US20080194751A1 - Filled polyamide molding materials showing a reduced water absorption - Google Patents
Filled polyamide molding materials showing a reduced water absorption Download PDFInfo
- Publication number
- US20080194751A1 US20080194751A1 US12/027,581 US2758108A US2008194751A1 US 20080194751 A1 US20080194751 A1 US 20080194751A1 US 2758108 A US2758108 A US 2758108A US 2008194751 A1 US2008194751 A1 US 2008194751A1
- Authority
- US
- United States
- Prior art keywords
- polyamide
- molding materials
- materials according
- parts
- polyamide molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 65
- 229920002647 polyamide Polymers 0.000 title claims abstract description 65
- 239000012778 molding material Substances 0.000 title claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 23
- 239000000945 filler Substances 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 239000000835 fiber Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000013329 compounding Methods 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 238000010295 mobile communication Methods 0.000 claims abstract description 6
- 238000001125 extrusion Methods 0.000 claims abstract description 3
- 238000007493 shaping process Methods 0.000 claims abstract description 3
- 239000003365 glass fiber Substances 0.000 claims description 27
- 230000009102 absorption Effects 0.000 claims description 21
- 239000008187 granular material Substances 0.000 claims description 13
- 150000004760 silicates Chemical class 0.000 claims description 11
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 10
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 10
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 8
- 229920006144 PA618 Polymers 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000004917 carbon fiber Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- -1 whiskers Substances 0.000 claims description 6
- 229920006143 PA616 Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- QQVIHTHCMHWDBS-UHFFFAOYSA-N perisophthalic acid Natural products OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 239000000454 talc Substances 0.000 claims description 4
- 229910052623 talc Inorganic materials 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920006231 aramid fiber Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000010433 feldspar Substances 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004571 lime Substances 0.000 claims description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 3
- 239000001095 magnesium carbonate Substances 0.000 claims description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 3
- 235000014380 magnesium carbonate Nutrition 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 235000012254 magnesium hydroxide Nutrition 0.000 claims description 3
- 229940088417 precipitated calcium carbonate Drugs 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 125000005624 silicic acid group Chemical class 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910052882 wollastonite Inorganic materials 0.000 claims description 3
- 239000010456 wollastonite Substances 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims 2
- 239000004609 Impact Modifier Substances 0.000 claims 1
- 238000000071 blow moulding Methods 0.000 claims 1
- 239000000975 dye Substances 0.000 claims 1
- 239000000314 lubricant Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 229920006345 thermoplastic polyamide Polymers 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 description 8
- 230000001143 conditioned effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000009757 thermoplastic moulding Methods 0.000 description 3
- 229920006060 Grivory® Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920003620 Grilon® Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004961 Radipol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229920006020 amorphous polyamide Polymers 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920006374 copolyamide PA6I/6T Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052900 illite Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/04—Polyamides derived from alpha-amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Definitions
- the present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on twin-screw extruders, and showing a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part such as antenna housings of stationary or mobile communication devices.
- thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, which are producible for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
- the present invention relates to the use of filled polyamide molding materials for manufacturing antenna housings for stationary or mobile communications devices. These molded parts have a significantly reduced variation of the electrical properties, i.e. the transmission or reception performance varies slightly with variable ambient humidity.
- Filled polyamide blends play an increasing role in the field of technical construction materials, because they have good mechanical properties.
- Fields of application are, for example, internal and external parts in the automotive sector and in the field of other means of transport, housing material for appliances and equipment for telecommunications, consumer electronics, household appliances, mechanical engineering, heating systems and mounting parts for installations.
- polymers are to be understood as polyamides in the present application, which have basic building blocks that are held together by amide bonds (—NH—CO—) and which are producible by polycondensation or polymerization of monomers, such as dicarboxylic acids, dicarboxylic acid halides, diamines, aminocarboxylic acids and/or lactames. They may be homopolymers or copolyamides.
- the average molecular weight of the polyamides should be more than 5,000, preferably more than 10,000.
- EP 0 441 423 B1 describes polyamide resin compositions with good mechanical properties and relatively low values of water absorption containing necessarily polyamide 46, and an aliphatic polyamide with a ratio of CH 2 /NHCO groups of 6 to 11 in the polyamide backbone and an amorphous polyamide with a Tg of more than 100° C. and optionally fillers.
- the values for water absorption indicated in EP 0 441 423 B1 do not yet show the equilibrium value, since it was only stored 24 h, however the lowest value is about 2.6%.
- EP 0 728 812 A1 describes thermoplastic molding materials from partly aromatic and amorphous copolyamides which optionally contain fibrous and other particulate fillers and rubber-elastic polymers. These molding materials shall have improved mechanical properties and shall be suitable for long-term usage at high temperatures, and shall also have good solution and oil resistance.
- EP 0 728 812 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise terephthalic acid, isophthalic acid, hexamethylene diamine and a cycloaliphatic diamine. Concerning water absorption of the molding materials, no information is given.
- EP 0 400 428 A1 describes thermoplastic molding materials from partly aromatic copolyamides, optionally aliphatic polyamides with adipic acid as monomer and optionally caprolactam.
- the thermoplastic molding materials according to EP 0 400 428 A1 shall have a good overall spectrum of mechanical properties, in particular high toughness levels.
- EP 0 400 428 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise 6T units and caprolactam and/or 66 units. Concerning water absorption of the molding materials, no information is given.
- polyamide molding materials with a polyamide matrix of a blend of polyamide 613 and/or polyamide 614 and/or polyamide 615 and/or polyamide 616 and/or polyamide 617 and/or polyamide 618 (A) and a copolyamide 6I/6T or polyamide 6I (B), respectively, and at least one fibrous or particulate filler (C), selected from the group consisting of glass fibers, carbon fibers, metal fibers, aramid fibers, whiskers, talc, mica, silicates, quartz, titanium dioxide, wollastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, grounded or precipitated calcium carbonate, lime, feldspar, barium sulfate, permanent magnetic or magnetizable metals or alloys, glass balls, hollow glass balls, hollow spheroidal silicate fillers, natural layered silicates, synthetic layered silicates and mixtures thereof.
- C fibrous or particulate filler
- the molded parts made from polyamide molding materials according to the present invention have very good dimensional stability and decreased variation in the electrical properties compared to molding materials based on polyamide 6 or polyamide 66.
- the present invention relates to filled polyamide molding materials with low water absorption and good mechanical properties based on polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, of a blend, consisting essentially of the following components:
- D usual additives
- the present invention relates to a method for manufacturing polyamide molding materials on normal compounding machines at cylinder temperatures of 260° C. to 320° C. wherein the polymeric portion is melted first and then fillers are dosed.
- the molding materials according to the present invention can be used to manufacture molded parts, preferably injection molded parts, more preferably for manufacturing antenna housings of stationary and mobile communication devices. These molded parts have inter alia good dimensional stability, small change in permittivity ( ⁇ r ) and loss angle (tan ⁇ ), and good hydrolytic stability due to low water absorption.
- Whiskers Needle-like single crystals of metals, oxides, borides, carbides, nitrides, polytitanate, carbon etc. mostly with polygonal cross-section are regarded to be whiskers, e.g. potassium titanate whiskers, aluminum oxide whiskers, silicon carbide whiskers. Whiskers generally have a diameter of 0.1 to 10 ⁇ m and a length in the range of mm to cm. Additionally, they have a high tensile strength. Whiskers can be produced by deposition from the gas phase on solids (VS mechanism), or from a three-phase system (VLS-mechanism).
- VS mechanism gas phase on solids
- VLS-mechanism three-phase system
- the glass fibers have a diameter of 5 to 20 ⁇ m, preferably of 5 to 15 ⁇ m and more preferably of 5 to 10 ⁇ m.
- the glass fibers preferably have circular, oval, elliptical or rectangular cross section.
- glass fibers especially oval, elliptical or rectangular with non-circular cross section (“flat glass fibers”) may be used in molding materials according to the present invention.
- These molding materials have advantages concerning strength and toughness, especially in the transverse direction, in the molded parts manufactured from the molding materials.
- the glass fibers are consisting of E glass.
- the glass fibers may be added as endless fibers or as chopped glass fibers, wherein the fibers may be equipped with a suitable sizing system and an adhesive agent or an adhesive agent system, e.g. based on silane.
- carbon black and/or carbon nanotubes may be used as antistatics in the molding materials according to the present invention.
- Using carbon black may also improve the black coloring of the molding material.
- Kaolins, serpentine, talc, mica, vermiculite, illite, smectite, montmorillonite, hectorite, double hydroxides or mixtures thereof may be used as layered silicates in the molding materials according to the present invention.
- the layered silicates may be surface treated or untreated.
- Antioxidants, antiozonants, light stabilizers, UV stabilizers, UV absorbers or UV blockers may be used in the molding materials according to the present invention as stabilizers and anti-aging agents, respectively.
- the aliphatic polyamide A) has a relative viscosity between 1.4 and 2.5, preferably 1.5 and 2.1 (0.5 wt.-% solution in m-cresol, 20° C.).
- Polyamide 614 or polyamide 618 or their mixture is preferably used as aliphatic polyamide A), more preferably polyamide 614 is used.
- the preparation of the polyamide molding materials according to the present invention can be effected on customary compounding machines, such as, for example, single-screw or twin-screw extruders or screw kneaders.
- the polymeric fraction is first melted and the filler can be introduced at a subsequent point of the extruder, for example, by means of a side feeder. If more than one filler is used, it may be added at the same point or at various points of the extruder.
- the compounding is preferably effected at set barrel temperatures of 260° C. to 320° C. However, the polymer portion and the fillers may also be dosed into the feeder together.
- the polyamide molding materials according to the present invention may also be manufactured by the known methods for producing long-fiber reinforced rod-like granules, particularly by using a pulltrusion method, wherein the endless fiber strand (roving) is completely soaked with the polymer melt, and subsequently cooled and cut.
- the long-fiber reinforced rod-like granules obtained thereby can be processed to molded parts using the normal processing procedures; especially good properties of the molded part can be obtained using gentle processing methods.
- the glass fibers which are used as roving in an alternative according to the present invention have a diameter of 10 to 20 ⁇ m, preferably of 12 to 18 ⁇ m, wherein the cross-section of the glass fibers is circular, oval, elliptical or angular.
- E glass fibers are especially used as chopped glass fibers, or as endless fibers (roving).
- all other glass fiber types such as A, C, D, M, S, R glass fibers or any mixtures thereof or mixtures with E glass fibers may be used.
- the polymer strand made from molding materials according to the present invention may be processed to granules by all known granuling methods, such as strand granuling, wherein the strand is cooled in a water bath and subsequently cut.
- strand granuling a granuling method
- underwater granuling and underwater hot cut off should be used to improve the quality of the granules, wherein the polymer melt is directly pressed through a nozzle hole and granuled by a rotating knife in a water stream.
- the molding materials according to the present invention can be processed at cylinder temperatures of 260° C. to 320° C., wherein form temperatures of 60° C. to 130° C. have to be chosen depending on the filler content of the molding materials.
- Another alternative for producing molding materials according to the present invention is mixing of granules with e.g. different matrices and/or fillers to form a dryblend, which will then be processed further.
- a compound may be produced in granular form and these granules may then be mixed to form a dryblend, optionally adding additional quantities of granular component (A) and/or (B). The such produced dryblend will then be processed.
- the homogenized granular mixture (dryblend) is processed in a processing machine, for example a screw injection molding machine, to reinforce molded parts and/or hollow bodies, wherein further quantities of granules of component (A) and/or (B) may be added.
- a processing machine for example a screw injection molding machine
- the molded parts made from the molding materials according to the present invention are used for producing interior and exterior parts, preferably with large requirements for dimensional accuracy, preferably in an environment with varying humidity, for example, in the fields of electrics, furniture, sports, engineering, sanitation and hygiene, medicine, energy and propulsion technology, automobiles and other means of transportation or housing materials for equipment and devices for telecommunication, in particular antenna housings for mobile or stationary communication devices, consumer electronics, household appliances, machinery, heating, or fastening parts for installations or for containers and ventilation parts of all kinds.
- a preferred use of the molding materials according to the present invention is the production of antenna housings for mobile or stationary communication devices. Due to the significantly reduced water absorption, the molded part and/or the housing has a significantly reduced variation of electrical properties. As described above, the electrical properties comprise, for example, permeability of electromagnetic radiation, permittivity ( ⁇ r ), or loss angle (tan ⁇ ). The water absorption results in a weakened signal due to increasing the permittivity.
- the molding materials of the compositions in Table 2 and 3 are prepared on a twin-screw extruder from the firm Werner & Pfleiderer type ZSK25.
- the granules PA 614 and PA 6I/6T are metered into the feed zone.
- the glass fiber as well as the carbon fiber is dosed into the polymer melt via a side feeder 3 barrel units before the die.
- the barrel temperature has been set as an ascending temperature profile up to 310° C. At 150 to 200 rpm, 10 kg throughput has been used. Alter cooling of the strands in a water bath the granular properties were measured after granulation and drying at 120° C. for 24 h.
- test specimens have been produced on an Arburg injection molding machine, wherein the cylinder temperatures were set with ascending profile of 280° C. to 310° C. and the molding temperature was chosen as 100° C.
- specimens are used in the dry state, they are stored at least 48 h at room temperature in a dry environment after injection molding, i.e. stored over silica gel.
- Conditioned specimens are stored according to ISO 1110 for 14 days at 72° C. and 62% relative humidity.
- GRIVORY G21 (PA 6I/6T; 2/1) is 2 wt.-% (at 23° C. and 50% relative humidity) and 7 wt.-% (at 23° C. and 100% relative humidity), respectively.
- the molding material according to the example 4 of the present invention shows greatly reduced water absorption in comparison to the molding material of comparison example 8.
- the molding materials according to the present invention show a smaller decrease of tensile modulus of elasticity by conditioning.
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Abstract
The present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices.
The thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
Description
- The present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on twin-screw extruders, and showing a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part such as antenna housings of stationary or mobile communication devices.
- The thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, which are producible for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
- Finally, the present invention relates to the use of filled polyamide molding materials for manufacturing antenna housings for stationary or mobile communications devices. These molded parts have a significantly reduced variation of the electrical properties, i.e. the transmission or reception performance varies slightly with variable ambient humidity.
- Filled polyamide blends play an increasing role in the field of technical construction materials, because they have good mechanical properties. Fields of application are, for example, internal and external parts in the automotive sector and in the field of other means of transport, housing material for appliances and equipment for telecommunications, consumer electronics, household appliances, mechanical engineering, heating systems and mounting parts for installations.
- The particular advantage of filled polyamides is the exceptionally good bonding between polymer matrix and fillers, especially concerning reinforcing fibrous fillers, However, due to high water absorption, the dimensional stability of molded parts produced thereof does not meet all requirements.
- In the following, such polymers are to be understood as polyamides in the present application, which have basic building blocks that are held together by amide bonds (—NH—CO—) and which are producible by polycondensation or polymerization of monomers, such as dicarboxylic acids, dicarboxylic acid halides, diamines, aminocarboxylic acids and/or lactames. They may be homopolymers or copolyamides. The average molecular weight of the polyamides should be more than 5,000, preferably more than 10,000.
- EP 0 441 423 B1 describes polyamide resin compositions with good mechanical properties and relatively low values of water absorption containing necessarily polyamide 46, and an aliphatic polyamide with a ratio of CH2/NHCO groups of 6 to 11 in the polyamide backbone and an amorphous polyamide with a Tg of more than 100° C. and optionally fillers. The values for water absorption indicated in EP 0 441 423 B1 do not yet show the equilibrium value, since it was only stored 24 h, however the lowest value is about 2.6%.
- EP 0 728 812 A1 describes thermoplastic molding materials from partly aromatic and amorphous copolyamides which optionally contain fibrous and other particulate fillers and rubber-elastic polymers. These molding materials shall have improved mechanical properties and shall be suitable for long-term usage at high temperatures, and shall also have good solution and oil resistance. EP 0 728 812 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise terephthalic acid, isophthalic acid, hexamethylene diamine and a cycloaliphatic diamine. Concerning water absorption of the molding materials, no information is given.
- EP 0 400 428 A1 describes thermoplastic molding materials from partly aromatic copolyamides, optionally aliphatic polyamides with adipic acid as monomer and optionally caprolactam. The thermoplastic molding materials according to EP 0 400 428 A1 shall have a good overall spectrum of mechanical properties, in particular high toughness levels. EP 0 400 428 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise 6T units and caprolactam and/or 66 units. Concerning water absorption of the molding materials, no information is given.
- Therefore, it is the object of the present invention, to provide polyamide molding materials with low water absorption and good mechanical properties, resulting in very good dimensional stability and significantly reduced variation of the electrical properties of the manufactured molded parts.
- This object is achieved by the polyamide molding materials according to claim 1, with a polyamide matrix of a blend of polyamide 613 and/or polyamide 614 and/or polyamide 615 and/or polyamide 616 and/or polyamide 617 and/or polyamide 618 (A) and a copolyamide 6I/6T or polyamide 6I (B), respectively, and at least one fibrous or particulate filler (C), selected from the group consisting of glass fibers, carbon fibers, metal fibers, aramid fibers, whiskers, talc, mica, silicates, quartz, titanium dioxide, wollastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, grounded or precipitated calcium carbonate, lime, feldspar, barium sulfate, permanent magnetic or magnetizable metals or alloys, glass balls, hollow glass balls, hollow spheroidal silicate fillers, natural layered silicates, synthetic layered silicates and mixtures thereof.
- Due to the low water absorption, the molded parts made from polyamide molding materials according to the present invention have very good dimensional stability and decreased variation in the electrical properties compared to molding materials based on polyamide 6 or polyamide 66.
- Therefore, the present invention relates to filled polyamide molding materials with low water absorption and good mechanical properties based on polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, of a blend, consisting essentially of the following components:
-
- (A) at least one aliphatic polyamide from the group consisting of polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, or mixtures thereof,
- (B) polyamide, build up from
- (b1) 60 to 100 wt.-parts units, preferably 60 to 80 wt.-parts units, more preferably 67 wt.-parts units, derived from isophthalic acid (1) in combination with hexamethylene diamine (6) in almost equimolar ratio,
- (b2) 0 to 40 wt.-parts units preferably 20 to 40 wt.-parts units, more preferably 33 wt.-parts units, derived from terephthalic acid (T) in combination with hexamethylene diamine (6) in almost equimolar ratio,
- wherein the wt.-parts of the components (b1) and (b2) totals 100 wt.-parts, and at least one filler component (C):
- (C) selected from the group consisting of glass fibers, carbon fibers, metal fibers, aramid fibers, whiskers, talc, mica, silicates, quartz, titanium dioxide, wollastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, grounded or precipitated calcium carbonate, lime, feldspar, barium sulfate, permanent magnetic or magnetizable metals or alloys, glass balls, hollow glass balls, hollow spheroidal silicate fillers, natural layered silicates, synthetic layered silicates and mixtures thereof,
- wherein the weight percents of the components (A) to (C) totals 100%, and wherein the components (A), (B) and (C) fulfill the following conditions:
-
(A) + (B): 80 to 20 wt.-%, weight ratio (A)/(B): 60/40 to 90/10, preferably 70/30 to 85/15, more preferably 70/30 to 80/20, most preferably 75/25, (C): 20 to 80 wt.-%, preferably 21 to 70 wt-.%, more preferably 31 to 64 wt.-%,
wherein the polyamide molding materials optionally comprise usual additives (D) in addition to the components (A) to (C), and wherein their amount is in addition to the sum of the components (A) to (C). - Furthermore, the present invention relates to a method for manufacturing polyamide molding materials on normal compounding machines at cylinder temperatures of 260° C. to 320° C. wherein the polymeric portion is melted first and then fillers are dosed.
- The molding materials according to the present invention can be used to manufacture molded parts, preferably injection molded parts, more preferably for manufacturing antenna housings of stationary and mobile communication devices. These molded parts have inter alia good dimensional stability, small change in permittivity (εr) and loss angle (tan δ), and good hydrolytic stability due to low water absorption.
- In the dependent claims more favorable embodiments of the present invention are contained.
- Needle-like single crystals of metals, oxides, borides, carbides, nitrides, polytitanate, carbon etc. mostly with polygonal cross-section are regarded to be whiskers, e.g. potassium titanate whiskers, aluminum oxide whiskers, silicon carbide whiskers. Whiskers generally have a diameter of 0.1 to 10 μm and a length in the range of mm to cm. Additionally, they have a high tensile strength. Whiskers can be produced by deposition from the gas phase on solids (VS mechanism), or from a three-phase system (VLS-mechanism).
- The glass fibers have a diameter of 5 to 20 μm, preferably of 5 to 15 μm and more preferably of 5 to 10 μm. The glass fibers preferably have circular, oval, elliptical or rectangular cross section.
- Preferably, glass fibers, especially oval, elliptical or rectangular with non-circular cross section (“flat glass fibers”) may be used in molding materials according to the present invention. These molding materials have advantages concerning strength and toughness, especially in the transverse direction, in the molded parts manufactured from the molding materials.
- Preferably, the glass fibers are consisting of E glass. The glass fibers may be added as endless fibers or as chopped glass fibers, wherein the fibers may be equipped with a suitable sizing system and an adhesive agent or an adhesive agent system, e.g. based on silane.
- For example, carbon black and/or carbon nanotubes may be used as antistatics in the molding materials according to the present invention.
- Using carbon black may also improve the black coloring of the molding material.
- Kaolins, serpentine, talc, mica, vermiculite, illite, smectite, montmorillonite, hectorite, double hydroxides or mixtures thereof may be used as layered silicates in the molding materials according to the present invention. The layered silicates may be surface treated or untreated.
- Antioxidants, antiozonants, light stabilizers, UV stabilizers, UV absorbers or UV blockers may be used in the molding materials according to the present invention as stabilizers and anti-aging agents, respectively.
- The aliphatic polyamide A) has a relative viscosity between 1.4 and 2.5, preferably 1.5 and 2.1 (0.5 wt.-% solution in m-cresol, 20° C.).
- Polyamide 614 or polyamide 618 or their mixture is preferably used as aliphatic polyamide A), more preferably polyamide 614 is used.
- An even greater toughness can be achieved by using special thin glass fibers with a diameter below 10 μm.
- The preparation of the polyamide molding materials according to the present invention can be effected on customary compounding machines, such as, for example, single-screw or twin-screw extruders or screw kneaders. As a rule, the polymeric fraction is first melted and the filler can be introduced at a subsequent point of the extruder, for example, by means of a side feeder. If more than one filler is used, it may be added at the same point or at various points of the extruder. The compounding is preferably effected at set barrel temperatures of 260° C. to 320° C. However, the polymer portion and the fillers may also be dosed into the feeder together.
- The polyamide molding materials according to the present invention may also be manufactured by the known methods for producing long-fiber reinforced rod-like granules, particularly by using a pulltrusion method, wherein the endless fiber strand (roving) is completely soaked with the polymer melt, and subsequently cooled and cut. The long-fiber reinforced rod-like granules obtained thereby can be processed to molded parts using the normal processing procedures; especially good properties of the molded part can be obtained using gentle processing methods.
- The glass fibers, which are used as roving in an alternative according to the present invention have a diameter of 10 to 20 μm, preferably of 12 to 18 μm, wherein the cross-section of the glass fibers is circular, oval, elliptical or angular.
- According to the present invention, E glass fibers are especially used as chopped glass fibers, or as endless fibers (roving). However, all other glass fiber types, such as A, C, D, M, S, R glass fibers or any mixtures thereof or mixtures with E glass fibers may be used.
- The polymer strand made from molding materials according to the present invention may be processed to granules by all known granuling methods, such as strand granuling, wherein the strand is cooled in a water bath and subsequently cut. At a filler content of more than 60 wt.-% underwater granuling and underwater hot cut off, respectively, should be used to improve the quality of the granules, wherein the polymer melt is directly pressed through a nozzle hole and granuled by a rotating knife in a water stream.
- The molding materials according to the present invention can be processed at cylinder temperatures of 260° C. to 320° C., wherein form temperatures of 60° C. to 130° C. have to be chosen depending on the filler content of the molding materials.
- Another alternative for producing molding materials according to the present invention is mixing of granules with e.g. different matrices and/or fillers to form a dryblend, which will then be processed further. For example, starting from the components (A) and/or (B) and the fillers (C), and optionally the additive (D), respectively, a compound may be produced in granular form and these granules may then be mixed to form a dryblend, optionally adding additional quantities of granular component (A) and/or (B). The such produced dryblend will then be processed.
- The homogenized granular mixture (dryblend) is processed in a processing machine, for example a screw injection molding machine, to reinforce molded parts and/or hollow bodies, wherein further quantities of granules of component (A) and/or (B) may be added.
- Processing of a dryblend tends to result in better mechanical properties. However, mixing of the dryblends generates an additional manufacturing step, which increases the cost of the product and thus lowers the economic efficiency. Moreover, vibration during transport may result in demixing, due to density differences and/or size differences of the various types of granules.
- The molded parts made from the molding materials according to the present invention are used for producing interior and exterior parts, preferably with large requirements for dimensional accuracy, preferably in an environment with varying humidity, for example, in the fields of electrics, furniture, sports, engineering, sanitation and hygiene, medicine, energy and propulsion technology, automobiles and other means of transportation or housing materials for equipment and devices for telecommunication, in particular antenna housings for mobile or stationary communication devices, consumer electronics, household appliances, machinery, heating, or fastening parts for installations or for containers and ventilation parts of all kinds.
- A preferred use of the molding materials according to the present invention is the production of antenna housings for mobile or stationary communication devices. Due to the significantly reduced water absorption, the molded part and/or the housing has a significantly reduced variation of electrical properties. As described above, the electrical properties comprise, for example, permeability of electromagnetic radiation, permittivity (εr), or loss angle (tan δ). The water absorption results in a weakened signal due to increasing the permittivity.
- The following examples illustrate the present invention without limiting it.
- The materials used in the examples and comparative examples are characterized in table 1.
-
TABLE 1 relative viscosity m-cresol, composition material commercial name 0.5 wt.-% at 20° C. weight-ratio manufacturer PA 614 — 1.93 — EMS-CHEMIE AG, Switzerland PA6I/6T GRIVORY G21 1.52 2/1 EMS-CHEMIE AG, Switzerland glass fiber Vetrotex — — Saint-Gobain EC10-4,5MM 99B Vetrotex, France carbon fiber Tenax — — Toho Tenax Europe HTA 5N51 6MM GmbH, Germany potassium Millicarb-OG — — Plüss-Staufer AG, carbonate Switzerland PA 66 Radipol A45 2.7 — Radici Chimica, Italy in H2SO4, 1 wt.-% PA 6 GRILON A28 2.75 — EMS-CHEMIE AG, in H2SO4, 1 wt.-% Switzerland - The molding materials of the compositions in Table 2 and 3 are prepared on a twin-screw extruder from the firm Werner & Pfleiderer type ZSK25. The granules PA 614 and PA 6I/6T are metered into the feed zone. The glass fiber as well as the carbon fiber is dosed into the polymer melt via a side feeder 3 barrel units before the die.
- The barrel temperature has been set as an ascending temperature profile up to 310° C. At 150 to 200 rpm, 10 kg throughput has been used. Alter cooling of the strands in a water bath the granular properties were measured after granulation and drying at 120° C. for 24 h.
- The test specimens have been produced on an Arburg injection molding machine, wherein the cylinder temperatures were set with ascending profile of 280° C. to 310° C. and the molding temperature was chosen as 100° C.
- The measurements were performed according to the following standards and at the following test specimens.
-
-
- ISO 527 with a traction speed of 1 mm/min
- ISO tensile bar, standard: ISO/CD 3167, type A1, 170×20/10×4 mm, temperature 23° C.
-
-
- ISO 527 with a speed of 5 mm/min
- ISO tensile bar, standard: ISO/CD 3167, type A1, 170×20/10×4 mm, temperature 23° C.
-
-
- ISO 307
- 0.5 wt-% m-cresol solution
- temperature 20° C.
- Calculation of the relative viscosity (RV) according to RV t/to based on section 11 of the norm.
-
-
- ISO 62
- granules
- temperature 23° C.
- At 50% relative humidity or at 100% relative humidity, respectively, the granules are stored until weight stops increasing.
- If the specimens are used in the dry state, they are stored at least 48 h at room temperature in a dry environment after injection molding, i.e. stored over silica gel.
- Conditioned specimens are stored according to ISO 1110 for 14 days at 72° C. and 62% relative humidity.
- The water absorption of GRIVORY G21 (PA 6I/6T; 2/1) is 2 wt.-% (at 23° C. and 50% relative humidity) and 7 wt.-% (at 23° C. and 100% relative humidity), respectively.
-
TABLE 2 examples number conditions unit 1 2 3 4 PA 614 — wt.-% 52.5 37.5 22.5 45 PA 6I/6T — wt.-% 17.5 12.5 7.5 15 glass fiber — wt.-% 30 50 62 30 carbon fiber — wt.-% — — 8 — potassium carbonate — wt.-% — — — 10 Tests tensile modulus dry MPa 8000 14800 26500 8400 of elasticity conditioned MPa 7800 13600 25000 8300 tensile strength at dry MPa 150 205 200 160 break conditioned MPa 130 180 180 135 elongation at break dry % 5 4 1.7 4.3 conditioned % 6 4.5 1.9 5 water absorption 23° C., 50% r.h. wt.-% 0.6 0.5 0.4 0.5 23° C., 100% r.h. wt.-% 2.0 1.6 1.3 1.8 -
TABLE 3 comparative examples number condition unit 5 6 7 8 PA 66 — wt.-% 52.5 37.5 — — PA 6I/6T — wt.-% 17.5 12.5 — — PA 12 — wt.-% — — — — PA 6 — wt.-% — — 50 60 glass fiber — wt.-% 30 50 50 30 mineral — wt.-% — — — 10 tests tensile modulus dry MPa 9500 16500 15400 10000 of elasticity conditioned MPa 8500 15500 10600 6500 tensile strength at break dry MPa 170 235 230 190 conditioned MPa 155 210 150 130 elongation at break dry % 3 2 3 4 conditioned % 3 2 5 — water 23° C., 50% r.h. % 1.5 1.4 1.5 2 absorption 23° C., 100% r.h. % 5 4 5 7 - As shown by the comparisons of example 1 and comparative example 5 and example 2 and comparative example 6, the water absorption of molding materials according to the present invention is significantly lower than that of the corresponding comparative examples.
- The molding material according to the example 4 of the present invention shows greatly reduced water absorption in comparison to the molding material of comparison example 8.
- The molding materials according to the present invention show a smaller decrease of tensile modulus of elasticity by conditioning.
- Furthermore, they show a higher elongation at break with the appropriate filler content.
Claims (14)
1. Filled polyamide molding materials with low water absorption and good mechanical properties based on polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, of a blend, consisting essentially of the following components:
(A) at least one aliphatic polyamide from the group consisting of polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, or mixtures thereof,
(B) polyamide, build up from
(b1) 60 to 100 wt.-parts units, preferably 60 to 80 wt.-parts units, more preferably 67 wt.-parts units, derived from isophtalic acid (I) in combination with hexamethylene diamine (6) in almost equimolar ratio,
(b2) 0 to 40 wt.-parts units, preferably 20 to 40 wt.-parts units, more preferably 33 wt.-parts units, derived from terephthalic acid (T) in combination with hexamethylene diamine (6) in almost equimolar ratio,
wherein the wt.-parts of the components (b1) and (b2) totals 100 wt.-parts, and at least one filler component (C):
(C) selected from the group consisting of glass fibers, carbon fibers, metal fibers, aramid fibers, whiskers, talc, mica, silicates, quartz, titanium dioxide, wollastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, grounded or precipitated calcium carbonate, lime, feldspar, barium sulfate, permanent magnetic or magnetizable metals or alloys, glass balls, hollow glass balls, hollow spheroidal silicate fillers, natural layered silicates, synthetic layered silicates and mixtures thereof,
wherein the weight percents of the components (A) to (C) total 100%, and
wherein the components (A), (B) and (C) fulfill the following conditions:
wherein the polyamide molding materials optionally comprise usual additives (D) in addition to the components (A) to (C), and wherein their amount is in addition to the sum of the components (A) to (C).
2. Polyamide molding materials according to claim 1 , characterized in that the aliphatic polyamide has a solution viscosity, measured in m-cresol (0.5 wt.-% at 20° C.) of ηref between 1.4 and 2.5, preferably between 1.5 and 2.1.
3. Polyamide molding materials according to one of the preceding claims 1 and 2 , characterized by a water absorption (23° C., 50% relative humidity) of <1% and of <2.8%, respectively (23° C., 100% relative humidity).
4. Polyamide molding materials according to one of the preceding claims 1 to 3 , characterized by a tensile modulus of elasticity (measured according to ISO 527) of at least 8000 MPa (dry) at a glass fiber content of 30 wt.-%.
5. Polyamide molding materials according to one of the preceding claims 1 to 4 , characterized in that the molding materials have elongations at break of 3.5% or more (measured according to ISO 527) at a glass fiber content of at least 30 wt.-%.
6. Polyamide molding materials according to one of the preceding claims 1 to 5 , characterized in that additives (D) are contained in the molding materials, which are selected from the group, consisting of the inorganic stabilizers, organic stabilizers, lubricants, dyes, metallic pigments, metal spangle, metal coated particles, halogenated flame retardants, halogen-free flame retardants, impact modifiers, antistatics, conductivity additives, in particular carbon black and/or carbon nanotubes, demolding agents, optical brighteners, or mixtures of the above additives.
7. Polyamide molding materials according to one of the preceding claims 1 to 6 , characterized in that glass fibers with a diameter of 5 to 20 μm, preferably 5-15 μm, more preferably from 5 to 10 μm are used as filler component (C), wherein the cross-section of the glass fibers is especially circular, oval, elliptical or angular, and wherein E glass fibers are particularly preferably used.
8. Polyamide molding materials according to one of the preceding claims 1 to 7 , characterized in that the aliphatic polyamide is particularly polyamide 614 or polyamide 618 or their mixture.
9. Method for producing polyamide molding materials according to one of the claims 1 to 8 on conventional compounding machines at cylinder temperatures of 260° C. to 320° C., wherein the polymeric portion is melted first and then the fillers, particularly the glass fibers and/or other fillers, are dosed.
10. Method for producing polyamide molding materials according to any of the previous claim 1 to 9, characterized in that firstly a compound in granular form is made from the first components (A) and (B) and the fillers (C) and optionally the additives (D), respectively, and these granules are subsequently mixed and optionally additional granular quantities of the components (A) and optionally (B) are added, and then the granules are processed.
11. Use of the molding materials according to one of the claims 1 to 10 with water absorptions below 1% (23° C., 50% relative humidity) and below 2.8% (23° C., 100% relative humidity), respectively, for producing of molded parts, preferably injection molded parts, more preferably antenna housings for stationary or mobile communication devices.
12. Method for producing molded parts from polyamide molding materials according to one of the claims 1 to 8 by injection molding, extrusion, blow molding, direct compounding and other shaping methods.
13. Molded part, obtainable from the polyamide molding materials according to one of the claims 1 to 8 .
14. Molded part according to claim 13 , characterized in that it is an antenna housing for stationary or mobile communications devices.
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US12/914,143 US8552103B2 (en) | 2007-02-07 | 2010-10-28 | Filled polyamide molding materials showing a reduced water absorption |
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US20080194751A1 true US20080194751A1 (en) | 2008-08-14 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US12/027,581 Abandoned US20080194751A1 (en) | 2007-02-07 | 2008-02-07 | Filled polyamide molding materials showing a reduced water absorption |
US12/914,143 Expired - Fee Related US8552103B2 (en) | 2007-02-07 | 2010-10-28 | Filled polyamide molding materials showing a reduced water absorption |
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US12/914,143 Expired - Fee Related US8552103B2 (en) | 2007-02-07 | 2010-10-28 | Filled polyamide molding materials showing a reduced water absorption |
Country Status (9)
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US (2) | US20080194751A1 (en) |
EP (1) | EP1961787B1 (en) |
JP (1) | JP5198893B2 (en) |
KR (1) | KR101135387B1 (en) |
CN (1) | CN101240110B (en) |
AT (1) | ATE428751T1 (en) |
DE (1) | DE502007000618D1 (en) |
ES (1) | ES2324734T3 (en) |
TW (1) | TWI395789B (en) |
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- 2007-02-07 EP EP07002642A patent/EP1961787B1/en not_active Not-in-force
- 2007-02-07 ES ES07002642T patent/ES2324734T3/en active Active
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- 2008-02-05 TW TW097104633A patent/TWI395789B/en not_active IP Right Cessation
- 2008-02-07 US US12/027,581 patent/US20080194751A1/en not_active Abandoned
- 2008-02-11 KR KR1020080012367A patent/KR101135387B1/en not_active Expired - Fee Related
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Cited By (22)
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US20080167404A1 (en) * | 2004-07-01 | 2008-07-10 | Solvay Advanced Polymers, Llc | Aromatic Polyamide Composition and Article Manufactured Therefrom |
US20100227122A1 (en) * | 2006-01-13 | 2010-09-09 | Teruhisa Kumazawa | Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device |
US20100032629A1 (en) * | 2008-08-07 | 2010-02-11 | Benoit Brule | Adhesive composition containing carbon nanotubes and a copolyamide |
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EP2588325A4 (en) * | 2010-06-30 | 2013-12-11 | Du Pont | Injection molded composite wheel for a vehicle |
CN105492177A (en) * | 2013-09-05 | 2016-04-13 | Sabic环球技术有限责任公司 | Method for preparing reinforced articles |
US10507608B2 (en) | 2013-11-14 | 2019-12-17 | Ems-Patent Ag | Polyamide moulding compounds for large moulded parts |
US20150287493A1 (en) * | 2014-04-08 | 2015-10-08 | Ems-Patent Ag | Electrically conductive polyamide moulding materials |
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CN106009643A (en) * | 2016-06-24 | 2016-10-12 | 宁波汇邦尼龙科技有限公司 | High-durability outer vehicle door handle material |
US11192979B2 (en) | 2017-03-30 | 2021-12-07 | Asahi Kasei Kabushiki Kaisha | Polyamide composition and molded article |
US20220348742A1 (en) * | 2019-09-27 | 2022-11-03 | Solvay Specialty Polymers Usa, Llc | Thermoplastic polymer composition |
US11312859B2 (en) * | 2020-03-13 | 2022-04-26 | Inv Nylon Chemicals Americas, Llc | Thermoplastic resins for network applications |
US20220204765A1 (en) * | 2020-03-13 | 2022-06-30 | Inv Nylon Chemicals Americas, Llc | Thermoplastic resins for network applications |
CN115413285A (en) * | 2020-03-13 | 2022-11-29 | 英威达纺织(英国)有限公司 | Thermoplastic Resins for Web Applications |
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CN115461395A (en) * | 2020-10-29 | 2022-12-09 | 株式会社Lg化学 | Thermoplastic resin composition and molded article |
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CN114656724A (en) * | 2022-03-30 | 2022-06-24 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding enhanced polyamide composition and application thereof |
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Also Published As
Publication number | Publication date |
---|---|
KR20080074055A (en) | 2008-08-12 |
TW200848469A (en) | 2008-12-16 |
EP1961787B1 (en) | 2009-04-15 |
ES2324734T3 (en) | 2009-08-13 |
JP5198893B2 (en) | 2013-05-15 |
ATE428751T1 (en) | 2009-05-15 |
CN101240110A (en) | 2008-08-13 |
EP1961787A1 (en) | 2008-08-27 |
KR101135387B1 (en) | 2012-04-17 |
JP2008189929A (en) | 2008-08-21 |
CN101240110B (en) | 2011-04-13 |
TWI395789B (en) | 2013-05-11 |
US8552103B2 (en) | 2013-10-08 |
US20110039979A1 (en) | 2011-02-17 |
DE502007000618D1 (en) | 2009-05-28 |
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Legal Events
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Owner name: EMS-CHEMIE AG, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:REXIN, ORNULF;AEPLI, ETIENNE;REEL/FRAME:020865/0188 Effective date: 20080218 |
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Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |