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US20100175856A1 - Vapor chamber with wick structure of different thickness and die for forming the same - Google Patents

Vapor chamber with wick structure of different thickness and die for forming the same Download PDF

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Publication number
US20100175856A1
US20100175856A1 US12/352,080 US35208009A US2010175856A1 US 20100175856 A1 US20100175856 A1 US 20100175856A1 US 35208009 A US35208009 A US 35208009A US 2010175856 A1 US2010175856 A1 US 2010175856A1
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United States
Prior art keywords
wick
section
wick structure
vapor chamber
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US12/352,080
Inventor
George Anthony Meyer, IV
Chien-Hung Sun
Chieh-Ping Chen
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Celsia Technologies Taiwan Inc
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Celsia Technologies Taiwan Inc
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Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to US12/352,080 priority Critical patent/US20100175856A1/en
Assigned to Celsia Technologies Taiwan, Inc. reassignment Celsia Technologies Taiwan, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIEH-PING, MEYER IV, GEORGE ANTHONY, SUN, CHIEN-HUNG
Publication of US20100175856A1 publication Critical patent/US20100175856A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
    • B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Definitions

  • the present invention relates to a vapor chamber and a die for forming the vapor chamber, and in particular to a vapor chamber with a wick structure of different thickness and a die for forming the vapor chamber.
  • vapor chambers have many advantageous features such as large heat-conducting capacity, high heat-transferring rate, light weight, simple structure, versatility, capability of transferring large amount of heat without consuming any electricity, low price and etc., they are widely used in dissipating the heat generated by electronic elements. Via the vapor chamber, the heat generated by electronic elements can be dissipated quickly, thereby overcoming the heat accumulation occurring in the electronic elements at current stage.
  • the conventional vapor chamber includes a casing, a wick structure, a supporting body and a working fluid.
  • the casing has a chamber.
  • the wick structure is adhered to the inner wall of the chamber.
  • the wick structure comprises a first wick section and a second wick section extending from the first wick structure.
  • the first wick structure and the second wick structure are formed to have the same thickness.
  • the supporting body is received within the wick structure.
  • the working fluid is filled within the chamber. Via the above arrangement, the vapor chamber is formed.
  • the vapor chamber In using the vapor chamber, it is adhered to the surface of an electronic heat-generating element with the first wick section being arranged to correspond to the central high-temperature heat source zone of the electronic heat-generating element.
  • the major portion of the heat of the central high-temperature heat source zone is substantially transferred to the first wick structure, and then the heat is absorbed by the working fluid within the first wick structure.
  • only a small amount of heat is transferred to the second wick structure.
  • the conventional vapor chamber still has some drawbacks as follows. If the thickness of the wick structure (i.e. the first and second wick sections) is small, the amount of working fluid contained therein will become less. Thus, in this case, the heat-conducting efficiency is poor. On the contrary, if the thickness of the wick structure is larger, the heat-conducting efficiency can be improved. However, a major portion of the heat is transferred to the first wick structure rather than the second wick structure. The utilization ratio of the second wick structure is low, which may waste the material and increase the cost.
  • the present Inventor proposes a reasonable and novel structure based on his delicate researches and expert experiments.
  • the present invention is to provide a vapor chamber with a wick structure of different thickness and a die for forming the vapor chamber so as to increase the heat-conducting efficiency and reduce the cost.
  • the present invention is to provide a vapor chamber with a wick structure of different thickness, which comprises a casing, a wick structure, a supporting body and a working fluid.
  • the casing has a chamber.
  • the wick structure is adhered to the inner wall of the chamber.
  • the wick structure has a first wick section and a second wick section extending from the first wick structure.
  • the thickness of the first wick section is larger than that of the second wick section.
  • the supporting body is received within the wick structure.
  • the working fluid is filled within the chamber.
  • the present invention is to provide a die for forming the vapor chamber.
  • the die is constituted of a plate.
  • a surface of the plate is formed with a first section matching the first wick section and a second section extending from the first section and matching the second wick section.
  • the first wick section of the wick structure has a larger thickness while the second wick section has a smaller thickness.
  • the present invention has effects of improving the heat-conducting efficiency and reducing the cost. In this way, the drawbacks of prior art can be overcome.
  • FIG. 1 is a cross-section view showing the vapor chamber of the present invention
  • FIG. 2 is a partially enlarged view showing the region A of FIG. 1 ;
  • FIG. 3 is a schematic view showing the operating state of the vapor chamber of the present invention.
  • FIG. 4 is a perspective view showing the casing and the die of the present invention.
  • FIG. 5 is a cross-sectional view showing the cooperation of the present invention with the die
  • FIG. 6 is a schematic view of FIG. 5 with the die removed
  • FIG. 7 is a perspective showing the supporting body of FIG. 6 ;
  • FIG. 8 is a schematic view showing another embodiment of the die of the present invention.
  • FIG. 9 is an assembled view of FIG. 8 ;
  • FIG. 10 is a schematic view showing the vapor chamber of another embodiment of the present invention.
  • FIG. 11 is a partially enlarged view showing the region B of FIG. 10 .
  • the present invention provides a vapor chamber 1 with a wick structure of different thickness, which is constituted of a casing 10 , a working fluid 20 , a wick structure 30 and a supporting body 40 .
  • the casing 10 is made of copper or aluminum.
  • the interior of the casing 10 is formed with a chamber 11 .
  • the working fluid 20 is filled in the chamber 11 .
  • the working fluid 20 can be pure water, alcohol, methanol, ethanol or propyl alcohol, but it is not limited thereto.
  • the wick structure 30 is adhered to the inner wall of the chamber 11 .
  • the wick structure 30 has a first wick section 31 and a second wick section 32 extending from the first wick section 31 .
  • the thickness of the wick section 31 is larger than that of the second wick section 32 .
  • the first wick section 31 is formed with a plurality of first ribs 33
  • the second wick section 32 is formed with a plurality of second ribs 34 .
  • the height of the first rib 33 is larger than that of the second rib 34 .
  • a first groove 35 is formed between any two adjacent first ribs 33
  • a second groove 36 is formed between any two adjacent second ribs 36 .
  • the depth of the first groove 35 is larger than that of the second groove 36 .
  • the wick structure 30 can be made of porous metallic sintered power, a woven network or the mixture thereof, but it is not limited thereto.
  • the supporting body 40 is received within the wick structure 30 .
  • the supporting body 40 comprises two side plates 41 ( FIG. 7 ) and a plurality of waved pieces 42 connected between the two side plates 41 .
  • the waved piece 42 is constituted of a plurality of crests 421 and troughs 422 .
  • the troughs 422 of any two adjacent waved pieces 42 are staggered.
  • the supporting body 40 can be an elastic body or an elastic metal plate.
  • the vapor chamber 1 is adhered to a surface of the an electronic heat-generating element 6 with the first wick section 31 being arranged to correspond to the central high-temperature heat source zone of the electronic heat-generating element 6 .
  • the major portion of the heat of the central high-temperature heat source zone is substantially transferred to the first wick structure, and then the heat is absorbed by the working fluid 20 within the first wick structure 31 , thereby increasing the heat-conducting efficiency.
  • only a small amount of heat is transferred to the second wick structure 32 . Since the thickness of the second wick section 32 is smaller than that of the first wick section 31 , so that the cost can be reduced. Therefore, the present invention has both effects of increasing the heat-conducting efficiency and reducing the cost.
  • the die 5 for making the wick structure 30 of the vapor chamber 1 according to the present invention is constituted of a plate 51 .
  • the plate 51 has a first section 52 and a second section 53 extending from the first section 52 .
  • the first section 52 is formed with a plurality of first elongate blocks 54 ( FIG. 5 ) matching the first wick section 31
  • the second section 53 is formed with a plurality of second elongate blocks 55 matching the second wick section 32 o
  • the height of the first elongate block 54 is the same as that of the second elongate block 55 .
  • a first slot 56 is formed with any two adjacent first elongate blocks 54
  • a second slot 57 is formed with any two adjacent second elongate blocks 55 .
  • the depth of the first slot 56 is larger that that of the second slot 57 .
  • the plate 51 can be a metal plate, but it is not limited thereto.
  • FIGS. 4 to 6 In forming the wick structure 30 , first, one side of the casing 10 is provided with an opening 12 . Then, the die 5 is disposed in the casing 10 via the opening 12 . Metallic powder is filled between the casing 10 and the die 5 ( FIG. 5 ) and then sintered to obtain the final shape. Thereafter, the die 5 is removed ( FIG. 6 ), thereby forming the wick structure 30 . Finally, please refer to FIG. 7 , the supporting body 40 is disposed in the wick structure 30 and the opening 12 is sealed. Then, the working fluid 20 is filled in the wick structure 30 and the air therein is exhausted to vacuum. Via this above process, the manufacturing of the vapor chamber 1 of the present invention is completed.
  • FIGS. 8 and 9 show another embodiment of the die of the present invention.
  • the difference between the present embodiment and the previous embodiment lies in that: the first section 52 ′ of the die 5 ′ is formed with a plurality of first elongate blocks 54 , and the second section 53 ′ is formed with a plurality of second elongate blocks 55 , wherein the height of the first elongate block 54 is smaller than that of the second elongate block 55 .
  • the present embodiment is an alternative embodiment of the die 5 .
  • FIGS. 10 and 11 show another embodiment of the vapor chamber of the present invention.
  • the difference between the present embodiment and the previous embodiment lies in that: the first wick section 31 ′ formed in the vapor chamber 1 ′ matches the first section 52 ′ of the die 5 ′, and the second wick section 32 ′ formed in the vapor chamber 1 ′matches the second section 53 ′ of the die 5 ′.
  • the first wick section 31 ′ is formed with a plurality of first ribs 33 and the second wick section 32 ′ is formed with a plurality of second ribs 34 .
  • the height of the first rib 33 is the same as that of the second rib 34 (the height of the first rib 33 or the second rib 34 is the distance from one face of the rib adhered to the inner wall of the casing 10 to the other face of the rib adhered to the surface of the supporting body 40 ).
  • a first groove 35 is formed between any two adjacent first ribs 33
  • a second groove 36 is formed between any two adjacent second ribs 34 .
  • the depth of the first groove 35 is smaller than that of the second groove 36 .
  • the present embodiment has the same effect as the previous embodiment.
  • the present invention has the effects of increasing the heat-conducting efficiency and reducing the cost, and it overcomes the drawbacks of prior art.
  • the present invention really has industrial applicability.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A vapor chamber with a wick structure of different thickness includes a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure has a first wick section and a second wick section extending from the first wick structure. The thickness of the first wick section is larger than that of the second wick section. The supporting body is received within the wick structure. The working fluid is filled within the chamber. Via the above arrangement, the heat-conducting efficiency can be increased while the cost can be reduced.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a vapor chamber and a die for forming the vapor chamber, and in particular to a vapor chamber with a wick structure of different thickness and a die for forming the vapor chamber.
  • 2. Description of Prior Art
  • Since vapor chambers have many advantageous features such as large heat-conducting capacity, high heat-transferring rate, light weight, simple structure, versatility, capability of transferring large amount of heat without consuming any electricity, low price and etc., they are widely used in dissipating the heat generated by electronic elements. Via the vapor chamber, the heat generated by electronic elements can be dissipated quickly, thereby overcoming the heat accumulation occurring in the electronic elements at current stage.
  • The conventional vapor chamber includes a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure comprises a first wick section and a second wick section extending from the first wick structure. The first wick structure and the second wick structure are formed to have the same thickness. The supporting body is received within the wick structure. The working fluid is filled within the chamber. Via the above arrangement, the vapor chamber is formed.
  • In using the vapor chamber, it is adhered to the surface of an electronic heat-generating element with the first wick section being arranged to correspond to the central high-temperature heat source zone of the electronic heat-generating element. The major portion of the heat of the central high-temperature heat source zone is substantially transferred to the first wick structure, and then the heat is absorbed by the working fluid within the first wick structure. On the other hand, only a small amount of heat is transferred to the second wick structure.
  • However, in practice, the conventional vapor chamber still has some drawbacks as follows. If the thickness of the wick structure (i.e. the first and second wick sections) is small, the amount of working fluid contained therein will become less. Thus, in this case, the heat-conducting efficiency is poor. On the contrary, if the thickness of the wick structure is larger, the heat-conducting efficiency can be improved. However, a major portion of the heat is transferred to the first wick structure rather than the second wick structure. The utilization ratio of the second wick structure is low, which may waste the material and increase the cost.
  • Therefore, in order to overcome the above problems, the present Inventor proposes a reasonable and novel structure based on his delicate researches and expert experiments.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a vapor chamber with a wick structure of different thickness and a die for forming the vapor chamber so as to increase the heat-conducting efficiency and reduce the cost.
  • The present invention is to provide a vapor chamber with a wick structure of different thickness, which comprises a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure has a first wick section and a second wick section extending from the first wick structure. The thickness of the first wick section is larger than that of the second wick section. The supporting body is received within the wick structure. The working fluid is filled within the chamber.
  • The present invention is to provide a die for forming the vapor chamber. The die is constituted of a plate. A surface of the plate is formed with a first section matching the first wick section and a second section extending from the first section and matching the second wick section.
  • In comparison with prior art, according to the present invention, the first wick section of the wick structure has a larger thickness while the second wick section has a smaller thickness. Via this arrangement, the present invention has effects of improving the heat-conducting efficiency and reducing the cost. In this way, the drawbacks of prior art can be overcome.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a cross-section view showing the vapor chamber of the present invention;
  • FIG. 2 is a partially enlarged view showing the region A of FIG. 1;
  • FIG. 3 is a schematic view showing the operating state of the vapor chamber of the present invention;
  • FIG. 4 is a perspective view showing the casing and the die of the present invention;
  • FIG. 5 is a cross-sectional view showing the cooperation of the present invention with the die;
  • FIG. 6 is a schematic view of FIG. 5 with the die removed;
  • FIG. 7 is a perspective showing the supporting body of FIG. 6;
  • FIG. 8 is a schematic view showing another embodiment of the die of the present invention;
  • FIG. 9 is an assembled view of FIG. 8;
  • FIG. 10 is a schematic view showing the vapor chamber of another embodiment of the present invention; and
  • FIG. 11 is a partially enlarged view showing the region B of FIG. 10.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
  • Please refer to FIGS. 1 and 2. The present invention provides a vapor chamber 1 with a wick structure of different thickness, which is constituted of a casing 10, a working fluid 20, a wick structure 30 and a supporting body 40.
  • The casing 10 is made of copper or aluminum. The interior of the casing 10 is formed with a chamber 11.
  • The working fluid 20 is filled in the chamber 11. The working fluid 20 can be pure water, alcohol, methanol, ethanol or propyl alcohol, but it is not limited thereto.
  • The wick structure 30 is adhered to the inner wall of the chamber 11. The wick structure 30 has a first wick section 31 and a second wick section 32 extending from the first wick section 31. The thickness of the wick section 31 is larger than that of the second wick section 32. The first wick section 31 is formed with a plurality of first ribs 33, and the second wick section 32 is formed with a plurality of second ribs 34. The height of the first rib 33 is larger than that of the second rib 34. A first groove 35 is formed between any two adjacent first ribs 33, and a second groove 36 is formed between any two adjacent second ribs 36. The depth of the first groove 35 is larger than that of the second groove 36. The wick structure 30 can be made of porous metallic sintered power, a woven network or the mixture thereof, but it is not limited thereto.
  • The supporting body 40 is received within the wick structure 30. The supporting body 40 comprises two side plates 41 (FIG. 7) and a plurality of waved pieces 42 connected between the two side plates 41. The waved piece 42 is constituted of a plurality of crests 421 and troughs 422. The troughs 422 of any two adjacent waved pieces 42 are staggered. The supporting body 40 can be an elastic body or an elastic metal plate.
  • Please refer to FIG. 3. When the present invention is in use, the vapor chamber 1 is adhered to a surface of the an electronic heat-generating element 6 with the first wick section 31 being arranged to correspond to the central high-temperature heat source zone of the electronic heat-generating element 6. The major portion of the heat of the central high-temperature heat source zone is substantially transferred to the first wick structure, and then the heat is absorbed by the working fluid 20 within the first wick structure 31, thereby increasing the heat-conducting efficiency. On the other hand, only a small amount of heat is transferred to the second wick structure 32. Since the thickness of the second wick section 32 is smaller than that of the first wick section 31, so that the cost can be reduced. Therefore, the present invention has both effects of increasing the heat-conducting efficiency and reducing the cost.
  • Please refer to FIG. 4. The die 5 for making the wick structure 30 of the vapor chamber 1 according to the present invention is constituted of a plate 51.
  • The plate 51 has a first section 52 and a second section 53 extending from the first section 52. The first section 52 is formed with a plurality of first elongate blocks 54 (FIG. 5) matching the first wick section 31, and the second section 53 is formed with a plurality of second elongate blocks 55 matching the second wick section 32 o The height of the first elongate block 54 is the same as that of the second elongate block 55. A first slot 56 is formed with any two adjacent first elongate blocks 54, and a second slot 57 is formed with any two adjacent second elongate blocks 55. The depth of the first slot 56 is larger that that of the second slot 57. The plate 51 can be a metal plate, but it is not limited thereto.
  • Please refer to FIGS. 4 to 6. In forming the wick structure 30, first, one side of the casing 10 is provided with an opening 12. Then, the die 5 is disposed in the casing 10 via the opening 12. Metallic powder is filled between the casing 10 and the die 5 (FIG. 5) and then sintered to obtain the final shape. Thereafter, the die 5 is removed (FIG. 6), thereby forming the wick structure 30. Finally, please refer to FIG. 7, the supporting body 40 is disposed in the wick structure 30 and the opening 12 is sealed. Then, the working fluid 20 is filled in the wick structure 30 and the air therein is exhausted to vacuum. Via this above process, the manufacturing of the vapor chamber 1 of the present invention is completed.
  • Please refer to FIGS. 8 and 9, which show another embodiment of the die of the present invention. The difference between the present embodiment and the previous embodiment lies in that: the first section 52′ of the die 5′ is formed with a plurality of first elongate blocks 54, and the second section 53′ is formed with a plurality of second elongate blocks 55, wherein the height of the first elongate block 54 is smaller than that of the second elongate block 55. The present embodiment is an alternative embodiment of the die 5.
  • Please refer to FIGS. 10 and 11, which show another embodiment of the vapor chamber of the present invention. The difference between the present embodiment and the previous embodiment lies in that: the first wick section 31′ formed in the vapor chamber 1′ matches the first section 52′ of the die 5′, and the second wick section 32′ formed in the vapor chamber 1′matches the second section 53′ of the die 5′. The first wick section 31′ is formed with a plurality of first ribs 33 and the second wick section 32′ is formed with a plurality of second ribs 34. The height of the first rib 33 is the same as that of the second rib 34 (the height of the first rib 33 or the second rib 34 is the distance from one face of the rib adhered to the inner wall of the casing 10 to the other face of the rib adhered to the surface of the supporting body 40). A first groove 35 is formed between any two adjacent first ribs 33, and a second groove 36 is formed between any two adjacent second ribs 34. The depth of the first groove 35 is smaller than that of the second groove 36. The present embodiment has the same effect as the previous embodiment.
  • According to the above, the present invention has the effects of increasing the heat-conducting efficiency and reducing the cost, and it overcomes the drawbacks of prior art. Thus, the present invention really has industrial applicability.

Claims (11)

1. A vapor chamber with a wick structure of different thickness, comprising:
a casing having a chamber;
a wick structure adhered to an inner wall of the chamber, the wick structure having a first wick section and a second wick section extending from the first wick structure, a thickness of the first wick section being larger than that of the second wick section;
a supporting body received within the wick structure; and
a working fluid filled within the chamber.
2. The vapor chamber with a wick structure of different thickness according to claim 1, wherein the first wick section is formed with a plurality of first ribs, the second wick section is formed with a plurality of second ribs, and a height of the first rib is larger than that of the second rib.
3. The vapor chamber with a wick structure of different thickness according to claim 2, wherein a first groove is formed between any two adjacent first ribs, a second groove is formed between any two adjacent second ribs, and a depth of the first groove is larger than that of the second groove.
4. The vapor chamber with a wick structure of different thickness according to claim 1, wherein the first wick section is formed with a plurality of first ribs, the second wick section is formed with a plurality of second ribs, and a height of the first rib is the same as that of the second rib.
5. The vapor chamber with a wick structure of different thickness according to claim 4, wherein a first groove is formed between any two adjacent first ribs, a second groove is formed between any two adjacent second ribs, and a depth of the first groove is smaller than that of the second groove.
6. The vapor chamber with a wick structure of different thickness according to claim 1, wherein the wick structure is made of porous metallic sintered powder.
7. The vapor chamber with a wick structure of different thickness according to claim 1, wherein the supporting body comprises two side plates and a plurality of waved pieces connected between the two side plates.
8. The vapor chamber with a wick structure of different thickness according to claim 7, wherein the waved piece is constituted of a plurality of crests and troughs, and the troughs of any two adjacent waved pieces are staggered.
9. A die for forming a wick structure of a vapor chamber, the wick structure having a first wick section and a second wick section extending from the first wick section, the die comprising:
a plate having a first section and a second section extending from the first section, the first section being formed with a plurality of first elongate blocks matching the first wick section, the second section being formed with a plurality of second elongate blocks matching the second wick section, a height of the first elongate block being the same as that of the second elongate block.
10. The die for forming a wick structure of a vapor chamber according to claim 9, wherein a first slot is formed between any two adjacent first elongate blocks, a second slot is formed between any two adjacent second elongate blocks, and a depth of the first slot is larger than that of the second slot.
11. A die for forming a wick structure of a vapor chamber, the wick structure having a first wick section and a second wick section extending from the first wick section, the die comprising:
a plate having a first section and a second section extending from the first section, the first section being formed with a plurality of first elongate blocks matching the first wick section, the second section being formed with a plurality of second elongate blocks matching the second wick section, and a height of the first elongate block being smaller than that of the second elongate block.
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Cited By (9)

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US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
US20130032312A1 (en) * 2011-08-04 2013-02-07 Ching-Chung Wang Vapor chamber capillary formation method and structure thereof
JP2019086254A (en) * 2017-11-09 2019-06-06 株式会社デンソー Evaporator
US10458719B2 (en) * 2015-01-22 2019-10-29 Pimems, Inc. High performance two-phase cooling apparatus
US11044835B2 (en) * 2019-03-27 2021-06-22 Google Llc Cooling electronic devices in a data center
US20210307202A1 (en) * 2018-12-12 2021-09-30 Magna International Inc. Additive manufactured heat sink
US20210310751A1 (en) * 2020-04-01 2021-10-07 Lenovo (Beijing) Co., Ltd. Heat conductiing device
US11873982B2 (en) 2020-05-14 2024-01-16 Signify Holding B.V. Vapor chamber element
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