US20070044948A1 - Water-cooled cooler for CPU of PC - Google Patents
Water-cooled cooler for CPU of PC Download PDFInfo
- Publication number
- US20070044948A1 US20070044948A1 US11/218,080 US21808005A US2007044948A1 US 20070044948 A1 US20070044948 A1 US 20070044948A1 US 21808005 A US21808005 A US 21808005A US 2007044948 A1 US2007044948 A1 US 2007044948A1
- Authority
- US
- United States
- Prior art keywords
- reservoir
- tubes
- chamber
- water
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000012530 fluid Substances 0.000 claims description 11
- 239000012466 permeate Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0202—Header boxes having their inner space divided by partitions
- F28F9/0204—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions
- F28F9/0209—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions having only transversal partitions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05375—Assemblies of conduits connected to common headers, e.g. core type radiators with particular pattern of flow, e.g. change of flow direction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
- F28F9/0224—Header boxes formed by sealing end plates into covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to coolers and more particularly to an improved water-cooled cooler for the CPU (central processing unit) of a PC (personal computer).
- FIG. 1 A conventional water-cooled cooler for a PC is shown in FIG. 1 .
- the cooler comprises a heat sink 1 mounted a CPU 2 for absorbing heat generated by the running CPU 2 , a cooling assembly 3 in fluid communication with the heat sink 1 through a pipe, a fan 5 mounted on the cooling assembly 3 for generating air flow to cool the cooling assembly 3 , and a pump 4 for drawing cooled water out of the cooling assembly 3 and feeding into the heat sink 1 .
- the cooling assembly 3 is the most important component of the cooler. It is understood that heat dissipation performance of the cooler will be adversely affected if water leaving the cooling assembly 3 has a temperature higher than a predetermined value (i.e., the cooling assembly 3 operates abnormally). Thus, continuing improvements in the exploitation of a water-cooled cooler for PC are constantly being sought.
- FIG. 1 schematically depicts a conventional water-cooled cooler for a PC
- FIG. 2 is a front view of a preferred embodiment of water-cooled cooler for PC according to the invention.
- FIG. 4 is a longitudinal sectional view of the cooler shown in FIG. 2 .
- a water-cooled cooler for PC in accordance with a preferred embodiment of the invention comprises a cooling assembly 10 including a plurality of threaded holes 11 such that a fan 5 may secure to the cooling assembly 10 by driving fasteners into the holes 11 .
- the cooling assembly 10 comprises a top plate 12 , a bottom plate 13 , a plurality of parallel tubes 14 interconnected the top plate 12 and the bottom plate 13 , a plurality of fins 15 mounted on an outer surface of each tube 14 such that hot water flowing through the tubes 14 may transfer heat to the fins 15 , and the activating fan 5 may generate air flow to cool the fins 15 and thus water.
- an upper connecting member 120 is provided on the top plate 12 proximate one side and thus left and right sections with respect to the upper connecting member 120 are formed on the top plate 12 .
- a first reservoir 20 and a separate third reservoir 30 are formed on the sections respectively.
- a first chamber 16 and a separate third chamber 17 are formed in the first reservoir 20 and the third reservoir 30 respectively.
- An inlet 21 is provided on the first reservoir 20 such that water may flow from an external source to the first chamber 16 via the inlet 21 .
- a lower connecting member 130 is provided on the bottom plate 13 proximate the other side and thus left and right sections with respect to the lower connecting member 130 are formed on the bottom plate 13 .
- a second reservoir 40 and a separate fourth reservoir 50 are formed on the sections respectively.
- a second chamber 18 and a separate fourth chamber 19 are formed in the second reservoir 40 and the fourth reservoir 50 respectively.
- An outlet 51 is provided on the fourth reservoir 50 such that it is possible that water may flow from an external source to the fourth chamber 19 via the outlet 51 .
- the first chamber 16 is in fluid communication with the second chamber 18 via a first number of tubes 14
- the second chamber 18 is in fluid communication with the third chamber 17 via a second number of tubes 14
- the third chamber 17 is in fluid communication with the fourth chamber 19 via a remaining third number of tubes 14 respectively.
- water may enter from the inlet 21 through the chambers 16 , 17 , 18 , and 19 and the tubes 14 and then may leave the cooling assembly 10 via the outlet 51 .
- water may enter from the outlet 51 through the chambers 16 , 17 , 18 , and 19 and the tubes 14 and then may leave the cooling assembly 10 via the inlet 21 .
- the first chamber 16 is separate from the third chamber 17 and the second chamber 18 is separate from the fourth chamber 19 respectively.
- fluid communication and heat transfer either between the first chamber 16 and the third chamber 17 or between the second chamber 18 and the fourth chamber 19 are made impossible. This ensures that only fins 15 are able to dissipate excessive heat of water flowing through the tubes 14 .
- hot water enters the first chamber 16 via the inlet 21 .
- water only flows to the second chamber 18 via the first number of tubes 14 rather than permeate to the third chamber 17 . That is, temperature of water in the third chamber 17 is not increased.
- Temperature of the first reservoir 20 is increased because hot water continues to flow into the first chamber 16 .
- the hot first reservoir 20 will not transfer heat to increase temperature of the third reservoir 30 and thus temperature of water in the third chamber 17 since the first reservoir 20 is heatproof.
- water in the second chamber 18 is initially cooled and is driven to flow to the third chamber 17 via the second number of tubes 14 rather than permeate to the fourth chamber 19 . That is, temperature of water in the fourth chamber 19 is not increased.
- Temperature of the third reservoir 30 is increased because hot water continues to flow into the third chamber 17 .
- the hot second reservoir 40 will not transfer heat to increase temperature of the fourth reservoir 50 and thus temperature of water in the fourth chamber 19 since the second reservoir 40 is heatproof.
- water in the third chamber 17 is further cooled and is driven to flow to the fourth chamber 19 via the remaining third number of tubes 14 .
- Temperature of again cooled water in the fourth chamber 19 is not increased due to the adjacent hot second reservoir 40 . As an end, cool water flows out of the outlet 51 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A device for cooling a CPU of PC comprises parallel tubes interconnected top and bottom, fins mounted on an outer surface of each tube, and a fan for cooling the fins; and a reservoir assembly including a first reservoir on a top, a second reservoir separate from the first reservoir, an inlet provided on the first reservoir, a third reservoir on an underside, a fourth reservoir separate from the third reservoir, and an outlet provided on the fourth reservoir. Water flowing through the hot CPU is adapted to enter from the inlet to flow through the first reservoir, a first number of the tubes, the third reservoir, a second number of the tubes, the second reservoir, a third number of the tubes, and the fourth reservoir prior to leaving the device via the outlet.
Description
- 1. Field of Invention
- The present invention relates to coolers and more particularly to an improved water-cooled cooler for the CPU (central processing unit) of a PC (personal computer).
- 2. Related Art
- A conventional water-cooled cooler for a PC is shown in
FIG. 1 . The cooler comprises aheat sink 1 mounted aCPU 2 for absorbing heat generated by the runningCPU 2, acooling assembly 3 in fluid communication with theheat sink 1 through a pipe, afan 5 mounted on thecooling assembly 3 for generating air flow to cool thecooling assembly 3, and apump 4 for drawing cooled water out of thecooling assembly 3 and feeding into theheat sink 1. This completes a cooling cycle. Thecooling assembly 3 is the most important component of the cooler. It is understood that heat dissipation performance of the cooler will be adversely affected if water leaving thecooling assembly 3 has a temperature higher than a predetermined value (i.e., thecooling assembly 3 operates abnormally). Thus, continuing improvements in the exploitation of a water-cooled cooler for PC are constantly being sought. - It is therefore an object of the present invention to provide a device for cooling a CPU of a PC comprising a cooling assembly including a top plate, a bottom plate, a plurality of parallel tubes interconnected the top and the bottom plates, a plurality of fins mounted on an outer surface of each of the tubes for absorbing heat of water flowing through the tubes, and a fan for generating air flow to cool the fins; and a reservoir assembly including a first reservoir on a top, a second reservoir separate from the first reservoir by a first gap, an inlet provided on the first reservoir, a third reservoir on an underside, a fourth reservoir separate from the third reservoir by a second gap, and an outlet provided on the fourth reservoir wherein the first reservoir is in fluid communication with the third reservoir via a first number of the tubes, the third reservoir is in fluid communication with the second reservoir via a second number of the tubes, and the second reservoir is in fluid communication with the fourth reservoir via a remaining third number of the tubes respectively; wherein water flowing through the hot CPU is adapted to enter from the inlet to flow through the first reservoir, the first number of the tubes, the third reservoir, the second number of the tubes, the second reservoir, the third number of the tubes, and the fourth reservoir sequentially prior to leaving the device via the outlet. In one aspect of the present invention the top plate comprises an upper connecting member proximate one side of the cooling assembly for connecting the first reservoir to the second reservoir, and the bottom plate comprises a lower connecting member proximate the other side of the cooling assembly for connecting the third reservoir to the fourth reservoir.
- The above and other objects, features and advantages of the present invention will become apparent from the following detailed description taken with the accompanying drawings.
-
FIG. 1 schematically depicts a conventional water-cooled cooler for a PC; -
FIG. 2 is a front view of a preferred embodiment of water-cooled cooler for PC according to the invention; -
FIG. 3 is a side view of the cooler shown inFIG. 2 ; and -
FIG. 4 is a longitudinal sectional view of the cooler shown inFIG. 2 . - Referring to
FIGS. 2, 3 , and 4, a water-cooled cooler for PC in accordance with a preferred embodiment of the invention comprises acooling assembly 10 including a plurality of threaded holes 11 such that afan 5 may secure to thecooling assembly 10 by driving fasteners into the holes 11. Thecooling assembly 10 comprises atop plate 12, abottom plate 13, a plurality ofparallel tubes 14 interconnected thetop plate 12 and thebottom plate 13, a plurality offins 15 mounted on an outer surface of eachtube 14 such that hot water flowing through thetubes 14 may transfer heat to thefins 15, and the activatingfan 5 may generate air flow to cool thefins 15 and thus water. - As shown in
FIG. 4 , an upper connectingmember 120 is provided on thetop plate 12 proximate one side and thus left and right sections with respect to the upper connectingmember 120 are formed on thetop plate 12. Afirst reservoir 20 and a separatethird reservoir 30 are formed on the sections respectively. Afirst chamber 16 and a separatethird chamber 17 are formed in thefirst reservoir 20 and thethird reservoir 30 respectively. Aninlet 21 is provided on thefirst reservoir 20 such that water may flow from an external source to thefirst chamber 16 via theinlet 21. Similarly, a lower connectingmember 130 is provided on thebottom plate 13 proximate the other side and thus left and right sections with respect to the lower connectingmember 130 are formed on thebottom plate 13. Asecond reservoir 40 and a separatefourth reservoir 50 are formed on the sections respectively. Asecond chamber 18 and a separatefourth chamber 19 are formed in thesecond reservoir 40 and thefourth reservoir 50 respectively. Anoutlet 51 is provided on thefourth reservoir 50 such that it is possible that water may flow from an external source to thefourth chamber 19 via theoutlet 51. Thefirst chamber 16 is in fluid communication with thesecond chamber 18 via a first number oftubes 14, thesecond chamber 18 is in fluid communication with thethird chamber 17 via a second number oftubes 14, and thethird chamber 17 is in fluid communication with thefourth chamber 19 via a remaining third number oftubes 14 respectively. Thus, water may enter from theinlet 21 through thechambers tubes 14 and then may leave thecooling assembly 10 via theoutlet 51. Alternatively, water may enter from theoutlet 51 through thechambers tubes 14 and then may leave thecooling assembly 10 via theinlet 21. As stated above, thefirst chamber 16 is separate from thethird chamber 17 and thesecond chamber 18 is separate from thefourth chamber 19 respectively. Thus, fluid communication and heat transfer either between thefirst chamber 16 and thethird chamber 17 or between thesecond chamber 18 and thefourth chamber 19 are made impossible. This ensures that onlyfins 15 are able to dissipate excessive heat of water flowing through thetubes 14. - In detail, in one embodiment hot water enters the
first chamber 16 via theinlet 21. Next, water only flows to thesecond chamber 18 via the first number oftubes 14 rather than permeate to thethird chamber 17. That is, temperature of water in thethird chamber 17 is not increased. Temperature of thefirst reservoir 20 is increased because hot water continues to flow into thefirst chamber 16. Advantageously, the hotfirst reservoir 20 will not transfer heat to increase temperature of thethird reservoir 30 and thus temperature of water in thethird chamber 17 since thefirst reservoir 20 is heatproof. As such, water in thesecond chamber 18 is initially cooled and is driven to flow to thethird chamber 17 via the second number oftubes 14 rather than permeate to thefourth chamber 19. That is, temperature of water in thefourth chamber 19 is not increased. Temperature of thethird reservoir 30 is increased because hot water continues to flow into thethird chamber 17. Advantageously, the hotsecond reservoir 40 will not transfer heat to increase temperature of thefourth reservoir 50 and thus temperature of water in thefourth chamber 19 since thesecond reservoir 40 is heatproof. As such, water in thethird chamber 17 is further cooled and is driven to flow to thefourth chamber 19 via the remaining third number oftubes 14. Temperature of again cooled water in thefourth chamber 19 is not increased due to the adjacent hotsecond reservoir 40. As an end, cool water flows out of theoutlet 51. - The heatproof characteristic between the
first reservoir 20 and thethird reservoir 30 is mainly achieved by agap 60 therebetween and the heatproof characteristic between thesecond reservoir 40 and thefourth reservoir 50 is mainly achieved by agap 70 therebetween respectively. - While the invention herein disclosed has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (2)
1. A device for cooling a CPU of a PC comprising:
a cooling assembly including a top plate, a bottom plate, a plurality of parallel tubes interconnected the top and the bottom plates, a plurality of fins mounted on an outer surface of each of the tubes for absorbing heat of water flowing through the tubes, and a fan for generating air flow to cool the fins; and
a reservoir assembly including a first reservoir on a top, a second reservoir separate from the first reservoir by a first gap, an inlet provided on the first reservoir, a third reservoir on an underside, a fourth reservoir separate from the third reservoir by a second gap, and an outlet provided on the fourth reservoir wherein the first reservoir is in fluid communication with the third reservoir via a first number of the tubes, the third reservoir is in fluid communication with the second reservoir via a second number of the tubes, and the second reservoir is in fluid communication with the fourth reservoir via a remaining third number of the tubes respectively;
wherein water flowing through the hot CPU is adapted to enter from the inlet to flow through the first reservoir, the first number of the tubes, the third reservoir, the second number of the tubes, the second reservoir, the third number of the tubes, and the fourth reservoir sequentially prior to leaving the device via the outlet.
2. The device of claim 1 , wherein the top plate comprises an upper connecting member proximate one side of the cooling assembly for connecting the first reservoir to the second reservoir, and the bottom plate comprises a lower connecting member proximate the other side of the cooling assembly for connecting the third reservoir to the fourth reservoir.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/218,080 US20070044948A1 (en) | 2005-08-31 | 2005-08-31 | Water-cooled cooler for CPU of PC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/218,080 US20070044948A1 (en) | 2005-08-31 | 2005-08-31 | Water-cooled cooler for CPU of PC |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070044948A1 true US20070044948A1 (en) | 2007-03-01 |
Family
ID=37802421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/218,080 Abandoned US20070044948A1 (en) | 2005-08-31 | 2005-08-31 | Water-cooled cooler for CPU of PC |
Country Status (1)
Country | Link |
---|---|
US (1) | US20070044948A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080230211A1 (en) * | 2007-03-19 | 2008-09-25 | William Richard Hutchins | Heat Exchangers |
US20130014924A1 (en) * | 2011-06-20 | 2013-01-17 | Martin Engelhardt | Heat exchanger and method for manufacturing a heat exchanger |
US20210305129A1 (en) * | 2020-03-27 | 2021-09-30 | Auras Technology Co., Ltd. | Liquid-cooling radiator module |
CN113518535A (en) * | 2020-03-27 | 2021-10-19 | 春鸿电子科技(重庆)有限公司 | Liquid cooling row module |
US20220392827A1 (en) * | 2019-09-10 | 2022-12-08 | Southern University Of Science And Technology | Heat dissipation structure and heat dissipation system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2505790A (en) * | 1946-07-24 | 1950-05-02 | Perfex Corp | Combination radiator and oil cooler |
US4917180A (en) * | 1989-03-27 | 1990-04-17 | General Motors Corporation | Heat exchanger with laminated header and tank and method of manufacture |
US4971145A (en) * | 1990-04-09 | 1990-11-20 | General Motors Corporation | Heat exchanger header |
US5236336A (en) * | 1990-12-05 | 1993-08-17 | Sanden Corporation | Heat exchanger |
US5729995A (en) * | 1995-03-20 | 1998-03-24 | Calsonic Corporation | Electronic component cooling unit |
US20020007646A1 (en) * | 2000-06-20 | 2002-01-24 | Showa Denko K.K. | Condenser |
US20020134538A1 (en) * | 1999-12-29 | 2002-09-26 | Sylvain Moreau | Multichannel tube heat exchanger, in particular for motor vehicle |
US20040173342A1 (en) * | 2001-05-11 | 2004-09-09 | Hajime Sugito | Cooling device boiling and condensing refrigerant |
-
2005
- 2005-08-31 US US11/218,080 patent/US20070044948A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2505790A (en) * | 1946-07-24 | 1950-05-02 | Perfex Corp | Combination radiator and oil cooler |
US4917180A (en) * | 1989-03-27 | 1990-04-17 | General Motors Corporation | Heat exchanger with laminated header and tank and method of manufacture |
US4971145A (en) * | 1990-04-09 | 1990-11-20 | General Motors Corporation | Heat exchanger header |
US5236336A (en) * | 1990-12-05 | 1993-08-17 | Sanden Corporation | Heat exchanger |
US5729995A (en) * | 1995-03-20 | 1998-03-24 | Calsonic Corporation | Electronic component cooling unit |
US20020134538A1 (en) * | 1999-12-29 | 2002-09-26 | Sylvain Moreau | Multichannel tube heat exchanger, in particular for motor vehicle |
US20020007646A1 (en) * | 2000-06-20 | 2002-01-24 | Showa Denko K.K. | Condenser |
US20040173342A1 (en) * | 2001-05-11 | 2004-09-09 | Hajime Sugito | Cooling device boiling and condensing refrigerant |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080230211A1 (en) * | 2007-03-19 | 2008-09-25 | William Richard Hutchins | Heat Exchangers |
US20130014924A1 (en) * | 2011-06-20 | 2013-01-17 | Martin Engelhardt | Heat exchanger and method for manufacturing a heat exchanger |
US9316450B2 (en) * | 2011-06-20 | 2016-04-19 | Mahle International Gmbh | Heat exchanger and method for manufacturing a heat exchanger |
US20220392827A1 (en) * | 2019-09-10 | 2022-12-08 | Southern University Of Science And Technology | Heat dissipation structure and heat dissipation system |
US20210305129A1 (en) * | 2020-03-27 | 2021-09-30 | Auras Technology Co., Ltd. | Liquid-cooling radiator module |
CN113518535A (en) * | 2020-03-27 | 2021-10-19 | 春鸿电子科技(重庆)有限公司 | Liquid cooling row module |
US11626346B2 (en) * | 2020-03-27 | 2023-04-11 | Auras Technology Co., Ltd. | Liquid-cooling radiator module |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20070163270A1 (en) | Liquid cooling system with thermoeletric cooling module | |
US10260781B2 (en) | Liquid cooling device having diversion mechanism | |
US6867973B2 (en) | Heat dissipation device with liquid coolant | |
US7466550B2 (en) | Integrated heat dissipating assembly | |
US20060021737A1 (en) | Liquid cooling device | |
US20080314559A1 (en) | Heat exchange structure and heat dissipating apparatus having the same | |
US7069737B2 (en) | Water-cooling heat dissipation system | |
DK1611406T3 (en) | Heat exchanger, especially air / air cooler | |
US20080029251A1 (en) | Water-cooled heat sink and water-cooled system | |
CN207802629U (en) | A kind of high density heat dissipation module | |
CN201119216Y (en) | Water-cooling head structure of water-cooling type heat dissipation system | |
US20110192572A1 (en) | Heat exchanger | |
US7669642B1 (en) | Thermal module | |
TWI572273B (en) | Liquid cooling heat sink | |
US7086453B2 (en) | Integrated liquid cooling system for electrical components | |
WO2016173231A1 (en) | Heat exchange device and semiconductor refrigeration equipment having the heat exchange device | |
US20070044948A1 (en) | Water-cooled cooler for CPU of PC | |
KR101848151B1 (en) | Small heatsink | |
PH12018000121A1 (en) | Liquid-cooled cooling device with channel | |
US20100181886A1 (en) | Heat dissipating module | |
US10303229B2 (en) | Water-cooling heat dissipation module | |
US7047759B1 (en) | Liquid cooling system | |
TWI625834B (en) | Water-cooling radiator unit and water-cooling module using same | |
CN207911814U (en) | Water temperature controlled heat exchanger | |
KR101848152B1 (en) | Small heatsink for multi-thermoelectric elements |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WATER KING AUTO PARTS INCORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LU, JING-RON;REEL/FRAME:016566/0673 Effective date: 20050812 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |