US20100059105A1 - Use of polyamide as an encapsulating material for photovoltaic modules - Google Patents
Use of polyamide as an encapsulating material for photovoltaic modules Download PDFInfo
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- US20100059105A1 US20100059105A1 US12/597,346 US59734608A US2010059105A1 US 20100059105 A1 US20100059105 A1 US 20100059105A1 US 59734608 A US59734608 A US 59734608A US 2010059105 A1 US2010059105 A1 US 2010059105A1
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- Prior art keywords
- polyamide
- photovoltaic module
- module according
- film
- layer
- Prior art date
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Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 title claims abstract description 41
- 229920002647 polyamide Polymers 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 35
- 229920002313 fluoropolymer Polymers 0.000 claims description 29
- 239000004811 fluoropolymer Substances 0.000 claims description 29
- 239000002131 composite material Substances 0.000 claims description 20
- -1 polychlorotrifluoroethylene Polymers 0.000 claims description 17
- 229920000728 polyester Polymers 0.000 claims description 12
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 claims description 7
- 229920002292 Nylon 6 Polymers 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000012876 carrier material Substances 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 229920000299 Nylon 12 Polymers 0.000 claims description 5
- ADTHJEKIUIOLBX-UHFFFAOYSA-N 1,1,3,4,4,5,5,6,6,6-decafluoro-3-(trifluoromethyl)hex-1-ene Chemical compound FC(C(F)(F)F)(C(C(C(F)(F)F)(C=C(F)F)F)(F)F)F ADTHJEKIUIOLBX-UHFFFAOYSA-N 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004954 Polyphthalamide Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920006375 polyphtalamide Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 3
- 125000005609 naphthenate group Chemical group 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920007925 Ethylene chlorotrifluoroethylene (ECTFE) Polymers 0.000 claims description 2
- 229920000571 Nylon 11 Polymers 0.000 claims description 2
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 229920000554 ionomer Polymers 0.000 claims description 2
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- 239000004608 Heat Stabiliser Substances 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 claims 1
- 238000006460 hydrolysis reaction Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229920006018 co-polyamide Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000019612 pigmentation Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/85—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2377/00—Polyamides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31562—Next to polyamide [nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31565—Next to polyester [polyethylene terephthalate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31736—Next to polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Definitions
- the invention relates to the use of polyamide as an encapsulating material for photovoltaic modules.
- Photovoltaic modules are used to generate electrical power.
- part of the structure of photovoltaic modules comprises solar cells which, by exposure to sunlight, generate electrical charges which can be drawn off as current.
- these solar cells are sensitive to mechanical influences or weathering influences to different extents.
- Encapsulating materials are used in order to protect said solar cells from these influences. These materials can consist of one or more layer(s), made of glass and/or plastic composites.
- composites of fluoropolymer materials and polyester (PET) are used as standard for encapsulating materials.
- a fluoropolymer layer on the outside guarantees weathering resistance
- the PET film in the core guarantees the mechanical stability and the electrical insulation
- another fluoropolymer layer on the inside guarantees the connection to the embedding material of the solar cells.
- the adhesion to the embedding material e.g. ethylvinyl acetate (EVA) is low.
- EVA ethylvinyl acetate
- relatively thick composites are required to ensure the desired electrical insulation. This is attributable on the one hand to the low insulating capacity of fluoropolymer layers and on the other hand, to the adhesive layers used as standard between the films.
- the smallest irregularities or inclusions in the adhesive layers have the result that high currents flow in a punctiform manner. This phenomenon must be counteracted by a larger thickness of the PET film in the core as a precaution.
- the present invention wishes to remedy this.
- polyamide as an encapsulating material for the production of photovoltaic modules is provided according to the invention.
- polyamide is advantageously effected as a film or as a film composite containing polyamide (PA).
- PA polyamide
- plastic composite comprising a carrier material selected from the group of polyethylene terephthalate (PET), polyethylene naphthenate (PEN) or ethylene tetrafluoroethylene copolymer (ETFE), as well as polyamide-12 layers adjoining the carrier material on both sides.
- PET polyethylene terephthalate
- PEN polyethylene naphthenate
- ETFE ethylene tetrafluoroethylene copolymer
- polyamide makes it possible to achieve very good adhesion to the embedding material which, as described above, can be, for example, EVA.
- the electrical insulation can be improved significantly by using a polyamide single film with the same thickness as compared to a composite comprising fluoropolymer layers and PET. It is not possible for high currents to flow in a punctiform manner via defects or inclusions in the adhesive layers.
- Polyamide films can likewise be designed as weather- and UV-stabilised so that values comparable to those when using fluoropolymers can also be achieved with regard to these properties.
- Various colour combinations can also be adjusted by means of pigmentation.
- two production steps i.e. the production of the PET/fluoropolymer layer composite and the fluoropolymer layer/PET/fluoropolymer layer composite can be saved.
- FIGS. 1 to 5 The invention is explained in detail hereinafter with reference to possible embodiments—see FIGS. 1 to 5 —as well as with reference to a possible exemplary embodiment.
- FIG. 1 shows the exemplary structure of a photovoltaic module which is encapsulated with the material 1 used according to the invention.
- the encapsulating material 1 comprises a weather-resistant film which at the same time serves as an adhesion promoter to the embedding material 2 .
- the embedding material 2 produces the non-positive connection to the solar cells 3 and to the embedding material 2 ′.
- the embedding material 2 ′ further ensures the non-positive connection to the encapsulating material 4 .
- FIG. 2 shows the exemplary structure of a photovoltaic module which is encapsulated with the material 1 used according to the invention.
- the encapsulating material 1 is used on both sides of the solar cells 3 .
- FIG. 3 shows the exemplary structure of a photovoltaic module which is encapsulated with the material 1 used according to the invention.
- a fluoropolymer layer 5 is used as an additional layer to the encapsulating material 1 on the side facing away from the solar cells 3 .
- the fluoropolymer layer 5 and the encapsulating material 4 thus constitute the respectively outermost layer of the photovoltaic module.
- FIG. 4 shows the use according to the invention of a plastic composite 1 , 1 ′ with the polyamide 12 layers 12 which are disposed on both sides of the carrier material 13 .
- the carrier material consists of polyethylene terephthalate or polyethylene naphthenate or ethylene tetrafluoroethylene copolymer.
- FIG. 5 shows a possible laminating device for producing a non-positive composite 6 from the materials 1 and 5 according to FIG. 3 .
- the encapsulating material 1 which is selected according to the exemplary embodiment is coated with adhesive by means of the applicator unit 7 and after passing through a drier 10 is adhesively bonded to the fluoropolymer layer 5 .
- the contact between the two films is controlled by the pressing pressure between the rollers 11 .
- the material 1 can be pre-treated by means of physical media 9 before each production step.
- the non-positive connection between the encapsulating material 1 and the fluoropolymer layer 5 can also be produced by co-extrusion. In this case, it is also possible to insert an adhesion promoter layer between the materials 1 and 5 and thus produce a triple-layer co-extrudate.
- the encapsulating material 1 itself can comprise a monolayer or likewise a co-extrudate of several layers.
- the material 1 Before using the encapsulating material 1 according to the invention or also before adhesive bonding with the fluoropolymer layer 5 , the material 1 can be pre-treated by means of chemical or physical media. This pre-treatment can be implemented on one or also on both sides of the encapsulating material 1 .
- Encapsulating material 1 as film polyamides (PA) of the type polyamide 6, polyamide 66, polyamide 7, polyamide 9, polyamide 10, polyamide 11, polyamide 12, polyamide 69, polyamide 6 10, polyamide 6 12, PA-6-3-T, PA 6I, polyphthalamide (PPA) as well as other possible aromatic, partially aromatic and co-polyamides comprising these types.
- PA polyamides
- PA polyphthalamide
- Embedding material 2 , 2 ′ ethylvinylacetate (EVA), polyvinylbutyral (PVB), ionomers, polymethylmethacrylate (PMMA), polyurethane, polyester, hotmelt or silicone elastomers.
- EVA ethylvinylacetate
- PVB polyvinylbutyral
- PMMA polymethylmethacrylate
- polyurethane polyester, hotmelt or silicone elastomers.
- Encapsulating material 4 glass
- PVDF polyvinylfluoride
- ECTFE ethylenechloro trifluoroethylene
- PCTFE polychlorotrifluoroethylene
- ETFE ethylenetetra-fluoroethylene
- PTFE polytetrafluoroethylene-hexafluoropropylene-vinylidenefluoride
- Fluoropolymer layer 5 as coating fluoropolymer from the group of selectively soluble fluoropolymers.
- the photovoltaic modules constructed from the aforesaid components are extremely stable when used outside which can be attributed, inter alia, to the good adhesion of polyamide to the embedding material.
Landscapes
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyesters Or Polycarbonates (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
- The invention relates to the use of polyamide as an encapsulating material for photovoltaic modules.
- Photovoltaic modules are used to generate electrical power. In this case, part of the structure of photovoltaic modules comprises solar cells which, by exposure to sunlight, generate electrical charges which can be drawn off as current. Depending on the type, these solar cells are sensitive to mechanical influences or weathering influences to different extents. Encapsulating materials are used in order to protect said solar cells from these influences. These materials can consist of one or more layer(s), made of glass and/or plastic composites.
- At the present time, composites of fluoropolymer materials and polyester (PET) are used as standard for encapsulating materials. A fluoropolymer layer on the outside guarantees weathering resistance, the PET film in the core guarantees the mechanical stability and the electrical insulation and another fluoropolymer layer on the inside guarantees the connection to the embedding material of the solar cells.
- With these materials it is found that the adhesion to the embedding material, e.g. ethylvinyl acetate (EVA) is low. Furthermore, relatively thick composites are required to ensure the desired electrical insulation. This is attributable on the one hand to the low insulating capacity of fluoropolymer layers and on the other hand, to the adhesive layers used as standard between the films. The smallest irregularities or inclusions in the adhesive layers have the result that high currents flow in a punctiform manner. This phenomenon must be counteracted by a larger thickness of the PET film in the core as a precaution.
- The present invention wishes to remedy this.
- The use of polyamide as an encapsulating material for the production of photovoltaic modules is provided according to the invention.
- The use of polyamide is advantageously effected as a film or as a film composite containing polyamide (PA). The advantageous use of a plastic composite is further proposed, said composite comprising a carrier material selected from the group of polyethylene terephthalate (PET), polyethylene naphthenate (PEN) or ethylene tetrafluoroethylene copolymer (ETFE), as well as polyamide-12 layers adjoining the carrier material on both sides.
- The use of polyamide makes it possible to achieve very good adhesion to the embedding material which, as described above, can be, for example, EVA. In particular, the electrical insulation can be improved significantly by using a polyamide single film with the same thickness as compared to a composite comprising fluoropolymer layers and PET. It is not possible for high currents to flow in a punctiform manner via defects or inclusions in the adhesive layers.
- Polyamide films can likewise be designed as weather- and UV-stabilised so that values comparable to those when using fluoropolymers can also be achieved with regard to these properties. Various colour combinations can also be adjusted by means of pigmentation. Furthermore, two production steps, i.e. the production of the PET/fluoropolymer layer composite and the fluoropolymer layer/PET/fluoropolymer layer composite can be saved.
- Special standards relating to flame retardancy can be used for photovoltaic modules, in particular when mounted on roofs and integrated in buildings. Detailed explanations on this can be found in the standards of the Underwriter Laboratories UL94 and UL790. In order to be able to likewise use the advantages according to the invention of polyamide under these conditions, it is necessary to produce a composite with a fluoropolymer layer as a flame-retardant layer on the outside. Special applications can also necessitate the additional use of another film, e.g. made of polyethylene terephthalate, between the fluoropolymer layer and the PA film.
- Further embodiments of the use according to the invention are disclosed in the patent claims.
- The invention is explained in detail hereinafter with reference to possible embodiments—see FIGS. 1 to 5—as well as with reference to a possible exemplary embodiment.
-
FIG. 1 shows the exemplary structure of a photovoltaic module which is encapsulated with thematerial 1 used according to the invention. The encapsulatingmaterial 1 comprises a weather-resistant film which at the same time serves as an adhesion promoter to the embeddingmaterial 2. The embeddingmaterial 2 produces the non-positive connection to thesolar cells 3 and to the embeddingmaterial 2′. The embeddingmaterial 2′ further ensures the non-positive connection to the encapsulatingmaterial 4. -
FIG. 2 shows the exemplary structure of a photovoltaic module which is encapsulated with thematerial 1 used according to the invention. In contrast toFIG. 1 , in this exemplary structure, theencapsulating material 1 is used on both sides of thesolar cells 3. -
FIG. 3 shows the exemplary structure of a photovoltaic module which is encapsulated with thematerial 1 used according to the invention. In order to satisfy additionally higher requirements on the flame retardancy such as prescribed, for example, in the corresponding standards UL94 and UL790, afluoropolymer layer 5 is used as an additional layer to the encapsulatingmaterial 1 on the side facing away from thesolar cells 3. In this exemplary design, thefluoropolymer layer 5 and the encapsulatingmaterial 4 thus constitute the respectively outermost layer of the photovoltaic module. -
FIG. 4 shows the use according to the invention of aplastic composite polyamide 12layers 12 which are disposed on both sides of thecarrier material 13. The carrier material consists of polyethylene terephthalate or polyethylene naphthenate or ethylene tetrafluoroethylene copolymer. -
FIG. 5 shows a possible laminating device for producing anon-positive composite 6 from thematerials FIG. 3 . Theencapsulating material 1 which is selected according to the exemplary embodiment is coated with adhesive by means of the applicator unit 7 and after passing through a drier 10 is adhesively bonded to thefluoropolymer layer 5. The contact between the two films is controlled by the pressing pressure between therollers 11. In this case, thematerial 1 can be pre-treated by means of physical media 9 before each production step. - The non-positive connection between the encapsulating
material 1 and thefluoropolymer layer 5 can also be produced by co-extrusion. In this case, it is also possible to insert an adhesion promoter layer between thematerials encapsulating material 1 itself can comprise a monolayer or likewise a co-extrudate of several layers. - Before using the
encapsulating material 1 according to the invention or also before adhesive bonding with thefluoropolymer layer 5, thematerial 1 can be pre-treated by means of chemical or physical media. This pre-treatment can be implemented on one or also on both sides of the encapsulatingmaterial 1. - The following exemplary embodiment reproduces possible variants for the selection of the components in the respective layers:
- Encapsulating
material 1 as film: polyamides (PA) of thetype polyamide 6, polyamide 66, polyamide 7, polyamide 9, polyamide 10,polyamide 11,polyamide 12, polyamide 69,polyamide 6 10,polyamide 6 12, PA-6-3-T, PA 6I, polyphthalamide (PPA) as well as other possible aromatic, partially aromatic and co-polyamides comprising these types. - Embedding
material - Encapsulating material 4: glass
-
Fluoropolymer layer 5 as film: polyvinylfluoride (PVF), polyvinylidenefluoride (PVDF), ethylenechloro trifluoroethylene (ECTFE), polychlorotrifluoroethylene (PCTFE), ethylenetetra-fluoroethylene (ETFE), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene-vinylidenefluoride (THV), tetrafluoroethylene-perfluoroalkoxy-vinylether-copolymerisate (PFA), perfluoro-ethylene-propylene (FEP). -
Fluoropolymer layer 5 as coating: fluoropolymer from the group of selectively soluble fluoropolymers. - The photovoltaic modules constructed from the aforesaid components are extremely stable when used outside which can be attributed, inter alia, to the good adhesion of polyamide to the embedding material.
Claims (31)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0073407A AT505186A1 (en) | 2007-05-10 | 2007-05-10 | USE OF A PLASTIC COMPOSITE FOR THE MANUFACTURE OF PHOTOVOLTAIC MODULES |
ATA734/2007 | 2007-05-10 | ||
ATA2087/2007 | 2007-12-20 | ||
AT0208707A AT505199A1 (en) | 2007-05-10 | 2007-12-20 | USE OF POLYAMIDE AS A PACKAGING MATERIAL FOR PHOTOVOLTAIC MODULES |
PCT/AT2008/000158 WO2008138021A2 (en) | 2007-05-10 | 2008-05-08 | Use of polyamide as an encapsulating material for photovoltaic modules |
Publications (1)
Publication Number | Publication Date |
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US20100059105A1 true US20100059105A1 (en) | 2010-03-11 |
Family
ID=39592809
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/597,597 Expired - Fee Related US8318316B2 (en) | 2007-05-10 | 2008-05-08 | Use of a polymer composite for the production of photovoltaic modules |
US12/597,346 Abandoned US20100059105A1 (en) | 2007-05-10 | 2008-05-08 | Use of polyamide as an encapsulating material for photovoltaic modules |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/597,597 Expired - Fee Related US8318316B2 (en) | 2007-05-10 | 2008-05-08 | Use of a polymer composite for the production of photovoltaic modules |
Country Status (22)
Country | Link |
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US (2) | US8318316B2 (en) |
EP (2) | EP2150987A2 (en) |
JP (2) | JP2010527142A (en) |
KR (2) | KR20100014682A (en) |
CN (2) | CN101715608A (en) |
AR (3) | AR066506A1 (en) |
AT (5) | AT505186A1 (en) |
BR (2) | BRPI0811286A2 (en) |
CA (2) | CA2684637A1 (en) |
CL (2) | CL2008001370A1 (en) |
CY (1) | CY1111856T1 (en) |
DK (1) | DK2143148T3 (en) |
ES (1) | ES2366685T3 (en) |
HR (1) | HRP20110691T1 (en) |
MX (2) | MX2009009561A (en) |
PE (2) | PE20090085A1 (en) |
PL (1) | PL2143148T3 (en) |
PT (1) | PT2143148E (en) |
RS (1) | RS51813B (en) |
RU (2) | RU2438210C2 (en) |
SI (1) | SI2143148T1 (en) |
WO (2) | WO2008138021A2 (en) |
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