US20070107441A1

US20070107441A1 - Heat-dissipating unit and related liquid cooling module

Info

Publication number: US20070107441A1
Application number: US11/397,015
Authority: US
Inventors: Hsin-Ho Lee
Original assignee: Hon Hai Precision Industry Co Ltd
Current assignee: Hon Hai Precision Industry Co Ltd
Priority date: 2005-11-11
Filing date: 2006-04-03
Publication date: 2007-05-17
Also published as: CN1964610A

Abstract

A liquid cooling module includes a heat-absorbing unit, a heat-dissipating unit, a outlet pipe and a inlet pipe. The heat-dissipating unit includes a tank configured for receiving a coolant therein, a pump disposed in the tank, at least one thermoelectric device and at least one heat sink. The thermoelectric device has a first surface and a second surface facing away the first surface, the first surface thereof is attached to the tank. The heat sink is attached to the second surface of the thermoelectric device. The outlet pipe interconnects the heat-absorbing unit and the pump. The inlet pipe interconnects the tank and the heat-absorbing unit. The liquid cooling module has a small volume, and can be easily disposed in a computer enclosure.

Description

TECHNICAL FIELD

The present invention relates to cooling modules and, more particularly, to a heat-dissipating unit and a liquid cooling module having the same.

BACKGROUND

Conventional information processing apparatuses, such as personal computers, employ an air-cooling method to air-cool heat producing elements like CPUs (central processing units). In this method, a plurality of heat radiating fins is attached to the heat producing element, and a cooling fan is attached to a top of the radiating fins directing a flow of cool air whereby cooling is achieved by air circulation.
As operating speeds of the CPUs and other electronic elements used in the information processing apparatus has been steadily increased (in recent years, power consumption of the CPU has been close to 100 W) conventional air-cooling methods have become insufficiently cooling to be able to deal with the increased heat output of CPUs.
As a technique for cooling the CPU with increased power consumption, liquid cooling is mainly used for personal (i.e. desktop) computers. A liquid cooling module using the liquid cooling technique includes a cooling jacket, a radiator and a pipe being connected therebetween. A cooling liquid circulates in a passage of the cooling module. The cooling jacket is attached to the CPU to allow the cooling liquid to absorb heat generated by the CPU. Then, the cooling liquid flows to the radiator, and the radiator radiates the excess heat. The liquid cooling technique is more efficient at transferring heat of CPU than the air-cooling method.
However, the conventional liquid cooling module usually is bulky, and cannot be disposed in a computer enclosure easily. Usually, the liquid cooling module is disposed out of the computer enclosure, thus occupying a lot of space, and making the assembly difficult to move.
What is needed, therefore, is a compact liquid cooling module which can be fitted inside the enclosure.

SUMMARY

In accordance with an embodiment, a liquid cooling module includes a heat-absorbing unit, a heat-dissipating unit, a outlet pipe and a inlet pipe. The heat-dissipating unit includes a tank configured for receiving a coolant therein, a pump disposed in the tank, at least one thermoelectric device and at least one heat sink. The thermoelectric device has a first surface and a second surface facing away from the first surface, the first surface thereof is attached to the tank. The heat sink is attached to the second surface of the thermoelectric device. The outlet pipe interconnects the heat-absorbing unit and the pump. The inlet pipe interconnects the tank and the heat-absorbing unit.
Other advantages and novel features will become more apparent from the following detailed description of present liquid cooling module, when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present liquid cooling module can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present liquid cooling module. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
FIG. 1 is a perspective, cut-away view of a liquid cooling module according to a first embodiment;
FIG. 2 is a schematic, perspective view of a liquid cooling module according to a second embodiment; and
FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present liquid cooling module will now be described in detail below and with reference to the drawings.
Referring to FIG. 1, a liquid cooling module 1 according to a first embodiment includes a heat-absorbing unit 10, a heat-dissipating unit 20, connecting pipes 30 connecting the heat-absorbing unit 10 and heat-dissipating unit 20, and a coolant circulating between in the heat-absorbing unit 10, the heat-dissipating unit 20 and the connecting pipe 30.
The heat-absorbing unit 10 is generally attached to a heat-generating component 40 for absorbing heat from the heat-generating component 40. The coolant takes the heat from the heat-absorbing unit 10 to the heat-dissipating unit 20.
In the first embodiment, the heat-dissipating unit 20 includes a tank 21, a pump 25 disposed in the tank 21, two thermoelectric devices 22, 22′and two heat sinks 23, 23′. The tank 21 is configured for receiving a coolant therein. The thermoelectric device 22 has a first surface 221 and a second surface 222 facing away from the first surface 221. The first surface 221 is relatively cool and the second surface 222 is relatively hot in use, and the first surface 221 is attached to the tank 21. The thermoelectric device 22′ is similarly to the thermoelectric device 22, and has a first surface 221′ and a second surface 222′ facing away from the first surface 221′. The two heat sinks 23, 23′ are respectively attached to the second surfaces 222, 222′ of the thermoelectric devices 22, 22′. The two thermoelectric devices 22, 22′ are disposed at a same side of the tank 21. In order to decrease heat resistance between the tank 21 and the two thermoelectric devices 22, 22′, two thermal interface materials 27, 27′ are respectively disposed between the tank 21 and the two thermoelectric devices 22, 22′.
In order to decrease heat resistance between the two thermoelectric devices 22, 22′ and the two heat sinks 23, 23′, two thermal interface materials 28, 28′ are respectively disposed therebetween. In order to improve a heat dissipating efficiency of the heat sinks 23, 23′, two fans 24, 24′ are respectively attached to the heat sinks 23, 23′.
The connecting pipes 30 includes an inlet pipe 31 and an outlet pipe 32. The inlet pipe 31 interconnects the heat-absorbing unit 10 and the pump 25, and the outlet pipe 32 interconnects the heat-absorbing unit 10 and the tank 21.
The coolant is selected from the group consisting of water, ammonia, carbinol, acetone, heptane, and any suitable combination thereof. The coolant is preferably a suspension having thermally conductive particles.
The heat-dissipating unit 20 further includes a coolant level meter 26 in communication with the tank 21. The coolant level meter 26 has a coolant level observing window 261 and a coolant inlet 262. From the observing window 261, an observer can see the coolant level in the coolant level meter 26 and know the coolant level in the tank 21. If the coolant level in the tank 21 is lower than the acceptable coolant level of the pump 25, coolant can be injected into the tank through the coolant inlet 262. In the first embodiment, the coolant level meter 26 is disposed between the two heat sinks 23, 23′, the observing window 261 is a transom window of the coolant level meter 26 formed by using transparent material as a top of the coolant level meter 26, and the coolant inlet 262 is located on a wall of the coolant level meter 26 away from the tank 21.
In operation, the heat-generating component 40 generates heat. The heat-absorbing unit 10 absorbs heat from the heat-generating component 40. The heat-generating component 40 can be an electronic component such as a CPU or an IC (integrated circuit) package. The heat absorbed by heat-absorbing unit 10 is transferred to the heat-dissipating unit 20 to be dissipated by the circulation of the coolant. The coolant conveys the heat in the heat-absorbing unit 10 and discharges the heat to the tank 21. The heat absorbed by the tank 21 is transferred to the heat sinks 23, 23′ through the two thermoelectric devices 22, 22′, respectively, and is then dissipated to the environment. Thereby, the heat-generating component 40 can operate at an optimum temperature.
During the heat-dissipating process of the liquid cooling module 1, the first surfaces 221, 221′ of the thermoelectric devices 22, 22′ are relatively cooler than the environment, thereby improving the thermal conduction efficiency between the tank 21 and the first outer surfaces 221, 221′. The second surfaces 222, 222′ of the thermoelectric devices 22, 22′ are relatively hotter than the environment, thereby improving the thermal conduction efficiency between the heat sinks 23, 23′ and the second outer surfaces 222, 222′.
Furthermore, as the pump 25 is disposed in the tank 21, the thermoelectric devices 22, 22′ are in contact with the tank 21, and the heat sinks 23, 23′ are in contact with the thermoelectric devices 22, 22′, the volume of the heat-dissipating unit 20 is reduced compared to conventional devices. Thereby, the heat-dissipating unit 20 can be disposed in a storage bracket of the computer enclosure. Accordingly, the liquid cooling module I can be easily disposed inside the computer enclosure.
Referring to FIGS. 2 and 3, in the second embodiment, the liquid cooling module 1′ is similar to the liquid cooling module 1. The difference is that the heat-dissipating unit 20′ further includes a casing 29. The casing 29 has a plurality of heat-dissipating holes 291 defined therein spatially corresponding to heat sinks 23, 23′. The casing 29 also has a hole 292 aligned with the coolant inlet 262 of the coolant level meter 26.
The casing 29 is used for protecting the heat-dissipating unit 20′, and the heat-dissipating unit 20′ protected by the casing 29 can be disposed easily and securely.
It is understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments and methods without departing from the spirit of the invention. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.

Claims

1. A liquid cooling module comprising:

a heat-absorbing unit;

a heat-dissipating unit comprising:

a tank configured for receiving a coolant therein;

a pump disposed in the tank;

at least one thermoelectric device having a first surface and a second surface facing away from the first surface, the first surface thereof being attached to the tank; and

at least one heat sink attached to the second surface of the thermoelectric device,

an outlet pipe interconnecting the heat-absorbing unit and the pump; and

an inlet pipe interconnecting the tank and the heat-absorbing unit.

2. The liquid cooling module as claimed in claim 1, wherein the heat-dissipating unit further comprises a coolant level meter in communication with the tank, the coolant level meter having a coolant level observing window.

3. The liquid cooling module as claimed in claim 2, wherein the coolant level meter has a coolant inlet for supplying the coolant into the tank.

4. The liquid cooling module as claimed in claim 1, wherein a thermal interface material is disposed between the tank and the thermoelectric device.

5. The liquid cooling module as claimed in claim 1, wherein a thermal interface material is disposed between the thermoelectric device and the heat sink.

6. The liquid cooling module as claimed in claim 1, wherein the heat-dissipating unit further comprises at least one fan attached to the at least one heat sink.

7. The liquid cooling module as claimed in claim 3, wherein the heat-dissipating unit further comprises a casing having a plurality of heat-dissipating holes defined therein spatially corresponding to the heat sink and a hole aligned with the coolant inlet of the coolant level meter.

8. A heat-dissipating unit comprising:

a tank configured for receiving a coolant therein;

a pump disposed in the tank;

at least one heat sink attached to the second surface of the thermoelectric device.

9. The heat-dissipating unit as claimed in claim 8, wherein the heat-dissipating unit further comprises a coolant level meter in communication with the tank, the meter device having a coolant level observing window.

10. The heat-dissipating unit as claimed in claim 9, wherein the coolant level meter has a coolant inlet for supplying the coolant into the tank.

11. The heat-dissipating unit as claimed in claim 8, wherein a thermal interface material is disposed between the tank and the thermoelectric device.

12. The heat-dissipating unit as claimed in claim 8, wherein a thermal interface material is disposed between the thermoelectric device and the heat sink.

13. The heat-dissipating unit as claimed in claim 8, wherein the heat-dissipating unit further comprises at least one fan attached to the heat sink.

14. The liquid cooling module as claimed in claim 10, wherein the heat-dissipating unit further comprises a casing having a plurality of heat-dissipating holes defined therein spatially corresponding to the heat sink and a hole aligned with the coolant inlet of the coolant level meter.