US20120031661A1 - Electromagnetic shielding device - Google Patents
Electromagnetic shielding device Download PDFInfo
- Publication number
- US20120031661A1 US20120031661A1 US12/968,427 US96842710A US2012031661A1 US 20120031661 A1 US20120031661 A1 US 20120031661A1 US 96842710 A US96842710 A US 96842710A US 2012031661 A1 US2012031661 A1 US 2012031661A1
- Authority
- US
- United States
- Prior art keywords
- frame
- shielding
- enclosure
- sidewalls
- shielding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Definitions
- the present disclosure relates to a shielding device for a printed circuit board, and particularly to a shielding device having a shielding enclosure that may be easily opened.
- Electronic components of a printed circuit board radiate electromagnetic waves which generate electronic noise or unwanted signals. Accordingly, it is highly desirable to provide shielding for electronic components of printed circuit boards, which are susceptible to electromagnetic radiation. Since the electric telecommunication equipment must withstand interference of electromagnetic radiation, a shielding device can be used to decrease radiation emission.
- the shielding device usually includes an enclosure and a frame.
- the enclosure is tightly latched to the frame.
- FIG. 1 is an exploded, isometric view of a shielding device.
- FIG. 2 is similar to FIG. 1 , but shown from another aspect.
- FIG. 3 is an assembled view of the shielding device shown in FIG. 1 .
- FIG. 4 is a cut-away view of FIG. 3 .
- FIG. 5 is similar to FIG. 3 but from a different angle and showing the enclosure in an opened state.
- the shielding device 100 in one illustrated first embodiment, is positioned on a printed circuit board 80 . Understandably, the shielding device 100 is used for shielding at least one electronic component 82 on the printed circuit board 80 .
- the shielding device 100 includes a frame 10 , a shielding enclosure 30 and a shaft 50 .
- the shielding enclosure 30 is hinged to the frame 10 by the shaft 50 so that the shielding enclosure 30 can be rotatably opened to access any electrical components contained within the shielding enclosure.
- the frame 10 includes a top wall 14 and a plurality of sidewalls 12 extending downwardly from outer edges of the top wall 14 .
- the frame 10 shown herein for illustrative purpose is polygonal, however, any other shapes may also be used.
- the top wall 14 of the frame 10 defines a central opening 16 for receiving electrical components disposed on the printed circuit board 80 .
- the sidewalls 12 are configured for being soldered to a conductive area of the printed circuit board 80 so that the sidewalls 12 of the frame 10 surround electronic components on a particular area of the printed circuit board 80 .
- Each sidewall 12 of the frame 10 defines at least one hole 122 .
- Two opposite hinged portions 142 are formed on fringes of the top wall 14 .
- the top wall 14 , the sidewalls 12 and the hinged portions 142 can be formed from a single sheet.
- the hinged portion 142 can be bent to form a coiled shape.
- a notch 144 is defined between the hinged portions 142 .
- a gap 146 is defined between each hinged portion 142 and the fringe of the top wall 14 .
- the shielding enclosure 30 includes a cover 32 , a plurality of flanges 34 , and a barrel portion 36 .
- An upper surface of the cover 32 is generally parallel to the top wall 14 of the frame 10 when the shielding enclosure 30 is positioned over the frame 10 .
- the cover 32 defines a plurality of holes 322 .
- the flanges 34 extend downwardly from three edges of the cover 32 , at an angle of approximately 90 degrees, allowing the flange 34 to cover the frame 10 .
- At least one flange 34 is extruded to form at least one protrusion 342 extending toward inside for being received in the hole 122 .
- At least one elastic tab 344 is spaced apart from two sides of the flange 34 .
- the barrel portion 36 is formed on the edge of the cover 32 without the flanges 34 by bending and/or stretching into a coiled shape.
- An operating portion 348 is formed on an opposite side of the barrel portion 36 .
- the cover 32 , the flanges 34 , the barrel portion 36 and the operating portion 348 can be formed from a single sheet.
- the frame 10 and the shielding enclosure 30 are preferably made from a metallic material, such as tin plated steel.
- a metallic material such as tin plated steel.
- other metal materials such as tin plated phosphor bronze, beryllium copper and other alloys of copper may also be used depending upon the required degree of shielding.
- the metal materials used for manufacturing the shielding enclosure 30 be capable of being readily soldered or welded with low resistance electrical conductivity.
- the primary purpose of the shield is to reduce magnetic field interference, it is generally preferable to use a steel or other alloy that has a relatively high permeability at low frequencies.
- the material may be plated with a low resistance metal, such as tin. If the principal concern of the shield is to reduce electrical field interference, then it is generally preferable to use a copper alloy as will be readily apparent to one skilled in the art of electromagnetic shielding.
- the shielding device 100 of the present disclosure may be easily and inexpensively manufactured.
- the shielding enclosure 30 including the cover 32 is stamped or punched from sheet metal.
- the sheet metal is also directly cut into the flanges 34 and a predetermined strip.
- the sides of the shielding enclosure 30 are bent to form the flanges 34
- the predetermined strip is bent into a coil to form the barrel portion 36 , and thereby the final product of the shielding enclosure 30 is obtained.
- the frame 10 is likewise easily formed using standard sheet metal or sheet foil processing techniques.
- the formed way of the hinged portions 142 is similar to the barrel portion 36 .
- the shaft 50 extends through the barrel portion 36 and the hinged portions 142 so that the shielding enclosure 30 is rotatably connected to the frame 10 .
- two distal ends of the shaft 50 are received in the gaps 146 . This structure may effectively prevent the shaft 50 from separating from the enclosure 30 and the frame 10 .
- the frame 10 is disposed over one or more electric or electronic components on the printed circuit board 80 to reduce electromagnetic interference from or to adjacent components, and is mounted on the printed circuit board 80 by soldering or the like.
- the shielding enclosure 30 is positioned over the frame 10 .
- the flanges 34 of the shielding enclosure 30 are placed around the side walls 14 of the frame 10 .
- the protrusions 342 are received in the holes 122 .
- the barrel portion 36 is disposed between the two hinged portions 142 .
- the shaft 50 extends through the hinged portions 142 and the barrel portion 36 . Accordingly, the shielding enclosure 30 is rotatably connected to the frame 10 .
- the shielding enclosure 70 can easily be opened.
- the through hole 122 may be formed on the shielding enclosure 30 and the protrusions 342 is located on the frame 10 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Aerials (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to a shielding device for a printed circuit board, and particularly to a shielding device having a shielding enclosure that may be easily opened.
- 2. Description of Related Art
- Electronic components of a printed circuit board radiate electromagnetic waves which generate electronic noise or unwanted signals. Accordingly, it is highly desirable to provide shielding for electronic components of printed circuit boards, which are susceptible to electromagnetic radiation. Since the electric telecommunication equipment must withstand interference of electromagnetic radiation, a shielding device can be used to decrease radiation emission.
- The shielding device usually includes an enclosure and a frame. The enclosure is tightly latched to the frame. To access electronic components inside the enclosure, the enclosure of the shielding device needs to be removed. However, it can be difficult to remove the enclosure from the frame.
- Therefore, there is room for improvement within the art.
- Many aspects of the present shielding device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present hinge assembly. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of a shielding device. -
FIG. 2 is similar toFIG. 1 , but shown from another aspect. -
FIG. 3 is an assembled view of the shielding device shown inFIG. 1 . -
FIG. 4 is a cut-away view ofFIG. 3 . -
FIG. 5 is similar toFIG. 3 but from a different angle and showing the enclosure in an opened state. - Referring to
FIGS. 1 and 2 , theshielding device 100, in one illustrated first embodiment, is positioned on a printedcircuit board 80. Understandably, theshielding device 100 is used for shielding at least oneelectronic component 82 on the printedcircuit board 80. Theshielding device 100 includes aframe 10, ashielding enclosure 30 and ashaft 50. Theshielding enclosure 30 is hinged to theframe 10 by theshaft 50 so that theshielding enclosure 30 can be rotatably opened to access any electrical components contained within the shielding enclosure. - The
frame 10 includes atop wall 14 and a plurality ofsidewalls 12 extending downwardly from outer edges of thetop wall 14. Theframe 10 shown herein for illustrative purpose is polygonal, however, any other shapes may also be used. Thetop wall 14 of theframe 10 defines acentral opening 16 for receiving electrical components disposed on the printedcircuit board 80. Thesidewalls 12 are configured for being soldered to a conductive area of the printedcircuit board 80 so that thesidewalls 12 of theframe 10 surround electronic components on a particular area of the printedcircuit board 80. Eachsidewall 12 of theframe 10 defines at least onehole 122. Two opposite hingedportions 142 are formed on fringes of thetop wall 14. Thetop wall 14, thesidewalls 12 and thehinged portions 142 can be formed from a single sheet. The hingedportion 142 can be bent to form a coiled shape. Anotch 144 is defined between thehinged portions 142. Agap 146 is defined between each hingedportion 142 and the fringe of thetop wall 14. - The
shielding enclosure 30 includes acover 32, a plurality offlanges 34, and abarrel portion 36. An upper surface of thecover 32 is generally parallel to thetop wall 14 of theframe 10 when theshielding enclosure 30 is positioned over theframe 10. Thecover 32 defines a plurality ofholes 322. Theflanges 34 extend downwardly from three edges of thecover 32, at an angle of approximately 90 degrees, allowing theflange 34 to cover theframe 10. At least oneflange 34 is extruded to form at least oneprotrusion 342 extending toward inside for being received in thehole 122. At least oneelastic tab 344 is spaced apart from two sides of theflange 34. Thebarrel portion 36 is formed on the edge of thecover 32 without theflanges 34 by bending and/or stretching into a coiled shape. Anoperating portion 348 is formed on an opposite side of thebarrel portion 36. Thecover 32, theflanges 34, thebarrel portion 36 and theoperating portion 348 can be formed from a single sheet. - The
frame 10 and theshielding enclosure 30 are preferably made from a metallic material, such as tin plated steel. However, other metal materials such as tin plated phosphor bronze, beryllium copper and other alloys of copper may also be used depending upon the required degree of shielding. In particular, however, it is desirable that the metal materials used for manufacturing theshielding enclosure 30 be capable of being readily soldered or welded with low resistance electrical conductivity. However, if the primary purpose of the shield is to reduce magnetic field interference, it is generally preferable to use a steel or other alloy that has a relatively high permeability at low frequencies. To provide electrical conductivity on materials with relatively high resistance, the material may be plated with a low resistance metal, such as tin. If the principal concern of the shield is to reduce electrical field interference, then it is generally preferable to use a copper alloy as will be readily apparent to one skilled in the art of electromagnetic shielding. - The
shielding device 100 of the present disclosure may be easily and inexpensively manufactured. At first, theshielding enclosure 30 including thecover 32 is stamped or punched from sheet metal. At the same time, the sheet metal is also directly cut into theflanges 34 and a predetermined strip. Afterwards, the sides of theshielding enclosure 30 are bent to form theflanges 34, the predetermined strip is bent into a coil to form thebarrel portion 36, and thereby the final product of theshielding enclosure 30 is obtained. Theframe 10 is likewise easily formed using standard sheet metal or sheet foil processing techniques. The formed way of the hingedportions 142 is similar to thebarrel portion 36. - The
shaft 50 extends through thebarrel portion 36 and thehinged portions 142 so that theshielding enclosure 30 is rotatably connected to theframe 10. In this exemplary embodiment, two distal ends of theshaft 50 are received in thegaps 146. This structure may effectively prevent theshaft 50 from separating from theenclosure 30 and theframe 10. - In assembly, referring to
FIGS. 3 to 5 , theframe 10 is disposed over one or more electric or electronic components on the printedcircuit board 80 to reduce electromagnetic interference from or to adjacent components, and is mounted on the printedcircuit board 80 by soldering or the like. Theshielding enclosure 30 is positioned over theframe 10. Theflanges 34 of theshielding enclosure 30 are placed around theside walls 14 of theframe 10. Theprotrusions 342 are received in theholes 122. Thebarrel portion 36 is disposed between the two hingedportions 142. Theshaft 50 extends through the hingedportions 142 and thebarrel portion 36. Accordingly, the shieldingenclosure 30 is rotatably connected to theframe 10. When the components shielded in theshielding device 100 need to be replaced, repaired or otherwise adjusted, the shielding enclosure 70 can easily be opened. - It is to be understood that the through hole 122may be formed on the shielding
enclosure 30 and the protrusions 342is located on theframe 10. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102450781A CN102348367A (en) | 2010-08-04 | 2010-08-04 | Shielding case and electronic device applying same |
CN201010245078.1 | 2010-08-04 | ||
CN201010245078 | 2010-08-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20120031661A1 true US20120031661A1 (en) | 2012-02-09 |
US8455771B2 US8455771B2 (en) | 2013-06-04 |
Family
ID=45546522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/968,427 Expired - Fee Related US8455771B2 (en) | 2010-08-04 | 2010-12-15 | Electromagnetic shielding device |
Country Status (3)
Country | Link |
---|---|
US (1) | US8455771B2 (en) |
JP (1) | JP2012039112A (en) |
CN (1) | CN102348367A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130048369A1 (en) * | 2011-08-31 | 2013-02-28 | Apple Inc. | Systems and methods for shielding circuitry from interference with a removable shield assembly |
US20140174814A1 (en) * | 2012-12-25 | 2014-06-26 | Hon Hai Precision Industry Co., Ltd. | Electromagnetic interference shield and electronic device using the same |
WO2015141968A1 (en) * | 2014-03-17 | 2015-09-24 | Samsung Electronics Co., Ltd. | Shield can, electronic device, and manufacturing method thereof |
US11337344B2 (en) * | 2020-03-12 | 2022-05-17 | Advanced-Connectek Inc. | Shielding member |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2566140A1 (en) * | 2010-04-27 | 2013-03-06 | Panasonic Corporation | Wireless terminal |
CN103682567A (en) * | 2012-09-26 | 2014-03-26 | 亚旭电脑股份有限公司 | Isolation cover and electronic device integrating antenna |
CN203590673U (en) * | 2013-09-09 | 2014-05-07 | 华为终端有限公司 | Shield cover and mobile terminal |
CN108683464A (en) * | 2018-04-20 | 2018-10-19 | 京信通信系统(中国)有限公司 | Antenna calibration network device and its shielding case |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5614694A (en) * | 1995-03-31 | 1997-03-25 | Motorola, Inc. | One piece open and closable metal RF shield |
US5737194A (en) * | 1996-07-29 | 1998-04-07 | Cray Research, Inc. | Input/output module assembly |
US5796578A (en) * | 1996-11-06 | 1998-08-18 | Dell Usa, L.P. | RF grounding and heat distribution system for a portable computer including a slip joint hinge with a banana plug type male intrusion member |
US6469904B1 (en) * | 2000-05-01 | 2002-10-22 | Hewlett-Packard Company | Housing for computer components |
US6897371B1 (en) * | 2002-08-27 | 2005-05-24 | A K Stamping Co. Inc. | One-piece shielding enclosure with selective interior access, and method and blank therefor |
US7358447B2 (en) * | 1994-06-06 | 2008-04-15 | Wavezero, Inc. | Electromagnetic interference shields for electronic devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000151174A (en) * | 1998-11-16 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Shield device of radio circuit board |
US7095626B2 (en) * | 2003-05-29 | 2006-08-22 | Interplex Nas Inc. | Openable one-piece electrical RF shield and method of manufacturing the same |
JP2006165201A (en) * | 2004-12-06 | 2006-06-22 | Toshiba Corp | Circuit module device |
TWM284198U (en) * | 2005-09-15 | 2005-12-21 | Jin-Fu Hung | Structure of a shield for avoiding electromagnetic interference |
CN101577742A (en) * | 2008-05-09 | 2009-11-11 | 深圳富泰宏精密工业有限公司 | Chip card holding device |
-
2010
- 2010-08-04 CN CN2010102450781A patent/CN102348367A/en active Pending
- 2010-12-15 US US12/968,427 patent/US8455771B2/en not_active Expired - Fee Related
-
2011
- 2011-08-03 JP JP2011170015A patent/JP2012039112A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7358447B2 (en) * | 1994-06-06 | 2008-04-15 | Wavezero, Inc. | Electromagnetic interference shields for electronic devices |
US5614694A (en) * | 1995-03-31 | 1997-03-25 | Motorola, Inc. | One piece open and closable metal RF shield |
US5737194A (en) * | 1996-07-29 | 1998-04-07 | Cray Research, Inc. | Input/output module assembly |
US5796578A (en) * | 1996-11-06 | 1998-08-18 | Dell Usa, L.P. | RF grounding and heat distribution system for a portable computer including a slip joint hinge with a banana plug type male intrusion member |
US6469904B1 (en) * | 2000-05-01 | 2002-10-22 | Hewlett-Packard Company | Housing for computer components |
US6897371B1 (en) * | 2002-08-27 | 2005-05-24 | A K Stamping Co. Inc. | One-piece shielding enclosure with selective interior access, and method and blank therefor |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130048369A1 (en) * | 2011-08-31 | 2013-02-28 | Apple Inc. | Systems and methods for shielding circuitry from interference with a removable shield assembly |
US20140174814A1 (en) * | 2012-12-25 | 2014-06-26 | Hon Hai Precision Industry Co., Ltd. | Electromagnetic interference shield and electronic device using the same |
US8963021B2 (en) * | 2012-12-25 | 2015-02-24 | Hon Hai Precision Industry Co., Ltd. | Electromagnetic interference shield and electronic device using the same |
WO2015141968A1 (en) * | 2014-03-17 | 2015-09-24 | Samsung Electronics Co., Ltd. | Shield can, electronic device, and manufacturing method thereof |
US9924616B2 (en) | 2014-03-17 | 2018-03-20 | Samsung Electronics Co., Ltd. | Shield can, electronic device, and manufacturing method thereof |
US11337344B2 (en) * | 2020-03-12 | 2022-05-17 | Advanced-Connectek Inc. | Shielding member |
Also Published As
Publication number | Publication date |
---|---|
JP2012039112A (en) | 2012-02-23 |
US8455771B2 (en) | 2013-06-04 |
CN102348367A (en) | 2012-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FIH (HONG KONG) LIMITED, HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAN, ZHENG-PING;CHEN, KUAN-HUNG;WANG, YAO;REEL/FRAME:025516/0207 Effective date: 20101208 Owner name: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAN, ZHENG-PING;CHEN, KUAN-HUNG;WANG, YAO;REEL/FRAME:025516/0207 Effective date: 20101208 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20170604 |