US20130230717A1 - Copper nanostructures and methods for their preparation - Google Patents
Copper nanostructures and methods for their preparation Download PDFInfo
- Publication number
- US20130230717A1 US20130230717A1 US13/601,496 US201213601496A US2013230717A1 US 20130230717 A1 US20130230717 A1 US 20130230717A1 US 201213601496 A US201213601496 A US 201213601496A US 2013230717 A1 US2013230717 A1 US 2013230717A1
- Authority
- US
- United States
- Prior art keywords
- copper
- set forth
- nanowire
- nanowires
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 161
- 239000010949 copper Substances 0.000 title claims abstract description 129
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 123
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 23
- 238000002360 preparation method Methods 0.000 title description 4
- 239000002070 nanowire Substances 0.000 claims abstract description 56
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 239000003638 chemical reducing agent Substances 0.000 claims description 23
- 239000011541 reaction mixture Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 8
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 6
- 239000008103 glucose Substances 0.000 claims description 6
- 150000003973 alkyl amines Chemical class 0.000 claims description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 5
- JJLJMEJHUUYSSY-UHFFFAOYSA-L copper(II) hydroxide Inorganic materials [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 4
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 claims description 3
- 229910021592 Copper(II) chloride Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 3
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 claims description 3
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 claims description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- JIDMEYQIXXJQCC-UHFFFAOYSA-L copper;2,2,2-trifluoroacetate Chemical compound [Cu+2].[O-]C(=O)C(F)(F)F.[O-]C(=O)C(F)(F)F JIDMEYQIXXJQCC-UHFFFAOYSA-L 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 125000003282 alkyl amino group Chemical group 0.000 claims 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000007795 chemical reaction product Substances 0.000 abstract description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 18
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 12
- 238000003917 TEM image Methods 0.000 description 9
- 239000002159 nanocrystal Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 239000007900 aqueous suspension Substances 0.000 description 5
- 238000002371 ultraviolet--visible spectrum Methods 0.000 description 5
- 239000002042 Silver nanowire Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- 238000000411 transmission spectrum Methods 0.000 description 2
- GZPBVLUEICLBOA-UHFFFAOYSA-N 4-(dimethylamino)-3,5-dimethylphenol Chemical compound CN(C)C1=C(C)C=C(O)C=C1C GZPBVLUEICLBOA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- -1 Cu+ ions Chemical class 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 0 [1*]N([2*])[3*] Chemical compound [1*]N([2*])[3*] 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001784 detoxification Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000002198 surface plasmon resonance spectroscopy Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0547—Nanofibres or nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F9/00—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments
- D01F9/08—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments of inorganic material
-
- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/22—Yarns or threads characterised by constructional features, e.g. blending, filament/fibre
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2973—Particular cross section
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/298—Physical dimension
Definitions
- Copper nanostructures have increasingly been found to have significant utility in the microelectronics and catalysis fields.
- copper nanowires e.g., polycrystalline wires that are usually fabricated by lithographic techniques
- Copper nanostructures hold great promise for use in microelectronics including low-cost flexible displays, light-emitting diodes and thin film solar cells.
- Copper nanostructures have also been found to exhibit localized surface plasmon resonance (LSPR) peaks in the visible region. Copper nanoparticles have been widely used as catalysts for water-gas shift and gas detoxification reactions.
- LSPR localized surface plasmon resonance
- Metal nanostructures in the shape of nanowires are believed to find widespread use in applications such as the fabrication of transparent electrodes for flexible electronic and display devices. They are also useful in formulating conductive coatings for electrostatic discharging and electromagnetic shielding. Research has conventionally focused on use of silver nanowires for use in such applications. Compared to silver, copper is several orders of magnitude more abundant and is significantly less expensive. Copper nanowires with reduced sizes (i.e., reduced diameters) exhibit increased transmittance of visible light making them even more ideal for electronics use.
- One aspect of the present disclosure is directed to a method for producing a copper nanostructure.
- a reaction mixture is formed in a reaction vessel.
- the reaction mixture includes a copper-containing compound, a capping agent and a reducing agent.
- the copper-containing compound is reduced with the reducing agent to cause copper to form a copper nanostructure.
- the pressure in the reaction vessel is less than about 190 kPa and/or the temperature of the reaction mixture is less than about 115° C. during formation of the nanostructure.
- a further aspect of the present disclosure is directed to a population of copper nanowire structures.
- Each structure has a length and a diameter.
- the average diameter of the copper nanowire structures is less than about 40 nm and the average ratio of length to diameter of the copper nanowire structures is at least about 10:1.
- the structure includes at least about 60 wt % copper and is characterized by a penta-twinned shape.
- FIG. 1 is an XRD pattern of a copper nanowire produced according to Example 1;
- FIGS. 2-3 are SEM images of copper nanowire structures produced according to Example 1;
- FIG. 4 is a TEM image of copper nanowire structures produced according to Example 1.
- FIG. 5 is a graph showing the distribution of diameters of copper nanowires produced according to Example 1.
- FIG. 6 is a TEM image of a portion of a copper nanowire produced according to Example 1.
- FIG. 7 is a high-resolution TEM image of the region marked by the box in FIG. 6 ;
- FIG. 8 is a TEM image of a second portion of a copper nanowire produced according to Example 1.
- FIG. 9 is a high-resolution TEM image of the region marked by the box in FIG. 8 ;
- FIG. 10 is a UV-vis spectra of an aqueous suspension of copper nanowires having an average diameter of about 24 nm and of silver nanowires having an average diameter of about 80 nm;
- FIG. 11 is a SEM image of copper bi-pyramids that formed after 30 minutes of reaction as produced according to Example 3 with an inset showing the SEM image of a tilted sample showing the pentagonal cross-section of the nanocrystals;
- FIG. 12 is a SEM image of copper bi-pyramids that formed after 1 hour of reaction as produced according to Example 3;
- FIG. 13 is a SEM image of copper bi-pyramids that formed after 3 hours of reaction as produced according to Example 3;
- FIG. 14 is a SEM image of copper bi-pyramids that formed after 6 hours of reaction as produced according to Example 3 with an inset showing the SEM image of a tilted sample showing the pentagonal cross-section of the nanocrystals;
- FIG. 15 is a TEM image of the copper nanowire of FIG. 14 ;
- FIG. 16 is a high-resolution TEM image of the region marked by the box in FIG. 15 ;
- FIG. 17 is a UV-vis spectra of the aqueous suspension of copper nanostructures of FIG. 11 ;
- FIG. 18 is a SEM image showing one type of pentagonal bi-pyramid
- FIG. 19 is a geometric model of the bi-pyramid of FIG. 18 ;
- FIG. 20 is a SEM image showing a second type of pentagonal bi-pyramid
- FIG. 21 is a geometric model of the bi-pyramid of FIG. 20 ;
- FIG. 22 is a SEM image showing a third type of pentagonal bi-pyramid
- FIG. 23 is a geometric model of the bi-pyramid of FIG. 22 ;
- FIG. 24 is a SEM image of copper nanocubes that formed after 30 minutes of reaction as produced according to Example 4.
- FIG. 25 is a SEM image of copper nanocubes that formed after 1 hour of reaction as produced according to Example 4.
- FIG. 26 is a SEM image of copper nanocubes that formed after 6 hours of reaction as produced according to Example 4.
- FIG. 27 is a XRD pattern of the copper nanocubes produced according to Example 4.
- FIG. 28 is a TEM image of a copper nanocube produced according to Example 4.
- FIG. 29 is high-resolution TEM image of the region marked by the box in FIG. 28 ;
- FIG. 30 is the UV-vis spectra of three separate aqueous suspensions of 50 nm, 100 nm and 200 nm copper nanocubes.
- FIG. 31 is a schematic of the reaction pathways used to produce various copper nanostructures according to Examples 1-4.
- the field of the disclosure relates to copper nanostructures and, more particularly, to copper nanostructures with relatively small dimensions and methods for producing such structures.
- the ratios of the various reaction products may be adjusted to produce other structures such as tad-pole shaped nanowires, nanocubes or pentagonal bi-pyramids.
- Provisions of the present disclosure are directed to copper nanostructures (e.g., nanowires) and methods for producing copper nanostructures. Without being held to any particular theory, it has been found that copper nanostructures formed at relatively low pressures (e.g., atmospheric pressure) and/or low temperatures (e.g., 100° C. or less) have a relatively small diameter. Further it has been found that by adjusting the concentration of the components of the reaction mixture and/or adjusting the respective ratios of the components, the shape of the resulting nanostructure may be changed.
- the copper nanostructures of the present disclosure are produced by forming a reaction mixture that contains a copper-containing compound, a capping agent and a reducing agent.
- the copper-containing compound is reduced by the reducing agent to produce elemental copper that forms the nanostructure.
- the pressure and/or temperature of the reaction vessel may be maintained relatively low (e.g., a pressure of less than about 190 kPa and/or a temperature of less than about 115° C.) such that nanowires with a relatively small diameter may be produced.
- Suitable copper-containing compounds that may be included in the reaction mixture include any compounds from which elemental copper)(Cu 0 is formed upon contact with a reducing agent or during electrolysis or an electroless deposition method, or upon decomposition.
- Exemplary copper-containing compounds include copper (II) nitrate (Cu(NO 3 ) 2 , anhydrous or hydrated), copper (II) sulfate (CuSO 4 , anhydrous or hydrated), copper (II) chloride (CuCl 2 , anhydrous or hydrated), copper (II) hydroxide (Cu(OH) 2 , anhydrous or hydrated), copper (II) acetate (Cu(CH 3 COO) 2 , anhydrous or hydrated), and copper (II) trifluoroacetate (Cu(CF 3 COO) 2 , anhydrous or hydrated).
- Suitable copper-containing compounds may also include various ligands and/or chelates that contain copper without limitation.
- the reducing agent that is combined with the copper-containing compound is any compound (or ligand or chelate) that reduces copper ions into elemental copper to deposit as a nanostructure seed or as part of the growing copper nanostructure.
- Suitable reducing agents include glucose (a or (3 form) and ascorbic acid.
- a capping agent is included in the reaction mixture.
- the capping agent stabilizes the resulting nanostructure (e.g., by changing the surface energies of different facets) and prevents aggregation between the structures.
- the capping agent becomes incorporated into the matrix during formation of the copper nanostructure-based composites.
- Suitable capping agents include alkylamines. Alkylamines have the general structure of Formula (I) shown below
- R 1 is an alkyl group (or substituted alkyl group) and R 2 and R 3 are either hydrogen or an alkyl group (or substituted alkyl group).
- the alkyl group of R 1 has 25 carbon atoms or less.
- One particularly preferred alkylamine is hexadecylamine (“HDA”).
- HDA has been found to be an effective capping agent for copper and has a strong selectivity toward the ⁇ 100 ⁇ facets of the nanostructure.
- HDA is used as a capping agent and glucose is used as a reducing agent.
- copper nanostructures may be produced in relatively large quantities with high purity and good uniformity.
- Other alkylamines of Formula (I) that may be used include octadecylamine and oleylamine.
- the components that form the reaction mixture are dissolved in water; however in some embodiments an organic solvent may be used or even a two-solvent system may be used.
- the copper-containing compound, the reducing agent and capping agent may be added to any suitable reaction vessel in any manner suitable to those of skill in the art (e.g., as solids or in solution form and in any order of addition).
- Suitable vessels may be lab scale (e.g., reaction vials) or may be commercial-scale (e.g., steel vessels which may be polymer-lined).
- the reaction vessel is agitated during formation of the copper nanostructures.
- the nanostructures may be produced batch-wise or in a continuous manner (e.g., a continuous-stirred tank reactor (CSTR)).
- CSTR continuous-stirred tank reactor
- the reaction contents are heated.
- the reaction mixture is heated to a temperature less than about 115° C.
- the reaction mixture is heated to a temperature less than about 110° C. or less than about 105° C.
- the reaction mixture is heated to a temperature of 100° C. or less to prevent the reaction mixture from boiling causing the pressure of the reaction contents to increase as in pressurized vessel systems. It is preferred that the reaction mixture be maintained at about ambient pressure (101 kPa) or less. However in some embodiments, the pressure is maintained to be below about 190 kPa, less than about 150 kPa, less than about 125 kPa or less than about 105 kPa.
- a reduced temperature e.g., less than about 115° C. and preferably less than about 100° C.
- a reduced pressure e.g., less than about 190 kPa and preferably 101 kPa or less
- copper nanostructures and, in particular, copper nanowires are produced with a relatively small diameter (e.g., less than about 40 nm, less than about 30 nm or even less than about 25 nm).
- the reduced temperature and/or pressure influences nucleation of the copper nanostructure.
- the seeds that are produced at such reduced temperatures and pressures have a decahedral shape which allows nanowires having a penta-twinned structure to be produced.
- Such penta-twinned copper structures have a relatively small diameter compared to conventional copper nanostructures.
- reaction is substantially complete after 6 hours or less.
- Other reaction times may be used depending on the concentration of components added, the desired structure of the nanomaterial and the desired conversion. Reaction times may be at least about 30 minutes, at least about 1 hour, at least about 3 hours, at least about 5 hours, from about 30 minutes to about 6 hours or from about 30 minutes to about 3 hours.
- the nanostructure that forms as a result of the process of embodiments of the present disclosure depends on the relative reaction rates and, in particular, the amount of reducing agent and/or capping agent present in the reaction mixture.
- decahedral seeds are nucleated and form penta-twinned nanowires with relatively uniform diameter due to anisotropic growth ( FIGS. 2-4 ).
- isotropic growth is promoted during early stage of growth.
- the reaction rate becomes smaller and the structure narrows to form a pentagonal bi-pyramid ( FIG. 11 ).
- an even smaller reaction rate results and the pentagonal bi-pyramid further grows into tadpole-shaped nanowires ( FIGS. 12-15 ).
- the reaction conditions are controlled such that single crystal seeds are nucleated rather than decahedral seeds. This allows nanocubes ( FIGS. 24-26 ) to form rather than nanowires and/or bi-pyramids.
- copper nanowires have been found to be produced without formation of bi-pyramids ( FIGS. 2-4 ) at relatively low concentrations of reducing agent and relatively high concentrations of capping agent. If the concentration of reducing agent is increased, pentagonal bi-pyramids form and the bi-pyramids taper off to form nanowires as the reaction proceeds. In contrast, if the concentration of capping agent is lowered, nanocubes form. Without being bound to any particular theory, it is believed that nanocubes may form due to oxidative etching. The oxidative etching causes single crystal seeds to form which results in growth of nanocubes. Such oxidative etching is blocked by the capping and protective effect of the capping agent (e.g., HDA) at higher concentrations of capping agent allowing multiply twinned copper seeds to form.
- the capping agent e.g., HDA
- the relative amounts of the components may be adjusted to produce the desired structure as appreciated by those of skill in the art.
- Copper nanowires produced in accordance with the present disclosure are characterized by a relatively small diameter and a high aspect ratio.
- the population of copper nanowire structures that are produced according to embodiments of the present disclosure have an average diameter of less than about 40 nm.
- the population has an average diameter of less than about 30 nm, less than about 25 nm, from about 10 nm to about 40 nm, from about 10 nm to about 30 nm from about 15 nm to about 40 nm, from about 15 nm to about 30 nm, from about 20 nm to about 40 nm or from about 20 nm to about 30 nm.
- the average length of the copper nanowire structures produced according to embodiments of the present disclosure may be at least about 10 nm, at least about 100 nm or even at least about 1 mm.
- the average aspect ratio i.e., the average ratio of length to diameter of the copper nanowire structures
- the aspect ratio is at least about 50:1, at least about 100:1, at least about 1000:1, at least about 10,000:1 or even at least about 25,000:1.
- the population of nanowires contains copper and amounts of organic material (e.g., the capping agent).
- the amount of copper in the population of nanowires (and in each nanowire) by at least about 60 wt % copper or, as in other embodiments, at least about 70 wt % copper, at least about 80 wt % copper, from about 60 wt % to about 99 wt % copper or from about 70 wt % to about 95 wt % copper.
- the properties applied above may be an average of the population of copper nanowires that is produced or of individual nanowires.
- Populations of copper nanowires may include at least about 100 copper nanowires, at least about 1000 copper nanowires, at least about 10,000 copper nanowires, at least about 1 ⁇ 10 6 copper nanowires or even at least about 1 ⁇ 10 9 copper nanowires.
- the copper nanowires of the present disclosure have been found to have a penta-twinned structure (i.e., five single crystallites bound together). It is believed the penta-twinned structure is bound by ten ⁇ 111 ⁇ facets at the two ends and five ⁇ 100 ⁇ side faces. It should be noted that the copper nanowires are not constructed on a template or membrane. In contrast, metallic copper atoms themselves give the nanowire its structural characteristics.
- a tadpole shaped nanostructure may be produced in which a bi-pyramid structure tapers from a base of about 200 nm ( FIG. 11 ). If the reaction is allowed to continue, the reaction slows and a nanowire with a radius less than about 40 nm extends from the point of the bi-pyramid ( FIGS. 12-15 ). In some embodiments, the reaction conditions are controlled such that copper nanocubes are formed. In the initial stage of reaction (e.g., at about 1 hour), the cube sides are about 50 nm in size ( FIG. 25 ). If the reaction is allowed to continue (e.g., for about 6 hours) the edges of the cube grow to about 200 nm in size ( FIG. 26 ).
- reaction conditions were varied in Examples 1-4 to produce various structures as shown in FIG. 31 . It should be noted that other reaction conditions (e.g., component concentrations) may be used to produce the desired nanostructures and the recited conditions are exemplary and should not be considered in a limiting sense.
- CuCl 2.2 H 2 O (0.021 g), HDA (0.18 g) and glucose (0.05 g) were dissolved in water (10 ml) in a vial (22.2 ml, borosilicate glass vial, with a black phenolic molded screw cap and polyvinyl-faced pulp liner, VWR International (Radnor, Pa.)) at room temperature.
- a vial (22.2 ml, borosilicate glass vial, with a black phenolic molded screw cap and polyvinyl-faced pulp liner, VWR International (Radnor, Pa.)
- the solution was magnetically stirred at room temperature overnight.
- the capped vial was then transferred into an oil bath and heated at 100° C. for 6 hours under magnetic stirring. As the reaction proceeded, the solution changed its color from blue to brown and finally red-brown. All the chemicals were obtained from Sigma-Aldrich (St. Louis, Mo.) and used as received.
- the as-prepared aqueous suspensions were directly dropped onto silicon substrates (for SEM) or carbon-coated copper grids (for TEM and high-resolution TEM) and then dried under the ambient conditions of a chemical laboratory.
- the silicon substrates or copper grids were then rinsed with hot water (about 60° C.) to remove the excess HDA and glucose, followed by another round of drying.
- the products could have alternatively been collected as powders by use of centrifugation processes.
- SEM Scanning electron microscope
- All SEM images were captured with a field-emission microscope (Nova NanoSEM 230, FEI (Hilsboro, Oreg.)) operated at 15 kV.
- All transmission electron microscope (TEM) images were conducted with a microscope (Tecnai G2 Spirit, FEI (Hilsboro, Oreg.)) operated at 120 kV.
- High-resolution TEM imaging was performed using a microscope (2100F, JEOL (Tokyo, Japan)) operated at 200 kV.
- Powder x-ray diffraction (XRD) patterns were recorded using a diffractometer (DMAX/A, Rigaku (The Woodlands, Tex.)) operated at 35 kV and 35 mA.
- the concentrations of Cu (II)/Cu (I) left behind in the reaction solutions were determined using an inductively-coupled plasma mass spectrometer (ICP-MS, PerkinElmer (Waltham, Mass.)).
- FIG. 1 shows the X-ray diffraction (XRD) pattern of a copper nanowire.
- XRD X-ray diffraction
- the concentrations of Cu 2+ /Cu + ions left behind in the reaction solution was measured using inductively-coupled plasma mass spectrometry (ICP-MS). It was determined that the precursor had been converted into atomic copper at a percentage of 93%.
- ICP-MS inductively-coupled plasma mass spectrometry
- the scanning electron microscopy (SEM) image shown in FIG. 2 demonstrates that copper nanowires could be prepared in high purity, typically approaching 95%, without any post-synthesis separation. Only a very small amount of copper nanocubes was found to co-exist with the nanowires. In addition, the nanowires were found to be highly flexible and some of them showed bending more than 360 degrees without being broken. Both the SEM image at a higher magnification ( FIG. 3 ) and TEM image ( FIG. 4 ) reveal that the nanowires were uniform in diameter and tended to be aligned in parallel to form bundles during sample preparation. The nanowires had an average diameter of 24 ⁇ 4 nm as calculated from 100 nanowires randomly selected from a number of TEM images ( FIG. 5 ).
- the lengths of the copper nanowires varied in the range of several tens to hundreds of micrometers; some of them were as long as several millimeters.
- the band-like contrast (see the box in FIG. 4 ) observed on the TEM images can be attributed to strains caused by bending or twisting.
- FIGS. 6-9 show transmission electron microscopy (TEM) images and the corresponding high-resolution TEM images taken from the middle ( FIGS. 6 and 7 ) and end portions ( FIGS. 8 and 9 ) of two different Cu nanowires, respectively.
- the insets in FIG. 7 and FIG. 9 schematically illustrate the orientations of the copper nanowires relative to the incident electron beam (indicated by arrows).
- the high-resolution TEM images FIGS. 7 and 9 ) show the existence of ⁇ 111 ⁇ twin planes parallel to the long axis of the copper nanowire. When the direction of the e-beam was perpendicular to the bottom side of the pentagonal nanowire ( FIG.
- FIG. 9 shows the high-resolution TEM image taken from a copper nanowire oriented with one of its side faces parallel to the e-beam.
- the fringes with lattice spacing of 2.1, 1.8, and 1.3 ⁇ could be indexed to the ⁇ 111 ⁇ , ⁇ 200 ⁇ , and ⁇ 220 ⁇ planes of copper, respectively.
- the copper nanowires had a penta-twinned structure bound by ten ⁇ 111 ⁇ facets at the two ends and five ⁇ 100 ⁇ side faces, which are consistent with the results previously reported for other metals (e.g., Ag, Au, and Pd).
- other metals e.g., Ag, Au, and Pd.
- UV-vis spectra were taken with a diode array spectrophotometer (Cary 50, Varian (Palo Alto, Calif.)).
- FIG. 10 shows UV-vis transmission spectra recorded from aqueous suspensions of the 24-nm copper nanowires of Example 1 and penta-twinned silver nanowires of 80-nm in diameter (prepared according to the literature) at roughly the same metal concentration (30 ⁇ g/ml), suggesting a slightly higher transmittance in the visible region for the copper nanowires. This higher transmittance could be attributed to the smaller diameter of the copper nanowires.
- glucose i.e., the reducing agent
- the tapered cooper nanocrystals exhibited a UV-vis absorption peak around 591 nm ( FIG. 17 ) and are characterized by a pentagonal bi-pyramid structure (see inset of FIG. 11 and FIGS. 18-23 ) formed by stretching apart the five-fold apices of a decahedron.
- Example 1 The preparation procedure of Example 1 was used to produce copper nanocrystals but the concentration of HDA (i.e., the capping agent) was decreased from 18 mg/ml to 9 mg/ml.
- Copper nanocubes ( FIGS. 24-26 ) formed rather than copper nanowires.
- FIGS. 24-26 are SEM images of the products obtained after 0.5 h, 1 h, and 6 h of reaction, respectively.
- FIG. 27 gives an XRD pattern of the nanocubes obtained at 6 h. For bulk copper, the strongest XRD diffraction is the (111) peak, followed by the (200), (220), and (311) peaks.
- the copper nanocubes tend to give (200) diffraction as the strongest peak because of their preferential orientation with ⁇ 100 ⁇ planes parallel to the substrate.
- the high-resolution TEM image of an individual Cu nanocube viewed along the ⁇ 100> zone axis ( FIGS. 28-29 ) clearly shows well-resolved, continuous fringes with lattice spacing of 1.8 ⁇ , corresponding to the ⁇ 100 ⁇ planes, indicating that the nanocube was a single crystal bound by ⁇ 100 ⁇ facets.
- FIG. 30 shows UV-vis absorption spectra taken from the copper nanocubes dispersed in water.
- the copper nanocubes exhibited a major SPR peak in the visible region, whose position was red-shifted from 565 to 625 nm as the edge length of the nanocubes was increased from 50 to 200 nm.
- the SPR peak of the copper nanocubes was positioned at a much longer wavelength.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Textile Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Copper nanostructures with relatively small dimensions and method for producing such structures are discloses. The ratios of the various reaction products may be adjusted to produce pentagonal nanowires and other structures such as tadpole shaped nanowires, nanocubes or pentagonal bi-pyramids.
Description
- This application claims the benefit of U.S. Provisional Patent Application No. 61/530,734, filed Sep. 2, 2011, which is incorporated herein by reference in its entirety.
- The claimed subject matter was developed with Government support under NSF Grant Nos. 0804088, 1104614 and ECS-0335765, awarded by the National Science Foundation. The Government has certain rights in the claimed subject matter.
- Copper nanostructures have increasingly been found to have significant utility in the microelectronics and catalysis fields. For example, copper nanowires (e.g., polycrystalline wires that are usually fabricated by lithographic techniques) are currently used as interconnects in computer chips. Copper nanostructures hold great promise for use in microelectronics including low-cost flexible displays, light-emitting diodes and thin film solar cells. Copper nanostructures have also been found to exhibit localized surface plasmon resonance (LSPR) peaks in the visible region. Copper nanoparticles have been widely used as catalysts for water-gas shift and gas detoxification reactions.
- Metal nanostructures in the shape of nanowires are believed to find widespread use in applications such as the fabrication of transparent electrodes for flexible electronic and display devices. They are also useful in formulating conductive coatings for electrostatic discharging and electromagnetic shielding. Research has conventionally focused on use of silver nanowires for use in such applications. Compared to silver, copper is several orders of magnitude more abundant and is significantly less expensive. Copper nanowires with reduced sizes (i.e., reduced diameters) exhibit increased transmittance of visible light making them even more ideal for electronics use.
- A continuing need exists for copper nanostructures that are suitable for use in various applications such as microelectronics and catalysis and for methods for producing them. A particular need exists for copper nanowires with relatively small diameters and methods for producing such nanowires.
- One aspect of the present disclosure is directed to a method for producing a copper nanostructure. A reaction mixture is formed in a reaction vessel. The reaction mixture includes a copper-containing compound, a capping agent and a reducing agent. The copper-containing compound is reduced with the reducing agent to cause copper to form a copper nanostructure. The pressure in the reaction vessel is less than about 190 kPa and/or the temperature of the reaction mixture is less than about 115° C. during formation of the nanostructure.
- A further aspect of the present disclosure is directed to a population of copper nanowire structures. Each structure has a length and a diameter. The average diameter of the copper nanowire structures is less than about 40 nm and the average ratio of length to diameter of the copper nanowire structures is at least about 10:1.
- Another aspect of the present disclosure is directed to a copper nanowire structure. The structure includes at least about 60 wt % copper and is characterized by a penta-twinned shape.
- Various refinements exist of the features noted in relation to the above-mentioned aspects of the present disclosure. Further features may also be incorporated in the above-mentioned aspects of the present disclosure as well. These refinements and additional features may exist individually or in any combination. For instance, various features discussed below in relation to any of the illustrated embodiments of the present disclosure may be incorporated into any of the above-described aspects of the present disclosure, alone or in any combination.
-
FIG. 1 is an XRD pattern of a copper nanowire produced according to Example 1; -
FIGS. 2-3 are SEM images of copper nanowire structures produced according to Example 1; -
FIG. 4 is a TEM image of copper nanowire structures produced according to Example 1; -
FIG. 5 is a graph showing the distribution of diameters of copper nanowires produced according to Example 1; -
FIG. 6 is a TEM image of a portion of a copper nanowire produced according to Example 1; -
FIG. 7 is a high-resolution TEM image of the region marked by the box inFIG. 6 ; -
FIG. 8 is a TEM image of a second portion of a copper nanowire produced according to Example 1; -
FIG. 9 is a high-resolution TEM image of the region marked by the box inFIG. 8 ; -
FIG. 10 is a UV-vis spectra of an aqueous suspension of copper nanowires having an average diameter of about 24 nm and of silver nanowires having an average diameter of about 80 nm; -
FIG. 11 is a SEM image of copper bi-pyramids that formed after 30 minutes of reaction as produced according to Example 3 with an inset showing the SEM image of a tilted sample showing the pentagonal cross-section of the nanocrystals; -
FIG. 12 is a SEM image of copper bi-pyramids that formed after 1 hour of reaction as produced according to Example 3; -
FIG. 13 is a SEM image of copper bi-pyramids that formed after 3 hours of reaction as produced according to Example 3; -
FIG. 14 is a SEM image of copper bi-pyramids that formed after 6 hours of reaction as produced according to Example 3 with an inset showing the SEM image of a tilted sample showing the pentagonal cross-section of the nanocrystals; -
FIG. 15 is a TEM image of the copper nanowire ofFIG. 14 ; -
FIG. 16 is a high-resolution TEM image of the region marked by the box inFIG. 15 ; -
FIG. 17 is a UV-vis spectra of the aqueous suspension of copper nanostructures ofFIG. 11 ; -
FIG. 18 is a SEM image showing one type of pentagonal bi-pyramid; -
FIG. 19 is a geometric model of the bi-pyramid ofFIG. 18 ; -
FIG. 20 is a SEM image showing a second type of pentagonal bi-pyramid; -
FIG. 21 is a geometric model of the bi-pyramid ofFIG. 20 ; -
FIG. 22 is a SEM image showing a third type of pentagonal bi-pyramid; -
FIG. 23 is a geometric model of the bi-pyramid ofFIG. 22 ; -
FIG. 24 is a SEM image of copper nanocubes that formed after 30 minutes of reaction as produced according to Example 4; -
FIG. 25 is a SEM image of copper nanocubes that formed after 1 hour of reaction as produced according to Example 4; -
FIG. 26 is a SEM image of copper nanocubes that formed after 6 hours of reaction as produced according to Example 4; -
FIG. 27 is a XRD pattern of the copper nanocubes produced according to Example 4; -
FIG. 28 is a TEM image of a copper nanocube produced according to Example 4; -
FIG. 29 is high-resolution TEM image of the region marked by the box inFIG. 28 ; -
FIG. 30 is the UV-vis spectra of three separate aqueous suspensions of 50 nm, 100 nm and 200 nm copper nanocubes; and -
FIG. 31 is a schematic of the reaction pathways used to produce various copper nanostructures according to Examples 1-4. - The field of the disclosure relates to copper nanostructures and, more particularly, to copper nanostructures with relatively small dimensions and methods for producing such structures. The ratios of the various reaction products may be adjusted to produce other structures such as tad-pole shaped nanowires, nanocubes or pentagonal bi-pyramids.
- Provisions of the present disclosure are directed to copper nanostructures (e.g., nanowires) and methods for producing copper nanostructures. Without being held to any particular theory, it has been found that copper nanostructures formed at relatively low pressures (e.g., atmospheric pressure) and/or low temperatures (e.g., 100° C. or less) have a relatively small diameter. Further it has been found that by adjusting the concentration of the components of the reaction mixture and/or adjusting the respective ratios of the components, the shape of the resulting nanostructure may be changed.
- Generally the copper nanostructures of the present disclosure are produced by forming a reaction mixture that contains a copper-containing compound, a capping agent and a reducing agent. The copper-containing compound is reduced by the reducing agent to produce elemental copper that forms the nanostructure. During reduction, the pressure and/or temperature of the reaction vessel may be maintained relatively low (e.g., a pressure of less than about 190 kPa and/or a temperature of less than about 115° C.) such that nanowires with a relatively small diameter may be produced.
- Suitable copper-containing compounds that may be included in the reaction mixture include any compounds from which elemental copper)(Cu0 is formed upon contact with a reducing agent or during electrolysis or an electroless deposition method, or upon decomposition. Exemplary copper-containing compounds include copper (II) nitrate (Cu(NO3)2, anhydrous or hydrated), copper (II) sulfate (CuSO4, anhydrous or hydrated), copper (II) chloride (CuCl2, anhydrous or hydrated), copper (II) hydroxide (Cu(OH)2, anhydrous or hydrated), copper (II) acetate (Cu(CH3COO)2, anhydrous or hydrated), and copper (II) trifluoroacetate (Cu(CF3COO)2, anhydrous or hydrated). Suitable copper-containing compounds may also include various ligands and/or chelates that contain copper without limitation.
- The reducing agent that is combined with the copper-containing compound is any compound (or ligand or chelate) that reduces copper ions into elemental copper to deposit as a nanostructure seed or as part of the growing copper nanostructure. Suitable reducing agents include glucose (a or (3 form) and ascorbic acid.
- In addition to the copper-containing compound and the reducing agent, a capping agent is included in the reaction mixture. The capping agent stabilizes the resulting nanostructure (e.g., by changing the surface energies of different facets) and prevents aggregation between the structures. The capping agent becomes incorporated into the matrix during formation of the copper nanostructure-based composites. Suitable capping agents include alkylamines. Alkylamines have the general structure of Formula (I) shown below
- wherein R1 is an alkyl group (or substituted alkyl group) and R2 and R3 are either hydrogen or an alkyl group (or substituted alkyl group). In some embodiments, the alkyl group of R1 has 25 carbon atoms or less. One particularly preferred alkylamine is hexadecylamine (“HDA”). HDA has been found to be an effective capping agent for copper and has a strong selectivity toward the {100} facets of the nanostructure. In some particular embodiments, HDA is used as a capping agent and glucose is used as a reducing agent. In such embodiments, copper nanostructures may be produced in relatively large quantities with high purity and good uniformity. Other alkylamines of Formula (I) that may be used include octadecylamine and oleylamine.
- Generally, the components that form the reaction mixture are dissolved in water; however in some embodiments an organic solvent may be used or even a two-solvent system may be used. The copper-containing compound, the reducing agent and capping agent may be added to any suitable reaction vessel in any manner suitable to those of skill in the art (e.g., as solids or in solution form and in any order of addition). Suitable vessels may be lab scale (e.g., reaction vials) or may be commercial-scale (e.g., steel vessels which may be polymer-lined). Preferably the reaction vessel is agitated during formation of the copper nanostructures. The nanostructures may be produced batch-wise or in a continuous manner (e.g., a continuous-stirred tank reactor (CSTR)).
- Upon formation of the reaction mixture, the reaction contents are heated. Generally, the reaction mixture is heated to a temperature less than about 115° C. In some embodiments, the reaction mixture is heated to a temperature less than about 110° C. or less than about 105° C. Preferably, the reaction mixture is heated to a temperature of 100° C. or less to prevent the reaction mixture from boiling causing the pressure of the reaction contents to increase as in pressurized vessel systems. It is preferred that the reaction mixture be maintained at about ambient pressure (101 kPa) or less. However in some embodiments, the pressure is maintained to be below about 190 kPa, less than about 150 kPa, less than about 125 kPa or less than about 105 kPa.
- In this regard, it has been found that by utilizing a reduced temperature (e.g., less than about 115° C. and preferably less than about 100° C.) and/or a reduced pressure (e.g., less than about 190 kPa and preferably 101 kPa or less) copper nanostructures and, in particular, copper nanowires are produced with a relatively small diameter (e.g., less than about 40 nm, less than about 30 nm or even less than about 25 nm). Without being bound to any particular theory, it is believed the reduced temperature and/or pressure influences nucleation of the copper nanostructure. It is believed that the seeds that are produced at such reduced temperatures and pressures have a decahedral shape which allows nanowires having a penta-twinned structure to be produced. Such penta-twinned copper structures have a relatively small diameter compared to conventional copper nanostructures.
- Generally the reaction is substantially complete after 6 hours or less. Other reaction times may be used depending on the concentration of components added, the desired structure of the nanomaterial and the desired conversion. Reaction times may be at least about 30 minutes, at least about 1 hour, at least about 3 hours, at least about 5 hours, from about 30 minutes to about 6 hours or from about 30 minutes to about 3 hours.
- The nanostructure that forms as a result of the process of embodiments of the present disclosure depends on the relative reaction rates and, in particular, the amount of reducing agent and/or capping agent present in the reaction mixture. At relatively low reaction rates, decahedral seeds are nucleated and form penta-twinned nanowires with relatively uniform diameter due to anisotropic growth (
FIGS. 2-4 ). At greater reaction rates, isotropic growth is promoted during early stage of growth. As the reaction continues, the reaction rate becomes smaller and the structure narrows to form a pentagonal bi-pyramid (FIG. 11 ). As the reaction proceeds, an even smaller reaction rate results and the pentagonal bi-pyramid further grows into tadpole-shaped nanowires (FIGS. 12-15 ). - In some embodiments, the reaction conditions are controlled such that single crystal seeds are nucleated rather than decahedral seeds. This allows nanocubes (
FIGS. 24-26 ) to form rather than nanowires and/or bi-pyramids. - In this regard, copper nanowires have been found to be produced without formation of bi-pyramids (
FIGS. 2-4 ) at relatively low concentrations of reducing agent and relatively high concentrations of capping agent. If the concentration of reducing agent is increased, pentagonal bi-pyramids form and the bi-pyramids taper off to form nanowires as the reaction proceeds. In contrast, if the concentration of capping agent is lowered, nanocubes form. Without being bound to any particular theory, it is believed that nanocubes may form due to oxidative etching. The oxidative etching causes single crystal seeds to form which results in growth of nanocubes. Such oxidative etching is blocked by the capping and protective effect of the capping agent (e.g., HDA) at higher concentrations of capping agent allowing multiply twinned copper seeds to form. - The relative molar concentrations between copper, reducing agent and capping agent that may result in formation of the various structures are shown in Table 1 below. Generally these ratios were used in Examples 1-4 described below.
-
TABLE 1 Relative amounts of components used to grow various copper nanostructures. NANO-BI- NANOWIRES NANOCUBES PYRAMIDS Concentration (mol/l) Copper 0.012 0.012 0.012 Capping Agent 0.075 0.037 0.075 Reducing Agent 0.028 0.028 0.055 Molar Ratios Capping Agent/ 6.1 3.0 6.1 Copper Reducing Agent/ 2.3 2.3 4.5 Copper Capping Agent/ 2.7 1.3 1.3 Reducing Agent - In this regard, the relative amounts of the components may be adjusted to produce the desired structure as appreciated by those of skill in the art.
- Copper nanowires produced in accordance with the present disclosure are characterized by a relatively small diameter and a high aspect ratio. Generally, the population of copper nanowire structures that are produced according to embodiments of the present disclosure have an average diameter of less than about 40 nm. In some embodiments the population has an average diameter of less than about 30 nm, less than about 25 nm, from about 10 nm to about 40 nm, from about 10 nm to about 30 nm from about 15 nm to about 40 nm, from about 15 nm to about 30 nm, from about 20 nm to about 40 nm or from about 20 nm to about 30 nm. The average length of the copper nanowire structures produced according to embodiments of the present disclosure may be at least about 10 nm, at least about 100 nm or even at least about 1 mm. In some embodiments, the average aspect ratio (i.e., the average ratio of length to diameter of the copper nanowire structures) is at least about 10:1. In other embodiments, the aspect ratio is at least about 50:1, at least about 100:1, at least about 1000:1, at least about 10,000:1 or even at least about 25,000:1.
- The population of nanowires contains copper and amounts of organic material (e.g., the capping agent). In this regard, the amount of copper in the population of nanowires (and in each nanowire) by at least about 60 wt % copper or, as in other embodiments, at least about 70 wt % copper, at least about 80 wt % copper, from about 60 wt % to about 99 wt % copper or from about 70 wt % to about 95 wt % copper.
- In this regard, the properties applied above may be an average of the population of copper nanowires that is produced or of individual nanowires. Populations of copper nanowires may include at least about 100 copper nanowires, at least about 1000 copper nanowires, at least about 10,000 copper nanowires, at least about 1×106 copper nanowires or even at least about 1×109 copper nanowires.
- The copper nanowires of the present disclosure have been found to have a penta-twinned structure (i.e., five single crystallites bound together). It is believed the penta-twinned structure is bound by ten {111} facets at the two ends and five {100} side faces. It should be noted that the copper nanowires are not constructed on a template or membrane. In contrast, metallic copper atoms themselves give the nanowire its structural characteristics.
- As discussed above, other structures may be produced by varying the reaction conditions. In some embodiments, a tadpole shaped nanostructure may be produced in which a bi-pyramid structure tapers from a base of about 200 nm (
FIG. 11 ). If the reaction is allowed to continue, the reaction slows and a nanowire with a radius less than about 40 nm extends from the point of the bi-pyramid (FIGS. 12-15 ). In some embodiments, the reaction conditions are controlled such that copper nanocubes are formed. In the initial stage of reaction (e.g., at about 1 hour), the cube sides are about 50 nm in size (FIG. 25 ). If the reaction is allowed to continue (e.g., for about 6 hours) the edges of the cube grow to about 200 nm in size (FIG. 26 ). - The reaction conditions were varied in Examples 1-4 to produce various structures as shown in
FIG. 31 . It should be noted that other reaction conditions (e.g., component concentrations) may be used to produce the desired nanostructures and the recited conditions are exemplary and should not be considered in a limiting sense. - To produce copper nanowires, CuCl2.2H2O (0.021 g), HDA (0.18 g) and glucose (0.05 g) were dissolved in water (10 ml) in a vial (22.2 ml, borosilicate glass vial, with a black phenolic molded screw cap and polyvinyl-faced pulp liner, VWR International (Radnor, Pa.)) at room temperature. After the vial had been capped, the solution was magnetically stirred at room temperature overnight. The capped vial was then transferred into an oil bath and heated at 100° C. for 6 hours under magnetic stirring. As the reaction proceeded, the solution changed its color from blue to brown and finally red-brown. All the chemicals were obtained from Sigma-Aldrich (St. Louis, Mo.) and used as received.
- To prepare samples for electron microscopy characterizations, the as-prepared aqueous suspensions were directly dropped onto silicon substrates (for SEM) or carbon-coated copper grids (for TEM and high-resolution TEM) and then dried under the ambient conditions of a chemical laboratory. The silicon substrates or copper grids were then rinsed with hot water (about 60° C.) to remove the excess HDA and glucose, followed by another round of drying. The products could have alternatively been collected as powders by use of centrifugation processes.
- Scanning electron microscope (SEM) images were captured of the copper nanowires dried on silicon substrates. All SEM images were captured with a field-emission microscope (Nova NanoSEM 230, FEI (Hilsboro, Oreg.)) operated at 15 kV. All transmission electron microscope (TEM) images were conducted with a microscope (Tecnai G2 Spirit, FEI (Hilsboro, Oreg.)) operated at 120 kV. High-resolution TEM imaging was performed using a microscope (2100F, JEOL (Tokyo, Japan)) operated at 200 kV. Powder x-ray diffraction (XRD) patterns were recorded using a diffractometer (DMAX/A, Rigaku (The Woodlands, Tex.)) operated at 35 kV and 35 mA. The concentrations of Cu (II)/Cu (I) left behind in the reaction solutions were determined using an inductively-coupled plasma mass spectrometer (ICP-MS, PerkinElmer (Waltham, Mass.)).
-
FIG. 1 shows the X-ray diffraction (XRD) pattern of a copper nanowire. The three peaks at 20=43.5, 50.7, and 74.4° correspond to diffractions from {111}, {200}, and {220} planes, respectively, of face-centered cubic copper (JCPDS #03-1018). No other phases such as Cu2O and CuO were detected. The concentrations of Cu2+/Cu+ ions left behind in the reaction solution was measured using inductively-coupled plasma mass spectrometry (ICP-MS). It was determined that the precursor had been converted into atomic copper at a percentage of 93%. - The scanning electron microscopy (SEM) image shown in
FIG. 2 demonstrates that copper nanowires could be prepared in high purity, typically approaching 95%, without any post-synthesis separation. Only a very small amount of copper nanocubes was found to co-exist with the nanowires. In addition, the nanowires were found to be highly flexible and some of them showed bending more than 360 degrees without being broken. Both the SEM image at a higher magnification (FIG. 3 ) and TEM image (FIG. 4 ) reveal that the nanowires were uniform in diameter and tended to be aligned in parallel to form bundles during sample preparation. The nanowires had an average diameter of 24±4 nm as calculated from 100 nanowires randomly selected from a number of TEM images (FIG. 5 ). The lengths of the copper nanowires varied in the range of several tens to hundreds of micrometers; some of them were as long as several millimeters. The band-like contrast (see the box inFIG. 4 ) observed on the TEM images can be attributed to strains caused by bending or twisting. -
FIGS. 6-9 show transmission electron microscopy (TEM) images and the corresponding high-resolution TEM images taken from the middle (FIGS. 6 and 7 ) and end portions (FIGS. 8 and 9 ) of two different Cu nanowires, respectively. The insets inFIG. 7 andFIG. 9 schematically illustrate the orientations of the copper nanowires relative to the incident electron beam (indicated by arrows). The high-resolution TEM images (FIGS. 7 and 9 ) show the existence of {111} twin planes parallel to the long axis of the copper nanowire. When the direction of the e-beam was perpendicular to the bottom side of the pentagonal nanowire (FIG. 7 ), two sets of fringes with lattice spacing of 2.1 nm and 1.3 nm were observed, corresponding to the {111} and {220} planes of copper, respectively.FIG. 9 shows the high-resolution TEM image taken from a copper nanowire oriented with one of its side faces parallel to the e-beam. The fringes with lattice spacing of 2.1, 1.8, and 1.3 Å could be indexed to the {111}, {200}, and {220} planes of copper, respectively. Based on the analysis of both SEM and high-resolution TEM images, it is evident that the copper nanowires had a penta-twinned structure bound by ten {111} facets at the two ends and five {100} side faces, which are consistent with the results previously reported for other metals (e.g., Ag, Au, and Pd). - UV-vis spectra were taken with a diode array spectrophotometer (
Cary 50, Varian (Palo Alto, Calif.)).FIG. 10 shows UV-vis transmission spectra recorded from aqueous suspensions of the 24-nm copper nanowires of Example 1 and penta-twinned silver nanowires of 80-nm in diameter (prepared according to the literature) at roughly the same metal concentration (30 μg/ml), suggesting a slightly higher transmittance in the visible region for the copper nanowires. This higher transmittance could be attributed to the smaller diameter of the copper nanowires. - The preparation procedure of Example 1 was used to produce copper nanocrystals but the concentration of glucose (i.e., the reducing agent) was increased from 5 to 10 mg/ml. As can be seen from
FIGS. 11-16 , tadpole-like copper nanostructures resulted from the increased amount of reducing agent. In an effort to uncover the growth mechanism, the products obtained at different reaction times were analyzed as detailed inFIGS. 11-16 . In the initial stage (t=30 min), the solution changed its color from blue to red-brown due to the formation of tapered copper nanocrystals whose diameter gradually changed from 200 to 25 nm over a length of 0.5 to 1 μm (FIG. 11 ). The tapered cooper nanocrystals exhibited a UV-vis absorption peak around 591 nm (FIG. 17 ) and are characterized by a pentagonal bi-pyramid structure (see inset ofFIG. 11 andFIGS. 18-23 ) formed by stretching apart the five-fold apices of a decahedron. - After the reaction had proceeded to 1 hour (
FIG. 12 ), thin copper nanowires of about 24 nm in diameter started to appear from the thinner end of a tapered nanocrystal. As the reaction was continued for three hours (FIGS. 13 and 14 ), the copper nanowires further grew along the long axes with almost no change to their diameters. These results indicate that the tadpole-like copper nanowires originated from the tapered nanocrystals. The SEM image in the inset ofFIG. 14 indicates that the tadpole-like copper nanowires also had a pentagonal cross-section. The TEM and high-resolution TEM images shown inFIGS. 15 and 16 further confirm a tadpole-like morphology and a penta-twinned structure for the copper nanowires. - The preparation procedure of Example 1 was used to produce copper nanocrystals but the concentration of HDA (i.e., the capping agent) was decreased from 18 mg/ml to 9 mg/ml. Copper nanocubes (
FIGS. 24-26 ) formed rather than copper nanowires.FIGS. 24-26 are SEM images of the products obtained after 0.5 h, 1 h, and 6 h of reaction, respectively.FIG. 27 gives an XRD pattern of the nanocubes obtained at 6 h. For bulk copper, the strongest XRD diffraction is the (111) peak, followed by the (200), (220), and (311) peaks. In contrast, the copper nanocubes tend to give (200) diffraction as the strongest peak because of their preferential orientation with {100} planes parallel to the substrate. The high-resolution TEM image of an individual Cu nanocube viewed along the <100> zone axis (FIGS. 28-29 ) clearly shows well-resolved, continuous fringes with lattice spacing of 1.8 Å, corresponding to the {100} planes, indicating that the nanocube was a single crystal bound by {100} facets. -
FIG. 30 shows UV-vis absorption spectra taken from the copper nanocubes dispersed in water. The copper nanocubes exhibited a major SPR peak in the visible region, whose position was red-shifted from 565 to 625 nm as the edge length of the nanocubes was increased from 50 to 200 nm. Compared to silver nanocubes with a similar size, the SPR peak of the copper nanocubes was positioned at a much longer wavelength. - When introducing elements of the present disclosure or the preferred embodiments(s) thereof, the articles “a”, “an”, “the” and “said” are intended to mean that there are one or more of the elements. The terms “comprising”, “including” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements.
- As various changes could be made in the above apparatus and methods without departing from the scope of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying figures shall be interpreted as illustrative and not in a limiting sense.
Claims (20)
1. A method of producing a copper nanostructure, the method comprising:
forming a reaction mixture in a reaction vessel, the reaction mixture comprising a copper-containing compound, a capping agent and a reducing agent; and
reducing the copper-containing compound with the reducing agent to cause copper to form a copper nanostructure, wherein (1) the pressure in the reaction vessel is less than about 190 kPa and/or (2) the temperature of the reaction mixture is less than about 115° C.
2. The method as set forth in claim 1 wherein the pressure in the reaction vessel is about atmospheric pressure.
3. The method as set forth in claim 1 wherein the capping agent is an alkylamine.
4. The method as set forth in claim 3 wherein the alkylamine has less than about 25 carbon atoms.
5. The method as set forth in claim 1 wherein the reaction mixture comprises water as a solvent.
6. The method as set forth in claim 1 wherein the temperature of the reaction mixture during formation of the nanostructure is less than about 115° C.
7. The method as set forth in claim 1 wherein the copper-containing compound is selected from the group consisting of copper (II) sulfate, copper (II) chloride, copper (II) hydroxide and copper (II) nitrate, copper (II) acetate and copper (II) trifluoroacetate.
8. The method as set forth in claim 1 wherein the reducing agent is selected from the group consisting of glucose and ascorbic acid.
9. The method as set forth in claim 1 wherein the capping agent is selected from the group consisting of hexadecylamine, octadecylamine and oleylamine.
10. The method as set forth in claim 1 wherein the capping agent is hexadecylamine.
11. The method as set forth in claim 1 wherein the concentration of at least one of the reducing agent and the capping agent in the reaction mixture is controlled to produce a copper nanostructure in the shape of (1) a nanowire, (2) a pentagonal bi-pyramid, (3) a nanowire having a tad-pole shaped portion or (4) a nanocube.
12. A population of copper nanowire structures, each structure having a length and a diameter, the average diameter of the copper nanowire structures being less than about 40 nm and the average ratio of length to diameter of the copper nanowire structures being at least about 10:1.
13. The population as set forth in claim 12 wherein the average ratio of length to diameter of the copper nanowire structures is at least about 50:1.
14. The population as set forth in claim 12 wherein the average diameter of the copper nanowire structures is less than about 30 nm.
15. The population as set forth in claim 12 wherein the copper nanowire structures comprise at least about 60 wt % copper.
16. The population as set forth in claim 12 wherein the population comprises at least about 100 copper nanowires.
17. A copper nanowire structure, the structure comprising at least about 60 wt % copper and being characterized by a penta-twinned shape.
18. The copper nanowire structure as set forth in claim 17 wherein the nanowire structure comprises at least about 60 wt % copper.
19. The copper nanowire structure as set forth in claim 17 wherein the ratio of the length to the diameter of the copper nanowire structure is at least about 10:1.
20. The copper nanowire structure as set forth in claim 17 wherein the diameter of the structure is less than about 40 nm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/601,496 US20130230717A1 (en) | 2011-09-02 | 2012-08-31 | Copper nanostructures and methods for their preparation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161530734P | 2011-09-02 | 2011-09-02 | |
US13/601,496 US20130230717A1 (en) | 2011-09-02 | 2012-08-31 | Copper nanostructures and methods for their preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130230717A1 true US20130230717A1 (en) | 2013-09-05 |
Family
ID=49043000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/601,496 Abandoned US20130230717A1 (en) | 2011-09-02 | 2012-08-31 | Copper nanostructures and methods for their preparation |
Country Status (1)
Country | Link |
---|---|
US (1) | US20130230717A1 (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130087363A1 (en) * | 2011-10-11 | 2013-04-11 | Korea Institute Of Science And Technology | Metal nanowires with high linearity, method for producing the metal nanowires and transparent conductive film including the metal nanowires |
CN103801709A (en) * | 2014-03-17 | 2014-05-21 | 中国科学院新疆理化技术研究所 | Synthetic method of copper nano-particles of different shapes |
WO2015120960A1 (en) * | 2014-02-11 | 2015-08-20 | Merck Patent Gmbh | Green chemistry method of making copper nanowires |
WO2015132719A1 (en) * | 2014-03-03 | 2015-09-11 | P.V. Nano Cell Ltd. | Nanometric copper formulations |
WO2016049430A1 (en) * | 2014-09-26 | 2016-03-31 | The Regents Of The University Of California | Methods to produce ultra-thin metal nanowires for transparent conductors |
WO2017024163A1 (en) | 2015-08-04 | 2017-02-09 | Abaxis, Inc. | Signal amplification in solution-based plasmonic specific-binding partner assays |
CN106971771A (en) * | 2017-05-10 | 2017-07-21 | 江汉大学 | A kind of preparation method of carbon-clad metal nano wire conductive film |
CN107052358A (en) * | 2016-12-14 | 2017-08-18 | 中国科学技术大学 | A kind of preparation method of copper nano-wire |
US9921218B2 (en) | 2011-11-21 | 2018-03-20 | Abaxis, Inc. | Signal amplification in lateral flow and related immunoassays |
WO2018106690A1 (en) * | 2016-12-08 | 2018-06-14 | Board Of Regents, The University Of Texas System | Metal nanofoam synthesis via microwave process |
CN110441360A (en) * | 2019-08-20 | 2019-11-12 | 浙江工业大学 | A kind of preparation method of one-dimensional copper nano-wire glucose sensor electrode material |
CN110465653A (en) * | 2019-09-19 | 2019-11-19 | 安徽工业大学 | A kind of silver wire and preparation method thereof |
US10488409B2 (en) | 2014-08-13 | 2019-11-26 | Abaxis, Inc. | Signal amplification in plasmonic specific-binding partner assays |
CN110586953A (en) * | 2018-06-12 | 2019-12-20 | 本田技研工业株式会社 | High yield preparation of two-dimensional copper nanosheets |
US10566104B2 (en) * | 2014-07-09 | 2020-02-18 | Daegu Gyeongbuk Institute Of Science And Technology | Metal nanowire having core-shell structure coated with graphene, and manufacturing method therefor |
CN113000855A (en) * | 2021-03-23 | 2021-06-22 | 中国科学技术大学先进技术研究院 | Preparation method of micro-nano copper powder |
CN113373519A (en) * | 2021-06-22 | 2021-09-10 | 中国地质科学院地球物理地球化学勘查研究所 | Nano copper crystal growth experiment simulation device and method |
US20210388180A1 (en) * | 2020-06-15 | 2021-12-16 | The Texas A&M University System | Copper nanowires and their use in plastics to improve thermal and electrical conductivity |
US11977072B2 (en) | 2017-01-30 | 2024-05-07 | Zoetis Services Llc | Solution-based plasmonic specific-binding partner assays using metallic nanostructures |
-
2012
- 2012-08-31 US US13/601,496 patent/US20130230717A1/en not_active Abandoned
Cited By (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130087363A1 (en) * | 2011-10-11 | 2013-04-11 | Korea Institute Of Science And Technology | Metal nanowires with high linearity, method for producing the metal nanowires and transparent conductive film including the metal nanowires |
US9972742B2 (en) | 2011-10-11 | 2018-05-15 | Korea Institute Of Science And Technology | Method for forming a transparent conductive film with metal nanowires having high linearity |
US8999205B2 (en) * | 2011-10-11 | 2015-04-07 | Korea Institute Of Science And Technology | Metal nanowires with high linearity, method for producing the metal nanowires and transparent conductive film including the metal nanowires |
US9921218B2 (en) | 2011-11-21 | 2018-03-20 | Abaxis, Inc. | Signal amplification in lateral flow and related immunoassays |
US11255854B2 (en) | 2011-11-21 | 2022-02-22 | Zoetis Services Llc | Signal amplification in lateral flow and related immunoassays |
US10281465B2 (en) | 2011-11-21 | 2019-05-07 | Abaxis, Inc. | Signal amplification in lateral flow and related immunoassays |
WO2015120960A1 (en) * | 2014-02-11 | 2015-08-20 | Merck Patent Gmbh | Green chemistry method of making copper nanowires |
EP3113897A4 (en) * | 2014-03-03 | 2017-11-08 | P.V. Nano Cell Ltd. | Nanometric copper formulations |
CN106102970A (en) * | 2014-03-03 | 2016-11-09 | P.V.纳米细胞公司 | Nanometer copper preparation |
US11590567B2 (en) | 2014-03-03 | 2023-02-28 | P.V. Nano Cell Ltd. | Nanometric copper formulations |
WO2015132719A1 (en) * | 2014-03-03 | 2015-09-11 | P.V. Nano Cell Ltd. | Nanometric copper formulations |
CN103801709A (en) * | 2014-03-17 | 2014-05-21 | 中国科学院新疆理化技术研究所 | Synthetic method of copper nano-particles of different shapes |
US10566104B2 (en) * | 2014-07-09 | 2020-02-18 | Daegu Gyeongbuk Institute Of Science And Technology | Metal nanowire having core-shell structure coated with graphene, and manufacturing method therefor |
US11209430B2 (en) | 2014-08-13 | 2021-12-28 | Zoetis Services Llc | Signal amplification in plasmonic specific-binding partner assays |
EP3943943A1 (en) | 2014-08-13 | 2022-01-26 | Zoetis Services LLC | Signal amplification in plasmonic specific-binding partner assays |
US10488409B2 (en) | 2014-08-13 | 2019-11-26 | Abaxis, Inc. | Signal amplification in plasmonic specific-binding partner assays |
WO2016049430A1 (en) * | 2014-09-26 | 2016-03-31 | The Regents Of The University Of California | Methods to produce ultra-thin metal nanowires for transparent conductors |
CN107073576A (en) * | 2014-09-26 | 2017-08-18 | 加利福尼亚大学董事会 | The method for producing the super thin metal nano wire for transparent conductor |
US10406602B2 (en) * | 2014-09-26 | 2019-09-10 | The Regents Of The University Of California | Methods to produce ultra-thin metal nanowires for transparent conductors |
TWI583799B (en) * | 2014-09-26 | 2017-05-21 | 美國加利福尼亞大學董事會 | Methods to produce ultra-thin metal nanowires for transparent conductors |
WO2017024163A1 (en) | 2015-08-04 | 2017-02-09 | Abaxis, Inc. | Signal amplification in solution-based plasmonic specific-binding partner assays |
EP4465021A2 (en) | 2015-08-04 | 2024-11-20 | Zoetis Services LLC | Signal amplification in solution-based plasmonic specific-binding partner assays |
US11614447B2 (en) | 2015-08-04 | 2023-03-28 | Zoetis Services Llc | Signal amplification in solution-based plasmonic specific-binding partner assays |
US10429383B2 (en) | 2015-08-04 | 2019-10-01 | Abaxis, Inc. | Signal amplification in solution-based plasmonic specific-binding partner assays |
US9835622B2 (en) | 2015-08-04 | 2017-12-05 | Abaxis, Inc. | Signal amplification in solution-based plasmonic specific-binding partner assays |
US11215614B2 (en) | 2015-08-04 | 2022-01-04 | Zoetis Services Llc | Signal amplification in solution-based plasmonic specific-binding partner assays |
WO2018106690A1 (en) * | 2016-12-08 | 2018-06-14 | Board Of Regents, The University Of Texas System | Metal nanofoam synthesis via microwave process |
CN107052358A (en) * | 2016-12-14 | 2017-08-18 | 中国科学技术大学 | A kind of preparation method of copper nano-wire |
US11977072B2 (en) | 2017-01-30 | 2024-05-07 | Zoetis Services Llc | Solution-based plasmonic specific-binding partner assays using metallic nanostructures |
CN106971771A (en) * | 2017-05-10 | 2017-07-21 | 江汉大学 | A kind of preparation method of carbon-clad metal nano wire conductive film |
US11131031B2 (en) | 2018-06-12 | 2021-09-28 | Honda Motor Co., Ltd. | High-yield preparation of two-dimensional copper nanosheets |
CN110586953A (en) * | 2018-06-12 | 2019-12-20 | 本田技研工业株式会社 | High yield preparation of two-dimensional copper nanosheets |
CN110441360A (en) * | 2019-08-20 | 2019-11-12 | 浙江工业大学 | A kind of preparation method of one-dimensional copper nano-wire glucose sensor electrode material |
CN110465653A (en) * | 2019-09-19 | 2019-11-19 | 安徽工业大学 | A kind of silver wire and preparation method thereof |
US20210388180A1 (en) * | 2020-06-15 | 2021-12-16 | The Texas A&M University System | Copper nanowires and their use in plastics to improve thermal and electrical conductivity |
CN113000855A (en) * | 2021-03-23 | 2021-06-22 | 中国科学技术大学先进技术研究院 | Preparation method of micro-nano copper powder |
CN113373519A (en) * | 2021-06-22 | 2021-09-10 | 中国地质科学院地球物理地球化学勘查研究所 | Nano copper crystal growth experiment simulation device and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20130230717A1 (en) | Copper nanostructures and methods for their preparation | |
Tang et al. | Growth of silver nanocrystals on graphene by simultaneous reduction of graphene oxide and silver ions with a rapid and efficient one-step approach | |
EP3484818B1 (en) | Multi-atomic layered materials | |
Sun et al. | Roughness-controlled copper nanowires and Cu nanowires–Ag heterostructures: synthesis and their enhanced catalysis | |
Gao et al. | Palladium nanowires stabilized by thiol-functionalized ionic liquid: seed-mediated synthesisand heterogeneous catalyst for Sonogashira coupling reaction | |
US8632884B2 (en) | Nanocomposites | |
US10226822B2 (en) | Method for preparing metal nanoparticles using a multi-functional polymer and a reducing agent | |
Yang et al. | Room-temperature synthesis of nanocrystalline Ag 2 S and its nanocomposites with gold | |
Leng et al. | Polyhedral Cu 2 O particles: shape evolution and catalytic activity on cross-coupling reaction of iodobenzene and phenol | |
EP2873457A1 (en) | Catalyst for preparing chiral selective and conductive selective single-walled carbon nanotube, preparation method and application thereof | |
Chen et al. | Metallic copper nanostructures synthesized by a facile hydrothermal method | |
Chang et al. | Synthesis of Cu/ZnO core/shell nanocomposites and their use as efficient photocatalysts | |
US10464136B2 (en) | Preparation method of copper nano-structures | |
Kan et al. | Gold microplates with well‐defined shapes | |
Das et al. | Water soluble sodium sulfate nanorods as a versatile template for the designing of copper sulfide nanotubes | |
Hu et al. | Template-mediated growth of Cu3SnS4 nanoshell tubes | |
US9463440B2 (en) | Oxide-based nanostructures and methods for their fabrication and use | |
KR102050042B1 (en) | two dimensional anisotropic Ag nanoplates and preparation method thereof | |
Zhan et al. | Solvothermal synthesis and mechanical characterization of single crystalline copper nanorings | |
Li et al. | High-yield synthesis of selenium nanowires in water at room temperature | |
Tang et al. | Cost-effective aqueous-phase synthesis of long copper nanowires | |
Chopade et al. | Controlled synthesis of monodispersed ZnSe microspheres for enhanced photo-catalytic application and its corroboration using density functional theory | |
Shi et al. | Ordered arrays of shape tunable CuInS 2 nanostructures, from nanotubes to nano test tubes and nanowires | |
Lee et al. | A simple route for the synthesis of copper nanowires | |
Gaur et al. | PbS micro-nanostructures with controlled morphologies by a novel thermal decomposition approach |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WASHINGTON UNIVERSITY, MISSOURI Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XIA, YOUNAN;MINGSHANG, JIN;REEL/FRAME:029279/0086 Effective date: 20110817 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: NATIONAL SCIENCE FOUNDATION, VIRGINIA Free format text: CONFIRMATORY LICENSE;ASSIGNOR:WASHINGTON UNIVERSITY;REEL/FRAME:039918/0297 Effective date: 20160830 |