US20100059203A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100059203A1 US20100059203A1 US12/399,030 US39903009A US2010059203A1 US 20100059203 A1 US20100059203 A1 US 20100059203A1 US 39903009 A US39903009 A US 39903009A US 2010059203 A1 US2010059203 A1 US 2010059203A1
- Authority
- US
- United States
- Prior art keywords
- fins
- heat dissipation
- dissipation device
- label member
- engaging portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- 230000007423 decrease Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Two mounting portions 16 extend horizontally and outwardly from two diagonally opposite corners of the base 12 , respectively. Each of the two mounting portions 16 defines a mounting hole 160 at a center thereof. Two mounting members (not shown) extend through the two mounting holes 160 and engage the printed circuit board, such that the heat sink 10 snugly contacts the electronic component mounted on the printed circuit board.
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Field of the Invention
- The present disclosure relates to heat dissipation, and, more particularly, to a heat dissipation device providing product information of the heat dissipation device.
- 2. Description of Related Art
- Electronic components, such as central processing units (CPUs) comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the CPUs in order to maintain safe operating conditions and assure that the CPUs function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a finned metal heat sink is attached to an outer surface of the CPU to remove the heat therefrom. The heat absorbed by the heat sink is then dissipated to ambient air. The related finned metal heat sink is made of highly heat-conductive metal, such as copper or aluminum, and generally comprises a base contacting the CPU to absorb the heat therefrom and a plurality of fins formed on the base for dissipating the heat.
- Conventionally, the heat sink is further provided with an adhesive label directly attached thereon, adapted for showing product information, such as product logo, product name, and other information. However, the adhesive label is prone to accidental removal in whole or part, with such removal having the potential for unremoved adhesive to remain, contaminating the heat sink and environs. In addition, the adhesive label is aesthetically unpleasing.
- What is needed, therefore, is a heat dissipation device incorporating a label member which can overcome the described limitations.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with the disclosure. -
FIG. 2 is an exploded view of the heat dissipation device ofFIG. 1 . - Referring to
FIG. 1 , a heat dissipation device in accordance with the disclosure is provided to dissipate heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises aheat sink 10 thermally contacting the electronic component and alabel member 20 securely disposed on theheat sink 10. - Also referring to
FIG. 2 , theheat sink 10 is integrally formed of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. Theheat sink 10 comprises arectangular base 12 and a plurality of fins 14 extending upwardly from a top surface thereof. The fins 14 are spaced from each other and extend along a width of thebase 12. Between each two adjacent fins 14 a passage (not labeled) therebetween allows airflow therethrough. The fins 14 comprise a plurality offirst fins 141 divided into two parts located at opposite lateral sides of thebase 12, respectively, and a plurality of second fins 142 at a center of thebase 12 and between the two parts of thefirst fins 141. Height of the second fins 142 gradually decreases from a middle second fin 142 to two outmost second fins 142, respectively, whereby top ends of the second fins 142 cooperatively form a curved surface. Each of the two outmost second fins 142 is shorter than a corresponding inmostfirst fin 141 close to the outmost second fin 142. Twoengaging portions 140 protrude inwardly from top ends of the two inmostfirst fins 141, respectively, and towards each other. The twoengaging portions 140 are two hooks each having a top inclined guide face and a bottom engaging face substantially parallel to thebase 12. Each of the twoengaging portions 140 has a triangular cross-section created by the guide face and the engaging face. The guide faces of the twoengaging portions 140 substantially face each other. Twomounting portions 16 extend horizontally and outwardly from two diagonally opposite corners of thebase 12, respectively. Each of the twomounting portions 16 defines amounting hole 160 at a center thereof. Two mounting members (not shown) extend through the twomounting holes 160 and engage the printed circuit board, such that the heat sink 10 snugly contacts the electronic component mounted on the printed circuit board. - The
label member 20 is an elongated plaque integrally formed of resilient metal or other material. A central portion of thelabel member 20 arches upwardly, whereby thelabel member 20 has a curved configuration. Twoelongated flanges 22 angle upwardly from two opposite lateral sides of thelabel member 20, respectively. A span of thelabel member 20 along a length thereof is approximately equal to an interval between the twoengaging portions 140 of theheat sink 10. - In assembly of the heat dissipation device, the two
flanges 22 of thelabel member 20 securely clasp the bottom engaging faces of the twoengaging portions 140 of theheat sink 10, respectively, by having one of theflanges 22 clasping the bottom engaging face of one of theengaging portions 140 and theother flange 22 moving downwardly along the top inclined guide face of the otherengaging portion 140 until theother flange 22 also clasps the bottom engaging face of the otherengaging portion 140. Thelabel member 20 spans the second fins 142 of theheat sink 10, wherein a bottom surface of thelabel member 20 is snugly received on the top ends of the second fins 142. To release thelabel member 20, a lateral portion of thelabel member 20 is depressed until acorresponding flange 22 located there disengages from a correspondingengaging portion 140, then moves anotherflange 22 away from anotherengaging portion 140. Thus, thelabel member 20 can be easily removed. - In use, characters or images are formed on the
label member 20 by stamping, etching or carving or other means, showing product information such as logo, product name or product ID, or other information. - It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary or exemplary embodiments of the invention.
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810304472.0A CN101674718A (en) | 2008-09-11 | 2008-09-11 | Radiation device |
CN200810304472.0 | 2008-09-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100059203A1 true US20100059203A1 (en) | 2010-03-11 |
Family
ID=41798200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/399,030 Abandoned US20100059203A1 (en) | 2008-09-11 | 2009-03-06 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100059203A1 (en) |
CN (1) | CN101674718A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150079734A1 (en) * | 2013-09-18 | 2015-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die-Tracing in Integrated Circuit Manufacturing and Packaging |
US20180138154A1 (en) * | 2016-11-14 | 2018-05-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US11152278B2 (en) * | 2017-10-10 | 2021-10-19 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
US20220408543A1 (en) * | 2021-06-22 | 2022-12-22 | Vacon Oy | Heatsink cooling arrangement |
US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584339A (en) * | 1995-09-08 | 1996-12-17 | Hong; Chen F. | Heat sink assembly for the central processor of computer |
US5594623A (en) * | 1994-09-21 | 1997-01-14 | Hewlett-Packard Co | Method and apparatus for attaching a heat sink and a fan to an integrated circuit package |
US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
US5940269A (en) * | 1998-02-10 | 1999-08-17 | D-Link Corporation | Heat sink assembly for an electronic device |
US6118657A (en) * | 1995-06-07 | 2000-09-12 | Thermalloy, Inc. | Fan attachment clip for heat sink |
US6295202B1 (en) * | 2000-06-29 | 2001-09-25 | Hewlett-Packard Company | Heatsink for actively cooled daughterboard system |
US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
US7339792B2 (en) * | 2005-12-14 | 2008-03-04 | Evga Corporation | Graphics card apparatus with improved heat dissipating assemblies |
US7515420B2 (en) * | 2007-03-27 | 2009-04-07 | Adc Telecommunications, Inc. | Apparatus for transferring heat between two corner surfaces |
US7616441B2 (en) * | 2007-08-06 | 2009-11-10 | Chin-Fu Horng | Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module |
US20110002119A1 (en) * | 2009-07-01 | 2011-01-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with large light emitting angle |
-
2008
- 2008-09-11 CN CN200810304472.0A patent/CN101674718A/en active Pending
-
2009
- 2009-03-06 US US12/399,030 patent/US20100059203A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5594623A (en) * | 1994-09-21 | 1997-01-14 | Hewlett-Packard Co | Method and apparatus for attaching a heat sink and a fan to an integrated circuit package |
US6118657A (en) * | 1995-06-07 | 2000-09-12 | Thermalloy, Inc. | Fan attachment clip for heat sink |
US5584339A (en) * | 1995-09-08 | 1996-12-17 | Hong; Chen F. | Heat sink assembly for the central processor of computer |
US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
US5940269A (en) * | 1998-02-10 | 1999-08-17 | D-Link Corporation | Heat sink assembly for an electronic device |
US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
US6295202B1 (en) * | 2000-06-29 | 2001-09-25 | Hewlett-Packard Company | Heatsink for actively cooled daughterboard system |
US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
US7339792B2 (en) * | 2005-12-14 | 2008-03-04 | Evga Corporation | Graphics card apparatus with improved heat dissipating assemblies |
US7515420B2 (en) * | 2007-03-27 | 2009-04-07 | Adc Telecommunications, Inc. | Apparatus for transferring heat between two corner surfaces |
US7616441B2 (en) * | 2007-08-06 | 2009-11-10 | Chin-Fu Horng | Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module |
US20110002119A1 (en) * | 2009-07-01 | 2011-01-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with large light emitting angle |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150079734A1 (en) * | 2013-09-18 | 2015-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die-Tracing in Integrated Circuit Manufacturing and Packaging |
US9508653B2 (en) * | 2013-09-18 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die-tracing in integrated circuit manufacturing and packaging |
US20180138154A1 (en) * | 2016-11-14 | 2018-05-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US10529692B2 (en) * | 2016-11-14 | 2020-01-07 | Samsung Electronics Co., Ltd. | Semiconductor module including package and heat transfer structure |
US10593648B2 (en) | 2016-11-14 | 2020-03-17 | Samsung Electronics Co., Ltd. | Heart transfer label structure |
US20200176423A1 (en) * | 2016-11-14 | 2020-06-04 | Samsung Electronics Co., Ltd. | Semiconductor module |
US10840221B2 (en) * | 2016-11-14 | 2020-11-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
TWI764887B (en) * | 2016-11-14 | 2022-05-21 | 南韓商三星電子股份有限公司 | Semiconductor module |
US11152278B2 (en) * | 2017-10-10 | 2021-10-19 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
US20220408543A1 (en) * | 2021-06-22 | 2022-12-22 | Vacon Oy | Heatsink cooling arrangement |
Also Published As
Publication number | Publication date |
---|---|
CN101674718A (en) | 2010-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHU, CHING-HUNG;LI, CHANG-MU;REEL/FRAME:022353/0634 Effective date: 20090303 Owner name: HON HAI PRECISION INDUSTRY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHU, CHING-HUNG;LI, CHANG-MU;REEL/FRAME:022353/0634 Effective date: 20090303 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |