US20100101756A1 - Liquid-cooling device - Google Patents
Liquid-cooling device Download PDFInfo
- Publication number
- US20100101756A1 US20100101756A1 US12/391,162 US39116209A US2010101756A1 US 20100101756 A1 US20100101756 A1 US 20100101756A1 US 39116209 A US39116209 A US 39116209A US 2010101756 A1 US2010101756 A1 US 2010101756A1
- Authority
- US
- United States
- Prior art keywords
- liquid
- heat exchanger
- cooling device
- base
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 45
- 238000001704 evaporation Methods 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to cooling devices, and more particularly to a liquid-cooling device for dissipating waste heat generated by electrical or electronic components and assemblies.
- liquid cooling devices are used to remove heat from electrical or electronic components which generate a large amount of heat during operation.
- Metallic heat sinks with fins, heat exchangers utilizing phase-change, or liquid cooling devices are in most common use.
- a liquid cooling device a plurality of channels is defined for travel of liquid which carries heat therein.
- the channels in the liquid cooling device are formed by milling and drilling a metal stock, for example, a copper block.
- the milling and drilling process incurs a high manufacturing cost of the liquid cooling device.
- the liquid cooling device to increase its size (and accordingly weight) proportionally. The increase of the size and weight of the liquid cooling device conflicts with the tendency of compactness and portability of the electronic products.
- FIG. 1 is an isometric, assembled view of a liquid-cooling device in accordance with an exemplary embodiment of the present disclosure.
- FIG. 2 is an exploded view of the liquid-cooling device of FIG. 1 .
- FIG. 3 is an inverted view of the liquid-cooling device of FIG. 2 .
- FIG. 4 is an enlarged, exploded view of a heat exchanger of the liquid-cooling device of FIG. 2 .
- FIG. 5 is a side elevation view of the liquid-cooling device of FIG. 1 .
- a liquid-cooling device in accordance with an exemplary embodiment of the present disclosure is especially useful in efficiently dissipating heat from highly integrated heat generating component such as microprocessors or computer chips (not shown) operating under high heat flux conditions.
- the liquid cooling device comprises a heat exchanger 10 , a fin set 20 located over a space behind a rear side of the heat exchanger 10 , a plurality of heat pipes 30 thermally connecting the heat exchanger 10 and the fin set 20 together, a fan 40 and two fan holders 50 holding the fan 40 on a front side of the fin set 20 .
- the fan 40 is located over the rear side of the heat exchanger 10 .
- the heat exchanger 10 comprises a base 12 , a housing 14 fixed on the base 12 , a cover 16 engaging with a top end of the housing 14 and two fixing legs 18 attached to a bottom of the base 12 .
- the base 12 is made of thermally conductive material, such as copper or aluminum and comprises a base plate 122 and a plurality of heat-exchanging members 124 protruding upwardly and perpendicularly from a top surface of the base plate 122 .
- Each heat-exchanging member 124 has a pin-like configuration with a square cross section, although it is not limited to such configuration and cross section.
- the base plate 122 is substantially T-shaped in profile, having a large top surface and a small bottom surface.
- the top surface of the base plate 122 is rectangular, although it is not limited to this shape.
- the bottom surface of the base plate 122 is used for contacting a heat generating component (not shown).
- the base plate 122 defines four engaging holes 1220 respectively in four corners thereof for engagingly receiving fixtures 200 to assemble the components of the heat exchanger 10 together.
- a plurality of receiving grooves 1222 are defined in a middle portion of the bottom surface of the base plate 122 .
- the receiving grooves 1222 are perpendicular to front and rear long sides of the base plate 122 and closely arranged side by side to each other.
- the heat-exchanging members 124 are located at a central portion of the top surface of the base plate 122 and arranged in a matrix and spaced from each other with a constant distance.
- the housing 14 has four peripheral sidewalls 140 perpendicularly interconnecting each other to cooperatively define a hollow cuboid.
- the housing 14 is vertically placed on the base plate 122 of the base 12 .
- the housing 14 defines two annular slots 142 respectively in bottom and top faces thereof.
- Each annular slot 42 is for accommodating a sealing ring 100 therein for ensuring a hermetical seal of the housing 14 with the cover 16 and the base plate 122 of the base 12 of the heat exchanger 10 .
- Four opened receiving channels 144 are respectively defined in four corners of the housing 14 for receiving the fixtures 200 therein.
- the receiving channels 144 are vertically extended through the housing 14 .
- the receiving channels 144 are horizontally opened to an environment surrounding the housing 14 via four tips of the four corners of the housing 14 , whereby the housing 14 including the four receiving channels 144 can be formed simply by aluminum extrusion.
- the cover 16 is with an isosceles trapezoid-shaped cross section and has two inclined faces on a top thereof and facing opposite to each other. The inclined faces are titled downwardly in respect to a middle of the top of the cover 16 .
- An inlet 162 and an outlet 164 are respectively defined through the two inclined faces of the cover 16 so as to be in fluid communication with the heat exchanger 10 .
- the inlet 162 and the outlet 164 are perpendicular to corresponding inclined faces and located adjacent to a front side of the cover 16 so that the fan 40 is located above the cover 16 and closely behind the inlet 162 and outlet 164 .
- Two fixing flanges 166 respectively extend laterally and horizontally from lower edges of the two inclined faces of the cover 16 . Each fixing flange 166 therein defines two through holes 1660 adjacent to two opposite ends thereof for a downward extension of a corresponding fixture 200 therethrough.
- Each of the fixing legs 18 comprises a middle portion 182 fixed to the bottom surface of the base plate 122 and two fixing portions 184 extending obliquely and downwardly from two opposite ends of the middle portion 182 .
- the middle portions 182 of the two fixing legs 18 are located at two opposite sides of the receiving grooves 1222 .
- the two fixing portions 184 of each fixing leg 18 are located at a lateral side of the base plate 122 for fasteners 300 respectively extending therethrough to mount the heat exchanger 10 onto the heat generating component (not shown).
- the fixtures 200 extend downwardly through corresponding through holes 166 of the cover 16 and the corresponding receiving channels 144 of the housing 14 in sequence and then are screwed into the corresponding engaging holes 1220 of the base 12 , to thus assemble the base 12 , housing 14 and the cover 16 together and define a sealed chamber (not labeled) in the heat exchanger 10 , which contains the heat-exchanging members 124 of the base 12 and working liquid therein.
- Two extension lines of the axes of the inlet 162 and outlet 164 intersect at the centre of the base plate 122 for facilitating the inflow and outflow of the working liquid corresponding to a central heat-accumulated portion of the base plate 122 .
- the inlet 162 and outlet 164 are connected to a pump (not shown) via conduits (not shown) to construct a flow circulation for the working liquid.
- the fin set 20 comprises a plurality of rectangular fins 22 which are spaced from each other and parallel to the base plate 122 .
- the fin set 20 defines two vertical slots 24 in two oppositely lateral sides thereof for engagingly receiving the fan holders 50 therein.
- a plurality of receiving holes 26 are defined in the fin set 20 and extend upwardly from the bottom to the top of the fin set 20 without extending through a topmost one of the fins 22 of the fin set 20 .
- the receiving holes 26 wholly receive condensing portions 34 of the heat pipes 30 therein.
- the receiving holes 26 are spaced from each other, perpendicular to the fins 22 and located at a middle portion of the fin set 20 .
- the heat pipes 30 are consistent in quantity with the receiving grooves 1222 of the base 122 and the receiving holes 26 of the fin set 20 .
- Each heat pipe 30 comprises an evaporating portion 32 received in a corresponding receiving groove 1222 of the base 122 and the condensing portion 34 extending perpendicularly from an end of the evaporating portion 32 and received in a corresponding receiving hole 26 of the fin set 20 .
- the evaporating portions 32 of the heat pipes 30 received in the receiving grooves 1222 are arranged closely side by side to each other and have bottom surfaces thereof coplanar with each other to form a flat face for contacting with the heat-generating component.
- the evaporating portion 32 has a semicircular cross section, while the condensing portion 34 has a round cross section.
- the fan 40 is fastened to the front side of the fin set 20 by the fan holders 50 .
- the fan 40 is located above the heat exchanger 10 and close to the inlet 162 and outlet 164 of the cover 16 .
- the evaporating portions 32 of the heat pipes 30 and the base plate 122 of the base 12 absorb heat from the heat generating component.
- the heat is absorbed by the evaporating portions 32 of the heat pipes 30 spreads to the base plate 122 and the fin set 20 via the condensing portions of the heat pipes 30 to be dissipated into ambient air in virtue of the fan 40 .
- the heat in the base plate 122 is transmitted to the heat exchanging members 124 .
- Liquid entering the sealed chamber of the heat exchanger 10 through the inlet 162 travels through the heat exchanging members 124 , then leaves the heat exchanger 10 from the outlet 164 to take the heat in the heat exchanging members 124 and the base plate 122 .
- the inlet 162 and outlet 164 formed on the corresponding inclined faces of the cover 16 extend upwardly and outwardly from the cover 16 , whereby the conduits connected to the inlet 162 and outlet 164 extend laterally from the cover 16 and would not block the way of airflow inhaled by the fan 40 and blown to the fin set 20 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present disclosure relates generally to cooling devices, and more particularly to a liquid-cooling device for dissipating waste heat generated by electrical or electronic components and assemblies.
- 2. Description of Related Art
- Nowadays, various cooling devices are used to remove heat from electrical or electronic components which generate a large amount of heat during operation. Metallic heat sinks with fins, heat exchangers utilizing phase-change, or liquid cooling devices are in most common use. In a liquid cooling device, a plurality of channels is defined for travel of liquid which carries heat therein. Generally, the channels in the liquid cooling device are formed by milling and drilling a metal stock, for example, a copper block. The milling and drilling process incurs a high manufacturing cost of the liquid cooling device. Moreover, to enhance the performance of the liquid cooling device to meet the ever increasing amount of heat of the electronic component needing to be dissipated requires the liquid cooling device to increase its size (and accordingly weight) proportionally. The increase of the size and weight of the liquid cooling device conflicts with the tendency of compactness and portability of the electronic products.
- What is needed is a liquid cooling device which is compact and has a high work performance.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric, assembled view of a liquid-cooling device in accordance with an exemplary embodiment of the present disclosure. -
FIG. 2 is an exploded view of the liquid-cooling device ofFIG. 1 . -
FIG. 3 is an inverted view of the liquid-cooling device ofFIG. 2 . -
FIG. 4 is an enlarged, exploded view of a heat exchanger of the liquid-cooling device ofFIG. 2 . -
FIG. 5 is a side elevation view of the liquid-cooling device ofFIG. 1 . - Referring to
FIGS. 1-5 , a liquid-cooling device in accordance with an exemplary embodiment of the present disclosure is especially useful in efficiently dissipating heat from highly integrated heat generating component such as microprocessors or computer chips (not shown) operating under high heat flux conditions. The liquid cooling device comprises aheat exchanger 10, afin set 20 located over a space behind a rear side of theheat exchanger 10, a plurality ofheat pipes 30 thermally connecting theheat exchanger 10 and the fin set 20 together, afan 40 and twofan holders 50 holding thefan 40 on a front side of thefin set 20. Thefan 40 is located over the rear side of theheat exchanger 10. - Particularly referring to
FIG. 4 , theheat exchanger 10 comprises abase 12, ahousing 14 fixed on thebase 12, acover 16 engaging with a top end of thehousing 14 and twofixing legs 18 attached to a bottom of thebase 12. Thebase 12 is made of thermally conductive material, such as copper or aluminum and comprises abase plate 122 and a plurality of heat-exchangingmembers 124 protruding upwardly and perpendicularly from a top surface of thebase plate 122. Each heat-exchangingmember 124 has a pin-like configuration with a square cross section, although it is not limited to such configuration and cross section. Thebase plate 122 is substantially T-shaped in profile, having a large top surface and a small bottom surface. The top surface of thebase plate 122 is rectangular, although it is not limited to this shape. The bottom surface of thebase plate 122 is used for contacting a heat generating component (not shown). Thebase plate 122 defines fourengaging holes 1220 respectively in four corners thereof for engagingly receivingfixtures 200 to assemble the components of theheat exchanger 10 together. A plurality of receivinggrooves 1222 are defined in a middle portion of the bottom surface of thebase plate 122. Thereceiving grooves 1222 are perpendicular to front and rear long sides of thebase plate 122 and closely arranged side by side to each other. The heat-exchangingmembers 124 are located at a central portion of the top surface of thebase plate 122 and arranged in a matrix and spaced from each other with a constant distance. - The
housing 14 has fourperipheral sidewalls 140 perpendicularly interconnecting each other to cooperatively define a hollow cuboid. Thehousing 14 is vertically placed on thebase plate 122 of thebase 12. Thehousing 14 defines twoannular slots 142 respectively in bottom and top faces thereof. Each annular slot 42 is for accommodating asealing ring 100 therein for ensuring a hermetical seal of thehousing 14 with thecover 16 and thebase plate 122 of thebase 12 of theheat exchanger 10. Four opened receiving channels 144 are respectively defined in four corners of thehousing 14 for receiving thefixtures 200 therein. The receiving channels 144 are vertically extended through thehousing 14. In addition, the receiving channels 144 are horizontally opened to an environment surrounding thehousing 14 via four tips of the four corners of thehousing 14, whereby thehousing 14 including the four receiving channels 144 can be formed simply by aluminum extrusion. - The
cover 16 is with an isosceles trapezoid-shaped cross section and has two inclined faces on a top thereof and facing opposite to each other. The inclined faces are titled downwardly in respect to a middle of the top of thecover 16. Aninlet 162 and anoutlet 164 are respectively defined through the two inclined faces of thecover 16 so as to be in fluid communication with theheat exchanger 10. Theinlet 162 and theoutlet 164 are perpendicular to corresponding inclined faces and located adjacent to a front side of thecover 16 so that thefan 40 is located above thecover 16 and closely behind theinlet 162 andoutlet 164. Twofixing flanges 166 respectively extend laterally and horizontally from lower edges of the two inclined faces of thecover 16. Eachfixing flange 166 therein defines two throughholes 1660 adjacent to two opposite ends thereof for a downward extension of acorresponding fixture 200 therethrough. - Each of the
fixing legs 18 comprises amiddle portion 182 fixed to the bottom surface of thebase plate 122 and twofixing portions 184 extending obliquely and downwardly from two opposite ends of themiddle portion 182. Themiddle portions 182 of the twofixing legs 18 are located at two opposite sides of the receivinggrooves 1222. The twofixing portions 184 of eachfixing leg 18 are located at a lateral side of thebase plate 122 forfasteners 300 respectively extending therethrough to mount theheat exchanger 10 onto the heat generating component (not shown). - To assemble the
heat exchanger 10, thefixtures 200 extend downwardly through corresponding throughholes 166 of thecover 16 and the corresponding receiving channels 144 of thehousing 14 in sequence and then are screwed into the correspondingengaging holes 1220 of thebase 12, to thus assemble thebase 12,housing 14 and thecover 16 together and define a sealed chamber (not labeled) in theheat exchanger 10, which contains the heat-exchangingmembers 124 of thebase 12 and working liquid therein. Two extension lines of the axes of theinlet 162 andoutlet 164 intersect at the centre of thebase plate 122 for facilitating the inflow and outflow of the working liquid corresponding to a central heat-accumulated portion of thebase plate 122. Theinlet 162 andoutlet 164 are connected to a pump (not shown) via conduits (not shown) to construct a flow circulation for the working liquid. - The
fin set 20 comprises a plurality ofrectangular fins 22 which are spaced from each other and parallel to thebase plate 122. Thefin set 20 defines twovertical slots 24 in two oppositely lateral sides thereof for engagingly receiving thefan holders 50 therein. A plurality of receivingholes 26 are defined in thefin set 20 and extend upwardly from the bottom to the top of thefin set 20 without extending through a topmost one of thefins 22 of thefin set 20. The receivingholes 26 wholly receive condensingportions 34 of theheat pipes 30 therein. The receivingholes 26 are spaced from each other, perpendicular to thefins 22 and located at a middle portion of thefin set 20. - The
heat pipes 30 are consistent in quantity with the receivinggrooves 1222 of thebase 122 and the receivingholes 26 of thefin set 20. Eachheat pipe 30 comprises anevaporating portion 32 received in acorresponding receiving groove 1222 of thebase 122 and thecondensing portion 34 extending perpendicularly from an end of theevaporating portion 32 and received in acorresponding receiving hole 26 of thefin set 20. The evaporatingportions 32 of theheat pipes 30 received in the receivinggrooves 1222 are arranged closely side by side to each other and have bottom surfaces thereof coplanar with each other to form a flat face for contacting with the heat-generating component. The evaporatingportion 32 has a semicircular cross section, while thecondensing portion 34 has a round cross section. - The
fan 40 is fastened to the front side of the fin set 20 by thefan holders 50. Thefan 40 is located above theheat exchanger 10 and close to theinlet 162 andoutlet 164 of thecover 16. - In operation of the liquid cooling device, the evaporating
portions 32 of theheat pipes 30 and thebase plate 122 of the base 12 absorb heat from the heat generating component. The heat is absorbed by the evaporatingportions 32 of theheat pipes 30 spreads to thebase plate 122 and the fin set 20 via the condensing portions of theheat pipes 30 to be dissipated into ambient air in virtue of thefan 40. The heat in thebase plate 122 is transmitted to theheat exchanging members 124. Liquid entering the sealed chamber of theheat exchanger 10 through theinlet 162, travels through theheat exchanging members 124, then leaves theheat exchanger 10 from theoutlet 164 to take the heat in theheat exchanging members 124 and thebase plate 122. - According to the configuration of the
heat exchanger 10 of the liquid cooling device, theinlet 162 andoutlet 164 formed on the corresponding inclined faces of thecover 16 extend upwardly and outwardly from thecover 16, whereby the conduits connected to theinlet 162 andoutlet 164 extend laterally from thecover 16 and would not block the way of airflow inhaled by thefan 40 and blown to the fin set 20. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810305173A CN101730449A (en) | 2008-10-24 | 2008-10-24 | Liquid cooling heat abstractor |
CN200810305173.9 | 2008-10-24 |
Publications (1)
Publication Number | Publication Date |
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US20100101756A1 true US20100101756A1 (en) | 2010-04-29 |
Family
ID=42116355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/391,162 Abandoned US20100101756A1 (en) | 2008-10-24 | 2009-02-23 | Liquid-cooling device |
Country Status (2)
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US (1) | US20100101756A1 (en) |
CN (1) | CN101730449A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US20100259900A1 (en) * | 2009-04-14 | 2010-10-14 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20100258282A1 (en) * | 2009-04-10 | 2010-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having fan holders |
CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air-cooling and liquid-cooling dual-purpose radiator |
CN103889193A (en) * | 2014-04-01 | 2014-06-25 | 昆山市张浦镇建茂电子厂 | Dual heat dissipation device of electronic product |
US9029684B2 (en) * | 2009-05-06 | 2015-05-12 | Commissariat à l'énergie atomique et aux énergies alternatives | Hybrid solar receiver and concentrating solar system comprising the same |
US20150245536A1 (en) * | 2014-02-21 | 2015-08-27 | Lenovo (Beijing) Co., Ltd. | Heat Dissipating Device And Electronic Apparatus |
US20190113287A1 (en) * | 2016-03-31 | 2019-04-18 | Nec Corporation | Phase change cooling system and electronic device |
US10790215B1 (en) * | 2019-05-27 | 2020-09-29 | Cooler Master Technology Inc. | Heat dissipation device |
CN113645805A (en) * | 2021-07-29 | 2021-11-12 | 苏州浪潮智能科技有限公司 | A liquid cooling radiator and server |
US20240114658A1 (en) * | 2022-09-29 | 2024-04-04 | Advanced Micro Devices, Inc. | Component cooler for a computing device |
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CN104684368A (en) * | 2015-04-01 | 2015-06-03 | 昆山固德利金属制品有限公司 | Water cooling heat dissipation device |
CN105224054B (en) * | 2015-11-13 | 2018-11-02 | 屠雪祥 | Heat radiation module |
CN107436657B (en) * | 2016-05-26 | 2019-11-01 | 刘小明 | PC terminal and its radiator |
CN109857226B (en) * | 2018-12-28 | 2022-02-11 | 华东交通大学 | An external conduction type computer cooling fan |
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2009
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