US20150013955A1

US20150013955A1 - Heat sink

Info

Publication number: US20150013955A1
Application number: US14/252,378
Authority: US
Inventors: Tai-Wei Lin; Chih-Ta HUANG
Original assignee: Hon Hai Precision Industry Co Ltd
Current assignee: Hon Hai Precision Industry Co Ltd
Priority date: 2013-07-10
Filing date: 2014-04-14
Publication date: 2015-01-15
Also published as: TW201502459A

Abstract

A heat sink includes a base and a number of fins mounted parallelly on the base. Each fin defines a number of vents, and two heat dissipating pieces protrude from opposite sides of each vent. The heat dissipating pieces of each vent cooperatively bounds an opening communicating with the corresponding vent. The number of openings of each fin is aligned with the number of openings of the other fins. The aligned openings of the number of fins cooperatively define a number of first air channels perpendicular to the number of fins. The number of heat dissipating pieces bound a number of second air channels parallel to the number of fins.

Description

FIELD

The present disclosure relates to a heat sink.

BACKGROUND

During operation of many electronic devices, electronic components of the electronic devices generate large amounts of heat. The heat must be immediately removed to prevent the electronic devices from being damaged. Heat sinks are frequently used to dissipate heat from the electronic devices. The heat sinks may include a number of parallel fins. The fins cooperatively define a number of parallel ventilation slots aligning with system airflow to assist in dissipating heat.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of an embodiment of a heat sink and an electronic component.

FIG. 2 is an assembled view of FIG. 1.

FIG. 3 is a sectional view of FIG. 2, taken along line III-III.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
FIG. 1 illustrates an embodiment of a heat sink 100 for dissipating heat from an electronic component 200. The heat sink 100 comprises a base 101 and a plurality of substantially parallel fins 10.
FIGS. 2 and 3 illustrate assembled views of the heat sink 100 and the electronic component 200. In the embodiment of FIGS. 2 and 3, each fin 10 is substantially rectangular and defines a plurality of substantially rectangular vents 111. The vents 111 are arrayed along a lengthwise direction and a widthwise direction of the fin 10. Two heat dissipating pieces 12 substantially perpendicularly extend from opposite sides of each vent 111. The heat dissipating pieces 12 of each vent 111 cooperatively bound an opening 13 communicating with the corresponding vent 111.
The fins 10 are mounted on the base 101, such that the vents 111 of the fins 10 align with each other. The aligned vents 111 of the fins 10 cooperatively define a plurality of first air channels 14 extending along a direction substantially perpendicular to the fins 10. The openings 13 bound by the heat dissipating pieces 12 cooperatively define a plurality of second air channels 15 extending along a direction substantially parallel to the fins 10.
In use, a bottom surface of the base 101 is attached to the electronic component 200, such that heat generated by the electronic component 200 is transferred to the base 101 and the fins 10. If system airflow aligns with the first air channels 14, the system airflow flows through the first air channels 14. Thus, the system airflow can fully contact the fins 10 to increase heat-dissipation ability of the fins 10. If the system airflow aligns with the second air channels 15, the system airflow flows through the second channels 15. Thus, heat-dissipation ability of the fins 10 is similarly increased.
Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

What is claimed is:

1. A heat sink, comprising:

a base; and

a plurality of parallel fins mounted on the base, wherein each fin defines a plurality of vents, and at least two heat dissipating pieces protruding from each fin bounding two opposite sides of each vent, the heat dissipating pieces at opposite sides of each vent cooperatively bound an opening communicating with the corresponding vent, the plurality of openings of each fin is aligned with the plurality of openings of the other fins, the aligned openings of the plurality of fins form a plurality of first air channels perpendicular to the plurality of fins, the plurality of heat dissipating pieces of each fin bound a plurality of second air channels parallel to the plurality of fins.

2. The heat sink of claim 1, wherein each fin is substantially rectangular, the plurality of vents is arrayed along a lengthwise direction and a widthwise direction of the fin.

3. The heat sink of claim 2, wherein each vent is substantially rectangular.