US20100212871A1 - Heat pipe and manufacturing method thereof - Google Patents
Heat pipe and manufacturing method thereof Download PDFInfo
- Publication number
- US20100212871A1 US20100212871A1 US12/494,339 US49433909A US2010212871A1 US 20100212871 A1 US20100212871 A1 US 20100212871A1 US 49433909 A US49433909 A US 49433909A US 2010212871 A1 US2010212871 A1 US 2010212871A1
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- US
- United States
- Prior art keywords
- heat pipe
- casing
- main body
- pipe
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the disclosure relates to heat pipes, and more particularly to a heat pipe that states of a working medium contained in the heat pipe is visible and a manufacturing method thereof.
- a heat pipe includes a sealed aluminum or copper container with an internal surface lined with a capillary wick mesh and a working medium contained in the container.
- one end of the heat pipe is thermally attached to an electronic component to absorb heat therefrom, and the other end of the heat pipe is thermally connected to the heat sink.
- the working medium is vaporized, and a pressure gradient is formed in the heat pipe. This pressure gradient forces the vapor to flow along the heat pipe from the one end to the other end where the vapor condenses and gives out its latent heat of vaporization.
- the working medium is then returned back to the one end of the heat pipe via the capillary forces developed in the wick mesh.
- the heat generated by the electronic component can be rapidly transferred to the heat sink via the heat pipe for further dissipating to ambient air.
- the container is made of aluminum or copper
- states of the working medium in the container is not visual observation from outside of the heat pipe during operation of the heat pipe.
- the states of the working medium in the container can only be deduced by phase change theory, which is not convenient for real-time observation or real-time monitoring a working process of the heat pipe.
- an aging degree of the heat pipe is unable to judge. After the heat pipe being used a period of time, the heat pipe usually results in overheat and even in damage of the electronic component before the users know an excessive aging of the heat pipe.
- FIG. 1 is an isometric, assembled view of a heat dissipation device according to an exemplary embodiment of present disclosure.
- FIG. 2 is an isometric, assembled view of a heat pipe of the heat dissipation device of FIG. 1 .
- FIGS. 3A-3C are views respectively showing steps of a manufacturing method of the heat pipe of FIG. 2 .
- FIG. 1 illustrates a heat dissipation device in accordance with an exemplary embodiment of the disclosure.
- the heat dissipation device is for dissipating heat generated by an electronic component 20 .
- the heat dissipation device includes a fin unit 30 , a heat pipe 10 thermally connecting the electronic component 20 to the fin unit 30 , and a centrifugal fan 40 for providing an airflow flowing through the fin unit 30 to take heat away.
- the heat pipe 10 includes a sealed hollow casing 11 , a wick structure 12 formed on an inner surface of the casing 11 , and a working medium 17 contained in an interior of the casing 11 .
- the heat pipe 10 includes an evaporating section 13 , an adiabatic section 15 and a condensing section 14 along an axial direction of the casing 11 .
- the adiabatic section 15 is located between the evaporating section 13 and the condensing section 14 .
- a cross-section of the casing 11 is substantially “D” shaped.
- the casing 11 includes an elongated main body 111 having an elongated opening 110 extending from the evaporating section 13 to the condensing section 14 and a transparent cover 112 for hermetically sealing the opening 110 of the main body 111 .
- a cross-section of the main body 111 is about “C” shaped.
- the main body 111 is made of high thermally conductive material such as copper or aluminum.
- the opening 110 is defined in a top side of the main body 111 and extends along the axial direction of the main body 111 .
- An outline of the opening 110 includes a first linear portion 114 , a second linear portion 115 parallel to the first linear portion 114 , and first and second arced portions 116 , 117 respectively connected between two opposite ends of the first and second linear portions 114 , 115 .
- a length of the opening 110 substantially equals to a length of the main body 111 .
- a width of the opening 110 i.e., a distance between the first and second linear portions 114 , 115 , is smaller than a diameter of the main body 111 .
- the wick structure 12 is only provided lining an inner surface of the main body 111 of the casing 11 .
- the wick structure 12 includes a plurality of micro grooves defined in the inner surface of the main body 111 .
- the micro grooves are evenly arranged along a circumference direction of the main body 111 of the casing 11 .
- Each of the micro grooves extends along the axial direction of the main body 111 from the evaporating section 13 to the condensing section 14 .
- the wick structure 12 can be other known type wicks, such as screen mesh, sintering powders, etc.
- the transparent cover 112 is a rectangular flat plate.
- the transparent cover 112 is made of transparent materials such as acryl, glass or the like.
- a size of the transparent cover 112 is slightly larger than that of the opening 110 of the main body 111 for hermetically covering on the opening 110 of the main body 111 .
- the size of the transparent cover 112 can be equal to that of the opening 110 .
- the transparent cover 112 and the main body 111 cooperatively define a sealed space in the interior of the casing 11 with the wick structure 12 and working medium 17 received therein.
- the working medium 17 can be water, alcohol or methanol.
- the wick structure 12 is saturated with the working medium 17 , which acts as a heat carrier when undergoing phase transitions between liquid state and vaporous state during operation of the heat pipe 10 .
- the working medium 17 and the wick structure 12 contained in the interior of the casing 11 are visually observable from the top side of the heat pipe 10 via the transparent cover 112 .
- the fin unit 30 when assembled, the fin unit 30 is arranged at an air outlet 42 of the centrifugal fan 40 .
- the fin unit 30 defines a slot 32 at a middle of a top surface thereof.
- the slot 32 has a shape and a size respectively corresponding to a shape and a size of the main body 111 of the casing 11 of the heat pipe 10 .
- the condensing section 14 and the adiabatic section 15 of the heat pipe 10 are receiving in the slot 32 , with an outer surface of the main body 111 at the condensing and adiabatic sections 14 , 15 contacting with the top surface of the fin unit 30 around the slot 32 .
- the transparent cover 112 protrudes out of the slot 32 of the fin unit 30 and faces a top side of the heat dissipation device.
- An outer surface of another end of the main body 111 corresponding to the evaporation section 13 of the heat pipe 10 is thermally contacted with a top surface of the electronic component 20 .
- the main body 111 at the evaporation section 13 of the heat pipe 10 absorbs heat from the electronic component 20 , the working medium 17 is vaporized to vapor, and a pressure gradient is formed in the interior of the casing 11 .
- This pressure gradient forces the vapor to flow along the casing 11 from the evaporating section 13 to the condensing section 14 , where the vapor condenses back to liquid and gives out its latent heat of vaporization.
- the liquid is then returned back to the evaporating section 13 under a capillary force of the wick structure 12 of the heat pipe 10 .
- Such a process is repeated so that heat is continuously transferred from the evaporating section 13 into the condensing section 14 .
- the heat generated by the electronic component 20 is rapidly transferred to the fin unit 30 via the heat pipe 10 for further dissipating to the ambient air by the airflow generated by the fan 40 .
- a phase changing process of the working medium 17 in the interior of casing 111 i.e., the working medium 17 vaporized to vapor at the evaporating section 13 to flow towards the condensing section 14 along the casing 111 , and then condensed back to liquid at the condensing section 14 to flow back towards the evaporating section 13 under the capillary force of the wick structure 12 , is visually observable from the top side of the heat pipe 10 .
- the heat pipe 10 can be better used in educational training for learners or in researching and experimenting for researchers. Furthermore, the phase changing process of the working medium 17 in the interior of the heat pipe 10 can be recorded by a video camera or camcorder from outside of the heat pipe 10 via the transparent cover 112 , which provides more intellectualized, more convenient, and highly effective learning for more learners and researchers. Moreover, users can well know a working performance of the heat pipe 10 by observing speed of the phase changing process of the working medium 17 via the transparent cover 112 and easily judge an aging degree of the heat pipe 10 after the heat pipe 10 has been used a period of time. Thus, the users can easily judge whether the heat pipe 10 needs to be replaced or repaired to ensure that the electronic component 20 can always work normally.
- FIGS. 3A-3C respectively show steps for a manufacturing method of the heat pipe 10 .
- a rudimentary rounded hollow pipe body 60 with wick structure lining against an inner surface thereof is provided.
- the pipe body 60 is made of high thermally conductive material such as copper or aluminum.
- a cross section of the pipe body 60 is annular. One end of the pipe body 60 is enclosed, and the other end of the pipe body 60 is open.
- a top part 62 of the pipe body 60 is cut off from the pipe body 60 along an axial direction of the pipe body 60 via a cutting process. An opening 110 is thus formed on a remaining part 64 of the pipe body 60 along a cut plane of the pipe body 60 .
- the remaining part 64 forms the main body 111 of the casing 11 of the heat pipe 10 of FIG. 2 .
- the top part 62 has an arced cross-section which is smaller than a half cross-section of the pipe body 60 . Then, residual stresses of the remaining part 64 of the pipe body 60 caused by the cutting process are released by stress relief annealing.
- a transparent cover 112 having a shape corresponding to the opening 110 of the main body 111 of the casing 11 is provided.
- the transparent cover 112 is fixedly affixed to the main body 111 by sealant and thus seals the opening 110 , to thereby form the casing 11 of the heat pipe 10 of FIG. 2 .
- the working medium 17 such as water, alcohol or methanol
- the casing 11 is vacuumed and the open end of the casing 11 is hermetically sealed so as to form the heat pipe 10 with the transparent cover 112 arranged on the top side thereof as shown in FIG. 2 .
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The disclosure relates to heat pipes, and more particularly to a heat pipe that states of a working medium contained in the heat pipe is visible and a manufacturing method thereof.
- 2. Description of Related Art
- With continuing development of the electronic technology, electronic components such as CPUs generate more and more heat that is required to be dissipated immediately. Heat pipes are commonly used for cooling the electronic components for their excellent heat transfer performances.
- Commonly, a heat pipe includes a sealed aluminum or copper container with an internal surface lined with a capillary wick mesh and a working medium contained in the container. When used, one end of the heat pipe is thermally attached to an electronic component to absorb heat therefrom, and the other end of the heat pipe is thermally connected to the heat sink. As the heat pipe absorbs heat at the one end thereof, the working medium is vaporized, and a pressure gradient is formed in the heat pipe. This pressure gradient forces the vapor to flow along the heat pipe from the one end to the other end where the vapor condenses and gives out its latent heat of vaporization. The working medium is then returned back to the one end of the heat pipe via the capillary forces developed in the wick mesh. Thus, the heat generated by the electronic component can be rapidly transferred to the heat sink via the heat pipe for further dissipating to ambient air.
- Since the container is made of aluminum or copper, states of the working medium in the container is not visual observation from outside of the heat pipe during operation of the heat pipe. The states of the working medium in the container can only be deduced by phase change theory, which is not convenient for real-time observation or real-time monitoring a working process of the heat pipe. Furthermore, an aging degree of the heat pipe is unable to judge. After the heat pipe being used a period of time, the heat pipe usually results in overheat and even in damage of the electronic component before the users know an excessive aging of the heat pipe.
- It is thus desirable to provide a heat pipe which can overcome the described limitations.
-
FIG. 1 is an isometric, assembled view of a heat dissipation device according to an exemplary embodiment of present disclosure. -
FIG. 2 is an isometric, assembled view of a heat pipe of the heat dissipation device ofFIG. 1 . -
FIGS. 3A-3C are views respectively showing steps of a manufacturing method of the heat pipe ofFIG. 2 . - Reference will now be made to the drawing figures to describe the present heat dissipation device and heat pipe thereof in detail.
-
FIG. 1 illustrates a heat dissipation device in accordance with an exemplary embodiment of the disclosure. The heat dissipation device is for dissipating heat generated by anelectronic component 20. The heat dissipation device includes afin unit 30, aheat pipe 10 thermally connecting theelectronic component 20 to thefin unit 30, and acentrifugal fan 40 for providing an airflow flowing through thefin unit 30 to take heat away. - Referring to
FIG. 2 , theheat pipe 10 includes a sealedhollow casing 11, awick structure 12 formed on an inner surface of thecasing 11, and a workingmedium 17 contained in an interior of thecasing 11. Theheat pipe 10 includes anevaporating section 13, anadiabatic section 15 and acondensing section 14 along an axial direction of thecasing 11. Theadiabatic section 15 is located between theevaporating section 13 and thecondensing section 14. - A cross-section of the
casing 11 is substantially “D” shaped. Thecasing 11 includes an elongatedmain body 111 having anelongated opening 110 extending from the evaporatingsection 13 to thecondensing section 14 and atransparent cover 112 for hermetically sealing the opening 110 of themain body 111. - A cross-section of the
main body 111 is about “C” shaped. Themain body 111 is made of high thermally conductive material such as copper or aluminum. Theopening 110 is defined in a top side of themain body 111 and extends along the axial direction of themain body 111. An outline of theopening 110 includes a firstlinear portion 114, a secondlinear portion 115 parallel to the firstlinear portion 114, and first and secondarced portions linear portions opening 110 substantially equals to a length of themain body 111. However, a width of theopening 110, i.e., a distance between the first and secondlinear portions main body 111. Thewick structure 12 is only provided lining an inner surface of themain body 111 of thecasing 11. Thewick structure 12 includes a plurality of micro grooves defined in the inner surface of themain body 111. The micro grooves are evenly arranged along a circumference direction of themain body 111 of thecasing 11. Each of the micro grooves extends along the axial direction of themain body 111 from the evaporatingsection 13 to thecondensing section 14. Alternatively, thewick structure 12 can be other known type wicks, such as screen mesh, sintering powders, etc. - The
transparent cover 112 is a rectangular flat plate. Thetransparent cover 112 is made of transparent materials such as acryl, glass or the like. A size of thetransparent cover 112 is slightly larger than that of the opening 110 of themain body 111 for hermetically covering on the opening 110 of themain body 111. Alternatively, the size of thetransparent cover 112 can be equal to that of theopening 110. Thetransparent cover 112 and themain body 111 cooperatively define a sealed space in the interior of thecasing 11 with thewick structure 12 and workingmedium 17 received therein. - The working
medium 17 can be water, alcohol or methanol. Thewick structure 12 is saturated with the workingmedium 17, which acts as a heat carrier when undergoing phase transitions between liquid state and vaporous state during operation of theheat pipe 10. The workingmedium 17 and thewick structure 12 contained in the interior of thecasing 11 are visually observable from the top side of theheat pipe 10 via thetransparent cover 112. - Referring back to
FIG. 1 , when assembled, thefin unit 30 is arranged at anair outlet 42 of thecentrifugal fan 40. Thefin unit 30 defines aslot 32 at a middle of a top surface thereof. Theslot 32 has a shape and a size respectively corresponding to a shape and a size of themain body 111 of thecasing 11 of theheat pipe 10. Thecondensing section 14 and theadiabatic section 15 of theheat pipe 10 are receiving in theslot 32, with an outer surface of themain body 111 at the condensing andadiabatic sections fin unit 30 around theslot 32. Thetransparent cover 112 protrudes out of theslot 32 of thefin unit 30 and faces a top side of the heat dissipation device. An outer surface of another end of themain body 111 corresponding to theevaporation section 13 of theheat pipe 10 is thermally contacted with a top surface of theelectronic component 20. - During operation, the
main body 111 at theevaporation section 13 of theheat pipe 10 absorbs heat from theelectronic component 20, the workingmedium 17 is vaporized to vapor, and a pressure gradient is formed in the interior of thecasing 11. This pressure gradient forces the vapor to flow along thecasing 11 from the evaporatingsection 13 to thecondensing section 14, where the vapor condenses back to liquid and gives out its latent heat of vaporization. The liquid is then returned back to the evaporatingsection 13 under a capillary force of thewick structure 12 of theheat pipe 10. Such a process is repeated so that heat is continuously transferred from the evaporatingsection 13 into thecondensing section 14. Thus, the heat generated by theelectronic component 20 is rapidly transferred to thefin unit 30 via theheat pipe 10 for further dissipating to the ambient air by the airflow generated by thefan 40. - Due to the
transparent cover 112 formed on the top side of thecasing 111, a phase changing process of the workingmedium 17 in the interior ofcasing 111, i.e., the workingmedium 17 vaporized to vapor at the evaporatingsection 13 to flow towards thecondensing section 14 along thecasing 111, and then condensed back to liquid at thecondensing section 14 to flow back towards theevaporating section 13 under the capillary force of thewick structure 12, is visually observable from the top side of theheat pipe 10. Thus, it is intuitively to know a working principle of the phase transition of the workingmedium 17 in the interior of thecasing 111 of theheat pipe 10 and accurately to know a working process of theheat pipe 10. Therefore, theheat pipe 10 can be better used in educational training for learners or in researching and experimenting for researchers. Furthermore, the phase changing process of the workingmedium 17 in the interior of theheat pipe 10 can be recorded by a video camera or camcorder from outside of theheat pipe 10 via thetransparent cover 112, which provides more intellectualized, more convenient, and highly effective learning for more learners and researchers. Moreover, users can well know a working performance of theheat pipe 10 by observing speed of the phase changing process of the workingmedium 17 via thetransparent cover 112 and easily judge an aging degree of theheat pipe 10 after theheat pipe 10 has been used a period of time. Thus, the users can easily judge whether theheat pipe 10 needs to be replaced or repaired to ensure that theelectronic component 20 can always work normally. -
FIGS. 3A-3C respectively show steps for a manufacturing method of theheat pipe 10. Referring toFIG. 3A , a rudimentary roundedhollow pipe body 60 with wick structure lining against an inner surface thereof is provided. Thepipe body 60 is made of high thermally conductive material such as copper or aluminum. A cross section of thepipe body 60 is annular. One end of thepipe body 60 is enclosed, and the other end of thepipe body 60 is open. Referring toFIG. 3B , atop part 62 of thepipe body 60 is cut off from thepipe body 60 along an axial direction of thepipe body 60 via a cutting process. Anopening 110 is thus formed on a remainingpart 64 of thepipe body 60 along a cut plane of thepipe body 60. The remainingpart 64 forms themain body 111 of thecasing 11 of theheat pipe 10 ofFIG. 2 . Thetop part 62 has an arced cross-section which is smaller than a half cross-section of thepipe body 60. Then, residual stresses of the remainingpart 64 of thepipe body 60 caused by the cutting process are released by stress relief annealing. Referring toFIG. 3C , atransparent cover 112 having a shape corresponding to theopening 110 of themain body 111 of thecasing 11 is provided. Thetransparent cover 112 is fixedly affixed to themain body 111 by sealant and thus seals theopening 110, to thereby form thecasing 11 of theheat pipe 10 ofFIG. 2 . Subsequently, the workingmedium 17 such as water, alcohol or methanol, is injected into thecasing 11 via the open end, and finally, thecasing 11 is vacuumed and the open end of thecasing 11 is hermetically sealed so as to form theheat pipe 10 with thetransparent cover 112 arranged on the top side thereof as shown inFIG. 2 . - It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (11)
Applications Claiming Priority (2)
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CN200910300496.3 | 2009-02-20 | ||
CN200910300496.3A CN101813429B (en) | 2009-02-20 | 2009-02-20 | Manufacturing method of heat pipe |
Publications (1)
Publication Number | Publication Date |
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US20100212871A1 true US20100212871A1 (en) | 2010-08-26 |
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ID=42620744
Family Applications (1)
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US12/494,339 Abandoned US20100212871A1 (en) | 2009-02-20 | 2009-06-30 | Heat pipe and manufacturing method thereof |
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US (1) | US20100212871A1 (en) |
CN (1) | CN101813429B (en) |
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US20140150995A1 (en) * | 2012-12-04 | 2014-06-05 | Foxconn Technology Co., Ltd. | Heat pipe and method for manufacturing the same |
US9120190B2 (en) | 2011-11-30 | 2015-09-01 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
CN105698410A (en) * | 2016-01-29 | 2016-06-22 | 南京工业大学 | Quartz visual heat pipe |
CN108709442A (en) * | 2018-04-27 | 2018-10-26 | 华南理工大学 | A kind of the vacuum pumping liquid injection closing device and method of tablet multichannel heat pipe |
CN118548730A (en) * | 2024-07-30 | 2024-08-27 | 四川力泓电子科技有限公司 | Heat pipe, radiator and electronic equipment |
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CN110328462A (en) * | 2019-07-01 | 2019-10-15 | 安徽安风风机有限公司 | High intensity transition method at volute tongue chamfering |
CN114980646A (en) * | 2021-02-24 | 2022-08-30 | 北京小米移动软件有限公司 | Heat dissipation module, terminal and heat dissipation structure manufacturing method |
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CN100467201C (en) * | 2005-07-01 | 2009-03-11 | 郑坚地 | Method for manufacturing integrally-formed flat heat pipe and heat pipe base material |
CN2837964Y (en) * | 2005-09-22 | 2006-11-15 | 李建民 | Fully transparent thermotube research and tutorial appliance |
CN101266112B (en) * | 2008-04-01 | 2010-12-01 | 哈尔滨工业大学 | Micro heat pipe with SOG structure and its manufacturing method |
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Cited By (8)
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US20130133863A1 (en) * | 2011-11-30 | 2013-05-30 | Palo Alto Research Center Incorporated | Co-Extruded Microchannel Heat Pipes |
US9120190B2 (en) | 2011-11-30 | 2015-09-01 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US10160071B2 (en) | 2011-11-30 | 2018-12-25 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US10371468B2 (en) * | 2011-11-30 | 2019-08-06 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US20140150995A1 (en) * | 2012-12-04 | 2014-06-05 | Foxconn Technology Co., Ltd. | Heat pipe and method for manufacturing the same |
CN105698410A (en) * | 2016-01-29 | 2016-06-22 | 南京工业大学 | Quartz visual heat pipe |
CN108709442A (en) * | 2018-04-27 | 2018-10-26 | 华南理工大学 | A kind of the vacuum pumping liquid injection closing device and method of tablet multichannel heat pipe |
CN118548730A (en) * | 2024-07-30 | 2024-08-27 | 四川力泓电子科技有限公司 | Heat pipe, radiator and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
CN101813429B (en) | 2013-01-23 |
CN101813429A (en) | 2010-08-25 |
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