US20130153201A1 - Thermal diffusion chamber with cooling tubes - Google Patents
Thermal diffusion chamber with cooling tubes Download PDFInfo
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- US20130153201A1 US20130153201A1 US13/769,433 US201313769433A US2013153201A1 US 20130153201 A1 US20130153201 A1 US 20130153201A1 US 201313769433 A US201313769433 A US 201313769433A US 2013153201 A1 US2013153201 A1 US 2013153201A1
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- fluid
- process chamber
- sealed process
- heat exchange
- chamber
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28C—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
- F28C3/00—Other direct-contact heat-exchange apparatus
- F28C3/005—Other direct-contact heat-exchange apparatus one heat-exchange medium being a solid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
Definitions
- the claimed invention relates to the field of thermal diffusion chamber equipment and methods of making thermal diffusion chambers for the production of solar energy panels, and more particularly to structures and methods of a obtaining a more even thermal profile of substrates confined within the thermal diffusion chamber.
- a form of solar energy production relies on solar panels, which in turn rely on the diffusion of select materials onto a substrate.
- glass is used as the substrate, which is exposed to a gaseous selenide species to form a copper, indium and selenide containing film on the substrate.
- the gaseous selenide species is known to be toxic to humans, which underscores prudent handling methods, including thermal regulation systems.
- thermal regulation systems capable of precluding migration and leakage of the gaseous selenide species from within a process chamber to atmosphere, in an efficient and reliable manner, can greatly improve the operation and production output of thermal chambers used in providing substrates of copper, indium and selenide containing film diffused within them.
- a frame supporting a containment chamber which in turn confines a sealed process chamber.
- at least one fluid inlet box in fluidic communication with an exterior of the sealed process chamber is presented, in which the fluid inlet box includes at least a flow adjustment structure to control a fluid flow from a fluid source around the exterior of the sealed process chamber; and an open loop heat exchange system in fluidic communication with an interior of the sealed process chamber is present, within at least a portion of the open loop heat exchange system resides internal to the sealed process chamber.
- FIG. 1 displays an orthogonal projection, with partial cut-away, of an exemplary embodiment of a thermal chamber of the claimed invention.
- FIG. 2 provides an orthogonal projection of an exemplary substrate support frame configured for use with the exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 3 shows a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 4 illustrates a cross-sectional, front elevation view of the exemplary embodiment of the thermal chamber of FIG. 1 showing an exhaust manifold and conduit.
- FIG. 5 provides an enlarged detailed cross-sectional, elevation view of a fluid inlet box with an attached inlet conduit of the exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 6 depicts a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber of FIG. 1 , showing an exemplary closed loop internal heat exchanger.
- FIG. 7 shows a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber of FIG. 1 , showing an exemplary open loop internal heat exchanger.
- FIG. 8 depicts a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber of FIG. 1 , showing an exemplary internal thermal sensor.
- FIG. 9 generally illustrates a plan view of an exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of the thermal chamber of FIG. 1 .
- FIG. 10 displays an orthogonal projection, of an exemplary door with attached primary thermal deflection assembly, of the thermal chamber of FIG. 1 .
- FIG. 11 provides an orthogonal projection of the primary thermal dispersion assembly of FIG. 10 .
- FIG. 12 shows an orthogonal projection of a secondary thermal dispersion assembly of the thermal chamber of FIG. 1 .
- FIG. 13 illustrates a schematic of a cool down heat exchange system for use in cooling down the interior and exterior of the thermal chamber of FIG. 1 .
- FIG. 14 illustrates a plan view of an alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of the thermal chamber of FIG. 1 .
- FIG. 15 provides an end view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of FIG. 14 .
- FIG. 16 displays a side elevation view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of FIG. 14 .
- FIG. 17 a shows an end view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of FIG. 14 positioned within the thermal chamber of FIG. 1 .
- FIG. 17 b shows a plan view of a bottom port support attached to the thermal chamber FIG. 17 a.
- FIG. 18 depicts a side elevation view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of FIG. 14 positioned within the thermal chamber of FIG. 1 .
- FIG. 19 generally illustrates a flow chart of a method of forming an exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 20 reveals a flow chart of a method of forming an exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 21 shows a flow chart of a method of forming an alternate exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 22 displays a flow chart of a method of forming an alternative exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 23 reveals a flow chart of a method of forming an alternative alternate exemplary embodiment of the thermal chamber of FIG. 1 .
- FIG. 24 displays an orthogonal projection an exemplary embodiment of an open loop heat exchange system of the claimed invention.
- FIG. 25 illustrates an orthogonal projection of a cooling tubes assembly of the exemplary embodiment of the open loop heat exchange system of FIG. 23 .
- FIG. 26 shows a right side view in elevation of the cooling tubes assembly of FIG. 23 .
- FIG. 27 depicts a right side view in elevation of a preferred embodiment of a cooling tubes assembly.
- FIG. 28 illustrates a right side, cross section view of an embodiment of the cooling tubes assembly positioned within the process chamber of the thermal chamber.
- FIG. 1 displays an exemplary thermal diffusion chamber 100 which includes at least a containment chamber 102 supported by a frame 104 .
- the containment chamber 102 in turn supports a process chamber 106 .
- the exemplary thermal diffusion chamber 100 further includes a heat source module 108 disposed between the process chamber 106 and the containment chamber 102 , a thermal regulation cavity 110 formed between the process chamber 106 and the heat source module 108 , and a collar 109 secured to a lip of the process chamber 106 and anchored to the containment chamber 102 .
- FIG. 1 further shows that at least one fluid inlet box 112 is provided, which is in fluidic communication with the thermal regulation cavity 110 .
- FIG. 2 shows an exemplary substrate support frame 113 configured for use with the exemplary embodiment of the thermal diffusion chamber 100 (of FIG. 1 ).
- the substrate support frame 113 is formed from quarts and accommodates a plurality of substrates 115 (one shown). In operation, the substrate support frame 113 is filled to capacity with substrates 115 and positioned within the process chamber 106 . Within the process chamber 106 , the substrate support frame 113 , serves as a fixture for the substrates 115 during the diffusion process.
- the substrates 115 are rectangular in shape having a width of substantially 650 millimeters and a length of substantially 1650 millimeters, and are formed from glass, preferably soda-lime-silica glass.
- FIG. 3 shows an exemplary embodiment of the thermal diffusion chamber 100 includes the fluid inlet box 112 in fluid communication with the thermal regulation cavity 110 . Further shown by FIG. 3 is a plurality of supports 114 preferably positioned between the heat source module 108 and the process chamber 106 .
- the heat source module is formed from a plurality of heaters 116 (also referred to herein as a heat source), which in an exemplary embodiment consists of substantially a total of twenty two ( 22 ) heaters.
- each heater provides a heater shell 118 , heater insulation 120 adjacent the heater shell 118 , and a plurality of heating elements 122 .
- the heating elements 122 are powered by electricity, and are preferably a coiled element.
- the term “heat source” is not limited to the disclosed plurality of heaters 116 .
- the heat source 116 may be natural gas, super heated steam, geo-thermal energy, or any other source of energy to produce a desired temperature within the process chamber 106 .
- the fluid inlet box 112 further includes an inlet conduit 124 secured to an inlet manifold 126 .
- the inlet manifold 126 delivers air to the air inlet boxes 112 for distribution over the process chamber 106 , as depicted in FIG. 3 .
- FIG. 3 further shows the exemplary thermal diffusion chamber 100 includes a purge conduit 128 in fluidic communication with the thermal regulation cavity 110 and secured to an outlet manifold 130 , the outlet manifold 130 selectively providing an internal pressure less than atmospheric pressure to draw air through the fluid inlet box 112 , around the process chamber 106 , and out the purge conduit 128 .
- FIG. 3 Also shown by FIG. 3 , is a plurality of external thermal sensors 132 in contacting adjacency with the process chamber 106 , extending through corresponding heaters 116 , and presenting electrical lead lines 133 for connection from the outside of the containment chamber 102 .
- fluid flow is suspended, i.e., the fluid flow undergoes fluid flow modulation, to provide a more accurate reading of the external temperature of the process chamber 106 .
- Information collected from the plurality of external thermal sensors 132 is used to cross check information collected by an internal thermal sensor assembly 158 of FIG. 8 .
- the information collected by the internal thermal sensors is used to determine which air inlet boxes 112 should undergo a restriction of fluid flow, and which should be adjusted for maximum fluid flow.
- the internal thermal sensor assembly 158 provides information for regulating an amount of power supplied to the heating elements 122 during a heat up cycle of the process chamber 106 . That is, during a heat up cycle of the process chamber 106 , power is being supplied to each of the plurality of heater 116 . By modulating the power supplied to each of the plurality of heaters 116 , a more uniform heat up of the process chamber 106 may be attained.
- FIG. 4 depicts the fluid inlet box 112 includes a plate valve 134 , which mitigates the flow of fluid from the thermal regulation cavity 110 through the fluid inlet box 112 and external to the containment chamber 102 .
- FIG. 4 further shows the fluid inlet box 112 includes a flow adjustment structure 136 , which preferably includes a positioning shaft 135 controlled by a motor 137 . In response to a rotation of the motor 137 , the positioning shaft 135 interacts with the plate valve 134 to control fluid flow from the exterior of the containment chamber 102 past the plate valve 134 and into the thermal regulation cavity 110 .
- FIG. 5 provides a more detailed view of the fluid inlet box 112 .
- the fluid inlet box 112 further provides an intake port 138 supporting the inlet conduit 124 , which is in contacting adjacency with the plate valve 134 .
- the fluid inlet box 112 further provides an exhaust port 140 that supports an outlet conduit 142 that is in fluidic communication with the thermal regulation cavity 110 .
- a pair of pinch rollers 139 of the motor 137 act upon the positioning shaft 135 to change a position of the positioning shaft 135 relative to the plate valve 134 .
- the fluid inlet box 112 provides an extension conduit 150 having a proximal end and a distal end, the proximal end in contacting adjacency with and secured to the outlet conduit 142 , the extension conduit 150 is provided to conduct fluid originating from the containment chamber 102 to the thermal regulation cavity 110 of FIG. 4 .
- the distal end of the extension conduit 150 is preferably fashioned with a diffusion member 152 affixed thereon, wherein the diffusion member 152 is configured to preclude fluid originating external the containment chamber 102 from being applied to the process chamber 106 of FIG. 4 in a stream normal to the exterior of the process chamber 106 .
- FIG. 5 further shows the fluid inlet box 112 further provides a pivot pin 154 disposed between the plate valve 134 and a pivot support 156 .
- the pivot support 156 is secured adjacent the inlet conduit 124 .
- the pivot pin 154 in combination with the flow adjustment structure 136 , promotes a controlled, predetermined, and adjustable displacement of the plate valve 134 from contacting adjacency with the inlet conduit 124 when fluid is drawn into the thermal regulation cavity 110 .
- the pivot pin 154 further promotes the closing of the plate valve 134 adjacent the inlet conduit 124 when the flow of fluid originating external the containment chamber 102 is stopped. In other words, a closed plate valve 134 deters passage of fluid from the thermal regulation chamber 110 to external the containment chamber 102 when fluid is not being drawn into the thermal regulation cavity 110 .
- FIG. 6 shows that an exemplary embodiment of the thermal diffusion chamber 100 includes the fluid inlet box 112 in fluid communication with the thermal regulation cavity 110 .
- a chamber door 160 is shown by FIG. 6 .
- the chamber door 160 includes a face plate 162 secured to a main body portion 164 , and a primary thermal dispersion assembly 166 secured to the face plate 162 .
- the primary thermal dispersion assembly 166 is aligned in close proximity to an inner surface of a sealed process chamber 168 .
- the sealed process chamber 168 is preferably formed when the chamber door 160 is secured in sealing contact with the process chamber 106 .
- a secondary thermal dispersion assembly 170 is aligned with the primary thermal dispersion assembly 166 and preferably communicates with a wall of the inner surface of the sealed process chamber 168 .
- the secondary thermal dispersion assembly 170 confines and supports a closed loop heat exchanger 174 adjacent the wall of the sealed process chamber 168 .
- the closed loop heat exchanger 174 provides a means for circulation of a fluid through the interior of the sealed process chamber 168 , to facilitate a cool down of the interior of the sealed process chamber 168 during a process cycle of the thermal diffusion chamber 100 .
- FIG. 7 shows that an alternate exemplary embodiment of the thermal diffusion chamber 100 includes the fluid inlet box 112 in fluid communication with the thermal regulation cavity 110 . Further shown by FIG. 7 is the chamber door 160 , which preferably includes the face plate 162 secured to the main body portion 164 , and the primary thermal dispersion assembly 166 secured to the face plate 162 . With the exception of the bottom portion, the primary thermal dispersion assembly 166 is aligned in close proximity to the inner surface of the sealed process chamber 168 .
- the secondary thermal dispersion assembly 170 is aligned with the primary thermal dispersion assembly 166 and rests on the bottom of the inner surface of the sealed process chamber 168 .
- the secondary thermal dispersion assembly 170 confines and supports an open loop heat exchanger 178 adjacent the bottom of the sealed process chamber 168 .
- the open loop heat exchanger 178 provides a plurality of supply ports 180 through which fluid may be introduced into the sealed process chamber 168 during a process cycle of the thermal diffusion chamber 100 to facilitate a cool down of the sealed process chamber 168 .
- FIG. 8 shows that an alternative exemplary embodiment of the thermal diffusion chamber 100 includes the fluid inlet box 112 in fluid communication with the thermal regulation cavity 110 . Further shown by FIG. 8 is the chamber door 160 , which preferably includes the face plate 162 secured to the main body portion 164 , and the primary thermal dispersion assembly 166 secured to the face plate 162 . With the exception of the bottom portion, the primary thermal dispersion assembly 166 is aligned in close proximity to the inner surface of the sealed process chamber 168 .
- the secondary thermal dispersion assembly 170 is aligned with the primary thermal dispersion assembly 166 and rests on the bottom of the inner surface of the sealed process chamber 168 .
- the secondary thermal dispersion assembly 170 confines and supports the thermal sensor assembly 158 adjacent the bottom of the sealed process chamber 168 .
- the thermal sensor assembly 158 provides a plurality of thermocouples 184 disposed along a length of the sealed process chamber 168 . The plurality of thermocouples 184 , are responsive to a change in temperature of the interior of the sealed process chamber 168 .
- the thermal sensor assembly 158 further includes a sensor conduit 186 extending from an opening of the sealed process chamber 168 through at least a mid portion of the sealed process chamber 168 .
- the sensor conduit 186 shields the plurality of thermocouples 184 from exposure to an internal environment of the sealed process chamber 168 .
- FIG. 8 further shows that the thermal sensor assembly 158 preferably further includes a plurality of signal lines 188 connected to and corresponding with each of the plurality of thermocouples 184 .
- Each signal line 188 conveys a signal to the exterior of the sealed process chamber 168 in response to the change in temperature of the interior of the sealed process chamber 168 .
- a combined heat exchange assembly 190 includes each: the closed loop heat exchanger 174 of FIG. 6 ; the open loop heat exchanger 178 of FIG. 7 ; and the thermal sensor assembly 158 of FIG. 8 .
- the closed loop heat exchanger 174 , the open loop heat exchanger 178 , and the thermal sensor assembly 158 are each supported by a plurality of heat exchanger supports 192 , and attached to and confined by the secondary thermal dispersion assembly 170 .
- FIG. 10 provides a more detailed depiction of the chamber door 160 .
- the chamber door 160 includes a face plate 162 secured to the main body portion 164 , and a lamp support 194 secured to the face plate 162 .
- the chamber door 160 further includes the primary thermal dispersion assembly 166 , while the lamp support 194 provides a plurality of alignment notches 195 (shown by FIG. 11 ) upon which the thermal dispersion assembly 166 is aligned and rests during operational modes of the thermal diffusion chamber 100 of FIG. 8 .
- FIG. 11 further shows the primary thermal dispersion assembly 166 includes at least a diffusion plate 196 adjacent a plurality of radiation reflection plates 197 .
- the diffusion plate 195 and a plurality of radiation reflection plates 197 are preferably held in alignment by the lamp support 194 .
- the main body portion 164 , the face plate 162 , and the thermal dispersion assembly 166 are preferably formed from quartz.
- FIG. 12 shows the secondary thermal dispersion assembly 170 provides a plurality of access ports 198 , which are used to align, support, and confine each closed loop heat exchanger 174 , the open loop heat exchanger 178 , and the thermal sensor assembly 158 of FIG. 8 .
- the secondary thermal dispersion assembly 170 includes at least a diffusion plate 196 a adjacent a plurality of radiation reflection plates 197 a, which in a preferred embodiment are formed from quartz.
- FIG. 13 illustrates a schematic of a heat exchange system 200 for use in cooling down an interior and an exterior of the sealed thermal chamber 168 during a process cycle of the thermal diffusion chamber 100 .
- the heat exchange system 200 includes a control system 202 (also referred to herein as controller 202 ) communicating with each a first fluid handling system 216 , a second fluid handling system 218 , and third fluid handling system 220 .
- the control system 202 includes at least a control signal buss 222 communicating with at least the first, second, and third fluid handling systems ( 216 , 218 , 220 ), and a controller 202 .
- the controller 202 includes at least an input/output module 204 communicating with the control signal buss 222 , a processor 206 communicating with the input/output module 204 , a memory 208 storing control logic 210 and communicating with the processor 206 , an input device 212 communicating with the processor 206 and a display 214 communicating with the processor 206 .
- the input/output module 204 upon receipt by the input/output module 204 of a measured temperature value of a first fluid flowing around the exterior of the sealed process chamber 168 , the input/output module 204 provides said measured temperature value of the first fluid flowing around the exterior of the sealed process chamber 168 to the processor 206 .
- the processor 206 accesses the stored control logic 210 and determines a control signal based on the measured temperature value of the first fluid flowing around the exterior of the sealed process chamber 168 .
- the processor 206 transmits the control signal to the input/output module 204 , the input/output module 204 advances the control signal by way of the control signal buss 222 to the first fluid handling system 216 .
- the processor 206 further determines an in use flow capacity percentage of fluid flowing through the first fluid handling system 216 based on data received from a flow usage monitoring device 224 communicating with a fluid transfer device 226 of the first fluid handling system 216 .
- the processor 206 still further preferably provides the in use flow capacity percentage of the first fluid transfer device 226 and the measured temperature value of the first fluid flowing around the exterior of the sealed process chamber 168 to the display 214 .
- FIG. 13 shows that the heat exchange system 200 preferably utilizes a plurality of control valves 228 , responsive to control signals generated by the processor 206 and provided to each of the plurality of control valves 228 by the control signal buss 222 to control the flow of fluids through each the first, second, and third fluid handling systems ( 216 , 218 , 220 ).
- FIG. 13 shows that the heat exchange system 200 preferably utilizes a plurality of control valves 228 , responsive to control signals generated by the processor 206 and provided to each of the plurality of control valves 228 by the control signal buss 222 to control the flow of fluids through each the first, second, and third fluid handling systems ( 216 , 218 , 220 ).
- the heat exchange system 200 preferably utilizes a plurality of check valves 230 to control backflow of the flow of fluids through each the first, second, and third fluid handling systems ( 216 , 218 , 220 ), and a plurality of thermal sensors 232 to provide temperature measurement values to the processor 206 upon which the processor 206 bases the determination of a plurality of control signals to be transmitted to each corresponding control valve of the plurality of control valves 228 .
- FIG. 13 still further provides a flow direction symbol 234 , which reveals the direction of flow of fluids through each corresponding the first, second, and third fluid handling systems ( 216 , 218 , 220 ), and that each of the plurality of thermal sensors 232 along with each of the plurality of control valves 228 communicate with the control signal buss 222 .
- the first fluid handling system 216 includes at least the first fluid transfer device 226 in fluid communication with at least one fluid inlet box 112 .
- the at least one fluid inlet box 112 is preferably in fluidic communication with an exterior of the sealed process chamber 168 , and the at least one fluid inlet box 112 includes at least: the flow adjustment structure 137 (of FIG.
- the first fluid handling system 216 preferably includes a first thermal sensor of the plurality of fluid sensors 232 communicating with each the returned first fluid and the control system 202 , the first thermal sensor measures a temperature value of the returned first fluid and provides that value to the control system 202 .
- the processor 206 of the control system 202 compares the measured temperature value to a predetermined temperature value and sends a control signal to a first control valve of the plurality of control valves 228 disposed between the fluid return conduit 130 and the first fluid transfer device 226 .
- the first control valve modulates flow of the returned first fluid from the exterior of the sealed process chamber 168 to the first fluid transfer device 226 .
- the first fluid handling system 216 preferably further includes an in line fluid heater 236 , such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA.
- the in line fluid heater 236 is plumbed into the first fluid handling system 216 between the fluid transfer device 226 and the plurality of fluid inlet boxes 112 .
- the in line fluid heater 236 may be selectively included in the fluid path of the first fluid through activation of a second control valve in response to a control signal provided by the control signal buss 222 from the processor 206 based on a temperature measurement value provided by a second thermal sensor measuring the first fluid exiting the fluid transfer device 226 .
- the in line fluid heater 236 is preferably used when the out flow temperature of the first fluid departing the fluid transfer device 226 is less than a desired inlet temperature of the fluid inlet box 112 .
- the first fluid handling system 216 preferably further includes a heat exchanger 238 , external to and plumbed into the first fluid handling system 216 between the thermal diffusion chamber 100 and the fluid transfer device 226 .
- the heat exchanger 238 may be selectively included in the fluid path of the first fluid through activation of a third control valve in response to a control signal provided by the control signal buss 222 from the processor 206 based on a temperature measurement value provided by a third thermal sensor measuring the first fluid exiting the thermal diffusion chamber 100 .
- the heat exchanger 238 is utilized to safeguard the fluid transfer device 226 from experiencing a thermal condition that exceeds its operating parameters.
- the first fluid handling system 216 preferably further includes an energy usage monitoring device 240 communicating with each the heat elements 130 of the plurality of heat sources 116 and the control system 202 .
- the energy monitoring device 240 is preferably used to safeguard against thermal runaway of each of the plurality of heat sources 116 . That is, when any of the plurality of heat sources 116 exceeds a preferred, predetermined usage percentage, the processor 206 issued a command to an energy source control unit instructing the energy source control unit to stop the supply of energy to the out of operating range heat source 116 .
- the processor further preferably provides the in use thermal capacity status of each of the plurality of heat sources 116 to the display 214 for presentation by the display 214 .
- the third fluid handling system 220 preferably includes at least a closed system fluid transfer device 242 in fluid communication with at least one fluid distribution conduit 244 .
- the at least one fluid distribution conduit 244 is preferably in fluidic communication with an interior of the sealed process chamber 168 .
- a feed conduit 246 is disposed between the second fluid transfer device 242 and the at least one fluid distribution conduit 244 .
- the feed conduit 246 preferably communicates the second fluid from the second fluid transfer device 242 to the at least one fluid distribution conduit 244 .
- a check valve disposed between the feed conduit 246 and the at least one fluid distribution conduit 244 , the check valve mitigating a back flow from the interior of the sealed process chamber 168 to the second fluid transfer device 242 .
- an interior fluid control valve is preferably plumbed between the second fluid transfer device 242 and the at least one fluid distribution conduit 244 , to control a flow of the second fluid into the interior of the sealed process chamber 168 .
- the preferred embodiment also provides a fluid collection conduit 248 in fluid communication with the interior of the sealed process chamber 168 and the second fluid transfer device 242 . The fluid collection conduit 248 returns the second fluid flowing into the interior of the sealed process chamber 168 to the second fluid transfer device 242 .
- a fourth thermal sensor communicating with the returned second fluid and the control system 202 is provided by the second fluid handling system 218 .
- the fourth thermal sensor preferably measures a temperature value of the returned second fluid and provides said measured temperature value to the control system 202 .
- the control system 202 Upon receipt of the measured temperature value by the control system 202 , the control system 202 compares the measured temperature value to a predetermined temperature value and sends an interior fluid control valve signal to the interior fluid control valve to modulate flow of the returned second fluid from the second fluid transfer device 242 in response to the interior fluid control valve signal.
- the second fluid handling system 218 preferably further includes an in line fluid heater 236 , such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA.
- the in line heater 236 is plumbed into the second fluid handling system 218 between the fluid transfer device 242 and the feed conduit 246 .
- the in line fluid heater 236 may be selectively included in the fluid path of the second fluid through activation of a fourth control valve in response to a control signal provided by the control signal buss 222 from the processor 206 .
- the control signal is preferably based on a temperature measurement value provided by a fifth thermal sensor measuring the second fluid exiting the fluid transfer device 242 .
- the in line fluid heater 236 is preferably used when the out flow temperature of the second fluid departing the fluid transfer device 242 is less than a desired inlet temperature of the at least one fluid distribution conduit 244 .
- the second fluid handling system 218 preferably further includes a heat exchanger 250 , external to and plumbed into the second fluid handling system 218 between the fluid collection conduit 248 and the second fluid transfer device 242 .
- the heat exchanger 250 may be selectively included in the fluid path of the second fluid through activation of a fifth control valve in response to a control signal provided by the control signal buss 222 from the processor 206 based on a temperature measurement value provided by a sixth thermal sensor measuring the second fluid entering the fluid collection conduit 248 .
- the heat exchanger 250 is utilized to safeguard the fluid transfer device 242 from experiencing a thermal condition that exceeds its operating parameters. Further, to provide data regarding an in use percentage of the fluid transfer device 242 , a flow usage monitoring device 252 is preferably used to safeguard against exceeding the operating capabilities of the fluid transfer device 242 .
- the third fluid handling system 220 is preferably a closed loop fluid handling system 220 . That is, the third fluid is isolated from all environments external to the closed loop fluid handling system 220 .
- the closed loop fluid handling system 220 preferably includes at least a closed loop fluid transfer device 254 in fluid communication with at least one fluid distribution conduit 256 .
- the at least one fluid distribution conduit 256 is preferably adjacent an interior of the sealed process chamber 168 .
- a feed conduit 258 is disposed between the closed loop fluid transfer device 254 and the at least one fluid distribution conduit 256 .
- the feed conduit 258 preferably communicates the isolated third fluid from the closed loop fluid transfer device 254 to the at least one fluid distribution conduit 244 .
- a check valve disposed between the feed conduit 258 and the at least one fluid distribution conduit 256 , the check valve mitigating a back flow from the at least one fluid distribution conduit 256 to the closed loop fluid transfer device 254 .
- a sixth fluid control valve is preferably plumbed between the closed loop fluid transfer device 254 and the at least one fluid distribution conduit 256 , to control a flow of the isolated third fluid into the at least one fluid distribution conduit 256 .
- the preferred embodiment also provides a fluid collection conduit 260 in fluid communication with a return conduit 262 and the closed loop fluid transfer device 254 . The fluid collection conduit 260 returns the isolated third fluid flowing into the at least one fluid distribution conduit 256 .
- a seventh thermal sensor that communicates with the returned isolated third fluid and the control system 202 is provided by the second fluid handling system 220 .
- the seventh thermal sensor preferably measures a temperature value of the returned isolated third fluid and provides said measured temperature value to the control system 202 .
- the control system 202 Upon receipt of the measured temperature value by the control system 202 , the control system 202 compares the measured temperature value to a predetermined temperature value and sends a fluid control valve signal to the fluid control valve, preferably plumbed in between the fluid collection conduit 260 and the return conduit 262 .
- the fluid control valve preferably functions to modulate flow of the returned isolated third fluid from the return conduit 262 to the closed loop fluid transfer device 254 in response to the fluid control valve signal.
- the closed loop fluid handling system 220 preferably further includes an in-line fluid heater 264 , such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA.
- the in-line fluid heater 264 is plumbed into the closed loop fluid handling system 220 between the feed conduit 258 and the at least one fluid distribution conduit 256 .
- the in line fluid heater 236 may be selectively engaged or disengaged during an operation mode of the closed loop fluid handling system 220 in response to a control signal.
- the control signal is preferably based on a temperature measurement value provided by an eighth thermal sensor measuring the isolated third fluid exiting an external gas to gas heat exchanger 266 .
- the external gas to gas heat exchanger 266 is preferably plumbed into the closed loop fluid handling system 220 between the feed conduit 258 and the closed loop fluid transfer device 254 .
- the in line fluid heater 264 is preferably used when the out flow temperature of the isolated third fluid is departing the external gas to gas heat exchanger 266 is less than a desired inlet temperature if the at least one fluid distribution conduit 256 .
- the external gas to gas heat exchanger 266 extracts heat from the isolated third fluid provided by the return conduit 262 , and transfers the extracted heat to the isolated third fluid provided by the closed loop fluid transfer device 254 .
- the closed loop fluid handling system 220 preferably further includes a heat exchanger 268 , internal to and plumbed within the closed loop fluid transfer device 254 .
- the heat exchanger 268 may be selectively included in the fluid path of the isolated third fluid through activation of a sixth control valve in response to a control signal provided by the control signal buss 222 from the processor 206 based on a temperature measurement value provided by a ninth thermal sensor measuring the isolated third fluid exiting the external gas to gas heat exchanger 266 .
- the heat exchanger 268 is utilized to safeguard a fluid advancement device 270 housed within the closed loop fluid transfer device 254 , from experiencing a thermal condition that exceeds the operating parameters of the fluid advancement device 270 .
- a flow usage monitoring device 272 is preferably used to safeguard against exceeding the operating capabilities of the fluid advancement device 270 , while being operated by a drive system 274 , connected to the fluid advancement device 270 .
- the isolated third fluid is held at a pressure below atmospheric pressure, while the fluid is at ambient temperature, to allow for thermal expansion of the isolated third fluid when the isolated third fluid is absorbing thermal energy from the interior of the sealed process chamber 168 .
- each the first fluid, the second fluid, and the isolated third fluid may be any of a number of fluids including, but not limited to air, water, nitrogen, helium, propylene glycol, ethylene glycol, or any other heat transfer sympathetic fluid.
- FIG. 13 shows that the preferred embodiment heat exchange system 200 includes the exemplary combined heat exchange assembly 190 , which preferably includes each: the closed loop heat exchanger 174 of FIG. 6 ; the open loop heat exchanger 178 of FIG. 7 ; and the thermal sensor assembly 158 of FIG. 8 .
- FIG. 13 A person skilled in the art will understand that alternate embodiments are inherently presented by FIG. 13 .
- a number of these include, but are not limited to, a fluid handling system such as 216 in fluidic communication with the exterior of the sealed process chamber 168 , combined with a closed loop heat exchange system in fluidic communication with the interior of the sealed process chamber 168 .
- the control system 202 communicates with each the fluid handling system 216 and the closed loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealed process chamber 168 , fluid flowing through the closed loop heat exchange system in response to the measured internal temperature of the sealed process chamber 168 .
- the closed loop heat exchange system preferably includes at least a fluid transfer device, such as the closed loop fluid transfer device 254 in fluid communication with at least one closed loop heat exchanger, such as the closed loop heat exchanger 174 of FIG. 6 .
- the exterior surface of the exemplary closed loop heat exchanger 174 is adjacent an interior surface of the sealed process chamber 168 .
- a second alternate embodiment includes at least a fluid handling system such as 216 in fluidic communication with the exterior of the sealed process chamber 168 , combined with an open loop heat exchange system in fluidic communication with the interior of the sealed process chamber 168 .
- the second alternate embodiment preferably further includes the control system 202 , which communicates with each the fluid handling system 216 and the open loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealed process chamber 168 , fluid flowing through the open loop heat exchange system and into the sealed process chamber 168 processing cavity in response to the measured internal temperature of the sealed process chamber.
- the open loop heat exchange system preferably includes at least a fluid transfer device, such as the fluid transfer device 242 in fluid communication with at least one open loop heat exchanger, such as the open loop heat exchanger 178 of FIG. 7 .
- the exterior surface of the exemplary closed loop heat exchanger 174 is adjacent an interior surface of the sealed process chamber 168 .
- a third alternate embodiment includes at least a fluid handling system such as 216 in fluidic communication with the exterior of the sealed process chamber 168 , combined with a closed loop heat exchange system, and an open loop heat exchange system, in which both the open loop and closed loop heat exchange systems are in fluidic communication with the interior of the sealed process chamber 168 .
- the third alternate embodiment preferably further includes the control system 202 , which communicates with each the fluid handling system 216 , the closed loop heat exchange system, and the open loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealed process chamber 168 , and the fluid flowing through each the open loop and closed loop heat exchange systems, and into the sealed process chamber 168 processing cavity in response to the measured internal temperature of the sealed process chamber.
- the control system 202 which communicates with each the fluid handling system 216 , the closed loop heat exchange system, and the open loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealed process chamber 168 , and the fluid flowing through each the open loop and closed loop heat exchange systems, and into the sealed process chamber 168 processing cavity in response to the measured internal temperature of the sealed process chamber.
- the open loop heat exchange system preferably includes at least a fluid transfer device, such as the fluid transfer device 242 in fluid communication with at least one open loop heat exchanger, such as the open loop heat exchanger 178 of FIG. 7 .
- the exterior surface of the exemplary closed loop heat exchanger 174 is adjacent an interior surface of the sealed process chamber 168 .
- the closed loop heat exchange system preferably includes at least a fluid transfer device, such as the closed loop fluid transfer device 254 in fluid communication with at least one closed loop heat exchanger, such as the closed loop heat exchanger 174 of FIG. 6 .
- the exterior surface of the exemplary closed loop heat exchanger 174 is adjacent an interior surface of the sealed process chamber 168 .
- FIG. 14 shown therein is an alternate exemplary embodiment of a combined heat exchange assembly 276 that preferably includes each: a closed loop heat exchanger 278 ; an open loop heat exchanger 280 ; and the thermal sensor assembly 158 of FIG. 8 .
- the closed loop heat exchanger 278 , the open loop heat exchanger 280 , and the thermal sensor assembly 158 are each supported by the plurality of heat exchanger supports 192 , and attached to and confined by a bottom port support 284 of FIG. 17 attached adjacent an access port 286 of the sealed process chamber 168 of FIG. 17 .
- FIG. 15 shows a front view in elevation of the exemplary combined heat exchange assembly 276 .
- the combined heat exchange assembly 276 includes at least the closed loop heat exchanger 278 adjacent the thermal sensor assembly, and each supported by the plurality of heat exchanger supports 192 .
- FIG. 16 shows a right side view in elevation of the exemplary combined heat exchange assembly 276 .
- the combined heat exchange assembly 276 includes at least the closed loop heat exchanger 278 adjacent each the open loop heat exchanger 280 , and the thermal sensor assembly 158 .
- FIG. 17 a shows a front view in elevation of the exemplary combined heat exchange assembly 276 mounted within the sealed process chamber 168 of a thermal diffusion system 294 .
- the heat exchange assembly 276 preferably includes at least the closed loop heat exchanger 278 adjacent the thermal sensor assembly and each secures to the bottom port support 284 , and protruding through the access port 286 of the sealed process chamber 168 of FIG. 17 , and supported by the plurality of heat exchanger supports 192 .
- FIG. 17 b shows a plan view of the bottom port support 284 , to reveal: a pair of closed loop access ports 288 , through which the closed loop heat exchanger 278 gains access to the interior of the sealed process chamber 168 ; a pair of open loop access ports 290 , through which the open loop heat exchanger 280 gains access to the interior of the sealed process chamber 168 ; and a thermal sensor access port 292 , through which the thermal sensor assembly 158 gains access to the interior of the sealed process chamber 168 .
- FIG. 18 shows a right side view in elevation of the exemplary diffusion chamber 294 that preferably includes the combined heat exchange assembly 276 adjacent the interior surface of the sealed process chamber 168 .
- the combined heat exchange assembly 276 includes at least the closed loop heat exchanger 278 adjacent each the open loop heat exchanger 280 , and the thermal sensor assembly 158 .
- FIG. 18 further shows the combined heat exchange assembly 276 is supported by the plurality of heat exchanger supports 192 , and secured to the bottom port support 284 .
- FIG. 19 provides an exemplary method of making a thermal chamber 300 , which commences at start step 302 and continues with process step 304 .
- a frame such as 104
- a containment chamber such as 102
- a heat source module is disposed within and confined by the containment chamber.
- a sealed process chamber (such as 168 ) is confined within the heat source module.
- the sealed process chamber includes at least an interior surface and an exterior surface.
- a fluid inlet box (such as 112 ) is preferably secured to the containment chamber in fluidic communication with the thermal regulation cavity.
- the fluid inlet box provides a plate valve (such as 134 ) that mitigates the flow of gasses from the thermal regulation cavity through the fluid inlet box and to the atmosphere, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136 ) interacting with the plate valve to control fluid flow from the atmosphere past the plate valve and into thermal regulation cavity.
- a thermal sensor assembly (such as 158 ) is disposed within the sealed process chamber.
- a controller (such as 204 ) is connected to each a flow adjustment structure (such as 136 ) and the thermal assembly, and the process concludes at end process step 318 .
- FIG. 20 provides an exemplary method of making a thermal chamber 400 , which commences at start step 402 and continues with process step 404 .
- a frame such as 104
- a containment chamber such as 102
- a heat source module is disposed within and confined by the containment chamber.
- a sealed process chamber (such as 168 ) is confined within the heat source module.
- the sealed process chamber includes at least an interior surface and an exterior surface.
- a first fluid handling system (such as 216 ) is preferably secured to in fluidic communication with an exterior of the sealed process chamber.
- the first fluid handling system provides a fluid inlet box (such as 112 ), which in turn provides a plate valve (such as 134 ).
- the plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136 ) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity.
- a second fluid handling system (such as 218 , or 220 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber.
- the second fluid handling system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle.
- a controller (such as 204 ) is connected to each the first and second fluid handling systems, and the process concludes at end process step 418 .
- FIG. 21 provides an exemplary method of making a thermal chamber 500 , which commences at start step 502 and continues with process step 504 .
- a frame such as 104
- a containment chamber such as 102
- a heat source module is disposed within and confined by the containment chamber.
- a sealed process chamber (such as 168 ) is confined within the heat source module.
- the sealed process chamber includes at least an interior surface and an exterior surface.
- a fluid handling system (such as 216 ) is preferably secured to in fluidic communication with an exterior of the sealed process chamber.
- the first fluid handling system provides a fluid inlet box (such as 112 ), which in turn provides a plate valve (such as 134 ).
- the plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136 ) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity.
- a closed loop heat exchange system (such as 296 of FIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber.
- the closed loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, without exposing the transferred fluid to the internal environment of the sealed process chamber.
- a controller (such as 204 ) is connected to each the fluid handling system and the closed loop heat exchange system, and the process concludes at end process step 518 .
- FIG. 22 provides an exemplary method of making a thermal chamber 600 , which commences at start step 602 and continues with process step 604 .
- a frame such as 104
- a containment chamber such as 102
- a heat source module is disposed within and confined by the containment chamber.
- a sealed process chamber (such as 168 ) is confined within the heat source module.
- the sealed process chamber includes at least an interior surface and an exterior surface.
- a fluid handling system (such as 216 ) is preferably secured to in fluidic communication with an exterior of the sealed process chamber.
- the first fluid handling system provides a fluid inlet box (such as 112 ), which in turn provides a plate valve (such as 134 ).
- the plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136 ) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity.
- an open loop heat exchange system (such as 298 of FIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber.
- the loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, by pulling the transferred fluid through the internal environment of the sealed process chamber.
- a controller (such as 204 ) is connected to each the fluid handling system and the open loop heat exchange system, and the process concludes at end process step 618 .
- FIG. 23 provides an exemplary method of making a thermal chamber 700 , which commences at start step 702 and continues with process step 704 .
- a frame such as 104
- a containment chamber such as 102
- a heat source module is disposed within and confined by the containment chamber.
- a sealed process chamber (such as 168 ) is confined within the heat source module.
- the sealed process chamber includes at least an interior surface and an exterior surface.
- a fluid handling system (such as 216 ) is preferably secured to in fluidic communication with an exterior of the sealed process chamber.
- the first fluid handling system provides a fluid inlet box (such as 112 ), which in turn provides a plate valve (such as 134 ).
- the plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136 ) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity.
- an open loop heat exchange system (such as 298 of FIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber.
- the loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, by pulling the transferred fluid through the internal environment of the sealed process chamber.
- a closed loop heat exchange system (such as 296 of FIG. 13 ) is preferably located in fluidic communication with an interior of the sealed process chamber.
- the closed loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, without exposing the transferred fluid to the internal environment of the sealed process chamber.
- a controller (such as 204 ) is connected to each the fluid handling system and the open loop heat exchange system, and the process concludes at end process step 720 .
- FIG. 24 displays an exemplary open loop heat exchange system 844 of the claimed subject matter, which preferably includes cooling tubes assembly 846 communicating with an air handling unit 848 (also referred to herein as a fluid handling unit 848 ) by way of an inlet conduit assembly 850 and an outlet conduit assembly 852 .
- FIG. 24 further shows that the exemplary open loop heat exchange system 844 preferably includes a heat exchanger 854 disposed between the outlet conduit assembly 852 and the air handling unit 848 .
- FIG. 25 shows that in a preferred embodiment, the cooling tubes assembly 846 includes an outlet manifold 856 supporting a thermal dispersion baffle 858 , and communicating with a plurality of outlet cooling tubes 860 .
- FIG. 25 further shows, that in the preferred embodiment, the cooling tubes assembly 846 includes an inlet manifold 862 communicating with a plurality of inlet cooling tubes 864 , and a pair of tube retention assemblies, 866 and 868 respectfully, separating and securing the cooling tubes assemblies 860 and 864 on to the other.
- the preferred outlet conduit assembly 852 includes an outlet header 870 in communication with the outlet manifold 856 , an accumulator 872 cooperating with and disposed between the outlet header 870 and a return line 874 .
- the return line 874 interconnects directly with the heat exchanger 854 .
- a ThermaSys Heat Exchanger Part No. SSC-1260-0 by ThermaSys Corporation of Montgomery, Ala., USA, has been found to be useful as a heat exchanger for use in the claimed subject matter, but is not a required heat exchanger for use in the claimed subject matter.
- FIG. 24 further shows the preferred inlet conduit assembly 850 includes an inlet header 876 in communication with the inlet manifold 862 , an inlet accumulator 878 cooperating with the inlet header 876 and a supply line 880 . Also shown by FIG. 24 , is a source line 882 connected directly into a first isolation valve 884 , which front ends the air handling unit 848 , and a second isolation valve 886 disposed between and interconnected directly with each the air handling unit 848 and the supply line 880 .
- the first isolation valve 884 is disposed between and is in fluid communication with, the heat exchanger 854 and the fluid handling unit 848
- the second isolation valve 886 is disposed between and in fluid communication with the fluid handling unit 848 and the cooling tubes assembly 846 .
- FIG. 26 shows a right side view in elevation of the cooling tubes assembly 846 , which preferably includes the outlet manifold 856 supporting the first set of thermal dispersion baffles 858 , and the inlet manifold 862 supporting a second thermal dispersion baffle 888 .
- FIG. 27 depicts a right side view in elevation of a preferred embodiment of a cooling tubes assembly 890 , which preferably includes the outlet manifold 856 supporting the first set of thermal dispersion baffles 858 , and the inlet manifold 862 supporting a second thermal dispersion baffle 888 .
- FIG. 28 illustrates in cross section, the cooling tubes assembly 846 positioned within the process chamber 106 of the thermal chamber 100 .
- FIG. 28 further shows the cooling tubes assembly 846 secured to the collar 109 .
- the outlet cooling tubes 860 project to about the mid-point of the process chamber 106 .
- This particular embodiment has been shown to produce quite favorable results.
- the remaining sign numbers shown by FIG. 28 replicate the sign numbers for FIG. 6 . Accordingly, a review of the discussion of FIG. 6 will aid in an understanding of other structural features of the thermal chamber 100 .
- the first isolation valve 884 communicates with the heat exchanger 854 .
- the heat exchanger 854 includes a heat exchange core 892 , a fluid input port 894 communicating with the heat exchange core 892 , a fluid output port 896 communicating with the heat exchange core 892 and offset from said fluid input port 894 , a coolant input port 898 in fluid communication with the heat exchange core 892 , and a coolant output port 900 in fluid communication with the heat exchange core 892 and offset from the coolant input port 898 by the heat exchange core 892 .
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Abstract
Preferably, a frame supporting a containment chamber, which in turn confines a sealed process chamber, is provided. Further, at least one fluid inlet box in fluidic communication with an exterior of the sealed process chamber is presented, in which the fluid inlet box includes at least a flow adjustment structure to control a fluid flow from a fluid source around the exterior of the sealed process chamber; and an open loop heat exchange system in fluidic communication with an interior of the sealed process chamber is present, within at least a portion of the open loop heat exchange system resides internal to the sealed process chamber.
Description
- This application is a continuation-in-part to U.S. patent application Ser. No. 12/982,224 filed Dec. 30, 2010 entitled, “Thermal Diffusion Chamber With Heat Exchanger.”
- The claimed invention relates to the field of thermal diffusion chamber equipment and methods of making thermal diffusion chambers for the production of solar energy panels, and more particularly to structures and methods of a obtaining a more even thermal profile of substrates confined within the thermal diffusion chamber.
- A form of solar energy production relies on solar panels, which in turn rely on the diffusion of select materials onto a substrate. In one example, glass is used as the substrate, which is exposed to a gaseous selenide species to form a copper, indium and selenide containing film on the substrate. The gaseous selenide species is known to be toxic to humans, which underscores prudent handling methods, including thermal regulation systems.
- As such, thermal regulation systems capable of precluding migration and leakage of the gaseous selenide species from within a process chamber to atmosphere, in an efficient and reliable manner, can greatly improve the operation and production output of thermal chambers used in providing substrates of copper, indium and selenide containing film diffused within them.
- Accordingly, there is a continuing need for improved mechanisms and methods of thermal regulation of the process chamber for thermal diffusion chambers.
- In accordance with various exemplary embodiments, preferably, a frame supporting a containment chamber, which in turn confines a sealed process chamber, is provided. Further, at least one fluid inlet box in fluidic communication with an exterior of the sealed process chamber is presented, in which the fluid inlet box includes at least a flow adjustment structure to control a fluid flow from a fluid source around the exterior of the sealed process chamber; and an open loop heat exchange system in fluidic communication with an interior of the sealed process chamber is present, within at least a portion of the open loop heat exchange system resides internal to the sealed process chamber.
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FIG. 1 displays an orthogonal projection, with partial cut-away, of an exemplary embodiment of a thermal chamber of the claimed invention. -
FIG. 2 provides an orthogonal projection of an exemplary substrate support frame configured for use with the exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 3 shows a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 4 illustrates a cross-sectional, front elevation view of the exemplary embodiment of the thermal chamber ofFIG. 1 showing an exhaust manifold and conduit. -
FIG. 5 provides an enlarged detailed cross-sectional, elevation view of a fluid inlet box with an attached inlet conduit of the exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 6 depicts a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber ofFIG. 1 , showing an exemplary closed loop internal heat exchanger. -
FIG. 7 shows a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber ofFIG. 1 , showing an exemplary open loop internal heat exchanger. -
FIG. 8 depicts a cross-sectional, right side elevation view of the exemplary embodiment of the thermal chamber ofFIG. 1 , showing an exemplary internal thermal sensor. -
FIG. 9 generally illustrates a plan view of an exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of the thermal chamber ofFIG. 1 . -
FIG. 10 displays an orthogonal projection, of an exemplary door with attached primary thermal deflection assembly, of the thermal chamber ofFIG. 1 . -
FIG. 11 provides an orthogonal projection of the primary thermal dispersion assembly ofFIG. 10 . -
FIG. 12 shows an orthogonal projection of a secondary thermal dispersion assembly of the thermal chamber ofFIG. 1 . -
FIG. 13 illustrates a schematic of a cool down heat exchange system for use in cooling down the interior and exterior of the thermal chamber ofFIG. 1 . -
FIG. 14 illustrates a plan view of an alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly of the thermal chamber ofFIG. 1 . -
FIG. 15 provides an end view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly ofFIG. 14 . -
FIG. 16 displays a side elevation view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly ofFIG. 14 . -
FIG. 17 a shows an end view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly ofFIG. 14 positioned within the thermal chamber ofFIG. 1 . -
FIG. 17 b shows a plan view of a bottom port support attached to the thermal chamberFIG. 17 a. -
FIG. 18 depicts a side elevation view of the alternate exemplary combination internal thermal sensor, open loop internal heat exchanger, and closed loop internal heat exchanger assembly ofFIG. 14 positioned within the thermal chamber ofFIG. 1 . -
FIG. 19 generally illustrates a flow chart of a method of forming an exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 20 reveals a flow chart of a method of forming an exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 21 shows a flow chart of a method of forming an alternate exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 22 displays a flow chart of a method of forming an alternative exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 23 reveals a flow chart of a method of forming an alternative alternate exemplary embodiment of the thermal chamber ofFIG. 1 . -
FIG. 24 displays an orthogonal projection an exemplary embodiment of an open loop heat exchange system of the claimed invention. -
FIG. 25 illustrates an orthogonal projection of a cooling tubes assembly of the exemplary embodiment of the open loop heat exchange system ofFIG. 23 . -
FIG. 26 shows a right side view in elevation of the cooling tubes assembly ofFIG. 23 . -
FIG. 27 depicts a right side view in elevation of a preferred embodiment of a cooling tubes assembly. -
FIG. 28 illustrates a right side, cross section view of an embodiment of the cooling tubes assembly positioned within the process chamber of the thermal chamber. - Reference will now be made in detail to one or more examples of various embodiments of the present invention depicted in the figures. Each example is provided by way of explanation of the various embodiments of the present invention, and not meant as a limitation of the invention. For example, features illustrated or described as part of one embodiment may be used with another embodiment to yield still a different embodiment. Other modifications and variations to the described embodiments are also contemplated within the scope and spirit of the claimed invention.
- Turning to the drawings,
FIG. 1 displays an exemplarythermal diffusion chamber 100 which includes at least acontainment chamber 102 supported by aframe 104. Thecontainment chamber 102 in turn supports aprocess chamber 106. Preferably the exemplarythermal diffusion chamber 100 further includes aheat source module 108 disposed between theprocess chamber 106 and thecontainment chamber 102, athermal regulation cavity 110 formed between theprocess chamber 106 and theheat source module 108, and acollar 109 secured to a lip of theprocess chamber 106 and anchored to thecontainment chamber 102.FIG. 1 further shows that at least onefluid inlet box 112 is provided, which is in fluidic communication with thethermal regulation cavity 110. -
FIG. 2 shows an exemplarysubstrate support frame 113 configured for use with the exemplary embodiment of the thermal diffusion chamber 100 (ofFIG. 1 ). In a preferred embodiment, thesubstrate support frame 113 is formed from quarts and accommodates a plurality of substrates 115 (one shown). In operation, thesubstrate support frame 113 is filled to capacity withsubstrates 115 and positioned within theprocess chamber 106. Within theprocess chamber 106, thesubstrate support frame 113, serves as a fixture for thesubstrates 115 during the diffusion process. Preferably thesubstrates 115 are rectangular in shape having a width of substantially 650 millimeters and a length of substantially 1650 millimeters, and are formed from glass, preferably soda-lime-silica glass. -
FIG. 3 shows an exemplary embodiment of thethermal diffusion chamber 100 includes thefluid inlet box 112 in fluid communication with thethermal regulation cavity 110. Further shown byFIG. 3 is a plurality ofsupports 114 preferably positioned between theheat source module 108 and theprocess chamber 106. - In a preferred exemplary embodiment, the heat source module is formed from a plurality of heaters 116 (also referred to herein as a heat source), which in an exemplary embodiment consists of substantially a total of twenty two (22) heaters. Preferably, each heater provides a
heater shell 118,heater insulation 120 adjacent theheater shell 118, and a plurality ofheating elements 122. In an exemplary embodiment, theheating elements 122 are powered by electricity, and are preferably a coiled element. However it is noted that the term “heat source” is not limited to the disclosed plurality ofheaters 116. Theheat source 116 may be natural gas, super heated steam, geo-thermal energy, or any other source of energy to produce a desired temperature within theprocess chamber 106. - Returning back to
FIG. 1 , which shows thefluid inlet box 112 further includes aninlet conduit 124 secured to aninlet manifold 126. Preferably theinlet manifold 126 delivers air to theair inlet boxes 112 for distribution over theprocess chamber 106, as depicted inFIG. 3 . -
FIG. 3 further shows the exemplarythermal diffusion chamber 100 includes apurge conduit 128 in fluidic communication with thethermal regulation cavity 110 and secured to anoutlet manifold 130, theoutlet manifold 130 selectively providing an internal pressure less than atmospheric pressure to draw air through thefluid inlet box 112, around theprocess chamber 106, and out thepurge conduit 128. - Also shown by
FIG. 3 , is a plurality of externalthermal sensors 132 in contacting adjacency with theprocess chamber 106, extending through correspondingheaters 116, and presentingelectrical lead lines 133 for connection from the outside of thecontainment chamber 102. In a preferred mode of operation of the exemplarythermal diffusion chamber 100, fluid flow is suspended, i.e., the fluid flow undergoes fluid flow modulation, to provide a more accurate reading of the external temperature of theprocess chamber 106. Information collected from the plurality of externalthermal sensors 132 is used to cross check information collected by an internalthermal sensor assembly 158 ofFIG. 8 . Preferably the information collected by the internal thermal sensors is used to determine whichair inlet boxes 112 should undergo a restriction of fluid flow, and which should be adjusted for maximum fluid flow. - By adjusting the fluid flow through the plurality of
air inlet boxes 112, a more uniform cool down of theprocess chamber 106 may be attained. Further, in an alternate preferred mode of operation of the exemplarythermal diffusion chamber 100, the internalthermal sensor assembly 158, with additional input from the plurality of externalthermal sensors 132, provides information for regulating an amount of power supplied to theheating elements 122 during a heat up cycle of theprocess chamber 106. That is, during a heat up cycle of theprocess chamber 106, power is being supplied to each of the plurality ofheater 116. By modulating the power supplied to each of the plurality ofheaters 116, a more uniform heat up of theprocess chamber 106 may be attained. -
FIG. 4 depicts thefluid inlet box 112 includes aplate valve 134, which mitigates the flow of fluid from thethermal regulation cavity 110 through thefluid inlet box 112 and external to thecontainment chamber 102.FIG. 4 further shows thefluid inlet box 112 includes aflow adjustment structure 136, which preferably includes apositioning shaft 135 controlled by amotor 137. In response to a rotation of themotor 137, thepositioning shaft 135 interacts with theplate valve 134 to control fluid flow from the exterior of thecontainment chamber 102 past theplate valve 134 and into thethermal regulation cavity 110. -
FIG. 5 provides a more detailed view of thefluid inlet box 112. In a preferred embodiment, thefluid inlet box 112 further provides anintake port 138 supporting theinlet conduit 124, which is in contacting adjacency with theplate valve 134. Preferably, thefluid inlet box 112 further provides anexhaust port 140 that supports an outlet conduit 142 that is in fluidic communication with thethermal regulation cavity 110. During an operation of thefluid inlet box 112, a pair ofpinch rollers 139 of themotor 137 act upon thepositioning shaft 135 to change a position of thepositioning shaft 135 relative to theplate valve 134. - As shown by
FIG. 5 , in a preferred embodiment in addition to providing theexhaust port 140 supporting the outlet conduit 142, thefluid inlet box 112 provides anextension conduit 150 having a proximal end and a distal end, the proximal end in contacting adjacency with and secured to the outlet conduit 142, theextension conduit 150 is provided to conduct fluid originating from thecontainment chamber 102 to thethermal regulation cavity 110 ofFIG. 4 . The distal end of theextension conduit 150 is preferably fashioned with adiffusion member 152 affixed thereon, wherein thediffusion member 152 is configured to preclude fluid originating external thecontainment chamber 102 from being applied to theprocess chamber 106 ofFIG. 4 in a stream normal to the exterior of theprocess chamber 106. -
FIG. 5 further shows thefluid inlet box 112 further provides apivot pin 154 disposed between theplate valve 134 and apivot support 156. Thepivot support 156 is secured adjacent theinlet conduit 124. Thepivot pin 154, in combination with theflow adjustment structure 136, promotes a controlled, predetermined, and adjustable displacement of theplate valve 134 from contacting adjacency with theinlet conduit 124 when fluid is drawn into thethermal regulation cavity 110. Thepivot pin 154 further promotes the closing of theplate valve 134 adjacent theinlet conduit 124 when the flow of fluid originating external thecontainment chamber 102 is stopped. In other words, aclosed plate valve 134 deters passage of fluid from thethermal regulation chamber 110 to external thecontainment chamber 102 when fluid is not being drawn into thethermal regulation cavity 110. -
FIG. 6 shows that an exemplary embodiment of thethermal diffusion chamber 100 includes thefluid inlet box 112 in fluid communication with thethermal regulation cavity 110. Further shown byFIG. 6 is achamber door 160. Preferably, thechamber door 160 includes aface plate 162 secured to amain body portion 164, and a primarythermal dispersion assembly 166 secured to theface plate 162. With the exception of a bottom portion, the primarythermal dispersion assembly 166 is aligned in close proximity to an inner surface of a sealedprocess chamber 168. The sealedprocess chamber 168 is preferably formed when thechamber door 160 is secured in sealing contact with theprocess chamber 106. - In the exemplary embodiment of
FIG. 6 , a secondarythermal dispersion assembly 170 is aligned with the primarythermal dispersion assembly 166 and preferably communicates with a wall of the inner surface of the sealedprocess chamber 168. In conjunction with a plurality ofsupport members 172, the secondarythermal dispersion assembly 170 confines and supports a closedloop heat exchanger 174 adjacent the wall of the sealedprocess chamber 168. The closedloop heat exchanger 174 provides a means for circulation of a fluid through the interior of the sealedprocess chamber 168, to facilitate a cool down of the interior of the sealedprocess chamber 168 during a process cycle of thethermal diffusion chamber 100. -
FIG. 7 shows that an alternate exemplary embodiment of thethermal diffusion chamber 100 includes thefluid inlet box 112 in fluid communication with thethermal regulation cavity 110. Further shown byFIG. 7 is thechamber door 160, which preferably includes theface plate 162 secured to themain body portion 164, and the primarythermal dispersion assembly 166 secured to theface plate 162. With the exception of the bottom portion, the primarythermal dispersion assembly 166 is aligned in close proximity to the inner surface of the sealedprocess chamber 168. - In the alternate exemplary embodiment of
FIG. 7 , preferably, the secondarythermal dispersion assembly 170 is aligned with the primarythermal dispersion assembly 166 and rests on the bottom of the inner surface of the sealedprocess chamber 168. In conjunction with a plurality ofsupport members 176, the secondarythermal dispersion assembly 170 confines and supports an openloop heat exchanger 178 adjacent the bottom of the sealedprocess chamber 168. The openloop heat exchanger 178 provides a plurality ofsupply ports 180 through which fluid may be introduced into the sealedprocess chamber 168 during a process cycle of thethermal diffusion chamber 100 to facilitate a cool down of the sealedprocess chamber 168. -
FIG. 8 shows that an alternative exemplary embodiment of thethermal diffusion chamber 100 includes thefluid inlet box 112 in fluid communication with thethermal regulation cavity 110. Further shown byFIG. 8 is thechamber door 160, which preferably includes theface plate 162 secured to themain body portion 164, and the primarythermal dispersion assembly 166 secured to theface plate 162. With the exception of the bottom portion, the primarythermal dispersion assembly 166 is aligned in close proximity to the inner surface of the sealedprocess chamber 168. - In the alternative exemplary embodiment of
FIG. 8 , the secondarythermal dispersion assembly 170 is aligned with the primarythermal dispersion assembly 166 and rests on the bottom of the inner surface of the sealedprocess chamber 168. In conjunction with a plurality ofsupport members 182, the secondarythermal dispersion assembly 170 confines and supports thethermal sensor assembly 158 adjacent the bottom of the sealedprocess chamber 168. Preferably, thethermal sensor assembly 158 provides a plurality ofthermocouples 184 disposed along a length of the sealedprocess chamber 168. The plurality ofthermocouples 184, are responsive to a change in temperature of the interior of the sealedprocess chamber 168. Preferably, thethermal sensor assembly 158 further includes asensor conduit 186 extending from an opening of the sealedprocess chamber 168 through at least a mid portion of the sealedprocess chamber 168. Thesensor conduit 186 shields the plurality ofthermocouples 184 from exposure to an internal environment of the sealedprocess chamber 168. -
FIG. 8 further shows that thethermal sensor assembly 158 preferably further includes a plurality ofsignal lines 188 connected to and corresponding with each of the plurality ofthermocouples 184. Eachsignal line 188 conveys a signal to the exterior of the sealedprocess chamber 168 in response to the change in temperature of the interior of the sealedprocess chamber 168. - As shown in a preferred embodiment by
FIG. 9 , a combinedheat exchange assembly 190 includes each: the closedloop heat exchanger 174 ofFIG. 6 ; the openloop heat exchanger 178 ofFIG. 7 ; and thethermal sensor assembly 158 ofFIG. 8 . The closedloop heat exchanger 174, the openloop heat exchanger 178, and thethermal sensor assembly 158 are each supported by a plurality of heat exchanger supports 192, and attached to and confined by the secondarythermal dispersion assembly 170. -
FIG. 10 provides a more detailed depiction of thechamber door 160. Preferably, thechamber door 160 includes aface plate 162 secured to themain body portion 164, and alamp support 194 secured to theface plate 162. As shown byFIG. 10 , thechamber door 160 further includes the primarythermal dispersion assembly 166, while thelamp support 194 provides a plurality of alignment notches 195 (shown byFIG. 11 ) upon which thethermal dispersion assembly 166 is aligned and rests during operational modes of thethermal diffusion chamber 100 ofFIG. 8 . -
FIG. 11 further shows the primarythermal dispersion assembly 166 includes at least adiffusion plate 196 adjacent a plurality ofradiation reflection plates 197. Thediffusion plate 195 and a plurality ofradiation reflection plates 197 are preferably held in alignment by thelamp support 194. In a preferred exemplary embodiment, themain body portion 164, theface plate 162, and thethermal dispersion assembly 166 are preferably formed from quartz. -
FIG. 12 shows the secondarythermal dispersion assembly 170 provides a plurality ofaccess ports 198, which are used to align, support, and confine each closedloop heat exchanger 174, the openloop heat exchanger 178, and thethermal sensor assembly 158 ofFIG. 8 . Preferably, the secondarythermal dispersion assembly 170 includes at least adiffusion plate 196 a adjacent a plurality ofradiation reflection plates 197 a, which in a preferred embodiment are formed from quartz. -
FIG. 13 illustrates a schematic of aheat exchange system 200 for use in cooling down an interior and an exterior of the sealedthermal chamber 168 during a process cycle of thethermal diffusion chamber 100. In a preferred embodiment, theheat exchange system 200 includes a control system 202 (also referred to herein as controller 202) communicating with each a firstfluid handling system 216, a secondfluid handling system 218, and thirdfluid handling system 220. Preferably, thecontrol system 202 includes at least acontrol signal buss 222 communicating with at least the first, second, and third fluid handling systems (216, 218, 220), and acontroller 202. - In a preferred embodiment, the
controller 202 includes at least an input/output module 204 communicating with the control signalbuss 222, aprocessor 206 communicating with the input/output module 204, amemory 208storing control logic 210 and communicating with theprocessor 206, aninput device 212 communicating with theprocessor 206 and adisplay 214 communicating with theprocessor 206. - During a preferred operation of the
thermal chamber 100, upon receipt by the input/output module 204 of a measured temperature value of a first fluid flowing around the exterior of the sealedprocess chamber 168, the input/output module 204 provides said measured temperature value of the first fluid flowing around the exterior of the sealedprocess chamber 168 to theprocessor 206. Theprocessor 206 accesses the storedcontrol logic 210 and determines a control signal based on the measured temperature value of the first fluid flowing around the exterior of the sealedprocess chamber 168. Theprocessor 206 transmits the control signal to the input/output module 204, the input/output module 204 advances the control signal by way of the control signalbuss 222 to the firstfluid handling system 216. - Preferably, the
processor 206 further determines an in use flow capacity percentage of fluid flowing through the firstfluid handling system 216 based on data received from a flowusage monitoring device 224 communicating with afluid transfer device 226 of the firstfluid handling system 216. Theprocessor 206 still further preferably provides the in use flow capacity percentage of the firstfluid transfer device 226 and the measured temperature value of the first fluid flowing around the exterior of the sealedprocess chamber 168 to thedisplay 214. - The schematic of
FIG. 13 shows that theheat exchange system 200 preferably utilizes a plurality ofcontrol valves 228, responsive to control signals generated by theprocessor 206 and provided to each of the plurality ofcontrol valves 228 by the control signalbuss 222 to control the flow of fluids through each the first, second, and third fluid handling systems (216, 218, 220).FIG. 13 further shows that theheat exchange system 200 preferably utilizes a plurality ofcheck valves 230 to control backflow of the flow of fluids through each the first, second, and third fluid handling systems (216, 218, 220), and a plurality ofthermal sensors 232 to provide temperature measurement values to theprocessor 206 upon which theprocessor 206 bases the determination of a plurality of control signals to be transmitted to each corresponding control valve of the plurality ofcontrol valves 228. -
FIG. 13 still further provides aflow direction symbol 234, which reveals the direction of flow of fluids through each corresponding the first, second, and third fluid handling systems (216, 218, 220), and that each of the plurality ofthermal sensors 232 along with each of the plurality ofcontrol valves 228 communicate with the control signalbuss 222. In a preferred embodiment, the firstfluid handling system 216 includes at least the firstfluid transfer device 226 in fluid communication with at least onefluid inlet box 112. The at least onefluid inlet box 112 is preferably in fluidic communication with an exterior of the sealedprocess chamber 168, and the at least onefluid inlet box 112 includes at least: the flow adjustment structure 137 (ofFIG. 5 ) to control the flow of the first fluid around the exterior of the sealedprocess chamber 168; and afluid return conduit 130 in fluid communication with each the exterior of the sealedprocess chamber 168 and the firstfluid transfer device 226, thefluid return conduit 130 returning the first fluid flowing around the sealedprocess chamber 168 to the firstfluid transfer device 226. - As shown by
FIG. 13 , the firstfluid handling system 216 preferably includes a first thermal sensor of the plurality offluid sensors 232 communicating with each the returned first fluid and thecontrol system 202, the first thermal sensor measures a temperature value of the returned first fluid and provides that value to thecontrol system 202. Upon receipt of the measured temperature value by thecontrol system 202, theprocessor 206 of thecontrol system 202 compares the measured temperature value to a predetermined temperature value and sends a control signal to a first control valve of the plurality ofcontrol valves 228 disposed between thefluid return conduit 130 and the firstfluid transfer device 226. In response to the control signal, the first control valve modulates flow of the returned first fluid from the exterior of the sealedprocess chamber 168 to the firstfluid transfer device 226. - Further shown by
FIG. 13 , the firstfluid handling system 216 preferably further includes an inline fluid heater 236, such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA. Preferably the inline fluid heater 236 is plumbed into the firstfluid handling system 216 between thefluid transfer device 226 and the plurality offluid inlet boxes 112. The inline fluid heater 236 may be selectively included in the fluid path of the first fluid through activation of a second control valve in response to a control signal provided by the control signalbuss 222 from theprocessor 206 based on a temperature measurement value provided by a second thermal sensor measuring the first fluid exiting thefluid transfer device 226. The inline fluid heater 236 is preferably used when the out flow temperature of the first fluid departing thefluid transfer device 226 is less than a desired inlet temperature of thefluid inlet box 112. - Additionally, the first
fluid handling system 216 preferably further includes aheat exchanger 238, external to and plumbed into the firstfluid handling system 216 between thethermal diffusion chamber 100 and thefluid transfer device 226. Theheat exchanger 238 may be selectively included in the fluid path of the first fluid through activation of a third control valve in response to a control signal provided by the control signalbuss 222 from theprocessor 206 based on a temperature measurement value provided by a third thermal sensor measuring the first fluid exiting thethermal diffusion chamber 100. Preferably, theheat exchanger 238 is utilized to safeguard thefluid transfer device 226 from experiencing a thermal condition that exceeds its operating parameters. - To provide data regarding an in use thermal capacity of each of the plurality of heat sources 116 (of
FIG. 8 ), the firstfluid handling system 216 preferably further includes an energyusage monitoring device 240 communicating with each theheat elements 130 of the plurality ofheat sources 116 and thecontrol system 202. Theenergy monitoring device 240 is preferably used to safeguard against thermal runaway of each of the plurality ofheat sources 116. That is, when any of the plurality ofheat sources 116 exceeds a preferred, predetermined usage percentage, theprocessor 206 issued a command to an energy source control unit instructing the energy source control unit to stop the supply of energy to the out of operatingrange heat source 116. The processor further preferably provides the in use thermal capacity status of each of the plurality ofheat sources 116 to thedisplay 214 for presentation by thedisplay 214. - In the preferred embodiment, shown by
FIG. 13 , the thirdfluid handling system 220 preferably includes at least a closed systemfluid transfer device 242 in fluid communication with at least onefluid distribution conduit 244. The at least onefluid distribution conduit 244 is preferably in fluidic communication with an interior of the sealedprocess chamber 168. Preferably, afeed conduit 246 is disposed between the secondfluid transfer device 242 and the at least onefluid distribution conduit 244. Thefeed conduit 246 preferably communicates the second fluid from the secondfluid transfer device 242 to the at least onefluid distribution conduit 244. - Also preferably provided by the second
fluid handling system 218 is a check valve disposed between thefeed conduit 246 and the at least onefluid distribution conduit 244, the check valve mitigating a back flow from the interior of the sealedprocess chamber 168 to the secondfluid transfer device 242. Additionally, an interior fluid control valve is preferably plumbed between the secondfluid transfer device 242 and the at least onefluid distribution conduit 244, to control a flow of the second fluid into the interior of the sealedprocess chamber 168. The preferred embodiment also provides afluid collection conduit 248 in fluid communication with the interior of the sealedprocess chamber 168 and the secondfluid transfer device 242. Thefluid collection conduit 248 returns the second fluid flowing into the interior of the sealedprocess chamber 168 to the secondfluid transfer device 242. - Preferably, a fourth thermal sensor communicating with the returned second fluid and the
control system 202 is provided by the secondfluid handling system 218. The fourth thermal sensor preferably measures a temperature value of the returned second fluid and provides said measured temperature value to thecontrol system 202. Upon receipt of the measured temperature value by thecontrol system 202, thecontrol system 202 compares the measured temperature value to a predetermined temperature value and sends an interior fluid control valve signal to the interior fluid control valve to modulate flow of the returned second fluid from the secondfluid transfer device 242 in response to the interior fluid control valve signal. - Further shown by
FIG. 13 , the secondfluid handling system 218 preferably further includes an inline fluid heater 236, such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA. Preferably the inline heater 236 is plumbed into the secondfluid handling system 218 between thefluid transfer device 242 and thefeed conduit 246. The inline fluid heater 236 may be selectively included in the fluid path of the second fluid through activation of a fourth control valve in response to a control signal provided by the control signalbuss 222 from theprocessor 206. The control signal is preferably based on a temperature measurement value provided by a fifth thermal sensor measuring the second fluid exiting thefluid transfer device 242. The inline fluid heater 236 is preferably used when the out flow temperature of the second fluid departing thefluid transfer device 242 is less than a desired inlet temperature of the at least onefluid distribution conduit 244. - Additionally, the second
fluid handling system 218 preferably further includes aheat exchanger 250, external to and plumbed into the secondfluid handling system 218 between thefluid collection conduit 248 and the secondfluid transfer device 242. Theheat exchanger 250 may be selectively included in the fluid path of the second fluid through activation of a fifth control valve in response to a control signal provided by the control signalbuss 222 from theprocessor 206 based on a temperature measurement value provided by a sixth thermal sensor measuring the second fluid entering thefluid collection conduit 248. - Preferably, the
heat exchanger 250 is utilized to safeguard thefluid transfer device 242 from experiencing a thermal condition that exceeds its operating parameters. Further, to provide data regarding an in use percentage of thefluid transfer device 242, a flowusage monitoring device 252 is preferably used to safeguard against exceeding the operating capabilities of thefluid transfer device 242. - In the preferred embodiment, shown by
FIG. 13 , the thirdfluid handling system 220 is preferably a closed loopfluid handling system 220. That is, the third fluid is isolated from all environments external to the closed loopfluid handling system 220. The closed loopfluid handling system 220 preferably includes at least a closed loopfluid transfer device 254 in fluid communication with at least onefluid distribution conduit 256. The at least onefluid distribution conduit 256 is preferably adjacent an interior of the sealedprocess chamber 168. Preferably, afeed conduit 258 is disposed between the closed loopfluid transfer device 254 and the at least onefluid distribution conduit 256. Thefeed conduit 258 preferably communicates the isolated third fluid from the closed loopfluid transfer device 254 to the at least onefluid distribution conduit 244. - Also preferably provided by the closed loop
fluid handling system 220 is a check valve disposed between thefeed conduit 258 and the at least onefluid distribution conduit 256, the check valve mitigating a back flow from the at least onefluid distribution conduit 256 to the closed loopfluid transfer device 254. Additionally, a sixth fluid control valve is preferably plumbed between the closed loopfluid transfer device 254 and the at least onefluid distribution conduit 256, to control a flow of the isolated third fluid into the at least onefluid distribution conduit 256. The preferred embodiment also provides afluid collection conduit 260 in fluid communication with areturn conduit 262 and the closed loopfluid transfer device 254. Thefluid collection conduit 260 returns the isolated third fluid flowing into the at least onefluid distribution conduit 256. - Preferably, a seventh thermal sensor that communicates with the returned isolated third fluid and the
control system 202 is provided by the secondfluid handling system 220. The seventh thermal sensor preferably measures a temperature value of the returned isolated third fluid and provides said measured temperature value to thecontrol system 202. Upon receipt of the measured temperature value by thecontrol system 202, thecontrol system 202 compares the measured temperature value to a predetermined temperature value and sends a fluid control valve signal to the fluid control valve, preferably plumbed in between thefluid collection conduit 260 and thereturn conduit 262. The fluid control valve preferably functions to modulate flow of the returned isolated third fluid from thereturn conduit 262 to the closed loopfluid transfer device 254 in response to the fluid control valve signal. - Further shown by
FIG. 13 , the closed loopfluid handling system 220 preferably further includes an in-line fluid heater 264, such as a SureHeat MAX® manufactured by OSRAM Sylvania of Danvers Main, USA. Preferably the in-line fluid heater 264 is plumbed into the closed loopfluid handling system 220 between thefeed conduit 258 and the at least onefluid distribution conduit 256. The inline fluid heater 236 may be selectively engaged or disengaged during an operation mode of the closed loopfluid handling system 220 in response to a control signal. The control signal is preferably based on a temperature measurement value provided by an eighth thermal sensor measuring the isolated third fluid exiting an external gas togas heat exchanger 266. The external gas togas heat exchanger 266 is preferably plumbed into the closed loopfluid handling system 220 between thefeed conduit 258 and the closed loopfluid transfer device 254. The inline fluid heater 264 is preferably used when the out flow temperature of the isolated third fluid is departing the external gas togas heat exchanger 266 is less than a desired inlet temperature if the at least onefluid distribution conduit 256. Preferably, the external gas togas heat exchanger 266 extracts heat from the isolated third fluid provided by thereturn conduit 262, and transfers the extracted heat to the isolated third fluid provided by the closed loopfluid transfer device 254. - Additionally, the closed loop
fluid handling system 220 preferably further includes aheat exchanger 268, internal to and plumbed within the closed loopfluid transfer device 254. Theheat exchanger 268, may be selectively included in the fluid path of the isolated third fluid through activation of a sixth control valve in response to a control signal provided by the control signalbuss 222 from theprocessor 206 based on a temperature measurement value provided by a ninth thermal sensor measuring the isolated third fluid exiting the external gas togas heat exchanger 266. - Preferably, the
heat exchanger 268 is utilized to safeguard afluid advancement device 270 housed within the closed loopfluid transfer device 254, from experiencing a thermal condition that exceeds the operating parameters of thefluid advancement device 270. Further, to provide data regarding an in use percentage of the closed loopfluid transfer device 254, a flowusage monitoring device 272 is preferably used to safeguard against exceeding the operating capabilities of thefluid advancement device 270, while being operated by adrive system 274, connected to thefluid advancement device 270. In a preferred embodiment the isolated third fluid is held at a pressure below atmospheric pressure, while the fluid is at ambient temperature, to allow for thermal expansion of the isolated third fluid when the isolated third fluid is absorbing thermal energy from the interior of the sealedprocess chamber 168. - It is noted that each the first fluid, the second fluid, and the isolated third fluid may be any of a number of fluids including, but not limited to air, water, nitrogen, helium, propylene glycol, ethylene glycol, or any other heat transfer sympathetic fluid.
- It is further noted that
FIG. 13 shows that the preferred embodimentheat exchange system 200 includes the exemplary combinedheat exchange assembly 190, which preferably includes each: the closedloop heat exchanger 174 ofFIG. 6 ; the openloop heat exchanger 178 ofFIG. 7 ; and thethermal sensor assembly 158 ofFIG. 8 . - A person skilled in the art will understand that alternate embodiments are inherently presented by
FIG. 13 . A number of these include, but are not limited to, a fluid handling system such as 216 in fluidic communication with the exterior of the sealedprocess chamber 168, combined with a closed loop heat exchange system in fluidic communication with the interior of the sealedprocess chamber 168. Wherein thecontrol system 202 communicates with each thefluid handling system 216 and the closed loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealedprocess chamber 168, fluid flowing through the closed loop heat exchange system in response to the measured internal temperature of the sealedprocess chamber 168. - In the present alternate embodiment, the closed loop heat exchange system preferably includes at least a fluid transfer device, such as the closed loop
fluid transfer device 254 in fluid communication with at least one closed loop heat exchanger, such as the closedloop heat exchanger 174 ofFIG. 6 . In the present alternate embodiment, the exterior surface of the exemplary closedloop heat exchanger 174 is adjacent an interior surface of the sealedprocess chamber 168. - A second alternate embodiment includes at least a fluid handling system such as 216 in fluidic communication with the exterior of the sealed
process chamber 168, combined with an open loop heat exchange system in fluidic communication with the interior of the sealedprocess chamber 168. The second alternate embodiment preferably further includes thecontrol system 202, which communicates with each thefluid handling system 216 and the open loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealedprocess chamber 168, fluid flowing through the open loop heat exchange system and into the sealedprocess chamber 168 processing cavity in response to the measured internal temperature of the sealed process chamber. - In the present second alternate embodiment, the open loop heat exchange system preferably includes at least a fluid transfer device, such as the
fluid transfer device 242 in fluid communication with at least one open loop heat exchanger, such as the openloop heat exchanger 178 ofFIG. 7 . In the present alternate embodiment, the exterior surface of the exemplary closedloop heat exchanger 174 is adjacent an interior surface of the sealedprocess chamber 168. - A third alternate embodiment includes at least a fluid handling system such as 216 in fluidic communication with the exterior of the sealed
process chamber 168, combined with a closed loop heat exchange system, and an open loop heat exchange system, in which both the open loop and closed loop heat exchange systems are in fluidic communication with the interior of the sealedprocess chamber 168. - The third alternate embodiment preferably further includes the
control system 202, which communicates with each thefluid handling system 216, the closed loop heat exchange system, and the open loop heat exchange system, and sets a flow rate of each the fluid flowing around an exterior of the sealedprocess chamber 168, and the fluid flowing through each the open loop and closed loop heat exchange systems, and into the sealedprocess chamber 168 processing cavity in response to the measured internal temperature of the sealed process chamber. - In the present third alternate embodiment, the open loop heat exchange system preferably includes at least a fluid transfer device, such as the
fluid transfer device 242 in fluid communication with at least one open loop heat exchanger, such as the openloop heat exchanger 178 ofFIG. 7 . In the present alternate embodiment, the exterior surface of the exemplary closedloop heat exchanger 174 is adjacent an interior surface of the sealedprocess chamber 168. Further, in the third alternate embodiment, the closed loop heat exchange system preferably includes at least a fluid transfer device, such as the closed loopfluid transfer device 254 in fluid communication with at least one closed loop heat exchanger, such as the closedloop heat exchanger 174 ofFIG. 6 . In the present alternate embodiment, the exterior surface of the exemplary closedloop heat exchanger 174 is adjacent an interior surface of the sealedprocess chamber 168. - Turning to
FIG. 14 , shown therein is an alternate exemplary embodiment of a combinedheat exchange assembly 276 that preferably includes each: a closedloop heat exchanger 278; an openloop heat exchanger 280; and thethermal sensor assembly 158 ofFIG. 8 . The closedloop heat exchanger 278, the openloop heat exchanger 280, and thethermal sensor assembly 158 are each supported by the plurality of heat exchanger supports 192, and attached to and confined by abottom port support 284 ofFIG. 17 attached adjacent anaccess port 286 of the sealedprocess chamber 168 ofFIG. 17 . -
FIG. 15 shows a front view in elevation of the exemplary combinedheat exchange assembly 276. Preferably the combinedheat exchange assembly 276 includes at least the closedloop heat exchanger 278 adjacent the thermal sensor assembly, and each supported by the plurality of heat exchanger supports 192.FIG. 16 shows a right side view in elevation of the exemplary combinedheat exchange assembly 276. Preferably the combinedheat exchange assembly 276 includes at least the closedloop heat exchanger 278 adjacent each the openloop heat exchanger 280, and thethermal sensor assembly 158. -
FIG. 17 a shows a front view in elevation of the exemplary combinedheat exchange assembly 276 mounted within the sealedprocess chamber 168 of athermal diffusion system 294. Theheat exchange assembly 276, preferably includes at least the closedloop heat exchanger 278 adjacent the thermal sensor assembly and each secures to thebottom port support 284, and protruding through theaccess port 286 of the sealedprocess chamber 168 ofFIG. 17 , and supported by the plurality of heat exchanger supports 192. -
FIG. 17 b shows a plan view of thebottom port support 284, to reveal: a pair of closedloop access ports 288, through which the closedloop heat exchanger 278 gains access to the interior of the sealedprocess chamber 168; a pair of openloop access ports 290, through which the openloop heat exchanger 280 gains access to the interior of the sealedprocess chamber 168; and a thermalsensor access port 292, through which thethermal sensor assembly 158 gains access to the interior of the sealedprocess chamber 168. -
FIG. 18 shows a right side view in elevation of theexemplary diffusion chamber 294 that preferably includes the combinedheat exchange assembly 276 adjacent the interior surface of the sealedprocess chamber 168. Preferably the combinedheat exchange assembly 276 includes at least the closedloop heat exchanger 278 adjacent each the openloop heat exchanger 280, and thethermal sensor assembly 158.FIG. 18 further shows the combinedheat exchange assembly 276 is supported by the plurality of heat exchanger supports 192, and secured to thebottom port support 284. -
FIG. 19 provides an exemplary method of making athermal chamber 300, which commences atstart step 302 and continues withprocess step 304. Atprocess step 304, a frame (such as 104) is provided. Atprocess step 306, a containment chamber (such as 102) is supported and secured to the frame. Atprocess step 308, a heat source module is disposed within and confined by the containment chamber. Atprocess step 310, a sealed process chamber (such as 168) is confined within the heat source module. Preferably, the sealed process chamber includes at least an interior surface and an exterior surface. - A
process step 312, a fluid inlet box (such as 112) is preferably secured to the containment chamber in fluidic communication with the thermal regulation cavity. Preferably, the fluid inlet box provides a plate valve (such as 134) that mitigates the flow of gasses from the thermal regulation cavity through the fluid inlet box and to the atmosphere, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136) interacting with the plate valve to control fluid flow from the atmosphere past the plate valve and into thermal regulation cavity. - At
process step 314, a thermal sensor assembly (such as 158) is disposed within the sealed process chamber. Atprocess step 316, a controller (such as 204) is connected to each a flow adjustment structure (such as 136) and the thermal assembly, and the process concludes atend process step 318. -
FIG. 20 provides an exemplary method of making athermal chamber 400, which commences atstart step 402 and continues withprocess step 404. Atprocess step 404, a frame (such as 104) is provided. Atprocess step 406, a containment chamber (such as 102) is supported and secured to the frame. Atprocess step 408, a heat source module is disposed within and confined by the containment chamber. Atprocess step 410, a sealed process chamber (such as 168) is confined within the heat source module. Preferably, the sealed process chamber includes at least an interior surface and an exterior surface. - A
process step 412, a first fluid handling system (such as 216) is preferably secured to in fluidic communication with an exterior of the sealed process chamber. Preferably, the first fluid handling system provides a fluid inlet box (such as 112), which in turn provides a plate valve (such as 134). The plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity. - A
process step 414, a second fluid handling system (such as 218, or 220) is preferably positioned in fluidic communication with an interior of the sealed process chamber. Preferably, the second fluid handling system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle. Atprocess step 416, a controller (such as 204) is connected to each the first and second fluid handling systems, and the process concludes atend process step 418. -
FIG. 21 provides an exemplary method of making athermal chamber 500, which commences atstart step 502 and continues withprocess step 504. Atprocess step 504, a frame (such as 104) is provided. Atprocess step 506, a containment chamber (such as 102) is supported and secured to the frame. Atprocess step 508, a heat source module is disposed within and confined by the containment chamber. Atprocess step 510, a sealed process chamber (such as 168) is confined within the heat source module. Preferably, the sealed process chamber includes at least an interior surface and an exterior surface. - At
process step 512, a fluid handling system (such as 216) is preferably secured to in fluidic communication with an exterior of the sealed process chamber. Preferably, the first fluid handling system provides a fluid inlet box (such as 112), which in turn provides a plate valve (such as 134). The plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity. - At
process step 514, a closed loop heat exchange system (such as 296 ofFIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber. Preferably, the closed loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, without exposing the transferred fluid to the internal environment of the sealed process chamber. Atprocess step 516, a controller (such as 204) is connected to each the fluid handling system and the closed loop heat exchange system, and the process concludes atend process step 518. -
FIG. 22 provides an exemplary method of making athermal chamber 600, which commences atstart step 602 and continues withprocess step 604. Atprocess step 604, a frame (such as 104) is provided. Atprocess step 606, a containment chamber (such as 102) is supported and secured to the frame. Atprocess step 608, a heat source module is disposed within and confined by the containment chamber. Atprocess step 610, a sealed process chamber (such as 168) is confined within the heat source module. Preferably, the sealed process chamber includes at least an interior surface and an exterior surface. - At
process step 612, a fluid handling system (such as 216) is preferably secured to in fluidic communication with an exterior of the sealed process chamber. Preferably, the first fluid handling system provides a fluid inlet box (such as 112), which in turn provides a plate valve (such as 134). The plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity. - At
process step 614, an open loop heat exchange system (such as 298 ofFIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber. Preferably, the loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, by pulling the transferred fluid through the internal environment of the sealed process chamber. Atprocess step 616, a controller (such as 204) is connected to each the fluid handling system and the open loop heat exchange system, and the process concludes atend process step 618. -
FIG. 23 provides an exemplary method of making athermal chamber 700, which commences atstart step 702 and continues withprocess step 704. Atprocess step 704, a frame (such as 104) is provided. Atprocess step 706, a containment chamber (such as 102) is supported and secured to the frame. Atprocess step 708, a heat source module is disposed within and confined by the containment chamber. Atprocess step 710, a sealed process chamber (such as 168) is confined within the heat source module. Preferably, the sealed process chamber includes at least an interior surface and an exterior surface. - At
process step 712, a fluid handling system (such as 216) is preferably secured to in fluidic communication with an exterior of the sealed process chamber. Preferably, the first fluid handling system provides a fluid inlet box (such as 112), which in turn provides a plate valve (such as 134). The plate valve mitigates the flow of fluid from the thermal regulation cavity through the fluid inlet box and external the containment chamber, and wherein the fluid inlet box further includes a flow adjustment structure (such as 136) interacting with the plate valve to control fluid flow from external the containment chamber, past the plate valve and into thermal regulation cavity. - At
process step 714, an open loop heat exchange system (such as 298 ofFIG. 13 ) is preferably positioned in fluidic communication with an interior of the sealed process chamber. Preferably, the loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, by pulling the transferred fluid through the internal environment of the sealed process chamber. - At
process step 716, a closed loop heat exchange system (such as 296 ofFIG. 13 ) is preferably located in fluidic communication with an interior of the sealed process chamber. Preferably, the closed loop heat exchange system provides means for transferring fluid into and out of the interior of the sealed process chamber during a thermal diffusion process cycle, without exposing the transferred fluid to the internal environment of the sealed process chamber. - At
process step 718, a controller (such as 204) is connected to each the fluid handling system and the open loop heat exchange system, and the process concludes atend process step 720. -
FIG. 24 displays an exemplary open loopheat exchange system 844 of the claimed subject matter, which preferably includescooling tubes assembly 846 communicating with an air handling unit 848 (also referred to herein as a fluid handling unit 848) by way of aninlet conduit assembly 850 and anoutlet conduit assembly 852.FIG. 24 further shows that the exemplary open loopheat exchange system 844 preferably includes aheat exchanger 854 disposed between theoutlet conduit assembly 852 and theair handling unit 848. -
FIG. 25 shows that in a preferred embodiment, thecooling tubes assembly 846 includes anoutlet manifold 856 supporting athermal dispersion baffle 858, and communicating with a plurality ofoutlet cooling tubes 860.FIG. 25 further shows, that in the preferred embodiment, thecooling tubes assembly 846 includes aninlet manifold 862 communicating with a plurality ofinlet cooling tubes 864, and a pair of tube retention assemblies, 866 and 868 respectfully, separating and securing the 860 and 864 on to the other.cooling tubes assemblies - Returning to
FIG. 24 , the preferredoutlet conduit assembly 852 includes anoutlet header 870 in communication with theoutlet manifold 856, anaccumulator 872 cooperating with and disposed between theoutlet header 870 and areturn line 874. Preferably, thereturn line 874 interconnects directly with theheat exchanger 854. It is noted that a ThermaSys Heat Exchanger Part No. SSC-1260-0, by ThermaSys Corporation of Montgomery, Ala., USA, has been found to be useful as a heat exchanger for use in the claimed subject matter, but is not a required heat exchanger for use in the claimed subject matter. -
FIG. 24 further shows the preferredinlet conduit assembly 850 includes aninlet header 876 in communication with theinlet manifold 862, aninlet accumulator 878 cooperating with theinlet header 876 and asupply line 880. Also shown byFIG. 24 , is asource line 882 connected directly into afirst isolation valve 884, which front ends theair handling unit 848, and asecond isolation valve 886 disposed between and interconnected directly with each theair handling unit 848 and thesupply line 880. Thefirst isolation valve 884 is disposed between and is in fluid communication with, theheat exchanger 854 and thefluid handling unit 848, while thesecond isolation valve 886 is disposed between and in fluid communication with thefluid handling unit 848 and thecooling tubes assembly 846. -
FIG. 26 shows a right side view in elevation of thecooling tubes assembly 846, which preferably includes theoutlet manifold 856 supporting the first set of thermal dispersion baffles 858, and theinlet manifold 862 supporting a secondthermal dispersion baffle 888. -
FIG. 27 depicts a right side view in elevation of a preferred embodiment of acooling tubes assembly 890, which preferably includes theoutlet manifold 856 supporting the first set of thermal dispersion baffles 858, and theinlet manifold 862 supporting a secondthermal dispersion baffle 888. -
FIG. 28 illustrates in cross section, thecooling tubes assembly 846 positioned within theprocess chamber 106 of thethermal chamber 100.FIG. 28 further shows thecooling tubes assembly 846 secured to thecollar 109. It will be noted that in this embodiment, theoutlet cooling tubes 860 project to about the mid-point of theprocess chamber 106. This particular embodiment has been shown to produce quite favorable results. The remaining sign numbers shown byFIG. 28 , replicate the sign numbers forFIG. 6 . Accordingly, a review of the discussion ofFIG. 6 will aid in an understanding of other structural features of thethermal chamber 100. - Returning again to
FIG. 24 , thefirst isolation valve 884 communicates with theheat exchanger 854. In a preferred embodiment, theheat exchanger 854 includes aheat exchange core 892, afluid input port 894 communicating with theheat exchange core 892, afluid output port 896 communicating with theheat exchange core 892 and offset from saidfluid input port 894, acoolant input port 898 in fluid communication with theheat exchange core 892, and acoolant output port 900 in fluid communication with theheat exchange core 892 and offset from thecoolant input port 898 by theheat exchange core 892. - It is to be understood that even though numerous characteristics and advantages of various embodiments of the present invention have been set forth in the foregoing description, together with details of the structure and function of various embodiments of the invention, this detailed description is illustrative only, and changes may be made in detail, especially in matters of structure and arrangements of parts within the principles of the present claimed invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. For example, the particular elements may vary depending on the particular application without departing from the spirit and scope of the present claimed invention.
- It will be clear that the present invention is well adapted to attain the ends and advantages mentioned as well as those inherent therein. While presently preferred embodiments have been described for purposes of this disclosure, numerous changes may be made which will readily suggest themselves to those skilled in the art and which are encompassed by the appended claims.
Claims (20)
1. An apparatus comprising:
a frame supporting a containment chamber;
a sealed process chamber confined within the containment chamber;
at least one fluid inlet box in fluidic communication with an exterior of the sealed process chamber, the fluid inlet box including at least a flow adjustment structure to control a fluid flow from a fluid source around the exterior of the sealed process chamber; and
an open loop heat exchange system in fluidic communication with an interior of the sealed process chamber, wherein the open loop heat exchange system includes cooling tubes that extend into the sealed process chamber.
2. The apparatus of claim 1 , further comprising:
a heat source module disposed between the containment chamber and the process chamber; and
a thermal sensor assembly disposed within an interior of the sealed process chamber contactingly adjacent a wall of the sealed thermal chamber, the thermal sensor assembly measures an internal temperature value of the sealed process chamber, and wherein the cooling tubes extend into the sealed process chamber a distance less than to a mid-point along the length of the sealed process chamber.
3. The apparatus of claim 1 , further comprising a controller communicating with the flow adjustment structure and the thermal sensor assembly, the controller sets a flow position of the flow adjustment structure to regulate fluid flow from the fluid source, through the fluid inlet box, and around the exterior of the sealed process chamber in response to the measured internal temperature value of the sealed process chamber, and wherein the cooling tubes extend into the sealed process chamber a distance to a mid-point portion of the sealed process chamber, along the length of the sealed process chamber.
4. The apparatus of claim 1 , in which the open loop heat exchange system comprising:
an inlet manifold communicating with a collar secured to said sealed process chamber, wherein said collar is adjacent an open end of said sealed process chamber; and
an outlet manifold communicating with said collar and offset from said inlet manifold, and wherein the cooling tubes extend into the sealed process chamber a distance beyond a mid-point portion of the sealed process chamber, along the length of the sealed process chamber.
5. The apparatus of claim 1 , in which the cooling tubes of the open loop heat exchange system comprising:
an inlet cooling tube adjacent an interior surface of said sealed process chamber; and
an outlet cooling tube adjacent said interior surface of said sealed process chamber and offset from said inlet cooling tube, and wherein each the inlet cooling tube and the outlet cooling tube extend a distance adjacent a mid-point portion of the sealed process chamber, along the length of the sealed process chamber.
6. The apparatus of claim 1 , in which the open loop heat exchange system comprising:
an inlet header adjacent an exterior surface of a collar secured to said sealed process chamber, wherein said collar is further adjacent an end of said containment chamber; and
an outlet header adjacent said end of said containment chamber and offset from said inlet header.
7. The apparatus of claim 1 , in which the open loop heat exchange system comprising:
an inlet accumulator adjacent an exterior surface of said containment chamber; and
an outlet accumulator adjacent said exterior surface of said containment chamber and offset from said inlet accumulator.
8. The apparatus of claim 1 , in which the open loop heat exchange system comprising:
a fluid supply conduit adjacent an exterior surface of said containment chamber; and
a fluid return conduit adjacent said exterior surface of said containment chamber and offset from said fluid supply conduit.
9. The apparatus of claim 1 , in which the open loop heat exchange system comprising, a heat exchanger adjacent an exterior surface of said containment chamber, and in which said heat exchanger comprises:
a heat exchange core;
a coolant input port communicating with said heat exchange core;
a coolant output port communicating with said heat exchange core and offset from said coolant input port;
a fluid input port in fluid communication with said heat exchange core; and
a fluid output port in fluid communication with said heat exchange core and offset from said fluid input port.
10. The apparatus of claim 1 , in which the open loop heat exchange system comprising, a fluid handling unit for exchanging fluid contained internal to said sealed process chamber.
11. An apparatus comprising:
a frame supporting a containment chamber;
a sealed process chamber confined within the containment chamber;
at least one fluid inlet box in fluidic communication with an exterior of the sealed process chamber, the fluid inlet box including at least a flow adjustment structure to control a fluid flow from a fluid source around the exterior of the sealed process chamber;
an open loop heat exchange system in fluidic communication with an interior of the sealed process chamber;
a controller communicating with the flow adjustment structure; and
a control signal buss communicating with at least the flow adjustment structure, and the controller, the control signal buss sends a control signal to the flow adjustment structure in response to measured internal temperature value of an interior of said sealed process chamber, wherein the open loop heat exchange system includes cooling tubes that extend into the sealed process chamber.
12. The apparatus of claim 11 , in which the open loop heat exchange system comprising:
an inlet manifold communicating with a collar secured to said sealed process chamber, wherein said collar is adjacent an open end of said sealed process chamber; and
an outlet manifold communicating with said collar and offset from said inlet manifold.
13. The apparatus of claim 12 , in which the open loop heat exchange system further comprising:
an inlet cooling tube adjacent an interior surface of said sealed process chamber; and
an outlet cooling tube adjacent said interior surface of said sealed process chamber and offset from said inlet cooling tube.
14. The apparatus of claim 13 , in which the open loop heat exchange system further comprising:
an inlet header adjacent an exterior surface of a collar secured to said sealed process chamber, wherein said collar is further adjacent an end of said containment chamber; and
an outlet header adjacent said end of said containment chamber and offset from said inlet header.
15. The apparatus of claim 14 , in which the open loop heat exchange system further comprising:
an inlet accumulator adjacent an exterior surface of said containment chamber; and
an outlet accumulator adjacent said exterior surface of said containment chamber and offset from said inlet accumulator.
16. The apparatus of claim 15 , in which the open loop heat exchange system further comprising:
a fluid supply conduit adjacent an exterior surface of said containment chamber; and
a fluid return conduit adjacent said exterior surface of said containment chamber and offset from said fluid supply conduit.
17. The apparatus of claim 16 , in which the open loop heat exchange system further comprising, a heat exchanger adjacent an exterior surface of said containment chamber, and in which said heat exchanger comprises:
a heat exchange core;
a coolant input port communicating with said heat exchange core;
a coolant output port communicating with said heat exchange core and offset from said coolant input port;
a fluid input port with said heat exchange core; and
a fluid output port communicating with said heat exchange core and offset from said fluid input port.
18. The apparatus of claim 17 , in which the open loop heat exchange system further comprising, a fluid handling unit for exchanging a fluid contained internal to said sealed process chamber.
19. The apparatus of claim 18 , in which the open loop heat exchange system further comprising;
a first isolation valve disposed between said fluid supply conduit and said fluid handling unit; and
a second isolation valve disposed between said fluid return conduit and said fluid handling unit.
20. The apparatus of claim 18 , in which the open loop heat exchange system further comprising;
a first set of thermal dispersion baffles secured to said inlet manifold; and
a second set of thermal dispersion baffles secured to said outlet manifold, wherein said first and said second thermal dispersion baffles mitigate transfer of heat from internal said sealed process chamber to a door sealing said sealed process chamber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/769,433 US20130153201A1 (en) | 2010-12-30 | 2013-02-18 | Thermal diffusion chamber with cooling tubes |
| PCT/US2013/029769 WO2014126592A1 (en) | 2013-02-18 | 2013-03-08 | Thermal diffusion chamber with cooling tubes |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/982,224 US20120168143A1 (en) | 2010-12-30 | 2010-12-30 | Thermal Diffusion Chamber With Heat Exchanger |
| US13/769,433 US20130153201A1 (en) | 2010-12-30 | 2013-02-18 | Thermal diffusion chamber with cooling tubes |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/982,224 Continuation-In-Part US20120168143A1 (en) | 2010-12-30 | 2010-12-30 | Thermal Diffusion Chamber With Heat Exchanger |
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| US20130153201A1 true US20130153201A1 (en) | 2013-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| US13/769,433 Abandoned US20130153201A1 (en) | 2010-12-30 | 2013-02-18 | Thermal diffusion chamber with cooling tubes |
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| US11434032B2 (en) | 2017-12-11 | 2022-09-06 | Glaxosmithkline Intellectual Property Development Limited | Modular aseptic production system |
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