US20130118717A1

US20130118717A1 - Heat-dissipating device and method for fabricating the same

Info

Publication number: US20130118717A1
Application number: US13/298,239
Authority: US
Inventors: Chun-Hung Lin; Han Lin Chen; Hsuan Hao Pai
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Development Corp
Priority date: 2011-11-16
Filing date: 2011-11-16
Publication date: 2013-05-16

Abstract

A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention is related to a heat-dissipating device and method for fabricating the same. In particular, the present invention relates to a heat-dissipating device having a heat pipe with fin plates to dissipate heat produced by electrical device, and a method for fabricating the heat-dissipating device.
2. Description of Related Art
Because of the speedy development of electronic technology, more and more electrical devices are equipped with a heat-dissipating device having heat pipe. The heat pipe is used to quickly dissipating the waste heat produced by the electronic devices.
The conventional way to fix the heat pipe to the electrical devices usually uses soldering tin to solder the heat pipe to the fin plates. The soldering process usually uses a reflow oven with high temperature. However, the development tendency of environmental protection limits the usage of soldering tin, which is becoming more and more restrictive.
Thus, there is an urgent desire to develop a heat-dissipating device, which can fix the heat pipe to contact the fin plates steadily and does not need soldering tin, complied with the development tendency of environmental protection.
Therefore, it is desirable to propose a heat-dissipating device to overcome the above-mentioned problems.

SUMMARY OF THE INVENTION

The present disclosure provides heat-dissipating device, which utilizes the fin plates to fix a cover board, and fix the heat pipe between the cover board and the fin plates. The present disclosure does not need soldering tin to fix the heat-pipe to the fin plates.
Another object of the present invention is to provide a method for fabricating the aforesaid heat-dissipating device.
According to one aspect of the present invention, the present disclosure provides a heat-dissipating device, which includes a plurality of fin plates arranged in contiguous manner, a heat pipe and a cover board. Each of the fin plates has at least one fixing tab protruded from a top edge thereof and a supporting portion arranged between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tab. The heat pipe having a part disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and are fixed with the cover board.
According to another aspect of the present invention, a method for fabricating a heat-dissipating device, comprising steps as followed:
providing a plurality of fin plates, and forming at least one fixing tab on a top edge of each fin plate;
forming a supporting portion between the fixing tabs, and defining an accommodating space between the supporting portion and the fixing tabs;
providing a heat pipe, and disposing one part of the heat pipe in the accommodating space;
providing a cover board, and forming a plurality of slits on the cover board corresponding to the fixing tabs; and
passing the fixing tabs through the slits and fixing to the cover board.
Thus, the present disclosure has advantages as followed. The present disclosure does not use soldering tin during the fabricating process, and does not pass a reflow oven of high temperature. Not only the cost is reduced, but the development tendency of environmental protection is complied with.
For further understanding of the present disclosure, reference is made to the following detailed description illustrating the embodiments and examples of the present disclosure. The description is for illustrative purpose only and is not intended to limit the scope of the claim.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective exploded view of a heat-dissipating device of the present disclosure;

FIG. 2 is a side view of the heat-dissipating device of the present disclosure;

FIG. 3 is another side view of the heat-dissipating device of the present disclosure;

FIG. 4 is an assembled side view of the heat-dissipating device of the present disclosure;

FIG. 5 is a perspective assembled view of the heat-dissipating device of the present disclosure;

FIG. 6 is a perspective view of the heat-dissipating device of an applied embodiment according to the present disclosure;

FIG. 7 is a side view of the heat-dissipating device of second embodiment according to the present disclosure; and

FIG. 8 is a side view of the heat-dissipating device of third embodiment according to the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference is made to FIG. 1, which is perspective assembled view of the heat-dissipating device of the present disclosure. The present disclosure provides a heat-dissipating device 100, which includes a plurality of fin plates 10 arranged in a continuous manner, a heat pipe 20 and a cover board 30. This embodiment is only partially shown in this figure. The heat-dissipating device according to the present disclosure does not use soldering tin to fix the cover board 30 to the fin plates 10 and provides the method to make the same. The following introduces heat-dissipating device 100 and the fabricating method in detail with referring to figures.
Each fin plate 10 has at least one fixing tabs 12 located on a top surface thereof, and a supporting portion 15 formed between the fixing tabs 12. An accommodating space 150 is defined between the supporting portions 15 and the two fixing tabs 12. In this present embodiment, each of the fin plates 10 has two fixing tabs 12, but the quantity is not limited therefor. For example, each fin plate 10 has one fixing tab, and the fixing tabs are arranged in staggered manner. The fin plates of odd numbers have one fixing tab at left side, and the fin plats of even numbers have one fixing tab at right side. The supporting portion 15 of the fin plate 10 is partially bent from a top edge thereof and extended toward one side. Each of the fin plates 10 further includes two first connecting plates 11 and a second connecting plate 13. The two first connecting plates 11 are respectively arranged at two sides of the fixing tab 12 and bent from the top edge of the fin plate 10 toward one side. The second connecting plate 13 is bent from a bottom edge of the fin plate 10 and extended toward one side.
The heat pipe 20 has one part disposed in the accommodating space 150. The heat pipe 20 of this present disclosure can be a flat heat pipe, which uses the working liquid and the capillary structure enclosed therein to conduct heat quickly.
The cover board 30 forms a plurality of slits 32 which are corresponded to the fixing tabs 12. The fixing tabs 12 pass through the slits 32 and are fixed to the cover board 30. The top end of the fixing tabs 12 are bent toward one side and pressed against the top surface of the cover board 30. The cover board 30 can be metal board or plastic board. The cover board 30 usually is disposed on a circuit board of the electrical device, and it preferably is heat-insulation board in this condition. But it is not limited thereto.
Please refer to FIG. 2, which is a side view of the heat-dissipating device of the present disclosure. The method for fabricating the above-mentioned heat-dissipating device according to the present disclosure includes steps as followed.
a), a plurality of fin plates 10 is provided, and to form a pair of fixing tabs 12 on a top surface of each fin plate 10;
b), to form a supporting portion 15 between the pair of fixing tabs 12, and define an accommodating space 150 between the supporting portion 15 and the fixing tabs 12;
c), a heat pipe 20 is provided, and one part of the heat pipe 20 is disposed in the accommodating space 150;
d), a cover board 30 is provided, and to form a plurality of slits 32 on the cover board 30 corresponding to the fixing tabs 12;
e), the fixing tabs 12 pass through the slits 32 and are fixed to the cover board 30.
In the step e) of fixing the cover board 30, this embodiment further includes the step of bending the top end of the fixing tabs 12 to press against the top surface of the cover board 30. To bend the fixing tabs 12, the present disclosure additionally provides a shaping tool 9 to bend the top end of the fixing tabs 12. The shaping tool 9 can be board-shaped and has a plurality of pressing weights 92 protruded from a bottom surface thereof to press the fixing tab 12.
Each of the fixing tab 12 has a top end 12 a protruded beyond the cover board 30, and a root portion 12 b located under the cover board 30. To make the fixing tabs 12 smoothly bent toward one identical side, firstly, the top ends 12 a of the fixing tabs 12 are bent toward one identical side obliquely. For example, to move the shaping tool 9 along the top surface of the cover board 30 to slightly press the top ends 12 a of the fixing tabs 12, so that the top ends 12 a are oblique related to the root portions 12 b under the slits 32.
Then, the pressing weights 92 of the shaping tool 9 are aligned to the slanted top ends 12 a of the fixing tabs 12, respectively. Following, the shaping tool 9 is moved downward to flat the top ends 12 a against the cover board 30, and the fixing step is finished. The shaping tool 9 illustrated in the foresaid embodiment is just one example, and it is not limited thereto.
Please refer to FIG. 3, which shows a shaping tool of another embodiment. The pressing weights 92 a of the shaping tool 9 a are shaped in sawtooth and each pressing weight 92 a has an oblique surface 921. After the cover board 30 is disposed on the fin plates 10, the oblique surface 921 of the pressing weights 92 a can be used to directly press the top ends 12 a of the fixing tabs 12 in oblique manner. Then, the shaping tool 9 a is moved horizontally along the top surface of the cover board 30, then the top ends 12 a can be flatted and tightly press against the cover board 30.
As shown in FIGS. 4 and 5, the heat-dissipating device 100 according to the present disclosure has been assembled. It does not need soldering tin any more, but uses the fin plates 10 themselves to fix the cover board 30, which complies with the development tendency of environmental protection. The cover board 30 presses the heat pipe 20 to against the fin plates 10.
Please refer to FIG. 6, which is an applied embodiment of the heat-dissipating device according to the present disclosure. The cover board 30 further extends an extending portion 34 from one side thereof A heat-dissipating fan 50 is fixed on the extending portion 34 and adjacent to the fin plates 10. The heat-dissipating fan 50 can blow the fin plates 10 to accelerate heat-dissipating efficiency.
Please refer to FIG. 7, which is a side view of the heat-dissipating device of second embodiment according to the present disclosure. This embodiment further includes at least one elastic leaf 36 a, which is disposed on the bottom surface of the cover board 30 and elastically pressed against the top surface of the heat pipe 20. A pair of elastic leafs 36 a is provided in this embodiment. Each elastic leaf 36 a has one end fixed to the cover board 30 and the other end pressed on the heat pipe 20, so that the heat pipe 20 can be tightly against the fin plates 10.
Please refer to FIG. 8, which is a side view of the heat-dissipating device of third embodiment according to the present disclosure. This embodiment further includes at least one thermal-insulating pad 38, which is disposed between the cover board 30 and the heat pipe 20. The thermal-insulating pad 38 preferably is made of elastic material. Not only the heat pipe 20 can be tightly against the fin plates 10, but also the cover board 30 can be insulated from heat to avoid conducting to the electrical device.
According to the present disclosure, the heat-dissipating device and the method for fabricating the same have advantages as followed. It does not need soldering tin to fix the heat pipe to the fin plates. The heat-dissipating device does not pass reflow oven of high temperature, so that the heat pipe 20 can avoid high-temperature processing and damage. Further, the present disclosure can reduce total cost, and complies with the development tendency of environmental protection.
The description above only illustrates specific embodiments and examples of the present disclosure. The present disclosure should therefore cover various modifications and variations made to the herein-described structure and operations of the present disclosure, provided they fall within the scope of the present invention as defined in the following appended claims.

Claims

What is claimed is:

1. A heat-dissipating device, comprising:

a plurality of fin plates, arranged in contiguous manner, each of the fin plates including:

at least one fixing tab protruded from a top edge thereof; and

a supporting portion arranged adjacent to the at least one fixing tab;

wherein an accommodating space is defined between the supporting portions and the fixing tabs;

a heat pipe having a part disposed in the accommodating space; and

a cover board formed with a plurality of slits corresponding to the fixing tabs, wherein the fixing tabs pass through the slits and is fixed with the cover board.

2. The heat-dissipating device of claim 1, wherein the supporting portion of the fin plates are bent partially from a top edge thereof toward one side.

3. The heat-dissipating device of claim 1, wherein each of the fin plates further includes a first connecting plate and a second connecting plate, wherein the first connecting plate is located at an outer side of the fixing tab and is bent from a top edge of the fin plate toward one side, wherein the second connecting plate is bent from a bottom edge of the fin plate toward one side.

4. The heat-dissipating device of claim 1, wherein each of the fixing tabs has a top end bent toward one side and press against a top surface of the cover board.

5. The heat-dissipating device of claim 1, wherein the cover board further includes an extending portion extended toward one side, and a heat-dissipating fan is fixed on the extending portion adjacent the fin plates.

6. The heat-dissipating device of claim 1, further comprising at least one elastic leaf disposed on a bottom surface of the cover board and elastically against a top surface of the heat pipe.

7. The heat-dissipating device of claim 1, further comprising at least one thermal-insulating pad disposed between the cover board and the heat pipe.

8. The heat-dissipating device of claim 1, wherein the cover board is a metal board or a plastic board.

9. A method for fabricating a heat-dissipating device, comprising steps as followed:

providing a plurality of fin plates, and forming at least one fixing tab on a top edge of each fin plate;

forming a supporting portion between the fixing tabs, and defining an accommodating space between the supporting portion and the fixing tabs;

providing a heat pipe, and disposing one part of the heat pipe in the accommodating space;

providing a cover board, and forming a plurality of slits on the cover board corresponding to the fixing tabs; and

passing the fixing tabs through the slits and fixing to the cover board.

10. The method for fabricating a heat-dissipating device of claim 9, wherein the step of fixing the cover board further comprises a step of bending a top end of the fixing tab to press against a top surface of the cover board.

11. The method for fabricating a heat-dissipating device of claim 10, further comprising a step of providing a shaping tool to bend the top end of the fixing tab.

12. The method for fabricating a heat-dissipating device of claim 11, wherein the shaping tool has a plurality of pressing weights protruded from a bottom surface thereof to press the fixing tab.

13. The method for fabricating a heat-dissipating device of claim 12, wherein the pressing weights are shaped in sawtooth, and each of the pressing weights has an oblique surface.

14. The method for fabricating a heat-dissipating device of claim 11, wherein the step of bending the top end of the fixing tab includes a step of moving the shaping tool along the top surface of the cover board.

15. The method for fabricating a heat-dissipating device of claim 11, further comprising a step of moving the shaping tool downward to flat the top ends against the cover board.

16. The method for fabricating a heat-dissipating device of claim 11, wherein the fin plates of odd numbers have one fixing tab at left side, and the fin plats of even numbers have one fixing tab at right side.