+

US20090293676A1 - Method of recovering valuable metals from waste - Google Patents

Method of recovering valuable metals from waste Download PDF

Info

Publication number
US20090293676A1
US20090293676A1 US12/186,333 US18633308A US2009293676A1 US 20090293676 A1 US20090293676 A1 US 20090293676A1 US 18633308 A US18633308 A US 18633308A US 2009293676 A1 US2009293676 A1 US 2009293676A1
Authority
US
United States
Prior art keywords
glass fiber
valuable metals
waste
metals
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/186,333
Inventor
Tetsuyuki Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20090293676A1 publication Critical patent/US20090293676A1/en
Priority to US13/902,342 priority Critical patent/US20130333522A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B1/00Preliminary treatment of ores or scrap
    • C22B1/005Preliminary treatment of scrap
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/001Dry processes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00Obtaining noble metals
    • C22B11/02Obtaining noble metals by dry processes
    • C22B11/021Recovery of noble metals from waste materials
    • C22B11/025Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00Obtaining copper
    • C22B15/0026Pyrometallurgy
    • C22B15/0056Scrap treating
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/005Separation by a physical processing technique only, e.g. by mechanical breaking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/178Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method of recovering valuable metals from wastes such as IC circuits board and printed wiring board.
  • Printed wiring boards commonly used in personal computers and cell phones contain significant amounts of metals used therein.
  • printed wiring boards have an insulation board such as glass epoxy substrate and semiconductor elements, capacitors, resistors, and wirings in combination formed thereon, and generally, the organic component content is said to be 32%; the glass component content, 38%; and the metal component content, about 30%.
  • the metal materials are said to contain copper in the greatest amount and additionally valuable metals such as tin, iron, lead, nickel and gold in an amount of 0.1% in the printed wiring board.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-301225.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2001-259603.
  • the glass fiber therein melts in the heating step into a melt-solidified solid state containing the metals inside.
  • An object of the present invention which was made to solve the problems above, is to provide a method of recovering valuable metals from waste, the waste being an integrated industrial waste containing a glass fiber, an epoxy resin and valuable metals such as copper, iron, gold and aluminum, comprising heating the industrial waste to a temperature at which the glass fiber does not melt but degrades, removing the degraded glass fiber, and thus, recovering the valuable metals contained in the waste.
  • the method of recovering metals from waste according to the present invention has the following advantages:
  • the method does not demand heating or fusion at high temperature and is thus, lower in concern about environmental pollution, and can be used in countries where stricter laws and regulations are imposed.
  • FIG. 1(A) is a photograph showing printed wiring boards heated respectively under temperature-period conditions in the range of 300° C. for 10 minutes and 750° C. for 20 minutes.
  • FIG. 1(B) is an English translation in table form of the Japanese characters shown in FIG. 1(A) .
  • FIG. 2(A) is a photograph showing printed wiring boards heated respectively under temperature-period conditions in the range of 750° C. for 30 minutes and 1000° C. for 40 minutes.
  • FIG. 2(B) is an English translation in table form of the Japanese characters shown in FIG. 2(A) .
  • FIGS. 3 to 34 are photographs of a heated printed wiring board.
  • the industrial wastes processed by the recovery method according to the present invention are industrial wastes such as printed wiring boards.
  • the temperature and the period are such that the glass fiber does not melt but decomposes.
  • the “favorable results” mean that the glass fiber and the valuable metals are separated and only the valuable metals are recovered easily.
  • the temperature and the period above are selected, because the glass fiber melts when heated under a temperature/period condition severer than the temperature/period condition above and solidifies itself when cooled.
  • the melted glass fiber solidifies itself into a solid state, while enclosing the metals therein, prohibiting recovery of the metals from the state once formed.
  • the metals have been recovered after the metals and the glass fiber are both melted at high temperature, by using the difference in specific density.
  • the glass fiber does not melt, eliminating the possibility of the glass fiber melt-enclosing the metals.
  • the glass fiber sheet when heated at 500° C. for 20 minutes or less, retains its original shape and still contains the metals therein without separation, although the surface thereof turns brown in color.
  • the glass fiber sheet in that state is resistant to pulverization under pressure and cannot be separated from the metals.
  • the glass fiber sheet and the metals are separated actually, when heated under a condition in the range of 500° C. for 20 minute or more to 750° C. for 30 minutes or less.
  • the lower limit heating condition is more preferably approximately 750° C. for 30 minutes or more.
  • the glass fiber sheet apparently retains its plate shape as a sheet, but is pulverized easily under external force, for example by the force when the sheet is held with fingers.
  • the metals do not melt in the temperature range.
  • the glass fiber is pulverized easily by slight vibration or pressurization by roller, favorably allowing recovery of the metal components as they are.
  • Printed wiring boards were heated in various temperature conditions of upward from 300° C. for 10 minutes at intervals of 100° C. and 10 minutes.
  • the fiber sheet and the metals retain their shapes and are not separated from each other. In particular at the low temperature side, the fiber sheet is only discolored. The fiber sheet retains its original shape, even when pressurized by hand. ⁇ The fiber sheet and the metals are separated from each other. Thus, the valuable metals can be collected. However, the fiber sheet retains its shape and is resistant to pulverization. ⁇ Apparently, the fiber sheet retains its shape. However, it is pulverized easily by slight pressurization or by the force when it is held with fingers. Because the glass fiber can be pulverized easily into powdery, it is possible to separate the valuable metals easily from the powder. ⁇ The glass is solidified into an aggregate state, while holding the metals. Aggregates as hard as rock are obtained when the waste is heated at higher temperature for an elongated period. The metals, which are entrapped in the melted glass, are difficult to separate.
  • the waste may be heated in a low-oxygen state generated by burning carbon additionally as the heat source.
  • the glass fiber sheet When heated in a temperature-period condition in the range above, in particular when heated in the range of 500° C. for 20 minutes or more and 750° C. for 30 minutes or less, the glass fiber sheet mostly retains its original shape but is separated from the valuable metals.
  • the glass fiber when heated in the range of 750° C. for 30 minutes or more, the glass fiber degrades to such a degree that it is pulverized easily into powder by application of slight external force, such as that when the glass fiber is held with fingers, or by application of vibration or pressure.
  • the glass fiber does not melt, because the heating temperature-period condition is 1000° C. for 10 minutes or less, and thus, the metal components remains as they are without entrapment in the melted glass fiber.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Processing Of Solid Wastes (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

A method which allows recovery of valuable metals in simple steps from printed wiring board or the like is provided.
The waste is an integrated industrial waste containing a glass fiber, an epoxy resin and valuable metals such as copper, iron, gold and aluminum. The method comprises heating the industrial waste to a temperature at which the glass fiber does not melt but degrades, followed by removing the degraded glass fiber.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a method of recovering valuable metals from wastes such as IC circuits board and printed wiring board.
  • 2. Description of the Related Art
  • Printed wiring boards commonly used in personal computers and cell phones contain significant amounts of metals used therein.
  • Specifically, printed wiring boards have an insulation board such as glass epoxy substrate and semiconductor elements, capacitors, resistors, and wirings in combination formed thereon, and generally, the organic component content is said to be 32%; the glass component content, 38%; and the metal component content, about 30%.
  • Most of the organic matter is an epoxy resin, and approximately 66% of the glass components is SiO2.
  • In particular, the metal materials are said to contain copper in the greatest amount and additionally valuable metals such as tin, iron, lead, nickel and gold in an amount of 0.1% in the printed wiring board.
  • Because these wastes contain a great amount of precious valuable metals, various methods of recovering the metals were developed and commercialized.
  • Patent Document 1: Japanese Patent Application Laid-Open No. 2003-301225.
  • Patent Document 2: Japanese Patent Application Laid-Open No. 2001-259603.
  • SUMMARY OF THE INVENTION
  • The conventional recovery methods described above, i.e., methods of recovering metals by dissolving the printed wiring board in acid or heating it and then oxidizing or pulverizing it, have the following problems:
  • <1> The glass fiber therein melts in the heating step into a melt-solidified solid state containing the metals inside.
  • <2> Incineration at high temperature leads to increase of the loads both on the apparatus and the environment.
  • <3> Fusion or electrolysis at high temperature demands great amounts of fuel and power.
  • <4> Although it is possible to dissolve the glass fiber in acid more efficiently by pulverization thereof, the fibrous material is tough and thus difficult to pulverize.
  • An object of the present invention, which was made to solve the problems above, is to provide a method of recovering valuable metals from waste, the waste being an integrated industrial waste containing a glass fiber, an epoxy resin and valuable metals such as copper, iron, gold and aluminum, comprising heating the industrial waste to a temperature at which the glass fiber does not melt but degrades, removing the degraded glass fiber, and thus, recovering the valuable metals contained in the waste.
  • As described above, the method of recovering metals from waste according to the present invention has the following advantages:
  • <1 > The method allows recovery of valuable metals in simple steps without need for an additional step of pulverizing the melt-solidified glass fiber.
  • <2> The method does not demand heating or fusion at high temperature and is thus, lower in concern about environmental pollution, and can be used in countries where stricter laws and regulations are imposed.
  • <3> The method demands smaller amounts of fuel and power and is thus economical.
  • BRIEF DESCRIPTION OF THE DRAWING(S)
  • FIG. 1(A) is a photograph showing printed wiring boards heated respectively under temperature-period conditions in the range of 300° C. for 10 minutes and 750° C. for 20 minutes.
  • FIG. 1(B) is an English translation in table form of the Japanese characters shown in FIG. 1(A).
  • FIG. 2(A) is a photograph showing printed wiring boards heated respectively under temperature-period conditions in the range of 750° C. for 30 minutes and 1000° C. for 40 minutes.
  • FIG. 2(B) is an English translation in table form of the Japanese characters shown in FIG. 2(A).
  • FIGS. 3 to 34 are photographs of a heated printed wiring board.
  • DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
  • Hereinafter, favorable embodiments of the present invention will be described in detail with reference to drawings.
  • EXAMPLES
  • <1 > Wastes to be Processed
  • The industrial wastes processed by the recovery method according to the present invention are industrial wastes such as printed wiring boards.
  • These industrial wastes are characteristic in that they are integrated materials of a glass fiber, an epoxy resin and valuable metals such as copper, iron and gold.
  • <2> Heating Step
  • These industrial wastes are heated at a particular temperature for a particular period of time.
  • The temperature and the period are such that the glass fiber does not melt but decomposes.
  • The relationship between the temperature and the period was determined in many tests.
  • The results showed specifically that the industrial waste is heated favorably under a condition in the range of 500° C. for 20 minutes or more and 1000° C. for 10 minutes or less.
  • More favorable results are found to be obtained, when the industrial waste is processed under a condition in the range of approximately 750° C. for 30 minutes or more to 1000° C. for 10 minutes or less.
  • Here, the “favorable results” mean that the glass fiber and the valuable metals are separated and only the valuable metals are recovered easily.
  • <3> Reason for Selecting the Temperature and the Period
  • <3-1 > Determination of Upper Limit
  • The temperature and the period above are selected, because the glass fiber melts when heated under a temperature/period condition severer than the temperature/period condition above and solidifies itself when cooled.
  • The melted glass fiber solidifies itself into a solid state, while enclosing the metals therein, prohibiting recovery of the metals from the state once formed.
  • For that reason, the metals have been recovered after the metals and the glass fiber are both melted at high temperature, by using the difference in specific density.
  • However, by the method according to the present invention, wherein the waste is heated up to 1000° C. for 10 minutes or less, the glass fiber does not melt, eliminating the possibility of the glass fiber melt-enclosing the metals.
  • <3-2> Determination of Lower Limit
  • As for the lower limit heating condition, the glass fiber sheet, when heated at 500° C. for 20 minutes or less, retains its original shape and still contains the metals therein without separation, although the surface thereof turns brown in color.
  • The glass fiber sheet in that state is resistant to pulverization under pressure and cannot be separated from the metals.
  • <3-3> Determination of Optimal Temperature and Period
  • However, the glass fiber sheet and the metals are separated actually, when heated under a condition in the range of 500° C. for 20 minute or more to 750° C. for 30 minutes or less.
  • It is thus possible to make the metal components sediment and collect the metal sediment, while separating it from the glass fiber sheet, for example, by gravimetric sorting by using a liquid.
  • The lower limit heating condition is more preferably approximately 750° C. for 30 minutes or more.
  • In the temperature-period condition above, the glass fiber sheet apparently retains its plate shape as a sheet, but is pulverized easily under external force, for example by the force when the sheet is held with fingers.
  • In addition, the metals do not melt in the temperature range.
  • Therefore, the glass fiber is pulverized easily by slight vibration or pressurization by roller, favorably allowing recovery of the metal components as they are.
  • <4> Test Results
  • Printed wiring boards were heated in various temperature conditions of upward from 300° C. for 10 minutes at intervals of 100° C. and 10 minutes.
  • The results obtained in respective temperature-period conditions are shown in photographs of FIGS. 3 to 46, and the results are summarized in the following Table 1.
  • TABLE 1
    Figure US20090293676A1-20091203-C00001
  • The marks in respective columns are as follows:
  • x The fiber sheet and the metals retain their shapes and are not
    separated from each other.
    In particular at the low temperature side, the fiber sheet is only
    discolored.
    The fiber sheet retains its original shape, even when pressurized by
    hand.
    Δ The fiber sheet and the metals are separated from each other.
    Thus, the valuable metals can be collected.
    However, the fiber sheet retains its shape and is resistant to
    pulverization.
    Apparently, the fiber sheet retains its shape.
    However, it is pulverized easily by slight pressurization or by
    the force when it is held with fingers.
    Because the glass fiber can be pulverized easily into powdery, it is
    possible to separate the valuable metals easily from the powder.
    The glass is solidified into an aggregate state, while holding the
    metals.
    Aggregates as hard as rock are obtained when the waste is heated at
    higher temperature for an elongated period.
    The metals, which are entrapped in the melted glass, are difficult to
    separate.
  • There was no change in the samples if they were heated for an extended period of time, even though the results obtained are not described herein.
  • <5> Heating in Oxygen-free State
  • It is possible to heat wastes in oxygen-free state, for example by using an electric furnace.
  • In this way, it is possible to recover valuable metals as they are without formation of oxide films, because the surface of the valuable metals such as copper are not oxidized.
  • If there is a concern about the damage of the heating unit in electric furnace, the waste may be heated in a low-oxygen state generated by burning carbon additionally as the heat source.
  • <6> Step of Removing Glass Fiber
  • When heated in a temperature-period condition in the range above, in particular when heated in the range of 500° C. for 20 minutes or more and 750° C. for 30 minutes or less, the glass fiber sheet mostly retains its original shape but is separated from the valuable metals.
  • It is thus possible to recover the valuable metals, by separating the glass fiber sheet from the valuable metals in the later separation step by using an optimal method such as gravimetric separation.
  • Further, when heated in the range of 750° C. for 30 minutes or more, the glass fiber degrades to such a degree that it is pulverized easily into powder by application of slight external force, such as that when the glass fiber is held with fingers, or by application of vibration or pressure.
  • On the other hand, the glass fiber does not melt, because the heating temperature-period condition is 1000° C. for 10 minutes or less, and thus, the metal components remains as they are without entrapment in the melted glass fiber.
  • It is thus possible to separate valuable metals from the glass fiber, removing the glass fiber and recovering the valuable metals, by a known simple method such as sieve classification or gravimetric classification.

Claims (3)

1. A method of recovering valuable metals from waste, the waste being an integrated industrial waste containing a glass fiber, an epoxy resin and valuable metals such as copper, iron, gold and aluminum, comprising
heating the industrial waste to a temperature at which the glass fiber does not melt but degrades,
removing the degraded glass fiber, and thus,
recovering the valuable metals contained in the waste.
2. The method of recovering valuable metals from waste according to claim 1, wherein the temperature condition applied to the industrial wastes is in the range of 500° C. for 20 minute or more and 1000° C. for about 10 minutes.
3. The method of recovering valuable metals from waste according to claim 1, wherein the temperature condition applied to the industrial wastes is in the range of 750° C. for 30 minute or more and 1000° C. for about 10 minutes.
US12/186,333 2008-06-02 2008-08-05 Method of recovering valuable metals from waste Abandoned US20090293676A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/902,342 US20130333522A1 (en) 2008-06-02 2013-05-24 Method of Recovering Valuable Metals from Waste

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008144732A JP4903753B2 (en) 2008-06-02 2008-06-02 Method for recovering valuable metals from waste
JP2008-144732 2008-06-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/902,342 Continuation US20130333522A1 (en) 2008-06-02 2013-05-24 Method of Recovering Valuable Metals from Waste

Publications (1)

Publication Number Publication Date
US20090293676A1 true US20090293676A1 (en) 2009-12-03

Family

ID=41378145

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/186,333 Abandoned US20090293676A1 (en) 2008-06-02 2008-08-05 Method of recovering valuable metals from waste
US13/902,342 Abandoned US20130333522A1 (en) 2008-06-02 2013-05-24 Method of Recovering Valuable Metals from Waste

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/902,342 Abandoned US20130333522A1 (en) 2008-06-02 2013-05-24 Method of Recovering Valuable Metals from Waste

Country Status (2)

Country Link
US (2) US20090293676A1 (en)
JP (1) JP4903753B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104710708A (en) * 2015-02-09 2015-06-17 福建工程学院 Method for preparing polyvinyl chloride plastic flame-retardant smoke-eliminating agent from waste circuit board metal concentrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288725A (en) * 1988-09-27 1990-03-28 Nippon Mining Co Ltd Method for separating and recovering copper from waste printed circuit boards
US6336601B1 (en) * 1998-12-11 2002-01-08 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06256863A (en) * 1993-03-05 1994-09-13 Asaka Riken Kogyo Kk Method for recovering metal from circuit board and device therefor
JPH0775771A (en) * 1993-09-09 1995-03-20 Hitachi Chem Co Ltd Reusing method of waste copper-plated laminate substrate as resource
JPH0871521A (en) * 1994-09-05 1996-03-19 Hitachi Chem Co Ltd Treatment of waste printed circuit board
JP2000210650A (en) * 1999-01-26 2000-08-02 Ebara Corp Treatment of abandoned electronic equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288725A (en) * 1988-09-27 1990-03-28 Nippon Mining Co Ltd Method for separating and recovering copper from waste printed circuit boards
US6336601B1 (en) * 1998-12-11 2002-01-08 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104710708A (en) * 2015-02-09 2015-06-17 福建工程学院 Method for preparing polyvinyl chloride plastic flame-retardant smoke-eliminating agent from waste circuit board metal concentrate

Also Published As

Publication number Publication date
JP4903753B2 (en) 2012-03-28
JP2009293055A (en) 2009-12-17
US20130333522A1 (en) 2013-12-19

Similar Documents

Publication Publication Date Title
Veit et al. Using mechanical processing in recycling printed wiring boards
Pietrelli et al. Eco-friendly and cost-effective strategies for metals recovery from printed circuit boards
Zeng et al. Current status and future perspective of waste printed circuit boards recycling
Theocharis et al. An integrated thermal and hydrometallurgical process for the recovery of Silicon and Silver from end-of-life crystalline Si photovoltaic panels
Jiang et al. Improving the end-of-life for electronic materials via sustainable recycling methods
KR100981789B1 (en) Apparatus and method for collecting tin and valuable metal of solder scrap
Zapf-Gottwick et al. Leaching hazardous substances out of photovoltaic modules
Habib et al. Recovering metallic fractions from waste electrical and electronic equipment by a novel vibration system
JP5267992B2 (en) Recycling method of tantalum capacitors
US20090293676A1 (en) Method of recovering valuable metals from waste
Huang et al. Toxic footprint and materials profile of electronic components in printed circuit boards
Vakilchap et al. Structural study and metal speciation assessments of waste PCBs and environmental implications: Outlooks for choosing efficient recycling routes
Flerus et al. Recovery of Gallium from Smartphones–Part I: Thermal and Mechanical Pretreatment
EP3055437B1 (en) Hydrometallurgy process for the recovery of materials from electronic boards
CN104342553A (en) Method for processing printed circuit board, and apparatus thereof
Adie et al. Trends in toxic metal levels in discarded laptop printed circuit boards
da Silveira et al. PHYSICAL PROCESSING AND ANALYSYS OF MATERIALS CONTENT OF SMALL-SIZE WASTE ELECTRIC AND ELECTRONIC EQUIPMENT (WEEE): A CASE OF SMARTPHONES PRINTED CIRCUIT BOARDS
Tembhare et al. Technological development in metal extraction processes from e-waste
JPH06256863A (en) Method for recovering metal from circuit board and device therefor
Keskinen et al. End-of-Life challenges of printed electronics
KR20150007027A (en) Method for separating metal from waste pcb
Lisińska et al. Problems of processing and separation of multi-material electronic waste in terms of circular economy
Caldas et al. Chemical and phisical characterization of memory boards from obsolete computers through optical emission spectrometry and scanning electron microscopy
KR20230123168A (en) Smart eco-friendly accessory that recycles electronic waste based on nano-silver fusion technology
Abeliotis et al. Environmental assessment of the recovery of printed circuit boards in Greece

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载