+

US20160104564A1 - Chip electronic component and board having the same - Google Patents

Chip electronic component and board having the same Download PDF

Info

Publication number
US20160104564A1
US20160104564A1 US14/691,285 US201514691285A US2016104564A1 US 20160104564 A1 US20160104564 A1 US 20160104564A1 US 201514691285 A US201514691285 A US 201514691285A US 2016104564 A1 US2016104564 A1 US 2016104564A1
Authority
US
United States
Prior art keywords
internal coil
electronic component
chip electronic
substrate
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/691,285
Inventor
Dong Jin JEONG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JEONG, DONG JIN
Publication of US20160104564A1 publication Critical patent/US20160104564A1/en
Priority to US16/212,541 priority Critical patent/US10553338B2/en
Priority to US16/730,399 priority patent/US11469030B2/en
Priority to US16/992,329 priority patent/US11626233B2/en
Priority to US18/120,055 priority patent/US12062476B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • the present disclosure relates to a chip electronic component and a board having the same.
  • An inductor a chip electronic component, is a representative passive element configuring an electronic circuit, together with a resistor and a capacitor to remove noise.
  • Such an inductor is commonly combined with a capacitor in consideration of respective electromagnetic characteristics thereof to configure a resonance circuit amplifying a signal in a specific frequency band, a filter circuit, or the like.
  • IT devices such as communications devices, display devices, and the like
  • inductors, capacitors, transistors, and the like used in such IT devices
  • inductors have been rapidly replaced by chips having a small size and high density, capable of being automatically surface-mounted, and a thin film type inductor in which coil patterns formed of a mixture of a magnetic powder and a resin are formed on upper and lower surfaces of a thin film insulating substrate by plating have been developed.
  • the thin film type inductor as described above may be manufactured by forming a coil pattern on a substrate and then covering an the exterior thereof with a magnetic material.
  • a conductive coil pattern may be formed on one surface of the substrate and on the other surface of the substrate.
  • the conductive coil patterns formed on one surface and the other surface of the substrate maybe electrically connected to each other by a via electrode formed in the substrate.
  • the via electrode and the conductive coil pattern are generally positioned in a linear manner, and relatively large pads are formed to prevent defects caused by misalignment of a via portion, causing a problem in manufacturing an inductor having a small size and high inductance.
  • an internal core area may be decreased, such that there may be significant limitations in miniaturization.
  • Patent Document 1 Japanese Patent Laid-Open Publication No. 2007-067214
  • An aspect of the present disclosure may provide a chip electronic component in which a loss of inductance due to an area of a via pad is prevented through altering a shape and a position of the via pad.
  • a chip electronic component may include: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface of the substrate; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein portions of the first and second via pads are extended in a direction toward first and second internal coil parts adjacent thereto.
  • a board having a chip electronic component may include: a printed circuit board on which first and second electrode pads are provided; and the chip electronic component as described above, mounted on the printed circuit board.
  • FIG. 1 is a schematic perspective view of a chip electronic component including internal coil parts according to an exemplary embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 ;
  • FIGS. 3A and 3B are schematic plan views of via pads according to an exemplary embodiment of the present disclosure.
  • FIG. 4 is a cross-sectional view taken along line II-II′ of FIG. 1 ;
  • FIG. 5 is a perspective view showing a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board.
  • FIG. 1 is a schematic perspective view showing a chip electronic component including internal coil parts according to an exemplary embodiment of the present disclosure.
  • a thin film type inductor used in a power line of a power supply circuit is disclosed.
  • the chip electronic component 100 may include a magnetic body 50 , internal coil parts 41 and 42 buried in the magnetic body 50 , and first and second external electrodes 81 and 82 disposed on an outer portion of the magnetic body 50 to thereby be electrically connected to the internal coil parts 41 and 42 .
  • a ‘length’ direction refers to an ‘L’ direction of FIG. 1
  • a ‘width’ direction refers to a ‘W’ direction of FIG. 1
  • a ‘thickness’ direction refers to a ‘T’ direction of FIG. 1 .
  • the magnetic body 50 may form the exterior of the chip electronic component 100 and may be formed of any material capable of exhibiting magnetic characteristics.
  • the magnetic body 50 may be formed by filling ferrite or magnetic metal powder.
  • the ferrite may include Mn—Zn based ferrite, Ni—Zn based ferrite, Ni—Zn—Cu based ferrite, Mn—Mg based ferrite, Ba based ferrite, Li based ferrite, or the like.
  • the magnetic metal powder may contain any one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni.
  • the magnetic metal powder may contain Fe—Si—B—Cr-based amorphous metal, but the present disclosure is not necessarily limited thereto.
  • the magnetic metal powder may have a particle diameter of 0.1 ⁇ m to 30 ⁇ m and be contained in a form in which the magnetic metal powder is dispersed in a thermosetting resin such as an epoxy resin, polyimide, or the like.
  • a first internal coil part 41 having a coil shape may be formed in one surface of a substrate 20 disposed in the magnetic body 50
  • a second internal coil part 42 having a coil shape may be formed on the other surface opposing one surface of the substrate 20 .
  • the first and second internal coil parts 41 and 42 may be formed in a spiral shape and be formed by performing an electroplating method.
  • Examples of the substrate 20 may include a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal-based soft magnetic substrate, and the like.
  • PPG polypropylene glycol
  • a central portion of the substrate 20 may be penetrated to thereby form a hole, and the hole is filled with a magnetic material to thereby form a core part 55 .
  • inductance Ls may be improved.
  • FIG. 2 is a cross-sectional view taken along line , of FIG. 1 .
  • the first and second internal coil parts 41 and 42 formed on one surface and the other surface of the substrate 20 may be connected to a via 45 penetrating through the substrate 20 .
  • First and second via pads 43 and 44 may be formed on one surface and the other surface of the substrate 20 , respectively, to cover the via 45 .
  • the first via pad 43 may be formed by extending one end portion of the first internal coil part 41
  • the second via pad 44 may be formed by extending one end portion of the second internal coil part 42 .
  • the first and second via pads 43 and 44 may be formed by performing an electroplating method similarly to the first and second internal coil parts 41 and 42 .
  • a via is positioned on a straight line with an internal coil portion, and an open defect due to misalignment of the via may occur.
  • the via pad having a large area as described above is also disposed in a direction toward a core implementing inductance (Ls), an area of an internal core part is decreased, such that inductance may be decreased in a process of miniaturizing the chip electronic component.
  • Ls inductance
  • the area of the via pad may be increased, the area of the core part may be decreased, and a magnetic material filled in the core part may be decreased, such that inductance (Ls) characteristics may be decreased.
  • Ls inductance
  • the first and second via pads 43 and 44 may be extended in a direction toward portions of the first and second internal coil parts 41 and 42 adjacent thereto.
  • FIGS. 3A and 3B are schematic plan views showing the via pads according to an exemplary embodiment of the present disclosure.
  • first and second via pads 43 and 44 are extended in the direction toward the portions of first and second internal coil parts 41 and 42 adjacent thereto.
  • Shapes of the first and second via pads 43 and 44 are not limited, but generally, the first and second via pads 43 and 44 may have a circular shape to be equal to a shape of the via.
  • the first and second via pads 43 and 44 may be disposed to be biased towards the first and second internal coil parts 41 and 42 , unlike a disposition shape of a general product.
  • the area of the core part 45 may be increased as compared to the related art, and the magnetic material filled in the core part is increased, such that inductance (Ls) characteristics may be improved.
  • the open defect that electric connection is cut due to the via 45 and the via pads 43 and 44 that are not aligned to coincide with each other but are misaligned may be prevented, and the area of the core part 55 in which the magnetic material is filled may be secured as much as possible, such that high inductance (Ls) may be secured.
  • the portions of the first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44 are formed as recessed portions to be insulated from the first and second via pads 43 and 44 .
  • the first and second via pads 43 and 44 are extended in the direction toward the portions of the first and second internal coil parts 41 and 42 adjacent thereto in order to implement high inductance (Ls) of the chip electronic component, such that a short-circuit defect may occur. Therefore, in order to prevent the short-circuit defect, the recessed portions may be formed in the portions of the first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44 .
  • the shapes of the recessed portions are not particularly limited as long as the recessed portions are formed to insulate the first and second internal coil parts 41 and 42 and the first and second via pads 43 and 44 from each other.
  • the centers of the recessed portions and the centers of the first and second via pads 43 and 44 may coincide with each other.
  • the recessed portions may have a shape in which the recessed portions are equally divided based on the first and second via pads 43 and 44 .
  • an interval d between the first and second via pads 43 and 44 and the first and second internal coil parts 41 and 42 adjacent thereto may be aim or more, but is not necessarily limited thereto.
  • the first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44 may be insulated from the first and second via pads 43 and 44 by adjusting the interval d between the first and second via pads 43 and 44 and the first and second internal coil parts 41 and 42 adjacent thereto to be aim or more.
  • the area of the core part 55 may be increased as compared to the related art, and accordingly, the magnetic material filled in the core part may be increased, thereby improving inductance (Ls) characteristics.
  • the area of the core part may be secured to be large due to the disposition of the via pad as described above, such that the filled magnetic material may be increased, and accordingly, high inductance chip electronic component may be implemented.
  • the first and second internal coil parts 41 and 42 , the via 45 , and the first and second via pads 43 and 44 may be formed of a metal having excellent electric conductivity.
  • the first and second internal coil parts 41 and 42 , the via 45 , and the first and second via pads 43 and 44 may be formed of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), an alloy thereof, or the like.
  • FIG. 4 is a cross-sectional view taken along line , of FIG. 1 .
  • the other end portion of the first internal coil part 41 maybe extended to forma first lead portion 46 exposed to one end surface of the magnetic body 50 in the length (L) direction, and the other end portion of the second internal coil part 42 may be extended to form a second lead portion 47 exposed to the other end surface of the magnetic body 50 in the length (L) direction.
  • first and second lead portions 46 and 47 may be exposed to at least one surface of the magnetic body 50 .
  • the first and second external electrodes 81 and 82 may be disposed on both end surfaces of the magnetic body 50 in the length (L) direction to be connected to the first and second lead portions 46 and 47 exposed to both end surfaces of the magnetic body 50 in the length (L) direction, respectively.
  • the first and second external electrodes 81 and 82 may be formed of a metal having excellent electric conductivity.
  • the first and second external electrodes 81 and 82 may be formed of one of nickel (Ni), copper (Cu), tin (Sn), silver (Ag), and the like, an alloy thereof, or the like.
  • FIG. 5 is a perspective view of a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board.
  • a board 200 having a chip electronic component 100 may include a printed circuit board 210 on which the chip electronic component 100 is mounted and first and second electrode pads 211 and 212 formed on the printed circuit board 210 to be spaced apart from each other.
  • the chip electronic component 100 may be electrically connected to the printed circuit board 210 by solders 230 in a state in which first and second external electrodes 81 and 82 are positioned on the first and second electrode pads 211 and 212 to contact the first and second electrode pads 221 and 222 , respectively.
  • Internal coil parts 41 and 42 of the mounted chip electronic component 100 may be disposed horizontally with respect to amounting surface of the printed circuit board 210 .
  • the area of the core may be sufficiently secured by disposing the via pad in the direction toward the coil adjacent to the via, such that a loss of the inductance caused by the area of the via pad may be prevented.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the priority and benefit of Korean Patent Application No. 10-2014-0138590 filed on Oct. 14, 2014, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.
    • BACKGROUND
  • The present disclosure relates to a chip electronic component and a board having the same.
  • An inductor, a chip electronic component, is a representative passive element configuring an electronic circuit, together with a resistor and a capacitor to remove noise. Such an inductor is commonly combined with a capacitor in consideration of respective electromagnetic characteristics thereof to configure a resonance circuit amplifying a signal in a specific frequency band, a filter circuit, or the like.
  • Recently, as information technology (IT) devices such as communications devices, display devices, and the like, have been increasingly thinned and miniaturized, research into technologies facilitating the miniaturizing and thinning of various elements such as inductors, capacitors, transistors, and the like, used in such IT devices, has been continuously undertaken.
  • In this regard, inductors have been rapidly replaced by chips having a small size and high density, capable of being automatically surface-mounted, and a thin film type inductor in which coil patterns formed of a mixture of a magnetic powder and a resin are formed on upper and lower surfaces of a thin film insulating substrate by plating have been developed.
  • The thin film type inductor as described above may be manufactured by forming a coil pattern on a substrate and then covering an the exterior thereof with a magnetic material.
  • Meanwhile, in order to thin and miniaturize inductors, limitations in shape of existing connection portions between coil patterns must be overcome.
  • More specifically, in a substrate plating process for forming the coil pattern of the inductor, a conductive coil pattern may be formed on one surface of the substrate and on the other surface of the substrate.
  • The conductive coil patterns formed on one surface and the other surface of the substrate maybe electrically connected to each other by a via electrode formed in the substrate.
  • The via electrode and the conductive coil pattern are generally positioned in a linear manner, and relatively large pads are formed to prevent defects caused by misalignment of a via portion, causing a problem in manufacturing an inductor having a small size and high inductance.
  • In addition, as the pad may be positioned to be adjacent to a core forming inductance, an internal core area may be decreased, such that there may be significant limitations in miniaturization.
  • Therefore, there remains a need to design an inductor capable of securing a sufficient amount of inductance while having a small size.
    • RELATED ART DOCUMENT
  • (Patent Document 1) Japanese Patent Laid-Open Publication No. 2007-067214
    • SUMMARY
  • An aspect of the present disclosure may provide a chip electronic component in which a loss of inductance due to an area of a via pad is prevented through altering a shape and a position of the via pad.
  • According to an aspect of the present disclosure, a chip electronic component may include: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface of the substrate; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein portions of the first and second via pads are extended in a direction toward first and second internal coil parts adjacent thereto.
  • According to another aspect of the present disclosure, a board having a chip electronic component may include: a printed circuit board on which first and second electrode pads are provided; and the chip electronic component as described above, mounted on the printed circuit board.
    • BRIEF DESCRIPTION OF DRAWINGS
  • The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a schematic perspective view of a chip electronic component including internal coil parts according to an exemplary embodiment of the present disclosure;
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1;
  • FIGS. 3A and 3B are schematic plan views of via pads according to an exemplary embodiment of the present disclosure;
  • FIG. 4 is a cross-sectional view taken along line II-II′ of FIG. 1; and
  • FIG. 5 is a perspective view showing a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board.
    •  DETAILED DESCRIPTION
  • Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
  • The disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
  • In the drawings, the shapes and dimensions of elements maybe exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.
    • Chip Electronic Component
  • Hereinafter, a chip electronic component according to an exemplary embodiment of the present disclosure will be described. Particularly, a thin film type inductor will be described, but the present disclosure is not limited thereto.
  • FIG. 1 is a schematic perspective view showing a chip electronic component including internal coil parts according to an exemplary embodiment of the present disclosure.
  • Referring to FIG. 1, as an example of the chip electronic component, a thin film type inductor used in a power line of a power supply circuit is disclosed.
  • The chip electronic component 100 according to an exemplary embodiment of the present disclosure may include a magnetic body 50, internal coil parts 41 and 42 buried in the magnetic body 50, and first and second external electrodes 81 and 82 disposed on an outer portion of the magnetic body 50 to thereby be electrically connected to the internal coil parts 41 and 42.
  • In the chip electronic component 100 according to an exemplary embodiment of the present disclosure, a ‘length’ direction refers to an ‘L’ direction of FIG. 1, a ‘width’ direction refers to a ‘W’ direction of FIG. 1, and a ‘thickness’ direction refers to a ‘T’ direction of FIG. 1.
  • The magnetic body 50 may form the exterior of the chip electronic component 100 and may be formed of any material capable of exhibiting magnetic characteristics. For example, the magnetic body 50 may be formed by filling ferrite or magnetic metal powder.
  • Examples of the ferrite may include Mn—Zn based ferrite, Ni—Zn based ferrite, Ni—Zn—Cu based ferrite, Mn—Mg based ferrite, Ba based ferrite, Li based ferrite, or the like.
  • The magnetic metal powder may contain any one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni. For example, the magnetic metal powder may contain Fe—Si—B—Cr-based amorphous metal, but the present disclosure is not necessarily limited thereto.
  • The magnetic metal powder may have a particle diameter of 0.1 μm to 30 μm and be contained in a form in which the magnetic metal powder is dispersed in a thermosetting resin such as an epoxy resin, polyimide, or the like.
  • A first internal coil part 41 having a coil shape may be formed in one surface of a substrate 20 disposed in the magnetic body 50, and a second internal coil part 42 having a coil shape may be formed on the other surface opposing one surface of the substrate 20.
  • The first and second internal coil parts 41 and 42 may be formed in a spiral shape and be formed by performing an electroplating method.
  • Examples of the substrate 20 may include a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal-based soft magnetic substrate, and the like.
  • A central portion of the substrate 20 may be penetrated to thereby form a hole, and the hole is filled with a magnetic material to thereby form a core part 55.
  • As the core part 55 filled with the magnetic material is formed, inductance Ls may be improved.
  • FIG. 2 is a cross-sectional view taken along line , of FIG. 1.
  • Referring to FIG. 2, the first and second internal coil parts 41 and 42 formed on one surface and the other surface of the substrate 20 may be connected to a via 45 penetrating through the substrate 20.
  • First and second via pads 43 and 44 may be formed on one surface and the other surface of the substrate 20, respectively, to cover the via 45.
  • The first via pad 43 may be formed by extending one end portion of the first internal coil part 41, and the second via pad 44 may be formed by extending one end portion of the second internal coil part 42.
  • The first and second via pads 43 and 44 may be formed by performing an electroplating method similarly to the first and second internal coil parts 41 and 42.
  • In general, a via is positioned on a straight line with an internal coil portion, and an open defect due to misalignment of the via may occur.
  • In the case of forming a via pad in order to prevent the open defect as described above, there is a tendency to increase an area of the via pad, which limits implementation of miniaturization and high inductance of a chip electronic component.
  • Meanwhile, as the via pad having a large area as described above is also disposed in a direction toward a core implementing inductance (Ls), an area of an internal core part is decreased, such that inductance may be decreased in a process of miniaturizing the chip electronic component.
  • That is, as the area of the via pad is increased, the area of the core part may be decreased, and a magnetic material filled in the core part may be decreased, such that inductance (Ls) characteristics may be decreased.
  • According to an exemplary embodiment of the present disclosure, in order to solve the above-mentioned problems, the first and second via pads 43 and 44 may be extended in a direction toward portions of the first and second internal coil parts 41 and 42 adjacent thereto.
  • FIGS. 3A and 3B are schematic plan views showing the via pads according to an exemplary embodiment of the present disclosure.
  • Referring to FIGS. 3A and 3B, it may be appreciated that the first and second via pads 43 and 44 are extended in the direction toward the portions of first and second internal coil parts 41 and 42 adjacent thereto.
  • Shapes of the first and second via pads 43 and 44 are not limited, but generally, the first and second via pads 43 and 44 may have a circular shape to be equal to a shape of the via.
  • The first and second via pads 43 and 44 may be disposed to be biased towards the first and second internal coil parts 41 and 42, unlike a disposition shape of a general product.
  • Since the first and second via pads 43 and 44 are disposed as described above, the area of the core part 45 may be increased as compared to the related art, and the magnetic material filled in the core part is increased, such that inductance (Ls) characteristics may be improved.
  • In addition, the open defect that electric connection is cut due to the via 45 and the via pads 43 and 44 that are not aligned to coincide with each other but are misaligned may be prevented, and the area of the core part 55 in which the magnetic material is filled may be secured as much as possible, such that high inductance (Ls) may be secured.
  • The portions of the first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44 are formed as recessed portions to be insulated from the first and second via pads 43 and 44.
  • That is, according to an exemplary embodiment of the present disclosure, the first and second via pads 43 and 44 are extended in the direction toward the portions of the first and second internal coil parts 41 and 42 adjacent thereto in order to implement high inductance (Ls) of the chip electronic component, such that a short-circuit defect may occur. Therefore, in order to prevent the short-circuit defect, the recessed portions may be formed in the portions of the first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44.
  • The shapes of the recessed portions are not particularly limited as long as the recessed portions are formed to insulate the first and second internal coil parts 41 and 42 and the first and second via pads 43 and 44 from each other.
  • According to an exemplary embodiment of the present disclosure, the centers of the recessed portions and the centers of the first and second via pads 43 and 44 may coincide with each other.
  • That is, the recessed portions may have a shape in which the recessed portions are equally divided based on the first and second via pads 43 and 44.
  • Meanwhile, according to an exemplary embodiment of the present disclosure, an interval d between the first and second via pads 43 and 44 and the first and second internal coil parts 41 and 42 adjacent thereto may be aim or more, but is not necessarily limited thereto.
  • The first and second internal coil parts 41 and 42 adjacent to the first and second via pads 43 and 44 may be insulated from the first and second via pads 43 and 44 by adjusting the interval d between the first and second via pads 43 and 44 and the first and second internal coil parts 41 and 42 adjacent thereto to be aim or more.
  • In the case in which the interval d between the first and second via pads 43 and 44 and the first and second internal coil parts 41 and 42 adjacent thereto is less than aim, a short-circuit defect may occur.
  • According to an exemplary embodiment of the present disclosure, since the first and second via pads 43 and 44 are disposed to be biased toward the first and second internal coil parts 41 and 42, the area of the core part 55 may be increased as compared to the related art, and accordingly, the magnetic material filled in the core part may be increased, thereby improving inductance (Ls) characteristics.
  • That is, even though the chip electronic component is miniaturized, the area of the core part may be secured to be large due to the disposition of the via pad as described above, such that the filled magnetic material may be increased, and accordingly, high inductance chip electronic component may be implemented.
  • The first and second internal coil parts 41 and 42, the via 45, and the first and second via pads 43 and 44 may be formed of a metal having excellent electric conductivity. For example, the first and second internal coil parts 41 and 42, the via 45, and the first and second via pads 43 and 44 may be formed of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), an alloy thereof, or the like.
  • FIG. 4 is a cross-sectional view taken along line , of FIG. 1.
  • Referring to FIG. 4, the other end portion of the first internal coil part 41 maybe extended to forma first lead portion 46 exposed to one end surface of the magnetic body 50 in the length (L) direction, and the other end portion of the second internal coil part 42 may be extended to form a second lead portion 47 exposed to the other end surface of the magnetic body 50 in the length (L) direction.
  • However, the present disclosure is not necessarily limited thereto, but the first and second lead portions 46 and 47 may be exposed to at least one surface of the magnetic body 50.
  • The first and second external electrodes 81 and 82 may be disposed on both end surfaces of the magnetic body 50 in the length (L) direction to be connected to the first and second lead portions 46 and 47 exposed to both end surfaces of the magnetic body 50 in the length (L) direction, respectively.
  • The first and second external electrodes 81 and 82 may be formed of a metal having excellent electric conductivity. For example, the first and second external electrodes 81 and 82 may be formed of one of nickel (Ni), copper (Cu), tin (Sn), silver (Ag), and the like, an alloy thereof, or the like.
    • Board Having Chip Electronic Component
  • FIG. 5 is a perspective view of a board in which the chip electronic component of FIG. 1 is mounted on a printed circuit board.
  • Referring to FIG. 5, a board 200 having a chip electronic component 100 according to the present exemplary embodiment may include a printed circuit board 210 on which the chip electronic component 100 is mounted and first and second electrode pads 211 and 212 formed on the printed circuit board 210 to be spaced apart from each other.
  • In this case, the chip electronic component 100 may be electrically connected to the printed circuit board 210 by solders 230 in a state in which first and second external electrodes 81 and 82 are positioned on the first and second electrode pads 211 and 212 to contact the first and second electrode pads 221 and 222, respectively.
  • Internal coil parts 41 and 42 of the mounted chip electronic component 100 may be disposed horizontally with respect to amounting surface of the printed circuit board 210.
  • Except for the description described above, a description of features overlapped with those of the above-mentioned chip electronic component according to an exemplary embodiment of the present disclosure will be omitted.
  • As set forth above, according to exemplary embodiments of the present disclosure, the area of the core may be sufficiently secured by disposing the via pad in the direction toward the coil adjacent to the via, such that a loss of the inductance caused by the area of the via pad may be prevented.
  • While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.

Claims (18)

What is claimed is:
1. A chip electronic component comprising:
a substrate;
a first internal coil part disposed on one surface of the substrate;
a second internal coil part disposed on the other surface of the substrate opposing one surface thereof;
a via penetrating through the substrate to connect the first and second internal coil parts to each other; and
first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via,
wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
2. The chip electronic component of claim 1, wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads.
3. The chip electronic component of claim 2, wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other.
4. The chip electronic component of claim 1, wherein the first via pad is formed by extending one end portion of the first internal coil part, and
the second via pad is formed by extending one end portion of the second internal coil part.
5. The chip electronic component of claim 1, wherein the first and second internal coil parts and the first and second via pads are formed by plating.
6. The chip electronic component of claim 1, wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μm or more therebetween.
7. The chip electronic component of claim 1, further comprising a magnetic body enclosing the first and second internal coil parts,
wherein the magnetic body contains a magnetic metal powder.
8. The chip electronic component of claim 1, wherein the substrate has a through hole which is disposed in a central portion of the substrate, and
the through hole is filled with a magnetic material to form a core part.
9. The chip electronic component of claim 7, wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body.
10. A board having a chip electronic component, the board comprising:
a printed circuit board on which first and second electrode pads are provided;
the chip electronic component of claim 1, mounted on the printed circuit board.
11. The board of claim 10, wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads.
12. The board of claim 11, wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other.
13. The board of claim 10, wherein the first via pad is formed by extending one end portion of the first internal coil part, and
the second via pad is formed by extending one end portion of the second internal coil part.
14. The board of claim 10, wherein the first and second internal coil parts and the first and second via pads are formed by plating.
15. The board of claim 10, wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μm or more therebetween.
16. The board of claim 10, wherein the chip electronic component further includes a magnetic body enclosing the first and second internal coil parts,
the magnetic body containing magnetic metal powder.
17. The board of claim 10, wherein the substrate has a through hole which is disposed in a central portion of the substrate, and
the through hole is filled with a magnetic material to form a core part.
18. The board of claim 16, wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body.
US14/691,285 2014-10-14 2015-04-20 Chip electronic component and board having the same Abandoned US20160104564A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US16/212,541 US10553338B2 (en) 2014-10-14 2018-12-06 Chip electronic component and board having the same
US16/730,399 US11469030B2 (en) 2014-10-14 2019-12-30 Chip electronic component and board having the same
US16/992,329 US11626233B2 (en) 2014-10-14 2020-08-13 Chip electronic component and board having the same
US18/120,055 US12062476B2 (en) 2014-10-14 2023-03-10 Chip electronic component and board having the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0138590 2014-10-14
KR1020140138590A KR101892689B1 (en) 2014-10-14 2014-10-14 Chip electronic component and board having the same mounted thereon

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/212,541 Continuation US10553338B2 (en) 2014-10-14 2018-12-06 Chip electronic component and board having the same

Publications (1)

Publication Number Publication Date
US20160104564A1 true US20160104564A1 (en) 2016-04-14

Family

ID=55655925

Family Applications (5)

Application Number Title Priority Date Filing Date
US14/691,285 Abandoned US20160104564A1 (en) 2014-10-14 2015-04-20 Chip electronic component and board having the same
US16/212,541 Active US10553338B2 (en) 2014-10-14 2018-12-06 Chip electronic component and board having the same
US16/730,399 Active 2036-01-02 US11469030B2 (en) 2014-10-14 2019-12-30 Chip electronic component and board having the same
US16/992,329 Active 2035-07-07 US11626233B2 (en) 2014-10-14 2020-08-13 Chip electronic component and board having the same
US18/120,055 Active US12062476B2 (en) 2014-10-14 2023-03-10 Chip electronic component and board having the same

Family Applications After (4)

Application Number Title Priority Date Filing Date
US16/212,541 Active US10553338B2 (en) 2014-10-14 2018-12-06 Chip electronic component and board having the same
US16/730,399 Active 2036-01-02 US11469030B2 (en) 2014-10-14 2019-12-30 Chip electronic component and board having the same
US16/992,329 Active 2035-07-07 US11626233B2 (en) 2014-10-14 2020-08-13 Chip electronic component and board having the same
US18/120,055 Active US12062476B2 (en) 2014-10-14 2023-03-10 Chip electronic component and board having the same

Country Status (3)

Country Link
US (5) US20160104564A1 (en)
KR (1) KR101892689B1 (en)
CN (2) CN108417339B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190101103A (en) * 2018-02-22 2019-08-30 삼성전기주식회사 Inductor array
US10546679B2 (en) 2016-12-21 2020-01-28 Samsung Electro-Mechanics Co., Ltd. Inductor
US11107616B2 (en) * 2018-04-02 2021-08-31 Samsung Electro-Mechanics Co., Ltd. Coil component

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102632370B1 (en) * 2018-09-28 2024-02-02 삼성전기주식회사 Coil electronic component
KR102064118B1 (en) * 2019-05-31 2020-01-08 삼성전기주식회사 Coil component and manufacturing method for the same
KR20220084661A (en) * 2020-12-14 2022-06-21 삼성전기주식회사 Coil component

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873757A (en) * 1987-07-08 1989-10-17 The Foxboro Company Method of making a multilayer electrical coil
US4904967A (en) * 1988-01-27 1990-02-27 Murata Manufacturing Co., Ltd. LC composite component
US5929733A (en) * 1993-07-21 1999-07-27 Nagano Japan Radio Co., Ltd. Multi-layer printed substrate
US6000128A (en) * 1994-06-21 1999-12-14 Sumitomo Special Metals Co., Ltd. Process of producing a multi-layered printed-coil substrate
US6388551B2 (en) * 1996-03-22 2002-05-14 Murata Manufacturing Co., Ltd. Method of making a laminated balun transform
US6618929B2 (en) * 1996-03-29 2003-09-16 Murata Manufacturing Co., Ltd. Laminated common-mode choke coil
US6710694B2 (en) * 2001-10-23 2004-03-23 Murata Manufacturing Co., Ltd. Coil device
US6914508B2 (en) * 2002-08-15 2005-07-05 Galaxy Power, Inc. Simplified transformer design for a switching power supply
US7046114B2 (en) * 2001-02-14 2006-05-16 Murata Manufacturing Co., Ltd. Laminated inductor
US20060214759A1 (en) * 2005-03-23 2006-09-28 Sumida Corporation Inductor
US7362205B2 (en) * 2005-08-26 2008-04-22 Tdk Corporation Common-mode filter
US7378931B2 (en) * 2005-09-29 2008-05-27 Murata Manufacturing Co., Ltd. Multilayer coil component
US20080180206A1 (en) * 2006-08-28 2008-07-31 Avago Technologies Ecbu (Singapore) Pte.Ltd. Coil Transducer with Reduced Arcing and Improved High Voltage Breakdown Performance Characteristics
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US7518480B1 (en) * 2006-08-03 2009-04-14 Rf Micro Devices, Inc. Printed circuit board inductor
US20090243783A1 (en) * 2006-08-28 2009-10-01 Avago Technologies Ecbu (Singapore) Pte. Ltd. Minimizing Electromagnetic Interference in Coil Transducers
US20090243782A1 (en) * 2006-08-28 2009-10-01 Avago Technologies Ecbu (Singapore) Pte. Ltd. High Voltage Hold-Off Coil Transducer
US20100020448A1 (en) * 2006-08-28 2010-01-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Galvanic isolator
US20110095620A1 (en) * 2006-08-28 2011-04-28 Avago Technologies Ecbu (Singapore) Pte. Ltd. Galvanic Isolators and Coil Transducers
US8334747B2 (en) * 2009-07-23 2012-12-18 Murata Manufacturing Co., Ltd. Coil-integrated switching power supply module
US20130022210A1 (en) * 2011-07-22 2013-01-24 Mikko Pekka Vainiala Method and apparatus for impulse response measurement and simulation
US20130028941A1 (en) * 2011-07-29 2013-01-31 Selecta Biosciences, Inc. Synthetic nanocarriers that generate humoral and cytotoxic t lymphocyte (ctl) immune responses
US20130120095A1 (en) * 2011-11-10 2013-05-16 Harris Corporation Method for making an electrical inductor and related inductor devices
US20130289412A1 (en) * 2012-03-19 2013-10-31 Volcano Corporation Rotary Transformer and Associated Devices, Systems, and Methods for Rotational Intravascular Ultrasound

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613843A (en) 1984-10-22 1986-09-23 Ford Motor Company Planar coil magnetic transducer
GB2252208B (en) * 1991-01-24 1995-05-03 Burr Brown Corp Hybrid integrated circuit planar transformer
JPH04321190A (en) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
JP3197022B2 (en) 1991-05-13 2001-08-13 ティーディーケイ株式会社 Multilayer ceramic parts for noise suppressor
US5363080A (en) 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
JP3320096B2 (en) 1992-05-07 2002-09-03 ティーディーケイ株式会社 Multilayer inductor and method of manufacturing the same
US5321380A (en) 1992-11-06 1994-06-14 Power General Corporation Low profile printed circuit board
JPH0786755A (en) * 1993-09-17 1995-03-31 Nagano Japan Radio Co Printed board
US6073339A (en) 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
US6342681B1 (en) 1997-10-15 2002-01-29 Avx Corporation Surface mount coupler device
JP4046827B2 (en) 1998-01-12 2008-02-13 Ｔｄｋ株式会社 Planar coil and planar transformer
US6091607A (en) * 1998-12-10 2000-07-18 Checkpoint Systems, Inc. Resonant tag with a conductive composition closing an electrical circuit
FR2812755B1 (en) * 2000-08-04 2002-10-31 St Microelectronics Sa INTEGRATED INDUCTANCE
WO2002071422A1 (en) * 2001-03-05 2002-09-12 Tdk Corporation Planar coil and planar transformer
JP3755453B2 (en) 2001-11-26 2006-03-15 株式会社村田製作所 Inductor component and method for adjusting inductance value thereof
US6950279B2 (en) * 2003-01-30 2005-09-27 Headway Technologies, Inc. Thin-film magnetic head with thin-film coil of low resistance
US6927939B2 (en) * 2003-01-30 2005-08-09 Headway Technologies, Inc. Thin-film magnetic head and method of manufacturing same
JP2005005298A (en) * 2003-06-09 2005-01-06 Tdk Corp Laminated chip inductor and its manufacturing method
JP4058642B2 (en) 2004-08-23 2008-03-12 セイコーエプソン株式会社 Semiconductor device
US7557562B2 (en) 2004-09-17 2009-07-07 Nve Corporation Inverted magnetic isolator
JP2007067214A (en) 2005-08-31 2007-03-15 Taiyo Yuden Co Ltd Power inductor
JP4312766B2 (en) * 2006-01-27 2009-08-12 シャープ株式会社 Semiconductor device
US7646304B2 (en) * 2006-04-10 2010-01-12 Checkpoint Systems, Inc. Transfer tape strap process
FR2901041B1 (en) * 2006-05-12 2008-10-10 Eric Heurtier LABEL INTEGRATING RF ANTENNA ANTENNA AND UHF RFID CARRIER
KR101352344B1 (en) * 2006-09-13 2014-01-15 삼성디스플레이 주식회사 Signal transfer member and display apparatus having the same
TWI303957B (en) * 2006-12-11 2008-12-01 Ind Tech Res Inst Embedded inductor devices and fabrication methods thereof
JP5287154B2 (en) * 2007-11-08 2013-09-11 パナソニック株式会社 Circuit protection element and manufacturing method thereof
JP4462388B2 (en) * 2007-12-20 2010-05-12 株式会社村田製作所 Wireless IC device
KR20100015206A (en) 2008-08-04 2010-02-12 삼성전자주식회사 A wireless testing interface device, a semiconductor device and a semiconductor package including thereof, and a testing method using thereof
US8339802B2 (en) * 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
CN103180919B (en) 2010-10-21 2016-05-18 Tdk株式会社 Coil component and manufacture method thereof
CN103430256B (en) * 2011-01-04 2016-06-01 Aac微技术有限公司 Comprise the coil assembly of planar coil
US8358487B2 (en) * 2011-01-05 2013-01-22 Headway Technologies, Inc. Thin-film magnetic head having coil of varying thinknesses in spaces adjacent the main magnetic pole
US9269634B2 (en) * 2011-05-16 2016-02-23 Globalfoundries Inc. Self-aligned metal gate CMOS with metal base layer and dummy gate structure
WO2013113945A1 (en) * 2012-02-05 2013-08-08 Féinics Amatech Teoranta Rfid antenna modules and methods
JP6060508B2 (en) * 2012-03-26 2017-01-18 Tdk株式会社 Planar coil element and manufacturing method thereof
KR101792269B1 (en) * 2012-04-05 2017-11-01 삼성전기주식회사 Electronic component and method for manufacturing the same
US9009951B2 (en) 2012-04-24 2015-04-21 Cyntec Co., Ltd. Method of fabricating an electromagnetic component
US9712209B2 (en) * 2012-12-03 2017-07-18 Samsung Electronics Co., Ltd. Planar spiral induction coil having increased quality (Q)-factor and method for designing planar spiral induction coil
US20140320252A1 (en) * 2013-04-29 2014-10-30 Skyworks Solutions, Inc. Low loss impedance transformers implemented as integrated passive devices and related methods thereof
CN203596265U (en) * 2013-11-21 2014-05-14 蒋石正 Power inductance piece
CN103645451A (en) * 2013-12-06 2014-03-19 东南大学 Low field nuclear magnetic resonance probe based on printed circuit board helmholtz coil
US20150279548A1 (en) * 2014-04-01 2015-10-01 Virginia Tech Intellectual Properties, Inc. Compact inductor employing redistrubuted magnetic flux
KR101823193B1 (en) * 2014-09-18 2018-01-29 삼성전기주식회사 Chip electronic component and board having the same mounted thereon
JP6535450B2 (en) * 2014-10-14 2019-06-26 株式会社村田製作所 Electronic parts
JP6331953B2 (en) * 2014-10-15 2018-05-30 株式会社村田製作所 Electronic components
KR101832546B1 (en) * 2014-10-16 2018-02-26 삼성전기주식회사 Chip electronic component and board having the same mounted thereon
US10956032B2 (en) * 2014-10-29 2021-03-23 Microsoft Technology Licensing, Llc Keyboard utility for inputting data into a mobile application
KR102105395B1 (en) * 2015-01-19 2020-04-28 삼성전기주식회사 Chip electronic component and board having the same mounted thereon
KR102105394B1 (en) 2015-03-09 2020-04-28 삼성전기주식회사 Coil component and and board for mounting the same
KR101823199B1 (en) * 2015-04-16 2018-01-29 삼성전기주식회사 Chip electronic component
KR101832559B1 (en) * 2015-05-29 2018-02-26 삼성전기주식회사 Coil Electronic Component
US10658847B2 (en) * 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9960176B2 (en) * 2015-11-05 2018-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Nitride-free spacer or oxide spacer for embedded flash memory
KR102163414B1 (en) * 2015-12-30 2020-10-08 삼성전기주식회사 Coil electronic component
US20180204672A1 (en) * 2017-01-13 2018-07-19 Arris Enterprises Llc High q adjacent printed antenna for wireless energy transfer
KR20180085219A (en) 2017-01-18 2018-07-26 삼성전기주식회사 Inductor and Manufacturing Method for the Same
KR102004814B1 (en) * 2018-04-25 2019-10-01 삼성전기주식회사 Coil component
TWI849118B (en) * 2019-05-02 2024-07-21 以色列商納米尺寸技術領域股份有限公司 Systems and methods of fabricating coils for coreless transformers and inductors

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873757A (en) * 1987-07-08 1989-10-17 The Foxboro Company Method of making a multilayer electrical coil
US4904967A (en) * 1988-01-27 1990-02-27 Murata Manufacturing Co., Ltd. LC composite component
US5929733A (en) * 1993-07-21 1999-07-27 Nagano Japan Radio Co., Ltd. Multi-layer printed substrate
US6000128A (en) * 1994-06-21 1999-12-14 Sumitomo Special Metals Co., Ltd. Process of producing a multi-layered printed-coil substrate
US6388551B2 (en) * 1996-03-22 2002-05-14 Murata Manufacturing Co., Ltd. Method of making a laminated balun transform
US6618929B2 (en) * 1996-03-29 2003-09-16 Murata Manufacturing Co., Ltd. Laminated common-mode choke coil
US7046114B2 (en) * 2001-02-14 2006-05-16 Murata Manufacturing Co., Ltd. Laminated inductor
US6710694B2 (en) * 2001-10-23 2004-03-23 Murata Manufacturing Co., Ltd. Coil device
US6914508B2 (en) * 2002-08-15 2005-07-05 Galaxy Power, Inc. Simplified transformer design for a switching power supply
US20060214759A1 (en) * 2005-03-23 2006-09-28 Sumida Corporation Inductor
US7362205B2 (en) * 2005-08-26 2008-04-22 Tdk Corporation Common-mode filter
US7378931B2 (en) * 2005-09-29 2008-05-27 Murata Manufacturing Co., Ltd. Multilayer coil component
US7518480B1 (en) * 2006-08-03 2009-04-14 Rf Micro Devices, Inc. Printed circuit board inductor
US20080180206A1 (en) * 2006-08-28 2008-07-31 Avago Technologies Ecbu (Singapore) Pte.Ltd. Coil Transducer with Reduced Arcing and Improved High Voltage Breakdown Performance Characteristics
US20090243783A1 (en) * 2006-08-28 2009-10-01 Avago Technologies Ecbu (Singapore) Pte. Ltd. Minimizing Electromagnetic Interference in Coil Transducers
US20090243782A1 (en) * 2006-08-28 2009-10-01 Avago Technologies Ecbu (Singapore) Pte. Ltd. High Voltage Hold-Off Coil Transducer
US20100020448A1 (en) * 2006-08-28 2010-01-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Galvanic isolator
US20110095620A1 (en) * 2006-08-28 2011-04-28 Avago Technologies Ecbu (Singapore) Pte. Ltd. Galvanic Isolators and Coil Transducers
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US8334747B2 (en) * 2009-07-23 2012-12-18 Murata Manufacturing Co., Ltd. Coil-integrated switching power supply module
US20130022210A1 (en) * 2011-07-22 2013-01-24 Mikko Pekka Vainiala Method and apparatus for impulse response measurement and simulation
US20130028941A1 (en) * 2011-07-29 2013-01-31 Selecta Biosciences, Inc. Synthetic nanocarriers that generate humoral and cytotoxic t lymphocyte (ctl) immune responses
US20130120095A1 (en) * 2011-11-10 2013-05-16 Harris Corporation Method for making an electrical inductor and related inductor devices
US20130289412A1 (en) * 2012-03-19 2013-10-31 Volcano Corporation Rotary Transformer and Associated Devices, Systems, and Methods for Rotational Intravascular Ultrasound

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546679B2 (en) 2016-12-21 2020-01-28 Samsung Electro-Mechanics Co., Ltd. Inductor
KR20190101103A (en) * 2018-02-22 2019-08-30 삼성전기주식회사 Inductor array
US11075030B2 (en) * 2018-02-22 2021-07-27 Samsung Electro-Mechanics Co., Ltd. Inductor array
KR102463336B1 (en) * 2018-02-22 2022-11-04 삼성전기주식회사 Inductor array
US11107616B2 (en) * 2018-04-02 2021-08-31 Samsung Electro-Mechanics Co., Ltd. Coil component

Also Published As

Publication number Publication date
US11469030B2 (en) 2022-10-11
US10553338B2 (en) 2020-02-04
CN108417339A (en) 2018-08-17
US20190108936A1 (en) 2019-04-11
KR101892689B1 (en) 2018-08-28
CN108417339B (en) 2020-07-21
US12062476B2 (en) 2024-08-13
US11626233B2 (en) 2023-04-11
US20200373055A1 (en) 2020-11-26
CN105513747B (en) 2018-05-11
US20200135376A1 (en) 2020-04-30
CN105513747A (en) 2016-04-20
US20230215610A1 (en) 2023-07-06
KR20160043857A (en) 2016-04-22

Similar Documents

Publication Publication Date Title
US12062476B2 (en) Chip electronic component and board having the same
US10123420B2 (en) Coil electronic component
KR102025708B1 (en) Chip electronic component and board having the same mounted thereon
US9655247B1 (en) Coil component and board having the same
US10170229B2 (en) Chip electronic component and board having the same
US10861637B2 (en) Coil component
US10607769B2 (en) Electronic component including a spacer part
US20160111194A1 (en) Chip electronic component and board having the same
US9875837B2 (en) Coil electronic component
US20180204663A1 (en) Inductor and method of manufacturing the same
US20160211071A1 (en) Electronic component
US20160217903A1 (en) Electronic component
KR102047561B1 (en) Chip electronic component and board having the same mounted thereon
US20180047494A1 (en) Coil component
KR102499470B1 (en) Chip electronic component
KR102235695B1 (en) Chip electronic component
KR102130679B1 (en) Chip electronic component
KR102004240B1 (en) Chip electronic component and board having the same mounted thereon

Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:JEONG, DONG JIN;REEL/FRAME:035451/0531

Effective date: 20150405

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载