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US20130167482A1 - Vacuum sealing process of a mems package - Google Patents

Vacuum sealing process of a mems package Download PDF

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Publication number
US20130167482A1
US20130167482A1 US13/607,618 US201213607618A US2013167482A1 US 20130167482 A1 US20130167482 A1 US 20130167482A1 US 201213607618 A US201213607618 A US 201213607618A US 2013167482 A1 US2013167482 A1 US 2013167482A1
Authority
US
United States
Prior art keywords
substrate
lid
solder
package
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/607,618
Inventor
Yee-Chung Fu
Peter Wing-Kau Tang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADVANCED NUMICRO SYSTEMS
Advanced Nano Systems Inc
Original Assignee
Advanced Nano Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Nano Systems Inc filed Critical Advanced Nano Systems Inc
Priority to US13/607,618 priority Critical patent/US20130167482A1/en
Assigned to ADVANCED NUMICRO SYSTEMS reassignment ADVANCED NUMICRO SYSTEMS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FU, YEE-CHUNG, TANG, PETER WING-KAU
Publication of US20130167482A1 publication Critical patent/US20130167482A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
    • B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Definitions

  • This invention relates a method to vacuum seal a package for a micro-electro-mechanical system (MEMS).
  • MEMS micro-electro-mechanical system
  • MEMS micro-electro-mechanical systems
  • FIG. 1 shows an exemplary micro-electro-mechanical system (MEMS) package
  • FIG. 2 shows a flowchart of an exemplary method to vacuum seal the MEMS package of FIG. 1 ;
  • FIG. 3 shows a rimless lid bottom of the package of FIG. 1 ;
  • FIG. 4 shows a lipless substrate top of the package of FIG. 1 , all arranged in accordance with embodiments of the invention.
  • FIG. 1 shows a micro-electro-mechanical system (MEMS) package 100 in one or more embodiments of the present disclosure.
  • Package 100 includes a package lid 200 with a transparent (e.g., glass) window 210 , and a package substrate 300 with a MEMS device 400 .
  • Lid 200 may have a rimmed bottom 260 with a lower surface 261 and a side surface 262 .
  • lid 200 has a bottom 702 without a rim as shown in FIG. 3 .
  • substrate 300 has a lipped top 310 with a top surface 311 and a side surface 312 .
  • substrate 300 has a top 704 without a lip as shown in FIG. 4 .
  • substrate 300 may be made of a ceramic material.
  • the interior of substrate 300 may be plated with a metal such as gold to form bond pads for MEMS device 400 .
  • the bond pads may be connected by vias to external pads or pins of substrate 300 .
  • Surfaces 311 and 312 of lipped top 310 may also be plated with a metal such as gold.
  • MEMS device 400 includes a stationary part 410 and a moving part 420 .
  • the top maybe plated with a metal rectangular ring 706 ( FIG. 4 ) that matches rimmed bottom 260 or rimless bottom 702 ( FIG. 3 ).
  • MEMS device 400 may further include a glass substrate (not shown) supporting stationary part 410 and moving part 420 .
  • MEMS device 400 may be connected by bonding wires 510 and 520 to substrate 300 .
  • MEMS device 400 may be a scanning mirror.
  • FIG. 2 is a flowchart of a method 600 to vacuum seal package 100 in one or more embodiments of the present disclosure.
  • Method 600 may comprise one or more operations, functions or actions as illustrated by one or more blocks. Although the blocks are illustrated in a sequential order to demonstrate method 600 , these blocks may also be performed in parallel, and/or in a different order than those described herein. Also, the various blocks may be combined into fewer blocks, divided into additional blocks, and/or eliminated based upon the desired implementation.
  • lid 200 is prepared.
  • Lid 200 may be first visually inspected, cleaned, and dried.
  • Lid 200 may be cleaned using ultrasound in an ultrasonic cleaning machine available from ACE Ultimate Co., Ltd. of Thailand.
  • Block 610 may include blocks 612 , 614 , 616 , and 618 .
  • a flux is applied on lower surface 261 of rimmed bottom 260 or rimless bottom 702 of lid 200 .
  • the flux may be Senju Sparkle Flux ES-1061 from Senju Metal Industry Co., Ltd. of Tokyo, Japan. Block 612 may be followed by block 614 .
  • a solder is applied on lower surface 261 of rimmed bottom 260 or rimless bottom 702 of lid 200 .
  • the solder may be Senju RMA-98 SUPER P3M705 0.4MM (250G) from Senju Metal Industry Co., Ltd. of Tokyo, Japan.
  • the solder may include flux material so block 612 may be skipped.
  • Block 614 may be followed by block 616 .
  • a flux is applied on side surface 262 of rimmed bottom 260 or rimless bottom 702 of lid 200 .
  • the flux may be the same as the one used in block 612 .
  • Block 616 may be followed by block 618 .
  • a solder is applied on side surface 262 of rimmed bottom 260 or rimless bottom 702 of lid 200 .
  • the solder may be the same as the one used in block 614 .
  • the solder may include flux material so block 616 may be skipped.
  • Lid 200 may then be cleaned twice with ultrasound and air dried between the cleaning Block 618 may be followed by block 620 .
  • substrate 300 is prepared.
  • Substrate 300 may be first visually inspected, cleaned with ultrasound, and dried.
  • Block 620 may include blocks 622 , 624 , and 626 .
  • MEMS device 400 is attached to substrate 300 .
  • MEMS device 400 may be attached by an adhesive.
  • Block 622 may be followed by block 624 .
  • bonding wires 510 and 520 are applied to electrically connect MEMS device 400 and substrate 300 .
  • Block 624 may be followed by block 626 .
  • a solder is applied on surfaces 311 and 312 on lipped top 310 or on metal rectangular ring 706 on lipless top 704 of substrate 300 .
  • the solder may be the same as the one used in block 614 .
  • a flux may be first applied to surfaces 311 and 312 or metal rectangular ring 706 before the solder.
  • the solder may include flux material. Note that step 626 may precede steps 622 and 624 . Block 626 may be followed by block 630 .
  • Block 630 package 100 is vacuum sealed. Lid 200 and substrate 300 may be first visually inspected, cleaned, and dried. Lid 200 and substrate 300 may be cleaned with alcohol. Block 630 may include blocks 632 , 634 , and 636 .
  • lid 200 and substrate 300 are aligned so rimmed bottom 260 of lid 200 fits around lipped top 310 of substrate 300 with similar spacing on all fours sides.
  • rimless bottom 702 fits around lipped top 310 or aligns with metal rectangular ring 706 on lipless top 704
  • rimmed bottom 260 aligns with metal rectangular ring 706 on lipless top 704 .
  • Block 632 may be followed by block 634 .
  • Block 634 pressure is applied from the top of lid 200 against substrate 300 .
  • a weight is placed on the top of lid 200 to press it down against substrate 300 when the solder melts.
  • Block 634 may be followed by block 636 .
  • lid 200 and substrate 300 are sealed in an elevated temperature and vacuum environment so package 100 is vacuum sealed when the solder melts and later solidifies.
  • a hot plate in a vacuum chamber may be used, the vacuum chamber's pressure may be set to 1 Ton, the hot plate may be preheated to 265 degrees ° C. for about 25 minutes, package 100 may be placed in the vacuum chamber and the hot plate may then run for 25 minutes, and package 100 may be allowed to cool for one hour.
  • Package 100 may be vibrated to facilitate the solder bonding between lid 200 and substrate 300 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)

Abstract

A vacuum sealing process of a micro-electrical-mechanical-system (MEMS) package is provided. Solder is applied to the rimmed bottom of a lid for the package. A micro-electro-mechanical system (MEMS) device is attached to a substrate for the package. Solder is applied to a lipped top of the substrate. The lid and the substrate are sealed in an elevated temperature and vacuum environment.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims the benefit of U.S. Provisional Application No. 61/532,303, filed Sep. 8, 2011, which is incorporated herein by reference.
    • FIELD OF INVENTION
  • This invention relates a method to vacuum seal a package for a micro-electro-mechanical system (MEMS).
    • DESCRIPTION OF RELATED ART
  • A micro-electro-mechanical systems (MEMS) is a device of small mechanical devices driven by electricity. The MEMS is often enclosed in a package that protects it from the environment.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • In the drawings:
  • FIG. 1 shows an exemplary micro-electro-mechanical system (MEMS) package;
  • FIG. 2 shows a flowchart of an exemplary method to vacuum seal the MEMS package of FIG. 1;
  • FIG. 3 shows a rimless lid bottom of the package of FIG. 1; and
  • FIG. 4 shows a lipless substrate top of the package of FIG. 1, all arranged in accordance with embodiments of the invention.
    •
  • Use of the same reference numbers in different figures indicates similar or identical elements.
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 shows a micro-electro-mechanical system (MEMS) package 100 in one or more embodiments of the present disclosure. Package 100 includes a package lid 200 with a transparent (e.g., glass) window 210, and a package substrate 300 with a MEMS device 400. Lid 200 may have a rimmed bottom 260 with a lower surface 261 and a side surface 262. Alternatively lid 200 has a bottom 702 without a rim as shown in FIG. 3. Referring back to FIG. 1, substrate 300 has a lipped top 310 with a top surface 311 and a side surface 312. Alternatively substrate 300 has a top 704 without a lip as shown in FIG. 4.
  • Referring back to FIG. 1, substrate 300 may be made of a ceramic material. The interior of substrate 300 may be plated with a metal such as gold to form bond pads for MEMS device 400. The bond pads may be connected by vias to external pads or pins of substrate 300. Surfaces 311 and 312 of lipped top 310 may also be plated with a metal such as gold. MEMS device 400 includes a stationary part 410 and a moving part 420. When substrate 300 has a lipless top 704 (FIG. 4), the top maybe plated with a metal rectangular ring 706 (FIG. 4) that matches rimmed bottom 260 or rimless bottom 702 (FIG. 3). MEMS device 400 may further include a glass substrate (not shown) supporting stationary part 410 and moving part 420. MEMS device 400 may be connected by bonding wires 510 and 520 to substrate 300. MEMS device 400 may be a scanning mirror.
  • FIG. 2 is a flowchart of a method 600 to vacuum seal package 100 in one or more embodiments of the present disclosure. Method 600 may comprise one or more operations, functions or actions as illustrated by one or more blocks. Although the blocks are illustrated in a sequential order to demonstrate method 600, these blocks may also be performed in parallel, and/or in a different order than those described herein. Also, the various blocks may be combined into fewer blocks, divided into additional blocks, and/or eliminated based upon the desired implementation.
  • In block 610, lid 200 is prepared. Lid 200 may be first visually inspected, cleaned, and dried. Lid 200 may be cleaned using ultrasound in an ultrasonic cleaning machine available from ACE Ultimate Co., Ltd. of Thailand. Block 610 may include blocks 612, 614, 616, and 618.
  • In block 612, a flux is applied on lower surface 261 of rimmed bottom 260 or rimless bottom 702 of lid 200. The flux may be Senju Sparkle Flux ES-1061 from Senju Metal Industry Co., Ltd. of Tokyo, Japan. Block 612 may be followed by block 614.
  • In block 614, a solder is applied on lower surface 261 of rimmed bottom 260 or rimless bottom 702 of lid 200. The solder may be Senju RMA-98 SUPER P3M705 0.4MM (250G) from Senju Metal Industry Co., Ltd. of Tokyo, Japan. Alternatively the solder may include flux material so block 612 may be skipped. Block 614 may be followed by block 616.
  • In block 616, a flux is applied on side surface 262 of rimmed bottom 260 or rimless bottom 702 of lid 200. The flux may be the same as the one used in block 612. Block 616 may be followed by block 618.
  • In block 618, a solder is applied on side surface 262 of rimmed bottom 260 or rimless bottom 702 of lid 200. The solder may be the same as the one used in block 614. Alternatively the solder may include flux material so block 616 may be skipped. Lid 200 may then be cleaned twice with ultrasound and air dried between the cleaning Block 618 may be followed by block 620.
  • In block 620, substrate 300 is prepared. Substrate 300 may be first visually inspected, cleaned with ultrasound, and dried. Block 620 may include blocks 622, 624, and 626.
  • In block 622, MEMS device 400 is attached to substrate 300. MEMS device 400 may be attached by an adhesive. Block 622 may be followed by block 624.
  • In block 624, bonding wires 510 and 520 are applied to electrically connect MEMS device 400 and substrate 300. Block 624 may be followed by block 626.
  • In block 626, a solder is applied on surfaces 311 and 312 on lipped top 310 or on metal rectangular ring 706 on lipless top 704 of substrate 300. The solder may be the same as the one used in block 614. A flux may be first applied to surfaces 311 and 312 or metal rectangular ring 706 before the solder. Alternatively the solder may include flux material. Note that step 626 may precede steps 622 and 624. Block 626 may be followed by block 630.
  • In block 630, package 100 is vacuum sealed. Lid 200 and substrate 300 may be first visually inspected, cleaned, and dried. Lid 200 and substrate 300 may be cleaned with alcohol. Block 630 may include blocks 632, 634, and 636.
  • In block 632, lid 200 and substrate 300 are aligned so rimmed bottom 260 of lid 200 fits around lipped top 310 of substrate 300 with similar spacing on all fours sides. Alternatively rimless bottom 702 fits around lipped top 310 or aligns with metal rectangular ring 706 on lipless top 704, or rimmed bottom 260 aligns with metal rectangular ring 706 on lipless top 704. Block 632 may be followed by block 634.
  • In block 634, pressure is applied from the top of lid 200 against substrate 300. For example, a weight is placed on the top of lid 200 to press it down against substrate 300 when the solder melts. Block 634 may be followed by block 636.
  • In block 636, lid 200 and substrate 300 are sealed in an elevated temperature and vacuum environment so package 100 is vacuum sealed when the solder melts and later solidifies. For example, a hot plate in a vacuum chamber may be used, the vacuum chamber's pressure may be set to 1 Ton, the hot plate may be preheated to 265 degrees ° C. for about 25 minutes, package 100 may be placed in the vacuum chamber and the hot plate may then run for 25 minutes, and package 100 may be allowed to cool for one hour. Package 100 may be vibrated to facilitate the solder bonding between lid 200 and substrate 300.
  • Various other adaptations and combinations of features of the embodiments disclosed are within the scope of the invention. Numerous embodiments are encompassed by the following claims.

Claims (15)

1: A method to vacuum seal a micro-electro-mechanical system (MEMS) package, comprising:
applying a solder to a bottom of a lid for the package;
attaching a MEMS device to a substrate for the package;
applying the solder to a top of the substrate;
aligning the lid and the substrate by fitting the bottom of the lid around the top of the substrate;
applying pressure to the lid against the substrate; and
sealing the lid and the substrate at elevated temperature and under vacuum.
2: The method of claim 1, wherein the bottom of the lid comprises a rimmed bottom.
3: The method of claim 2, wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimmed bottom.
4: The method of claim 1, wherein the top of the substrate comprises a metal rectangular ring.
5: The method of claim 4, wherein applying the solder to a top of the substrate comprises applying the solder onto the metal rectangular ring.
6: The method of claim 1, wherein the bottom of the lid comprises a rimless bottom.
7: The method of claim 6, wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimless bottom.
8: The method of claim 1, wherein the top of the substrate comprises a lipped top.
9: The method of claim 8, wherein applying the solder to a top of the substrate comprises applying the solder to top and side surfaces of the lipped top.
10: The method of claim 1, further comprising:
applying a flux to the bottom of the lid.
11: The method of claim 10, further comprising:
applying the flux to the top of the substrate.
12: The method of claim 1, wherein the solder includes a flux.
13: The method of claim 1, wherein sealing the lid and the substrate at elevated temperature and under vacuum comprises heating the package at 265° C. under 1 Torr.
14: The method of claim 13, wherein sealing the lid and the substrate at elevated temperature and under vacuum further comprises vibrating the package.
15: The method of claim 1, further comprising wire bonding the MEMS device and the substrate.
US13/607,618 2011-09-08 2012-09-07 Vacuum sealing process of a mems package Abandoned US20130167482A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10407194B2 (en) 2016-06-21 2019-09-10 United States Of America As Represented By The Secretary Of The Navy Low temperature self-sealing vacuum packaging
US20220144626A1 (en) * 2020-11-11 2022-05-12 Beijing Voyager Technology Co., Ltd. Detachable mems package top cover

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US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
US4338486A (en) * 1978-06-03 1982-07-06 Schott Glaswerke Housing for electrical and electronic components
US4400870A (en) * 1980-10-06 1983-08-30 Texas Instruments Incorporated Method of hermetically encapsulating a semiconductor device by laser irradiation
US4486622A (en) * 1979-05-14 1984-12-04 Siemens Aktiengesellschaft Case for a semiconductor component
US4558346A (en) * 1982-03-29 1985-12-10 Fujitsu Limited Highly reliable hermetically sealed package for a semiconductor device
JPS635867A (en) * 1986-06-25 1988-01-11 Matsushita Electric Works Ltd Automatic soldering device
JPS63157758A (en) * 1986-12-19 1988-06-30 Matsushita Electric Ind Co Ltd Static type soldering device
US4769272A (en) * 1987-03-17 1988-09-06 National Semiconductor Corporation Ceramic lid hermetic seal package structure
US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
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US7667324B2 (en) * 2006-10-31 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Systems, devices, components and methods for hermetically sealing electronic modules and packages
US8058106B2 (en) * 2009-09-04 2011-11-15 Magic Technologies, Inc. MEMS device package with vacuum cavity by two-step solder reflow method
US8191756B2 (en) * 2004-11-04 2012-06-05 Microchips, Inc. Hermetically sealing using a cold welded tongue and groove structure
US8199527B2 (en) * 2007-05-21 2012-06-12 Taiyo Yuden Co., Ltd. Electronic component and manufacturing method therefor
US8431820B2 (en) * 2008-05-02 2013-04-30 Neomax Materials Co., Ltd. Hermetic sealing cap
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US3024299A (en) * 1957-04-16 1962-03-06 Philips Corp Cold press bonded semi-conductor housing joint
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
US4338486A (en) * 1978-06-03 1982-07-06 Schott Glaswerke Housing for electrical and electronic components
US4486622A (en) * 1979-05-14 1984-12-04 Siemens Aktiengesellschaft Case for a semiconductor component
US4400870A (en) * 1980-10-06 1983-08-30 Texas Instruments Incorporated Method of hermetically encapsulating a semiconductor device by laser irradiation
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US4769272A (en) * 1987-03-17 1988-09-06 National Semiconductor Corporation Ceramic lid hermetic seal package structure
US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
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US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
US6627814B1 (en) * 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
US6821032B2 (en) * 2002-05-28 2004-11-23 Intel Corporation Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs
US7142435B2 (en) * 2002-07-19 2006-11-28 Senju Metal Industry Co., Ltd. Lid for use in packaging an electronic device and method of manufacturing the lid
US8191756B2 (en) * 2004-11-04 2012-06-05 Microchips, Inc. Hermetically sealing using a cold welded tongue and groove structure
US7358106B2 (en) * 2005-03-03 2008-04-15 Stellar Micro Devices Hermetic MEMS package and method of manufacture
US7667324B2 (en) * 2006-10-31 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Systems, devices, components and methods for hermetically sealing electronic modules and packages
US8199527B2 (en) * 2007-05-21 2012-06-12 Taiyo Yuden Co., Ltd. Electronic component and manufacturing method therefor
US8431820B2 (en) * 2008-05-02 2013-04-30 Neomax Materials Co., Ltd. Hermetic sealing cap
US8558123B2 (en) * 2008-08-21 2013-10-15 Murata Manufacturing Co., Ltd. Electronic component device with a Ni-Bi alloy sealing frame
US8058106B2 (en) * 2009-09-04 2011-11-15 Magic Technologies, Inc. MEMS device package with vacuum cavity by two-step solder reflow method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10407194B2 (en) 2016-06-21 2019-09-10 United States Of America As Represented By The Secretary Of The Navy Low temperature self-sealing vacuum packaging
US20220144626A1 (en) * 2020-11-11 2022-05-12 Beijing Voyager Technology Co., Ltd. Detachable mems package top cover
US11673795B2 (en) * 2020-11-11 2023-06-13 Beijing Voyager Technology Co., Ltd. Detachable MEMS package top cover

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