US20080081859A1 - Thermally Conductive Sheet And Method Of Production Thereof - Google Patents
Thermally Conductive Sheet And Method Of Production Thereof Download PDFInfo
- Publication number
- US20080081859A1 US20080081859A1 US11/720,121 US72012105A US2008081859A1 US 20080081859 A1 US20080081859 A1 US 20080081859A1 US 72012105 A US72012105 A US 72012105A US 2008081859 A1 US2008081859 A1 US 2008081859A1
- Authority
- US
- United States
- Prior art keywords
- thermally conductive
- meth
- conductive sheet
- aluminum hydroxide
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 12
- 239000011231 conductive filler Substances 0.000 claims abstract description 76
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 62
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 59
- 239000002530 phenolic antioxidant Substances 0.000 claims abstract description 51
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 48
- 239000011593 sulfur Substances 0.000 claims abstract description 48
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 46
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 32
- 239000000178 monomer Substances 0.000 claims description 68
- 239000000203 mixture Substances 0.000 claims description 54
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 41
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 31
- 238000006116 polymerization reaction Methods 0.000 description 17
- -1 acrylic ester Chemical class 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- 238000012719 thermal polymerization Methods 0.000 description 10
- 229910044991 metal oxide Inorganic materials 0.000 description 8
- 150000004706 metal oxides Chemical class 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000005251 gamma ray Effects 0.000 description 2
- 150000004677 hydrates Chemical class 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 230000001976 improved effect Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- AFDOIZVAMVVAKT-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol ethyl prop-2-eneperoxoate Chemical compound CCOOC(=O)C=C.CCOOC(=O)C=C.CCOOC(=O)C=C.CCC(CO)(CO)CO AFDOIZVAMVVAKT-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- BVCOHOSEBKQIQD-UHFFFAOYSA-N 2-tert-butyl-6-methoxyphenol Chemical compound COC1=CC=CC(C(C)(C)C)=C1O BVCOHOSEBKQIQD-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
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- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- VCNTUJWBXWAWEJ-UHFFFAOYSA-J aluminum;sodium;dicarbonate Chemical compound [Na+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O VCNTUJWBXWAWEJ-UHFFFAOYSA-J 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910001647 dawsonite Inorganic materials 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- PWZFXELTLAQOKC-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide;tetrahydrate Chemical compound O.O.O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O PWZFXELTLAQOKC-UHFFFAOYSA-A 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- GGROONUBGIWGGS-UHFFFAOYSA-N oxygen(2-);zirconium(4+);hydrate Chemical compound O.[O-2].[O-2].[Zr+4] GGROONUBGIWGGS-UHFFFAOYSA-N 0.000 description 1
- LGOPTUPXVVNJFH-UHFFFAOYSA-N pentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCCC(O)=S LGOPTUPXVVNJFH-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000003244 pro-oxidative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Definitions
- the present invention relates to a thermally conductive sheet containing a (meth)acrylic polymer and a thermally conductive filler. More specifically, the present invention relates to a thermally conductive sheet which has high thermal conductivity and superior thermal stability, and a method of production thereof.
- thermally conductive sheet having higher thermal conductivity is required.
- a thermally conductive sheet containing a non-silicone resin as a binder component is required because it seldom causes a contact fault in electronics.
- non-silicone resin sheet or a composition usable in a sheet there is disclosed, for example, a formed body or a sheet in which a thermally conductive filler is filled in an acrylic resin (see JP-A-2001-310984 and JP-A-2003-238760).
- a thermally conductive adhesive containing a (meth)alkyl acrylate monomer and a thermally conductive filler or a thermally conductive adhesive containing a polymerized (meth)alkyl acrylate monomer and a thermally conductive filler see JP-A-2004-059851 and JP-A-10-316953.
- the present invention is to address the aforementioned problems and aims to provide a non-silicone (meth)acrylic polymer type thermally conductive sheet having both high thermal conductivity and thermal stability.
- thermally conductive sheet containing a thermally conductive filler As a result of studies for addressing the above problems by the inventors, it was found out that it is possible to manufacture a (meth)acrylic polymer type thermally conductive sheet containing a thermally conductive filler at high ratio by selecting a thermally conductive filler having a suitable particle size.
- thermal stability of the sheet decreases. The decrease in thermal stability seems to be attributed to the fact that metal oxides and metal hydrates show a strong pro-oxidant action because metal oxides and metal hydrates have many hydroxyl groups on the surfaces thereof.
- a synergistic effect in suppressing the thermal oxidation can be obtained by using a combination of a phenolic antioxidant and a sulfur based antioxidant, and an effect in greatly improving the thermal stability is shown.
- the present invention there is provided the following (meth)acrylic polymer type thermally conductive sheet and method of production thereof.
- a thermally conductive sheet comprising:
- the thermally conductive sheet is formed by curing a thermally conductive composition comprising:
- the thermally conductive sheet may contain 0.05 to 2 parts by weight of (C) a phenolic antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- the thermally conductive sheet may contain 0.5 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- the thermally conductive sheet may contain 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive sheet or thermally conductive composition containing (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- the thermally conductive sheet contains at least 55% by volume of (B) thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive sheet or thermally conductive composition containing (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- a method of production of a thermally conductive sheet comprising a step of curing a thermally conductive composition comprising: (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- a thermally conductive sheet of the present invention has high thermal conductivity and superior thermal stability since a combination of a phenolic antioxidant and a sulfur based antioxidant is used in a system containing a (meth)acrylic polymer and a thermally conductive filler.
- a thermally conductive sheet of the present invention can suitably be produced according to a method for producing an acrylic thermally conductive sheet of the present invention.
- (meth)acrylic means “acrylic or methacrylic”
- (meth)acrylic monomer means an acrylic monomer such as acrylic acid or acrylic ester, or a methacrylic monomer such as methacrylic acid or methacrylic ester.
- a thermally conductive sheet contains a (meth)acrylic polymer as component (A), a thermally conductive filler containing aluminum hydroxide as component (B), a phenolic antioxidant as component (C), and a sulfur based antioxidant as component (D).
- component (A) a (meth)acrylic polymer as component (A)
- thermally conductive filler containing aluminum hydroxide as component (B) a thermally conductive filler containing aluminum hydroxide as component (B), a phenolic antioxidant as component (C), and a sulfur based antioxidant as component (D).
- a (meth)acrylic polymer is a polymer obtained by polymerizing or optionally crosslinking a monomer component (A′) containing a (meth)acrylic monomer.
- the (meth)acrylic monomer is not particularly limited as long as it is a monomer used to form a general (meth)acrylic polymer.
- Useful examples are monofunctional (meth)acrylic monomers having alkyl groups of 20 or less carbons as ester groups, including ethyl (meth)acrylate, butyl(meth)acrylate, hexyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, octyl(meth)acrylate, isooctyl(meth)acrylate, decyl(meth)acrylate, and dodecyl (meth)acrylate.
- Useful examples further include acrylic acid and methacrylic acid. Incidentally, one or mixtures of these monofunctional (meth)acrylic monomers may be used. Further, flexibility of the sheet can be controlled by employing at least two kinds of monofunctional (meth)acrylate having different carbon numbers.
- the monomer component (A′) contains a polyfunctional (meth)acrylic monomer in addition to the above monofunctional (meth)acrylic monomer.
- the monomer component (A′) containing a polyfunctional (meth)acrylic monomer can be crosslinked and enhance strength of the sheet.
- a polyfunctional (meth)acrylic monomer is preferably a compound having two or more functional groups selected from the group consisting of an acryloxy group and a methacryloxy group.
- Useful examples include: di(meth)acrylates such as 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, 1,4-butanediol dimethacrylate, poly(butanediol) diacrylate, tetraethylene glycol dimethacrylate, 1,3-butylene glycol diacrylate, triethylene glycol diacrylate, triisopropylene glycol diacrylate, polyethylene glycol diacrylate, and bisphenol A dimethacrylate; tri(meth)acrylates such as trimethylol propane triacrylate, trimethylol propane trimethacrylate, pentaerythritol monohydroxy triacrylate, and trimethylol propane triethoxy triacrylate; tetraacrylates such as pent
- the monomer component (A′) contains a polyfunctional (meth)acrylic monomer as described above, there is no limitation with regard to the content. However, when the content is too small, an effect in crosslinking by the polyfunctional (meth)acrylic monomer is sometimes insufficient. When the content is too high, the sheet sometimes has low flexibility.
- the content is generally 0.01 to 5 parts by weight with respect to 100 parts by weight of monofunctional (meth)acrylic monomer.
- a thermally conductive filler is a component necessary for a thermally conductive sheet to exhibit substantial thermal conductivity.
- a thermally conductive filler employed contains aluminum hydroxide.
- a thermally conductive sheet containing a thermally conductive filler containing aluminum hydroxide component can have superior filling ability of the filler and superior flame retardancy.
- the thermally conductive filler may contain, in addition to aluminum hydroxide, another metal hydrate and/or a metal oxide.
- the thermally conductive composition generally contains at least 10% by volume of aluminum hydroxide in order to sufficiently exhibit flame retardancy.
- the thermally conductive composition generally contains at most 75% by volume of aluminum hydroxide so as not to detract flexibility as a thermally conductive sheet or not to have difficulty in filling the filler.
- the metal oxide examples include aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, zirconium oxide, and zinc oxide.
- aluminum oxide (alumina) is particularly preferable in that it has high thermal conductivity and it can be easily filled at high ratio. Since a metal hydrate also functions as a flame retardant, it is preferable that a thermally conductive sheet contains metal hydrate other than aluminum hydroxide.
- metal hydrate other than aluminum hydroxide examples include magnesium hydroxide, barium hydroxide, calcium hydroxide, dawsonite, hydrotalcite, zinc borate, calcium aluminate, and zirconium oxide hydrate.
- the thermally conductive sheet may further contain another thermally conductive filler besides the aforementioned thermally conductive filler.
- another thermally conductive filler include boron nitride, aluminum nitride, silicon nitride, boron carbide, aluminum carbide, and silicon carbide.
- thermally conductive fillers are added to the material in the form of particles.
- Use of a combination of a group of relatively large particles having the average particle diameter of 5 to 50 ⁇ m and a group of relatively small particles having the average particle diameter of below 5 ⁇ m can increase the amount of the thermally conductive filler to be added to the material.
- strength (for example, tensile strength) of the resultant thermally conductive sheet can be enhanced by subjecting a thermally conductive filler to a surface treatment with a silane coupling agent, a titanate coupling agent, fatty acid, or the like.
- a titanate coupling agent is particularly preferable from the view point of a production process since a titanate coupling agent has a superior effect in lowering viscosity of a thermally conductive composition containing large amount of filler.
- a thermally conductive filler may be subjected to a surface treatment with such a surface-treating agent in advance before the filler is mixed with other components, an effect of a surface treatment can be exhibited even if a surface-treating agent is added to a thermally conductive composition together with a thermally conductive filler and mixed with them, and then cured.
- the thermally conductive sheet has a thermal conductivity of preferably 1 W/m ⁇ K or more, and more preferably 3 W/m K or more. Therefore, it is desirable that the content of the thermally conductive filler is high from the viewpoint of enhancing thermal conductivity.
- the content of the thermally conductive filler in the thermally conductive composition is generally 55% by volume or more with respect to 100% by volume of the thermally conductive composition.
- the content of the thermally conductive filler is generally 85% by volume or less with respect to 100% by volume of the thermally conductive composition.
- a present invention is particularly effective in the case that the content of the thermally conductive filler is very high, particularly 55% by volume or more with respect to 100% by volume of the thermally conductive composition.
- the total content of metal hydrate including aluminum hydroxide in the thermally conductive composition is generally 10% by volume or more from the viewpoint of flame retardancy.
- a phenolic antioxidant there may be employed a generally used one such as monophenolic, bisphenolic, or polyphenolic antioxidant.
- a phenolic antioxidant include a monophenolic antioxidant such as 2,6-di-tert-butyl-p-cresol, tert-butyl hydroxyanisole, 2,6-di-tert-butyl-4-ethylphenol, and stearyl- ⁇ -(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; a bisphenolic antioxidant such as 2,2′-methylene-bis(4-methyl-6-tert-butylphenol), 2,2′-methylene-bis(4-ethyl-6-tert-butylphenol), 4,4′-thiobis(3-methyl-6-tert-butylphenol), 4,4′-butylidene-bis(3-methyl-6-tert-butylphenol), and triethyleneglycol-bis[3-(3-tert-butyl-4-
- the phenolic antioxidant when it is too small, sometimes sufficiently-improved thermal stability cannot be exhibited. Therefore, the phenolic antioxidant is generally contained by 0.05 part by weight or more per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer. On the other hand, when an amount of the phenolic antioxidant is too large, bleeding is sometimes caused. Further, in the case that a sheet is formed by mixing a thermally conductive filter with a monomer component, and then curing the mixture, the curing speed is sometimes lowered.
- the phenolic antioxidant is generally contained by 2 parts by weight per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- the phenolic antioxidant due to a synergistic effect by using a combination of a phenolic antioxidant and a sulfur based antioxidant, sufficient thermal stability can be obtained even by a small amount of the antioxidants, which enables to reduce the amount of phenolic antioxidant to be added.
- a combination of a phenolic antioxidant and a sulfur based antioxidant is particularly effective in that thermal stability can be improved without seriously impeding a curing reaction in the case that a sheet is formed by curing after mixing a thermally conductive filler with a monomer component as described above.
- Component (D) Sulfur Based Antioxidant
- sulfur based antioxidant there may be employed a generally used one such as a thioether based antioxidant.
- Useful examples include thiodipropionate and alkylthiopropionate.
- the concrete examples include di-lauryl thiodipropionate, di-stearyl thiodipropionate, di-myristyl thiodipropionate, di-tridecyl thiodipropionate, and pentaerythrityl tetrakis(3-laurylthiopropionate).
- One or mixtures of these sulfur based antioxidants may be used.
- the sulfur based antioxidant when it is too small, sometimes sufficiently-improved thermal stability cannot be exhibited. Therefore, the sulfur based antioxidant is generally contained by 0.05 part by weight or more per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer. On the other hand, when an amount of the sulfur based antioxidant is too large, an odor is sometimes emitted. Therefore, the sulfur based antioxidant is generally contained by 3 parts by weight per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- a phosphorous based antioxidant may further be used together with the above antioxidants so as to further improve stability of the thermally conductive sheet against heat or light.
- Useful examples of the phosphorous based antioxidant include tris(2,4-di-tert-butylphenyl)phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4′-biphenylene diphosphonite.
- additives may be added to the materials for the thermally conductive sheet of the present embodiments as long as the characteristics of the thermally conductive sheet are not spoiled.
- the additive include: tackifiers, plasticizers, flame retardants, flame retarding auxiliaries, precipitation inhibitors, thickeners, thixotropic agents such as ultra-fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and metal deactivators.
- tackifiers plasticizers
- flame retardants flame retarding auxiliaries
- precipitation inhibitors such as ultra-fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and metal deactivators.
- thixotropic agents such as ultra-fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and metal deactivators.
- one or mixtures of these additives may be used.
- thermally conductive sheet of the present embodiment may be manufactured according to a method described in conventionally-known documents such as JP-A-11-292998, JP-A-10-316953, and JP-A-10-330575.
- a thermally conductive sheet can be obtained by adding, as necessary, a polymerization initiator to a thermally conductive composition containing (A′) a monomer component, (B) a thermally conductive filler, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant; deaerating and mixing them with a planetary mixer, or the like, to obtain a mixture, forming the mixture in the shape of a sheet, and curing the formed body in the shape of a sheet by polymerization and, as necessary, crosslinking.
- This method enables to fill a thermally conductive filler at high ratio, for example 55% by volume with respect to 100% by volume of the thermally conductive composition. Therefore, this method is particularly suitable for manufacturing a thermally conductive sheet containing a large amount of thermally conductive filler.
- Polymerization can be performed in various manners, for example, thermal polymerization, ultraviolet polymerization, electron beam polymerization, gamma-ray polymerization, and ion-beam polymerization.
- thermal polymerization ultraviolet polymerization
- electron beam polymerization electron beam polymerization
- gamma-ray polymerization gamma-ray polymerization
- ion-beam polymerization a suitable amount of thermal polymerization initiator may be contained in the thermally conductive composition, and the formed body in the shape of a sheet is heated at about 50 to 200° C.
- a suitable amount of photopolymerization initiator may be contained in the thermally conductive composition, and the formed body in the shape of a sheet is irradiated with ultraviolet radiation.
- thermal polymerization is preferably employed in place of ultraviolet polymerization.
- inert gas atmosphere such as nitrogen gas atmosphere
- no polymerization initiator is required generally.
- thermal polymerization initiator examples include organic peroxides such as diacyl peroxides, peroxy ketals, ketone peroxides, hydro peroxides, dialkyl peroxides, peroxy esters, and peroxydicarbonates. More specific examples of the organic peroxides include: lauroyl peroxide, benzoyl peroxide, cyclohexanone peroxide, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane, and tert-butyl hydro peroxide. Incidentally, a combination of persulfate and bisulfite can also be used.
- photopolymerization initiators include: benzoin ethers such as benzoin ethyl ether and benzoin isopropyl ether; anisoin ethyl ether, anisoin isopropyl ether, Michler's ketone (4,4′-tetramethyldiaminobenzophenone); and substituted acetophenones such as 2,2-dimethoxy-2-phenylacetophenone (for example, commercial name: KB-1 produced by Sartomer Co., Inc. and commercial name: IRGACURE 651 produced by Ciba Specialty Chemicals K.K.), 2,2-diethoxyacetophenone.
- benzoin ethers such as benzoin ethyl ether and benzoin isopropyl ether
- anisoin ethyl ether anisoin isopropyl ether
- Michler's ketone (4,4′-tetramethyldiaminobenzophenone)
- thermo polymerization initiators and photo polymerization initiators may be used in any combination. No limitation is given to the content of the polymerization initiator. However, the content is generally 0.1 to 2.0 parts by weight with respect to 100 parts by weight of the (A′) monomer component.
- the (A′) monomer may be prepolymerized before mixing with a thermally conductive filler to increase viscosity. Prepolymerization is generally performed until the viscosity becomes about 5 to 10000 mPa ⁇ s. Prepolymerization can be performed in various manners, for example, thermal polymerization, ultraviolet polymerization, electron beam polymerization, gamma-ray polymerization, and ion-beam polymerization. When prepolymerization is performed by heat or ultraviolet radiation, a polymerization initiator such as thermal polymerization initiators and photopolymerization initiators may be added to the monomer component.
- a polymerization initiator such as thermal polymerization initiators and photopolymerization initiators may be added to the monomer component.
- a thermally conductive sheet as described above is disposed between a heat sink, a heat radiator, or the like, and electronic parts, particularly, semiconductor electronic parts such as a power transistor, a graphic integrated circuit (IC), a chip set, a memory set, and central processing unit (CPU), and used to suitably transmit heat between them.
- the thickness of a thermally conductive sheet is not particularly limited. However, the thickness may be 0.1 mm or more from the viewpoint of practical manufacturability and handleability.
- each of the binder components shown in Table 1 was put in a planetary mixer altogether and kneaded for 30 minutes under reduced pressure (50 mmHg) to obtain each thermally conductive composition.
- the content of a thermally conductive filler in each thermally conductive composition is shown in Table 2.
- Each of the thermally conductive compositions was held by two poly(ethylene terephthalate) (PET) liners treated with a silicone mold lubricant, and the composition was subjected to calendering to give a sheet having a thickness of 1 mm (excluding the thickness of the PET liners) after the sheet is cured.
- the obtained formed sheet was heated at 140° C. for 15 minutes in an oven to obtain a thermally conductive sheet having a thickness of 1 mm.
- thermally conductive sheet having a thickness of 1 mm was obtained in the same manner as in Example 1 except that the binder components and contents shown in the Tables 3 and 4 were employed.
- the content of a thermally conductive filler in each thermally conductive composition is shown in Tables 5 and 6.
- Example 4 two kinds of (meth)acrylate having different carbon numbers were used.
- Example 5 acrylic acid, which is a polar monomer, was used.
- a composition containing the components of Comparative Example 8 at the ratio has very high viscosity, coating the composition to the PET liner was difficult, and a sheet could not be formed.
- thermal conductivity was measured by the following method.
- a rate of change in hardness ⁇ H(%) for each of the thermally conductive sheets manufactured in Examples 1 to 6 and Comparative Examples 1 to 7 was obtained in the same manner as described above except that the sample was kept in an oven at 180° C. for 12 hours. Incidentally, the sample obtained in Comparative Example 8 could not form into a sheet, and therefore, could not be evaluated.
- a piece having dimensions of 0.01 m ⁇ 0.01 m (area of 1.0 ⁇ 10 ⁇ 4 m 2 , thickness of L(m)) was cut out from each of the thermally conductive sheets.
- the piece was held by a heating plate and a cooling plate, and an electric power of 4.8 W was applied under a constant load of 7.6 ⁇ 10 4 N/m 2 for 5 minutes.
- a difference in temperature between the heating plate and the cooling plate was measured, and the thermal resistance R L was obtained by the following formula.
- “measured area” in the following formula is the area of the above piece.
- R L (K ⁇ m 2 /W) Temperature difference(K) ⁇ measured area(m 2 )/electric power (W)
- ⁇ (W/m ⁇ K) (2 L(m) ⁇ L(m))/( R 2L (K ⁇ m 2 /W) ⁇ R L (K ⁇ m 2 /W))
- each of the sheets obtained was evaluated for flame retardancy on the basis of the Underwriters Laboratories Inc. Standard No. 94 “Test for Flammability of Plastic Materials (1996)” (hereinbelow referred to as UL94 standard).
- UL94 standard Underwriters Laboratories Inc. Standard No. 94 “Test for Flammability of Plastic Materials (1996)”
- the sheets other than the sheets obtained in Example 6 and Comparative Example 7 showed flame retardancy which cleared V-2 of UL94.
- the sheet obtained in Comparative Example 7 could not clear the standard.
- the sheet obtained Example 6 exhibited an improved effect of thermal stability of the present invention due to the use of a phenolic antioxidant and a sulfur based antioxidant in combination.
- the sheet was not good as the sheets in the other Examples in flame retardancy because of a small amount of aluminum hydroxide.
- a thermally conductive sheet of the present invention has superior thermal stability and can suitably be used as a thermally conductive sheet for electronics.
- a method of production of a thermally conductive sheet of the present invention enables to suitably produce such a thermally conductive sheet.
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Abstract
There is provided a thermally conductive sheet containing: (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant. The thermally conductive sheet is a non-silicone (meth)acrylic polymer type thermally conductive sheet and has both high thermal conductivity and thermal stability.
Description
- The present invention relates to a thermally conductive sheet containing a (meth)acrylic polymer and a thermally conductive filler. More specifically, the present invention relates to a thermally conductive sheet which has high thermal conductivity and superior thermal stability, and a method of production thereof.
- Nowadays, as electronics are miniaturized and highly integrated, heating density around an exothermic body such as a chip becomes higher and higher, and a thermally conductive sheet having higher thermal conductivity is required. At the same time, a thermally conductive sheet containing a non-silicone resin as a binder component is required because it seldom causes a contact fault in electronics.
- As a non-silicone resin sheet or a composition usable in a sheet, there is disclosed, for example, a formed body or a sheet in which a thermally conductive filler is filled in an acrylic resin (see JP-A-2001-310984 and JP-A-2003-238760). There is further disclosed a thermally conductive adhesive containing a (meth)alkyl acrylate monomer and a thermally conductive filler or a thermally conductive adhesive containing a polymerized (meth)alkyl acrylate monomer and a thermally conductive filler (see JP-A-2004-059851 and JP-A-10-316953).
- In polyolefin resins, improvement in thermal stability or light stability has variously been tried, and usage of various kinds of thermal stabilizers in systems where a filler such as talc is filled in polyolefin (see Japanese Patent No. 2615829 and Japanese Patent No. 3133375).
- However, it is difficult for a (meth)acrylic polymer type thermally conductive sheet as disclosed in the references described above to achieve high thermal conductivity and thermal stability. Particularly, there is a problem that, when the amount of the thermally conductive filler is increased in order to obtain high thermal conductivity, thermal stability is lowered, and the sheet cannot keep flexibility in a certain time period. An olefin resin composition as disclosed in Japanese Patent No. 2615829 or Japanese Patent No. 3133375 has low flexibility and a small amount of thermally conductive filler, which is not suitable for a thermally conductive sheet. Therefore, a non-silicone thermally conductive sheet is required which can have both high thermal conductivity and thermal stability.
- The present invention is to address the aforementioned problems and aims to provide a non-silicone (meth)acrylic polymer type thermally conductive sheet having both high thermal conductivity and thermal stability.
- As a result of studies for addressing the above problems by the inventors, it was found out that it is possible to manufacture a (meth)acrylic polymer type thermally conductive sheet containing a thermally conductive filler at high ratio by selecting a thermally conductive filler having a suitable particle size. However, when a thermally conductive filler of a metal oxide or metal hydrate is filled in the sheet at high ratio, thermal stability of the sheet decreases. The decrease in thermal stability seems to be attributed to the fact that metal oxides and metal hydrates show a strong pro-oxidant action because metal oxides and metal hydrates have many hydroxyl groups on the surfaces thereof. In such a system, a synergistic effect in suppressing the thermal oxidation can be obtained by using a combination of a phenolic antioxidant and a sulfur based antioxidant, and an effect in greatly improving the thermal stability is shown. According to the present invention, there is provided the following (meth)acrylic polymer type thermally conductive sheet and method of production thereof.
- A thermally conductive sheet comprising:
- (A) a (meth)acrylic polymer,
- (B) a thermally conductive filler containing aluminum hydroxide,
- (C) a phenolic antioxidant, and
- (D) a sulfur based antioxidant.
- In another aspect, the thermally conductive sheet is formed by curing a thermally conductive composition comprising:
- (A′) a monomer component containing a (meth)acrylic monomer,
- (B) a thermally conductive filler containing aluminum hydroxide,
- (C) a phenolic antioxidant, and
- (D) a sulfur based antioxidant.
- The thermally conductive sheet may contain 0.05 to 2 parts by weight of (C) a phenolic antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- The thermally conductive sheet may contain 0.5 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- The thermally conductive sheet may contain 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive sheet or thermally conductive composition containing (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- The thermally conductive sheet contains at least 55% by volume of (B) thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive sheet or thermally conductive composition containing (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- A method of production of a thermally conductive sheet, comprising a step of curing a thermally conductive composition comprising: (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
- A thermally conductive sheet of the present invention has high thermal conductivity and superior thermal stability since a combination of a phenolic antioxidant and a sulfur based antioxidant is used in a system containing a (meth)acrylic polymer and a thermally conductive filler. In addition, according to a method for producing an acrylic thermally conductive sheet of the present invention, such a thermally conductive sheet can suitably be produced.
- The present invention is hereinbelow described in detail on the basis of embodiments. However, the present invention is by no means limited to these embodiments. Incidentally, in this specification, “(meth)acrylic” means “acrylic or methacrylic,” and “(meth)acrylic monomer” means an acrylic monomer such as acrylic acid or acrylic ester, or a methacrylic monomer such as methacrylic acid or methacrylic ester.
- A thermally conductive sheet contains a (meth)acrylic polymer as component (A), a thermally conductive filler containing aluminum hydroxide as component (B), a phenolic antioxidant as component (C), and a sulfur based antioxidant as component (D). Each of the components is hereinbelow described concretely.
- Component (A): (Meth)Acrylic Polymer
- A (meth)acrylic polymer is a polymer obtained by polymerizing or optionally crosslinking a monomer component (A′) containing a (meth)acrylic monomer. The (meth)acrylic monomer is not particularly limited as long as it is a monomer used to form a general (meth)acrylic polymer. Useful examples are monofunctional (meth)acrylic monomers having alkyl groups of 20 or less carbons as ester groups, including ethyl (meth)acrylate, butyl(meth)acrylate, hexyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, octyl(meth)acrylate, isooctyl(meth)acrylate, decyl(meth)acrylate, and dodecyl (meth)acrylate. Useful examples further include acrylic acid and methacrylic acid. Incidentally, one or mixtures of these monofunctional (meth)acrylic monomers may be used. Further, flexibility of the sheet can be controlled by employing at least two kinds of monofunctional (meth)acrylate having different carbon numbers.
- It is also desirable that the monomer component (A′) contains a polyfunctional (meth)acrylic monomer in addition to the above monofunctional (meth)acrylic monomer. The monomer component (A′) containing a polyfunctional (meth)acrylic monomer can be crosslinked and enhance strength of the sheet. A polyfunctional (meth)acrylic monomer is preferably a compound having two or more functional groups selected from the group consisting of an acryloxy group and a methacryloxy group. Useful examples include: di(meth)acrylates such as 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, 1,4-butanediol dimethacrylate, poly(butanediol) diacrylate, tetraethylene glycol dimethacrylate, 1,3-butylene glycol diacrylate, triethylene glycol diacrylate, triisopropylene glycol diacrylate, polyethylene glycol diacrylate, and bisphenol A dimethacrylate; tri(meth)acrylates such as trimethylol propane triacrylate, trimethylol propane trimethacrylate, pentaerythritol monohydroxy triacrylate, and trimethylol propane triethoxy triacrylate; tetraacrylates such as pentaerythritol tetraacrylate, and di(trimethylol propane) tetraacrylate; and pentaacrylate such as dipentaerythritol (monohydroxy) pentaacrylate. One or mixtures of these polyfunctional (meth)acrylic monomers may be used.
- When the monomer component (A′) contains a polyfunctional (meth)acrylic monomer as described above, there is no limitation with regard to the content. However, when the content is too small, an effect in crosslinking by the polyfunctional (meth)acrylic monomer is sometimes insufficient. When the content is too high, the sheet sometimes has low flexibility. The content is generally 0.01 to 5 parts by weight with respect to 100 parts by weight of monofunctional (meth)acrylic monomer.
- Component (B): Thermally Conductive Filler
- A thermally conductive filler is a component necessary for a thermally conductive sheet to exhibit substantial thermal conductivity. A thermally conductive filler employed contains aluminum hydroxide. A thermally conductive sheet containing a thermally conductive filler containing aluminum hydroxide component can have superior filling ability of the filler and superior flame retardancy. Further, the thermally conductive filler may contain, in addition to aluminum hydroxide, another metal hydrate and/or a metal oxide. The thermally conductive composition generally contains at least 10% by volume of aluminum hydroxide in order to sufficiently exhibit flame retardancy. In addition, the thermally conductive composition generally contains at most 75% by volume of aluminum hydroxide so as not to detract flexibility as a thermally conductive sheet or not to have difficulty in filling the filler.
- Examples of the metal oxide include aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, zirconium oxide, and zinc oxide. Among these, aluminum oxide (alumina) is particularly preferable in that it has high thermal conductivity and it can be easily filled at high ratio. Since a metal hydrate also functions as a flame retardant, it is preferable that a thermally conductive sheet contains metal hydrate other than aluminum hydroxide. Examples of metal hydrate other than aluminum hydroxide include magnesium hydroxide, barium hydroxide, calcium hydroxide, dawsonite, hydrotalcite, zinc borate, calcium aluminate, and zirconium oxide hydrate.
- The thermally conductive sheet may further contain another thermally conductive filler besides the aforementioned thermally conductive filler. Examples of another thermally conductive filler include boron nitride, aluminum nitride, silicon nitride, boron carbide, aluminum carbide, and silicon carbide.
- Generally, these thermally conductive fillers are added to the material in the form of particles. Use of a combination of a group of relatively large particles having the average particle diameter of 5 to 50 μm and a group of relatively small particles having the average particle diameter of below 5 μm can increase the amount of the thermally conductive filler to be added to the material. Further, strength (for example, tensile strength) of the resultant thermally conductive sheet can be enhanced by subjecting a thermally conductive filler to a surface treatment with a silane coupling agent, a titanate coupling agent, fatty acid, or the like. Among these, a titanate coupling agent is particularly preferable from the view point of a production process since a titanate coupling agent has a superior effect in lowering viscosity of a thermally conductive composition containing large amount of filler. Incidentally, though a thermally conductive filler may be subjected to a surface treatment with such a surface-treating agent in advance before the filler is mixed with other components, an effect of a surface treatment can be exhibited even if a surface-treating agent is added to a thermally conductive composition together with a thermally conductive filler and mixed with them, and then cured.
- The thermally conductive sheet has a thermal conductivity of preferably 1 W/m·K or more, and more preferably 3 W/m K or more. Therefore, it is desirable that the content of the thermally conductive filler is high from the viewpoint of enhancing thermal conductivity. The content of the thermally conductive filler in the thermally conductive composition is generally 55% by volume or more with respect to 100% by volume of the thermally conductive composition. On the other hand, when the content of the thermally conductive filler is too high, a sheet obtained is sometimes brittle, or it sometimes makes production of a sheet difficult. Therefore, the content of the thermally conductive filler is generally 85% by volume or less with respect to 100% by volume of the thermally conductive composition. In the case that the content of the thermally conductive filler is very high, an effect of a combination of a phenolic antioxidant and a sulfur based antioxidant is shown more clearly. Therefore, a present invention is particularly effective in the case that the content of the thermally conductive filler is very high, particularly 55% by volume or more with respect to 100% by volume of the thermally conductive composition. The total content of metal hydrate including aluminum hydroxide in the thermally conductive composition is generally 10% by volume or more from the viewpoint of flame retardancy.
- Component (C): Phenolic Antioxidant
- As a phenolic antioxidant, there may be employed a generally used one such as monophenolic, bisphenolic, or polyphenolic antioxidant. Examples of a phenolic antioxidant include a monophenolic antioxidant such as 2,6-di-tert-butyl-p-cresol, tert-butyl hydroxyanisole, 2,6-di-tert-butyl-4-ethylphenol, and stearyl-β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; a bisphenolic antioxidant such as 2,2′-methylene-bis(4-methyl-6-tert-butylphenol), 2,2′-methylene-bis(4-ethyl-6-tert-butylphenol), 4,4′-thiobis(3-methyl-6-tert-butylphenol), 4,4′-butylidene-bis(3-methyl-6-tert-butylphenol), and triethyleneglycol-bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate]; and a polyphenolic antioxidant such as 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanurate, and tetrakis[methylene-3-(3′,5′-di-tert-butyl-4′-hydroxyphenyl)propionate]methane. One or mixtures of these phenolic antioxidants may be used.
- Though there is no particular limitation with regard to an amount of the phenolic antioxidant, when it is too small, sometimes sufficiently-improved thermal stability cannot be exhibited. Therefore, the phenolic antioxidant is generally contained by 0.05 part by weight or more per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer. On the other hand, when an amount of the phenolic antioxidant is too large, bleeding is sometimes caused. Further, in the case that a sheet is formed by mixing a thermally conductive filter with a monomer component, and then curing the mixture, the curing speed is sometimes lowered. Therefore, the phenolic antioxidant is generally contained by 2 parts by weight per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer. Incidentally, in the present invention, due to a synergistic effect by using a combination of a phenolic antioxidant and a sulfur based antioxidant, sufficient thermal stability can be obtained even by a small amount of the antioxidants, which enables to reduce the amount of phenolic antioxidant to be added. Therefore, a combination of a phenolic antioxidant and a sulfur based antioxidant is particularly effective in that thermal stability can be improved without seriously impeding a curing reaction in the case that a sheet is formed by curing after mixing a thermally conductive filler with a monomer component as described above.
- Component (D) Sulfur Based Antioxidant
- As a sulfur based antioxidant, there may be employed a generally used one such as a thioether based antioxidant. Useful examples include thiodipropionate and alkylthiopropionate. The concrete examples include di-lauryl thiodipropionate, di-stearyl thiodipropionate, di-myristyl thiodipropionate, di-tridecyl thiodipropionate, and pentaerythrityl tetrakis(3-laurylthiopropionate). One or mixtures of these sulfur based antioxidants may be used.
- Though there is no particular limitation with regard to an amount of the sulfur based antioxidant, when it is too small, sometimes sufficiently-improved thermal stability cannot be exhibited. Therefore, the sulfur based antioxidant is generally contained by 0.05 part by weight or more per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer. On the other hand, when an amount of the sulfur based antioxidant is too large, an odor is sometimes emitted. Therefore, the sulfur based antioxidant is generally contained by 3 parts by weight per 100 parts by weight of (A) a (meth)acrylic polymer or (A′) a monomer component containing a (meth)acrylic monomer.
- A phosphorous based antioxidant may further be used together with the above antioxidants so as to further improve stability of the thermally conductive sheet against heat or light. Useful examples of the phosphorous based antioxidant include tris(2,4-di-tert-butylphenyl)phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4′-biphenylene diphosphonite.
- Other Additives
- Various kinds of additives may be added to the materials for the thermally conductive sheet of the present embodiments as long as the characteristics of the thermally conductive sheet are not spoiled. Examples of the additive include: tackifiers, plasticizers, flame retardants, flame retarding auxiliaries, precipitation inhibitors, thickeners, thixotropic agents such as ultra-fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and metal deactivators. Incidentally, one or mixtures of these additives may be used.
- Next, description is given with regard to a method for manufacturing a thermally conductive sheet of the present invention. A thermally conductive sheet of the present embodiment may be manufactured according to a method described in conventionally-known documents such as JP-A-11-292998, JP-A-10-316953, and JP-A-10-330575.
- A thermally conductive sheet can be obtained by adding, as necessary, a polymerization initiator to a thermally conductive composition containing (A′) a monomer component, (B) a thermally conductive filler, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant; deaerating and mixing them with a planetary mixer, or the like, to obtain a mixture, forming the mixture in the shape of a sheet, and curing the formed body in the shape of a sheet by polymerization and, as necessary, crosslinking. This method enables to fill a thermally conductive filler at high ratio, for example 55% by volume with respect to 100% by volume of the thermally conductive composition. Therefore, this method is particularly suitable for manufacturing a thermally conductive sheet containing a large amount of thermally conductive filler.
- Polymerization can be performed in various manners, for example, thermal polymerization, ultraviolet polymerization, electron beam polymerization, gamma-ray polymerization, and ion-beam polymerization. When the thermally conductive composition is thermally polymerized, a suitable amount of thermal polymerization initiator may be contained in the thermally conductive composition, and the formed body in the shape of a sheet is heated at about 50 to 200° C. When the thermally conductive composition is subjected to ultraviolet polymerization, a suitable amount of photopolymerization initiator may be contained in the thermally conductive composition, and the formed body in the shape of a sheet is irradiated with ultraviolet radiation. However, when a large amount of thermally conductive filler is used, transmission of ultraviolet radiation is sometimes limited. In such a case, thermal polymerization is preferably employed in place of ultraviolet polymerization. Incidentally, it is preferred to conduct polymerization under an inert gas atmosphere such as nitrogen gas atmosphere to suppress inhibition of polymerization by oxygen. In addition, when polymerization is conducted by the use of particle beam like electron beam polymerization, no polymerization initiator is required generally.
- Examples of the thermal polymerization initiator include organic peroxides such as diacyl peroxides, peroxy ketals, ketone peroxides, hydro peroxides, dialkyl peroxides, peroxy esters, and peroxydicarbonates. More specific examples of the organic peroxides include: lauroyl peroxide, benzoyl peroxide, cyclohexanone peroxide, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane, and tert-butyl hydro peroxide. Incidentally, a combination of persulfate and bisulfite can also be used.
- Examples of photopolymerization initiators include: benzoin ethers such as benzoin ethyl ether and benzoin isopropyl ether; anisoin ethyl ether, anisoin isopropyl ether, Michler's ketone (4,4′-tetramethyldiaminobenzophenone); and substituted acetophenones such as 2,2-dimethoxy-2-phenylacetophenone (for example, commercial name: KB-1 produced by Sartomer Co., Inc. and commercial name: IRGACURE 651 produced by Ciba Specialty Chemicals K.K.), 2,2-diethoxyacetophenone. Other examples include: substituted α-ketols such as 2-methyl-2-hydroxypropiophenone, aromatic sulphonylchlorides such as 2-naphthalenesulphonylchloride, and photoactive oxime compounds such as 1-phenone-1,1-propanedion-2-(o-ethoxycarbonyl)oxime. In addition, the above thermal polymerization initiators and photo polymerization initiators may be used in any combination. No limitation is given to the content of the polymerization initiator. However, the content is generally 0.1 to 2.0 parts by weight with respect to 100 parts by weight of the (A′) monomer component.
- The (A′) monomer may be prepolymerized before mixing with a thermally conductive filler to increase viscosity. Prepolymerization is generally performed until the viscosity becomes about 5 to 10000 mPa·s. Prepolymerization can be performed in various manners, for example, thermal polymerization, ultraviolet polymerization, electron beam polymerization, gamma-ray polymerization, and ion-beam polymerization. When prepolymerization is performed by heat or ultraviolet radiation, a polymerization initiator such as thermal polymerization initiators and photopolymerization initiators may be added to the monomer component.
- A thermally conductive sheet as described above is disposed between a heat sink, a heat radiator, or the like, and electronic parts, particularly, semiconductor electronic parts such as a power transistor, a graphic integrated circuit (IC), a chip set, a memory set, and central processing unit (CPU), and used to suitably transmit heat between them. The thickness of a thermally conductive sheet is not particularly limited. However, the thickness may be 0.1 mm or more from the viewpoint of practical manufacturability and handleability.
- The present invention is hereinbelow described specifically on the basis of Examples. However, the present invention is by no means limited to the Examples.
- Each of the binder components shown in Table 1 was put in a planetary mixer altogether and kneaded for 30 minutes under reduced pressure (50 mmHg) to obtain each thermally conductive composition. The content of a thermally conductive filler in each thermally conductive composition is shown in Table 2. Each of the thermally conductive compositions was held by two poly(ethylene terephthalate) (PET) liners treated with a silicone mold lubricant, and the composition was subjected to calendering to give a sheet having a thickness of 1 mm (excluding the thickness of the PET liners) after the sheet is cured. The obtained formed sheet was heated at 140° C. for 15 minutes in an oven to obtain a thermally conductive sheet having a thickness of 1 mm.
TABLE 1 Binder component Content (parts by weight) Comparative Comparative Comparative Composition Example 1 Example 1 Example 2 Example 3 2-ethylhexyl acrylate 100 100 100 100 1,6-hexanedioldiacrylate (crosslinking agent) 0.3 0.3 0.3 0.25 tetraethyleneglycol-di-2-ethylhexanoate (plasticizer) 40 40 40 25 IRGANOX1076*1 (phenolic antioxidant) 0.5 0.9 — 0.3 A0-412S*2 (sulfur based antioxidant) 0.5 — 0.9 — PERHEXA TMH*3 (thermal polymerization initiator) 0.7 0.7 0.7 0.7 TITACOAT S-151*4 (titanate-based coupling agent) 5 5 5 2
*1Commercial name (produced by Ciba Specialty Chemicals K.K.)
*2Commercial name (produced by Asahi Denka Co., Ltd.)
*3Commercial name (produced by NOF Corp.)
*4Commercial name (produced by Nippon Soda Co., Ltd.)
-
TABLE 2 Content of thermally conductive filler in sheet (% by volume) Content (% by volume) Comparative Comparative Comparative Kind of thermally conductive filler Example 1 Example 1 Example 2 Example 3 Aluminum hydroxide*5 (metal hydrate) 23.0 23.0 23.0 56.8 Alumina*6 (metal oxide) 47.0 47.0 47.0 — Total thermally conductive filler 70.0 70.0 70.0 56.8
*5Commercial name H34 (produced by Showa Denko K.K.)
*6Commercial name DAM45 (produced by Denki Kagaku Kogyo Kabushiki Kaisha)
- Each thermally conductive sheet having a thickness of 1 mm was obtained in the same manner as in Example 1 except that the binder components and contents shown in the Tables 3 and 4 were employed. The content of a thermally conductive filler in each thermally conductive composition is shown in Tables 5 and 6. In Example 4, two kinds of (meth)acrylate having different carbon numbers were used. In Example 5, acrylic acid, which is a polar monomer, was used. Incidentally, since a composition containing the components of Comparative Example 8 at the ratio has very high viscosity, coating the composition to the PET liner was difficult, and a sheet could not be formed.
TABLE 3 Binder component Content (parts by weight) Comparative Comparative Comparative Composition Example 2 Example 3 Example 4 Example 5 Example 6 2-ethylhexyl acrylate 100 100 100 100 100 1,6-hexanedioldiacrylate (crosslinking agent) 0.3 0.25 0.3 0.3 0.3 tetraethyleneglycol-di-2-ethylhexanoate (plasticizer) 40 25 40 40 40 IRGANOX1076 (phenolic antioxidant) 0.5 0.3 0.3 5.0 — A0-23*7 (sulfur based antioxidant) 0.5 — — — — A0-412S (sulfur based antioxidant) — 0.6 — — — LA-62*8 (hindered amine based antioxidant) — — 0.6 — 1.0 PERHEXA TMH (thermal polymerization initiator) 0.7 0.7 0.7 0.7 0.7 TITACOAT S-151 (titanate-based coupling agent) 5 2 5 5 5
*7,*8Commercial name (produced by Asahi Denka Co., Ltd.)
-
TABLE 4 Binder component Content (parts by weight) Comparative Comparative Composition Example 4 Example 5 Example 6 Example 7 Example 8 2-ethylhexyl acrylate 70 99.5 100 100 100 n-butyl acrylate 30 — — — — acrylic acid — 0.5 — — — 1,6-hexanedioldiacrylate (crosslinking agent) 0.035 0.1 0.4 0.4 0.3 tetraethyleneglycol-di-2-ethylhexanoate (plasticizer) 60 25 30 20 20 IRGANOX1076 (phenolic antioxidant) — — 0.5 0.3 0.3 IRGANOX1010*9 (phenolic antioxidant) 0.4 0.4 — — — A0-23 (sulfur based antioxidant) — 0.4 — — 0.6 A0-412S (sulfur based antioxidant) 0.8 — 1 — — PERHEXA TMH (thermal polymerization initiator) 0.7 0.7 0.7 0.7 0.7 TITACOAT S-151 (titanate-based coupling agent) 4 2 4 2 4
*9Commercial name (produced by Ciba Specialty Chemicals K.K.)
-
TABLE 5 Content of thermally conductive filler in sheet (% by volume) Content (% by volume) Comparative Comparative Comparative Kind of thermally conductive filler Example 2 Example 3 Example 4 Example 5 Example 6 Aluminum hydroxide (metal hydrate) 23.0 56.8 23.0 23.0 23.0 Alumina (metal oxide) 47.0 — 47.0 47.0 47.0 Total thermally conductive filler 70.0 56.8 70.0 70.0 70.0 -
TABLE 6 Content of thermally conductive filler in sheet (% by volume) Content (% by volume) Comparative Comparative Kind of thermally conductive filler Example 4 Example 5 Example 6 Example 7 Example 8* Aluminum hydroxide*5 (metal hydrate) 50.4 56.8 5.8 — — Magnesium hydroxide*10 (metal hydrate) — — — — 57.7 Alumina*6 (metal oxide) 17.7 — 52.7 — — Silicon Carbide*11 — — — 60.4 — Total thermally conductive filler 68.1 56.8 58.5 60.4 57.7
*Comparative Example 8 is for reference since a sheet could not formed.
*10Commercial name KISUMA 5J (produced by Kyowa Chemical Industry Co., Ltd.)
*11Commercial name CP240 (produced by Nanko Abrasives Industry Co., Ltd.)
- Each of the thermally conductive sheets obtained was measured for a change in hardness with the passage of time by the following method, which was employed as an index of thermal stability. In addition, thermal conductivity was measured by the following method.
- Change in Hardness
- A sample for measurement was obtained by piling up 10 thermally conductive sheets obtained in each of Example 1 and Comparative Examples 1 to 3 (with the compositions shown in Tables 1 and 2). The sample was measured for initial hardness under a load of 1 kg by an Asker C hardness meter. Then, the sample was kept in an oven at 110° C. for 4 weeks. Then, the sample was cooled down to 25° C. for measuring of hardness. A rate of change in hardness ΔH(%) was obtained from the initial hardness and the hardness after 4 weeks obtained above. Here, it is shown that a sample having smaller ΔH keeps flexibility more and superior thermal stability.
ΔH(%)={[(hardness after 4 weeks)−(initial hardness)/initial hardness}×100 - A rate of change in hardness ΔH(%) for each of the thermally conductive sheets manufactured in Examples 1 to 6 and Comparative Examples 1 to 7 was obtained in the same manner as described above except that the sample was kept in an oven at 180° C. for 12 hours. Incidentally, the sample obtained in Comparative Example 8 could not form into a sheet, and therefore, could not be evaluated.
- Thermal Conductivity
- A piece having dimensions of 0.01 m×0.01 m (area of 1.0×10−4 m2, thickness of L(m)) was cut out from each of the thermally conductive sheets. The piece was held by a heating plate and a cooling plate, and an electric power of 4.8 W was applied under a constant load of 7.6×104N/m2 for 5 minutes. At that time, a difference in temperature between the heating plate and the cooling plate was measured, and the thermal resistance RL was obtained by the following formula. Incidentally, “measured area” in the following formula is the area of the above piece.
R L(K·m2/W)=Temperature difference(K)×measured area(m2)/electric power (W) - Further, a sample was formed by joining two pieces (thickness of 2 L) and measured for the thermal resistance R2L (K·m2/W) in the same manner as described above. The thermal conductivity λ (W/m·K) was obtained by the following formula using RL and R2L.
λ(W/m·K)=(2 L(m)−L(m))/(R 2L(K·m2/W)−R L(K·m2/W)) - Results of the evaluations are shown in Tables 7 and 8. As shown in Table 7, the sheet of Example 1, which employed a combination of a phenolic antioxidant and a sulfur based antioxidant, exhibited good thermal stability in spite of a high content of thermally conductive filler. In addition, the sheet exhibited very high thermal conductivity since the sheet has a high content of thermally conductive filler. Each of the sheets of Comparative Examples 1 and 2, which employed either a phenolic antioxidant or a sulfur based antioxidant alone, exhibited low thermal stability. In addition, the sheet in Comparative Example 3, which has a relatively small content of a thermally conductive filler, exhibited low thermal stability under the temperature conditions shown in Table 8 though it exhibited good thermal stability under the temperature conditions shown in Table 7.
- As shown in Table 8, the sheets in Examples 1 to 6, which employed a combination of a phenolic antioxidant and a sulfur based antioxidant, exhibited good thermal stability even under higher-temperature conditions. The sheet, which employed a phenolic antioxidant alone, did not exhibit good thermal stability even when the amount of the antioxidant was increased (see Comparative Example 5). In addition, in Comparative Example 5, where an increased amount of a phenolic antioxidant was used, a surface of the sheet became sticky due to polymerization inhibition, and an odor of acrylic monomer was remarkable. Such phenomena are not preferable from the viewpoint of workability or influence on environment. Incidentally, though it is not shown in the Tables, when a phenolic antioxidant is used alone, and the content was increased up to 15 parts by weight, the component was not cured, and a sheet could not be obtained.
- In both the case of employing a hindered amine based antioxidant alone and the case of employing a combination of a hindered amine based antioxidant and a phenolic antioxidant, low thermal stability was shown (see Comparative Examples 4 and 6). Incidentally, the sheet in Comparative Example 6, where 1.0 part by weight of a hindered amine based antioxidant was added, had blooming on a surface thereof and showed low handleability.
- Further, each of the sheets obtained was evaluated for flame retardancy on the basis of the Underwriters Laboratories Inc. Standard No. 94 “Test for Flammability of Plastic Materials (1996)” (hereinbelow referred to as UL94 standard). As a result, the sheets other than the sheets obtained in Example 6 and Comparative Example 7 showed flame retardancy which cleared V-2 of UL94. However, the sheet obtained in Comparative Example 7 could not clear the standard. The sheet obtained Example 6 exhibited an improved effect of thermal stability of the present invention due to the use of a phenolic antioxidant and a sulfur based antioxidant in combination. However, the sheet was not good as the sheets in the other Examples in flame retardancy because of a small amount of aluminum hydroxide. Incidentally, a test on the basis of the UL94 standard is often employed for evaluation of flame retardancy. It is usually desirable to have a flame retardancy of V-2 or more.
TABLE 7 Thermal Hardness (ASKER C) conductivity Initial After 4 weeks Δ H (%) (W/m · K) Example 1 45 48 6.7 5.8 Comp. Ex. 1 45 81 80.0 5.8 Comp. Ex. 2 45 79 75.6 5.8 Comp. Ex. 3 37 38 2.7 1.9
Aging test at 110° C. for 4 weeks
-
TABLE 8 Thermal Hardness (ASKER C) conductivity Initial After 12 hours Δ H (%) (W/m · K) Example 1 45 60 33.3 5.8 Example 2 45 52 13.5 5.8 Example 3 37 41 10.8 1.9 Example 4 50 55 10 4.5 Example 5 48 54 12.5 1.9 Example 6 38 45 18.4 2.6 Comp. Ex. 1 45 83 84.4 5.8 Comp. Ex. 2 45 92 104.4 5.8 Comp. Ex. 3 37 75 102.7 1.9 Comp. Ex. 4 45 79 75.6 5.8 Comp. Ex. 5 41 69 68.3 5.8 Comp. Ex. 6 44 72 63.6 5.8 Comp. Ex. 7 46 56 21.7 2.4 Comp. Ex. 8 — — — —
Aging test at 180° C. for 12 hours
- As described above, a thermally conductive sheet of the present invention has superior thermal stability and can suitably be used as a thermally conductive sheet for electronics. In addition, a method of production of a thermally conductive sheet of the present invention enables to suitably produce such a thermally conductive sheet.
Claims (21)
1-7. (canceled)
8. A thermally conductive sheet comprising:
(A) a (meth)acrylic polymer,
(B) a thermally conductive filler containing aluminum hydroxide,
(C) a phenolic antioxidant, and
(D) a sulfur based antioxidant.
9. A thermally conductive sheet according to claim 8 , wherein the thermally conductive sheet contains 0.05 to 2 parts by weight of (C) a phenolic antioxidant with respect to 1100 parts by weight of (A) a (meth)acrylic polymer.
10. A thermally conductive sheet according to claim 9 , wherein the thermally conductive sheet contains 0.05 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer.
11. thermally conductive sheet according to claim 10 , wherein the thermally conductive sheet contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
12. A thermally conductive sheet according to claim 11 wherein the thermally conductive sheet contains at least 55% by volume of (B) a thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
13. A thermally conductive sheet according to claim 9 , wherein the thermally conductive sheet contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
14. A thermally conductive sheet according to claim 13 , wherein the thermally conductive sheet contains at least 55% by volume of (B) a thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
15. A thermally conductive sheet according to claim 8 , wherein the thermally conductive sheet contains 0.05 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 100 parts by weight of (A) a (meth)acrylic polymer.
16. A thermally conductive sheet according to claim 8 , wherein the thermally conductive sheet contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
17. A thermally conductive sheet according to claim 8 , wherein the thermally conductive sheet contains at least 55% by volume of (B) a thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive sheet containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
18. A thermally conductive sheet according to claim 8 , wherein the thermally conductive sheet is formed by curing a thermally conductive composition comprising:
(A′) a monomer component containing a (meth)acrylic monomer,
(B) a thermally conductive filler containing aluminum hydroxide,
(C) a phenolic antioxidant, and
(D) a sulfur based antioxidant.
19. A thermally conductive sheet according to claim 18 wherein the thermally conductive composition contains 0.05 to 2 parts by weight of (C) a phenolic antioxidant with respect to 100 parts by weight of (A′) a monomer component containing a (meth)acrylic monomer.
20. A thermally conductive sheet according to claim 19 , wherein the thermally conductive composition contains 0.05 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 11000 parts by weight of (A′) a monomer component containing a (meth)acrylic monomer.
21. A thermally conductive sheet according to claim 20 , wherein the thermally conductive composition contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive composition containing (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
22. A thermally conductive sheet according to claim 21 , wherein the thermally conductive composition contains at least 55% by volume of (B) a thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive composition containing (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
23. A thermally conductive sheet according to claim 19 , wherein the thermally conductive composition contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive composition containing (A) a (meth)acrylic polymer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
24. A thermally conductive sheet according to claim 18 , wherein the thermally conductive composition contains 0.05 to 3 parts by weight of (D) a sulfur based antioxidant with respect to 100 parts by weight of (A′) a monomer component containing a (meth)acrylic monomer.
25. A thermally conductive sheet according to claim 18 wherein the thermally conductive composition contains 10 to 75% by volume of aluminum hydroxide with respect to 100% by volume of thermally conductive composition containing (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
26. A thermally conductive sheet according to claim 18 , wherein the thermally conductive composition contains at least 55% by volume of (B) a thermally conductive filler containing aluminum hydroxide with respect to 100% by volume of thermally conductive composition containing (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
27. A method of production of a thermally conductive sheet, comprising a step of curing a thermally conductive composition comprising: (A′) a monomer component containing a (meth)acrylic monomer, (B) a thermally conductive filler containing aluminum hydroxide, (C) a phenolic antioxidant, and (D) a sulfur based antioxidant.
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JP4588285B2 (en) | 2002-01-25 | 2010-11-24 | 信越化学工業株式会社 | Thermally conductive silicone rubber composition |
JP2003238760A (en) | 2002-02-19 | 2003-08-27 | C I Kasei Co Ltd | Nonhalogen, flame retardant and heat radiation sheet |
JP2004002527A (en) * | 2002-05-31 | 2004-01-08 | Dainippon Ink & Chem Inc | Flame-retardant heat-conductive electrical insulating adhesive material |
JP2004010859A (en) | 2002-06-11 | 2004-01-15 | Dainippon Ink & Chem Inc | Composition for heat conductive electric insulating pressure-sensitive adhesive and pressure-sensitive adhesive sheet using the same |
JP4385573B2 (en) | 2002-07-31 | 2009-12-16 | Dic株式会社 | Composition for heat-conducting electrical insulation pressure-sensitive adhesive and pressure-sensitive adhesive sheet using the same |
-
2004
- 2004-12-03 JP JP2004351422A patent/JP4869584B2/en not_active Expired - Fee Related
-
2005
- 2005-10-28 EP EP05824536A patent/EP1833903B1/en not_active Not-in-force
- 2005-10-28 US US11/720,121 patent/US20080081859A1/en not_active Abandoned
- 2005-10-28 AT AT05824536T patent/ATE525430T1/en not_active IP Right Cessation
- 2005-10-28 WO PCT/US2005/039098 patent/WO2006062614A1/en active Application Filing
-
2009
- 2009-09-29 US US12/569,562 patent/US7956116B2/en not_active Expired - Fee Related
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US5907129A (en) * | 1993-11-19 | 1999-05-25 | Idemitsu Kosan Co., Ltd. | Syndiotactic styrenic resin composition |
US5852135A (en) * | 1995-04-19 | 1998-12-22 | Polyplastics Co., Ltd. | Thermoplastic resin compositions and a method of producing the same |
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Cited By (8)
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CN103328611A (en) * | 2010-12-10 | 2013-09-25 | 株式会社亚都玛科技 | Flame retarder and method for producing same, and flame-retardant resin composition and method for producing same |
CN105209499A (en) * | 2013-05-22 | 2015-12-30 | 迪睿合株式会社 | Photocurable acrylic thermo-conducting composition, acrylic thermoconductive sheet, and method for manufacturing same |
US9416254B2 (en) | 2013-05-22 | 2016-08-16 | Dexerials Corporation | Photocurable acrylic-based thermal conductive composition, acrylic-based thermal conductive sheet, and method of producing the same |
US10118367B2 (en) * | 2016-04-06 | 2018-11-06 | Kitagawa Industries Co., Ltd. | Thermal conducting sheet and method for producing same |
CN112839971A (en) * | 2019-07-10 | 2021-05-25 | 株式会社Lg化学 | Composition and heat sink made therefrom |
US20210340342A1 (en) * | 2019-07-10 | 2021-11-04 | Lg Chem, Ltd. | Composition and Heat Radiation Sheet Manufactured Therefrom |
EP3862369A4 (en) * | 2019-07-10 | 2021-11-24 | LG Chem, Ltd. | COMPOSITION AND HEAT DUCTION PLATE MADE FROM IT |
US12012490B2 (en) * | 2019-07-10 | 2024-06-18 | Lg Chem, Ltd. | Composition and heat radiation sheet manufactured therefrom |
Also Published As
Publication number | Publication date |
---|---|
EP1833903B1 (en) | 2011-09-21 |
US20100020496A1 (en) | 2010-01-28 |
ATE525430T1 (en) | 2011-10-15 |
WO2006062614A1 (en) | 2006-06-15 |
EP1833903A1 (en) | 2007-09-19 |
US7956116B2 (en) | 2011-06-07 |
JP2006160830A (en) | 2006-06-22 |
JP4869584B2 (en) | 2012-02-08 |
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