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US20120181008A1 - Heat sink clip device - Google Patents

Heat sink clip device Download PDF

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Publication number
US20120181008A1
US20120181008A1 US13/008,593 US201113008593A US2012181008A1 US 20120181008 A1 US20120181008 A1 US 20120181008A1 US 201113008593 A US201113008593 A US 201113008593A US 2012181008 A1 US2012181008 A1 US 2012181008A1
Authority
US
United States
Prior art keywords
heat sink
clip device
sink clip
diameter portion
thermal conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/008,593
Inventor
I-Yung Lin
Po-Chih Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Chaun Choung Technology Corp
Original Assignee
Chaun Choung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to US13/008,593 priority Critical patent/US20120181008A1/en
Assigned to CHAUN-CHOUNG TECHNOLOGY CORP. reassignment CHAUN-CHOUNG TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, I-YUNG, LIU, PO-CHIH
Publication of US20120181008A1 publication Critical patent/US20120181008A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/08—Fastening; Joining by clamping or clipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a fixture, especially for a clip device used for a heat sink.
  • the heat generation also substantially increases. Therefore, the heat generated by the electronic components needs to be dissipated by the heat sink device to control the working temperature in order to maintain the electronic components in a normal operation.
  • the heat sink device needs the clip to secure it to the base of the electronic components.
  • the heat sink device includes a thermal conductive board attached to the electronic components, and a heat dissipating unit such as heat dissipating fins or heat pipes.
  • the thermal conductive board can usually be secured by screws as the locking member.
  • the screw includes a ring slot which can be engaged with a C-shaped ring. During the installation, the screw is provided with an elastic unit, then the screw goes through the thermal conductive board and is secured on the base, and finally the C-shaped ring is engaged with the ring slot to prevent screw from loosening.
  • the size of the C-shaped ring is small.
  • tools need to be used to engage the C-shaped ring with the ring slot, which makes it inconvenient in the installation process.
  • the C-shaped ring might be destroyed by forced opening and will probably not be reused.
  • the present invention provides a heat sink clip device, whose simple structure and convenient and speedy installation makes it very easy to be assembled and disassembled.
  • a heat sink clip device of the present invention is configured to secure a heat sink to a heat generating unit.
  • the heat sink clip device comprises a thermal conductive board and a plurality of locking members.
  • the thermal conductive board is attached to the heat generating unit.
  • the thermal conductive boarding includes a plurality of connecting apertures, and each connecting aperture includes a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion.
  • a plurality of locking members is respectively engaged with the connecting apertures.
  • Each locking member includes a threaded member and an elastic unit sheathed on the threaded member.
  • the threaded member includes a bar portion a head portion and a blocking ring. The head portion and the blocking ring are respectively attached to both sides of the bar portion.
  • the diameter of the bar portion is a little bit smaller than the size of the smaller diameter portion.
  • the outside diameter of the blocking ring is a little bit smaller than the size of the bigger diameter portion.
  • the inside diameter of the elastic unit is a little bit bigger than the outside diameter of the blocking ring.
  • This invention also provides a heat sink clip device, which may be suitable to relatively small thermal conductive board and may increase the flexibility of the present invention because the connecting aperture is formed on the periphery of the thermal conductive board.
  • This invention further provides a heat sink clip device, whose blocking ring is provided on top of the base to prevent the threaded members from being over-screwed, to prevent the threaded members from destroying the base during the securing process and to increase the utility of the present invention.
  • the heat sink clip device of the present invention includes a blocking ring provided with one or more threaded members.
  • the corresponding connecting apertures may be formed on the thermal conductive board to let the threaded members go through and be secured.
  • C-shaped ring need not be used and the tool to open the C-shaped ring need not be used, either.
  • the blocking ring is provided on top of the base to prevent the threaded members from being over-screwed, to prevent the threaded members from destroying the base during the securing process and to increase the utility of the present invention.
  • the connecting aperture may also be formed on the periphery of the thermal conductive board in order to decrease the installation area of the connecting aperture and therefore to increase the flexibility of the present invention.
  • FIG. 1 is a schematic illustration of one embodiment of the heat sink clip device of the present invention.
  • FIG. 2 is a schematic illustration of combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 3 is a schematic illustration of passing through position of one embodiment of the threaded member of the present invention.
  • FIG. 4 is a sectional view of the combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 5 is a schematic illustration of the invention of one embodiment of the heat sink clip device of the present invention.
  • FIG. 6 is a schematic illustration of the invention and combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 7 shows the second embodiment of the heat sink clip device of the present invention.
  • FIG. 8 is the sectional view of the combination of the second embodiment of the heat sink clip device of the present invention.
  • FIG. 9 shows the third embodiment of the heat sink clip device of the present invention.
  • FIG. 10 is the sectional view of the combination of the third embodiment of the heat sink clip device of the present invention.
  • FIG. 11 shows the fourth embodiment of the heat sink clip device of the present invention.
  • FIG. 12 shows another pattern of the elastic unit of the heat sink clip device to be used in the first embodiment.
  • FIG. 13 shows another pattern of the elastic unit of the heat sink clip device to be used in the second embodiment.
  • FIG. 14 shows another pattern of the elastic unit of the heat sink clip device to be used in the third embodiment.
  • FIG. 15 shows another pattern of the elastic unit of the heat sink clip device to be used in the fourth embodiment.
  • FIG. 1 to FIG. 4 are respectively a schematic illustration of one embodiment of the heat sink clip device of the present invention, a schematic illustration of combination of one embodiment of the heat sink clip device of the present invention, a schematic illustration of passing through position of one embodiment of the threaded member of the present invention and a sectional view of the combination of one embodiment of the heat sink clip device of the present invention.
  • a heat sink clip device 1 of the present invention may be configured to secure a heat sink 2 .
  • the heat sink 2 may comprise a flattened heat dissipating tube 3 and a group of heat dissipating fins 4 connected to the flattened heat dissipating tube 3 .
  • the heat sink clip 1 may comprise a thermal conductive board 10 and a plurality of locking members 20 .
  • the flattened heat dissipating tube 3 may be attached to the thermal conductive board 10 .
  • the thermal conductive board 10 may include a plurality of connecting apertures 11 .
  • Each connecting aperture 11 may include a bigger diameter portion 12 and a smaller diameter portion 13 connected to the bigger diameter portion 12 .
  • the thermal conductive board 10 may be a rectangular board.
  • the connecting apertures 11 may be provided inside of the thermal conductive board 10 .
  • the bigger diameter portion 12 and the smaller diameter portion 13 may be both arc apertures to make the whole connecting aperture 11 a gourd shape.
  • the locking members 20 may respectively go through the connecting apertures 11 .
  • the locking member 20 may include a threaded member 21 and an elastic unit 22 sheathed the threaded member 21 .
  • the threaded member 21 may include a bar portion 210 , a head portion 211 and a blocking ring 212 .
  • the head portion 211 and the blocking ring 212 may be respectively attached to both sides of the bar portion 210 .
  • the diameter of the bar portion 210 may be a little bit smaller than the size of the smaller diameter portion 13 .
  • the outside diameter of the blocking ring 212 may be a little bit smaller than the size of the bigger diameter portion 12 .
  • the inside diameter of the elastic unit 22 may be a little bit bigger than the outside diameter of the blocking ring 212 .
  • the threaded member 21 may be a screw.
  • the head portion 211 may be a screw head.
  • the threaded member 21 may form a threaded portion 213 outside of the blocking ring 212 .
  • the size of the smaller diameter portion 13 may be bigger than the diameter of the bar portion 210 for about 0.2-0.3 mm.
  • the size of the bigger diameter portion 12 may be bigger than the outside diameter of the blocking ring 212 for about 0.2-0.3 mm.
  • there is a neck portion 14 between the bigger diameter portion 12 and the smaller diameter portion 13 there is a neck portion 14 between the bigger diameter portion 12 and the smaller diameter portion 13 .
  • the width of the neck portion 14 may be a little bit smaller than the diameter of the bar portion 210 , for example, smaller by about 0.1 mm.
  • the elastic unit 22 may be a spring.
  • the elastic unit 22 When the locking members 20 are installed, firstly let the elastic unit 22 go through both thread portion 213 and blocking ring 212 in order to be sheathed on the bar portion 210 , then let both the bar portion 210 of the threaded member 21 and the blocking ring 212 go through the bigger diameter portion 12 , and afterwards, push the bar portion 210 in the direction of the neck portion 14 and the smaller diameter portion 13 . Because the size of the neck portion 14 and the smaller diameter portion 13 are both a little bit smaller than the diameter of the bar portion 210 , the bar portion 210 will be positioned in the smaller diameter portion 13 .
  • FIG. 5 and FIG. 6 are respectively a schematic illustration of the invention of one embodiment of the heat sink clip device of the present invention and a schematic illustration of the invention and combination of one embodiment of the heat sink clip device of the present invention.
  • the heat sink clip device 1 may be used to secure a heat sink to a heat generating unit 5 .
  • the heat generating unit 5 may be attached to an electronic board 6 .
  • the electronic board 6 may include a plurality of keyholes 7 corresponding to the locking members 20 .
  • the threaded members 21 may be respectively secured to the keyholes 7 .
  • the key hole may be a threaded aperture.
  • the threaded members 21 may further include a threaded portion 213 .
  • the threaded portion 213 may be engaged with the threaded aperture.
  • the blocking ring 212 may be provided on the electronic board 7 .
  • the elastic unit 22 may be suppressed elastically between the head portion 211 and the thermal conductive board 10 .
  • FIG. 7 and FIG. 8 respectively shows the second embodiment of the heat sink clip device of the present invention and is the sectional view of the combination of the second embodiment of the heat sink clip device of the present invention.
  • This embodiment essentially the same with the former one, has the different features that the connecting aperture 11 a may be provided on the periphery of the thermal conductive board 10 a .
  • the structure can be used when the size of the thermal conductive board 10 a is relatively small but the connecting aperture 11 a need to be opened on the board.
  • the connecting aperture 11 a of this embodiment may include a bigger diameter portion 12 a and a smaller diameter portion 13 a connected to the bigger diameter portion 12 a .
  • the bigger diameter portion 12 a may be a long trough and the smaller diameter portion 13 a may be an arc aperture.
  • the long trough may be provided on the periphery of the thermal conductive board 10 a to form an opening 102 a .
  • the long trough may extend to be connected with the arc aperture.
  • the bigger diameter portion 12 a and the smaller diameter portion 13 a may form a neck 14 a in between.
  • the limitations of the size of the bigger diameter portion 12 a and the smaller diameter portion 13 a are essentially similar to those of the first embodiment.
  • the locking members 20 may be pushed into the opening 120 a of the connecting aperture 11 a .
  • the bar portion 210 of the threaded member 21 may be pushed in the direction of the neck portion 14 a and the smaller diameter portion 13 a to secure the bar portion 210 to the smaller diameter portion 13 a.
  • FIG. 9 and FIG. 10 shows the third embodiment of the heat sink clip device of the present invention and is the sectional view of the combination of the third embodiment of the heat sink clip device of the present invention.
  • the present embodiment is different than the first embodiment in the features that the thermal conductive board 10 b may extend to form a plurality of sleeves 14 b .
  • Each sleeve 14 b may include a surrounding piece 141 b attached to the thermal conductive board 10 b and a board piece 142 b attached to the surrounding piece 141 b .
  • the board piece 142 b may be provided with a connecting aperture 11 b .
  • the sleeves 14 b may form an installation space 140 b , which provides the locking member 20 a more steady installation space 140 b.
  • FIG. 11 shows the fourth embodiment of the heat sink clip device of the present invention.
  • the thermal conductive board 10 c may extend to form a plurality of sleeves 14 c .
  • Each sleeve 14 c may include a surrounding piece 141 c attached to the thermal conductive board 10 c and a board piece 142 c attached to the surrounding piece 141 c .
  • the board piece 142 c may be provided with a connecting aperture 11 c .
  • the difference between this embodiment and the third embodiment may be that the sleeves 14 c may be formed on the periphery 10 c to be a half-opened.
  • the connecting aperture 11 of the thermal conductive board 10 may include a plurality of locking members 20 ′.
  • the locking members 20 ′ may include a threaded member 21 and an elastic unit 22 ′ attached to the threaded member 21 .
  • the elastic unit 22 ′ may be an elastic piece and may include an opening 220 ′ to be engaged with the threaded member 21 .
  • the elastic piece may connect two threaded members 21 , that is, two adjacent threaded members 21 may be engaged with the same elastic piece.
  • the locking member 20 ′ may be engaged with the thermal conductive board 10 a where the connecting aperture 11 a is on the periphery of the thermal conductive board 10 a .
  • the thermal conductive board 10 b may extend from one side of the connecting aperture 11 b to form a surrounding piece 141 b attached to the thermal conductive board 10 b .
  • the thermal conductive board 10 c may extend from one side of the connecting aperture 11 c to form a surrounding piece 141 c attached to the thermal conductive board 10 c
  • the locking member 20 ′ may connect to the thermal conductive board 10 b and 10 c by the same method.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink clip device, configured to secure a heat sink to a heat generating unit, the heat sink clip comprises a thermal conductive board and a plurality of locking members. The thermal conductive board is attached to the heat generating unit. The thermal conductive board may include a plurality of connecting apertures. Each connecting aperture may include a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion. A plurality of locking members may be engaged with the corresponding connecting aperture. Each locking members may include a threaded member and an elastic unit sheathed on the threaded member. The threaded member may include a bar portion, a head portion and a blocking ring. The head portion and the blocking ring are respectively on both sides of the bar portion. The diameter of the bar portion may be a little bit smaller than the size of the smaller diameter portion. The outside diameter of the blocking ring may be a little bit smaller than the size of the bigger diameter portion. The inside diameter of the elastic unit may be a little bit bigger than the outside diameter of the blocking ring. The bar portion and the blocking ring may go through the bigger diameter portion and then may be secured to the smaller diameter portion. The elastic unit may be suppressed between the threaded member head and the thermal conductive board. This creates a heat sink clip device.

Description

    BACKGROUND
  • 1. Technical Field
  • The present invention relates to a fixture, especially for a clip device used for a heat sink.
  • 2. Related Art
  • Since the calculation speed of internal components of electronic products substantially increases, the heat generation also substantially increases. Therefore, the heat generated by the electronic components needs to be dissipated by the heat sink device to control the working temperature in order to maintain the electronic components in a normal operation.
  • Traditionally, the heat sink device needs the clip to secure it to the base of the electronic components. The heat sink device includes a thermal conductive board attached to the electronic components, and a heat dissipating unit such as heat dissipating fins or heat pipes. The thermal conductive board can usually be secured by screws as the locking member. The screw includes a ring slot which can be engaged with a C-shaped ring. During the installation, the screw is provided with an elastic unit, then the screw goes through the thermal conductive board and is secured on the base, and finally the C-shaped ring is engaged with the ring slot to prevent screw from loosening.
  • In the above structure, the size of the C-shaped ring is small. During the installation, tools need to be used to engage the C-shaped ring with the ring slot, which makes it inconvenient in the installation process. In addition, when the screw needs to be disassembled, the C-shaped ring might be destroyed by forced opening and will probably not be reused.
    • BRIEF SUMMARY
  • The present invention provides a heat sink clip device, whose simple structure and convenient and speedy installation makes it very easy to be assembled and disassembled.
  • A heat sink clip device of the present invention is configured to secure a heat sink to a heat generating unit. The heat sink clip device comprises a thermal conductive board and a plurality of locking members. The thermal conductive board is attached to the heat generating unit. The thermal conductive boarding includes a plurality of connecting apertures, and each connecting aperture includes a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion. A plurality of locking members is respectively engaged with the connecting apertures. Each locking member includes a threaded member and an elastic unit sheathed on the threaded member. The threaded member includes a bar portion a head portion and a blocking ring. The head portion and the blocking ring are respectively attached to both sides of the bar portion. The diameter of the bar portion is a little bit smaller than the size of the smaller diameter portion. The outside diameter of the blocking ring is a little bit smaller than the size of the bigger diameter portion. The inside diameter of the elastic unit is a little bit bigger than the outside diameter of the blocking ring. The bar portion and the blocking ring go through the bigger diameter portion and then are secured to the smaller diameter portion. The elastic unit is suppressed between the head portion and the thermal conductive board.
  • This invention also provides a heat sink clip device, which may be suitable to relatively small thermal conductive board and may increase the flexibility of the present invention because the connecting aperture is formed on the periphery of the thermal conductive board.
  • This invention further provides a heat sink clip device, whose blocking ring is provided on top of the base to prevent the threaded members from being over-screwed, to prevent the threaded members from destroying the base during the securing process and to increase the utility of the present invention.
  • Compared to the related arts, the heat sink clip device of the present invention includes a blocking ring provided with one or more threaded members. The corresponding connecting apertures may be formed on the thermal conductive board to let the threaded members go through and be secured. As a result, during the installation process, C-shaped ring need not be used and the tool to open the C-shaped ring need not be used, either. In addition, when the threaded members are secured to the base, the blocking ring is provided on top of the base to prevent the threaded members from being over-screwed, to prevent the threaded members from destroying the base during the securing process and to increase the utility of the present invention. Moreover, when the area of the thermal conductive board is relatively small, the connecting aperture may also be formed on the periphery of the thermal conductive board in order to decrease the installation area of the connecting aperture and therefore to increase the flexibility of the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:
  • FIG. 1 is a schematic illustration of one embodiment of the heat sink clip device of the present invention.
  • FIG. 2 is a schematic illustration of combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 3 is a schematic illustration of passing through position of one embodiment of the threaded member of the present invention.
  • FIG. 4 is a sectional view of the combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 5 is a schematic illustration of the invention of one embodiment of the heat sink clip device of the present invention.
  • FIG. 6 is a schematic illustration of the invention and combination of one embodiment of the heat sink clip device of the present invention.
  • FIG. 7 shows the second embodiment of the heat sink clip device of the present invention.
  • FIG. 8 is the sectional view of the combination of the second embodiment of the heat sink clip device of the present invention.
  • FIG. 9 shows the third embodiment of the heat sink clip device of the present invention.
  • FIG. 10 is the sectional view of the combination of the third embodiment of the heat sink clip device of the present invention.
  • FIG. 11 shows the fourth embodiment of the heat sink clip device of the present invention.
  • FIG. 12 shows another pattern of the elastic unit of the heat sink clip device to be used in the first embodiment.
  • FIG. 13 shows another pattern of the elastic unit of the heat sink clip device to be used in the second embodiment.
  • FIG. 14 shows another pattern of the elastic unit of the heat sink clip device to be used in the third embodiment.
  • FIG. 15 shows another pattern of the elastic unit of the heat sink clip device to be used in the fourth embodiment.
    •  DETAILED DESCRIPTION
  • Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that drawings do not limit the scope of the present invention.
  • Please refer from FIG. 1 to FIG. 4, which are respectively a schematic illustration of one embodiment of the heat sink clip device of the present invention, a schematic illustration of combination of one embodiment of the heat sink clip device of the present invention, a schematic illustration of passing through position of one embodiment of the threaded member of the present invention and a sectional view of the combination of one embodiment of the heat sink clip device of the present invention. A heat sink clip device 1 of the present invention may be configured to secure a heat sink 2. The heat sink 2 may comprise a flattened heat dissipating tube 3 and a group of heat dissipating fins 4 connected to the flattened heat dissipating tube 3. The heat sink clip 1 may comprise a thermal conductive board 10 and a plurality of locking members 20.
  • The flattened heat dissipating tube 3 may be attached to the thermal conductive board 10. The thermal conductive board 10 may include a plurality of connecting apertures 11. Each connecting aperture 11 may include a bigger diameter portion 12 and a smaller diameter portion 13 connected to the bigger diameter portion 12. In this embodiment, the thermal conductive board 10 may be a rectangular board. The connecting apertures 11 may be provided inside of the thermal conductive board 10. The bigger diameter portion 12 and the smaller diameter portion 13 may be both arc apertures to make the whole connecting aperture 11 a gourd shape.
  • The locking members 20 may respectively go through the connecting apertures 11. The locking member 20 may include a threaded member 21 and an elastic unit 22 sheathed the threaded member 21. The threaded member 21 may include a bar portion 210, a head portion 211 and a blocking ring 212. The head portion 211 and the blocking ring 212 may be respectively attached to both sides of the bar portion 210. The diameter of the bar portion 210 may be a little bit smaller than the size of the smaller diameter portion 13. The outside diameter of the blocking ring 212 may be a little bit smaller than the size of the bigger diameter portion 12. The inside diameter of the elastic unit 22 may be a little bit bigger than the outside diameter of the blocking ring 212.
  • In this embodiment, the threaded member 21 may be a screw. The head portion 211 may be a screw head. The threaded member 21 may form a threaded portion 213 outside of the blocking ring 212. In addition, the size of the smaller diameter portion 13 may be bigger than the diameter of the bar portion 210 for about 0.2-0.3 mm. The size of the bigger diameter portion 12 may be bigger than the outside diameter of the blocking ring 212 for about 0.2-0.3 mm. Furthermore, there is a neck portion 14 between the bigger diameter portion 12 and the smaller diameter portion 13. The width of the neck portion 14 may be a little bit smaller than the diameter of the bar portion 210, for example, smaller by about 0.1 mm.
  • Please refer to FIG. 3. In this embodiment, the elastic unit 22 may be a spring. When the locking members 20 are installed, firstly let the elastic unit 22 go through both thread portion 213 and blocking ring 212 in order to be sheathed on the bar portion 210, then let both the bar portion 210 of the threaded member 21 and the blocking ring 212 go through the bigger diameter portion 12, and afterwards, push the bar portion 210 in the direction of the neck portion 14 and the smaller diameter portion 13. Because the size of the neck portion 14 and the smaller diameter portion 13 are both a little bit smaller than the diameter of the bar portion 210, the bar portion 210 will be positioned in the smaller diameter portion 13.
  • Please refer to FIG. 5 and FIG. 6, which are respectively a schematic illustration of the invention of one embodiment of the heat sink clip device of the present invention and a schematic illustration of the invention and combination of one embodiment of the heat sink clip device of the present invention. The heat sink clip device 1 may be used to secure a heat sink to a heat generating unit 5. The heat generating unit 5 may be attached to an electronic board 6. The electronic board 6 may include a plurality of keyholes 7 corresponding to the locking members 20. The threaded members 21 may be respectively secured to the keyholes 7. As shown in FIG. 6, the key hole may be a threaded aperture. The threaded members 21 may further include a threaded portion 213. The threaded portion 213 may be engaged with the threaded aperture. The blocking ring 212 may be provided on the electronic board 7. Furthermore, the elastic unit 22 may be suppressed elastically between the head portion 211 and the thermal conductive board 10.
  • Please also refer to FIG. 7 and FIG. 8, which respectively shows the second embodiment of the heat sink clip device of the present invention and is the sectional view of the combination of the second embodiment of the heat sink clip device of the present invention. This embodiment, essentially the same with the former one, has the different features that the connecting aperture 11 a may be provided on the periphery of the thermal conductive board 10 a. The structure can be used when the size of the thermal conductive board 10 a is relatively small but the connecting aperture 11 a need to be opened on the board. Similarly, the connecting aperture 11 a of this embodiment may include a bigger diameter portion 12 a and a smaller diameter portion 13 a connected to the bigger diameter portion 12 a. In this embodiment, the bigger diameter portion 12 a may be a long trough and the smaller diameter portion 13 a may be an arc aperture. The long trough may be provided on the periphery of the thermal conductive board 10 a to form an opening 102 a. The long trough may extend to be connected with the arc aperture.
  • As shown in FIG. 8, the bigger diameter portion 12 a and the smaller diameter portion 13 a may form a neck 14 a in between. The limitations of the size of the bigger diameter portion 12 a and the smaller diameter portion 13 a are essentially similar to those of the first embodiment. The locking members 20 may be pushed into the opening 120 a of the connecting aperture 11 a. As a result, the bar portion 210 of the threaded member 21 may be pushed in the direction of the neck portion 14 a and the smaller diameter portion 13 a to secure the bar portion 210 to the smaller diameter portion 13 a.
  • Please refer to FIG. 9 and FIG. 10, which shows the third embodiment of the heat sink clip device of the present invention and is the sectional view of the combination of the third embodiment of the heat sink clip device of the present invention. The present embodiment is different than the first embodiment in the features that the thermal conductive board 10 b may extend to form a plurality of sleeves 14 b. Each sleeve 14 b may include a surrounding piece 141 b attached to the thermal conductive board 10 b and a board piece 142 b attached to the surrounding piece 141 b. The board piece 142 b may be provided with a connecting aperture 11 b. The sleeves 14 b may form an installation space 140 b, which provides the locking member 20 a more steady installation space 140 b.
  • Please refer to FIG. 11, which shows the fourth embodiment of the heat sink clip device of the present invention. The thermal conductive board 10 c may extend to form a plurality of sleeves 14 c. Each sleeve 14 c may include a surrounding piece 141 c attached to the thermal conductive board 10 c and a board piece 142 c attached to the surrounding piece 141 c. The board piece 142 c may be provided with a connecting aperture 11 c. The difference between this embodiment and the third embodiment may be that the sleeves 14 c may be formed on the periphery 10 c to be a half-opened.
  • Please refer to FIG. 12 to FIG. 15, which shows another pattern of the elastic unit of the heat sink clip device to be used in the first, second, third or fourth embodiment. As shown in FIG. 12, the connecting aperture 11 of the thermal conductive board 10 may include a plurality of locking members 20′. The locking members 20′ may include a threaded member 21 and an elastic unit 22′ attached to the threaded member 21. The elastic unit 22′ may be an elastic piece and may include an opening 220′ to be engaged with the threaded member 21. The elastic piece may connect two threaded members 21, that is, two adjacent threaded members 21 may be engaged with the same elastic piece.
  • In addition, in FIG. 13, the locking member 20′ may be engaged with the thermal conductive board 10 a where the connecting aperture 11 a is on the periphery of the thermal conductive board 10 a. In addition, as shown in FIG. 14 and FIG. 15, the thermal conductive board 10 b may extend from one side of the connecting aperture 11 b to form a surrounding piece 141 b attached to the thermal conductive board 10 b. The thermal conductive board 10 c may extend from one side of the connecting aperture 11 c to form a surrounding piece 141 c attached to the thermal conductive board 10 c The locking member 20′ may connect to the thermal conductive board 10 b and 10 c by the same method.
  • The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.

Claims (16)

1. An heat sink clip device, configured to secure a heat sink to a heat generating unit, the heat sink clip device comprising:
a thermal conductive board, attached to the heat generating unit, the thermal conductive board including a plurality of connecting apertures, each connecting aperture including a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion;
a plurality of locking members, respectively engaged with the connecting apertures, each locking member including a threaded member and an elastic unit sheathed on the threaded member, the threaded member including a bar portion, a head portion and a blocking ring, the head portion and the blocking ring being respectively attached to on both sides of the bar portion, the diameter of the bar portion being a little bit smaller than the size of the smaller diameter portion, the outside diameter of the blocking ring being a little bit smaller than the size of the bigger diameter portion, the inside diameter of the elastic unit being a little bit bigger than the outside diameter of the blocking ring, the bar portion and the blocking ring going through the bigger diameter portion and then being secured to the smaller diameter portion, the elastic unit being suppressed between the head portion and the thermal conductive board.
2. The heat sink clip device according to claim 1, wherein the connecting aperture is formed in the thermal conductive board.
3. The heat sink clip device according to claim 1, wherein the connecting aperture is formed on the periphery of the thermal conductive board.
4. The heat sink clip device according to claim 3, wherein the bigger diameter portion is a long trough, the smaller diameter portion is an arc aperture, the long trough is formed on the periphery of the thermal conductive board and has an opening, extending to be connected with the arc aperture.
5. The heat sink clip device according to claim 2, wherein the thermal conductive board extends to form a plurality of sleeves, each sleeve includes a surrounding piece and a board piece attached to the surrounding piece, and the board piece includes the connecting aperture.
6. The heat sink clip device according to claim 3, wherein the thermal conductive board extends to form a plurality of sleeves, each sleeve includes a surrounding piece and a board attached to the surrounding piece, and the board piece includes the connecting aperture.
7. The heat sink clip device according to claim 1, wherein the bigger diameter portion and the smaller diameter portion are respectively arc apertures to form a gourd shape of the connecting aperture.
8. The heat sink clip device according to claim 1, wherein the threaded member is a screw and the threaded member head is a screw head.
9. The heat sink clip device according to claim 1, wherein the size of the smaller diameter portion is bigger than the diameter of the bar portion for 0.2-0.3 mm.
10. The heat sink clip device according to claim 1, wherein a neck portion is included between the bigger diameter portion and the smaller diameter portion, and the width of the neck portion is a little bit smaller than the diameter of the bar portion.
11. The heat sink clip device according to claim 10, wherein the width of the neck portion is smaller than the bar portion for about 0.1 mm.
12. The heat sink clip device according to claim 1, wherein the heat generating unit connects to an electronic board, the electronic board respectively includes a plurality of keyholes, and the threaded members respectively are secured to the keyholes.
13. The heat sink clip device according to claim 12, wherein the keyhole is a threaded aperture, the threaded member further includes a threaded portion, the threaded portion is engaged with the thread hole, and the blocking ring is provided on the electronic board.
14. The heat sink clip device according to claim 1, wherein the elastic unit is a spring.
15. The heat sink clip device according to claim 1, wherein the elastic unit is an elastic piece, and the elastic unit is provided with an opening configured to be engaged with the threaded member.
16. The heat sink clip device according to claim 15, wherein the elastic piece connects the two threaded members, and the adjacent two threaded members are engaged with the same elastic piece.
US13/008,593 2011-01-18 2011-01-18 Heat sink clip device Abandoned US20120181008A1 (en)

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