US20070062675A1

US20070062675A1 - Heat dissipating system

Info

Publication number: US20070062675A1
Application number: US11/392,355
Authority: US
Inventors: Chien-Jung Chen; Te-Tsung Chen; Chih-Tsung Hsu
Original assignee: Individual
Current assignee: Yen Sun Technology Corp
Priority date: 2005-09-21
Filing date: 2006-03-28
Publication date: 2007-03-22
Also published as: TWM284951U; JP3122897U

Abstract

A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of Taiwanese application no. 094216236, filed on Sep. 21, 2005.

BACKGROUND OF THE INVENTION

1. Field of the Invention
This invention relates to a heat dissipating system, more particularly to a heat dissipating system for cooling an electronic device.
2. Description of the Related Art
As technology advances in the field of computers, performance of the computer has become more and more powerful. Therefore, considerable heat is generated by electronic devices, such as a central processing unit (CPU), of the computer, thereby resulting in a high temperature. The high temperature can cause improper shut down of the computer and damage to the data stored in the computer. Thus, heat dissipation is a major concern for computer manufacturers.
FIG. 1 shows a conventional heat dissipating device 1 that includes a heat sink 11, a coolant 12, a driving mechanism 13, a cooling mechanism 14, and a conduit 112 allowing the coolant 12 to flow therein and connected to the heat sink 11 and the driving mechanism 13.
The heat sink 11 includes a body 111 heat-exchangably connected to an electronic device 100, and defines an inner space in the body 111. The coolant 12 is received in the inner space of the heat sink 11, and flows through the space of the heat sink 11 so as to carry the heat from the electronic device 100.
The driving mechanism 13 is used to circulate the coolant 12 in the heat dissipating system 1.
The cooling mechanism 14 includes a plurality of heat dissipating fins 142 spaced apart from each other and connected to a tortuous section 141 of the conduit 112.
In operation, the heat generated by the electronic device 100 is transferred to the body 111 of the heat sink 11, and is carried by the coolant 12 to the cooling mechanism 14 so as to be dissipated thereat. The heat dissipating fins 142 of the cooling mechanism 14 contact the tortuous section 141 of the conduit 112 so as to facilitate heat dissipation. With the circulation of the coolant 12, the heat generated by the electronic device 100 is dissipated.
However, in the conventional heat dissipating device 1, when the driving force generated by the driving mechanism 13 is too strong, the pressure in the heat dissipating device 1 becomes too high, thereby causing damage to the heat dissipating device 1, such as breaking of the conduit 112. Therefore, there is a need in the art to provide a heat dissipating system that can avoid pressure therein from rising to an extent that could cause damage to the heat dissipating system.

SUMMARY OF THE INVENTION

Therefore, the object of the present invention is to provide a heat dissipating system for cooling an electronic device, which can prevent the problem caused by excessive pressure as encountered in the prior art.
According to this invention, a heat dissipating system for cooling an electronic device comprises: a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism for drawing the coolant from the coolant reservoir; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism draws the coolant from the coolant reservoir and drives circulation of the coolant in the coolant circulating conduit through the heat sink and the cooling mechanism so as to transfer heat from the heat sink to the cooling mechanism through the coolant; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is normally closed, thereby forbidding fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass, and is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment of this invention, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of a conventional heat dissipating device;
FIG. 2 is a schematic view of the preferred embodiment of a heat dissipating system according to this invention in a state where a valve is closed; and
FIG. 3 is a schematic view of the preferred embodiment of a heat dissipating system according to this invention in a state where the valve is opened.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 2, the preferred embodiment of a heat dissipating system 2 according to this invention includes: a heat sink 24 adapted to be connected to an electronic device 100 for absorbing heat from the electronic device 100; a coolant reservoir 21 for storing a coolant 22 therein; a driving mechanism 25 for drawing the coolant 22 from the coolant reservoir 21; a cooling mechanism 26; a coolant circulating conduit 23 connected to the coolant reservoir 21, the cooling mechanism 26, the heat sink 24, and the driving mechanism 25 such that the driving mechanism 25 draws the coolant 22 from the coolant reservoir 21 and drives circulation of the coolant 22 in the coolant circulating conduit 23 through the heat sink 24 and the cooling mechanism 26 so as to transfer heat from the heat sink 24 to the cooling mechanism 26 through the coolant 22; and a pressure stabilizing mechanism 27 including a bypass 272 connected to the coolant reservoir 21 and the coolant circulating conduit 23 at a position downstream of the driving mechanism 25, and a valve 271.
In this embodiment, the valve 271 is installed movably in the bypass 272. The bypass 272 includes a wider portion 273 near the valve 271 for permitting movement of the valve 271 thereinto when the valve 271 is pushed by the pressure in the coolant circulating conduit 23. The valve 271 is normally closed, thereby forbidding fluid communication between the coolant reservoir 21 and the coolant circulating conduit 23 through the bypass 272 (see FIG. 2). On the other hand, as shown in FIG. 3, the valve 271 is pushed into the wider portion 273 of the bypass 272 so as to be moved from the closed position to an open position when the pressure inside the coolant circulating conduit 23 exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir 21 and the coolant circulating conduit 23 through the bypass 272 (see FIG. 3).
In this embodiment, the driving mechanism 25 includes a pump. Preferably, the coolant 22 is water.
In this embodiment, the heat sink 24 includes a container 240 and a plurality of fins 241 disposed in the container 240. The fins 241 are spaced apart from each other, and are in contact with the coolant 22 in the container 240. The fins 241 provide a larger surface area for heat-exchange from the electronic device 100 to the coolant 22, thereby enhancing the heat dissipating efficiency.
In this embodiment, the cooling mechanism 26 includes a plurality of fins 261 and a fan 262. The fins 261 of the cooling mechanism 26 are spaced apart from each other, and contact the coolant circulating conduit 23, such that heat is transferred to the fins 261 of the cooling mechanism 26 from the coolant 22 through the coolant circulating conduit 23. The fan 262 of the cooling mechanism 26 is used to cool the fins 261 of the cooling mechanism 26.
In operation, the heat generated by the electronic device 100 is transferred to the fins 241 of the heat sink 24. The coolant 22 passes through the heat sink 24, and absorbs heat from the fins 241 of the heat sink 24 so as to carry the heat from the heat sink 24. The heated coolant 22 is cooled when passing through the cooling mechanism 26. The cooled coolant 22 is re-circulated to the heat sink 24 through the driving action of the pump 25, thereby continuing the heat-exchanging circulation. When the pressure inside the coolant circulating conduit 23 exceeds the predetermined value, as described above, the valve 271 is moved to the open position. As a consequence, a part of the coolant 22 flows back into the coolant reservoir 21 through the bypass 272 so as to prevent abnormal pressure inside the coolant circulating conduit 23. The remainder of the coolant 22 continues the heat-exchanging circulation in the coolant circulating conduit 23.
In this embodiment, the electronic device 100 is directly connected to the heat sink 24. However, this invention is not limited to the disclosed embodiment. For example, the electronic device 100 can be directly connected to the reservoir 21.
With the pressure stabilizing mechanism 27, the problem caused by excessive pressure as encountered in the prior art can be avoided.
While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation and equivalent arrangements.

Claims

1. A heat dissipating system for cooling an electronic device, said heat dissipating system comprising:

a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device;

a coolant reservoir adapted for storing a coolant therein;

a driving mechanism for drawing the coolant from said coolant reservoir;

a cooling mechanism;

a coolant circulating conduit connected to said coolant reservoir, said cooling mechanism, said heat sink, and said driving mechanism such that said driving mechanism draws the coolant from said coolant reservoir and drives circulation of the coolant in said coolant circulating conduit through said heat sink and said cooling mechanism so as to transfer heat from said heat sink to said cooling mechanism through the coolant; and

a pressure stabilizing mechanism including a bypass connected to said coolant reservoir and said coolant circulating conduit at a position downstream of said driving mechanism, and a valve that is normally closed, thereby forbidding fluid communication between said coolant reservoir and said coolant circulating conduit through said bypass, and that is opened when the pressure inside said coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between said coolant reservoir and said coolant circulating conduit through said bypass.

2. The heat dissipating system of claim 1, wherein said valve is installed movably in said bypass, and is movable from a closed position to an open position when the pressure in said coolant circulating conduit exceeds the predetermined value.

3. The heat dissipating system of claim 1, wherein said heat sink includes a container and a plurality of fins disposed in said container.

4. The heat dissipating system of claim 1, wherein said cooling mechanism includes a fan and a plurality of fins connected to said coolant circulating conduit.

5. The heat dissipating system of claim 1, wherein said driving mechanism includes a pump.