US20090014157A1 - Cooler - Google Patents
Cooler Download PDFInfo
- Publication number
- US20090014157A1 US20090014157A1 US11/883,472 US88347206A US2009014157A1 US 20090014157 A1 US20090014157 A1 US 20090014157A1 US 88347206 A US88347206 A US 88347206A US 2009014157 A1 US2009014157 A1 US 2009014157A1
- Authority
- US
- United States
- Prior art keywords
- heat
- cooler according
- area
- cooler
- channel system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000010276 construction Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
- F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
- F28D1/0333—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a cooler according to the present disclosure.
- the task of the invention is to make available an improved cooler, which is, however, economical as much as possible, especially one that can be produced economically, in particular for PC processors.
- a cooler which can be used advantageously for cooling one or more semiconductor components, especially PC processors, is provided with a heat-absorbing area and a heat-dissipating area, which has a channel system that is composed of profiled elements and/or stamped sheet-metal parts soldered to each other and that is filled at least partially with a coolant, and corrugated sheet-metal ribs arranged between the channels of the channel system in the heat-dissipating area.
- the coolant guidance can be constructed so that no other lines are necessary, i.e., the channel system is formed preferably exclusively by parts that can be soldered to each other.
- the parts that are used preferably involve as many identical parts as possible, so that the tool and logistics costs can be kept low.
- the channel system preferably has a square shape at least in the heat-dissipating area, which simplifies the use of identical parts.
- connection are preferably arranged at the corners, especially at diagonally opposite corners.
- connections are preferably constructed as formed areas of these parts, wherein they project upwards. In this way, the connections preferably have a round tube-like construction.
- a closable filling nozzle is provided opening into the heat-absorbing area.
- the filling nozzle can also have an air flow-specific task, for which it is constructed preferably at the highest position in the middle in the direction of the fan.
- the heat-absorbing area is preferably formed by a chamber, in which a plurality of crossbars, pins, or other surface area-increasing elements project outwards from the side, at which the element to be cooled is attached.
- the longitudinal extent of the surface area-increasing element is preferably perpendicular to the planes of the channel system in the heat-dissipating area.
- the corrugated sheet-metal ribs are preferably arranged running parallel to the stamped and bent sheet-metal parts forming the channels, wherein the crests and valleys of the corrugated sheet-metal ribs are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels.
- Attachment openings or boreholes for bolts or threaded boreholes are preferably provided on the cooler for a fan, with the fan preferably being attached in the heat-dissipating area.
- the cooler is preferably partially filled with an alcohol-water mixture as coolant, wherein the coolant is at a slightly reduced pressure, so that the boiling point is lowered and the boiling point is reached even for relatively low temperatures in the heat-absorbing area.
- a cooler ( 1 ) for a PC processor comprises a heat absorption area ( 3 ), a heat dissipation area ( 4 ), and a channel system ( 2 ) consisting of profiled elements and/or stamped/bent components ( 8 ) welded together.
- the channel system is at least partially filled with a coolant and comprises between the channels of the channel system ( 2 ) corrugated sheets ( 9 ) that are provided in the heat dissipation area ( 4 ).
- FIG. 1 illustrates a section through a cooler according to the embodiment.
- FIG. 2 illustrates a section in the area of a connection of the channel planes of the cooler from FIG. 1 .
- FIG. 3 illustrates a perspective view of the cooler from FIG. 1 .
- FIGS. 4 a - c illustrate a sheet, which is used for a channel, from various perspectives.
- a cooler 1 for a PC processor (not shown) has a channel system 2 , in which a coolant is located, with a heat-absorbing area 3 and a heat-dissipating area 4 .
- the heat-dissipating area 3 shown at the bottom in FIG. 1 , comprises a chamber formed by a hood, in which a plurality of pins 5 for increasing the heat-transferring surface area projects from the side of the contact area 6 on the PC processor.
- a closable coolant filling nozzle 7 with whose help the channel system 2 is partially filled after successful production of the cooler 1 with the coolant, in the present case an alcohol-water mixture, which is at a slightly reduced pressure, opens into the heat-absorbing area 3 .
- the heat-absorbing area 3 is connected via openings (not shown in more detail) to the heat-dissipating area 4 .
- the heat-dissipating area 4 is composed essentially from sheet-metal parts 8 constructed as stamped and bent parts (see FIG. 4 ), corrugated ribs 9 , a base plate arranged adjacent to the heat-absorbing area 3 , and a cover plate arranged on the other side of the heat-dissipating area 4 . All of the parts, that is, the parts of the heat-dissipating area 4 and also the heat-absorbing area 3 , are soldered to each other in a single work process after being put together.
- two sheet-metal parts 8 twisted around each other form a plane of the channel system 2 in the form of a square-shaped ring channel.
- the individual planes of the channel system 2 are connected to each other via connections 10 at two diagonally opposite corners.
- the connections 10 are here part of the stamped and bent sheet-metal parts, wherein they are constructed on one side projecting with a hollow cylindrical shape and are soldered to the corresponding area of the adjacent plane of the channel system 2 .
- Corrugated ribs 9 are arranged between two planes of the channel system 2 , wherein the orientation of the corrugated ribs 9 is such that good ventilation is possible with the help of a fan (not shown) attached by means of screws (at the top in FIG. 1 ).
- the arrangement of the cooler 1 is advantageous so that the heat-absorbing area 3 is arranged underneath the heat-dissipating area 4 , so that the liquid coolant flows downward and collects there. Due to the reduced low pressure, the boiling point is reduced, so that even for a relatively small increase in the temperature, due to the heat output by the PC processor, boiling generates bubbles, which rise upwards, that is, also into the heat-dissipating area 4 , and thus ensure a continuous thorough mixing of the coolant.
- the coolant is cooled by the dissipation of heat outward to the air fed from the fan. The cooled coolant sinks back into the heat-absorbing area 3 , where it can again absorb and dissipate heat.
- profiled elements and plates are used, which allow a corresponding layout of the channel system.
- the profiled elements and plates can also be soldered to each other in one work process.
- the function corresponds to that of the first embodiment.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a cooler (1) for a PC processor. Said cooler comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. Said channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).
Description
- This application is a National Stage filing of International Application PCT/EP2006/000681, filed Jan. 26, 2006, claiming priority to German Application No. 10 2005 004 777.7, filed Feb. 1, 2005, entitled “COOLER”. The present application claims priority to PCT/EP2006/000681, and to German Application No. 10 2005 004 777.7, and both references are expressly incorporated by reference herein, in their entireties.
- The invention relates to a cooler according to the present disclosure.
- Due to ever increasing demands, for example, on PC processors with respect to their power, the cooling requirements of these processors increase correspondingly. Here, the cooling should be performed as quietly as possible.
- The task of the invention is to make available an improved cooler, which is, however, economical as much as possible, especially one that can be produced economically, in particular for PC processors.
- This task is accomplished by a cooler with the features of the present disclosure. Advantageous constructions are described hereinafter.
- According to the invention, a cooler, which can be used advantageously for cooling one or more semiconductor components, especially PC processors, is provided with a heat-absorbing area and a heat-dissipating area, which has a channel system that is composed of profiled elements and/or stamped sheet-metal parts soldered to each other and that is filled at least partially with a coolant, and corrugated sheet-metal ribs arranged between the channels of the channel system in the heat-dissipating area. In this way, because the components are soldered to each other, simple production with only one soldering process is possible. Here, the coolant guidance can be constructed so that no other lines are necessary, i.e., the channel system is formed preferably exclusively by parts that can be soldered to each other.
- The parts that are used preferably involve as many identical parts as possible, so that the tool and logistics costs can be kept low.
- The channel system preferably has a square shape at least in the heat-dissipating area, which simplifies the use of identical parts.
- In this way, in the heat-dissipating area there are several planes that are preferably interconnected by means of at least two connections. The connections are preferably arranged at the corners, especially at diagonally opposite corners.
- For the use of stamped and bent sheet-metal parts, the connections are preferably constructed as formed areas of these parts, wherein they project upwards. In this way, the connections preferably have a round tube-like construction.
- For simple filling, preferably a closable filling nozzle is provided opening into the heat-absorbing area. In this way, the filling nozzle can also have an air flow-specific task, for which it is constructed preferably at the highest position in the middle in the direction of the fan.
- The heat-absorbing area is preferably formed by a chamber, in which a plurality of crossbars, pins, or other surface area-increasing elements project outwards from the side, at which the element to be cooled is attached. In this way, the longitudinal extent of the surface area-increasing element is preferably perpendicular to the planes of the channel system in the heat-dissipating area.
- To allow good heat transfer, the corrugated sheet-metal ribs are preferably arranged running parallel to the stamped and bent sheet-metal parts forming the channels, wherein the crests and valleys of the corrugated sheet-metal ribs are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels. With an airtight attachment of the fan above the cooler, all of the air fed through the fan can flow through the heat-dissipating area, i.e., the entire amount of supplied air can be used, which makes possible an optimization of the cooling output.
- Attachment openings or boreholes for bolts or threaded boreholes are preferably provided on the cooler for a fan, with the fan preferably being attached in the heat-dissipating area.
- The cooler is preferably partially filled with an alcohol-water mixture as coolant, wherein the coolant is at a slightly reduced pressure, so that the boiling point is lowered and the boiling point is reached even for relatively low temperatures in the heat-absorbing area.
- A cooler (1) for a PC processor comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. The channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).
- In the following, the invention is explained in detail using an embodiment with a variant with reference to the drawings.
-
FIG. 1 illustrates a section through a cooler according to the embodiment. -
FIG. 2 illustrates a section in the area of a connection of the channel planes of the cooler fromFIG. 1 . -
FIG. 3 illustrates a perspective view of the cooler fromFIG. 1 . -
FIGS. 4 a-c illustrate a sheet, which is used for a channel, from various perspectives. - For the purposes of promoting an understanding of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended, such alterations and further modifications in the illustrated device and its use, and such further applications of the principles of the disclosure as illustrated therein being contemplated as would normally occur to one skilled in the art to which the disclosure relates.
- A
cooler 1 for a PC processor (not shown) has achannel system 2, in which a coolant is located, with a heat-absorbingarea 3 and a heat-dissipating area 4. The heat-dissipating area 3, shown at the bottom inFIG. 1 , comprises a chamber formed by a hood, in which a plurality ofpins 5 for increasing the heat-transferring surface area projects from the side of thecontact area 6 on the PC processor. - A closable
coolant filling nozzle 7, with whose help thechannel system 2 is partially filled after successful production of thecooler 1 with the coolant, in the present case an alcohol-water mixture, which is at a slightly reduced pressure, opens into the heat-absorbingarea 3. - The heat-absorbing
area 3 is connected via openings (not shown in more detail) to the heat-dissipating area 4. The heat-dissipating area 4 is composed essentially from sheet-metal parts 8 constructed as stamped and bent parts (seeFIG. 4 ),corrugated ribs 9, a base plate arranged adjacent to the heat-absorbingarea 3, and a cover plate arranged on the other side of the heat-dissipating area 4. All of the parts, that is, the parts of the heat-dissipating area 4 and also the heat-absorbingarea 3, are soldered to each other in a single work process after being put together. Here, two sheet-metal parts 8 twisted around each other form a plane of thechannel system 2 in the form of a square-shaped ring channel. The individual planes of thechannel system 2 are connected to each other viaconnections 10 at two diagonally opposite corners. Theconnections 10 are here part of the stamped and bent sheet-metal parts, wherein they are constructed on one side projecting with a hollow cylindrical shape and are soldered to the corresponding area of the adjacent plane of thechannel system 2. -
Corrugated ribs 9 are arranged between two planes of thechannel system 2, wherein the orientation of thecorrugated ribs 9 is such that good ventilation is possible with the help of a fan (not shown) attached by means of screws (at the top inFIG. 1 ). - The arrangement of the
cooler 1 is advantageous so that the heat-absorbingarea 3 is arranged underneath the heat-dissipating area 4, so that the liquid coolant flows downward and collects there. Due to the reduced low pressure, the boiling point is reduced, so that even for a relatively small increase in the temperature, due to the heat output by the PC processor, boiling generates bubbles, which rise upwards, that is, also into the heat-dissipating area 4, and thus ensure a continuous thorough mixing of the coolant. In the heat-dissipating area 4, the coolant is cooled by the dissipation of heat outward to the air fed from the fan. The cooled coolant sinks back into the heat-absorbingarea 3, where it can again absorb and dissipate heat. - According to one variant, instead of stamped and bent sheet-metal parts, profiled elements and plates are used, which allow a corresponding layout of the channel system. The profiled elements and plates can also be soldered to each other in one work process. The function corresponds to that of the first embodiment.
- While the preferred embodiment of the invention has been illustrated and described in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that all changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (13)
1-12. (canceled)
13. A cooler, especially for a semiconductor component, in particular for a PC processor, with a heat-absorbing area (3) and a heat-dissipating area (4), characterized by a channel system (2), which is made from profiled elements and/or stamped and bent sheet-metal parts (8) soldered to each other and which is filled at least partially with a coolant, and corrugated sheet-metal ribs (9) arranged between the channels of the channel system (2) in the heat-dissipating area (4).
14. The cooler according to claim 13 , characterized in that the channel system (2) has a square construction at least in the heat-dissipating area (4).
15. The cooler according to claim 14 , characterized in that the channel system has several interconnected planes in the heat-dissipating area (4).
16. The cooler according to claim 15 , characterized in that at least two connections (10) are provided.
17. The cooler according to claim 16 , characterized in that the connections (10) are arranged on opposite corners.
18. The cooler according to claim 17 , characterized in that the connections (10) are constructed as formed areas of the stamped and bent sheet-metal parts (8), which are constructed on one side with a projecting, hollow cylindrical, shape.
19. The cooler according to claim 13 , characterized in that a closable filling nozzle (7) is provided opening into the heat-absorbing area (3).
20. The cooler according to claim 13 , characterized in that the heat-absorbing area (3) is formed by a chamber, in which a plurality of crossbars, pins (5), or other surface area-increasing elements project outward from the side on which the element to be cooled is attached.
21. The cooler according to claim 20 , characterized in that the longitudinal extent of the surface area-increasing element extends perpendicular to the planes of the channel system (2) in the heat-dissipating area (4).
22. The cooler according to claim 13 , characterized in that the corrugated sheet-metal ribs (9) are arranged running parallel to the stamped and bent sheet-metal parts (8), wherein the crests and valleys of the corrugated sheet-metal ribs (9) are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels.
23. The cooler according to claim 13 , characterized in that attachment openings for a fan are provided on the cooler (1), wherein the fan is attached in the heat-dissipating area (4).
24. The cooler according to claim 13 , characterized in that the cooler (1) is partially filled with an alcohol-water mixture as a coolant, wherein the coolant is at a slightly reduced pressure.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005004777.7 | 2005-02-01 | ||
DE102005004777A DE102005004777A1 (en) | 2005-02-01 | 2005-02-01 | cooler |
PCT/EP2006/000681 WO2006081977A1 (en) | 2005-02-01 | 2006-01-26 | Cooler |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090014157A1 true US20090014157A1 (en) | 2009-01-15 |
Family
ID=36177772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/883,472 Abandoned US20090014157A1 (en) | 2005-02-01 | 2006-01-26 | Cooler |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090014157A1 (en) |
EP (1) | EP1846713A1 (en) |
DE (1) | DE102005004777A1 (en) |
WO (1) | WO2006081977A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010012328U1 (en) * | 2010-09-08 | 2011-12-13 | Heinz Georg Symann | Plate heat exchanger with blower |
Citations (15)
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US4884631A (en) * | 1988-03-17 | 1989-12-05 | California Institute Of Technology | Forced air heat sink apparatus |
US5583746A (en) * | 1994-12-12 | 1996-12-10 | Tennmax Trading Corp. | Heat sink assembly for a central processing unit of a computer |
US5832986A (en) * | 1996-06-28 | 1998-11-10 | Eastman Kodak Company | Heat exchanger |
US5871043A (en) * | 1994-09-06 | 1999-02-16 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant |
US5924481A (en) * | 1995-06-22 | 1999-07-20 | Calsonic Corporation | Cooling device for electronic component |
US5998863A (en) * | 1996-07-19 | 1999-12-07 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US6005772A (en) * | 1997-05-20 | 1999-12-21 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US20010006101A1 (en) * | 1998-03-31 | 2001-07-05 | Chu Richard C. | Extended air cooling with heat loop for dense or compact configurations of electronic components |
US20010040022A1 (en) * | 2000-01-04 | 2001-11-15 | Hao Li Jia | Bubble cycling heat exchanger |
US6341646B1 (en) * | 1998-11-20 | 2002-01-29 | Denso Corporation | Cooling device boiling and condensing refrigerant |
US20040011511A1 (en) * | 2002-07-18 | 2004-01-22 | Debashis Ghosh | Thermosiphon for electronics cooling with nonuniform airflow |
US6695039B1 (en) * | 2003-02-25 | 2004-02-24 | Delphi Technologies, Inc. | Orientation insensitive thermosiphon assembly for cooling electronic components |
US6742575B2 (en) * | 2002-02-26 | 2004-06-01 | Denso Corporation | Boiling and condensing apparatus |
US6827132B1 (en) * | 2003-09-23 | 2004-12-07 | Inventec Corporation | Radiation apparatus |
US6863119B2 (en) * | 2000-09-14 | 2005-03-08 | Denso Corporation | Cooling device boiling and condensing refrigerant |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5736849A (en) * | 1980-08-14 | 1982-02-27 | Toshiba Corp | Power converter |
EP0409179B1 (en) * | 1989-07-19 | 1995-01-18 | Showa Aluminum Corporation | Heat pipe |
US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
FI20021027A0 (en) * | 2002-05-31 | 2002-05-31 | Outokumpu Oy | Radiator element for electronic device |
DE202004001729U1 (en) * | 2004-02-05 | 2004-04-15 | Giga-Byte Technology Co., Ltd., Hsin-Tien | Cooling system for use with electronic modules has vertical plate stack for heat conduction cooled by radial flow fan |
-
2005
- 2005-02-01 DE DE102005004777A patent/DE102005004777A1/en not_active Withdrawn
-
2006
- 2006-01-26 EP EP06706427A patent/EP1846713A1/en not_active Withdrawn
- 2006-01-26 WO PCT/EP2006/000681 patent/WO2006081977A1/en active Application Filing
- 2006-01-26 US US11/883,472 patent/US20090014157A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
DE102005004777A1 (en) | 2006-08-10 |
EP1846713A1 (en) | 2007-10-24 |
WO2006081977A1 (en) | 2006-08-10 |
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