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US20080314502A1 - Method for providing hermetic electrical feedthrough - Google Patents

Method for providing hermetic electrical feedthrough Download PDF

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Publication number
US20080314502A1
US20080314502A1 US11/875,198 US87519807A US2008314502A1 US 20080314502 A1 US20080314502 A1 US 20080314502A1 US 87519807 A US87519807 A US 87519807A US 2008314502 A1 US2008314502 A1 US 2008314502A1
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Prior art keywords
ceramic sheet
ceramic
paste
sheet
laminated
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Abandoned
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US11/875,198
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English (en)
Inventor
Jerry Ok
Robert J. Greenberg
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Vivani Medical Inc
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Individual
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Priority to US11/875,198 priority Critical patent/US20080314502A1/en
Priority to US11/924,408 priority patent/US8551271B2/en
Assigned to SECOND SIGHT MEDICAL PRODUCTS, INC. reassignment SECOND SIGHT MEDICAL PRODUCTS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OK, JERRY, GREENBERG, M.D., PH.D., ROBERT J.
Publication of US20080314502A1 publication Critical patent/US20080314502A1/en
Priority to US14/080,549 priority patent/US9717150B2/en
Priority to US15/626,437 priority patent/US9936590B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Definitions

  • the present disclosure relates generally to a method and apparatus for providing electrical feedthroughs and more particularly to a method and apparatus suitable for forming hermetic electrical feedthroughs through a ceramic sheet.
  • a housing must be formed of biocompatible and electrochemically stable materials and typically must include a wall containing multiple hermetic electrical feedthroughs.
  • a hermetic electrical feedthrough is comprised of electrically conductive material which extends through and is hermetically sealed in the wall material.
  • One known approach uses an assembled pin feedthrough consisting of a conductive pin that is bonded chemically at its perimeter through brazing or the use of oxides, and/or welded, and/or mechanically bonded through compression to a ceramic body.
  • gold is used as a braze material that wets the feedthrough pin and the ceramic body resulting in a hermetic seal.
  • Wetting to the ceramic body requires a deposited layer of metal such as titanium. This layer acts additionally as a diffusion barrier for the gold.
  • a method of fabricating a hermetic electrical feedthrough comprising: providing a ceramic sheet having an upper surface and a lower surface; forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface; inserting a conductive thickfilm paste into said via hole; laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate; firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via; and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.
  • a method of fabricating a hermetic electrical feedthroughs comprising: providing a plurality of ceramic sheets having an upper surface and a lower surface; forming a plurality of via holes in each of the ceramic sheets extending from said upper surface to said lower surface of each ceramic sheet; inserting a conductive thickfilm paste into the via holes of each ceramic sheet; stacking the plurality of ceramic sheets on top of each other, wherein the via holes filled with conductive thickfilm paste of each ceramic sheet is substantially aligned with the via holes filled with conductive thickfilm paste of the other ceramic sheets; sandwiching the stacked ceramic sheets between an upper ceramic sheet and a lower ceramic sheet; laminating stacked plurality of ceramic sheets with the lower ceramic sheet and the upper ceramic sheet to form a laminated ceramic substrate; firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via holes to form metalized vias and cause the laminated ceramic substrate to form a hermetic seal around the metalized vias; and removing the upper
  • FIG. 1 depicts a top view of a finished feedthrough assembly in accordance with the present disclosure comprised of a ceramic sheet having electrically conductive vias extending therethrough;
  • FIG. 2 depicts a sectional view taken substantially along the plane 2 - 2 of FIG. 1 showing the electrically conductive vias ends flush with the surfaces of the ceramic sheet;
  • FIG. 3 depicts a flow diagram illustrating a possible series of process steps for fabricating a feedthrough assembly in accordance with the present disclosure
  • FIGS. 4A-4M respectively depict the fabrication stages of a feedthrough assembly in accordance with the process flow illustrated in FIG. 3 , wherein FIG. 4A depicts a sectional view of a ceramic sheet; FIGS. 4B-C depict via holes being punched in the sheet of FIG. 4A ; FIGS. 4D-E depict exemplary stencil printing with vacuum pull down process; FIG. 4F depicts paste inserted into the via holes; FIGS. 4G-H depict exemplary multilayer lamination process; FIG. 41 shows an exemplary laminated substrate; FIGS. 4J-K depict lapping/grinding process; and FIGS. 4L-M depict dicing of the substrate to form multiple feedthrough assemblies.
  • the present disclosure is directed to a method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet (or substrate) having a possible thickness of ⁇ 40 mils. More particularly, the disclosure is directed to a method and apparatus for forming a structure including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body.
  • Electrical feedthroughs in accordance with the present writing are intended to function in corrosive environments, e.g., in medical devices intended for implantation in a patient's body.
  • the device housing be hermetically sealed which, of course, requires that all feedthroughs in the housing wall also be hermetic.
  • Biocompatiblity assures that the implanted device has no deleterious effect on body tissue.
  • Electrochemical stability assures that the corrosive environment of the body has no deleterious effect on the device. Ceramic and platinum materials are often used in implantable medical devices because they typically exhibit both biocompatibility and electrochemical stability.
  • Embodiments constructed in accordance with the present disclosure are able to achieve very high feedthrough density.
  • the feedthrough pitch i.e., center-to-center distance between adjacent feedthroughs may be from 10 mils to 40 mils.
  • FIGS. 1 and 2 depict a preferred feedthrough assembly 8 in accordance with the present disclosure comprising a thin ceramic sheet 10 of ceramic material having multiple electrical feedthroughs 12 extending therethrough terminating flush with the upper and lower surfaces 14 , 16 of sheet 10 .
  • the sheet 10 typically comprises a wall portion of a housing (not shown) for accommodating electronic circuitry.
  • the feedthroughs 12 function to electrically connect devices external to the housing, e.g., adjacent to surface 14 , to electronic circuitry contained within the housing, e.g., adjacent to surface 16 .
  • “Thin ceramic sheet” as used herein refers to a sheet having a finished thickness dimension of ⁇ 40 mils, i.e., 1 mm.
  • the apparatus in accordance with the disclosure is particularly suited for use in corrosive environments such as in medical devices implanted in a patient's body.
  • the present disclosure is directed to providing electrical feedthroughs that are compatible with thin ceramic sheets (or substrates) having a finished thickness of ⁇ 40 mils, and with feedthroughs that are hermetic, biocompatible, and electrochemically stable.
  • the ceramic sheet 10 may be formed of 90% aluminum oxide (AlO 2 ) and the feedthroughs 12 may have a diameter of ⁇ 20 mils and may be composed of paste containing, for example, platinum.
  • FIGS. 3 and 4 A- 4 M depict the possible process steps for fabricating the finished feedthrough assembly 8 illustrated in FIGS. 1 and 2 .
  • a green ceramic sheet/tape/substrate 20 ( FIG. 4A ), formed, for example, of >90% aluminum oxide (AlO 2 ) is selected as represented by step 21 in FIG. 3 .
  • the sheet 20 may have a thickness of 40 mils or less.
  • Green ceramic sheet/tape/substrate refers to an unfired ceramic sheet, tape or substrate.
  • Via holes 26 are formed into the sheet 20 as represented by FIGS. 4B-4C and step 28 in FIG. 3 .
  • each via hole 26 may be punched in to the sheet 20 using, for example, programmable punch tool 27 .
  • a plurality of via holes 26 may be punched at the same time. It is to be understood that other methods may be used to form via holes 26 .
  • via holes 26 may be formed using solvent etching, laser ablation, and/or via holes 26 may be drilled.
  • Step 37 of FIG. 3 calls for selecting a conductive thickfilm paste 17 to fill in via holes 26 depicted in FIG. 4C .
  • Thiickfilm paste refers to a material containing inorganic particles dispersed in a vehicle comprising an organic resin and a solvent. Types of different pastes are disclosed in U.S. Pat. No. 5,601,638, the disclosure of which is incorporated herein by reference.
  • a stencil printing with vacuum pull down process may be used to fill via holes 26 with the conductive paste 17 as represented by FIGS. 4D-4E and step 39 in FIG. 3 .
  • the sheet 20 may sandwiched between a stencil layer 19 and a vacuum base 80 .
  • a vacuum chuck 81 of the vacuum base 80 pulls the conductive paste 17 through holes 82 of the stencil layer 19 and into the via holes 26 as shown in FIGS. 4D-4E .
  • Step 40 of FIG. 3 calls for determining if additional green ceramic sheet/tape/substrates with paste filled via holes are required. If additional green ceramic sheet/tape/substrates with paste filled via holes are required (“Yes” in step 40 ), steps 21 , 28 , 37 and 39 are repeated. If additional green ceramic sheet/tape/substrates with paste filled via holes are not required (“No” in step 40 ), step 41 of FIG. 3 is performed.
  • the sheet 20 with via holes 26 filled with conductive paste 17 shown in FIG. 4F may go through a multilayer lamination process as represented by FIGS. 4G-4H and step 41 in FIG. 3 .
  • the sheet 20 of FIG. 4F may be laminated with, for example, sheets 91 and 92 as shown in FIG. 4G .
  • the sheets 91 and 92 may contain conductive paste filled vias 26 that are similar to the conductive paste filled vias 26 of the sheet 20 and the sheets 91 and 92 may be formed using steps 21 , 28 , 37 and 39 of FIG. 3 as described above.
  • the sheets 20 , 91 and 92 are stacked on top of each other with conductive paste filled vias 26 of each sheet being aligned on top of each other; b) stacked sheets 20 , 91 and 92 are sandwiched between two unpunched green ceramic sheets/tapes/substrates 95 and 96 ; and c) the sheets 20 , 91 and 92 and the sheets 95 and 96 are laminated together using a heatpress 98 to create laminated substrate 100 shown in FIG. 41 .
  • FIGS. 4G and 4H laminate three sheets 20 , 91 and 92 with conductive paste filled vias 26
  • this disclosure is not limited to three sheets and that a single sheet 20 with conductive paste filled vias may be laminated together with the sheets 95 and 96 without the additional sheets 91 and 92 .
  • FIGS. 4G and 4H appreciate that this disclosure is not limited to three sheets and that additional sheets with conductive paste filled vias may also be laminated together with sheets 20 , 91 and 92 .
  • Step 44 of FIG. 3 calls for the laminated substrate 100 to be fired. Firing of the laminated substrate 100 encompasses different aspects of forming bonds in ceramic (evaporation, binder burnout, sintering, etc.).
  • the unpunched ceramic layers 95 and 96 of the laminated substrate 100 help to constrain the conductive paste within via holes 26 and allow for compression during the firing step 44 .
  • the unpunched ceramic layers 95 and 96 of the laminated substrate 100 also help to isolate the conductive paste filled vias 26 from the firing atmosphere during the step 44 which may be the key to hermetic and low resistance paste filled vias 26 .
  • An exemplary firing schedule includes ramping the laminated substrate 100 of FIG. 41 up to 600° C. at a rate of 1° C./minute, then ramping up to 1600° C. at a rate at 5° C./minute, followed by a one hour dwell and then a cool-to-room-temperature interval.
  • the ceramic material of the laminated substrate 100 shrinks thereby shrinking via holes 26 around the paste 17 to form a seal.
  • the fine aluminum oxide suspension permits uniform and continuous sealing around the surface of the paste 17 .
  • the paste 17 being squeezed by the ceramic exhibits sufficient flow to enable the paste 17 to flow and fill any crevices in the ceramic. This action produces a hermetic paste/ceramic interface.
  • the firing step 44 may also cause hermeticity through bonding mechanisms like, for example, sintering, glass melt/wetting, alloying, compounding and/or diffusion solution formation.
  • “Sintering” as used herein is a term used to describe the consolidation of the ceramic material during firing. Consolidation implies that within the ceramic material, particles have joined together into an aggregate that has strength. The term sintering may be used to imply that shrinkage and densification have occurred; although this commonly happens, densification may not always occur. ⁇ “Sintering” is also a method for making objects from powder, by heating the material (below its melting point) until its particles adhere to each other. “Sintering” is traditionally used for manufacturing ceramic objects, and has also found uses in such fields as powder metallurgy.
  • “Alloying” as used herein refers to an alloy that is a homogeneous hybrid of two or more elements, at least one which is a metal, and where the resulting material has metallic properties.
  • “Compounding” as used herein refers to a chemical compound that is a substance consisting of two or more elements chemically-bonded together in a fixed proportion by mass.
  • “Diffusion solution formation” as used herein refers is the net movement of particles from an area of high concentration to an area of low concentration.
  • a solid solution is a solid-state solution of one or more solutes in a solvent. Such a mixture is considered a solution rather than a compound when the crystal structure of the solvent remains unchanged by addition of the solutes, and when the mixture remains in a single homogeneous phase.
  • the firing step 44 may also cause solidification of the metalized vias 26 and the ceramic material of the laminated substrate 100 to prevent leaks.
  • Step 48 of FIG. 3 calls for lapping or grinding the upper and lower surfaces of the fired laminated substrate 100 to remove materials 50 and 51 , depicted in FIG. 4J , in order to expose the upper and lower faces of the metalized vias 26 .
  • the upper and lower surfaces of the fired laminated substrate 100 may also go through the polishing step 49 so that the metalized vias 26 are flush with the surrounding ceramic material.
  • the fired laminated substrate 100 may be subjected to a hermeticity test, e.g., frequently a helium (He) leak test as represented by step 56 in FIG. 3 .
  • a hermeticity test e.g., frequently a helium (He) leak test as represented by step 56 in FIG. 3 .
  • He helium
  • sheet/substrate 20 may contain several patterns 24 a - d of the via holes 26 as shown in FIG. 4L .
  • the fired laminated substrate 100 would contain several patterns 24 a - d of the metal filled via holes 26 and the fired laminated substrate 100 would be subjected to a singulation or dicing step 58 to provide multiple feedthrough assemblies 60 A, 60 B, 60 C, 60 D shown in FIG. 4M .
  • the conductive paste 17 may comprise any of the noble metals and/or any of the refractory metals, for example, platinum, titanium, gold, paliadum, tantalum, niobium.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Prostheses (AREA)
US11/875,198 2001-03-30 2007-10-19 Method for providing hermetic electrical feedthrough Abandoned US20080314502A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/875,198 US20080314502A1 (en) 2007-06-25 2007-10-19 Method for providing hermetic electrical feedthrough
US11/924,408 US8551271B2 (en) 2007-06-25 2007-10-25 Method for providing hermetic electrical feedthrough
US14/080,549 US9717150B2 (en) 2001-03-30 2013-11-14 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
US15/626,437 US9936590B2 (en) 2007-06-25 2017-06-19 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

Applications Claiming Priority (2)

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US94608607P 2007-06-25 2007-06-25
US11/875,198 US20080314502A1 (en) 2007-06-25 2007-10-19 Method for providing hermetic electrical feedthrough

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US11/875,198 Abandoned US20080314502A1 (en) 2001-03-30 2007-10-19 Method for providing hermetic electrical feedthrough
US11/924,408 Active US8551271B2 (en) 2007-06-25 2007-10-25 Method for providing hermetic electrical feedthrough
US14/080,549 Active US9717150B2 (en) 2001-03-30 2013-11-14 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
US15/626,437 Active US9936590B2 (en) 2007-06-25 2017-06-19 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

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US14/080,549 Active US9717150B2 (en) 2001-03-30 2013-11-14 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
US15/626,437 Active US9936590B2 (en) 2007-06-25 2017-06-19 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

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EP (1) EP2174535B1 (fr)
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US8588916B2 (en) 2011-08-02 2013-11-19 Medtronic, Inc. Feedthrough configured for interconnect
US8653384B2 (en) 2012-01-16 2014-02-18 Greatbatch Ltd. Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
US8670829B2 (en) 2011-08-02 2014-03-11 Medtronic, Inc. Insulator for a feedthrough
US8841558B2 (en) 2011-08-02 2014-09-23 Medtronic Inc. Hermetic feedthrough
US8872035B2 (en) 2011-08-02 2014-10-28 Medtronic, Inc. Hermetic feedthrough
WO2014176565A1 (fr) * 2013-04-26 2014-10-30 Kla-Tencor Corporation Traversée électrique en céramique multi-couche permettant de passer du vide à la pression atmosphérique
US20150004359A1 (en) * 2013-06-27 2015-01-01 Heraeus Precious Metals North America Conshohocken LLP Platinum containing conductive paste
US9008779B2 (en) 2011-08-02 2015-04-14 Medtronic, Inc. Insulator for a feedthrough
US20150250386A1 (en) * 2012-09-28 2015-09-10 Csem Centre Suisse D'electronique Et De Microtechnique Sa -Recherche Et Developpement Implantable devices
US9509272B2 (en) 2011-01-31 2016-11-29 Heraeus Deutschland GmbH & Co. KG Ceramic bushing with filter
US9504840B2 (en) 2011-01-31 2016-11-29 Heraeus Deutschland GmbH & Co. KG Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
TWI561378B (en) * 2010-04-20 2016-12-11 Corning Inc Laminated hermetic sheets and related workpieces and methods of encapsulating the same
US9552899B2 (en) 2011-01-31 2017-01-24 Heraeus Deutschland GmbH & Co. KG Ceramic bushing for an implantable medical device
US9627833B2 (en) 2011-08-02 2017-04-18 Medtronic, Inc. Electrical leads for a feedthrough
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USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US20190194078A1 (en) * 2017-10-24 2019-06-27 Component Re-Engineering Company, Inc. Termination Feedthrough Unit With Ceramic Insulator Suitable For Vacuum And Corrosive Applications
US10390441B1 (en) 2008-05-28 2019-08-20 Second Sight Medical Products, Inc. Method for providing hermetic electrical feedthrough
US10420949B2 (en) * 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
US10559409B2 (en) 2017-01-06 2020-02-11 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
US11071858B2 (en) 2011-03-01 2021-07-27 Greatbatch Ltd. Hermetically sealed filtered feedthrough having platinum sealed directly to the insulator in a via hole
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
AU2022246391B2 (en) * 2016-09-30 2024-09-19 Greatcell Energy Limited A solar module and a method of fabricating a solar module

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KR102427144B1 (ko) * 2014-05-07 2022-07-28 모간 어드밴스드 세라믹스, 인코포레이티드 대형 동시소성 물품의 개선된 제조방법
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JP7590402B2 (ja) * 2019-07-12 2024-11-26 ニューラリンク コーポレーション ハーメチックシールされた電子機器および製造する方法のためのモノリシックな生体適合性フィードスルー
CN110304935B (zh) * 2019-08-08 2021-11-26 贵州大学 一种陶瓷微通道的封装方法
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US8551271B2 (en) * 2007-06-25 2013-10-08 Second Sight Medical Products, Inc. Method for providing hermetic electrical feedthrough
US20080314865A1 (en) * 2007-06-25 2008-12-25 Jerry Ok Method for Providing Hermetic Electrical Feedthrough
US10952332B2 (en) 2008-05-28 2021-03-16 Second Sight Medical Products, Inc. Method for providing hermetic electrical feedthrough
US10390441B1 (en) 2008-05-28 2019-08-20 Second Sight Medical Products, Inc. Method for providing hermetic electrical feedthrough
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US9552899B2 (en) 2011-01-31 2017-01-24 Heraeus Deutschland GmbH & Co. KG Ceramic bushing for an implantable medical device
US9509272B2 (en) 2011-01-31 2016-11-29 Heraeus Deutschland GmbH & Co. KG Ceramic bushing with filter
US9504840B2 (en) 2011-01-31 2016-11-29 Heraeus Deutschland GmbH & Co. KG Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US11071858B2 (en) 2011-03-01 2021-07-27 Greatbatch Ltd. Hermetically sealed filtered feedthrough having platinum sealed directly to the insulator in a via hole
US10471266B2 (en) 2011-08-02 2019-11-12 Medtronic, Inc. Hermetic feedthrough for an implantable medical device
US8670829B2 (en) 2011-08-02 2014-03-11 Medtronic, Inc. Insulator for a feedthrough
US8588916B2 (en) 2011-08-02 2013-11-19 Medtronic, Inc. Feedthrough configured for interconnect
US9418778B2 (en) 2011-08-02 2016-08-16 Medtronic, Inc. Method of manufacturing a feedthrough
US10561851B2 (en) 2011-08-02 2020-02-18 Medtronic, Inc. Interconnection of conductor to feedthrough
US9724524B2 (en) 2011-08-02 2017-08-08 Medtronic, Inc. Interconnection of conductor to feedthrough
US9008779B2 (en) 2011-08-02 2015-04-14 Medtronic, Inc. Insulator for a feedthrough
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US10420949B2 (en) * 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
US9511220B2 (en) 2012-01-16 2016-12-06 Greatbatch Ltd. Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
US11351387B2 (en) * 2012-01-16 2022-06-07 Greatbatch Ltd. Method of manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device incorporating a post conductive paste filled pressing step
US8938309B2 (en) 2012-01-16 2015-01-20 Greatbatch Ltd. Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
US9352150B2 (en) 2012-01-16 2016-05-31 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US9233253B2 (en) 2012-01-16 2016-01-12 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
US8653384B2 (en) 2012-01-16 2014-02-18 Greatbatch Ltd. Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
US9492659B2 (en) 2012-01-16 2016-11-15 Greatbatch Ltd. Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
USRE47624E1 (en) 2012-01-16 2019-10-01 Greatbatch Ltd. Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
US10500402B2 (en) 2012-01-16 2019-12-10 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US20150250386A1 (en) * 2012-09-28 2015-09-10 Csem Centre Suisse D'electronique Et De Microtechnique Sa -Recherche Et Developpement Implantable devices
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
WO2014176565A1 (fr) * 2013-04-26 2014-10-30 Kla-Tencor Corporation Traversée électrique en céramique multi-couche permettant de passer du vide à la pression atmosphérique
US9591770B2 (en) 2013-04-26 2017-03-07 Kla-Tencor Corporation Multi-layer ceramic vacuum to atmosphere electric feed through
US9892816B2 (en) * 2013-06-27 2018-02-13 Heraeus Precious Metals North America Conshohocken Llc Platinum containing conductive paste
US20150004359A1 (en) * 2013-06-27 2015-01-01 Heraeus Precious Metals North America Conshohocken LLP Platinum containing conductive paste
AU2022246391B2 (en) * 2016-09-30 2024-09-19 Greatcell Energy Limited A solar module and a method of fabricating a solar module
US10559409B2 (en) 2017-01-06 2020-02-11 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
US20190194078A1 (en) * 2017-10-24 2019-06-27 Component Re-Engineering Company, Inc. Termination Feedthrough Unit With Ceramic Insulator Suitable For Vacuum And Corrosive Applications
US11028021B2 (en) * 2017-10-24 2021-06-08 Watlow Electric Manufacturing Company Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applications

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US9717150B2 (en) 2017-07-25
AU2007355605B2 (en) 2012-04-26
US20080314865A1 (en) 2008-12-25
EP2174535A1 (fr) 2010-04-14
US9936590B2 (en) 2018-04-03
EP2174535B1 (fr) 2019-12-04
US20140076844A1 (en) 2014-03-20
US20170290171A1 (en) 2017-10-05
AU2007355605A1 (en) 2008-12-31
WO2009002355A1 (fr) 2008-12-31

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