US20080003927A1 - Sheet for mounting polishing workpiece and method for making the same - Google Patents
Sheet for mounting polishing workpiece and method for making the same Download PDFInfo
- Publication number
- US20080003927A1 US20080003927A1 US11/797,714 US79771407A US2008003927A1 US 20080003927 A1 US20080003927 A1 US 20080003927A1 US 79771407 A US79771407 A US 79771407A US 2008003927 A1 US2008003927 A1 US 2008003927A1
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- United States
- Prior art keywords
- sheet
- substrate
- surface layer
- layer
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
Definitions
- the present invention relates to a sheet for mounting a polishing workpiece and the method for making the same, and more particularly, to a sheet for mounting a polishing workpiece and the method for making the same which are used in the chemical mechanical polishing process.
- Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion.
- the polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel.
- a sheet must be used for carrying and mounting the polishing workpiece, and the quality of the sheet directly influences the polishing effect of the polishing workpiece.
- FIG. 1 a schematic view of a polishing device with a conventional sheet disclosed in U.S. Patent No. U.S. Pat. No. 5,781,393 is shown.
- the polishing device 1 comprises a lower base plate 11 , a sheet 12 , a polishing workpiece 13 , an upper base plate 14 , a polishing pad 15 and slurry 16 .
- the sheet 12 is adhered to the lower base plate 11 through an adhesive layer 17 and is used for carrying and mounting the polishing workpiece 13 .
- the polishing pad 15 is mounted on the upper base plate 14 .
- the operation mode of the polishing device 1 is as follows. First, the polishing workpiece 13 is mounted on the sheet 12 , and then both the upper and lower base plates 14 and 11 are rotated and the upper base plate 14 is simultaneously moved downwards, such that the polishing pad 15 contacts the surface of the polishing workpiece 13 .
- a polishing operation for the polishing workpiece 13 may be performed by continuously supplementing the slurry 16 and using the polishing pad 15 .
- the sheet 12 is of a single-layer structure, the material of which is generally PU (polyurethane), a kind of foaming material.
- the sheet 12 is formed by a wet process, and thus a plurality of continuous foaming holes 121 exists in the interior of the sheet 12 .
- the disadvantage of the sheet 12 is that the slurry 16 tends to be inhaled through the foaming holes 121 during the polishing process, which causes changes in the hardness and physical property of the sheet 12 , such that the polishing condition needs to be readjusted. Furthermore, the lifetime of the sheet 12 is reduced.
- the sheet 12 is formed by the wet process which results in an excessively low planarity, and it is very difficult to achieve a generally uniform thickness above 0.5 mm.
- the foaming holes 121 within the sheet 12 cause the phenomenon of air wrapping when the sheet 12 adsorbs the polishing workpiece 13 , thus resulting in a poor adhesion and a possible crack during the polishing process as well as an uneven polished surface after the polishing of the polishing workpiece 13 .
- the objective of the present invention is to provide a sheet for mounting a polishing workpiece.
- the sheet of the present invention comprises a substrate, a surface layer and a slightly rough layer.
- the substrate has a surface.
- the surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface.
- the slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece. Additionally, since no hole structure exists in the interior of both the surface layer and the slightly rough layer, the slurry will not be inhaled during the polishing, thus prolonging the lifetime of the sheet.
- Another objective of the present invention is to provide a method for making the sheet for mounting a polishing workpiece, which comprises the following steps:
- FIG. 1 shows a schematic view of the polishing device with a conventional sheet disclosed in U.S. Patent No. U.S. Pat. No. 5,781,393;
- FIG. 2 shows a local schematic view of the sheet of FIG. 1 ;
- FIG. 3 shows a local schematic view of the sheet for mounting the polishing workpiece according to the present invention.
- FIGS. 4 to 6 show schematic views of each process step of the method for making the sheet for mounting the polishing workpiece according to the present invention.
- the sheet 2 of the present invention is of a three-layered structure, which comprises a substrate 21 , a surface layer 22 and a slightly rough layer 23 .
- the substrate 21 has a first surface 211 and a second surface 212 , wherein the second surface 212 is used for being adhered on the lower base plate (not shown) of a polishing device.
- the material of the substrate 21 is high solid PU, with a plurality of continuous or discontinuous type holes 213 existing in the interior of the substrate 21 , and the thickness of the substrate 21 can be larger than 0.5 mm.
- the material of the substrate 21 may also be acrylic resin or another kind of resin.
- the surface layer 22 is located on the first surface 211 of the substrate 21 , and has a surface 221 .
- the surface layer has no hole structure in the interior thereof.
- the material of the surface layer 22 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin).
- the surface layer 22 has a uniform thickness which is less than that of the substrate 21 .
- the materials of the surface layer 22 and substrate 21 may be the same or different.
- the slightly rough layer 23 is located on the surface 221 of the surface layer 22 , and is used for carrying and mounting a polishing workpiece (not shown). No hole structure exists in the interior of the slightly rough layer 23 , and the material of the slightly rough layer 23 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). The materials of the slightly rough layer 23 and surface layer 22 may be the same or different.
- a vent space 232 is formed between any two protrusions 231 of the slightly rough layer 23 , and when the polishing workpiece contacts the slightly rough layer 23 , the air therebetween may be easily vented out via the vent space 232 , without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet 2 , thereby improving the polishing effect of the polishing workpiece. Additionally, since no hole structure exists in the interior of both the surface layer 22 and the slightly rough layer 23 , the slurry will not be inhaled during the polishing, thus prolonging the lifetime of the sheet 2 .
- the present invention further relates to a method for making the sheet for mounting a polishing workpiece, which comprises the following steps.
- a surface layer 22 is formed on a release paper 30 .
- the surface layer 22 has no hole structure existing in the interior thereof.
- the surface layer 22 has a surface 221 .
- the material of the surface layer 22 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin), and the surface layer 22 has a uniform thickness.
- the surface layer 22 is formed on the release paper 30 in a manner of coating.
- a substrate 21 is formed on the surface layer 22 , the substrate 21 has a first surface 211 and a second surface 212 .
- the material of the substrate 21 is high solid PU, with a plurality of continuous or discontinuous type holes 213 existing in the interior of the substrate 21 , and the thickness of the substrate 21 is larger than 0.5 mm.
- the material of the substrate 21 may also be acrylic resin or another kind of resin.
- the materials of the surface layer 22 and the substrate 21 may be the same or different.
- the substrate 21 is formed on the surface layer 22 in a manner of coating. Therefore, compared with the conventional wet process, the substrate 21 of the invention can remain a uniform thickness when the thickness thereof is larger than 0.5 mm.
- the substrate 21 and surface layer 22 are dried for one day. After that, the release paper 30 is removed.
- a slightly rough layer 23 is printed on the surface 221 of the surface layer 22 to form the sheet 2 (the same as FIG. 3 ).
- the material of the slightly rough layer 23 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin).
- the materials of the slightly rough layer 23 and surface layer 22 may be the same or different.
- the printing step is screen printing.
- a water repellent treatment may also be performed for the slightly rough layer 23 to prolong the lifetime of the sheet 2 .
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
Description
- This is a divisional of application Ser. No. 11/478,601, filed Jul. 3, 2006, which is incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to a sheet for mounting a polishing workpiece and the method for making the same, and more particularly, to a sheet for mounting a polishing workpiece and the method for making the same which are used in the chemical mechanical polishing process.
- 2. Description of the Related Art
- Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. During the polishing, a sheet must be used for carrying and mounting the polishing workpiece, and the quality of the sheet directly influences the polishing effect of the polishing workpiece.
- Referring to
FIG. 1 , a schematic view of a polishing device with a conventional sheet disclosed in U.S. Patent No. U.S. Pat. No. 5,781,393 is shown. Thepolishing device 1 comprises alower base plate 11, asheet 12, apolishing workpiece 13, anupper base plate 14, apolishing pad 15 andslurry 16. Thesheet 12 is adhered to thelower base plate 11 through anadhesive layer 17 and is used for carrying and mounting thepolishing workpiece 13. Thepolishing pad 15 is mounted on theupper base plate 14. - The operation mode of the
polishing device 1 is as follows. First, thepolishing workpiece 13 is mounted on thesheet 12, and then both the upper andlower base plates upper base plate 14 is simultaneously moved downwards, such that thepolishing pad 15 contacts the surface of thepolishing workpiece 13. A polishing operation for thepolishing workpiece 13 may be performed by continuously supplementing theslurry 16 and using thepolishing pad 15. - Referring to
FIG. 2 , a local schematic view of the sheet ofFIG. 1 is shown. Thesheet 12 is of a single-layer structure, the material of which is generally PU (polyurethane), a kind of foaming material. Thesheet 12 is formed by a wet process, and thus a plurality ofcontinuous foaming holes 121 exists in the interior of thesheet 12. The disadvantage of thesheet 12 is that theslurry 16 tends to be inhaled through thefoaming holes 121 during the polishing process, which causes changes in the hardness and physical property of thesheet 12, such that the polishing condition needs to be readjusted. Furthermore, the lifetime of thesheet 12 is reduced. In addition, thesheet 12 is formed by the wet process which results in an excessively low planarity, and it is very difficult to achieve a generally uniform thickness above 0.5 mm. Finally, thefoaming holes 121 within thesheet 12 cause the phenomenon of air wrapping when thesheet 12 adsorbs thepolishing workpiece 13, thus resulting in a poor adhesion and a possible crack during the polishing process as well as an uneven polished surface after the polishing of thepolishing workpiece 13. - Consequently, there is an existing need for a sheet for mounting a polishing workpiece and the method for making the same to solve the above-mentioned problems.
- The objective of the present invention is to provide a sheet for mounting a polishing workpiece. The sheet of the present invention comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece. Additionally, since no hole structure exists in the interior of both the surface layer and the slightly rough layer, the slurry will not be inhaled during the polishing, thus prolonging the lifetime of the sheet.
- Another objective of the present invention is to provide a method for making the sheet for mounting a polishing workpiece, which comprises the following steps:
- (a) forming a surface layer on a release paper, the surface layer having no hole structure in the interior thereof;
- (b) forming a substrate on the surface layer;
- (c) drying the surface layer and the substrate;
- (d) removing the release paper; and
- (e) printing a slightly rough layer on the surface layer, the slightly rough layer having no hole structure in the interior thereof.
-
FIG. 1 shows a schematic view of the polishing device with a conventional sheet disclosed in U.S. Patent No. U.S. Pat. No. 5,781,393; -
FIG. 2 shows a local schematic view of the sheet ofFIG. 1 ; -
FIG. 3 shows a local schematic view of the sheet for mounting the polishing workpiece according to the present invention; and -
FIGS. 4 to 6 show schematic views of each process step of the method for making the sheet for mounting the polishing workpiece according to the present invention. - Referring to
FIG. 3 , a local schematic view of the sheet for mounting the polishing workpiece according to the present invention is shown. Thesheet 2 of the present invention is of a three-layered structure, which comprises asubstrate 21, asurface layer 22 and a slightlyrough layer 23. Thesubstrate 21 has afirst surface 211 and asecond surface 212, wherein thesecond surface 212 is used for being adhered on the lower base plate (not shown) of a polishing device. In this embodiment, the material of thesubstrate 21 is high solid PU, with a plurality of continuous ordiscontinuous type holes 213 existing in the interior of thesubstrate 21, and the thickness of thesubstrate 21 can be larger than 0.5 mm. However, it is to be understood that the material of thesubstrate 21 may also be acrylic resin or another kind of resin. - The
surface layer 22 is located on thefirst surface 211 of thesubstrate 21, and has asurface 221. The surface layer has no hole structure in the interior thereof. The material of thesurface layer 22 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). Thesurface layer 22 has a uniform thickness which is less than that of thesubstrate 21. The materials of thesurface layer 22 andsubstrate 21 may be the same or different. - The slightly
rough layer 23 is located on thesurface 221 of thesurface layer 22, and is used for carrying and mounting a polishing workpiece (not shown). No hole structure exists in the interior of the slightlyrough layer 23, and the material of the slightlyrough layer 23 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). The materials of the slightlyrough layer 23 andsurface layer 22 may be the same or different. Avent space 232 is formed between any twoprotrusions 231 of the slightlyrough layer 23, and when the polishing workpiece contacts the slightlyrough layer 23, the air therebetween may be easily vented out via thevent space 232, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and thesheet 2, thereby improving the polishing effect of the polishing workpiece. Additionally, since no hole structure exists in the interior of both thesurface layer 22 and the slightlyrough layer 23, the slurry will not be inhaled during the polishing, thus prolonging the lifetime of thesheet 2. - The present invention further relates to a method for making the sheet for mounting a polishing workpiece, which comprises the following steps.
- At first, referring to
FIG. 4 , asurface layer 22 is formed on arelease paper 30. Thesurface layer 22 has no hole structure existing in the interior thereof. Thesurface layer 22 has asurface 221. The material of thesurface layer 22 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin), and thesurface layer 22 has a uniform thickness. Preferably, thesurface layer 22 is formed on therelease paper 30 in a manner of coating. - Then, referring to
FIG. 5 , asubstrate 21 is formed on thesurface layer 22, thesubstrate 21 has afirst surface 211 and asecond surface 212. In this embodiment, the material of thesubstrate 21 is high solid PU, with a plurality of continuous or discontinuous type holes 213 existing in the interior of thesubstrate 21, and the thickness of thesubstrate 21 is larger than 0.5 mm. However, it is to be understood that the material of thesubstrate 21 may also be acrylic resin or another kind of resin. The materials of thesurface layer 22 and thesubstrate 21 may be the same or different. Preferably, thesubstrate 21 is formed on thesurface layer 22 in a manner of coating. Therefore, compared with the conventional wet process, thesubstrate 21 of the invention can remain a uniform thickness when the thickness thereof is larger than 0.5 mm. - Then, the
substrate 21 andsurface layer 22 are dried for one day. After that, therelease paper 30 is removed. - At last, referring to
FIG. 6 , after turning thesubstrate 21 and thesurface layer 22 upside-down for 180 degrees, a slightlyrough layer 23 is printed on thesurface 221 of thesurface layer 22 to form the sheet 2 (the same asFIG. 3 ). No hole structure exists in the interior of the slightlyrough layer 23, and the material of the slightlyrough layer 23 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). The materials of the slightlyrough layer 23 andsurface layer 22 may be the same or different. In this embodiment, the printing step is screen printing. - Preferably, a water repellent treatment may also be performed for the slightly
rough layer 23 to prolong the lifetime of thesheet 2. - While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Claims (8)
1. A method for making a sheet for mounting a polishing workpiece, comprising the following steps of:
(a) forming a surface layer on a release paper, the surface layer having no hole structure in the interior thereof;
(b) forming a substrate on the surface layer;
(c) drying the surface layer and the substrate;
(d) removing the release paper; and
(e) printing a slightly rough layer on the surface layer, the slightly rough layer having no hole structure in the interior thereof.
2. The method as claimed in claim 1 , wherein the substrate has a plurality of holes in the interior thereof.
3. The method as claimed in claim 2 , wherein the holes of the substrate are of a continuous type.
4. The method as claimed in claim 2 , wherein the holes of the substrate are of a discontinuous type.
5. The method as claimed in claim 1 , wherein the surface layer is formed on the release paper in a manner of coating in the step (a).
6. The method as claimed in claim 1 , wherein the substrate is formed on the surface layer in a manner of coating in the step (b).
7. The method as claimed in claim 1 , wherein the slightly rough layer is printed on the surface layer in a manner of screen printing in the step (e).
8. The method as claimed in claim 1 , further comprising a step of performing a water repellent treatment for the slightly rough layer.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/797,714 US20080003927A1 (en) | 2006-07-03 | 2007-05-07 | Sheet for mounting polishing workpiece and method for making the same |
US12/482,330 US20090252876A1 (en) | 2007-05-07 | 2009-06-10 | Sheet for mounting polishing workpiece and method for making the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/478,601 US7789738B2 (en) | 2006-07-03 | 2006-07-03 | Sheet for mounting polishing workpiece and method for making the same |
US11/797,714 US20080003927A1 (en) | 2006-07-03 | 2007-05-07 | Sheet for mounting polishing workpiece and method for making the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/478,601 Division US7789738B2 (en) | 2006-07-03 | 2006-07-03 | Sheet for mounting polishing workpiece and method for making the same |
Related Child Applications (1)
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US12/482,330 Continuation-In-Part US20090252876A1 (en) | 2007-05-07 | 2009-06-10 | Sheet for mounting polishing workpiece and method for making the same |
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US20080003927A1 true US20080003927A1 (en) | 2008-01-03 |
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US11/478,601 Expired - Fee Related US7789738B2 (en) | 2006-07-03 | 2006-07-03 | Sheet for mounting polishing workpiece and method for making the same |
US11/797,714 Abandoned US20080003927A1 (en) | 2006-07-03 | 2007-05-07 | Sheet for mounting polishing workpiece and method for making the same |
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US11/478,601 Expired - Fee Related US7789738B2 (en) | 2006-07-03 | 2006-07-03 | Sheet for mounting polishing workpiece and method for making the same |
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Cited By (4)
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---|---|---|---|---|
US20080003932A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
JP2013132745A (en) * | 2011-12-27 | 2013-07-08 | Asahi Glass Co Ltd | Polishing carrier, method for polishing glass substrate for magnetic recording medium, and method for manufacturing glass substrate for magnetic recording medium |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011029331A (en) * | 2009-07-23 | 2011-02-10 | Disco Abrasive Syst Ltd | Method for grinding wafer and protective tape |
Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4017656A (en) * | 1975-09-18 | 1977-04-12 | Pandel-Bradford, Inc. | Imitation leather material and method of preparing such material |
US4132037A (en) * | 1977-02-28 | 1979-01-02 | Siltec Corporation | Apparatus for polishing semiconductor wafers |
US4276341A (en) * | 1979-05-02 | 1981-06-30 | Kabushiki Kaisha Asahi Gomu | Wet suit material and wet suit made thereof |
US4851061A (en) * | 1987-03-16 | 1989-07-25 | Sorkoram Paul O | Method and apparatus for patterned cut of thermoplastics |
US5058413A (en) * | 1989-11-07 | 1991-10-22 | Robert Muddiman | Rupture disc |
US5424813A (en) * | 1994-05-23 | 1995-06-13 | Xerox Corporation | Apparatus and method for improved blotter roller permeability |
US5497699A (en) * | 1994-11-29 | 1996-03-12 | Mather; Clifford L. | Method of silk screen printing on a rough surface such as a football |
US5584146A (en) * | 1995-04-10 | 1996-12-17 | Applied Materials, Inc. | Method of fabricating chemical-mechanical polishing pad providing polishing uniformity |
US5632914A (en) * | 1995-05-24 | 1997-05-27 | Davidson Textron Inc. | Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes |
US5776290A (en) * | 1993-04-15 | 1998-07-07 | Minnesota Mining And Manufacturing Company | Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing |
US5781393A (en) * | 1996-04-16 | 1998-07-14 | Erico International Corporation | Surge arrester |
US5830806A (en) * | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
US5871393A (en) * | 1996-03-25 | 1999-02-16 | Chiyoda Co., Ltd. | Mounting member for polishing |
US5975999A (en) * | 1997-01-06 | 1999-11-02 | 3M Innovative Properties Company | Hand tool having a cushioned laminate attachment surface |
US5989470A (en) * | 1996-09-30 | 1999-11-23 | Micron Technology, Inc. | Method for making polishing pad with elongated microcolumns |
US5993293A (en) * | 1998-06-17 | 1999-11-30 | Speedram Corporation | Method and apparatus for improved semiconductor wafer polishing |
US6074287A (en) * | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
US6089965A (en) * | 1998-07-15 | 2000-07-18 | Nippon Pillar Packing Co., Ltd. | Polishing pad |
US6095900A (en) * | 1998-03-23 | 2000-08-01 | Speedfam-Ipec | Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers |
US6155910A (en) * | 1997-01-03 | 2000-12-05 | 3M Innovative Properties Company | Method and article for the production of optical quality surfaces on glass |
US6217434B1 (en) * | 1997-04-04 | 2001-04-17 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US6238745B1 (en) * | 1998-12-22 | 2001-05-29 | Dow Corning Toray Silicone Co. Ltd. | Water repellent for treating solids |
US6454633B1 (en) * | 1997-04-04 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads of flocked hollow fibers and methods relating thereto |
US20030068967A1 (en) * | 2001-10-09 | 2003-04-10 | Eiji Nakamura | Cleaning sheet |
US6566426B1 (en) * | 2001-11-22 | 2003-05-20 | Nippon Shokubai Co., Ltd. | Aqueous resin composition |
US6575821B2 (en) * | 2000-08-01 | 2003-06-10 | Joest Peter | Abrasive belt for a belt grinding machine |
US6657158B1 (en) * | 2002-06-03 | 2003-12-02 | Visteon Global Technologies, Inc. | Method of processing a laser scored instrument panel with an invisible seam airbag opening |
US6855043B1 (en) * | 1999-07-09 | 2005-02-15 | Applied Materials, Inc. | Carrier head with a modified flexible membrane |
US20060116059A1 (en) * | 2000-06-23 | 2006-06-01 | International Business Machines Corporation | Fiber embedded polishing pad |
US7241408B2 (en) * | 2002-11-19 | 2007-07-10 | I.V. Technologies Co., Ltd. | Method of fabricating polishing pad having detection window thereon |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US7384061B2 (en) * | 2005-07-14 | 2008-06-10 | International Automotive Components Group North America, Inc. | Trim panel and a method of manufacture |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3345206A (en) * | 1963-07-22 | 1967-10-03 | Johnson & Johnson | Adhesive composition containing a carboxyl modified elastomer, adhesive sheet coatedtherewith, and method of making the adhesive sheet |
US3453783A (en) * | 1966-06-30 | 1969-07-08 | Texas Instruments Inc | Apparatus for holding silicon slices |
US3449870A (en) * | 1967-01-24 | 1969-06-17 | Geoscience Instr Corp | Method and apparatus for mounting thin elements |
US3650880A (en) * | 1968-11-20 | 1972-03-21 | Hooker Chemical Corp | Porous polyurethanes and method of manufacture |
US3617702A (en) * | 1969-06-10 | 1971-11-02 | Du Pont | Apparatus and method for perforating sheet material |
US3860399A (en) * | 1972-12-07 | 1975-01-14 | Gen Electric | Liquid blocking technique for working a member to precise optical tolerances |
GB1474505A (en) * | 1974-12-16 | 1977-05-25 | ||
DE2754603A1 (en) | 1977-12-08 | 1979-06-13 | Bayer Ag | PROCESS FOR THE SOLVENT-FREE COATING OF SUBSTRATES |
DE2800748A1 (en) * | 1978-01-09 | 1979-07-12 | Hauni Werke Koerber & Co Kg | METHOD AND DEVICE FOR FORMING A STRAND OF TOBACCO FIBERS OR ANOTHER SMOKEABLE MATERIAL |
US4328410A (en) * | 1978-08-24 | 1982-05-04 | Slivinsky Sandra H | Laser skiving system |
US4239567A (en) * | 1978-10-16 | 1980-12-16 | Western Electric Company, Inc. | Removably holding planar articles for polishing operations |
US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
US4850093A (en) * | 1987-02-09 | 1989-07-25 | Grumman Aerospace Corporation | Method of making an acoustic attenuating liner |
JPH01199479A (en) | 1988-02-04 | 1989-08-10 | Furukawa Electric Co Ltd:The | Manufacture of light emitting element |
US5109638A (en) * | 1989-03-13 | 1992-05-05 | Microsurface Finishing Products, Inc. | Abrasive sheet material with non-slip backing |
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
FR2679526A1 (en) | 1991-07-25 | 1993-01-29 | Cebal | Tube made of plastic material with a fixed head on a skirt comprising an outer semi-rigid layer provided with traversing porosities or perforations |
US5906887A (en) * | 1992-08-19 | 1999-05-25 | P.C.I.Paper Conversions, Inc. | Composite elastomeric article for adhesive cushioning and mounting means |
US5336554A (en) * | 1993-05-14 | 1994-08-09 | David Knight | Stretchable tear resistant porous elastomeric film elements and processes |
DE4316925C2 (en) * | 1993-05-20 | 1997-01-23 | Ludw Lindgens Gmbh | Process for increasing the water vapor permeability of leather for seats of upholstered seats, in particular automobile seats |
US5820448A (en) * | 1993-12-27 | 1998-10-13 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
JPH07235050A (en) * | 1994-02-18 | 1995-09-05 | Hitachi Metals Ltd | Magnetic disk fixing method |
US5707385A (en) * | 1994-11-16 | 1998-01-13 | Advanced Cardiovascular Systems, Inc. | Drug loaded elastic membrane and method for delivery |
US5935683A (en) * | 1996-04-24 | 1999-08-10 | Mitsui Chemicals, Inc. | Waterproof material and method for applying it |
JPH10242617A (en) * | 1997-02-28 | 1998-09-11 | Murata Mfg Co Ltd | Method and apparatus for processing ceramic green sheet |
DE19722679A1 (en) * | 1997-05-30 | 1998-12-03 | Wacker Siltronic Halbleitermat | Wafer holder and method for manufacturing a semiconductor wafer |
US6367529B1 (en) * | 1998-05-01 | 2002-04-09 | Fujikoshi Kikai Kogyo Kabushiki Kaisha | Method of adhering wafers and wafer adhering device |
US6344414B1 (en) * | 1999-04-30 | 2002-02-05 | International Business Machines Corporation | Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
US6371833B1 (en) * | 1999-09-13 | 2002-04-16 | Infineon Technologies Ag | Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer |
US6346036B1 (en) * | 1999-10-28 | 2002-02-12 | Strasbaugh | Multi-pad apparatus for chemical mechanical planarization |
JP4300687B2 (en) * | 1999-10-28 | 2009-07-22 | 味の素株式会社 | Manufacturing method of multilayer printed wiring board using adhesive film |
DE60109601T2 (en) | 2000-05-27 | 2006-02-09 | Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington | RILLEN POLISHING PILLOWS FOR CHEMICAL-MECHANICAL PLANARIZATION |
JP3336386B2 (en) | 2000-06-14 | 2002-10-21 | 独立行政法人農業生物資源研究所 | Insect skin incision apparatus and insect skin incision method |
EP1193031A1 (en) * | 2000-09-29 | 2002-04-03 | Infineon Technologies SC300 GmbH & Co. KG | Arrangement for polishing disk-like objects |
CN2470953Y (en) | 2001-03-29 | 2002-01-09 | 中国科学院微电子中心 | Suction disc of silicon-chip polishing machine head |
DE10128745A1 (en) | 2001-06-13 | 2003-01-23 | Volkswagen Ag | Air bag for a vehicle, comprises a gas generator unit located behind a cover and/or lining section, an outlet opening which is covered in the non-activated state, and perforation holes |
KR20030020784A (en) | 2001-09-04 | 2003-03-10 | 명범영 | polishing pad having even arrangement of uniform hollows and method of manufacturing the same |
US7295425B2 (en) * | 2002-06-27 | 2007-11-13 | Dainippon Ink And Chemicals, Inc. | Molding for electrolytic capacitor anode element, molding with substratum, production methods therefor, and production method for electrolytic capacitor anode element |
JP2004074301A (en) | 2002-08-09 | 2004-03-11 | Hitachi Chem Co Ltd | Polishing pad and substrate polishing method |
KR20040048464A (en) | 2002-12-03 | 2004-06-10 | 주식회사 하이닉스반도체 | Chemical mechanical polishing pad |
JP2004306195A (en) | 2003-04-07 | 2004-11-04 | Hitachi Chem Co Ltd | Polishing pad for CMP and method of manufacturing the same |
JP2005116948A (en) | 2003-10-10 | 2005-04-28 | Nitto Denko Corp | Semiconductor wafer processing method, and double-faced adhesive sheet |
JP2006128547A (en) | 2004-11-01 | 2006-05-18 | Toshiba Corp | Semiconductor and manufacturing method thereof |
JP4611730B2 (en) | 2004-12-14 | 2011-01-12 | 富士紡ホールディングス株式会社 | Soft plastic sheet and method for attaching soft plastic sheet |
US7789738B2 (en) * | 2006-07-03 | 2010-09-07 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
-
2006
- 2006-07-03 US US11/478,601 patent/US7789738B2/en not_active Expired - Fee Related
-
2007
- 2007-05-07 US US11/797,714 patent/US20080003927A1/en not_active Abandoned
Patent Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4017656A (en) * | 1975-09-18 | 1977-04-12 | Pandel-Bradford, Inc. | Imitation leather material and method of preparing such material |
US4132037A (en) * | 1977-02-28 | 1979-01-02 | Siltec Corporation | Apparatus for polishing semiconductor wafers |
US4276341A (en) * | 1979-05-02 | 1981-06-30 | Kabushiki Kaisha Asahi Gomu | Wet suit material and wet suit made thereof |
US4851061A (en) * | 1987-03-16 | 1989-07-25 | Sorkoram Paul O | Method and apparatus for patterned cut of thermoplastics |
US5058413A (en) * | 1989-11-07 | 1991-10-22 | Robert Muddiman | Rupture disc |
US5776290A (en) * | 1993-04-15 | 1998-07-07 | Minnesota Mining And Manufacturing Company | Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing |
US5424813A (en) * | 1994-05-23 | 1995-06-13 | Xerox Corporation | Apparatus and method for improved blotter roller permeability |
US5497699A (en) * | 1994-11-29 | 1996-03-12 | Mather; Clifford L. | Method of silk screen printing on a rough surface such as a football |
US5584146A (en) * | 1995-04-10 | 1996-12-17 | Applied Materials, Inc. | Method of fabricating chemical-mechanical polishing pad providing polishing uniformity |
US5632914A (en) * | 1995-05-24 | 1997-05-27 | Davidson Textron Inc. | Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes |
US5871393A (en) * | 1996-03-25 | 1999-02-16 | Chiyoda Co., Ltd. | Mounting member for polishing |
US6074287A (en) * | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
US5781393A (en) * | 1996-04-16 | 1998-07-14 | Erico International Corporation | Surge arrester |
US5989470A (en) * | 1996-09-30 | 1999-11-23 | Micron Technology, Inc. | Method for making polishing pad with elongated microcolumns |
US5830806A (en) * | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
US6155910A (en) * | 1997-01-03 | 2000-12-05 | 3M Innovative Properties Company | Method and article for the production of optical quality surfaces on glass |
US5975999A (en) * | 1997-01-06 | 1999-11-02 | 3M Innovative Properties Company | Hand tool having a cushioned laminate attachment surface |
US6454633B1 (en) * | 1997-04-04 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads of flocked hollow fibers and methods relating thereto |
US6217434B1 (en) * | 1997-04-04 | 2001-04-17 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US6095900A (en) * | 1998-03-23 | 2000-08-01 | Speedfam-Ipec | Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers |
US5993293A (en) * | 1998-06-17 | 1999-11-30 | Speedram Corporation | Method and apparatus for improved semiconductor wafer polishing |
US6089965A (en) * | 1998-07-15 | 2000-07-18 | Nippon Pillar Packing Co., Ltd. | Polishing pad |
US6238745B1 (en) * | 1998-12-22 | 2001-05-29 | Dow Corning Toray Silicone Co. Ltd. | Water repellent for treating solids |
US6855043B1 (en) * | 1999-07-09 | 2005-02-15 | Applied Materials, Inc. | Carrier head with a modified flexible membrane |
US20060116059A1 (en) * | 2000-06-23 | 2006-06-01 | International Business Machines Corporation | Fiber embedded polishing pad |
US6575821B2 (en) * | 2000-08-01 | 2003-06-10 | Joest Peter | Abrasive belt for a belt grinding machine |
US6726541B2 (en) * | 2001-10-09 | 2004-04-27 | Nihon Microcoating Co., Ltd. | Cleaning sheet |
US20030068967A1 (en) * | 2001-10-09 | 2003-04-10 | Eiji Nakamura | Cleaning sheet |
US6566426B1 (en) * | 2001-11-22 | 2003-05-20 | Nippon Shokubai Co., Ltd. | Aqueous resin composition |
US6657158B1 (en) * | 2002-06-03 | 2003-12-02 | Visteon Global Technologies, Inc. | Method of processing a laser scored instrument panel with an invisible seam airbag opening |
US7241408B2 (en) * | 2002-11-19 | 2007-07-10 | I.V. Technologies Co., Ltd. | Method of fabricating polishing pad having detection window thereon |
US7384061B2 (en) * | 2005-07-14 | 2008-06-10 | International Automotive Components Group North America, Inc. | Trim panel and a method of manufacture |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080003933A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US7316605B1 (en) * | 2006-07-03 | 2008-01-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20080003932A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US7629554B2 (en) | 2006-07-03 | 2009-12-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7789738B2 (en) * | 2006-07-03 | 2010-09-07 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
JP2013132745A (en) * | 2011-12-27 | 2013-07-08 | Asahi Glass Co Ltd | Polishing carrier, method for polishing glass substrate for magnetic recording medium, and method for manufacturing glass substrate for magnetic recording medium |
Also Published As
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US7789738B2 (en) | 2010-09-07 |
US20080003932A1 (en) | 2008-01-03 |
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