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US20090068844A1 - Etching Process - Google Patents

Etching Process Download PDF

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Publication number
US20090068844A1
US20090068844A1 US12/296,139 US29613907A US2009068844A1 US 20090068844 A1 US20090068844 A1 US 20090068844A1 US 29613907 A US29613907 A US 29613907A US 2009068844 A1 US2009068844 A1 US 2009068844A1
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Prior art keywords
fluorine
nitrogen
argon
process according
mixture
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US12/296,139
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Anja Pischtiak
Thomas Schwarze
Michael Pittroff
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Solvay Fluor GmbH
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Solvay Fluor GmbH
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Assigned to SOLVAY FLUOR GMBH reassignment SOLVAY FLUOR GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PITTROFF, MICHAEL, PISCHTIAK, ANJA, SCHWARZE, THOMAS
Publication of US20090068844A1 publication Critical patent/US20090068844A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • C23F4/04—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 by physical dissolution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas

Definitions

  • the present invention relates to a method for etching substrates using gases comprising F 2 .
  • SiO x N y (shortly referred to as SiON) layers can be prepared from the so-called TEOS/Ozone CVD process wherein tetraethoxysilane is treated in a plasma apparatus in the presence of ozone.
  • SiO 2 can be deposited by thermal growth. Deposition of W, TiN and TaN are possible using PVD processes.
  • US patent application 2003/0056388 discloses a cleaning gas for chamber cleaning which comprises SF 6 and F 2 and/or NF 3 .
  • U.S. Pat. No. 5,425,842 discloses a process for chamber cleaning using F 2 or a fluorine compound and oxygen or an oxygen compound. With such gas mixtures, polymeric fluorocarbon contaminations can be removed. In a similar way, such contaminations on the surface of semiconductors can be removed. The contaminations are often formed when semiconductors are etched in a plasma chamber using fluorocarbons or hydrofluorocarbons as etching gas, such as CF 4 , C 2 F 6 and CHF 3 , sometimes mixed with hydrogen.
  • NF 3 is often used as etching gas in the production of semiconductors. It can be used to etch inorganic coatings like SiON, amorphous Si, SiO 2 , TiN, TaN or W (tungsten).
  • Problem of the present invention was to identify an etching gas composition which is effective as chamber cleaning gas and for other purposes in the field of semiconductor production with a significantly reduced environmentally destructive global warming emission.
  • a special problem of the present invention is to identify an etching gas composition useful for etching inorganic materials, in the form of mixtures, which can be used especially for etching inorganic contaminations in the frame of chamber cleaning.
  • the process according to the present invention provides for the etching of semiconductor material (e.g. Reactive Ion Etching, in short: RIE), for surface cleaning and surface preparation of semiconductors, solar panels and flat panels (Thin Film Transistors, Liquid Crystal Displays, short: TFT/LCD application) and for cleaning of chambers for semiconductor production (TFT/LCD application) and is characterized by the application of a mixture of fluorine and one or more inert gases selected from the group consisting of nitrogen and the noble gases (He, Ar, Xe and Kr).
  • the fluorine content of the mixture is preferably between 1 and 35 vol.-% and more preferably between 15 and 25 vol.-%.
  • the content of fluorine lies in the range of 18 to 22 vol.-%.
  • the mixture can be formed in the reactor, or, which is preferred, a mixture of fluorine and the inert gas or gases is formed before introducing it into the reactor. If the gases are introduced in such a premixed form into the reactor, a homogenous mixture is provided throughout the reactor chamber. In cases where fluorine containing mixtures are used in a drop-in manner for NF 3 , the fluorine content may be lower. This is explained below.
  • the gas mixture consists of fluorine and the inert gas or inert gases, the fluorine being present within the range given above, and the inert gas or gases being balance to 100 vol.-%.
  • gas mixtures can be advantageously be used for etching semiconductor material like SiON, amorphous Si, SiO 2 , TiN, TaN or W, or for cleaning the surface of semiconductors or for cleaning chambers which are contaminated by inorganic materials like those mentioned above, or by organic material.
  • organic material as already was explained, may be formed when semiconductor material is etched using poly- or perfluorocarbon compounds.
  • the treatment with the gas mixture can be performed in the presence of a plasma, or it can be performed plasma-free.
  • the temperature expediently is 400° C. or higher, preferably higher than 450° C., up to 650° C. or even more.
  • a range with good results is the range between 400 and 800° C., preferably 400 and 650° C., especially the range between 450 and 650° C.
  • Fluorine and the inert gases can be delivered as a mixture, or they can be delivered separately from each other.
  • a drop-in method includes the situation where an apparatus is operated alternating with NF 3 /inert gas and F 2 /inert gas.
  • the term “drop-in” denotes a situation where an apparatus which originally was tuned for and possibly operated with NF 3 /inert gas mixtures, is permanently operated with F 2 /inert gas mixtures.
  • mixtures of fluorine and argon are for example excellent drop-in substitutes for mixtures comprising NF 3 , especially for those comprising NF 3 and Ar.
  • mixtures of fluorine and nitrogen or fluorine and helium are excellent drop-in substitutes for apparatus operated with mixtures comprising said inert gases and NF 3 .
  • an apparatus tuned for NF 3 and a specific inert gas, e.g. argon can be operated even with gas mixtures of fluorine and any other inert gas, if the specific inert gas, for which the apparatus is tuned for, is comprised in certain minimum amounts in the gas mixture of fluorine and the other kind of inert gas.
  • an apparatus tuned for mixtures of argon and NF 3 can be operated with mixtures of fluorine and nitrogen, provided that some argon is additionally introduced into the chamber.
  • argon is additionally introduced into the chamber.
  • a minimum amount of 50 vol.-% of argon is sufficient to keep the plasma operable without any tuning of the apparatus. This minimum amount is sometimes dependent from the specific apparatus, but can simply be found by checking the stability of the plasma.
  • the additional inert gas needed in view of the tuning can be comprised in the mixture of fluorine and the other inert gas, or it can be supplied separately into the apparatus.
  • Preferred noble gas is argon. From the foregoing, it is clear that in such preferred drop-in processes, F 2 gas is chosen instead of NF 3 as constituent of the gas mixtures further comprising inert gas.
  • fluorine, nitrogen and argon whereby at least fluorine and nitrogen are supplied as a gas mixture.
  • fluorine and nitrogen are supplied as mixture separately from argon
  • the fluorine content in the nitrogen/fluorine mixture is preferably in the range of 15 to 25 vol.-%, as denoted above.
  • argon is supplied separately from the fluorine/nitrogen mixture, the volumes of the nitrogen/fluorine mixture and of argon are regulated in such a way that the content of argon in the sum of nitrogen/fluorine and argon is preferably at least 50 vol.-%.
  • the content of fluorine in the sum of argon, nitrogen and fluorine gas forming a mixture in the reactor is flexible, it can be in the range of 1 to 25 vol.-%.
  • the content of nitrogen in the sum of nitrogen, fluorine and argon gas in the reactor is also flexible; it can be in the range of 4 to 50 vol.-%.
  • the argon preferably is the balance to 100 vol.-%.
  • fluorine and nitrogen are preferably supplied as mixture with a volume ratio of fluorine to nitrogen being preferably in the range of 15:85 to 25:75. Consequently, the contents of fluorine and nitrogen are in the lower range.
  • a nitrogen/fluorine mixture and argon whereby the sum of this gas supply consists of fluorine, nitrogen and argon wherein the content of fluorine is in the range of 1 to 5 vol.-%, the volume ratio of fluorine to nitrogen lies in the range of 15:85 to 25:75, and argon is the balance to 100 vol.-%.
  • the most preferred range of fluorine is 1 to 4 vol.-%.
  • Preferred volume ratio of fluorine to nitrogen is 18:82 to 22:78, and argon is the balance to 100 vol.-%.
  • the nitrogen/fluorine mixture and the argon can also be delivered in one line wherein they are premixed before entering the reactor chamber, or they can be provided premixed in the form of a ternary mixture.
  • a ternary mixture can easily be prepared by condensing the desired amounts of fluorine, argon and nitrogen into a pressure bottle.
  • mixtures of fluorine and an inert gas as drop-in for NF 3 and the inert gas in plasma-operated apparatus for treatment, for example, of semiconductors, solar panels, flat panels, in cleaning their surface and in chamber cleaning is another aspect of the present invention.
  • argon (Ar) is the preferred inert gas.
  • N 2 /F 2 is more efficient compared to Ar/F 2 .
  • the process according to the present invention can be widely applied in the filed of semiconductor, solar panel and flat panel (TFT/LCD) manufacturing.
  • One aspect of the present invention concerns the etching of materials used in or being a result of semiconductor manufacturing.
  • the described mixture of fluorine and inert gas or inert gases can be used to etch inorganic materials, for example amorphous Si, and especially SiON, TaN, TiN, W and SiO 2 . These materials are often produced via CVD, PVD or ALD processes during the production of semiconductors.
  • the mixture can also be used to etch organic materials, such as photo resist.
  • the mixture is used together with oxygen.
  • the gas mixture outlined above is used for chamber cleaning or for cleaning the surface of semiconductor substrates, flat panels (TFT/LCD) and the like.
  • TFT/LCD flat panels
  • inorganic or organic contamination may occur in the chambers used or even on the semiconductor material treated in the chambers.
  • the preferred mixture is composed of fluorine and nitrogen.
  • the preferred mixture is composed of fluorine and argon.
  • mixtures comprising 18 to 22 vol.-% of fluorine, the balance being nitrogen or argon, respectively, if binary mixtures are used. If ternary mixtures are used, which sometimes may be advantageous, the fluorine content once again is preferably in the range of 1 to 5 vol.-%.
  • FIG. 1 shows the relative etch rate at 150° C., normalized in view of the fluorine content, for gas mixtures of fluorine with nitrogen or argon, applied to certain inorganic materials often used in semiconductor and flat panel manufacturing.
  • a dotted line shows for comparison the etch rate of NF 3 , set at 100%.
  • FIG. 2 shows the results when etching is performed at 300° C.
  • the pressure during etching or chamber cleaning is lower than ambient pressure (1 bar), i.e. it is performed under vacuum.
  • the etching is preferably performed at a pressure in the range of 100 to 2000 Pa.
  • the pressure is preferably in the range of 100 to 1000 Pa, especially preferably at a pressure in the range of 200 to 800 Pa, and still more preferably in the range of 300 to 600 Pa.
  • the etching can performed at lower or higher pressures than indicated, but with decreasing etch rate.
  • the temperature lies preferably in the range of ambient temperature (about 20° C.) to 400° C., if the etching is performed in the presence of a plasma. Especially preferably, the temperature is in the range of 100° C. to 400° C.
  • the mixture of fluorine and inert gas is used for chamber cleaning. If the inside of the chamber is contaminated with W, a mixture of fluorine and nitrogen is very suitable. For other contaminants, mixtures of fluorine and argon are preferred. The preferred ranges of temperature and pressure correspond to those given above for etching.
  • the mixtures can be used in a process performed plasma-free, or they can be used in a process supported by a plasma. If organic matter, like fluorinated polycarbon material, is to be removed, the addition of oxygen is advantageous.
  • the process according to the present invention can be performed in apparatus commonly used for preparing semiconductors, TFTs, LCDs, solar panels and flat panels. It can, for example, be used in CVD apparatus, PVD apparatus, or ALD apparatus working with or without plasma.
  • the process is suitable for apparatus using a remote plasma, and for apparatus in which the plasma is produced directly in the chamber, be it induced by radio-frequency energy or by microwave energy.
  • fluorine and inert gas are introduced into the chamber not separately, but as a premixed homogenous mixture. Thereby it is guaranteed that a preset ratio of fluorine and inert gas is homogeneously provided throughout the reactor. If one uses ternary mixtures, they can be supplied in premixed form, or they can be supplied partially mixed into the reactor.
  • a preferred embodiment provides for the supply of fluorine and argon or fluorine and nitrogen, which are already premixed, and, in the case of the latter, if desired an additional supply of argon which may be performed separately or even in the form of a ternary mixture with fluorine and nitrogen.
  • NF 3 can be substituted by a gas mixture which is environmentally friendly in view of GWP and ozone; NF 3 has a very high GWP, while Ar, N 2 , F 2 and their mixtures have zero GWP. It has been found that the gas mixtures according to the present invention are, for many applications, comparable and sometimes even better (e.g. when etching amorphous Si, SiON or SiO2 at 150° C. with F 2 /Ar or F 2 /N 2 or when etching TaN or SiON at 300° C.
  • a further advantage of the process is that the mixtures of fluorine and an inert gas can be used as drop-in substitute for respective mixtures comprising fluorine instead of NF 3 .
  • the apparatus is tuned for a mixture of NF 3 and a different inert gas (which means adjustment of the mass flow of the gas flow controllers and valves, heating of the samples plate, parameters like flow volume and flow speed, reactor temperature, homogeneity of the flow throughout the reactor, to achieve optimal etch gas effectiveness), additional supply of the inert gas for which the apparatus is tuned for provides for operable conditions.
  • gas mixtures comprising or preferably consisting of fluorine and one or more inert gases selected from the group consisting of nitrogen and the noble gases.
  • fluorine is comprised in binary mixtures in the range of 1 to 35 vol.-%.
  • a content of fluorine in the range of 15 to 25 vol.-% in the binary mixtures is highly preferred, still more preferably a range of 18 to 22 vol.-%.
  • Preferred noble gas is Ar.
  • mixtures consisting of 15 to 25 vol.-% fluorine and 75 to 85 vol.-% Ar still more preferred are mixtures consisting of 18 to 22 vol.-% fluorine and 78 to 82 vol.-% Ar; most preferred are mixtures consisting of 20 vol.-% fluorine and 80 vol.-% Ar.
  • Such binary mixtures can of course be used together with additionally supplied gases; e.g., binary mixtures comprising fluorine and nitrogen in the volume range given above can be used together with argon; consequently, the content of fluorine in the reactor chamber is reduced accordingly depending from the amount of argon supplied.
  • Another aspect of the invention relates to mixtures comprising or preferably consisting of fluorine, nitrogen and one or more of the noble gases.
  • Ternary mixtures are preferred.
  • the content of fluorine in such a ternary gas mixture is preferably in the range of 1 to 25 vol.-%, especially preferably in the range of 1 to 5 vol.-%.
  • the content of nitrogen is preferably in the range of 4 to 50 vol.-%.
  • the noble gas or noble gases preferably is or are the balance to 100 vol.-%.
  • the volume ratio of fluorine to nitrogen lies especially preferably in the range of 15:85 to 25:75, still more preferably in the range of 18:82 to 22:78.
  • Preferred noble gas is argon.
  • Very preferred gas mixtures consist of fluorine, nitrogen and argon wherein the content of fluorine is in the range of 1 to 5 vol.-%, the volume ratio of fluorine to nitrogen lies in the range of 15:85 to 25:75, and argon is the balance to 100 vol.-%.
  • the preferred range of fluorine is 1 to 4 vol.-%.
  • Preferred volume ratio of fluorine to nitrogen is 18:82 to 22:78, and argon is the balance to 100 vol.-%.
  • Another aspect of the present invention is an apparatus suitable for treating, especially for etching or surface-cleaning of semiconductors, solar panels or flat panels (TFT and LCDs), which is tuned for NF 3 comprising gases, but which comprises a gas mixture which comprises fluorine and one or more inert gases selected from nitrogen and the noble gases.
  • NF 3 comprising gases
  • the apparatus is connected, e.g. via a line, with one or more containers such as pressure bottles comprising the fluorine containing gas mixtures mentioned above.
  • Still another aspect of the present invention is the use of fluorine as a drop-in substitute for NF 3 as a component of gas mixtures applied in plasma-supported treatment apparatus, such as those for chamber cleaning, surface treatment or etching of semiconductors, solar panels and flat panels (TFTs and LCDs).
  • the preferred use is in plasma apparatus which are tuned for NF 3 containing gases, but which are operated with fluorine containing gases as a substitute.
  • the fluorine containing gases can of course substitute gas mixtures of NF 3 with e.g. argon, which are supplied separately into the reactor, and only form a mixture in the apparatus, but they can also substitute such NF 3 containing mixtures which are supplied into the reactor in premixed form.
  • the vacuum system was passivated by first flushing it with low flow of F 2 /N 2 , then for several hours at high F 2 /N 2 pressure without any flow. This was repeated twice.
  • the F 2 /Ar and F 2 /N 2 mixtures were used in a volume ratio of 20:80, stored in 2-liter pressure bottles filled up to 10 and 38 bar, respectively.
  • the remote plasma source was usually ignited in the presence of pure argon. Directly after the plasma was in a stable condition, the gas mixture comprising fluorine was introduced. Mixtures of fluorine and argon could be supplied in drop-in manner without any problem. Since the apparatus used was tuned for Ar/NF 3 mixtures, to obtain a stable plasma, argon was continually supplied additionally to the apparatus when a mixture of fluorine and nitrogen as inert gas was used. In this manner, the fluorine/nitrogen mixtures could be used in a drop-in manner. Delivery of fluorine/ nitrogen and argon separately allows fine tuning of the argon content. Using ternary mixtures of fluorine, nitrogen and argon has the advantage that the mixtures are already homogenous when delivered to the reactor.
  • the etch rates were determined in situ by reflectrometry using a 645 nm laser directed to the sample.
  • the etch rate was calculated by dividing the thickness of the film by the time when the removal endpoint was detected.
  • Argon and fluorine were condensed in a volume ratio of 20:80 into a 2-liter pressure bottle filled up to a pressure of 10 Bar, thereby forming a homogeneous mixture of both compounds.
  • Nitrogen and fluorine were condensed in a volume ratio of 20:80 into a 2-liter pressure bottle filled up to 38 Bar, thereby forming a homogenous mixture of both compounds.
  • the size of the samples was 20 ⁇ 20 mm.
  • the investigated material was deposited on a 150 nm thermal SiO 2 layer to allow interferometric measurement.
  • the SiON and SiO 2 samples were deposited on bulk silicon since their optical properties allow interferometric measurements.
  • SiON 1000 nm SiO x N y (referred to as SiON) on bulk silicon, deposited by a conventional TEOS/ozone CVD process
  • SiO 2 1000 nm SiO 2 , thermally grown on bulk silicon
  • 300 nm tungsten 300 nm TiN
  • e 200 nm TaN, deposited by a conventional PVD process
  • Example 1 was repeated introducing argon and NF 3 in flows of 350 sccm and 20 sccm, respectively. Also here, the optimal etch rate was observed at 400 Pa.
  • a mixture of argon and fluorine (volume ratio 80:20) was introduced into the reactor in a flow of 100 sccm at various pressures and temperatures. It was found that, independently of the temperature, the optimal relate etch rate was achieved at a pressure of 400 Pa. The highest etch rate was observed at 300° C.
  • SiO 2 , TiN, TaN and W were etched with mixtures of argon/fluorine, nitrogen/fluorine (with additional argon supply for plasma stabilization) and, for comparison, with NF 3 .
  • the relative etch rates, normalized for the fluorine content, are compiled in FIG. 1 / 2 . It can be seen that the mixture of fluorine and nitrogen is comparable or even clearly higher for W and SiON, when compared to NF 3 (set as 100%, indicated by the dotted line). The mixture of fluorine and argon is comparable or even clearly higher for SiON, TiN and SiO 2 , when compared to NF 3 . TaN can be etched by fluorine and argon in a competitive range compared to NF 3 ; tungsten etching with a mixture of fluorine and argon is possible, but the etch rate is comparatively low.
  • Results are compiled in FIG. 2 / 2 .
  • argon/fluorine mixture a very high etch rate is achieved for TaN, with the nitrogen/fluorine mixture, SiON etching is very effective.
  • argon/fluorine is competitive to NF 3 , as is the etching of W and SiON with the mixture of nitrogen and fluorine (with additional supply of argon, as described, for plasma stabilization). Etching of W using argon/fluorine is possible, but with a comparatively low etch rate.
  • Plasma chambers contaminated by inorganic materials like SiO 2 , SiON, TiN, TaN and W can be cleaned using mixtures of argon and fluorine or nitrogen and fluorine (advantageously again with additional argon supply, if the reactor is tuned for NF 3 /Ar).
  • the plasma is started with argon, and then the etching gas mixture (which here is a cleaning gas mixture) is introduced into the reactor.
  • the pressure lies preferably in the range of 100 to 800 Pa, with an optimum at 400 Pa.
  • the temperature is preferably in the range of 150 to 300° C. Treatment is performed until the desired degree of cleaning is achieved. Gaseous reaction products (like SiF 4 ) formed from the contaminants can be removed by applying a vacuum to the cleaned reactor chamber.
  • Such a cleaning step can be performed in regular intervals, whenever such cleaning is desirable.
  • Plasma chambers may be contaminated by organic material, e.g. polymeric carbon material which may be partially or completely fluorinated. This contamination can occur if semiconductors or flat panels are etched under plasma conditions using fluorocarbons or hydrofluorocarbons, e.g. CF4 4 , C 2 F 6 or CHF 3 , as etching gas. Chambers contaminated by such organic material are cleaned at a temperature of 250° C. using mixtures of argon and fluorine or nitrogen and fluorine, respectively as described in example 4a). Again, the plasma is started using argon, and then the cleaning gas is introduced into the chamber. It is highly preferable also to introduce oxygen into the chamber to be cleaned. The reaction products formed from the organic contaminants like C0 2 , (hydro)fluorocarbon products or carbonyl fluoride, can be removed from the cleaned chamber by applying a vacuum. This chamber cleaning can be performed regularly, whenever such a cleaning operation is desirable.
  • organic material e.g. polymeric carbon material which may be partially or completely fluor
  • Fluorocarbon or hydrofluorocarbon etching gases such as CF 4 , C 2 F 6 or CHF 3 .
  • organic material may not only form in the inside of the reactor chamber, but also on the surface of the etched semiconductor or flat panel.
  • Such surface contaminations can be removed using mixtures of argon and fluorine or nitrogen and fluorine, respectively.
  • pressure and temperature preferred ranges are given in example 4a.
  • the reaction products can be removed from the chamber wherein the semiconductor or flat panel is located by applying a vacuum.
  • Etching, chamber cleaning and surface cleaning of semiconductors, flat panels and the like can be performed under plasma-free conditions.
  • the temperature is preferably set to at least 400° C., but can be considerably higher, up to 650° C. , up to 800° C. or even more.
  • the etching or cleaning operation can be supported by UV light.
  • gas mixtures of examples 7.1 to 7.3 can also be prepared by pressing a gas mixture of fluorine and nitrogen (volume ratio 20:80) into the pressure bottle and, prior or afterwards, adding argon.
  • the mixtures of the examples 7.1 to 7.3 which are perfectly homogenous, can be used for etching of semiconductors or for chamber cleaning in analogy to examples 1 to 6.
  • Advantage is that the ternary mixtures are already in a homogenous form before they are introduced into the reactor chamber.
  • Amorphous Si can be produced in the frame of semiconductor, solar or flat panel production in plasma-free or plasma-supported CVD apparatus.
  • An undesired deposit occurs in the chamber, often close to the source of the silicium precursor.
  • a plasma chamber with undesired deposits of amorphous Si is treated with fluorine/argon, fluorine/nitrogen mixtures (volume ratio 20:80) or with ternary mixtures comprising 90 vol.-% Ar, the balance to 100 vol.-% being a mixture of fluorine and nitrogen (volume ratio 20:80) at a pressure of 400 Pa and a temperature of 250° C.
  • a reactor chamber with undesired deposits of amorphous Si is treated with a mixture of fluorine and nitrogen (volume ratio 20:80) at a temperature of 700° C. to remove the Si deposits.

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US10161034B2 (en) 2017-04-21 2018-12-25 Lam Research Corporation Rapid chamber clean using concurrent in-situ and remote plasma sources
US11149347B2 (en) 2015-05-22 2021-10-19 Solvay Sa Process for etching, and chamber cleaning and a gas therefor
CN114097064A (zh) * 2020-06-25 2022-02-25 株式会社日立高新技术 真空处理方法
CN114823350A (zh) * 2022-04-17 2022-07-29 中南大学 一种铌酸锂薄膜刻蚀方法
US12308242B2 (en) 2020-04-14 2025-05-20 Resonac Corporation Etching method and method for manufacturing semiconductor element

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MX2010008075A (es) 2008-01-23 2010-08-04 Solvay Fluor Gmbh Proceso para la fabricacion de celulas solares.
WO2010087930A1 (fr) * 2009-01-27 2010-08-05 Linde Aktiengesellschaft Gravure au fluor moléculaire de pellicules minces en silicium pour applications photovoltaïques et autres processus de dépôt chimique en phase vapeur à basse température
CN102754201A (zh) * 2009-10-26 2012-10-24 苏威氟有限公司 用于生产tft基质的蚀刻方法
WO2011051409A1 (fr) 2009-10-30 2011-05-05 Solvay Sa Procédé de gravure par plasma et nettoyage de chambre à plasma à l'aide de f2 et de cof2
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TWI586842B (zh) 2010-09-15 2017-06-11 首威公司 氟之製造工廠及使用彼之方法
US20130017644A1 (en) * 2011-02-18 2013-01-17 Air Products And Chemicals, Inc. Fluorine Based Chamber Clean With Nitrogen Trifluoride Backup
JP2012216718A (ja) * 2011-04-01 2012-11-08 Kaneka Corp Ｃｖｄ装置のクリーニング方法
WO2013024041A1 (fr) 2011-08-17 2013-02-21 Solvay Sa Processus électrolytique de fabrication de fluor et appareil à cet effet
WO2013092777A1 (fr) 2011-12-22 2013-06-27 Solvay Sa Appareil à chambre à plasma et procédé de nettoyage d'une telle chambre
EP2860288A1 (fr) 2013-10-11 2015-04-15 Solvay SA Cellule électrolytique améliorée
EP2860287A1 (fr) 2013-10-11 2015-04-15 Solvay SA Cellule électrolytique améliorée
EP2944385A1 (fr) * 2014-05-12 2015-11-18 Solvay SA Procédé de gravure et de nettoyage d'une chambre et gaz associé
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US20110079241A1 (en) * 2009-10-01 2011-04-07 Ashwini Sinha Method for ion source component cleaning
US9627180B2 (en) 2009-10-01 2017-04-18 Praxair Technology, Inc. Method for ion source component cleaning
US8871174B2 (en) 2010-03-26 2014-10-28 Solvay Sa Method for the supply of fluorine
US8728882B2 (en) 2012-03-30 2014-05-20 Samsung Display Co., Ltd. Manufacturing method for thin film transistor array panel
US20160307765A1 (en) * 2013-10-08 2016-10-20 Hitachi High-Technologies Corporation Dry etching method
US11018014B2 (en) * 2013-10-08 2021-05-25 Hitachi High-Tech Corporation Dry etching method
US11149347B2 (en) 2015-05-22 2021-10-19 Solvay Sa Process for etching, and chamber cleaning and a gas therefor
US10161034B2 (en) 2017-04-21 2018-12-25 Lam Research Corporation Rapid chamber clean using concurrent in-situ and remote plasma sources
US12308242B2 (en) 2020-04-14 2025-05-20 Resonac Corporation Etching method and method for manufacturing semiconductor element
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