US20060219919A1 - TEM sample holder and method of forming same - Google Patents
TEM sample holder and method of forming same Download PDFInfo
- Publication number
- US20060219919A1 US20060219919A1 US11/433,850 US43385006A US2006219919A1 US 20060219919 A1 US20060219919 A1 US 20060219919A1 US 43385006 A US43385006 A US 43385006A US 2006219919 A1 US2006219919 A1 US 2006219919A1
- Authority
- US
- United States
- Prior art keywords
- sample holder
- tem sample
- probe tip
- tem
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/2204—Specimen supports therefor; Sample conveying means therefore
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31749—Focused ion beam
Definitions
- This disclosure relates to the use of focused ion-beam (FIB) microscopes for the preparation of specimens for later analysis in the transmission electron microscope (TEM), and apparatus and methods to facilitate these activities.
- FIB focused ion-beam
- FIB focused ion-beam
- lift-out techniques include an “ex-situ” method that is performed outside the FIB chamber, and “in-situ” methods performed inside the FIB.
- the conventional process of in-situ lift-out can be simplified into three successive steps.
- the first is the excision of the sample using focused ion-beam milling and extraction of the sample from its trench.
- the second is the “holder-attach” step, during which the sample is translated on the probe-tip point to the TEM sample holder. Then it is attached to the TEM sample holder (typically with ion beam-induced metal deposition) and later detached from the probe-tip point.
- the third and final step is the thinning of the sample into an electron-transparent thin section using focused ion beam milling.
- a significant portion of the total time involved in completing a TEM sample with in-situ lift-out is spent during the holder-attach step.
- the relative amount of time involved depends on the amount of time required to mechanically isolate the lift-out sample from the initial bulk sample (ion beam milling rate), but will vary between 30% to 60% of the total time for TEM sample preparation.
- FIG. 1 is a perspective view of a typical TEM sample pre-form, in rectangular shape, also showing the shape of a TEM sample holder therein.
- FIG. 2 is a perspective view of a probe tip embedded into a TEM sample pre-form having a rectangular shape.
- FIG. 3 is a perspective view of a probe tip embedded into a TEM sample pre-form having a circular shape.
- FIG. 4 is a perspective view of a probe tip embedded into a TEM sample pre-form having a pennant-like shape, picked up by the grippers.
- FIG. 5 is a perspective view of the shear punch of a press, shown having engaged a probe tip embedded into a TEM sample pre-form of rectangular shape, located on the press platform.
- FIG. 6 is a cross-sectional view of a probe tip positioned in a press and engaged 2 by the former rod of the press.
- FIG. 7 is a cross-sectional view of a probe tip embedded in the material of a TEM sample pre-form.
- FIG. 8 is a cross-sectional view of a probe tip attached to a corrugated material 6 with electrical or thermal bonding.
- FIG. 9 is a cross-sectional view of a probe tip attached to the material using an adhesive.
- FIG. 10 is a cross-sectional view of the probe tip bonded to the TEM sample pre-form with CVD or an evaporated material.
- FIG. 11 is a transverse view of a corrugated material.
- FIG. 12 is a transverse view of a probe tip, embedded into a corrugated material.
- FIG. 13 is a flowchart showing the operational sequence of a preferred embodiment.
- the preferred embodiment includes a novel method and apparatus for joining a nano-manipulator probe tip ( 150 ) to a solid piece of material comprising a TEM sample holder pre-form ( 100 ).
- this mechanical process is performed outside the vacuum chamber, although it could be performed inside the FIB chamber as well.
- the step of embedding a probe tip ( 150 ) into the TEM sample holder pre-form ( 100 ) is completed outside the FIB, using the mechanical press described in the U.S. patent application Ser. No. 10/896,596.
- the TEM sample holder ( 210 ) with the probe tip ( 150 ) attached is formed before the attachment of an excised sample to the probe tip point ( 160 ), rather than afterwards.
- the assembly comprising the probe tip ( 150 ) attached to a TEM sample holder pre-form ( 100 ), can be picked up by the tweezers or grippers ( 350 ) and then transferred into the FIB for the in-situ lift-out procedure or for other purposes.
- This transfer can be accomplished by several means, including but not limited to, the transfer of the assembled TEM sample holder ( 210 ) through the sample door of a FIB equipped with a door, translation of the TEM sample holder ( 210 ) through a vacuum airlock on the nano-manipulator device, or the translation of the sample holder ( 210 ) in a cassette that passes through a vacuum airlock on the FIB chamber. All but the first means listed do not require that the FIB vacuum chamber be vented to atmosphere, which offers cycle time reduction and long-term equipment reliability advantages.
- the probe tip ( 150 ) is attached to a TEM sample holder pre-form ( 100 ) by a combined mechanical forming and cutting operation, as described in U.S. patent application Ser. No. 10/896,596.
- the TEM sample holder pre-form ( 100 ) is a sheet of material of approximately the same thickness as a standard TEM grid.
- this sheet of material can be of any suitable geometrical shape, but preferably it is of rectangular shape, as shown in FIG. 1 , a circular shape as shown in FIG. 3 , or a pennant-like shape, as shown in FIG. 4 .
- FIG. 1 shows how, in some embodiments, the resulting shape ( 110 ) of the TEM sample holder ( 210 ) is cut from the sample holder pre-form in the attachment step, described below.
- the shape of the pre-form ( 100 ) is the final shape of the assembled TEM sample holder ( 210 ).
- the probe tip ( 150 ) can be joined to the material that will form the TEM sample holder pre-form ( 100 ), so as to preserve the attachment between the probe tip ( 150 ) and this material, and prevent the probe tip ( 150 ) from separating from the TEM sample holder pre-form material ( 100 ) during transportation, storage or inspection in the TEM.
- the assembly should not interfere with the normal operation of the FIB, TEM, or other intended analytical instrument, and should survive well in the internal environment of the TEM, or other intended analytical instrument.
- the TEM sample holder pre-form ( 100 ) material is preferably soft copper, but may also be molybdenum, aluminum, gold, silver, nickel, beryllium, or copper coated with such metals, if appropriate to the application.
- FIGS. 2-4 show a nano-manipulator probe tip ( 150 ) placed across the TEM sample holder pre-form ( 100 ).
- the probe tip ( 150 ) has a probe-tip point ( 160 ) that holds a sample ( 140 ) for analysis.
- the probe-tip point ( 160 ) is a fine tungsten needle.
- the TEM sample holder pre-form ( 100 ) may also be fabricated from a material harder than copper, such as molybdenum, or it may have a surface structure that facilitates the mechanical embedding of the probe tip ( 150 ) in the TEM sample holder pre-form ( 100 ) material, illustrated in FIGS. 11 and 12 and discussed below.
- FIGS. 5-12 show methods for joining the probe tip ( 150 ) to the TEM pre-form ( 100 ).
- FIG. 6 is a view of mechanical deformation of the material of the TEM sample holder pre-form material ( 100 ) or probe tip ( 150 ), or both, to embed the probe tip ( 150 ) into the material of the TEM sample pre-form.
- FIG. 5 shows the press previously described acting to embed a probe tip ( 150 ) into a TEM sample holder pre-form ( 100 ) to form the completed sample holder ( 210 ).
- the shear punch ( 270 ) moves downward carrying a former rod ( 250 ) that impacts the pre-form ( 100 ) and the probe tip ( 150 ). As shown in FIG.
- the former rod ( 250 ) presses the probe tip ( 150 ) into the pre-form material ( 100 ), preferably assisted with teeth ( 260 ) on the former rod ( 250 ) for holding the probe tip ( 150 ) and flowing the pre-form ( 100 ) material around it.
- FIGS. 6 and 7 show a cross-section of this operation and result. Excess parts of the TEM sample holder pre-form material ( 100 ), if any, are severed during the combined mechanical forming and cutting operation. In addition, the probe tip ( 150 ) is cut off substantially at the edge of the finished TEM sample holder ( 210 ).
- FIG. 8 depicts electrical or thermal bonding ( 320 ), such as welding, of the probe tip ( 150 ) to the TEM sample holder pre-form material ( 100 ).
- FIG. 8 also shows corrugations ( 175 ) in the TEM sample holder pre-form material.
- FIG. 9 shows bonding the probe tip ( 150 ) to the TEM sample holder pre-form material ( 100 ) with a suitable glue or adhesive ( 330 ).
- FIG. 10 shows bonding the probe tip ( 150 ) to the TEM sample holder pre-form material ( 100 ) with a CVD or evaporated material ( 340 ).
- FIGS. 11 and 12 show cross-sections of a corrugated structure with corrugations ( 175 ) having a period approximately the same or less than the probe tip ( 150 ) diameter.
- the corrugation period is about half the diameter of the probe tip ( 150 ).
- the corrugations ( 175 ) may be periodic, such as continuous rows or ridges roughly aligned in the direction of the probe tip, rows of individual posts, or non-periodic free-form elevations. These structures can be easily deformed to lock the probe tip ( 150 ) in place.
- the assembly of the TEM sample holder pre-form material ( 100 ) with the probe tip ( 150 ) attached to it can be picked up by the grippers or tweezers ( 350 ) (shown in FIG. 4 ) and transferred to the FIB for the in-situ lift-out operation.
- the in-situ lift-out process can be followed with the final thinning operation, during which the desired portion of the lift-out sample ( 140 ) or samples is thinned to electron transparency (typically 50-250 nm).
- This final thinning can be performed in an off-line FIB to maximize throughput of the in-line FIB and to take advantage of the efficiency, expertise and dedicated resources of the off-line FIB lab that can be located outside the clean room.
- the apparatus for attaching the probe tip ( 150 ) to a TEM sample holder pre-form ( 100 ) is located inside the FIB, the final thinning operation can be performed immediately after the in-situ lift-out operation. This process is shown as a flowchart in FIG. 13 .
- the probe tip ( 150 ) and the TEM sample pre-form ( 100 ) are permanently attached in step 360 , using the press as described above, forming the TEM sample holder ( 210 ).
- the completed sample holder ( 210 ) is grasped by grippers ( 350 ) in step 365 and transferred into the FIB chamber in step 370 .
- the in-situ lift-out of the sample of interest ( 140 ) is performed, including the attachment of the sample ( 140 ) to the probe tip point ( 160 ).
- the sample ( 140 ) may optionally be thinned before transfer outside the FIB.
- the sample holder ( 210 ) bearing the attached sample ( 140 ) is removed from the FIB, optionally for final thinning at step ( 390 ). Finally, at step 395 , the sample holder ( 210 ) with the attached sample ( 140 ) is transferred to a TEM or other instrument for inspection.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
- This continuation-in-part patent application claims the priority of U.S. application Ser. No. 10/896,596, filed Jul. 22, 2004, further claiming priority from U.S. provisional patent application No. 60/519,046, filed Nov. 11, 2003. Application Ser. No. 10/896,596 is incorporated into this continuation-in-part application by reference.
- This disclosure relates to the use of focused ion-beam (FIB) microscopes for the preparation of specimens for later analysis in the transmission electron microscope (TEM), and apparatus and methods to facilitate these activities.
- The use of focused ion-beam (FIB) microscopes has become common for the preparation of specimens for later analysis in the transmission electron microscope (TEM). The structural artifacts, and even some structural layers, in the device region and interconnect stack of current integrated-circuit devices can be too small to be reliably detected with the secondary electron imaging in a Scanning Electron Microscope (SEM), or FIB, which offers a bulk surface imaging resolution of approximately 3 nm. In comparison, TEM inspection offers much finer image resolution (<0.1 nm), but requires electron-transparent (<100 nm thick) sections of the sample mounted on 3 mm diameter grid disks.
- Techniques were later developed for cutting out and removing specimens for examination that required little or no preliminary mechanical preparation of the initial semiconductor die sample before preparation in the FIB. These lift-out techniques include an “ex-situ” method that is performed outside the FIB chamber, and “in-situ” methods performed inside the FIB.
- The conventional process of in-situ lift-out can be simplified into three successive steps. The first is the excision of the sample using focused ion-beam milling and extraction of the sample from its trench. The second is the “holder-attach” step, during which the sample is translated on the probe-tip point to the TEM sample holder. Then it is attached to the TEM sample holder (typically with ion beam-induced metal deposition) and later detached from the probe-tip point. The third and final step is the thinning of the sample into an electron-transparent thin section using focused ion beam milling.
- A significant portion of the total time involved in completing a TEM sample with in-situ lift-out is spent during the holder-attach step. The relative amount of time involved depends on the amount of time required to mechanically isolate the lift-out sample from the initial bulk sample (ion beam milling rate), but will vary between 30% to 60% of the total time for TEM sample preparation. In order to eliminate the holder-attach step, it would be desirable to directly join the probe tip to the material that will form the TEM sample holder, and thereafter attach the excised sample to the probe tip of the newly-formed TEM sample holder. This newly created assembly is robust and easy to pick up with the tweezers, allowing smooth transfer inside and outside the FIB without the necessity to vent the FIB vacuum chamber.
-
FIG. 1 is a perspective view of a typical TEM sample pre-form, in rectangular shape, also showing the shape of a TEM sample holder therein. -
FIG. 2 is a perspective view of a probe tip embedded into a TEM sample pre-form having a rectangular shape. -
FIG. 3 is a perspective view of a probe tip embedded into a TEM sample pre-form having a circular shape. -
FIG. 4 is a perspective view of a probe tip embedded into a TEM sample pre-form having a pennant-like shape, picked up by the grippers. -
FIG. 5 is a perspective view of the shear punch of a press, shown having engaged a probe tip embedded into a TEM sample pre-form of rectangular shape, located on the press platform. -
FIG. 6 is a cross-sectional view of a probe tip positioned in a press and engaged 2 by the former rod of the press. -
FIG. 7 is a cross-sectional view of a probe tip embedded in the material of a TEM sample pre-form. -
FIG. 8 is a cross-sectional view of a probe tip attached to a corrugated material 6 with electrical or thermal bonding. -
FIG. 9 is a cross-sectional view of a probe tip attached to the material using an adhesive. -
FIG. 10 is a cross-sectional view of the probe tip bonded to the TEM sample pre-form with CVD or an evaporated material. -
FIG. 11 is a transverse view of a corrugated material. -
FIG. 12 is a transverse view of a probe tip, embedded into a corrugated material. -
FIG. 13 is a flowchart showing the operational sequence of a preferred embodiment. - The preferred embodiment includes a novel method and apparatus for joining a nano-manipulator probe tip (150) to a solid piece of material comprising a TEM sample holder pre-form (100). In the preferred embodiment, this mechanical process is performed outside the vacuum chamber, although it could be performed inside the FIB chamber as well. In the preferred embodiment, the step of embedding a probe tip (150) into the TEM sample holder pre-form (100) is completed outside the FIB, using the mechanical press described in the U.S. patent application Ser. No. 10/896,596. In the present disclosure, however, the TEM sample holder (210) with the probe tip (150) attached is formed before the attachment of an excised sample to the probe tip point (160), rather than afterwards.
- The assembly comprising the probe tip (150) attached to a TEM sample holder pre-form (100), can be picked up by the tweezers or grippers (350) and then transferred into the FIB for the in-situ lift-out procedure or for other purposes. This transfer can be accomplished by several means, including but not limited to, the transfer of the assembled TEM sample holder (210) through the sample door of a FIB equipped with a door, translation of the TEM sample holder (210) through a vacuum airlock on the nano-manipulator device, or the translation of the sample holder (210) in a cassette that passes through a vacuum airlock on the FIB chamber. All but the first means listed do not require that the FIB vacuum chamber be vented to atmosphere, which offers cycle time reduction and long-term equipment reliability advantages.
- In the preferred embodiment, the probe tip (150) is attached to a TEM sample holder pre-form (100) by a combined mechanical forming and cutting operation, as described in U.S. patent application Ser. No. 10/896,596. As shown in
FIG. 1 , the TEM sample holder pre-form (100) is a sheet of material of approximately the same thickness as a standard TEM grid. In the preferred embodiment, this sheet of material can be of any suitable geometrical shape, but preferably it is of rectangular shape, as shown inFIG. 1 , a circular shape as shown inFIG. 3 , or a pennant-like shape, as shown inFIG. 4 . One of such shapes could be cut from the other during the combined mechanical forming and cutting operation, as described in the incorporated application, where the TEM sample holder pre-form (100) is referred to as a “coupon.” This new assembly (210), shown inFIGS. 2-4 , can be easily picked up using grippers or tweezers (350) and transferred into the FIB for an attachment of a lift-out sample (140), or placed into a standard cassette.FIG. 1 shows how, in some embodiments, the resulting shape (110) of the TEM sample holder (210) is cut from the sample holder pre-form in the attachment step, described below. In other embodiments, the shape of the pre-form (100) is the final shape of the assembled TEM sample holder (210). - The probe tip (150) can be joined to the material that will form the TEM sample holder pre-form (100), so as to preserve the attachment between the probe tip (150) and this material, and prevent the probe tip (150) from separating from the TEM sample holder pre-form material (100) during transportation, storage or inspection in the TEM. The assembly should not interfere with the normal operation of the FIB, TEM, or other intended analytical instrument, and should survive well in the internal environment of the TEM, or other intended analytical instrument.
- The TEM sample holder pre-form (100) material is preferably soft copper, but may also be molybdenum, aluminum, gold, silver, nickel, beryllium, or copper coated with such metals, if appropriate to the application.
FIGS. 2-4 show a nano-manipulator probe tip (150) placed across the TEM sample holder pre-form (100). The probe tip (150) has a probe-tip point (160) that holds a sample (140) for analysis. Typically, the probe-tip point (160) is a fine tungsten needle. - The TEM sample holder pre-form (100) may also be fabricated from a material harder than copper, such as molybdenum, or it may have a surface structure that facilitates the mechanical embedding of the probe tip (150) in the TEM sample holder pre-form (100) material, illustrated in
FIGS. 11 and 12 and discussed below. - Excess parts of the TEM sample holder pre-form material (100), if any, are severed during the combined mechanical forming and cutting operation, described in the U.S. patent application Ser. No. 10/896,596. In addition, the probe tip (150) is cut off substantially at the edge of the finished TEM sample holder (210).
-
FIGS. 5-12 show methods for joining the probe tip (150) to the TEM pre-form (100).FIG. 6 is a view of mechanical deformation of the material of the TEM sample holder pre-form material (100) or probe tip (150), or both, to embed the probe tip (150) into the material of the TEM sample pre-form.FIG. 5 shows the press previously described acting to embed a probe tip (150) into a TEM sample holder pre-form (100) to form the completed sample holder (210). The shear punch (270) moves downward carrying a former rod (250) that impacts the pre-form (100) and the probe tip (150). As shown inFIG. 6 , the former rod (250) presses the probe tip (150) into the pre-form material (100), preferably assisted with teeth (260) on the former rod (250) for holding the probe tip (150) and flowing the pre-form (100) material around it.FIGS. 6 and 7 show a cross-section of this operation and result. Excess parts of the TEM sample holder pre-form material (100), if any, are severed during the combined mechanical forming and cutting operation. In addition, the probe tip (150) is cut off substantially at the edge of the finished TEM sample holder (210). -
FIG. 8 depicts electrical or thermal bonding (320), such as welding, of the probe tip (150) to the TEM sample holder pre-form material (100).FIG. 8 also shows corrugations (175) in the TEM sample holder pre-form material.FIG. 9 shows bonding the probe tip (150) to the TEM sample holder pre-form material (100) with a suitable glue or adhesive (330).FIG. 10 shows bonding the probe tip (150) to the TEM sample holder pre-form material (100) with a CVD or evaporated material (340). -
FIGS. 11 and 12 show cross-sections of a corrugated structure with corrugations (175) having a period approximately the same or less than the probe tip (150) diameter. InFIG. 11 , the corrugation period is about half the diameter of the probe tip (150). The corrugations (175) may be periodic, such as continuous rows or ridges roughly aligned in the direction of the probe tip, rows of individual posts, or non-periodic free-form elevations. These structures can be easily deformed to lock the probe tip (150) in place. - Once the assembly of the TEM sample holder pre-form material (100) with the probe tip (150) attached to it has been created, it can be picked up by the grippers or tweezers (350) (shown in
FIG. 4 ) and transferred to the FIB for the in-situ lift-out operation. The in-situ lift-out process can be followed with the final thinning operation, during which the desired portion of the lift-out sample (140) or samples is thinned to electron transparency (typically 50-250 nm). This final thinning can be performed in an off-line FIB to maximize throughput of the in-line FIB and to take advantage of the efficiency, expertise and dedicated resources of the off-line FIB lab that can be located outside the clean room. However, if the apparatus for attaching the probe tip (150) to a TEM sample holder pre-form (100) is located inside the FIB, the final thinning operation can be performed immediately after the in-situ lift-out operation. This process is shown as a flowchart inFIG. 13 . - After initial system setup in
step 355, the probe tip (150) and the TEM sample pre-form (100) are permanently attached instep 360, using the press as described above, forming the TEM sample holder (210). The completed sample holder (210) is grasped by grippers (350) instep 365 and transferred into the FIB chamber instep 370. Inside the FIB, instep 375, the in-situ lift-out of the sample of interest (140) is performed, including the attachment of the sample (140) to the probe tip point (160). Atstep 380 the sample (140) may optionally be thinned before transfer outside the FIB. Atstep 385 the sample holder (210) bearing the attached sample (140) is removed from the FIB, optionally for final thinning at step (390). Finally, atstep 395, the sample holder (210) with the attached sample (140) is transferred to a TEM or other instrument for inspection. - Since those skilled in the art can modify the specific embodiments described above, we intend that the claims be interpreted to cover such modifications and equivalents.
Claims (41)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/433,850 US20060219919A1 (en) | 2003-11-11 | 2006-05-12 | TEM sample holder and method of forming same |
US12/391,552 US7935937B2 (en) | 2003-11-11 | 2009-02-24 | Method of forming TEM sample holder |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51904603P | 2003-11-11 | 2003-11-11 | |
US10/896,596 US7053383B2 (en) | 2003-11-11 | 2004-07-22 | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
US11/433,850 US20060219919A1 (en) | 2003-11-11 | 2006-05-12 | TEM sample holder and method of forming same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/896,596 Continuation-In-Part US7053383B2 (en) | 2003-11-11 | 2004-07-22 | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/391,552 Division US7935937B2 (en) | 2003-11-11 | 2009-02-24 | Method of forming TEM sample holder |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060219919A1 true US20060219919A1 (en) | 2006-10-05 |
Family
ID=46062843
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/433,850 Abandoned US20060219919A1 (en) | 2003-11-11 | 2006-05-12 | TEM sample holder and method of forming same |
US12/391,552 Expired - Fee Related US7935937B2 (en) | 2003-11-11 | 2009-02-24 | Method of forming TEM sample holder |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/391,552 Expired - Fee Related US7935937B2 (en) | 2003-11-11 | 2009-02-24 | Method of forming TEM sample holder |
Country Status (1)
Country | Link |
---|---|
US (2) | US20060219919A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080173813A1 (en) * | 2007-01-22 | 2008-07-24 | Fei Company | Manipulator for rotating and translating a sample holder |
US20080283768A1 (en) * | 2006-07-26 | 2008-11-20 | Fei Company | Transfer mechanism for transferring a specimen |
US20090146075A1 (en) * | 2007-10-18 | 2009-06-11 | Regents Of The University Of California | Motorized Manipulator for Positioning a TEM Specimen |
US20090294690A1 (en) * | 2003-11-11 | 2009-12-03 | Omniprobe, Inc. | Method of forming tem sample holder |
US20090320624A1 (en) * | 2008-06-27 | 2009-12-31 | Omniprobe, Inc. | Method for Preparing Specimens for Atom Probe Analysis and Specimen Assemblies Made Thereby |
CN103531425A (en) * | 2013-10-18 | 2014-01-22 | 上海华力微电子有限公司 | Fixing device for transmission electron microscope samples |
KR101564437B1 (en) * | 2014-02-05 | 2015-10-30 | 한국표준과학연구원 | A device for supporting a tip of a microscope |
KR101955846B1 (en) * | 2018-01-12 | 2019-03-08 | 한국표준과학연구원 | Clean eletronmicroscope holder for flow environment |
US20230090602A1 (en) * | 2021-09-21 | 2023-03-23 | Kioxia Corporation | Sample stand and method for manufacturing sample stand |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8604446B2 (en) * | 2011-08-08 | 2013-12-10 | The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Devices and methods for cryo lift-out with in situ probe |
US20140082920A1 (en) * | 2012-09-27 | 2014-03-27 | International Business Machines Corporation | High aspect ratio sample holder |
US10186397B2 (en) * | 2013-11-11 | 2019-01-22 | Howard Hughes Medical Institute | Workpiece holder for workpiece transport apparatus |
Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270552A (en) * | 1991-08-22 | 1993-12-14 | Hitachi, Ltd. | Method for separating specimen and method for analyzing the specimen separated by the specimen separating method |
US6080991A (en) * | 1998-06-18 | 2000-06-27 | United Microelectronics Corp. | Method for milling a transmission electron microscope test slice |
US6300631B1 (en) * | 1999-10-07 | 2001-10-09 | Lucent Technologies Inc. | Method of thinning an electron transparent thin film membrane on a TEM grid using a focused ion beam |
US20020000522A1 (en) * | 2000-06-21 | 2002-01-03 | Reza Alani | Ion beam milling system and method for electron microscopy specimen preparation |
US6523239B2 (en) * | 1999-05-25 | 2003-02-25 | J.L. Clark, Inc. | Die for assembling metal spool having high torque transmitting capacity between spool components |
US20030150836A1 (en) * | 2000-08-03 | 2003-08-14 | Lancy Tsung | Mass production of cross-section TEM samples by focused ion beam deposition and anisotropic etching |
US6664552B2 (en) * | 2000-11-06 | 2003-12-16 | Hitachi, Ltd. | Method and apparatus for specimen fabrication |
US20040004186A1 (en) * | 2002-07-08 | 2004-01-08 | Chartered Semiconductor Manufacturing Limited | Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization |
US20040016880A1 (en) * | 2002-04-18 | 2004-01-29 | Empa Eidg. Materialprufungs- Und Forschungsanstalt | Method for the preparation of a TEM lamella |
US6714289B2 (en) * | 2002-07-24 | 2004-03-30 | Suruga Seiki Co., Ltd. | Semiconductor device inspecting apparatus |
US6717156B2 (en) * | 2001-05-08 | 2004-04-06 | Hitachi, Ltd. | Beam as well as method and equipment for specimen fabrication |
US20040144924A1 (en) * | 2003-01-17 | 2004-07-29 | Peter Emile Stephan Joseph Asselbergs | Method for the manufacture and transmissive irradiation of a sample, and particle-optical system |
US20040164242A1 (en) * | 2003-02-15 | 2004-08-26 | Wolfgang Grunewald | Sample preparation for transmission electron microscopy |
US20040178372A1 (en) * | 2003-03-13 | 2004-09-16 | Jorgen Rasmussen | End effector for supporting a microsample |
US20040185586A1 (en) * | 2003-02-13 | 2004-09-23 | Masatoshi Yasutake | Preparation of sample chip, method of observing wall surface thereof and system therefor |
US6826971B2 (en) * | 2001-11-26 | 2004-12-07 | Renesas Technology Corp. | Fabrication method for sample to be analyzed |
US20040246465A1 (en) * | 2003-05-06 | 2004-12-09 | Kouji Iwasaki | Micro-sample pick-up apparatus and micro-sample pick-up method |
US20040245466A1 (en) * | 2000-08-03 | 2004-12-09 | Joseph Robinson | Transmission electron microscope sample preparation |
US20040251412A1 (en) * | 2003-06-13 | 2004-12-16 | Fei Company | Method and apparatus for manipulating a microscopic sample |
US20050001164A1 (en) * | 2000-11-02 | 2005-01-06 | Mitsuo Tokuda | Method and apparatus for processing a micro sample |
US20050035302A1 (en) * | 2003-08-01 | 2005-02-17 | Robert Morrison | Specimen tip and tip holder assembly |
US6870161B2 (en) * | 2002-08-30 | 2005-03-22 | Sii Nanotechnology Inc. | Apparatus for processing and observing a sample |
US20050178980A1 (en) * | 2003-09-23 | 2005-08-18 | Zyvex Corporation | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
US20060011867A1 (en) * | 2004-07-14 | 2006-01-19 | Applied Materials Israel Ltd | Method and apparatus for sample formation and microanalysis in a vacuum chamber |
US7053383B2 (en) * | 2003-11-11 | 2006-05-30 | Omniprobe, Inc. | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060219919A1 (en) * | 2003-11-11 | 2006-10-05 | Moore Thomas M | TEM sample holder and method of forming same |
US7126132B2 (en) * | 2004-07-22 | 2006-10-24 | Omniprobe, Inc. | Apparatus for preparing a TEM sample holder |
US7381971B2 (en) * | 2004-07-28 | 2008-06-03 | Omniprobe, Inc. | Method and apparatus for in-situ probe tip replacement inside a charged particle beam microscope |
US7395727B2 (en) * | 2004-07-28 | 2008-07-08 | Omniprobe, Inc. | Strain detection for automated nano-manipulation |
WO2006050495A2 (en) * | 2004-11-03 | 2006-05-11 | Omniprobe, Inc. | Method and apparatus for the automated process of in-situ lift-out |
US7423263B2 (en) * | 2006-06-23 | 2008-09-09 | Fei Company | Planar view sample preparation |
EP2095134B1 (en) * | 2006-10-20 | 2017-02-22 | FEI Company | Method and apparatus for sample extraction and handling |
US7834315B2 (en) * | 2007-04-23 | 2010-11-16 | Omniprobe, Inc. | Method for STEM sample inspection in a charged particle beam instrument |
CN102203780B (en) * | 2008-06-06 | 2014-06-25 | 沙特阿拉伯石油公司 | System and related methods for global targeting of process utilities under varying conditions |
US8288740B2 (en) * | 2008-06-27 | 2012-10-16 | Omniprobe, Inc. | Method for preparing specimens for atom probe analysis and specimen assemblies made thereby |
-
2006
- 2006-05-12 US US11/433,850 patent/US20060219919A1/en not_active Abandoned
-
2009
- 2009-02-24 US US12/391,552 patent/US7935937B2/en not_active Expired - Fee Related
Patent Citations (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270552A (en) * | 1991-08-22 | 1993-12-14 | Hitachi, Ltd. | Method for separating specimen and method for analyzing the specimen separated by the specimen separating method |
US6080991A (en) * | 1998-06-18 | 2000-06-27 | United Microelectronics Corp. | Method for milling a transmission electron microscope test slice |
US6523239B2 (en) * | 1999-05-25 | 2003-02-25 | J.L. Clark, Inc. | Die for assembling metal spool having high torque transmitting capacity between spool components |
US6300631B1 (en) * | 1999-10-07 | 2001-10-09 | Lucent Technologies Inc. | Method of thinning an electron transparent thin film membrane on a TEM grid using a focused ion beam |
US20020000522A1 (en) * | 2000-06-21 | 2002-01-03 | Reza Alani | Ion beam milling system and method for electron microscopy specimen preparation |
US20040217286A1 (en) * | 2000-06-21 | 2004-11-04 | Reza Alani | Ion beam milling system and method for electron microscopy specimen preparation |
US20030150836A1 (en) * | 2000-08-03 | 2003-08-14 | Lancy Tsung | Mass production of cross-section TEM samples by focused ion beam deposition and anisotropic etching |
US20040245466A1 (en) * | 2000-08-03 | 2004-12-09 | Joseph Robinson | Transmission electron microscope sample preparation |
US20050199828A1 (en) * | 2000-11-02 | 2005-09-15 | Mitsuo Tokuda | Method and apparatus for processing a micro sample |
US20050001164A1 (en) * | 2000-11-02 | 2005-01-06 | Mitsuo Tokuda | Method and apparatus for processing a micro sample |
US20050211927A1 (en) * | 2000-11-02 | 2005-09-29 | Mitsuo Tokuda | Method and apparatus for processing a micro sample |
US20050006600A1 (en) * | 2000-11-06 | 2005-01-13 | Hitachi, Ltd. | Method and apparatus for specimen fabrication |
US6664552B2 (en) * | 2000-11-06 | 2003-12-16 | Hitachi, Ltd. | Method and apparatus for specimen fabrication |
US6717156B2 (en) * | 2001-05-08 | 2004-04-06 | Hitachi, Ltd. | Beam as well as method and equipment for specimen fabrication |
US6826971B2 (en) * | 2001-11-26 | 2004-12-07 | Renesas Technology Corp. | Fabrication method for sample to be analyzed |
US20040016880A1 (en) * | 2002-04-18 | 2004-01-29 | Empa Eidg. Materialprufungs- Und Forschungsanstalt | Method for the preparation of a TEM lamella |
US20040004186A1 (en) * | 2002-07-08 | 2004-01-08 | Chartered Semiconductor Manufacturing Limited | Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization |
US6714289B2 (en) * | 2002-07-24 | 2004-03-30 | Suruga Seiki Co., Ltd. | Semiconductor device inspecting apparatus |
US6870161B2 (en) * | 2002-08-30 | 2005-03-22 | Sii Nanotechnology Inc. | Apparatus for processing and observing a sample |
US20040144924A1 (en) * | 2003-01-17 | 2004-07-29 | Peter Emile Stephan Joseph Asselbergs | Method for the manufacture and transmissive irradiation of a sample, and particle-optical system |
US20040185586A1 (en) * | 2003-02-13 | 2004-09-23 | Masatoshi Yasutake | Preparation of sample chip, method of observing wall surface thereof and system therefor |
US20040164242A1 (en) * | 2003-02-15 | 2004-08-26 | Wolfgang Grunewald | Sample preparation for transmission electron microscopy |
US20040178355A1 (en) * | 2003-03-13 | 2004-09-16 | Jorgen Rasmussen | Sample manipulation system |
US20040178372A1 (en) * | 2003-03-13 | 2004-09-16 | Jorgen Rasmussen | End effector for supporting a microsample |
US20040246465A1 (en) * | 2003-05-06 | 2004-12-09 | Kouji Iwasaki | Micro-sample pick-up apparatus and micro-sample pick-up method |
US20040251412A1 (en) * | 2003-06-13 | 2004-12-16 | Fei Company | Method and apparatus for manipulating a microscopic sample |
US20050035302A1 (en) * | 2003-08-01 | 2005-02-17 | Robert Morrison | Specimen tip and tip holder assembly |
US20050178980A1 (en) * | 2003-09-23 | 2005-08-18 | Zyvex Corporation | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
US7053383B2 (en) * | 2003-11-11 | 2006-05-30 | Omniprobe, Inc. | Method and apparatus for rapid sample preparation in a focused ion beam microscope |
US20060011867A1 (en) * | 2004-07-14 | 2006-01-19 | Applied Materials Israel Ltd | Method and apparatus for sample formation and microanalysis in a vacuum chamber |
US20060011868A1 (en) * | 2004-07-14 | 2006-01-19 | Applied Materials Israel Ltd | Method and apparatus for sample formation and microanalysis in a vacuum chamber |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7935937B2 (en) * | 2003-11-11 | 2011-05-03 | Omniprobe, In.c | Method of forming TEM sample holder |
US20090294690A1 (en) * | 2003-11-11 | 2009-12-03 | Omniprobe, Inc. | Method of forming tem sample holder |
US7888655B2 (en) * | 2006-07-26 | 2011-02-15 | Fei Company | Transfer mechanism for transferring a specimen |
US20080283768A1 (en) * | 2006-07-26 | 2008-11-20 | Fei Company | Transfer mechanism for transferring a specimen |
US7884326B2 (en) * | 2007-01-22 | 2011-02-08 | Fei Company | Manipulator for rotating and translating a sample holder |
US20080173813A1 (en) * | 2007-01-22 | 2008-07-24 | Fei Company | Manipulator for rotating and translating a sample holder |
US7851769B2 (en) | 2007-10-18 | 2010-12-14 | The Regents Of The University Of California | Motorized manipulator for positioning a TEM specimen |
US20090146075A1 (en) * | 2007-10-18 | 2009-06-11 | Regents Of The University Of California | Motorized Manipulator for Positioning a TEM Specimen |
US20090320624A1 (en) * | 2008-06-27 | 2009-12-31 | Omniprobe, Inc. | Method for Preparing Specimens for Atom Probe Analysis and Specimen Assemblies Made Thereby |
US8288740B2 (en) * | 2008-06-27 | 2012-10-16 | Omniprobe, Inc. | Method for preparing specimens for atom probe analysis and specimen assemblies made thereby |
CN103531425A (en) * | 2013-10-18 | 2014-01-22 | 上海华力微电子有限公司 | Fixing device for transmission electron microscope samples |
KR101564437B1 (en) * | 2014-02-05 | 2015-10-30 | 한국표준과학연구원 | A device for supporting a tip of a microscope |
KR101955846B1 (en) * | 2018-01-12 | 2019-03-08 | 한국표준과학연구원 | Clean eletronmicroscope holder for flow environment |
US20230090602A1 (en) * | 2021-09-21 | 2023-03-23 | Kioxia Corporation | Sample stand and method for manufacturing sample stand |
US12090624B2 (en) * | 2021-09-21 | 2024-09-17 | Kioxia Corporation | Sample stand and method for manufacturing sample stand |
Also Published As
Publication number | Publication date |
---|---|
US7935937B2 (en) | 2011-05-03 |
US20090294690A1 (en) | 2009-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7935937B2 (en) | Method of forming TEM sample holder | |
US7315023B2 (en) | Method of preparing a sample for examination in a TEM | |
US8011259B2 (en) | Sample carrier comprising a deformable strip of material folded back upon itself and sample holder | |
US7525087B2 (en) | Method for creating observational sample | |
US7375325B2 (en) | Method for preparing a sample for electron microscopic examinations, and sample supports and transport holders used therefor | |
US8258473B2 (en) | Method and apparatus for rapid preparation of multiple specimens for transmission electron microscopy | |
CN107860620B (en) | Transmission electron microscope sample and preparation method thereof | |
US7408178B2 (en) | Method for the removal of a microscopic sample from a substrate | |
US7053383B2 (en) | Method and apparatus for rapid sample preparation in a focused ion beam microscope | |
US20060017016A1 (en) | Method for the removal of a microscopic sample from a substrate | |
US8288740B2 (en) | Method for preparing specimens for atom probe analysis and specimen assemblies made thereby | |
JP2003194681A (en) | Tem sample preparation method | |
JP2008122114A (en) | Preparation method of sample for atom probe analysis by fib, and device for executing the method | |
EP1868225A1 (en) | Sample carrier and sample holder | |
CN114858828A (en) | Preparation method of transmission electron microscope sample | |
JP2003156418A (en) | Method of preparing analytical sample, analytical method, and analytical sample therefor | |
JP2004179038A (en) | Fixing method of sample for transmission electron microscope and sample table | |
EP1612836B1 (en) | Method for the removal of a microscopic sample from a substrate | |
EP1612837B1 (en) | Method for the removal of a microscopic sample from a substrate | |
JP2024022515A (en) | Transmission type electron microscope-purpose sample manufacturing method | |
JP2012163487A (en) | Processing method and analyzing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OMNIPROBE, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOORE, THOMAS M.;AMADOR, GONZALO;ZAYKOVA-FELDMAN, LYUDMILA;REEL/FRAME:018042/0161 Effective date: 20060504 |
|
AS | Assignment |
Owner name: OMNIPROBE, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOORE, THOMAS M.;AMADOR, GONZALO;ZAYKOVA-FELDMAN, LYUDMILA;REEL/FRAME:018079/0243 Effective date: 20060504 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |