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US20100115301A1 - Cpu power delivery system - Google Patents

Cpu power delivery system Download PDF

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Publication number
US20100115301A1
US20100115301A1 US12/684,257 US68425710A US2010115301A1 US 20100115301 A1 US20100115301 A1 US 20100115301A1 US 68425710 A US68425710 A US 68425710A US 2010115301 A1 US2010115301 A1 US 2010115301A1
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United States
Prior art keywords
die
cpu
voltage regulator
voltage
vrm
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Abandoned
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US12/684,257
Inventor
Siva G. Narendra
Howard A. Wilson
Donald S. Gardner
Peter Hazucha
Gerhard Schrom
Tanay Karnik
Nitin Borkar
Vivek K. De
Shekhar Y. Borkar
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Individual
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Individual
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Priority to US12/684,257 priority Critical patent/US20100115301A1/en
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Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the present invention relates to computer systems; more particularly, the present invention relates to delivering power to a central processing unit (CPU).
  • CPU central processing unit
  • Integrated circuit components such as central processing units (CPUs) are typically powered by a voltage regulator module (VRM) located at a remote location, such as on the CPU motherboard.
  • VRM voltage regulator module
  • the motherboard voltage regulator module (VRM) typically supplies a single supply voltage (Vcc) to multiple CPU cores, a cache and input/output (I/O) components. This is due to the fact that power delivery systems do not have sufficient area on the board, socket and package to route separate supply voltages to multiple cores, cache and I/O components.
  • FIG. 1 is a block diagram of one embodiment of a computer system
  • FIG. 2 illustrates one embodiment of a CPU die
  • FIG. 3 illustrates one embodiment of a voltage regulator die
  • FIG. 4 illustrates one embodiment of a CPU.
  • a power delivery system for a CPU is described.
  • numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.
  • FIG. 1 is a block diagram of one embodiment of a computer system 100 .
  • Computer system 100 includes a central processing unit (CPU) 102 coupled to bus 105 .
  • CPU 102 is a processor in the Pentium® family of processors including the Pentium® II processor family, Pentium® III processors, and Pentium® IV processors available from Intel Corporation of Santa Clara, Calif. Alternatively, other CPUs may be used.
  • a chipset 107 is also coupled to bus 105 .
  • Chipset 107 includes a memory control hub (MCH) 110 .
  • MCH 110 may include a memory controller 112 that is coupled to a main system memory 115 .
  • Main system memory 115 stores data and sequences of instructions that are executed by CPU 102 or any other device included in system 100 .
  • main system memory 115 includes dynamic random access memory (DRAM); however, main system memory 115 may be implemented using other memory types. Additional devices may also be coupled to bus 105 , such as multiple CPUs and/or multiple system memories.
  • DRAM dynamic random access memory
  • Chipset 107 also includes an input/output control hub (ICH) 140 coupled to MCH 110 to via a hub interface.
  • ICH 140 provides an interface to input/output (I/O) devices within computer system 100 .
  • I/O input/output
  • ICH 140 may be coupled to a Peripheral Component Interconnect bus adhering to a Specification Revision 2.1 bus developed by the PCI Special Interest Group of Portland, Oregon.
  • FIG. 2 illustrates one embodiment of a CPU 102 die 200 .
  • Die 200 includes four CPU processing cores (core 1 -core 4 ) 210 .
  • die 200 includes cache 220 and I/O circuitry 230 .
  • cache 220 is a L 2 /L 3 cache.
  • I/O circuitry 230 is placed on the periphery (e.g., north, south, east, and west boundaries) to enable efficient vertical current delivery to cores 210 .
  • a motherboard voltage regulator module typically supplies a single Vcc to the cores, cache and I/O circuitry since power delivery systems do not have sufficient area on the board, socket and package to route separate supply voltages to multiple cores, cache and I/O components.
  • variable core-level Vcc provides significant power saving.
  • components within a single core can be shut down or put on lower Vcc to save active power.
  • a core may include performance-critical and non-critical components. The core would operate more efficiently if the non-critical component could be supplied by a separate, lower Vcc to save active and leakage power.
  • an external VRM on a motherboard is insufficient to enable a multi-Vcc solution.
  • a multiple Vcc VRM die is bonded to CPU die 200 .
  • FIG. 3 illustrates one embodiment of a VRM die 300 .
  • VRM die 300 includes seven VRMs (VRM 1 -VRM 7 ) that provide a regulated voltage supply to each component within CPU die 200 .
  • VRM 1 -VRM 4 supply a Vcc voltages to Core 1 -Core 4 , respectively.
  • VRM 5 supplies a Vcc to cache 220
  • VRM 6 and VRM 7 provide voltages to I/O circuitry 230 , respectively.
  • other quantities of VRMs may be included in die 300 , depending on the number of components within die 200 that are to have separate voltage supplies.
  • the voltages supplied by each VRM may be the same or different from voltages supplied by the other VRMs.
  • die 300 is flipped and bonded (metal-side to metal-side) to supply appropriate cores, thus bringing the VRMs as close to the CPU die 200 as possible.
  • VRM die 300 is in a three dimensional (3D) packaging configuration with die 200 .
  • FIG. 4 illustrates one embodiment of CPU 102 .
  • CPU 102 includes the multi-Vcc VRM die 300 sandwiched between CPU die 200 and a package substrate 400 .
  • VRM die 300 is pad matched to CPU die 200 and package substrate 400 so that die 300 can be an option sandwiched die.
  • package 400 and CPU 200 design does not need any changes.
  • FIG. 4 shows the I/O connections between die 200 and 300 , as well as the die/die bonding. Note that only two regulators are shown on die 200 for simplicity. Further, a heat spreader and heat sink (not shown) may be coupled to CPU die 200 .
  • the above-described integrated 3D VRM avoids the discontinuities and impedances in the VRM to die power delivery path, which give rise to amplitude/phase degradation and response time delay.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Power Sources (AREA)
  • Microcomputers (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.

Description

    PRIORITY
  • This application is a continuation of application Ser. No. 10/955,746, entitled CPU Power Delivery System, and claims priority therefrom.
    • FIELD OF THE INVENTION
  • The present invention relates to computer systems; more particularly, the present invention relates to delivering power to a central processing unit (CPU).
    • BACKGROUND
  • Integrated circuit components, such as central processing units (CPUs), are typically powered by a voltage regulator module (VRM) located at a remote location, such as on the CPU motherboard. The motherboard voltage regulator module (VRM) typically supplies a single supply voltage (Vcc) to multiple CPU cores, a cache and input/output (I/O) components. This is due to the fact that power delivery systems do not have sufficient area on the board, socket and package to route separate supply voltages to multiple cores, cache and I/O components.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention is illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which:
  • FIG. 1 is a block diagram of one embodiment of a computer system;
  • FIG. 2 illustrates one embodiment of a CPU die;
  • FIG. 3 illustrates one embodiment of a voltage regulator die; and
  • FIG. 4 illustrates one embodiment of a CPU.
    •  DETAILED DESCRIPTION
  • According to one embodiment, a power delivery system for a CPU is described. In the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.
  • Reference in the specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.
  • FIG. 1 is a block diagram of one embodiment of a computer system 100. Computer system 100 includes a central processing unit (CPU) 102 coupled to bus 105. In one embodiment, CPU 102 is a processor in the Pentium® family of processors including the Pentium® II processor family, Pentium® III processors, and Pentium® IV processors available from Intel Corporation of Santa Clara, Calif. Alternatively, other CPUs may be used.
  • A chipset 107 is also coupled to bus 105. Chipset 107 includes a memory control hub (MCH) 110. MCH 110 may include a memory controller 112 that is coupled to a main system memory 115. Main system memory 115 stores data and sequences of instructions that are executed by CPU 102 or any other device included in system 100. In one embodiment, main system memory 115 includes dynamic random access memory (DRAM); however, main system memory 115 may be implemented using other memory types. Additional devices may also be coupled to bus 105, such as multiple CPUs and/or multiple system memories.
  • Chipset 107 also includes an input/output control hub (ICH) 140 coupled to MCH 110 to via a hub interface. ICH 140 provides an interface to input/output (I/O) devices within computer system 100. For instance, ICH 140 may be coupled to a Peripheral Component Interconnect bus adhering to a Specification Revision 2.1 bus developed by the PCI Special Interest Group of Portland, Oregon.
  • FIG. 2 illustrates one embodiment of a CPU 102 die 200. Die 200 includes four CPU processing cores (core 1-core 4) 210. In addition, die 200 includes cache 220 and I/O circuitry 230. In one embodiment, cache 220 is a L2/L3 cache. I/O circuitry 230 is placed on the periphery (e.g., north, south, east, and west boundaries) to enable efficient vertical current delivery to cores 210.
  • As discussed above, a motherboard voltage regulator module typically supplies a single Vcc to the cores, cache and I/O circuitry since power delivery systems do not have sufficient area on the board, socket and package to route separate supply voltages to multiple cores, cache and I/O components.
  • Various architectural studies have shown that there is a tremendous power saving if all cores are not active and performing at the same Vcc at the same time. Thus, variable core-level Vcc provides significant power saving. Moreover, components within a single core can be shut down or put on lower Vcc to save active power. For example, a core may include performance-critical and non-critical components. The core would operate more efficiently if the non-critical component could be supplied by a separate, lower Vcc to save active and leakage power. However, as discussed above, an external VRM on a motherboard is insufficient to enable a multi-Vcc solution.
  • According to one embodiment, a multiple Vcc VRM die is bonded to CPU die 200. FIG. 3 illustrates one embodiment of a VRM die 300. In one embodiment, VRM die 300 includes seven VRMs (VRM 1-VRM 7) that provide a regulated voltage supply to each component within CPU die 200. For instance VRM 1-VRM 4 supply a Vcc voltages to Core 1-Core 4, respectively.
  • In addition, VRM 5 supplies a Vcc to cache 220, while VRM 6 and VRM 7 provide voltages to I/O circuitry 230, respectively. Note that in other embodiments, other quantities of VRMs may be included in die 300, depending on the number of components within die 200 that are to have separate voltage supplies. Also, the voltages supplied by each VRM may be the same or different from voltages supplied by the other VRMs.
  • According to one embodiment, die 300 is flipped and bonded (metal-side to metal-side) to supply appropriate cores, thus bringing the VRMs as close to the CPU die 200 as possible. In a further embodiment, VRM die 300 is in a three dimensional (3D) packaging configuration with die 200.
  • FIG. 4 illustrates one embodiment of CPU 102. CPU 102 includes the multi-Vcc VRM die 300 sandwiched between CPU die 200 and a package substrate 400. According to one embodiment, VRM die 300 is pad matched to CPU die 200 and package substrate 400 so that die 300 can be an option sandwiched die. Thus, package 400 and CPU 200 design does not need any changes.
  • In addition, FIG. 4 shows the I/O connections between die 200 and 300, as well as the die/die bonding. Note that only two regulators are shown on die 200 for simplicity. Further, a heat spreader and heat sink (not shown) may be coupled to CPU die 200.
  • The above-described integrated 3D VRM avoids the discontinuities and impedances in the VRM to die power delivery path, which give rise to amplitude/phase degradation and response time delay.
  • Whereas many alterations and modifications of the present invention will no doubt become apparent to a person of ordinary skill in the art after having read the foregoing description, it is to be understood that any particular embodiment shown and described by way of illustration is in no way intended to be considered limiting. Therefore, references to details of various embodiments are not intended to limit the scope of the claims, which in themselves recite only those features regarded as essential to the invention.

Claims (18)

1. A central processing unit (CPU) comprising:
a CPU die, including;
a first processing core;
a second processing core; and
a voltage regulator die bonded to the CPU die in a three dimensional packaging configuration, including:
a first voltage regulator module (VRM) to supply a first voltage to the first processing core; and a second VRM to supply a second voltage to the second processing core.
2. The CPU of claim 1 wherein the first voltage is equal to the second voltage.
3. The CPU of claim 1 wherein the voltage regulator die further comprises:
a third VRM to supply a third voltage to a cache at the CPU die; and
a fourth VRM to supply a fourth voltage to an input/output (I/O) circuitry at the CPU die.
4. The CPU of claim 3 further comprising I/O connections coupled between the voltage regulator die and the CPU die.
5. The CPU of claim 1 further comprising a package substrate bonded to the voltage regulator die.
6. The CPU of claim 5 wherein the voltage regulator die is pad matched to the CPU die and the package substrate.
7. The CPU of claim 1 wherein the voltage regulator die is flipped and bonded to the CPU die metal side to metal side.
8. A method comprising bonding a voltage regulator die to a central processing unit (CPU) die in a three-dimensional packaging configuration.
9. The method of claim 8 further comprising bonding a package substrate to the voltage regulator die.
10. The method of claim 9 wherein the voltage regulator die is pad matched to the CPU die and the package substrate.
11. The method of claim 8 further comprising coupling I/O connections between the voltage regulator die and the CPU die.
12. The method of claim 8 further comprising:
supplying a first voltage to a first processing core on the CPU die with a first voltage regulator module (VRM) on the voltage regulator die; and
supplying a second voltage to a second processing core on the CPU die with a second VRM on the voltage regulator die
13. A system comprising:
a central processing unit (CPU) having:
a CPU die, including;
a first processing core;
a second processing core; and
a voltage regulator die bonded to the CPU die in a three dimensional packaging configuration, including:
a first voltage regulator module (VRM) to supply a first voltage to the first processing core;
a second VRM to supply a second voltage to the second processing core;
a chipset coupled to the CPU; and
a main memory device coupled to the chipset.
14. The system of claim 13 wherein the voltage regulator die further comprises:
a third VRM to supply a third voltage to a cache at the CPU die; and
a fourth VRM to supply a fourth voltage to an input/output (I/O) circuitry at the CPU die.
15. The system of claim 14 further comprising I/O connections coupled between the voltage regulator die and the CPU die.
16. The system of claim 13 wherein the CPU further comprises a package substrate bonded to the voltage regulator die.
17. The system of claim 65 wherein the voltage regulator die is pad matched to the CPU die and the package substrate.
18. The system of claim 13 wherein the voltage regulator die is flipped and bonded to the CPU die metal side to metal side.
US12/684,257 2004-09-30 2010-01-08 Cpu power delivery system Abandoned US20100115301A1 (en)

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Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060081257A1 (en) * 2004-08-31 2006-04-20 Ross Krogh Single use drug delivery components
KR101108397B1 (en) * 2005-06-10 2012-01-30 엘지전자 주식회사 Power control device and method of a multi-core processor
US7568115B2 (en) 2005-09-28 2009-07-28 Intel Corporation Power delivery and power management of many-core processors
US7949887B2 (en) 2006-11-01 2011-05-24 Intel Corporation Independent power control of processing cores
JP4945224B2 (en) * 2006-11-30 2012-06-06 株式会社東芝 Controller, information processing apparatus, and supply voltage control method
US8397090B2 (en) * 2006-12-08 2013-03-12 Intel Corporation Operating integrated circuit logic blocks at independent voltages with single voltage supply
US7900069B2 (en) * 2007-03-29 2011-03-01 Intel Corporation Dynamic power reduction
US8193799B2 (en) * 2008-09-23 2012-06-05 Globalfoundries Inc. Interposer including voltage regulator and method therefor
US8248152B2 (en) 2009-02-25 2012-08-21 International Business Machines Corporation Switched capacitor voltage converters
US8174288B2 (en) * 2009-04-13 2012-05-08 International Business Machines Corporation Voltage conversion and integrated circuits with stacked voltage domains
US8212537B2 (en) * 2009-07-23 2012-07-03 International Business Machines Corporation Integratable efficient switching down converter
US8276002B2 (en) * 2009-11-23 2012-09-25 International Business Machines Corporation Power delivery in a heterogeneous 3-D stacked apparatus
US8812879B2 (en) * 2009-12-30 2014-08-19 International Business Machines Corporation Processor voltage regulation
US8629705B2 (en) 2010-06-07 2014-01-14 International Business Machines Corporation Low voltage signaling
TWI420297B (en) * 2010-10-13 2013-12-21 Feature Integration Technology Inc Serial signal control methods and associated device
WO2012074967A1 (en) * 2010-11-29 2012-06-07 President And Fellows Of Harvard College Fully integrated 3-level dc/dc converter for nanosecond-scale dynamic voltage scaling with fast shunt regulation
KR101286923B1 (en) 2012-04-06 2013-07-16 박혜성 Device for supplying direct current
TWI588763B (en) * 2016-07-19 2017-06-21 富邦金融控股股份有限公司 Virtual currency crediting system based on physical assets and method thereof
US10594213B1 (en) * 2019-02-20 2020-03-17 Blockchain Asics Llc Performance sensitive series string power supply
US11596052B2 (en) * 2020-06-08 2023-02-28 Intel Corporation Integrated voltage regulator for high performance devices

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410467A (en) * 1992-03-19 1995-04-25 Astec International Limited Power converters with improved switching efficiency
US20010032738A1 (en) * 1999-07-15 2001-10-25 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6335565B1 (en) * 1996-12-04 2002-01-01 Hitachi, Ltd. Semiconductor device
US6365962B1 (en) * 2000-03-29 2002-04-02 Intel Corporation Flip-chip on flex for high performance packaging applications
US20020087906A1 (en) * 2000-12-29 2002-07-04 Mar Clarence Y. CPU power sequence for large multiprocessor systems
US20020145839A1 (en) * 2000-10-30 2002-10-10 Smith Larry D. Power distribution system with a dedicated power structure and a high performance voltage regulator
US6469895B1 (en) * 1995-09-05 2002-10-22 Astec International Limited Integrated circuit mounting structure including a switching power supply
US20030065966A1 (en) * 1999-09-29 2003-04-03 Poisner David I. Over-clocking detection system utilizing a reference signal and thereafter preventing over-clocking by reducing clock rate
US20030081389A1 (en) * 2001-10-26 2003-05-01 Raj Nair Silicon interposer-based hybrid voltage regulator system for VLSI devices
US20030126477A1 (en) * 2001-12-28 2003-07-03 Zhang Kevin X. Method and apparatus for controlling a supply voltage to a processor
US20040142603A1 (en) * 2002-07-24 2004-07-22 Walker J. Thomas Attachable modular electronic systems
US6831294B1 (en) * 1999-01-22 2004-12-14 Renesas Technology Corp. Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes
US20050041763A1 (en) * 2001-04-27 2005-02-24 Wang Weizheng W. Unblind equalizer architecture for digital communication systems
US20050127758A1 (en) * 2003-12-12 2005-06-16 Atkinson Lee W. System and method for power management when an operating voltage is between two thresholds
US6922783B2 (en) * 2002-01-16 2005-07-26 Hewlett-Packard Development Company, L.P. Method and apparatus for conserving power on a multiprocessor integrated circuit
US20050207133A1 (en) * 2004-03-11 2005-09-22 Mark Pavier Embedded power management control circuit
US20060065962A1 (en) * 2004-09-29 2006-03-30 Intel Corporation Control circuitry in stacked silicon
US7111186B2 (en) * 2003-04-28 2006-09-19 Sun Microsystems, Inc. Method and apparatus for static phase offset correction
US7247930B2 (en) * 2004-09-30 2007-07-24 Intel Corporation Power management integrated circuit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206452B (en) * 1987-06-23 1991-01-09 Burr Brown Ltd Printed circuit board topography for high speed intelligent industrial controller
US5608617A (en) * 1996-05-03 1997-03-04 Zecal Incorporated High power miniature demand power supply
JP2001185676A (en) * 1999-12-24 2001-07-06 Sharp Corp Semiconductor device
US6359783B1 (en) * 1999-12-29 2002-03-19 Intel Corporation Integrated circuit socket having a built-in voltage regulator
US6429630B2 (en) * 2000-01-27 2002-08-06 Primarion, Inc. Apparatus for providing regulated power to an integrated circuit
JP2002353325A (en) * 2001-05-25 2002-12-06 Mitsubishi Electric Corp Semiconductor device
US6635970B2 (en) * 2002-02-06 2003-10-21 International Business Machines Corporation Power distribution design method for stacked flip-chip packages
WO2003073251A2 (en) 2002-02-25 2003-09-04 Molex Incorporated Power delivery to base of processor
GB2399684B (en) 2003-03-18 2006-06-28 Shuttle Inc Placement structure of an integrated motherboard
US7523337B2 (en) 2004-08-19 2009-04-21 Intel Corporation Power delivery system in which power supply and load exchange power consumption measurements via digital bus

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410467A (en) * 1992-03-19 1995-04-25 Astec International Limited Power converters with improved switching efficiency
US6469895B1 (en) * 1995-09-05 2002-10-22 Astec International Limited Integrated circuit mounting structure including a switching power supply
US6335565B1 (en) * 1996-12-04 2002-01-01 Hitachi, Ltd. Semiconductor device
US6831294B1 (en) * 1999-01-22 2004-12-14 Renesas Technology Corp. Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes
US20010032738A1 (en) * 1999-07-15 2001-10-25 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US20030065966A1 (en) * 1999-09-29 2003-04-03 Poisner David I. Over-clocking detection system utilizing a reference signal and thereafter preventing over-clocking by reducing clock rate
US6365962B1 (en) * 2000-03-29 2002-04-02 Intel Corporation Flip-chip on flex for high performance packaging applications
US20020145839A1 (en) * 2000-10-30 2002-10-10 Smith Larry D. Power distribution system with a dedicated power structure and a high performance voltage regulator
US6791846B2 (en) * 2000-10-30 2004-09-14 Sun Microsystems, Inc. Power distribution system with a dedicated power structure and a high performance voltage regulator
US20020087906A1 (en) * 2000-12-29 2002-07-04 Mar Clarence Y. CPU power sequence for large multiprocessor systems
US20050041763A1 (en) * 2001-04-27 2005-02-24 Wang Weizheng W. Unblind equalizer architecture for digital communication systems
US20030081389A1 (en) * 2001-10-26 2003-05-01 Raj Nair Silicon interposer-based hybrid voltage regulator system for VLSI devices
US20030126477A1 (en) * 2001-12-28 2003-07-03 Zhang Kevin X. Method and apparatus for controlling a supply voltage to a processor
US6922783B2 (en) * 2002-01-16 2005-07-26 Hewlett-Packard Development Company, L.P. Method and apparatus for conserving power on a multiprocessor integrated circuit
US20040142603A1 (en) * 2002-07-24 2004-07-22 Walker J. Thomas Attachable modular electronic systems
US7111186B2 (en) * 2003-04-28 2006-09-19 Sun Microsystems, Inc. Method and apparatus for static phase offset correction
US20050127758A1 (en) * 2003-12-12 2005-06-16 Atkinson Lee W. System and method for power management when an operating voltage is between two thresholds
US20050207133A1 (en) * 2004-03-11 2005-09-22 Mark Pavier Embedded power management control circuit
US20060065962A1 (en) * 2004-09-29 2006-03-30 Intel Corporation Control circuitry in stacked silicon
US7247930B2 (en) * 2004-09-30 2007-07-24 Intel Corporation Power management integrated circuit

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