US20120181000A1 - Heat dissipation assembly - Google Patents
Heat dissipation assembly Download PDFInfo
- Publication number
- US20120181000A1 US20120181000A1 US13/193,626 US201113193626A US2012181000A1 US 20120181000 A1 US20120181000 A1 US 20120181000A1 US 201113193626 A US201113193626 A US 201113193626A US 2012181000 A1 US2012181000 A1 US 2012181000A1
- Authority
- US
- United States
- Prior art keywords
- fins
- heat dissipation
- air channel
- dissipation assembly
- side faces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipation assemblies, and particularly relates to a heat dissipation assembly for removing heat from an electronic component.
- a commonly used heat dissipation component includes a heat sink mounted on a CPU.
- the heat sink may include a plurality of parallel fins and several heat pipes passing therethrough.
- a fan is mounted on the fins to dissipate heat from the fins.
- the heat dissipation efficiency is often low.
- FIG. 1 is an isometric and exploded view of an exemplary embodiment of a heat dissipation assembly.
- FIG. 2 is an enlarged view of the circled portion II of FIG. 1 .
- FIG. 3 is an isometric and assembled view of the heat dissipation assembly of FIG. 1 .
- a heat dissipation assembly in accordance with an exemplary embodiment includes a heat sink 10 and a fan 30 .
- the heat sink 10 includes a base 11 .
- a plurality of fins 13 is located on a top surface of the base 11 .
- a bottom surface of the base 11 thermally contacts a heat generating component 60 .
- the heat generating component 60 is a CPU, which is located on a printed circuit board 50 .
- Heat generated by the heat generating component 60 is transmitted to the base 11 , and then transmitted to the fins 13 .
- the fins 13 are parallel with each other.
- Each fin 13 includes two opposite side faces 131 .
- the two side faces 131 are symmetrical about a central line of the fin 13 .
- Each side face 13 is wavy, and includes a plurality of convexities 136 and a plurality of concavities 137 .
- the plurality of convexities 136 is interlaced with the plurality of concavities 137 . That is a convexity 136 being located between two concavities 137 and a concavity 137 being located between two convexities 136 . Because the side face 13 is wavy, it has a great surface area for better heat dissipation.
- An air channel 135 is formed between two adjacent side faces 131 of two adjacent fins 13 . Because the side faces 131 are waved, a width of the air channel 135 is not consistent.
- the width of the air channel 135 includes a plurality of wide portions 138 and a plurality of narrow portions 139 .
- the plurality of wide portions 138 are interlaced with the plurality of narrow portions 139 . That is a wide portion 138 being located between two narrow portions 139 and a narrow portion 138 being located between two wide portions 138 .
- the wide portion 138 corresponds to concavities 137 of the two adjacent side faces 131 .
- the narrow portion 139 corresponds to convexities 136 of the two adjacent side faces 131 .
- the fan 30 is mounted on the heat sink 10 , and located on a side of the air channels 135 .
- the fan 30 rotates to drive air through the air channels 135 .
- heat on adjacent concavities 137 are transmitted to the convexities 136 .
- heat on the heat sink 10 is dissipated quickly.
- the convexities 136 have greater areas than plane fins of conventional heat sink. Therefore, the heat dissipation assembly has great heat dissipation efficiency.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat dissipation assemblies, and particularly relates to a heat dissipation assembly for removing heat from an electronic component.
- 2. Description of Related Art
- With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements. The heat must be removed quickly. A commonly used heat dissipation component includes a heat sink mounted on a CPU. The heat sink may include a plurality of parallel fins and several heat pipes passing therethrough. A fan is mounted on the fins to dissipate heat from the fins. However, the heat dissipation efficiency is often low.
- Therefore, there is room for improvement within the art.
- Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric and exploded view of an exemplary embodiment of a heat dissipation assembly. -
FIG. 2 is an enlarged view of the circled portion II ofFIG. 1 . -
FIG. 3 is an isometric and assembled view of the heat dissipation assembly ofFIG. 1 . - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIGS. 1 to 3 , a heat dissipation assembly in accordance with an exemplary embodiment includes aheat sink 10 and afan 30. - The
heat sink 10 includes abase 11. A plurality offins 13 is located on a top surface of thebase 11. A bottom surface of thebase 11 thermally contacts aheat generating component 60. In one embodiment, theheat generating component 60 is a CPU, which is located on a printedcircuit board 50. Heat generated by theheat generating component 60 is transmitted to thebase 11, and then transmitted to thefins 13. Thefins 13 are parallel with each other. Eachfin 13 includes twoopposite side faces 131. The twoside faces 131 are symmetrical about a central line of thefin 13. Each side face 13 is wavy, and includes a plurality ofconvexities 136 and a plurality ofconcavities 137. The plurality ofconvexities 136 is interlaced with the plurality ofconcavities 137. That is aconvexity 136 being located between twoconcavities 137 and aconcavity 137 being located between twoconvexities 136. Because theside face 13 is wavy, it has a great surface area for better heat dissipation. - An
air channel 135 is formed between two adjacent side faces 131 of twoadjacent fins 13. Because the side faces 131 are waved, a width of theair channel 135 is not consistent. The width of theair channel 135 includes a plurality ofwide portions 138 and a plurality ofnarrow portions 139. The plurality ofwide portions 138 are interlaced with the plurality ofnarrow portions 139. That is awide portion 138 being located between twonarrow portions 139 and anarrow portion 138 being located between twowide portions 138. Thewide portion 138 corresponds toconcavities 137 of the two adjacent side faces 131. Thenarrow portion 139 corresponds to convexities 136 of the two adjacent side faces 131. When air flows in theair channel 135, air flows fast in thenarrow portions 139 and flows slow in thewide portions 138. - The
fan 30 is mounted on theheat sink 10, and located on a side of theair channels 135. Thefan 30 rotates to drive air through theair channels 135. Air flows fast in thenarrow portions 139, so heat on theconvexities 136 are dissipated quickly. After heat on theconvexities 136 are dissipated, heat onadjacent concavities 137 are transmitted to theconvexities 136. So, heat on theheat sink 10 is dissipated quickly. In another aspect, theconvexities 136 have greater areas than plane fins of conventional heat sink. Therefore, the heat dissipation assembly has great heat dissipation efficiency. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110021932.0 | 2011-01-19 | ||
CN2011100219320A CN102609060A (en) | 2011-01-19 | 2011-01-19 | Heat abstractor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120181000A1 true US20120181000A1 (en) | 2012-07-19 |
Family
ID=46489887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/193,626 Abandoned US20120181000A1 (en) | 2011-01-19 | 2011-07-29 | Heat dissipation assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120181000A1 (en) |
CN (1) | CN102609060A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222841A1 (en) * | 2011-03-03 | 2012-09-06 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20150144301A1 (en) * | 2013-11-26 | 2015-05-28 | Cooler Master (Hui Zhou) Co., Ltd. | Heat dissipating device |
US20230020100A1 (en) * | 2021-07-19 | 2023-01-19 | Coretronic Corporation | Heat dissipation module and projection device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107317557A (en) * | 2017-06-22 | 2017-11-03 | 成都希塔科技有限公司 | The system cooling system of high power power amplifier |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6279648B1 (en) * | 1996-01-27 | 2001-08-28 | Manfred Diels | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method |
US6470962B1 (en) * | 2001-08-24 | 2002-10-29 | Infortrend Technology Inc. | Retaining tool of heat radiator |
US20030161107A1 (en) * | 2002-02-27 | 2003-08-28 | Spark Electronic S.R.L. | Heat dissipater for integrated circuits |
US20040194927A1 (en) * | 2003-01-29 | 2004-10-07 | Lee Hsieh Kun | Fan holder |
US20090159255A1 (en) * | 1997-08-28 | 2009-06-25 | Giacomel Jeffrey A | Food preparation and storage device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW487298U (en) * | 2000-12-19 | 2002-05-11 | Global Win Technology Co Ltd | Non-uniform heat dissipation fins |
TWI267337B (en) * | 2003-05-14 | 2006-11-21 | Inventor Prec Co Ltd | Heat sink |
CN2682474Y (en) * | 2003-12-15 | 2005-03-02 | 智翎股份有限公司 | Radiating fin group |
CN101078949B (en) * | 2006-05-24 | 2010-05-12 | 富准精密工业(深圳)有限公司 | Radiator |
-
2011
- 2011-01-19 CN CN2011100219320A patent/CN102609060A/en active Pending
- 2011-07-29 US US13/193,626 patent/US20120181000A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6279648B1 (en) * | 1996-01-27 | 2001-08-28 | Manfred Diels | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method |
US20090159255A1 (en) * | 1997-08-28 | 2009-06-25 | Giacomel Jeffrey A | Food preparation and storage device |
US6470962B1 (en) * | 2001-08-24 | 2002-10-29 | Infortrend Technology Inc. | Retaining tool of heat radiator |
US20030161107A1 (en) * | 2002-02-27 | 2003-08-28 | Spark Electronic S.R.L. | Heat dissipater for integrated circuits |
US20040194927A1 (en) * | 2003-01-29 | 2004-10-07 | Lee Hsieh Kun | Fan holder |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222841A1 (en) * | 2011-03-03 | 2012-09-06 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US8737070B2 (en) * | 2011-03-03 | 2014-05-27 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation system |
US20150144301A1 (en) * | 2013-11-26 | 2015-05-28 | Cooler Master (Hui Zhou) Co., Ltd. | Heat dissipating device |
US20230020100A1 (en) * | 2021-07-19 | 2023-01-19 | Coretronic Corporation | Heat dissipation module and projection device |
US12189279B2 (en) * | 2021-07-19 | 2025-01-07 | Coretronic Corporation | Heat dissipation module and projection device |
Also Published As
Publication number | Publication date |
---|---|
CN102609060A (en) | 2012-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;ZENG, XIANG-KUN;YAO, ZHI-JIANG;AND OTHERS;REEL/FRAME:026677/0186 Effective date: 20110728 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;ZENG, XIANG-KUN;YAO, ZHI-JIANG;AND OTHERS;REEL/FRAME:026677/0186 Effective date: 20110728 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |