+

US20160320143A1 - Plate type heat pipe with mesh wick structure having opening - Google Patents

Plate type heat pipe with mesh wick structure having opening Download PDF

Info

Publication number
US20160320143A1
US20160320143A1 US15/205,009 US201615205009A US2016320143A1 US 20160320143 A1 US20160320143 A1 US 20160320143A1 US 201615205009 A US201615205009 A US 201615205009A US 2016320143 A1 US2016320143 A1 US 2016320143A1
Authority
US
United States
Prior art keywords
heat pipe
mesh
type heat
plate type
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/205,009
Inventor
Chih-Feng Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Priority to US15/205,009 priority Critical patent/US20160320143A1/en
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FAN, CHIH-FENG
Publication of US20160320143A1 publication Critical patent/US20160320143A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/084Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/085Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices

Definitions

  • the disclosure generally relates to heat transfer apparatuses typically used in electronic devices, and particularly to a plate type heat pipe with high heat transfer performance.
  • Heat pipes have excellent heat transfer performance and are therefore effective means for transfer or dissipation of heat from heat sources.
  • heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers.
  • a heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”).
  • a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section.
  • a screen mesh inserted into the casing and held against the inner wall thereof is usually used as the wick structure of the heat pipe.
  • the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component.
  • the working medium contained in the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference in vapor pressure between the two sections of the heat pipe, the generated vapor moves and thus carries the heat towards the condenser section where the vapor is condensed into condensate after releasing the heat into the ambient environment via, for example, fins thermally contacting the condenser section. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
  • the screen mesh is attached to the whole inner wall of the casing from the evaporator section to the condenser section.
  • a space in the heat pipe for the vaporized working medium to flow through may be inadequate. This leads to a high flow resistance for the working medium, and thereby retards the heat transfer capability of the heat pipe.
  • FIG. 1 is an abbreviated, longitudinal cross-sectional view of a plate type heat pipe in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a transverse cross-sectional view of an adiabatic section of the heat pipe of the first embodiment, corresponding to line II-II of FIG. 1 .
  • FIG. 3 is a transverse cross-sectional view of both an evaporator section and a condenser section of the heat pipe of the first embodiment, corresponding to lines III-III of FIG. 1 .
  • FIG. 4 is a plan view of an unfolded mesh of the heat pipe of FIG. 1 , showing the mesh spread out flat from a folded (or rolled) state.
  • FIG. 5 is a transverse cross-sectional view of an adiabatic section of a plate type heat pipe in accordance with a second embodiment of the present disclosure.
  • FIG. 6 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a third embodiment of the present disclosure.
  • FIG. 7 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a fourth embodiment of the present disclosure.
  • FIG. 8 is essentially a plan view of an unfolded mesh of a plate type heat pipe in accordance with a fifth embodiment of the present disclosure.
  • FIG. 9 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a sixth embodiment of the present disclosure.
  • FIG. 10 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a seventh embodiment of the present disclosure.
  • FIG. 11 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with an eighth embodiment of the present disclosure.
  • the term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
  • the term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected.
  • the heat pipe 100 includes an elongated flat tube 10 , which contains a wick structure 30 and a working medium 20 therein.
  • the tube 10 is made of a highly thermally conductive material such as copper or aluminum.
  • the tube 10 includes an evaporator section 102 , a condenser section 104 opposite to the evaporator section 102 , and an adiabatic section 103 disposed between the evaporator section 102 and the condenser section 104 .
  • a thickness of the tube 10 from top to bottom is less than 2 mm (millimeters). That is, a total height of the tube 10 is less than 2 mm.
  • the tube 10 includes a flat bottom wall 11 , a top wall 13 opposite to the bottom wall 11 , and two side walls 15 connected between the bottom wall 11 and the top wall 13 .
  • the bottom wall 11 , the top wall 13 and the side walls 15 cooperatively define a sealed chamber 50 .
  • the chamber 50 is in vacuum except for the working medium 20 .
  • the working medium 20 is saturated in the wick structure 30 and is usually selected from a liquid such as water, methanol, or alcohol, which has a low boiling point and is compatible with the wick structure 30 .
  • the working medium 20 can easily evaporate to vapor when it absorbs heat at the evaporator section 102 of the heat pipe 100 .
  • the wick structure 30 is attached to an inner wall of the tube 10 .
  • the wick structure 30 extends along an axial direction of the tube 10 from the evaporator section 102 to the condenser section 104 .
  • the wick structure 30 is a porous screen mesh structure, and provides a capillary force to drive condensed working medium 20 at the condenser section 104 to flow towards the evaporator section 102 of the heat pipe 100 .
  • the wick structure 30 is formed by rolling a rectangular mesh 31 .
  • the mesh 31 defines two rectangular openings 32 spaced from each other. Each opening 32 is also spaced from an adjacent outer long edge of the mesh 31 .
  • the openings 32 are only located at the adiabatic section 103 of the heat pipe 100 .
  • the openings 32 are identical, and are parallel to each other.
  • a transverse width of each opening 32 is approximately one fourth of a corresponding width of the mesh 31 .
  • a length of each opening 32 (measured from left to right in FIG. 4 ) is approximately equal to a length of the adiabatic section 103 .
  • FIG. 2 a transverse cross-sectional view of the adiabatic section 103 of the heat pipe 100 is shown.
  • the two openings 32 respectively correspond to the side walls 15 at the adiabatic section 103 .
  • FIG. 3 a transverse cross-sectional view of the evaporator section 102 and the condenser section 104 of the heat pipe 100 is shown. No openings are defined in portions of the wick structure 30 which are respectively attached to the inner walls of the evaporator section 102 and the condenser section 104 .
  • FIG. 5 is a transverse cross-sectional view of the adiabatic section 103 of the plate type heat pipe 100 in accordance with a second embodiment of the present disclosure.
  • the difference between the first embodiment and the second embodiment is that in the second embodiment, the two openings 32 respectively corresponding to the top wall 13 and the bottom wall 11 of the tube 10 after the wick structure 30 is attached to the inner wall of the tube 10 .
  • the opening 32 at the top wall 13 overlaps the opening 32 at the bottom wall 11 .
  • FIG. 6 shows an unfolded mesh 31 a for the plate type heat pipe 100 in accordance with a third embodiment of the present disclosure.
  • the differences between the meshes 31 , 31 a of the first and third embodiments are as follows.
  • only one opening 32 a is defined in the mesh 31 a.
  • the opening 32 a corresponds to the adiabatic section 103 of the plate type heat pipe 100 .
  • a transverse width of the opening 32 a is substantially half of a corresponding width of the mesh 31 a.
  • FIG. 7 shows an unfolded mesh 31 b for the plate type heat pipe 100 in accordance with a fourth embodiment of the present disclosure.
  • the mesh 31 b defines three spaced, parallel, rectangular openings 32 b corresponding to the adiabatic section 103 of the heat pipe 100 .
  • One of the three openings 32 b is defined in a middle of the mesh 31 b.
  • the other two openings 32 b are respectively defined in two opposite long sides of the mesh 31 b.
  • Outer extremities of the other two openings 32 b are aligned with opposite outer long edges of the mesh 31 b, respectively. That is, the other two openings 32 b communicate with lateral exteriors of the mesh 31 b.
  • a total transverse width of the three openings 32 b is substantially half of a corresponding width of the mesh 31 b.
  • FIG. 8 shows an unfolded mesh 31 c for the plate type heat pipe 100 in accordance with a fifth embodiment of the present disclosure.
  • the mesh 31 c defines three spaced, parallel, rectangular openings 32 c corresponding to the adiabatic section 103 of the heat pipe 100 .
  • One of the three openings 32 c is defined in a middle of the mesh 31 c, and the other two openings 32 c are respectively defined in two opposite long sides of the mesh 31 c.
  • Outer extremities of the other two openings 32 c are aligned with opposite outer long edges of the mesh 31 c, respectively. That is, the other two openings 32 c communicate with lateral exteriors of the mesh 31 c.
  • a total transverse width of the three openings 32 c is substantially half of a corresponding width of the mesh 31 c.
  • the difference between the meshes 31 b, 31 c of the fourth and fifth embodiments is, in the fifth embodiment, a copper sheet 33 is connected between two opposite long side edges of the middle opening 32 c, to reinforce the strength of the mesh 31 c.
  • FIG. 9 shows an unfolded mesh 31 d for the plate type heat pipe 100 in accordance with a sixth embodiment of the present disclosure.
  • the mesh 31 d defines six spaced rectangular openings 32 d extending in two rows along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104 .
  • the two rows of openings 32 d are parallel to each other. All the openings 32 d have a same transverse width.
  • the two openings 32 d in a middle of the mesh 31 d have the same length, are directly opposite each other, and correspond to the adiabatic section 103 of the heat pipe 100 .
  • the two openings 32 d in one of opposite ends of the mesh 31 d have the same length, are directly opposite each other, and are adjacent to the condenser section 104 of the heat pipe 100 .
  • the two openings 32 d in the other opposite end of the mesh 31 d have the same length, are directly opposite each other, and are adjacent to the evaporator section 102 of the heat pipe 100 .
  • FIG. 10 shows an unfolded mesh 31 e for the plate type heat pipe 100 in accordance with a seventh embodiment of the present disclosure.
  • the mesh 31 e defines an isosceles trapezoidal opening 32 e.
  • the parallel sides of the opening 32 e are substantially perpendicular to opposite long sides of the mesh 31 e.
  • the opening 32 e extends along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104 .
  • the long parallel side of the opening 32 e is adjacent to the evaporator section 102
  • the short parallel side of the opening 32 e is adjacent to the condenser section 104 .
  • FIG. 11 shows an unfolded mesh 31 f for the plate type heat pipe 100 in accordance with an eighth embodiment of the present disclosure.
  • the mesh 31 f defines two elongated, isosceles triangular openings 32 f.
  • the openings 32 f are identical, and are arranged side by side.
  • Bases of the openings 32 f i.e. the two non-equal sides of the openings 32 f
  • Vertexes of the openings 32 f point in the same direction.
  • the openings 32 f extend along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104 .
  • the bases of the openings 32 f are adjacent to the evaporator section 102
  • the vertexes of the openings 32 f are adjacent to the condenser section 104 .
  • a total area of the wick structure 30 is reduced due to the openings being defined in the wick structure 30 , thereby increasing a space in the heat pipe 100 for the vaporized working medium 20 to flow therethrough. Therefore, compared with conventional heat pipes, the heat pipe 100 has not only a low flow resistance, but also a large capillary force. These advantages facilitate improving the heat transfer capability of the heat pipe 100 .
  • Table 1 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of a conventional mesh type heat pipe and certain of the heat pipes 100 in accordance with the present disclosure.
  • the conventional mesh type heat pipe and the heat pipes 100 in Table 1 all have a thickness of 1 mm.
  • Qmax represents the maximum heat transfer rate of each heat pipe at an operational temperature of 50° C.
  • Rth is obtained by dividing the difference between an average temperature of the evaporator section of the heat pipe and an average temperature of the condenser section of the heat pipe by Qmax.
  • the average of Rth of the heat pipes 100 with the mesh 31 a defining one opening 32 a is substantially equal to that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 a defining one opening 32 a is significantly more than that of the conventional mesh type heat pipe.
  • the average of Rth of the heat pipe 100 with the mesh 31 defining two openings 32 (i.e., the heat pipe of the first embodiment) is significantly less than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 defining two openings 32 is slightly more than that of the conventional mesh type heat pipe.
  • the average of Rth of the heat pipe 100 with the mesh 31 c defining three openings 32 c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 c defining three openings 32 c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A plate type heat pipe includes a sealed tube, a chamber defined in the tube, and working medium received in the chamber. A mesh wick structure is attached to an inner wall of the tube. In one version of the plate type heat pipe, the wick structure defines a single opening. The opening communicates the chamber and thereby provides additional space for flow of vaporized working medium inside the tube. In other versions of the plate type heat pipe, the wick structure defines two or more openings.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims priority to TW Patent Application No. 100148725 filed on Dec. 26, 2011, the contents of which are incorporated by reference herein.
  • FIELD
  • The disclosure generally relates to heat transfer apparatuses typically used in electronic devices, and particularly to a plate type heat pipe with high heat transfer performance.
  • BACKGROUND
  • Heat pipes have excellent heat transfer performance and are therefore effective means for transfer or dissipation of heat from heat sources. Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers. A heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”). Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section. A screen mesh inserted into the casing and held against the inner wall thereof is usually used as the wick structure of the heat pipe.
  • In operation, the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component. The working medium contained in the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference in vapor pressure between the two sections of the heat pipe, the generated vapor moves and thus carries the heat towards the condenser section where the vapor is condensed into condensate after releasing the heat into the ambient environment via, for example, fins thermally contacting the condenser section. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
  • Typically, the screen mesh is attached to the whole inner wall of the casing from the evaporator section to the condenser section. As a result, a space in the heat pipe for the vaporized working medium to flow through may be inadequate. This leads to a high flow resistance for the working medium, and thereby retards the heat transfer capability of the heat pipe.
  • Therefore, it is desirable to provide a heat pipe with improved heat transfer capability.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
  • FIG. 1 is an abbreviated, longitudinal cross-sectional view of a plate type heat pipe in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a transverse cross-sectional view of an adiabatic section of the heat pipe of the first embodiment, corresponding to line II-II of FIG. 1.
  • FIG. 3 is a transverse cross-sectional view of both an evaporator section and a condenser section of the heat pipe of the first embodiment, corresponding to lines III-III of FIG. 1.
  • FIG. 4 is a plan view of an unfolded mesh of the heat pipe of FIG. 1, showing the mesh spread out flat from a folded (or rolled) state.
  • FIG. 5 is a transverse cross-sectional view of an adiabatic section of a plate type heat pipe in accordance with a second embodiment of the present disclosure.
  • FIG. 6 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a third embodiment of the present disclosure.
  • FIG. 7 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a fourth embodiment of the present disclosure.
  • FIG. 8 is essentially a plan view of an unfolded mesh of a plate type heat pipe in accordance with a fifth embodiment of the present disclosure.
  • FIG. 9 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a sixth embodiment of the present disclosure.
  • FIG. 10 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with a seventh embodiment of the present disclosure.
  • FIG. 11 is a plan view of an unfolded mesh of a plate type heat pipe in accordance with an eighth embodiment of the present disclosure.
  • DETAILED DESCRIPTION OF EMBODIMENTS
  • It will be appreciated that for simplicity and clarity of illustration, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure. The description is not to be considered as limiting the scope of the embodiments described herein.
  • Several definitions that apply throughout this disclosure will now be presented. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like. The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected.
  • Referring to FIG. 1, a plate type heat pipe 100 in accordance with a first embodiment of the disclosure is shown. The heat pipe 100 includes an elongated flat tube 10, which contains a wick structure 30 and a working medium 20 therein.
  • Also referring to FIGS. 2-3, the tube 10 is made of a highly thermally conductive material such as copper or aluminum. The tube 10 includes an evaporator section 102, a condenser section 104 opposite to the evaporator section 102, and an adiabatic section 103 disposed between the evaporator section 102 and the condenser section 104. A thickness of the tube 10 from top to bottom is less than 2 mm (millimeters). That is, a total height of the tube 10 is less than 2 mm. The tube 10 includes a flat bottom wall 11, a top wall 13 opposite to the bottom wall 11, and two side walls 15 connected between the bottom wall 11 and the top wall 13. The bottom wall 11, the top wall 13 and the side walls 15 cooperatively define a sealed chamber 50. The chamber 50 is in vacuum except for the working medium 20.
  • The working medium 20 is saturated in the wick structure 30 and is usually selected from a liquid such as water, methanol, or alcohol, which has a low boiling point and is compatible with the wick structure 30. Thus, the working medium 20 can easily evaporate to vapor when it absorbs heat at the evaporator section 102 of the heat pipe 100.
  • The wick structure 30 is attached to an inner wall of the tube 10. The wick structure 30 extends along an axial direction of the tube 10 from the evaporator section 102 to the condenser section 104. The wick structure 30 is a porous screen mesh structure, and provides a capillary force to drive condensed working medium 20 at the condenser section 104 to flow towards the evaporator section 102 of the heat pipe 100.
  • Referring also to FIG. 4, the wick structure 30 is formed by rolling a rectangular mesh 31. The mesh 31 defines two rectangular openings 32 spaced from each other. Each opening 32 is also spaced from an adjacent outer long edge of the mesh 31. The openings 32 are only located at the adiabatic section 103 of the heat pipe 100. In the illustrated embodiment, the openings 32 are identical, and are parallel to each other. A transverse width of each opening 32 (measured from top to bottom in FIG. 4) is approximately one fourth of a corresponding width of the mesh 31. A length of each opening 32 (measured from left to right in FIG. 4) is approximately equal to a length of the adiabatic section 103.
  • Referring to FIG. 2, a transverse cross-sectional view of the adiabatic section 103 of the heat pipe 100 is shown. The two openings 32 respectively correspond to the side walls 15 at the adiabatic section 103.
  • Referring to FIG. 3, a transverse cross-sectional view of the evaporator section 102 and the condenser section 104 of the heat pipe 100 is shown. No openings are defined in portions of the wick structure 30 which are respectively attached to the inner walls of the evaporator section 102 and the condenser section 104.
  • FIG. 5 is a transverse cross-sectional view of the adiabatic section 103 of the plate type heat pipe 100 in accordance with a second embodiment of the present disclosure. The difference between the first embodiment and the second embodiment is that in the second embodiment, the two openings 32 respectively corresponding to the top wall 13 and the bottom wall 11 of the tube 10 after the wick structure 30 is attached to the inner wall of the tube 10. In the illustrated embodiment, the opening 32 at the top wall 13 overlaps the opening 32 at the bottom wall 11.
  • FIG. 6 shows an unfolded mesh 31 a for the plate type heat pipe 100 in accordance with a third embodiment of the present disclosure. The differences between the meshes 31, 31 a of the first and third embodiments are as follows. In the third embodiment, only one opening 32 a is defined in the mesh 31 a. The opening 32 a corresponds to the adiabatic section 103 of the plate type heat pipe 100. A transverse width of the opening 32 a is substantially half of a corresponding width of the mesh 31 a.
  • FIG. 7 shows an unfolded mesh 31 b for the plate type heat pipe 100 in accordance with a fourth embodiment of the present disclosure. The differences between the meshes 31, 31 b of the first and fourth embodiments are as follows. In the fourth embodiment, the mesh 31 b defines three spaced, parallel, rectangular openings 32 b corresponding to the adiabatic section 103 of the heat pipe 100. One of the three openings 32 b is defined in a middle of the mesh 31 b. The other two openings 32 b are respectively defined in two opposite long sides of the mesh 31 b. Outer extremities of the other two openings 32 b are aligned with opposite outer long edges of the mesh 31 b, respectively. That is, the other two openings 32 b communicate with lateral exteriors of the mesh 31 b. A total transverse width of the three openings 32 b is substantially half of a corresponding width of the mesh 31 b.
  • FIG. 8 shows an unfolded mesh 31 c for the plate type heat pipe 100 in accordance with a fifth embodiment of the present disclosure. The mesh 31 c defines three spaced, parallel, rectangular openings 32 c corresponding to the adiabatic section 103 of the heat pipe 100. One of the three openings 32 c is defined in a middle of the mesh 31 c, and the other two openings 32 c are respectively defined in two opposite long sides of the mesh 31 c. Outer extremities of the other two openings 32 c are aligned with opposite outer long edges of the mesh 31 c, respectively. That is, the other two openings 32 c communicate with lateral exteriors of the mesh 31 c. A total transverse width of the three openings 32 c is substantially half of a corresponding width of the mesh 31 c. The difference between the meshes 31 b, 31 c of the fourth and fifth embodiments is, in the fifth embodiment, a copper sheet 33 is connected between two opposite long side edges of the middle opening 32 c, to reinforce the strength of the mesh 31 c.
  • FIG. 9 shows an unfolded mesh 31 d for the plate type heat pipe 100 in accordance with a sixth embodiment of the present disclosure. The differences between the meshes 31, 31 d of the first and sixth embodiments are as follows. In the sixth embodiment, the mesh 31 d defines six spaced rectangular openings 32 d extending in two rows along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104. The two rows of openings 32 d are parallel to each other. All the openings 32 d have a same transverse width. The two openings 32 d in a middle of the mesh 31 d have the same length, are directly opposite each other, and correspond to the adiabatic section 103 of the heat pipe 100. The two openings 32 d in one of opposite ends of the mesh 31 d have the same length, are directly opposite each other, and are adjacent to the condenser section 104 of the heat pipe 100. The two openings 32 d in the other opposite end of the mesh 31 d have the same length, are directly opposite each other, and are adjacent to the evaporator section 102 of the heat pipe 100.
  • FIG. 10 shows an unfolded mesh 31 e for the plate type heat pipe 100 in accordance with a seventh embodiment of the present disclosure. The mesh 31 e defines an isosceles trapezoidal opening 32 e. The parallel sides of the opening 32 e are substantially perpendicular to opposite long sides of the mesh 31 e. The opening 32 e extends along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104. In one embodiment, the long parallel side of the opening 32 e is adjacent to the evaporator section 102, and the short parallel side of the opening 32 e is adjacent to the condenser section 104.
  • FIG. 11 shows an unfolded mesh 31 f for the plate type heat pipe 100 in accordance with an eighth embodiment of the present disclosure. The mesh 31 f defines two elongated, isosceles triangular openings 32 f. In the illustrated embodiment, the openings 32 f are identical, and are arranged side by side. Bases of the openings 32 f (i.e. the two non-equal sides of the openings 32 f) are aligned with each other, and are substantially perpendicular to opposite long sides of the mesh 31 f. Vertexes of the openings 32 f point in the same direction. The openings 32 f extend along the axial direction of the tube 10 from the evaporator section 102 to the condenser section 104. In one embodiment, the bases of the openings 32 f are adjacent to the evaporator section 102, and the vertexes of the openings 32 f are adjacent to the condenser section 104.
  • According to the disclosure, a total area of the wick structure 30 is reduced due to the openings being defined in the wick structure 30, thereby increasing a space in the heat pipe 100 for the vaporized working medium 20 to flow therethrough. Therefore, compared with conventional heat pipes, the heat pipe 100 has not only a low flow resistance, but also a large capillary force. These advantages facilitate improving the heat transfer capability of the heat pipe 100.
  • Table 1 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of a conventional mesh type heat pipe and certain of the heat pipes 100 in accordance with the present disclosure. The conventional mesh type heat pipe and the heat pipes 100 in Table 1 all have a thickness of 1 mm. Qmax represents the maximum heat transfer rate of each heat pipe at an operational temperature of 50° C. Rth is obtained by dividing the difference between an average temperature of the evaporator section of the heat pipe and an average temperature of the condenser section of the heat pipe by Qmax.
  • The average of Rth of the heat pipes 100 with the mesh 31 a defining one opening 32 a is substantially equal to that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 a defining one opening 32 a is significantly more than that of the conventional mesh type heat pipe. The average of Rth of the heat pipe 100 with the mesh 31 defining two openings 32 (i.e., the heat pipe of the first embodiment) is significantly less than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 defining two openings 32 is slightly more than that of the conventional mesh type heat pipe. The average of Rth of the heat pipe 100 with the mesh 31 c defining three openings 32 c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 c defining three openings 32 c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe.
  • TABLE 1
    Average of Qmax Average of Rth
    Type of heat pipe (unit: W) (unit: ° C./W)
    Conventional mesh type 8.1 0.6
    heat pipe
    Heat pipe
    100 with the 12.5 0.61
    mesh 31a defining one
    opening 32a
    Heat pipe
    100 with the 8.3 0.33
    mesh 31 defining two
    openings 32
    Heat pipe 100 with the 11.9 1.07
    mesh 31c defining three
    openings 32c and the
    copper sheet 33
  • The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a plate type heat pipe. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.

Claims (7)

What is claimed is:
1. A plate type heat pipe comprising:
a sealed tube defining a chamber therein;
a working medium received in the chamber; and
a mesh wick structure attached to an inner wall of the tube in the chamber, the wick structure defining at least one opening, the at least one opening communicating with the chamber and thereby providing additional space for flow of vaporized working medium inside the tube.
2. The plate type heat pipe of claim 1, wherein the tube comprises an evaporator section, a condenser section opposite to the evaporator section, and an adiabatic section disposed between the evaporator section and the condenser section, the at least one opening being located at the adiabatic section of the tube only.
3. The plate type heat pipe of claim 2, wherein the wick structure is a rolled mesh attached on the inner wall of the tube.
4. The plate type heat pipe of claim 3, wherein the at least one opening is two parallel, elongated openings, each of the two openings being spaced from an outer long edge of the mesh when the mesh is unrolled and flat.
5. The plate type heat pipe of claim 4, wherein the tube comprises a flat bottom wall, a flat top wall opposite to the bottom wall, and two side walls connected between the bottom wall and the top wall, the two openings respectively corresponding to the top wall and the bottom wall of the tube at the adiabatic section.
6. The plate type heat pipe of claim 4, wherein a width of each of the openings is approximately one fourth of a width of the mesh when the mesh is unrolled and flat.
7. The plate type heat pipe of claim 3, wherein the at least one opening is defined in a middle of the mesh.
US15/205,009 2011-12-26 2016-07-08 Plate type heat pipe with mesh wick structure having opening Abandoned US20160320143A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/205,009 US20160320143A1 (en) 2011-12-26 2016-07-08 Plate type heat pipe with mesh wick structure having opening

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW100148725A TWI530654B (en) 2011-12-26 2011-12-26 Plate type heat pipe
TW100148725 2011-12-26
US13/710,482 US9423187B2 (en) 2011-12-26 2012-12-11 Plate type heat pipe with mesh wick structure having opening
US15/205,009 US20160320143A1 (en) 2011-12-26 2016-07-08 Plate type heat pipe with mesh wick structure having opening

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13/710,482 Division US9423187B2 (en) 2011-12-26 2012-12-11 Plate type heat pipe with mesh wick structure having opening

Publications (1)

Publication Number Publication Date
US20160320143A1 true US20160320143A1 (en) 2016-11-03

Family

ID=48653406

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/710,482 Expired - Fee Related US9423187B2 (en) 2011-12-26 2012-12-11 Plate type heat pipe with mesh wick structure having opening
US15/205,009 Abandoned US20160320143A1 (en) 2011-12-26 2016-07-08 Plate type heat pipe with mesh wick structure having opening

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US13/710,482 Expired - Fee Related US9423187B2 (en) 2011-12-26 2012-12-11 Plate type heat pipe with mesh wick structure having opening

Country Status (2)

Country Link
US (2) US9423187B2 (en)
TW (1) TWI530654B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626416B (en) * 2017-01-12 2018-06-11 Asia Vital Components Co Ltd Capillary structure and loop heat pipe having the capillary structure
US20220217875A1 (en) * 2019-04-05 2022-07-07 Phase Change Energy Solutions, Inc. Thermal Management Devices and Methods

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201437591A (en) * 2013-03-26 2014-10-01 Asustek Comp Inc Heat pipe structure
US20160069616A1 (en) * 2014-09-05 2016-03-10 Asia Vital Components Co., Ltd. Heat pipe with complex capillary structure
US10012399B2 (en) * 2014-11-06 2018-07-03 Lee Wa Wong Window-type air conditioning system with water cooling unit
US20160131437A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Thin heat pipe structure
US11454456B2 (en) 2014-11-28 2022-09-27 Delta Electronics, Inc. Heat pipe with capillary structure
CN105698578A (en) * 2014-11-28 2016-06-22 台达电子工业股份有限公司 Heat pipe
CN114413668A (en) * 2016-05-31 2022-04-29 台达电子工业股份有限公司 Heat pipe and method of making the same
US11209216B2 (en) 2017-07-28 2021-12-28 Dana Canada Corporation Ultra thin heat exchangers for thermal management
WO2019018945A1 (en) 2017-07-28 2019-01-31 Dana Canada Corporation Device and method for alignment of parts for laser welding
JP6560425B1 (en) * 2018-11-09 2019-08-14 古河電気工業株式会社 heat pipe
TWI861091B (en) * 2019-04-11 2024-11-11 訊凱國際股份有限公司 Heat dissipating device and manufacturing method of the same
JP6640401B1 (en) * 2019-04-18 2020-02-05 古河電気工業株式会社 heatsink

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040069460A1 (en) * 2002-05-08 2004-04-15 Yasumi Sasaki Thin sheet type heat pipe
US20070107877A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat pipe with multiple vapor-passages
US20070163755A1 (en) * 2003-12-16 2007-07-19 Hyun-Tae Kim Flat plate heat transfer device and method for manufacturing the same
US7275588B2 (en) * 2004-06-02 2007-10-02 Hul-Chun Hsu Planar heat pipe structure
US20090084526A1 (en) * 2007-09-28 2009-04-02 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20090139696A1 (en) * 2007-12-03 2009-06-04 Forcecon Technology Co., Ltd. Flat heat pipe with multi-passage sintered capillary structure
US20100157533A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
TW407455B (en) * 1997-12-09 2000-10-01 Diamond Electric Mfg Heat pipe and its processing method
JP2001183080A (en) 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for manufacturing compressed mesh wick and flat surface type heat pipe having compressed mesh wick
TWI271502B (en) * 2005-01-28 2007-01-21 Foxconn Tech Co Ltd Wick structure for heat pipe and method for making thereof
JP4811460B2 (en) 2008-12-24 2011-11-09 ソニー株式会社 Heat transport device and electronic equipment
TWI427255B (en) 2009-01-16 2014-02-21 Foxconn Tech Co Ltd Evaporator and loop type heat pipe employing it
TWM367324U (en) 2009-05-19 2009-10-21 Tai Sol Electronics Co Ltd Heat pipe
JP2011085311A (en) 2009-10-15 2011-04-28 Sony Corp Heat transport device, method for manufacturing heat transport device and electronic device
CN101900506A (en) * 2010-01-15 2010-12-01 富瑞精密组件(昆山)有限公司 Flat and thin heat guide pipe
TWI494531B (en) 2010-05-20 2015-08-01 Foxconn Tech Co Ltd Flat heat pipe and method for manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040069460A1 (en) * 2002-05-08 2004-04-15 Yasumi Sasaki Thin sheet type heat pipe
US20070163755A1 (en) * 2003-12-16 2007-07-19 Hyun-Tae Kim Flat plate heat transfer device and method for manufacturing the same
US7275588B2 (en) * 2004-06-02 2007-10-02 Hul-Chun Hsu Planar heat pipe structure
US20070107877A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat pipe with multiple vapor-passages
US20090084526A1 (en) * 2007-09-28 2009-04-02 Foxconn Technology Co., Ltd. Heat pipe with composite wick structure
US20090139696A1 (en) * 2007-12-03 2009-06-04 Forcecon Technology Co., Ltd. Flat heat pipe with multi-passage sintered capillary structure
US20100157533A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626416B (en) * 2017-01-12 2018-06-11 Asia Vital Components Co Ltd Capillary structure and loop heat pipe having the capillary structure
US20220217875A1 (en) * 2019-04-05 2022-07-07 Phase Change Energy Solutions, Inc. Thermal Management Devices and Methods

Also Published As

Publication number Publication date
US9423187B2 (en) 2016-08-23
TWI530654B (en) 2016-04-21
TW201326717A (en) 2013-07-01
US20130160977A1 (en) 2013-06-27

Similar Documents

Publication Publication Date Title
US20160320143A1 (en) Plate type heat pipe with mesh wick structure having opening
US20070246193A1 (en) Orientation insensitive thermosiphon of v-configuration
TW200643362A (en) Loop-type heat exchange apparatus
US8622118B2 (en) Loop heat pipe
US20130014919A1 (en) Heat pipe
CN102458088B (en) Heat radiation structure of electronic device
US8459340B2 (en) Flat heat pipe with vapor channel
US7650928B2 (en) High performance compact thermosiphon with integrated boiler plate
US20100263834A1 (en) Heat dissipation device
US20110232874A1 (en) Heat dissipation apparatus with heat pipe
US20110174466A1 (en) Flat heat pipe
US9273909B2 (en) Heat pipe structure, and thermal module and electronic device using same
CN104154787A (en) Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device
CN107917554A (en) Flat heat pipe expansion type condensing device
CN113983843A (en) Thin plate type loop heat pipe
US7140421B2 (en) Wick structure of heat pipe
CN207881290U (en) Flat heat pipe expansion type condensing device
US20080314554A1 (en) Heat dissipation device with a heat pipe
KR100659582B1 (en) Loop type micro heat transport device
CN101581547B (en) A loop heat pipe radiator
CN116518760B (en) A kind of split channel type flat loop heat pipe
JP3173270U (en) heat pipe
US20130160976A1 (en) Heat pipe with composite wick structure
CN1318114C (en) Evaporator for separated heat tube
CN111712099B (en) Double-temperature-equalizing plate type heat dissipation module

Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FAN, CHIH-FENG;REEL/FRAME:039105/0443

Effective date: 20160707

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载