US20080110795A1 - Packing case for substrates of flat display device - Google Patents
Packing case for substrates of flat display device Download PDFInfo
- Publication number
- US20080110795A1 US20080110795A1 US11/985,259 US98525907A US2008110795A1 US 20080110795 A1 US20080110795 A1 US 20080110795A1 US 98525907 A US98525907 A US 98525907A US 2008110795 A1 US2008110795 A1 US 2008110795A1
- Authority
- US
- United States
- Prior art keywords
- packing case
- side walls
- protrusions
- main body
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000012856 packing Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 title abstract description 47
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000006260 foam Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
Definitions
- the present invention relates to packing cases, and more particularly to a packing case that can be used to hold or transport flat, thin objects such as substrates of flat display devices.
- a liquid crystal display includes a liquid crystal panel, which has a thin film transistor (TFT) substrate and a color filter substrate.
- TFT thin film transistor
- the TFT and color filter substrates are manufactured in different sections of a factory. Then the TFT and color filter substrates need to be transported to the same section of the factory for assembly. Packing cases are usually needed for holding and transporting the TFT and color filter substrates.
- a typical packing case generally includes a main body and a cover.
- the main body together with the cover forms a closed space for receiving the TFT and color filter substrates therein.
- the main component of the TFT and color filter substrates is glass, therefore the TFT and color filter substrates are fragile and easily damaged if subjected to external impact.
- a partition layer used as a shock absorber is provided between each two adjacent TFT substrates or color filter substrates in the packing case.
- Each TFT substrate or color filter substrate generally includes electronic components such as TFTs formed at a display area of the substrate, and auxiliary circuits such as an electrostatic discharge circuit formed at peripheral sides of the display area.
- electronic components such as TFTs formed at a display area of the substrate
- auxiliary circuits such as an electrostatic discharge circuit formed at peripheral sides of the display area.
- the electronic components and auxiliary circuits are liable to be damaged by friction between the substrate and either or both of the partition layers when the substrate is inserted into or taken out of the packing case.
- a packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side walls. Each two adjacent protrusions define a groove therebetween. The groove includes a first portion and a second portion. The first portion is adjacent to the side wall, and a width of the second portion increases with increasing distance away from the side wall.
- a packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls of the main body. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side wall. Each two adjacent protrusions define a groove therebetween.
- the groove includes a first portion and a second portion. The first portion is adjacent to the side wall and has a uniform width, and the second portion flares from the first portion such that a width of the second portion adjacent to the first portion is the same as the width of the first portion and a width of the second portion farthest from the first portion is greater than the width of the first portion.
- FIG. 1 is an exploded, isometric view of a packing case according to an exemplary embodiment of the present invention, and also showing two substrates.
- FIG. 2 is an enlarged view of a circled portion II of FIG. 1 .
- FIG. 3 is a top plan view of a main body of the packing case of FIG. 1 .
- FIG. 4 is an isometric view of the main body of the packing case of FIG. 1 holding the two substrates therein.
- FIG. 1 is an exploded, isometric view showing a packing case according to an exemplary embodiment of the present invention.
- the packing case 20 includes a cover 21 and a main body 25 .
- the cover 21 coupled with the main body 25 cooperatively define a closed space for holding or transporting flat, thin objects, which may for example be substrates 40 of flat display devices.
- the flat display devices may for example be liquid crystal displays or plasma displays.
- the substrates 40 may for example be TFT substrates and color filter substrates of liquid crystal display panels, or glass substrates of plasma display panels.
- the packing case 20 may be made of foam resin.
- the resin may be high density polyethylene, high density polypropylene, low density polyethylene, low density polypropylene, or another polyolefin material.
- the foam resin is fabricated by expansion foaming, whereby a size of the finished foam resin is about 3 to 30 times its original size.
- the forming process may be performed by way of heating up the foam resin with a mold.
- the process may also be a low pressure foaming process.
- Various portions of the packing case 20 typically have a thickness in the range from 15 mm to 100 mm.
- the main body 25 includes a bottom 212 , a first side wall 216 , a second side wall 217 , a third side wall 218 opposite to the first side wall 216 , and a fourth side wall 219 opposite to the second side wall 217 .
- the first, second, third, and fourth side walls 216 , 217 , 218 , 219 are arranged end to end, and perpendicularly extend from the bottom 212 . Thereby, the first, second, third, and fourth side walls 216 , 217 , 218 , 219 together with the bottom 212 define a space for receiving the substrates 40 .
- an inner portion of the first, second, third, and fourth side walls 216 , 217 , 218 , 219 protrudes up higher than an outer portion of the first, second, third, and fourth side wall 216 , 217 , 218 , 219 .
- an inner peripheral protruding rim (not labeled) is formed at the top of the main body 25 , with an outer peripheral ledge of the top of the main body 25 surrounding a bottom of the inner peripheral protruding rim.
- the cover 21 can thereby be fittingly engaged on the top of the main body 25 , with a bottom of the cover abutting the ledge of the main body 25 , and an inner peripheral wall of the cover abutting the inner peripheral protruding rim of the main body 25 .
- Each of the first and third side walls 216 , 218 includes a plurality of first protrusions 213 formed at an inner surface thereof.
- the first protrusions 213 are parallel to each other, separate from each other, and evenly spaced apart. All the first protrusions 213 of the first and third side walls 216 , 218 have substantially the same configuration.
- Each of the first protrusions 213 has a wedge shape, and perpendicularly extends from the inner surface of the first or third side wall 216 , 218 .
- the first protrusions 213 of the first side wall 216 are symmetrically opposite the first protrusions 213 of the third side wall 218 .
- Each two adjacent first protrusions 213 together with a corresponding portion of the first side wall 216 or third side wall 218 cooperatively define a first groove 215 .
- the first grooves 215 are oriented perpendicular to the bottom 212 of the main body 25 .
- the first grooves 215 of the first side wall 216 are symmetrically opposite the first grooves 215 of the third side wall 218 .
- Each of the first protrusions 213 includes a first surface 2131 , a second surface 2133 parallel to the first surface 2131 , and a third surface 2135 .
- the first surface 2131 and the second surface 2133 are each perpendicular to the third side wall 218 .
- the first surface 2131 has an area larger than an area of the second surface 2133 .
- the third surface 2135 extends from an end of the second surface 2133 in a direction oblique to the third side wall 218 .
- the second surface 2133 together with a corresponding portion of the first surface 2131 of an adjacent protrusion 213 cooperatively define a first portion (not labeled) of the first groove 215 therebetween.
- the third surface 2135 together with another corresponding portion of the first surface 2131 of the adjacent protrusion 213 cooperatively define a second portion (not labeled) of the first groove 215 therebetween.
- the first portion of the first groove 215 has a width approximately equal to a thickness of the substrate 40 .
- a width of the second portion of the first groove 215 increases with increasing distance away from the third side wall 218 .
- the bottom 212 includes a plurality of second protrusions 251 . All the second protrusions 251 have the same configuration. Each second protrusion 251 is strip-shaped, and extends perpendicularly up from an inner surface (not labeled) of the bottom 212 . The second protrusions 251 are arranged in two lines, which lines are parallel to each other and parallel to the first and third side walls 216 , 218 . The two lines of second protrusions 251 are at opposite sides of a central axis (not shown) of the bottom 212 , and spaced a same distance from the central axis.
- each two adjacent second protrusions 251 together with a corresponding portion of the bottom 212 cooperatively define a second groove 253 .
- the second grooves 253 at the bottom 212 are aligned with the first grooves 215 at both the first and the third side walls 216 , 218 .
- a second groove 253 in one of the lines, the aligned second groove 253 in the other line, and the aligned first grooves 215 of the first and third side walls 216 , 218 cooperatively define a groove unit (not labeled) for receiving a substrate 40 .
- the substrate 40 When a substrate 40 is received in the packing case 20 , the substrate 40 is inserted into a groove unit. A side of the substrate 40 that has electronic components and auxiliary circuits contacts the second surfaces 2133 of the first protrusions 215 . The other side of the substrate 40 contacts the first surfaces 2131 of the first protrusions 215 . Thereby, three edges of the substrate 40 corresponding to the first side wall 216 , the third side wall 218 , and the bottom 212 are received in a groove unit, as shown in FIG. 4 .
- the first protrusions 213 are provided at the first and third side walls 216 , 218 , and the second grooves 253 are provided at the bottom 212 .
- the substrate 40 is fastened in the packing case 20 , with the corresponding edges thereof being received in the groove unit defined by the first and second grooves 215 , 253 . Thereby, the substrate 40 is tightly fastened in the packing case 20 .
- a display area of the substrate 40 is generally arranged in the central portion of the substrate 40 .
- each first protrusion 213 extends in a direction oblique toward the third side wall 218 .
- the width of the second portion of the first groove 215 increases with increasing distance away from the respective first or third side wall 216 , 218 .
- Peripheral sides of the substrate 40 around the display area of the substrate 40 are located at the second portions of the first grooves 215 . Therefore, when the substrate 40 is inserted into or taken out of the first grooves 215 , and when the packing case 20 is undergoing transportation, the auxiliary circuits at the peripheral sides of the substrate 40 avoid being damaged by any friction that occurs between the substrate 40 and the packing case 20 .
- the third surface 2135 may be a curved surface, as long as the width of the second portion of the first groove 215 increases along with increasing distance away from the respective first or third side wall 216 , 218 .
- each of the second protrusions 251 may have a wedge shape.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
Abstract
Description
- The present invention relates to packing cases, and more particularly to a packing case that can be used to hold or transport flat, thin objects such as substrates of flat display devices.
- Because the liquid crystal display has the advantages of portability, low power consumption, and low radiation, the liquid crystal display is considered by many to have the potential to completely replace cathode ray tube displays. Typically, a liquid crystal display includes a liquid crystal panel, which has a thin film transistor (TFT) substrate and a color filter substrate. In mass production of the liquid crystal display, the TFT and color filter substrates are manufactured in different sections of a factory. Then the TFT and color filter substrates need to be transported to the same section of the factory for assembly. Packing cases are usually needed for holding and transporting the TFT and color filter substrates.
- A typical packing case generally includes a main body and a cover. The main body together with the cover forms a closed space for receiving the TFT and color filter substrates therein. The main component of the TFT and color filter substrates is glass, therefore the TFT and color filter substrates are fragile and easily damaged if subjected to external impact. In order to prevent the TFT and color filter substrates from being damaged, a partition layer used as a shock absorber is provided between each two adjacent TFT substrates or color filter substrates in the packing case.
- Each TFT substrate or color filter substrate generally includes electronic components such as TFTs formed at a display area of the substrate, and auxiliary circuits such as an electrostatic discharge circuit formed at peripheral sides of the display area. However, the electronic components and auxiliary circuits are liable to be damaged by friction between the substrate and either or both of the partition layers when the substrate is inserted into or taken out of the packing case.
- What is needed, therefore, is a packing case that can overcome the above-described deficiencies.
- A packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side walls. Each two adjacent protrusions define a groove therebetween. The groove includes a first portion and a second portion. The first portion is adjacent to the side wall, and a width of the second portion increases with increasing distance away from the side wall.
- A packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls of the main body. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side wall. Each two adjacent protrusions define a groove therebetween. The groove includes a first portion and a second portion. The first portion is adjacent to the side wall and has a uniform width, and the second portion flares from the first portion such that a width of the second portion adjacent to the first portion is the same as the width of the first portion and a width of the second portion farthest from the first portion is greater than the width of the first portion.
- Other novel features and advantages will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
-
FIG. 1 is an exploded, isometric view of a packing case according to an exemplary embodiment of the present invention, and also showing two substrates. -
FIG. 2 is an enlarged view of a circled portion II ofFIG. 1 . -
FIG. 3 is a top plan view of a main body of the packing case ofFIG. 1 . -
FIG. 4 is an isometric view of the main body of the packing case ofFIG. 1 holding the two substrates therein. - Reference will now be made to the drawings to describe preferred and exemplary embodiments in detail.
-
FIG. 1 is an exploded, isometric view showing a packing case according to an exemplary embodiment of the present invention. Thepacking case 20 includes acover 21 and amain body 25. Thecover 21 coupled with themain body 25 cooperatively define a closed space for holding or transporting flat, thin objects, which may for example besubstrates 40 of flat display devices. The flat display devices may for example be liquid crystal displays or plasma displays. Thesubstrates 40 may for example be TFT substrates and color filter substrates of liquid crystal display panels, or glass substrates of plasma display panels. - The
packing case 20 may be made of foam resin. The resin may be high density polyethylene, high density polypropylene, low density polyethylene, low density polypropylene, or another polyolefin material. The foam resin is fabricated by expansion foaming, whereby a size of the finished foam resin is about 3 to 30 times its original size. The forming process may be performed by way of heating up the foam resin with a mold. The process may also be a low pressure foaming process. Various portions of thepacking case 20 typically have a thickness in the range from 15 mm to 100 mm. - The
main body 25 includes abottom 212, afirst side wall 216, asecond side wall 217, athird side wall 218 opposite to thefirst side wall 216, and afourth side wall 219 opposite to thesecond side wall 217. The first, second, third, andfourth side walls bottom 212. Thereby, the first, second, third, andfourth side walls bottom 212 define a space for receiving thesubstrates 40. At a top of each of the first, second, third, andfourth side walls fourth side walls fourth side wall main body 25, with an outer peripheral ledge of the top of themain body 25 surrounding a bottom of the inner peripheral protruding rim. Thecover 21 can thereby be fittingly engaged on the top of themain body 25, with a bottom of the cover abutting the ledge of themain body 25, and an inner peripheral wall of the cover abutting the inner peripheral protruding rim of themain body 25. - Each of the first and
third side walls first protrusions 213 formed at an inner surface thereof. At each of the first andthird side walls first protrusions 213 are parallel to each other, separate from each other, and evenly spaced apart. All thefirst protrusions 213 of the first andthird side walls first protrusions 213 has a wedge shape, and perpendicularly extends from the inner surface of the first orthird side wall first protrusions 213 of thefirst side wall 216 are symmetrically opposite thefirst protrusions 213 of thethird side wall 218. Each two adjacentfirst protrusions 213 together with a corresponding portion of thefirst side wall 216 orthird side wall 218 cooperatively define afirst groove 215. Thefirst grooves 215 are oriented perpendicular to thebottom 212 of themain body 25. Thefirst grooves 215 of thefirst side wall 216 are symmetrically opposite thefirst grooves 215 of thethird side wall 218. - Also referring to
FIG. 2 , this is an enlarged view of a circled portion II ofFIG. 1 . Each of thefirst protrusions 213 includes afirst surface 2131, asecond surface 2133 parallel to thefirst surface 2131, and athird surface 2135. Thefirst surface 2131 and thesecond surface 2133 are each perpendicular to thethird side wall 218. Thefirst surface 2131 has an area larger than an area of thesecond surface 2133. Thethird surface 2135 extends from an end of thesecond surface 2133 in a direction oblique to thethird side wall 218. Thesecond surface 2133 together with a corresponding portion of thefirst surface 2131 of anadjacent protrusion 213 cooperatively define a first portion (not labeled) of thefirst groove 215 therebetween. Thethird surface 2135 together with another corresponding portion of thefirst surface 2131 of theadjacent protrusion 213 cooperatively define a second portion (not labeled) of thefirst groove 215 therebetween. - The first portion of the
first groove 215 has a width approximately equal to a thickness of thesubstrate 40. A width of the second portion of thefirst groove 215 increases with increasing distance away from thethird side wall 218. - Also referring to
FIG. 3 , this is a top plan view of themain body 25. The bottom 212 includes a plurality ofsecond protrusions 251. All thesecond protrusions 251 have the same configuration. Eachsecond protrusion 251 is strip-shaped, and extends perpendicularly up from an inner surface (not labeled) of the bottom 212. Thesecond protrusions 251 are arranged in two lines, which lines are parallel to each other and parallel to the first andthird side walls second protrusions 251 are at opposite sides of a central axis (not shown) of the bottom 212, and spaced a same distance from the central axis. In each line, thesecond protrusions 251 are parallel to each other, separate from each other, and evenly spaced apart. Thus each two adjacentsecond protrusions 251 together with a corresponding portion of the bottom 212 cooperatively define asecond groove 253. Thesecond grooves 253 at the bottom 212 are aligned with thefirst grooves 215 at both the first and thethird side walls second groove 253 in one of the lines, the alignedsecond groove 253 in the other line, and the alignedfirst grooves 215 of the first andthird side walls substrate 40. - When a
substrate 40 is received in thepacking case 20, thesubstrate 40 is inserted into a groove unit. A side of thesubstrate 40 that has electronic components and auxiliary circuits contacts thesecond surfaces 2133 of thefirst protrusions 215. The other side of thesubstrate 40 contacts thefirst surfaces 2131 of thefirst protrusions 215. Thereby, three edges of thesubstrate 40 corresponding to thefirst side wall 216, thethird side wall 218, and the bottom 212 are received in a groove unit, as shown inFIG. 4 . - As detailed above, the
first protrusions 213 are provided at the first andthird side walls second grooves 253 are provided at the bottom 212. Thesubstrate 40 is fastened in thepacking case 20, with the corresponding edges thereof being received in the groove unit defined by the first andsecond grooves substrate 40 is tightly fastened in thepacking case 20. In addition, a display area of thesubstrate 40 is generally arranged in the central portion of thesubstrate 40. Thus when thesubstrate 40 is inserted into or taken out of the first andsecond grooves packing case 20 is undergoing transportation, the display area of thesubstrate 40 does not contact thepacking case 20. Accordingly, the electronic components at the display area of thesubstrate 40 avoid being damaged by any friction that occurs between thesubstrate 40 and thepacking case 20. - Furthermore, the
third surface 2135 of eachfirst protrusion 213 extends in a direction oblique toward thethird side wall 218. The width of the second portion of thefirst groove 215 increases with increasing distance away from the respective first orthird side wall substrate 40 around the display area of thesubstrate 40 are located at the second portions of thefirst grooves 215. Therefore, when thesubstrate 40 is inserted into or taken out of thefirst grooves 215, and when thepacking case 20 is undergoing transportation, the auxiliary circuits at the peripheral sides of thesubstrate 40 avoid being damaged by any friction that occurs between thesubstrate 40 and thepacking case 20. - Various modifications and alterations to the above-described embodiments are possible. For example, the
third surface 2135 may be a curved surface, as long as the width of the second portion of thefirst groove 215 increases along with increasing distance away from the respective first orthird side wall second protrusions 251 may have a wedge shape. - It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95141783 | 2006-11-10 | ||
TW095141783A TWI316040B (en) | 2006-11-10 | 2006-11-10 | Packing box for glass substrate and a package structure of a glass substrate using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080110795A1 true US20080110795A1 (en) | 2008-05-15 |
Family
ID=39368170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/985,259 Abandoned US20080110795A1 (en) | 2006-11-10 | 2007-11-13 | Packing case for substrates of flat display device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080110795A1 (en) |
TW (1) | TWI316040B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140299508A1 (en) * | 2013-04-09 | 2014-10-09 | Gudeng Precision Industrial Co., Ltd. | Anti-electrostatic substrate cassette |
JP2014231394A (en) * | 2013-05-28 | 2014-12-11 | コーニング精密素材株式会社Corning Precision Materials Co.,Ltd. | Box for substrate transfer |
US20160272412A1 (en) * | 2013-12-24 | 2016-09-22 | Boe Technology Group Co., Ltd. | Packaging structure and packaging method for display panel |
CN107600640A (en) * | 2017-07-14 | 2018-01-19 | 友达光电股份有限公司 | Packing case (food) |
CN107792475A (en) * | 2017-10-27 | 2018-03-13 | 友达光电(苏州)有限公司 | Packaging structure |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4566839A (en) * | 1983-05-18 | 1986-01-28 | Microglass, Inc. | Semiconductor wafer diffusion boat and method |
US4618062A (en) * | 1984-10-04 | 1986-10-21 | Komamura Photographic Co., Ltd. | Film holder for cameras |
US4858414A (en) * | 1981-01-26 | 1989-08-22 | Wully, S.A. | Packing case, particularly for sheet material |
US5025926A (en) * | 1987-07-07 | 1991-06-25 | Empak, Inc. | Package |
US5330053A (en) * | 1991-02-07 | 1994-07-19 | Dai Nippon Printing Co., Ltd. | Case for photomask |
US5588531A (en) * | 1993-11-09 | 1996-12-31 | Yodogawa Kasei Kabushiki Kaisha | Glass substrate transport box |
US5782361A (en) * | 1995-06-26 | 1998-07-21 | Kakizaki Manufacturing Co., Ltd. | Thin-plate supporting container |
US5857573A (en) * | 1998-01-15 | 1999-01-12 | Advanced Micro Devices, Inc. | Tray for shipping PCMCIA cards |
US6206197B1 (en) * | 1998-10-30 | 2001-03-27 | Stmicroelectronics S.A. | Semiconductor wafer carrier with grooves |
US20050006266A1 (en) * | 2003-07-08 | 2005-01-13 | Hoya Corporation | Container for housing a mask blank, method of housing a mask blank, and mask blank package |
US20060002785A1 (en) * | 2002-01-15 | 2006-01-05 | Cardinal Ig Company | Methods and apparatus for handling fragile bars |
US6994217B2 (en) * | 2003-10-09 | 2006-02-07 | Entegris, Inc. | Shipper with tooth design for improved loading |
US20060283774A1 (en) * | 2005-05-17 | 2006-12-21 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container and method for manufacturing the same |
-
2006
- 2006-11-10 TW TW095141783A patent/TWI316040B/en not_active IP Right Cessation
-
2007
- 2007-11-13 US US11/985,259 patent/US20080110795A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4858414A (en) * | 1981-01-26 | 1989-08-22 | Wully, S.A. | Packing case, particularly for sheet material |
US4566839A (en) * | 1983-05-18 | 1986-01-28 | Microglass, Inc. | Semiconductor wafer diffusion boat and method |
US4618062A (en) * | 1984-10-04 | 1986-10-21 | Komamura Photographic Co., Ltd. | Film holder for cameras |
US5025926A (en) * | 1987-07-07 | 1991-06-25 | Empak, Inc. | Package |
US5330053A (en) * | 1991-02-07 | 1994-07-19 | Dai Nippon Printing Co., Ltd. | Case for photomask |
US5588531A (en) * | 1993-11-09 | 1996-12-31 | Yodogawa Kasei Kabushiki Kaisha | Glass substrate transport box |
US5782361A (en) * | 1995-06-26 | 1998-07-21 | Kakizaki Manufacturing Co., Ltd. | Thin-plate supporting container |
US5857573A (en) * | 1998-01-15 | 1999-01-12 | Advanced Micro Devices, Inc. | Tray for shipping PCMCIA cards |
US6206197B1 (en) * | 1998-10-30 | 2001-03-27 | Stmicroelectronics S.A. | Semiconductor wafer carrier with grooves |
US20060002785A1 (en) * | 2002-01-15 | 2006-01-05 | Cardinal Ig Company | Methods and apparatus for handling fragile bars |
US20050006266A1 (en) * | 2003-07-08 | 2005-01-13 | Hoya Corporation | Container for housing a mask blank, method of housing a mask blank, and mask blank package |
US6994217B2 (en) * | 2003-10-09 | 2006-02-07 | Entegris, Inc. | Shipper with tooth design for improved loading |
US20060283774A1 (en) * | 2005-05-17 | 2006-12-21 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container and method for manufacturing the same |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140299508A1 (en) * | 2013-04-09 | 2014-10-09 | Gudeng Precision Industrial Co., Ltd. | Anti-electrostatic substrate cassette |
US9396980B2 (en) * | 2013-04-09 | 2016-07-19 | Gudeng Precision Industrial Co., Ltd. | Anti-electrostatic substrate cassette |
JP2014231394A (en) * | 2013-05-28 | 2014-12-11 | コーニング精密素材株式会社Corning Precision Materials Co.,Ltd. | Box for substrate transfer |
US20160272412A1 (en) * | 2013-12-24 | 2016-09-22 | Boe Technology Group Co., Ltd. | Packaging structure and packaging method for display panel |
US10065793B2 (en) * | 2013-12-24 | 2018-09-04 | Boe Technology Group Co., Ltd. | Packaging structure and packaging method for display panel |
CN107600640A (en) * | 2017-07-14 | 2018-01-19 | 友达光电股份有限公司 | Packing case (food) |
CN107792475A (en) * | 2017-10-27 | 2018-03-13 | 友达光电(苏州)有限公司 | Packaging structure |
Also Published As
Publication number | Publication date |
---|---|
TW200821234A (en) | 2008-05-16 |
TWI316040B (en) | 2009-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101182266B1 (en) | Container member, Fabrication method for the same and Display Device having the same | |
US6392723B1 (en) | Flat display device with substantially rectangular bezel | |
US20080128310A1 (en) | Packing case with buffers for holding multi-size substrates of display device | |
US20070095703A1 (en) | Packing apparatus with internal partition layer | |
US9568757B2 (en) | Display device having mold frame with elastic protective member | |
US20080110795A1 (en) | Packing case for substrates of flat display device | |
US8633405B2 (en) | Display panel and display device including the same | |
US20140362325A1 (en) | Display apparatus | |
US20150041352A1 (en) | Packaging device for liquid crystal panel | |
US8760599B2 (en) | Display device and method for manufacturing the same | |
US8902376B2 (en) | Backlight module and display device using the same | |
US10065793B2 (en) | Packaging structure and packaging method for display panel | |
CN101723137B (en) | Packing box | |
US9758298B2 (en) | Packing box for liquid crystal glass panel | |
US10906718B2 (en) | Tray with buffering members for carrying display panel | |
US20110215019A1 (en) | Package Box Module | |
US20120133608A1 (en) | Touch display assembly structure | |
KR100673580B1 (en) | Board Storage Tray | |
WO2016033786A1 (en) | Packing case of liquid crystal panel | |
US7612842B2 (en) | Optical module | |
US20040170003A1 (en) | Adjustable cassette for substrates | |
KR20120063944A (en) | Packing box for lcd | |
KR20100034265A (en) | Package case for substrate | |
TWI703075B (en) | Cushioning packaging device | |
TWI462211B (en) | Assembly of bearing device and object and bearing device thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INNOLUX DISPLAY CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KAO, SHU-HUI;CHUANG, CHENG-DOUL;CHUNG, WEN-KAI;AND OTHERS;REEL/FRAME:020162/0380 Effective date: 20071106 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: INNOLUX CORPORATION, TAIWAN Free format text: CHANGE OF NAME;ASSIGNOR:CHIMEI INNOLUX CORPORATION;REEL/FRAME:032672/0746 Effective date: 20121219 Owner name: CHIMEI INNOLUX CORPORATION, TAIWAN Free format text: CHANGE OF NAME;ASSIGNOR:INNOLUX DISPLAY CORP.;REEL/FRAME:032672/0685 Effective date: 20100330 |