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US20090223651A1 - Panel heat-dissipating device - Google Patents

Panel heat-dissipating device Download PDF

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Publication number
US20090223651A1
US20090223651A1 US12/170,613 US17061308A US2009223651A1 US 20090223651 A1 US20090223651 A1 US 20090223651A1 US 17061308 A US17061308 A US 17061308A US 2009223651 A1 US2009223651 A1 US 2009223651A1
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US
United States
Prior art keywords
heat
vapor chamber
dissipating device
conducting base
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/170,613
Inventor
George Anthony Meyer, IV
Chien-Hung Sun
I-Ying Lee
Chieh-Ping Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celsia Technologies Taiwan Inc
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Assigned to Celsia Technologies Taiwan, Inc. reassignment Celsia Technologies Taiwan, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIEH-PING, LEE, I-YING, MEYER IV, GEORGE ANTHONY, SUN, CHIEN-HUNG
Publication of US20090223651A1 publication Critical patent/US20090223651A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink, and in particular to a panel heat-dissipating device formed by means of extending a vapor chamber.
  • the heat-dissipating device provided in the computer has to be modified according to the cases applied by the central processing unit within the computer.
  • the heat-dissipating device for a personal computer since the space within the personal computer is larger, there is enough space for mounting a fan. Therefore, a heat sink made of aluminum and copper material can cooperate with an associated fan to perform heat dissipation.
  • the heat-dissipating device is to be used in a notebook or a portable computer, since the internal space is restricted, the common aluminum-extruded heat sink cannot be used and the fan is also limited to a centrifugal fan.
  • heat-conducting elements generating a heat-conducting effect via circulative change in vapor/liquid phases are often used in the field of heat dissipation.
  • the heat pipe can be manufactured more easily and does not occupy too much space, it can be extended in the lengthwise direction of the heat pipe.
  • the heat can be further dissipated via heat-dissipating means such as fins or fans. Therefore, the heat pipe is very suitable for the cases in which the internal space is restricted, such as a notebook.
  • the vapor chamber is often used to replace a solid base on the heat sink.
  • the vapor chamber has advantage over the heat pipe in terms of compactness.
  • the manufacture of the vapor chamber may be restricted due to the larger surface area thereof.
  • the main body of the vapor chamber may be recessed inwardly during a degassing process. As a result, the surface of the vapor chamber may not be flat enough to be attached to a heat source. Therefore, a good thermal contact effect cannot be achieved.
  • the present invention is to provide a panel heat-dissipating device. With a smaller thickness of the vapor chamber, the heat-dissipating device can be made more compact. Further, a heat-conducting path can be extended in the lengthwise direction of the heat-dissipating device. The heat-conducting base and the fin assembly of the heat-dissipating device are located on the same side of the vapor chamber, which reduces the space in the height of the heat-dissipating device. Thus, it can be applied to the cases that the height and thickness thereof are restricted.
  • the present invention provides a panel heat-dissipating device, which includes a heat-conducting base, a vapor chamber, and at least one fin assembly.
  • the heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon.
  • the vapor chamber forms extending portions toward the lateral of the heat-conducting base.
  • the extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon.
  • the fin assembly and the heat-conducting base are located on the same side of the vapor chamber. Via this arrangement, a panel heat-dissipating device can be obtained. Further, since the fin assembly and the heat-conducting base are located on the same side of the vapor chamber, the above objects can be achieved.
  • FIG. 1 is an exploded perspective view of the present invention
  • FIG. 2 is an assembled perspective view of the present invention
  • FIG. 3 is a cross-sectional view of the present invention.
  • FIG. 4 is an enlarged view showing the details of portion A in FIG. 3 ;
  • FIG. 5 is a schematic view showing the operating state of the present invention.
  • FIG. 1 and FIG. 2 are an exploded perspective view and an assembled perspective of the present invention respectively.
  • the present invention provides a panel heat-dissipating device, which includes a heat-conducting base 1 , a vapor chamber 2 , and at least one fin assembly 3 .
  • the heat-conducting base 1 is formed into a flat plate and is made of heat-conducting materials such as aluminum, copper or the like.
  • the bottom surface of the heat-conducting base 1 is a surface 10 to be heated to which an electronic heat-generating element 4 such as a central processing unit can be attached ( FIG. 5 ).
  • the top surface of the heat-conducting base 1 is a heat-conducting surface 11 . With the heat-conducting surface 11 being thermally connected to the vapor chamber 2 , the heat absorbed by the heat-conducting base 1 can be conducted to the vapor chamber 2 . Further, the periphery or corners of the heat-conducting base 1 can be provided with a locking hole 12 . After associated fixing elements (not shown) are penetrated into the locking holes, the heat-conducting base 1 can be fixed to a circuit board (such as a main board) provided in the central processing unit.
  • a circuit board such as a main board
  • the interior of the vapor chamber 2 is under vacuum and the periphery thereof is sealed.
  • the inner wall of the vapor chamber has capillary structure.
  • the interior of the vapor chamber is filled with a working fluid that is a heat-conducting element for conducting heat by means of the changes in liquid/vapor phases.
  • the vapor chamber 2 is formed into an elongate and flat plate. A portion of the vapor chamber 2 is attached to the heat-conducting surface 11 of the heat-conducting base 1 , thereby generating a heat-conducting effect. The rest portion of the vapor chamber extends toward the lateral of the heat-conducting base 1 .
  • the middle portion of the vapor chamber 2 is attached and fixed to the heat-conducting surface 11 of the heat-conducting base 1 .
  • the other two elongate ends of the vapor chamber protrude and extend from the heat-conducting base 1 , so that the heat absorbed by the heat-conducting base 1 can be conducted to the middle portion of the vapor chamber 2 .
  • the heat can be conducted from both ends of the vapor chamber 2 .
  • the fin assembly 3 is formed by means of arranging a plurality of fins 30 at intervals. Each of the fins 30 is bent to form a bending edge 300 . With reference to FIGS. 3 and 4 , the bending edge 300 of each fin 30 can be used as a pitch of the transverse arrangement. After the bending edge 300 of each fin 30 is bent, the upside of the fin assembly 3 is formed into a recessed region 31 . The portion of the vapor chamber 2 extending from the heat-conducting base 1 is accommodated in the recessed region 31 to be attached to the bending edge 300 of each fin 30 , so that the fin assembly 3 is located below the vapor chamber 2 . The fin assembly and the heat-conducting base 1 are located on the same side of the vapor chamber 2 . As a result, the heat-dissipating device occupies less space in the height thereof. Therefore, it can be more suitable for the cases that the height and thickness thereof are restricted.
  • connection among the heat-conducting base 1 , the vapor chamber 2 and the fin assembly 3 can be achieved by means of soldering, heat-conducting glue or heat-conducting adhesive, thereby fixing each element.
  • the panel heat-dissipating device of the present invention can be obtained.
  • the heat-dissipating device when the heat-dissipating device is applied to an electronic heat-generating element 4 such as a central processing unit, the surface 10 to be heated of the heat-conducting base 1 is attached to the upper surface of the electronic heat-generating element 4 and is located in place by means of the locking holes 12 of the heat-conducting base 1 .
  • the outmost fin 30 of the fin assembly 3 can be also formed into a locking piece 32 that is bent outwardly, so that screw elements such as bolts 41 can penetrate the locking pieces to be positioned on the circuit board 40 .
  • the heat-dissipating device serves as a heat-conducting path by means of the transverse extension of the vapor chamber 2 .
  • the heat-conducting base 1 is disposed below the middle section of the vapor chamber 2 , so that both ends of the vapor chamber 2 can be used as condensed ends and are connected to the fin assembly 3 respectively.
  • the gap between the vapor chamber 2 and a circuit board 40 allows the fin assembly 3 to be disposed therein, so that the whole height of the heat-dissipating device gets close to the circuit board 40 , thereby reducing the space efficiently.
  • the present invention really achieves the desired objects and solves the drawbacks of prior art. Further, the present invention indeed has novelty and inventive steps, and thus conforms to the requirements for a utility model patent.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A panel heat-dissipating device includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located to the same side of the vapor chamber. Via this arrangement, the heat-dissipating device occupies less space in the height.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat sink, and in particular to a panel heat-dissipating device formed by means of extending a vapor chamber.
  • 2. Description of Prior Art
  • Since the computer is widely used to various applications and is designed to be more and more compact, the heat-dissipating device provided in the computer has to be modified according to the cases applied by the central processing unit within the computer. For example, in the case of the heat-dissipating device for a personal computer, since the space within the personal computer is larger, there is enough space for mounting a fan. Therefore, a heat sink made of aluminum and copper material can cooperate with an associated fan to perform heat dissipation. However, if the heat-dissipating device is to be used in a notebook or a portable computer, since the internal space is restricted, the common aluminum-extruded heat sink cannot be used and the fan is also limited to a centrifugal fan.
  • In addition, heat-conducting elements generating a heat-conducting effect via circulative change in vapor/liquid phases (such s a heat pipe or a vapor chamber) are often used in the field of heat dissipation. Especially, since the heat pipe can be manufactured more easily and does not occupy too much space, it can be extended in the lengthwise direction of the heat pipe. After the heat generated by the central processing unit is conducted transversely toward a heat-dissipating region, the heat can be further dissipated via heat-dissipating means such as fins or fans. Therefore, the heat pipe is very suitable for the cases in which the internal space is restricted, such as a notebook. The vapor chamber is often used to replace a solid base on the heat sink. Although the principle of the vapor chamber is the same as that of the heat pipe, in practice, the vapor chamber can be used to other cases different from those of the heat pipe because of the difference in their profiles.
  • Although the heat pipe occupies less space, comparing the diameter of the heat pipe with the thickness of the vapor chamber, the vapor chamber has advantage over the heat pipe in terms of compactness. However, the manufacture of the vapor chamber may be restricted due to the larger surface area thereof. Further, the main body of the vapor chamber may be recessed inwardly during a degassing process. As a result, the surface of the vapor chamber may not be flat enough to be attached to a heat source. Therefore, a good thermal contact effect cannot be achieved.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a panel heat-dissipating device. With a smaller thickness of the vapor chamber, the heat-dissipating device can be made more compact. Further, a heat-conducting path can be extended in the lengthwise direction of the heat-dissipating device. The heat-conducting base and the fin assembly of the heat-dissipating device are located on the same side of the vapor chamber, which reduces the space in the height of the heat-dissipating device. Thus, it can be applied to the cases that the height and thickness thereof are restricted.
  • The present invention provides a panel heat-dissipating device, which includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located on the same side of the vapor chamber. Via this arrangement, a panel heat-dissipating device can be obtained. Further, since the fin assembly and the heat-conducting base are located on the same side of the vapor chamber, the above objects can be achieved.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded perspective view of the present invention;
  • FIG. 2 is an assembled perspective view of the present invention;
  • FIG. 3 is a cross-sectional view of the present invention;
  • FIG. 4 is an enlarged view showing the details of portion A in FIG. 3; and
  • FIG. 5 is a schematic view showing the operating state of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • In order to make the Examiner to better understand the characteristics and technical contents of the present invention, a detailed description relating thereto will be made with reference to the accompanying drawings. However, the drawings are illustrative only, but not used to limit the present invention.
  • FIG. 1 and FIG. 2 are an exploded perspective view and an assembled perspective of the present invention respectively. The present invention provides a panel heat-dissipating device, which includes a heat-conducting base 1, a vapor chamber 2, and at least one fin assembly 3.
  • The heat-conducting base 1 is formed into a flat plate and is made of heat-conducting materials such as aluminum, copper or the like. The bottom surface of the heat-conducting base 1 is a surface 10 to be heated to which an electronic heat-generating element 4 such as a central processing unit can be attached (FIG. 5). The top surface of the heat-conducting base 1 is a heat-conducting surface 11. With the heat-conducting surface 11 being thermally connected to the vapor chamber 2, the heat absorbed by the heat-conducting base 1 can be conducted to the vapor chamber 2. Further, the periphery or corners of the heat-conducting base 1 can be provided with a locking hole 12. After associated fixing elements (not shown) are penetrated into the locking holes, the heat-conducting base 1 can be fixed to a circuit board (such as a main board) provided in the central processing unit.
  • The interior of the vapor chamber 2 is under vacuum and the periphery thereof is sealed. The inner wall of the vapor chamber has capillary structure. The interior of the vapor chamber is filled with a working fluid that is a heat-conducting element for conducting heat by means of the changes in liquid/vapor phases. The vapor chamber 2 is formed into an elongate and flat plate. A portion of the vapor chamber 2 is attached to the heat-conducting surface 11 of the heat-conducting base 1, thereby generating a heat-conducting effect. The rest portion of the vapor chamber extends toward the lateral of the heat-conducting base 1. In the present embodiment, the middle portion of the vapor chamber 2 is attached and fixed to the heat-conducting surface 11 of the heat-conducting base 1. The other two elongate ends of the vapor chamber protrude and extend from the heat-conducting base 1, so that the heat absorbed by the heat-conducting base 1 can be conducted to the middle portion of the vapor chamber 2. Via the high heat-conducting effect of the vapor chamber 2, the heat can be conducted from both ends of the vapor chamber 2.
  • The fin assembly 3 is formed by means of arranging a plurality of fins 30 at intervals. Each of the fins 30 is bent to form a bending edge 300. With reference to FIGS. 3 and 4, the bending edge 300 of each fin 30 can be used as a pitch of the transverse arrangement. After the bending edge 300 of each fin 30 is bent, the upside of the fin assembly 3 is formed into a recessed region 31. The portion of the vapor chamber 2 extending from the heat-conducting base 1 is accommodated in the recessed region 31 to be attached to the bending edge 300 of each fin 30, so that the fin assembly 3 is located below the vapor chamber 2. The fin assembly and the heat-conducting base 1 are located on the same side of the vapor chamber 2. As a result, the heat-dissipating device occupies less space in the height thereof. Therefore, it can be more suitable for the cases that the height and thickness thereof are restricted.
  • The connection among the heat-conducting base 1, the vapor chamber 2 and the fin assembly 3 can be achieved by means of soldering, heat-conducting glue or heat-conducting adhesive, thereby fixing each element.
  • Therefore, with the above elements, the panel heat-dissipating device of the present invention can be obtained.
  • As shown in FIG. 5, when the heat-dissipating device is applied to an electronic heat-generating element 4 such as a central processing unit, the surface 10 to be heated of the heat-conducting base 1 is attached to the upper surface of the electronic heat-generating element 4 and is located in place by means of the locking holes 12 of the heat-conducting base 1. The outmost fin 30 of the fin assembly 3 can be also formed into a locking piece 32 that is bent outwardly, so that screw elements such as bolts 41 can penetrate the locking pieces to be positioned on the circuit board 40. The heat-dissipating device serves as a heat-conducting path by means of the transverse extension of the vapor chamber 2. Especially, the heat-conducting base 1 is disposed below the middle section of the vapor chamber 2, so that both ends of the vapor chamber 2 can be used as condensed ends and are connected to the fin assembly 3 respectively. In practice, the gap between the vapor chamber 2 and a circuit board 40 allows the fin assembly 3 to be disposed therein, so that the whole height of the heat-dissipating device gets close to the circuit board 40, thereby reducing the space efficiently. Besides, in real practice we can reverse the heat-dissipating device by 180 degree, and let middle part of the vapor chamber 2 to attach directly with an electronic heat-generating element 4. Hence, it also has the same effect as reducing the space.
  • According to the above, the present invention really achieves the desired objects and solves the drawbacks of prior art. Further, the present invention indeed has novelty and inventive steps, and thus conforms to the requirements for a utility model patent.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (7)

1. A panel heat-dissipating device, comprising:
a heat-conducting base having a heat-conducting surface;
a vapor chamber thermally connected to the heat-conducting surface and forming extending portions toward a lateral of the heat-conducting base; and
a fin assembly provided on the extending portions of the vapor chamber toward the lateral of the heat-conducting base, the fin assembly and the heat-conducting base being located on the same side of the vapor chamber.
2. The panel heat-dissipating device according to claim 1, wherein the heat-conducting base is provided thereon with locking holes for positioning.
3. The panel heat-dissipating device according to claim 1, wherein the vapor chamber is formed into an elongate and flat plate, the heat-conducting base is provided on a middle portion of the vapor chamber, the extending portions of the vapor chamber toward the lateral of the heat-conducting base are two ends of the vapor chamber.
4. The panel heat-dissipating device according to claim 3, further comprising another fin assembly, the two fin assemblies are located on both ends of the vapor chamber respectively.
5. The panel heat-dissipating device according to claim 1, wherein the fin assembly is constituted of a plurality of fins, each fin is bent to form a bending edge to be attached to the vapor chamber.
6. The panel heat-dissipating device according to claim 5, wherein the bending edge of each fin is bent to form a recessed region on the fin assembly, the recessed region allows the vapor chamber to be accommodated therein and attached to each bending edge.
7. The panel heat-dissipating device according to claim 1, wherein the fin assembly is constituted of a plurality of fins, the outmost fin forms an outwardly-bent locking piece for positioning.
US12/170,613 2008-03-06 2008-07-10 Panel heat-dissipating device Abandoned US20090223651A1 (en)

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TW097203776U TWM337966U (en) 2008-03-06 2008-03-06 Flat plate heat sink

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Cited By (3)

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WO2017180538A1 (en) * 2016-04-14 2017-10-19 Microsoft Technology Licensing, Llc Passive thermal management system with phase change material
US11266040B2 (en) * 2019-05-09 2022-03-01 Lenovo (Singapore) Pte Ltd Heat transport device
US20230269908A1 (en) * 2022-02-18 2023-08-24 Auras Technology Co., Ltd. Heat dissipation device

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Publication number Priority date Publication date Assignee Title
CN103874391B (en) * 2012-12-14 2016-12-21 技嘉科技股份有限公司 Radiator and method of manufacturing the same

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US20020067598A1 (en) * 2000-12-05 2002-06-06 Sathe Ajit V. Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US20040069455A1 (en) * 2002-08-28 2004-04-15 Lindemuth James E. Vapor chamber with sintered grooved wick
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US7150312B2 (en) * 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US20080017349A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US7377306B2 (en) * 2003-12-12 2008-05-27 Sony Corporation Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device
US20080142192A1 (en) * 2006-12-15 2008-06-19 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7684187B1 (en) * 2008-09-17 2010-03-23 Celsia Technologies Taiwan, Inc. Heat dissipation device
US7710724B2 (en) * 2006-11-24 2010-05-04 Kabushiki Kaisha Toshiba Electronic apparatus
US7770632B2 (en) * 2007-09-26 2010-08-10 Coolit Systems, Inc. Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition

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Publication number Priority date Publication date Assignee Title
US5710694A (en) * 1996-04-30 1998-01-20 Evercool Technology Co., Ltd. Adjustable radiation fin fastening device for an integrated circuit chip
US20020067598A1 (en) * 2000-12-05 2002-06-06 Sathe Ajit V. Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US7150312B2 (en) * 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US20040069455A1 (en) * 2002-08-28 2004-04-15 Lindemuth James E. Vapor chamber with sintered grooved wick
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US7377306B2 (en) * 2003-12-12 2008-05-27 Sony Corporation Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device
US20080017349A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US7710724B2 (en) * 2006-11-24 2010-05-04 Kabushiki Kaisha Toshiba Electronic apparatus
US20080142192A1 (en) * 2006-12-15 2008-06-19 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7770632B2 (en) * 2007-09-26 2010-08-10 Coolit Systems, Inc. Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017180538A1 (en) * 2016-04-14 2017-10-19 Microsoft Technology Licensing, Llc Passive thermal management system with phase change material
US10798848B2 (en) 2016-04-14 2020-10-06 Microsoft Technology Licensing, Llc Passive thermal management system with phase change material
US11266040B2 (en) * 2019-05-09 2022-03-01 Lenovo (Singapore) Pte Ltd Heat transport device
US20230269908A1 (en) * 2022-02-18 2023-08-24 Auras Technology Co., Ltd. Heat dissipation device
US12274030B2 (en) * 2022-02-18 2025-04-08 Auras Technology Co., Ltd. Heat dissipation device

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