US20100230074A1

US20100230074A1 - Heat dissipation apparatus

Info

Publication number: US20100230074A1
Application number: US12/484,531
Authority: US
Inventors: Yang Li
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2009-03-13
Filing date: 2009-06-15
Publication date: 2010-09-16
Also published as: CN201438459U

Abstract

A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect to a centerline of the fin assembly. Each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a heat dissipation apparatus.
2. Description of Related Art
Electronic devices in computers, such as central processing units (CPUs), generate considerable heat during normal operation, which can deteriorate operational stability and damage associated electronic devices. Thus, the heat must be removed quickly to ensure normal operation of the CPU. A typical heat dissipation apparatus includes a typical heat sink mounted on a CPU to remove heat, and a fan fixed on the heat sink to generate airflow through the heat dissipation apparatus. A commonly used heat dissipation apparatus may be a downflow type with the fan disposed on top of the heat sink or a sideflow type with the fan disposed at a side of the heat sink. The downflow type heat sink includes a plurality of parallel fins soldered together and a copper core disposed in the middle of the parallel fins for heat conduction. However, the copper core is usually heavy and dissipating efficiency thereof low.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded view of an embodiment of a heat dissipation apparatus.

FIG. 2 is an assembled view of the heat dissipation apparatus of FIG. 1.

DETAILED DESCRIPTION

FIG. 1 is an exploded view of an embodiment of a heat dissipation apparatus. The heat dissipation apparatus includes a heat sink 10, and a fan 20 configured to be fixed on the heat sink 10.
The heat sink 10 includes a base 11, and a fin assembly 12 disposed on a top surface of the base 11. A bottom surface of the base 11 is configured to contact a heat source, such as a central processing unit (CPU). The heat generated by the heat source is transmitted to the fin assembly 12 via the base 11. The fin assembly 12 includes a first heat dissipation member 121, and a second heat dissipation member 122. The first and second heat dissipation members 121, 122 form a column space in the middle of the fin assembly 12. Each heat dissipation member includes a plurality of parallel fins 13 vertically disposed on the top surface of the base 11, and a bent heat pipe 14 passing through the plurality of parallel fins 13. The parallel fins 13 are radial on the base 11 and symmetric with respect to a centerline of the column space. A corner on top of the parallel fins 13 is arcuate.
The base 11 includes a heat conducting plate 111, and two fixing plates 112 corresponding to the two heat pipes 14. Two slots 15 are formed on the heat conducting plate 111 to receive the corresponding heat pipe 14. Two column protrusions 16 are formed on one side each of the slots 15 respectively. Each fixing plate 112 includes a slot 17 thereon corresponding to the heat pipe 14, and a column receiving hole 18 engaging the column protrusion 16. A lower portion of the heat pipe 14 is horizontally fixed in the slots 15 and 17, and the column protrusions 16 are received in the corresponding column receiving holes 18 to fix the heat pipes 14 on the base 11. Two supporting members 19 are disposed on the base 11 to support the heat sink 10. Each supporting member 19 has a middle portion secured to one side of the heat conducting plate 111, and a bottom surface of the corresponding fixing plate 112. Two bent supporting legs 191 extend form two sides of each supporting member 19. A fixing hole 192 is disposed on a distal end of each supporting leg.
Referring to FIG. 2, the fan 20 is rounded and mounted to the air inlet of the heat sink 10.
The heat pipes 14 pass through the most of the parallel fins 13 on the first and second heat dissipation members 121, 122. The heat generated by the heat source is promptly transmitted to the first and second heat dissipation members 121, 122. When the fan 20 rotates, the airflow from the fan 20 passing through the fins assembly 12 and a speed of the airflow is accelerated by the arcuate air inlet at top of the column space. The high speed airflow forms a tremendous impact on the top surface of the base 11, and the heat accumulated around the base 11 is dissipated quickly, and efficiency of heat dissipation is improved. Here, heat pipes 14 are disposed in the first and second heat dissipation members 121, 122 to replace the copper core in the typical heat dissipation apparatus, and the weight of the heat sink 10 is decreased.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation apparatus for dissipating heat from a heat source, comprising:

a base comprising a bottom surface configured for contacting the heat source; and

a fin assembly comprising a first heat dissipation member and a second heat dissipation member, each symmetric with respect to a centerline of the fin assembly; wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.

2. The heat dissipation apparatus of claim 1, wherein a lower portion of each heat pipe is disposed on the base, and passed through the plurality of parallel fins.

3. The heat dissipation apparatus of claim 2, wherein the base comprises a heat conducting plate and two fixing plates; the heat conducting plate comprising two slots that receive the corresponding heat pipe, and two column protrusions disposed on one side of the slots respectively; each fixing plate comprising a slot thereon corresponding to the heat pipe, and a column receiving hole that engages the column protrusion; wherein the lower portion of each heat pipe is horizontally fixed in the corresponding slots on the heat conducting plate and fixing plate, and the column protrusions are received in the corresponding column receiving holes to fix the heat pipes on the base.

4. The heat dissipation apparatus of claim 3, further comprising two supporting members disposed on the base to support the fin assembly, each supporting member comprising a middle portion secured on one side of the heat conducting plate, and a bottom surface of the corresponding fixing plate, two bent supporting legs extended from two sides of each supporting member, and a fixing hole disposed on a distal end of each supporting leg.

5. A heat dissipation apparatus, comprising:

a fan configured to generate airflow through the heat dissipation apparatus; and

a heat sink configured to contact a heat source, comprising:

a base with a bottom surface contacting the heat source;

a fin assembly comprising a first heat dissipation member and a second heat dissipation member, each symmetric with respect to a centerline of the fin assembly;

wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins; a corner of first and second heat dissipation members is arcuate.

6. The heat dissipation apparatus of claim 5, wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.

7. The heat dissipation apparatus of claim 6, wherein the fan is round and mounted to the air inlet of the heat sink.

8. The heat dissipation apparatus of claim 6, wherein the fan is mounted to the heat sink by glue.