US20070276182A1

US20070276182A1 - Endoscope electronics assembly

Info

Publication number: US20070276182A1
Application number: US11/839,480
Authority: US
Inventors: Doron Adler; Ofer Pillar; Arie Blumenzweig; Shai Finkman; David Hanuka
Original assignee: C2 Cure Inc
Current assignee: Gyrus ACMI Inc
Priority date: 2004-07-29
Filing date: 2007-08-15
Publication date: 2007-11-29
Also published as: US20060025651A1; US7300397B2

Abstract

A method for assembling an endoscope that includes an imaging subassembly inside an insertion tube having distal and proximal ends. The method includes coupling the imaging subassembly to a plurality of wires, which have respective first and second ends, by fixing the first ends of the wires to the imaging subassembly. A connector is coupled to the wires by fixing the second ends of the wires to the connector. After coupling the imaging subassembly and the connector to the wires, the imaging subassembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end. After passing the connector through the insertion tube, the connector is inserted in a receptacle.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application claiming priority to and the benefit of U.S. patent application Ser. No. 10/901,376, filed Jul. 29, 2004, by Doron Adler, et al., entitled ENDOSCOPE ELECTRONICS ASSEMBLY, the contents of which is hereby incorporated by reference for all purposes as if listed in its entirety herein.

BACKGROUND

The present invention relates generally to endoscopy, and specifically to improved methods for assembly of endoscopes, as well as electronic parts and subassemblies for use in endoscopes.
Electronic endoscopes typically comprise an imaging subassembly, comprising an image sensor and suitable optics, at the distal end of the endoscope insertion tube. The imaging subassembly is connected to wires that pass through the insertion tube to the proximal end of the endoscope, where they are connected to a video processor board. Typically, the video processor board provides power and control signals to the image sensor, and receives and processes raw video signals from the image sensor in order to generate standard video output.
Thus, in general, the electronics assembly of the endoscope (comprising the imaging subassembly, video processor board and connecting wires) can undergo final testing only after the entire endoscope has been assembled, whereupon the wires are connected to the imaging assembly at one end of the insertion tube and the video processor board at the other. If a fault in the electronics assembly is discovered at this late stage, it may be necessary to disassemble the entire endoscope in order to repair it.

SUMMARY

There is a need for new methods of assembling endoscopes that permit the electronics assembly to be completely assembled and tested before it is assembled into the endoscope. Embodiments of the present invention that are described hereinbelow provide methods and devices that address this need.
In these embodiments, the electronics assembly comprises an imaging subassembly, wires, and a long, narrow connector, which is thin enough to pass through the endoscope insertion tube. The imaging subassembly is fixed to the distal end of the wires, and the connector is fixed to the proximal end, by soldering or by any other suitable technique, before the wires are passed through the insertion tube. The electronics assembly may then be tested by plugging the connector into a suitable video processor board or test jig. After testing, the electronics assembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end. After the connector and wires have passed through the insertion tube, the imaging subassembly is installed and sealed in the distal end of the insertion tube. The connector may then be plugged into a suitable receptacle in a processing subassembly, and the endoscope is ready for use.
Although the embodiments described hereinbelow relate specifically to imaging subassemblies, the principles of the present invention are equally applicable to other types of electronic subassemblies that are installed at the distal end of an endoscope and must be connected to processing or control electronics at the proximal end. Furthermore, the novel connectors and methods of assembly described hereinbelow may be used not only in endoscopes, but also in other types of electronic devices and systems.
There is therefore provided, in accordance with an embodiment of the present invention, a method for assembling an endoscope that includes an imaging subassembly inside an insertion tube having distal and proximal ends, the method including: coupling the imaging subassembly to a plurality of wires, which have respective first and second ends, by fixing the first ends of the wires to the imaging subassembly; coupling a connector to the wires by fixing the second ends of the wires to the connector; after coupling the imaging subassembly and the connector to the wires, installing the imaging subassembly in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end; and after passing the connector through the insertion tube, inserting the connector in a receptacle.
In a disclosed embodiment, the method includes testing the imaging subassembly by receiving signals from the connector after coupling the imaging subassembly and the connector to the wires and before installing the imaging subassembly in the insertion tube.
Typically, inserting the connector in the receptacle includes coupling the imaging subassembly to convey signals to a processing subassembly via the wires.
In some embodiments, the connector has an axis and includes a first array of conductive elements disposed along the axis, and coupling the connector to the wires includes connecting the wires to the conductive elements. Typically, the receptacle includes a second array of conductive pads, and coupling the connector to the receptacle includes aligning the first and second arrays, and exerting a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads. In a disclosed embodiment, coupling the connector to the receptacle includes inserting between the first and second arrays an elastomeric material including alternating conductive and non-conductive layers so that the electrical contact is formed through the elastomeric material.
Additionally or alternatively, the connector includes a dielectric substrate, and the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate. Further additionally or alternatively, while passing the connector through the insertion tube, the axis of the connector is approximately parallel to the wires.
There is also provided, in accordance with an embodiment of the present invention, an electronic assembly for use in an endoscope that includes an insertion tube, the assembly including: an imaging subassembly, including an image sensor; an elongate connector, which has an axis and includes a first array of conductive elements disposed along the axis, and which has transverse dimensions that are sufficiently small to permit the connector to pass through the insertion tube of the endoscope; and wires, which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the conductive elements of the connector.
There is additionally provided, in accordance with an embodiment of the present invention, a connector assembly, including: an elongate connector, which has an axis and includes a first array of conductive elements disposed along the axis, and which is adapted for coupling of respective wires to the conductive elements; a receptacle, of a size and shape suitable for receiving the connector, and including a second array of conductive pads, positioned so as to be aligned with the first array when the connector is inserted in the receptacle; and an elastomeric material, which includes alternating conductive and non-conductive layers, and which is adapted to be held in the receptacle between the first and second arrays so as to provide electrical contact between the conductive elements and the conductive pads when the connector is inserted in the receptacle.
In disclosed embodiments, the connector includes a dielectric substrate, and the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate. Typically, the layer of conductive material is disposed on at least first and second sides of the substrate, wherein the first side is configured to contact the elastomeric material, and wherein the wires are attached to the conductive material on the second side. In one embodiment, the first and second sides are opposing sides of the substrate, and wherein the conductive material on the second side is electrically connected by through-holes passing through the substrate to the conductive elements on the first side.
There is further provided, in accordance with an embodiment of the present invention, an endoscope, including: an insertion tube having distal and proximal ends and having an internal dimension; an electronic assembly, which is installed inside the insertion tube, and includes: an imaging subassembly, including an image sensor, positioned in the distal end of the insertion tube; an elongate connector, which protrudes from the proximal end of the insertion tube, and which has transverse dimensions that are smaller than the internal dimension of the insertion tube; and wires, which pass through the insertion tube and which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the connector; and a processing assembly, including a receptacle that is adapted to receive the connector outside the proximal end of the insertion tube.
The present invention will be more fully understood from the following detailed description of the embodiments thereof, taken together with the drawings in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic, cutaway view of a system for endoscopy, in accordance with an embodiment of the present invention;
FIG. 2 is a schematic, pictorial view of an electronics assembly for use in an endoscope, in accordance with an embodiment of the present invention;
FIGS. 3A and 3C are schematic bottom and top views of a connector, while FIGS. 3B and 3D are schematic left and right side views of the connector, in accordance with an embodiment of the present invention;
FIG. 4 is a schematic top view of a processing board for use with the assembly of FIG. 2, in accordance with an embodiment of the present invention;
FIG. 5A is a schematic, exploded view of a connector, processing board, and receptacle for coupling the connector to the processing board, in accordance with an embodiment of the present invention;
FIG. 5B is a schematic, pictorial illustration of the connector, board and receptacle of FIG. 5A after completion of the connection between the connector and the board;
FIG. 6 is a schematic, pictorial illustration of an endoscope, showing a method for installation of an electronics assembly in the insertion tube of the endoscope, in accordance with an embodiment of the present invention;
FIG. 7A is a schematic, pictorial view of a connector, in accordance with another embodiment of the present invention; and
FIG. 7B is a schematic, sectional view of the connector shown in FIG. 7A, taken along the line VIIB-VIIB.

DETAILED DESCRIPTION OF EMBODIMENTS

FIG. 1 is a schematic, cutaway view of a system 20 for endoscopy, in accordance with an embodiment of the present invention. System 20 comprises an electronic endoscope 21, comprising an insertion tube 22 and a handle 24, which is coupled by cable to a control unit 25. An imaging subassembly 27 is installed in the distal end of the insertion tube, and is coupled by a cable 34 running through the insertion tube to a proximal processing subassembly, which in this embodiment comprises an interface board 38 in handle 24. The imaging subassembly captures images of a region outside the distal end of the insertion tube (typically images of the inside of a body cavity or passageway). The image signals are passed from board 38 to control unit 25, which processes the images for display on a display monitor 26.
Imaging subassembly 27 comprises a circuit board 28, typically a printed circuit board, which may be rigid or flexible, or may have both rigid and flexible parts. An image sensor 32, such as a CCD or CMOS sensor array, is mounted on board 28, along with ancillary electronic components. Objective optics 30 form an image of the region outside the distal end of insertion tube 22 on sensor 32. In the embodiment shown in FIG. 1, sensor 32 is oriented in a plane that is parallel to the longitudinal axis of insertion tube 22, and optics 30 comprise a prism for reflecting the images onto the sensor plane. Typically, endoscope 22 also comprises a light source, for illuminating the region outside the distal end, as well as other functional elements, which are omitted from the figures for the sake of simplicity. Further details of an endoscope of this sort are described in PCT publication WO 03/098913, whose disclosure is incorporated herein by reference. This particular configuration is shown here solely by way of example, however, and the principles of the present invention are equally applicable to endoscopes having different image sensor configurations, including endoscopes in which the sensor plane is perpendicular to the axis of the insertion tube.
Image sensor 32 generates raw video signals (which may be analog or digital signals) responsively to the light that is imaged onto the sensor elements by optics 30. The signals are carried through tube 22 by cable 34. The proximal end of cable 34 terminates in a novel connector 36, which mates with a suitable receptacle on a interface board 38. Typically, board 38 also supplies power and control signals through cable 34 to board 28. The connector and receptacle are described in detail hereinbelow.
FIG. 2 is a schematic, pictorial view of an electronics assembly 39 used in system 20, in accordance with an embodiment of the present invention. Assembly 39 comprises imaging subassembly 27, cable 34 and connector 36. The imaging subassembly includes board 28, image sensor 32, and possibly optics 30, as well (not shown in this figure), which may be fixed to the image sensor. Cable 34 comprises multiple wires 40, whose distal ends are soldered to corresponding pads on board 28. Alternatively, the wires may be fixed to subassembly 27 by other means, as are known in the art.
Connector 36 comprises an array of conductive elements 42 on a non-conducting substrate 44. In other words, the connector comprises alternating conducting and non-conducting segments, arrayed along the longitudinal axis of the connector. Further details of connector 36 are shown in FIGS. 3A-D. Each of wires 40 is fixed at its proximal end to one of elements 42, thus providing a connection between board 28 and the connector elements.
FIGS. 3A-D are schematic frontal views showing the four surfaces of connector 36, in accordance with an embodiment of the present invention. FIG. 3A shows the bottom surface of the connector, which contacts the receptacle on board 38. FIG. 3C is the opposite, top surface, and FIGS. 3B and 3D are the two sides of the connector. In this embodiment, substrate 44 of connector 36 comprises a glass-epoxy printed circuit substrate, which is approximately 0.6 mm wide, 1.2 mm high and 29 mm long. The transverse dimensions, perpendicular to the longitudinal axis of the connector, are sufficiently small so that the connector can pass through insertion tube 22 even after wires 40 have been attached to conductive elements 42. The conductive elements are about 0.5 mm wide, and have a center-to-center pitch of about 1 mm. Conductive elements 42 typically comprise copper with a tin/lead coating, and are formed as a layer on substrate 44 using a printed circuit production process. As shown in FIGS. 3A, 3B and 3D, the copper is plated around three sides of the substrate.
Wires 40 are fixed to connector 36 by soldering the wires to elements 42, so that each wire contacts one element. Typically, for ease of assembly, the wires are soldered to alternating sides the connector, so that some of the wires are soldered to the side shown in FIG. 3B, and the remaining wires to the side shown in FIG. 3D. After soldering the wires, the sides of the connector are potted in an insulating, protective coating, such as an epoxy coating, while leaving the top and bottom of the connector bare. Alternatively, other materials and methods known in the art may be used to fabricate connector 36, and other methods may be used to connect the wires to the conductive elements of the connector. The dimensions given above are listed solely by way of example, and can be made larger or smaller to accommodate application needs and production constraints.
FIG. 4 is a schematic top view of interface board 38, in accordance with an embodiment of the present invention. Board 38 is a printed circuit board, which comprises an array of conductive pads 50 having the same pitch as conductive elements 42. Pads 50 are connected to circuit elements on board 38 by traces on the reverse side of the board (not shown). A connector 52 at the other side of board 38 is used to connect the board to in the cable leading to control unit 25.
Reference is now made to FIGS. 5A and 5B, which schematically illustrate how connector 36 is brought into electrical contact with board 38, in accordance with an embodiment of the present invention. FIG. 5A is an exploded view of the parts involved, while FIG. 5B shows the parts following completion of the assembly. A receptacle 60 is fixed to board 38 over the array of pads 50, so that a slot 64 in the receptacle is longitudinally aligned with the axis of the array. A piece of conductive elastomeric material 62 is inserted into slot 64. For example, material 62 may comprise a ZEBRA.RTM. elastomeric connector, distributed by Fujipoly America Corporation (Carteret, N.J.). The ZEBRA connector is constructed of alternating parallel layers of electrically conductive and nonconductive silicone elastomer. The ZEBRA material is oriented so that the alternating layers are perpendicular to the axis of the array.
Connector 36 is positioned over slot 64 above elastomeric material 62, so that each conductive element 42 is aligned with a corresponding pad 50 on board 38. A cover 66, with a slot 68 for holding the connector, is mechanically fastened to receptacle 60 so as to clamp connector 36 against material 62. Due to the pressure now exerted by connector 36 against material 62, the alternating conductive layers of the elastomeric material provide a reliable electrical connection between each element 42 and its corresponding pad 50. This arrangement has the advantage that it permits connector 36 to be made very thin, with no protruding connector pins, and that it enables connection and disconnection between connector 36 and board 38 to be made with essentially no insertion or removal force.
In other embodiments of the present invention, different designs may be used for connector 36, and different methods may be used for coupling the connector to board 38. Other connector types may be used in this context as long as the connectors are narrow enough to fit through insertion tube 22, as described with reference to the figure that follows.
FIG. 6 is a schematic, pictorial illustration of endoscope 21 showing installation of electronics assembly 39 in insertion tube 22, in accordance with an embodiment of the present invention. Assembly 39 is first assembled outside insertion tube 22, by soldering together (or otherwise connecting) board 28, cable 34 and connector 36, and installing the components of imaging subassembly 27 on board 28. Assembly 39 may then be tested, either by plugging connector 36 into the actual processing board 38, or by plugging the connector into a suitable test jig (with a receptacle similar to that shown in FIG. 5). This arrangement permits complete electrical and functional testing of assembly 39 to be completed while the assembly is outside insertion tube 22. As a result, defective parts can be identified and repaired or replaced before assembly 39 is installed in the endoscope. Because of the zero-force nature of the connection between connector 36 and the mating receptacle, there is little or no risk of damage to the connector due to repeated connect and disconnect operations that may occur during testing.
After testing is completed, connector 36 is inserted into the distal end of insertion tube 22, with the long axis of the connector parallel to the tube and to cable 34. The connector is passed through tube 22 to the proximal end, pulling cable 34 along behind it. When the connector has been passed all the way through the insertion tube, imaging subassembly is installed in the distal end of the tube, and the distal end is sealed. At this point, connector 36 protrudes from the proximal end of the tube. The connector may then be connected to board 38 in the manner described above.
FIGS. 7A and 7B schematically illustrate a connector 70, which may be used in place of connector 36 in accordance with an alternative embodiment of the present invention. FIG. 7A is a pictorial illustration of connector 70, showing both top and bottom views of the connector, as well as details of structures on the top side of the connector. FIG. 7B is a sectional illustration of connector 70 taken along a line VIIB-VIIB in FIG. 7A.
Connector 70, like connector 36, comprises dielectric substrate 42, which in this case has metal layers deposited on its top and bottom surfaces. There is no need in this embodiment, however, for any metal structures on the sides of the connector. Cable 34 typically comprises a ribbon cable, with wires 40 arrayed side-by-side with a known pitch. Typically, the cable comprises ten wires at a pitch of 100 .mu.m, although a greater or smaller number of wires, as well as a finer or coarser pitch, may likewise be used. On the top surface of connector 70, an array of conducting traces 72 is printed with a pitch equal to the pitch of cable 34. Wires 40 are then attached to respective traces 72 simply by aligning cable 34 properly with the traces and soldering the wires to the traces. Suitable assembly methods for this purpose are known in the art.
Each trace 72 connects to a through-hole 74, which passes through substrate 42 to a corresponding conductive element 42 printed on the bottom surface of connector 70. Holes 74 are plated through in order to make electrical contact between each trace 72 and the corresponding element 42. Thus, soldering wires 40 to traces 72 connects the wires through to elements 42 simply and compactly. Connector 70 may then be installed in receptacle 60 (FIG. 5A) in the manner described above.
Although the embodiments described hereinabove relate specifically to flexible electronic imaging endoscopes, elements of these embodiments may also be applied, mutatis mutandis, in electronic instruments of other sorts. For example, the methods and devices described above may also be used in producing rigid endoscopes, as well as in both flexible and rigid borescopes for non-medical applications. Furthermore, the principles of the present invention may be applied, as well, in pre-assembling and testing electronic assemblies in elongate electronic probes of other sorts, in which a functional subassembly at the distal end must be connected by wires to a processing subassembly at the proximal end.
It will thus be appreciated that the embodiments described above are cited by way of example, and that the present invention is not limited to what has been particularly shown and described hereinabove. Rather, the scope of the present invention includes both combinations and subcombinations of the various features described hereinabove, as well as variations and modifications thereof which would occur to persons skilled in the art upon reading the foregoing description and which are not disclosed in the prior art.

Claims

1. An electronic assembly for use in an endoscope that includes an insertion tube, the assembly comprising:

an imaging subassembly, comprising an image sensor;

an elongate connector, which has an axis and comprises a first array of conductive elements disposed along the axis, and which has transverse dimensions that are sufficiently small to permit the connector to pass through the insertion tube of the endoscope; and

wires, which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the conductive elements of the connector.

2. The assembly according to claim 1, wherein the wires are fixed so as to couple the imaging subassembly to the conductive elements of the connector before installation of the assembly in the insertion tube of the endoscope.

3. The assembly according to claim 1, wherein the connector is adapted to be received by a receptacle, which includes a second array of conductive pads, by aligning the first and second arrays, inserting between the first and second arrays an elastomeric material comprising alternating conductive and non-conductive layers, and exerting a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads.

4. The assembly according to claim 1, wherein the connector comprises a dielectric substrate, and wherein the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate.

5. A connector assembly, comprising:

an elongate connector, which has an axis and comprises a first array of conductive elements disposed along the axis, and which is adapted for coupling of respective wires to the conductive elements;

a receptacle, of a size and shape suitable for receiving the connector, and comprising a second array of conductive pads, positioned so as to be aligned with the first array when the connector is inserted in the receptacle; and

an elastomeric material, which comprises alternating conductive and non-conductive layers, and which is adapted to be held in the receptacle between the first and second arrays so as to provide electrical contact between the conductive elements and the conductive pads when the connector is inserted in the receptacle.

6. The assembly according to claim 5, wherein the connector comprises a dielectric substrate, and wherein the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate.

7. The assembly according to claim 6, wherein the layer of conductive material is disposed on at least first and second sides of the substrate, wherein the first side is configured to contact the elastomeric material, and wherein the wires are attached to the conductive material on the second side.

8. The assembly according to claim 7, wherein the first and second sides are opposing sides of the substrate, and wherein the conductive material on the second side is electrically connected by through-holes passing through the substrate to the conductive elements on the first side.

9. An endoscope, comprising:

an insertion tube having distal and proximal ends and having an internal dimension; an electronic assembly, which is installed inside the insertion tube, and comprises: an imaging subassembly, comprising an image sensor, positioned in the distal end of the insertion tube;

an elongate connector, which protrudes from the proximal end of the insertion tube, and which has transverse dimensions that are smaller than the internal dimension of the insertion tube; and wires, which pass through the insertion tube and which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the connector; and

a processing assembly, comprising a receptacle that is adapted to receive the connector outside the proximal end of the insertion tube.

10. The endoscope according to claim 9, wherein the electronic assembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end after fixing the imaging subassembly and the connector to the wires.

11. The endoscope according to claim 10, wherein while passing the connector through the insertion tube, the axis of the connector is approximately parallel to the wires.

12. The endoscope according to claim 10, wherein the electronic assembly is tested by receiving signals from the connector after fixing the imaging subassembly and the connector to the wires and before installing the imaging subassembly in the insertion tube.

13. The endoscope according to claim 9, wherein the connector has an axis and comprises a first array of conductive elements disposed along the axis, and wherein the wires are connected to the conductive elements.

14. The endoscope according to claim 13, wherein the receptacle comprises a second array of conductive pads, and is adapted to receive the connector so as to align the first and second arrays, and to exert a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads.

15. The endoscope according to claim 14, wherein the receptacle comprises an elastomeric material, which comprises alternating conductive and non-conductive layers, and which is positioned between the first and second arrays so that the electrical contact is formed through the elastomeric material.

16. The method according to claim 14, wherein the connector comprises a dielectric substrate and a layer of conductive material that is disposed over the dielectric substrate, and wherein the conductive elements are formed from the layer of the conductive material.