+

US20090014157A1 - Cooler - Google Patents

Cooler Download PDF

Info

Publication number
US20090014157A1
US20090014157A1 US11/883,472 US88347206A US2009014157A1 US 20090014157 A1 US20090014157 A1 US 20090014157A1 US 88347206 A US88347206 A US 88347206A US 2009014157 A1 US2009014157 A1 US 2009014157A1
Authority
US
United States
Prior art keywords
heat
cooler according
area
cooler
channel system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/883,472
Inventor
Steffen Groezinger
Horst Rothenhoefer
Volker Velte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle Behr Industry GmbH and Co KG
Original Assignee
Behr Industrieanlagen GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr Industrieanlagen GmbH and Co KG filed Critical Behr Industrieanlagen GmbH and Co KG
Assigned to BEHR INDUSTRY GMBH & CO. KG reassignment BEHR INDUSTRY GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GROEZINGER, STEFFEN, ROTHENHOEFER, HORST, VELTE, VOLKER
Publication of US20090014157A1 publication Critical patent/US20090014157A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0325Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
    • F28D1/0333Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031Radiators for recooling a coolant of cooling systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a cooler according to the present disclosure.
  • the task of the invention is to make available an improved cooler, which is, however, economical as much as possible, especially one that can be produced economically, in particular for PC processors.
  • a cooler which can be used advantageously for cooling one or more semiconductor components, especially PC processors, is provided with a heat-absorbing area and a heat-dissipating area, which has a channel system that is composed of profiled elements and/or stamped sheet-metal parts soldered to each other and that is filled at least partially with a coolant, and corrugated sheet-metal ribs arranged between the channels of the channel system in the heat-dissipating area.
  • the coolant guidance can be constructed so that no other lines are necessary, i.e., the channel system is formed preferably exclusively by parts that can be soldered to each other.
  • the parts that are used preferably involve as many identical parts as possible, so that the tool and logistics costs can be kept low.
  • the channel system preferably has a square shape at least in the heat-dissipating area, which simplifies the use of identical parts.
  • connection are preferably arranged at the corners, especially at diagonally opposite corners.
  • connections are preferably constructed as formed areas of these parts, wherein they project upwards. In this way, the connections preferably have a round tube-like construction.
  • a closable filling nozzle is provided opening into the heat-absorbing area.
  • the filling nozzle can also have an air flow-specific task, for which it is constructed preferably at the highest position in the middle in the direction of the fan.
  • the heat-absorbing area is preferably formed by a chamber, in which a plurality of crossbars, pins, or other surface area-increasing elements project outwards from the side, at which the element to be cooled is attached.
  • the longitudinal extent of the surface area-increasing element is preferably perpendicular to the planes of the channel system in the heat-dissipating area.
  • the corrugated sheet-metal ribs are preferably arranged running parallel to the stamped and bent sheet-metal parts forming the channels, wherein the crests and valleys of the corrugated sheet-metal ribs are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels.
  • Attachment openings or boreholes for bolts or threaded boreholes are preferably provided on the cooler for a fan, with the fan preferably being attached in the heat-dissipating area.
  • the cooler is preferably partially filled with an alcohol-water mixture as coolant, wherein the coolant is at a slightly reduced pressure, so that the boiling point is lowered and the boiling point is reached even for relatively low temperatures in the heat-absorbing area.
  • a cooler ( 1 ) for a PC processor comprises a heat absorption area ( 3 ), a heat dissipation area ( 4 ), and a channel system ( 2 ) consisting of profiled elements and/or stamped/bent components ( 8 ) welded together.
  • the channel system is at least partially filled with a coolant and comprises between the channels of the channel system ( 2 ) corrugated sheets ( 9 ) that are provided in the heat dissipation area ( 4 ).
  • FIG. 1 illustrates a section through a cooler according to the embodiment.
  • FIG. 2 illustrates a section in the area of a connection of the channel planes of the cooler from FIG. 1 .
  • FIG. 3 illustrates a perspective view of the cooler from FIG. 1 .
  • FIGS. 4 a - c illustrate a sheet, which is used for a channel, from various perspectives.
  • a cooler 1 for a PC processor (not shown) has a channel system 2 , in which a coolant is located, with a heat-absorbing area 3 and a heat-dissipating area 4 .
  • the heat-dissipating area 3 shown at the bottom in FIG. 1 , comprises a chamber formed by a hood, in which a plurality of pins 5 for increasing the heat-transferring surface area projects from the side of the contact area 6 on the PC processor.
  • a closable coolant filling nozzle 7 with whose help the channel system 2 is partially filled after successful production of the cooler 1 with the coolant, in the present case an alcohol-water mixture, which is at a slightly reduced pressure, opens into the heat-absorbing area 3 .
  • the heat-absorbing area 3 is connected via openings (not shown in more detail) to the heat-dissipating area 4 .
  • the heat-dissipating area 4 is composed essentially from sheet-metal parts 8 constructed as stamped and bent parts (see FIG. 4 ), corrugated ribs 9 , a base plate arranged adjacent to the heat-absorbing area 3 , and a cover plate arranged on the other side of the heat-dissipating area 4 . All of the parts, that is, the parts of the heat-dissipating area 4 and also the heat-absorbing area 3 , are soldered to each other in a single work process after being put together.
  • two sheet-metal parts 8 twisted around each other form a plane of the channel system 2 in the form of a square-shaped ring channel.
  • the individual planes of the channel system 2 are connected to each other via connections 10 at two diagonally opposite corners.
  • the connections 10 are here part of the stamped and bent sheet-metal parts, wherein they are constructed on one side projecting with a hollow cylindrical shape and are soldered to the corresponding area of the adjacent plane of the channel system 2 .
  • Corrugated ribs 9 are arranged between two planes of the channel system 2 , wherein the orientation of the corrugated ribs 9 is such that good ventilation is possible with the help of a fan (not shown) attached by means of screws (at the top in FIG. 1 ).
  • the arrangement of the cooler 1 is advantageous so that the heat-absorbing area 3 is arranged underneath the heat-dissipating area 4 , so that the liquid coolant flows downward and collects there. Due to the reduced low pressure, the boiling point is reduced, so that even for a relatively small increase in the temperature, due to the heat output by the PC processor, boiling generates bubbles, which rise upwards, that is, also into the heat-dissipating area 4 , and thus ensure a continuous thorough mixing of the coolant.
  • the coolant is cooled by the dissipation of heat outward to the air fed from the fan. The cooled coolant sinks back into the heat-absorbing area 3 , where it can again absorb and dissipate heat.
  • profiled elements and plates are used, which allow a corresponding layout of the channel system.
  • the profiled elements and plates can also be soldered to each other in one work process.
  • the function corresponds to that of the first embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a cooler (1) for a PC processor. Said cooler comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. Said channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).

Description

    CROSS-REFERENCES TO RELATED APPLICATIONS
  • This application is a National Stage filing of International Application PCT/EP2006/000681, filed Jan. 26, 2006, claiming priority to German Application No. 10 2005 004 777.7, filed Feb. 1, 2005, entitled “COOLER”. The present application claims priority to PCT/EP2006/000681, and to German Application No. 10 2005 004 777.7, and both references are expressly incorporated by reference herein, in their entireties.
  • BACKGROUND OF THE INVENTION
  • The invention relates to a cooler according to the present disclosure.
  • Due to ever increasing demands, for example, on PC processors with respect to their power, the cooling requirements of these processors increase correspondingly. Here, the cooling should be performed as quietly as possible.
  • The task of the invention is to make available an improved cooler, which is, however, economical as much as possible, especially one that can be produced economically, in particular for PC processors.
  • This task is accomplished by a cooler with the features of the present disclosure. Advantageous constructions are described hereinafter.
  • According to the invention, a cooler, which can be used advantageously for cooling one or more semiconductor components, especially PC processors, is provided with a heat-absorbing area and a heat-dissipating area, which has a channel system that is composed of profiled elements and/or stamped sheet-metal parts soldered to each other and that is filled at least partially with a coolant, and corrugated sheet-metal ribs arranged between the channels of the channel system in the heat-dissipating area. In this way, because the components are soldered to each other, simple production with only one soldering process is possible. Here, the coolant guidance can be constructed so that no other lines are necessary, i.e., the channel system is formed preferably exclusively by parts that can be soldered to each other.
  • The parts that are used preferably involve as many identical parts as possible, so that the tool and logistics costs can be kept low.
  • The channel system preferably has a square shape at least in the heat-dissipating area, which simplifies the use of identical parts.
  • In this way, in the heat-dissipating area there are several planes that are preferably interconnected by means of at least two connections. The connections are preferably arranged at the corners, especially at diagonally opposite corners.
  • For the use of stamped and bent sheet-metal parts, the connections are preferably constructed as formed areas of these parts, wherein they project upwards. In this way, the connections preferably have a round tube-like construction.
  • For simple filling, preferably a closable filling nozzle is provided opening into the heat-absorbing area. In this way, the filling nozzle can also have an air flow-specific task, for which it is constructed preferably at the highest position in the middle in the direction of the fan.
  • The heat-absorbing area is preferably formed by a chamber, in which a plurality of crossbars, pins, or other surface area-increasing elements project outwards from the side, at which the element to be cooled is attached. In this way, the longitudinal extent of the surface area-increasing element is preferably perpendicular to the planes of the channel system in the heat-dissipating area.
  • To allow good heat transfer, the corrugated sheet-metal ribs are preferably arranged running parallel to the stamped and bent sheet-metal parts forming the channels, wherein the crests and valleys of the corrugated sheet-metal ribs are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels. With an airtight attachment of the fan above the cooler, all of the air fed through the fan can flow through the heat-dissipating area, i.e., the entire amount of supplied air can be used, which makes possible an optimization of the cooling output.
  • Attachment openings or boreholes for bolts or threaded boreholes are preferably provided on the cooler for a fan, with the fan preferably being attached in the heat-dissipating area.
  • The cooler is preferably partially filled with an alcohol-water mixture as coolant, wherein the coolant is at a slightly reduced pressure, so that the boiling point is lowered and the boiling point is reached even for relatively low temperatures in the heat-absorbing area.
  • BRIEF SUMMARY
  • A cooler (1) for a PC processor comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. The channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).
  • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
  • In the following, the invention is explained in detail using an embodiment with a variant with reference to the drawings.
  • FIG. 1 illustrates a section through a cooler according to the embodiment.
  • FIG. 2 illustrates a section in the area of a connection of the channel planes of the cooler from FIG. 1.
  • FIG. 3 illustrates a perspective view of the cooler from FIG. 1.
  • FIGS. 4 a-c illustrate a sheet, which is used for a channel, from various perspectives.
  • DETAILED DESCRIPTION
  • For the purposes of promoting an understanding of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended, such alterations and further modifications in the illustrated device and its use, and such further applications of the principles of the disclosure as illustrated therein being contemplated as would normally occur to one skilled in the art to which the disclosure relates.
  • A cooler 1 for a PC processor (not shown) has a channel system 2, in which a coolant is located, with a heat-absorbing area 3 and a heat-dissipating area 4. The heat-dissipating area 3, shown at the bottom in FIG. 1, comprises a chamber formed by a hood, in which a plurality of pins 5 for increasing the heat-transferring surface area projects from the side of the contact area 6 on the PC processor.
  • A closable coolant filling nozzle 7, with whose help the channel system 2 is partially filled after successful production of the cooler 1 with the coolant, in the present case an alcohol-water mixture, which is at a slightly reduced pressure, opens into the heat-absorbing area 3.
  • The heat-absorbing area 3 is connected via openings (not shown in more detail) to the heat-dissipating area 4. The heat-dissipating area 4 is composed essentially from sheet-metal parts 8 constructed as stamped and bent parts (see FIG. 4), corrugated ribs 9, a base plate arranged adjacent to the heat-absorbing area 3, and a cover plate arranged on the other side of the heat-dissipating area 4. All of the parts, that is, the parts of the heat-dissipating area 4 and also the heat-absorbing area 3, are soldered to each other in a single work process after being put together. Here, two sheet-metal parts 8 twisted around each other form a plane of the channel system 2 in the form of a square-shaped ring channel. The individual planes of the channel system 2 are connected to each other via connections 10 at two diagonally opposite corners. The connections 10 are here part of the stamped and bent sheet-metal parts, wherein they are constructed on one side projecting with a hollow cylindrical shape and are soldered to the corresponding area of the adjacent plane of the channel system 2.
  • Corrugated ribs 9 are arranged between two planes of the channel system 2, wherein the orientation of the corrugated ribs 9 is such that good ventilation is possible with the help of a fan (not shown) attached by means of screws (at the top in FIG. 1).
  • The arrangement of the cooler 1 is advantageous so that the heat-absorbing area 3 is arranged underneath the heat-dissipating area 4, so that the liquid coolant flows downward and collects there. Due to the reduced low pressure, the boiling point is reduced, so that even for a relatively small increase in the temperature, due to the heat output by the PC processor, boiling generates bubbles, which rise upwards, that is, also into the heat-dissipating area 4, and thus ensure a continuous thorough mixing of the coolant. In the heat-dissipating area 4, the coolant is cooled by the dissipation of heat outward to the air fed from the fan. The cooled coolant sinks back into the heat-absorbing area 3, where it can again absorb and dissipate heat.
  • According to one variant, instead of stamped and bent sheet-metal parts, profiled elements and plates are used, which allow a corresponding layout of the channel system. The profiled elements and plates can also be soldered to each other in one work process. The function corresponds to that of the first embodiment.
  • While the preferred embodiment of the invention has been illustrated and described in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that all changes and modifications that come within the spirit of the invention are desired to be protected.

Claims (13)

1-12. (canceled)
13. A cooler, especially for a semiconductor component, in particular for a PC processor, with a heat-absorbing area (3) and a heat-dissipating area (4), characterized by a channel system (2), which is made from profiled elements and/or stamped and bent sheet-metal parts (8) soldered to each other and which is filled at least partially with a coolant, and corrugated sheet-metal ribs (9) arranged between the channels of the channel system (2) in the heat-dissipating area (4).
14. The cooler according to claim 13, characterized in that the channel system (2) has a square construction at least in the heat-dissipating area (4).
15. The cooler according to claim 14, characterized in that the channel system has several interconnected planes in the heat-dissipating area (4).
16. The cooler according to claim 15, characterized in that at least two connections (10) are provided.
17. The cooler according to claim 16, characterized in that the connections (10) are arranged on opposite corners.
18. The cooler according to claim 17, characterized in that the connections (10) are constructed as formed areas of the stamped and bent sheet-metal parts (8), which are constructed on one side with a projecting, hollow cylindrical, shape.
19. The cooler according to claim 13, characterized in that a closable filling nozzle (7) is provided opening into the heat-absorbing area (3).
20. The cooler according to claim 13, characterized in that the heat-absorbing area (3) is formed by a chamber, in which a plurality of crossbars, pins (5), or other surface area-increasing elements project outward from the side on which the element to be cooled is attached.
21. The cooler according to claim 20, characterized in that the longitudinal extent of the surface area-increasing element extends perpendicular to the planes of the channel system (2) in the heat-dissipating area (4).
22. The cooler according to claim 13, characterized in that the corrugated sheet-metal ribs (9) are arranged running parallel to the stamped and bent sheet-metal parts (8), wherein the crests and valleys of the corrugated sheet-metal ribs (9) are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels.
23. The cooler according to claim 13, characterized in that attachment openings for a fan are provided on the cooler (1), wherein the fan is attached in the heat-dissipating area (4).
24. The cooler according to claim 13, characterized in that the cooler (1) is partially filled with an alcohol-water mixture as a coolant, wherein the coolant is at a slightly reduced pressure.
US11/883,472 2005-02-01 2006-01-26 Cooler Abandoned US20090014157A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005004777.7 2005-02-01
DE102005004777A DE102005004777A1 (en) 2005-02-01 2005-02-01 cooler
PCT/EP2006/000681 WO2006081977A1 (en) 2005-02-01 2006-01-26 Cooler

Publications (1)

Publication Number Publication Date
US20090014157A1 true US20090014157A1 (en) 2009-01-15

Family

ID=36177772

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/883,472 Abandoned US20090014157A1 (en) 2005-02-01 2006-01-26 Cooler

Country Status (4)

Country Link
US (1) US20090014157A1 (en)
EP (1) EP1846713A1 (en)
DE (1) DE102005004777A1 (en)
WO (1) WO2006081977A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010012328U1 (en) * 2010-09-08 2011-12-13 Heinz Georg Symann Plate heat exchanger with blower

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
US5832986A (en) * 1996-06-28 1998-11-10 Eastman Kodak Company Heat exchanger
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US5998863A (en) * 1996-07-19 1999-12-07 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US20010006101A1 (en) * 1998-03-31 2001-07-05 Chu Richard C. Extended air cooling with heat loop for dense or compact configurations of electronic components
US20010040022A1 (en) * 2000-01-04 2001-11-15 Hao Li Jia Bubble cycling heat exchanger
US6341646B1 (en) * 1998-11-20 2002-01-29 Denso Corporation Cooling device boiling and condensing refrigerant
US20040011511A1 (en) * 2002-07-18 2004-01-22 Debashis Ghosh Thermosiphon for electronics cooling with nonuniform airflow
US6695039B1 (en) * 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
US6742575B2 (en) * 2002-02-26 2004-06-01 Denso Corporation Boiling and condensing apparatus
US6827132B1 (en) * 2003-09-23 2004-12-07 Inventec Corporation Radiation apparatus
US6863119B2 (en) * 2000-09-14 2005-03-08 Denso Corporation Cooling device boiling and condensing refrigerant

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5736849A (en) * 1980-08-14 1982-02-27 Toshiba Corp Power converter
EP0409179B1 (en) * 1989-07-19 1995-01-18 Showa Aluminum Corporation Heat pipe
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
FI20021027A0 (en) * 2002-05-31 2002-05-31 Outokumpu Oy Radiator element for electronic device
DE202004001729U1 (en) * 2004-02-05 2004-04-15 Giga-Byte Technology Co., Ltd., Hsin-Tien Cooling system for use with electronic modules has vertical plate stack for heat conduction cooled by radial flow fan

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US5832986A (en) * 1996-06-28 1998-11-10 Eastman Kodak Company Heat exchanger
US5998863A (en) * 1996-07-19 1999-12-07 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US20010006101A1 (en) * 1998-03-31 2001-07-05 Chu Richard C. Extended air cooling with heat loop for dense or compact configurations of electronic components
US6341646B1 (en) * 1998-11-20 2002-01-29 Denso Corporation Cooling device boiling and condensing refrigerant
US20010040022A1 (en) * 2000-01-04 2001-11-15 Hao Li Jia Bubble cycling heat exchanger
US6863119B2 (en) * 2000-09-14 2005-03-08 Denso Corporation Cooling device boiling and condensing refrigerant
US6742575B2 (en) * 2002-02-26 2004-06-01 Denso Corporation Boiling and condensing apparatus
US20040011511A1 (en) * 2002-07-18 2004-01-22 Debashis Ghosh Thermosiphon for electronics cooling with nonuniform airflow
US6695039B1 (en) * 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
US6827132B1 (en) * 2003-09-23 2004-12-07 Inventec Corporation Radiation apparatus

Also Published As

Publication number Publication date
DE102005004777A1 (en) 2006-08-10
EP1846713A1 (en) 2007-10-24
WO2006081977A1 (en) 2006-08-10

Similar Documents

Publication Publication Date Title
US11474574B2 (en) Cooling apparatus
US7600558B2 (en) Cooler
US7522422B2 (en) Heat sink
CN102034771B (en) Heat sink systems and devices
US20050061477A1 (en) Fan sink heat dissipation device
TWI435206B (en) Computer device heat dissipation system
JP2008186820A (en) Heating element cooling structure and driving device
US12099385B2 (en) Cooling apparatus
US20090277614A1 (en) Heat dissipating device and heat conduction structure thereof
CN101142866B (en) Heat-absorbing member, cooling device, and electronic apparatus
TW201345403A (en) Heat dissipation device
JP2024545421A (en) Siphon radiator and its radiating fin
US20190212066A1 (en) Water-cooling radiator assembly with internal horiziontal partition members and flow disturbing members
JP2006279004A (en) Heat sink with heat pipe
US20090014157A1 (en) Cooler
TWI539266B (en) Led illuminating apparatus and heat dissipater thereof
CN216903715U (en) Laser cooling device and laser
KR20160023517A (en) Heat sink having thermoconductive core and light source apparatus comprising the same
CN210220381U (en) Novel liquid cooling plate
WO2005011349A2 (en) Cooling device for leading dissipated heat away from an electrical or electronic component or assembly groups
CN101621906B (en) Radiating device
JP2007080989A (en) Heat sink
CN222108385U (en) Multi-layer liquid cooling radiator structure
KR102034166B1 (en) Electronic device having a heat radiating apparatus
TWI396462B (en) Heat dissipation device for leds

Legal Events

Date Code Title Description
AS Assignment

Owner name: BEHR INDUSTRY GMBH & CO. KG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GROEZINGER, STEFFEN;ROTHENHOEFER, HORST;VELTE, VOLKER;REEL/FRAME:020211/0494

Effective date: 20070925

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载