US20060156739A1 - Heating and cooling appliance for use in a vehicle - Google Patents
Heating and cooling appliance for use in a vehicle Download PDFInfo
- Publication number
- US20060156739A1 US20060156739A1 US11/035,886 US3588605A US2006156739A1 US 20060156739 A1 US20060156739 A1 US 20060156739A1 US 3588605 A US3588605 A US 3588605A US 2006156739 A1 US2006156739 A1 US 2006156739A1
- Authority
- US
- United States
- Prior art keywords
- heat
- vehicle
- semiconductor chip
- box
- outside surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 27
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000012530 fluid Substances 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 3
- 235000020965 cold beverage Nutrition 0.000 description 2
- 235000012171 hot beverage Nutrition 0.000 description 2
- 210000000038 chest Anatomy 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2303/00—Details of devices using other cold materials; Details of devices using cold-storage bodies
- F25D2303/08—Devices using cold storage material, i.e. ice or other freezable liquid
- F25D2303/083—Devices using cold storage material, i.e. ice or other freezable liquid using cold storage material disposed in closed wall forming part of a container for products to be cooled
- F25D2303/0832—Devices using cold storage material, i.e. ice or other freezable liquid using cold storage material disposed in closed wall forming part of a container for products to be cooled the liquid is disposed in an accumulator pack locked in a closable wall forming part of the container
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
- F25D2331/80—Type of cooled receptacles
- F25D2331/804—Boxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
- F25D2331/80—Type of cooled receptacles
- F25D2331/805—Cans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
- F25D2331/80—Type of cooled receptacles
- F25D2331/809—Holders
Definitions
- the present invention relates to a heating and cooling appliance, especially to a heating and cooling appliance for use in a vehicle.
- the present invention provides a heating and cooling appliance for use in a vehicle to mitigate or obviate the aforementioned problems.
- the main objective of the present invention is to provide a heating and cooling appliance for use in a vehicle.
- the heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly.
- the outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch.
- the thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall.
- the inner box is mounted in the thermal box.
- the semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch on the outer box.
- the heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
- FIG. 1 is a perspective of a heating and cooling appliance for use in a vehicle in accordance with the present invention with four drink cans;
- FIG. 2 is a partially exploded perspective view of the heating and cooling appliance in FIG. 1 with four drink cans;
- FIG. 3 is an exploded perspective view of the heating and cooling appliance in FIG. 1 without the outer box and with four drink cans;
- FIG. 4 is a side view in partial section of the heating and cooling appliance in FIG. 1 ;
- FIG. 5 is an operational perspective view of a vehicle interior with two heating and cooling appliances in FIG. 1 mounted in the vehicle;
- FIG. 6 is a top view of a vehicle interior with three heating and cooling appliances in FIG. 1 mounted in the vehicle.
- a heating and cooling appliance for use in a vehicle in accordance with the present invention comprises an outer box ( 10 ), a thermal box ( 20 ), an inner box ( 30 ), at least one semiconductor chip ( 40 ) and at, least one heatsink assembly ( 50 ).
- the outer box ( 10 ) is mounted in a vehicle to conform to interior equipment and furnishings of the vehicle and has a top, four sides, an inner space, an opening, a switch ( 11 ) and at least one vent ( 12 ).
- the outer box can be an armrest, a bucket seat console or the like.
- the opening is formed in the top and communicates with the inner space.
- the switch ( 11 ) is mounted on the top and can be pressed to turn off the heating and cooling appliance or activate either a heating mode or a cooling mode.
- the at least one vent ( 42 ) is formed uniquely in a side.
- the thermal box ( 20 ) is hollow, is mounted in the inner space through the opening in the outer box ( 10 ) and has four outer sidewalls, a top opening, a top edge, multiple insulated walls ( 21 ) and at least one heat-conducting wall ( 22 ).
- the insulated walls ( 21 ) are formed in the outer sidewalls.
- Each heat-conducting wall ( 22 ) is formed in an insulated wall ( 21 ) and corresponds uniquely to a vent ( 12 ).
- the inner box ( 30 ) is hollow, is mounted through the top opening in the thermal box ( 20 ) and has a top opening, a top edge, an outer sidewall, an optional flange ( 31 ) and an optional fluid passage ( 32 ).
- the flange ( 31 ) is formed on and extends out perpendicular from the top edge of the inner box ( 30 ) and attaches to the top edge of the thermal box ( 20 ).
- the fluid passage ( 32 ) is formed around the outer sidewall of the inner box ( 30 ) and is filled with a heat-conducting fluid.
- Each semiconductor chip ( 40 ) is attached uniquely to a heat-conducting wall ( 22 ), corresponds to the fluid passage ( 32 ), electrically connects to the switch ( 11 ) and has an inside surface, an outside surface and heatsink grease ( 41 ). The inside surface is attached to the heat-conducting wall ( 22 ). The heatsink grease ( 41 ) is spread on the outside surface.
- Changing the position of the switch ( 11 ) will change the operation mode of the semiconductor chip ( 40 ).
- the semiconductor chip ( 40 ) stops operating.
- the semiconductor chip ( 40 ) When the switch ( 11 ) is the heating position, the semiconductor chip ( 40 ) generates heat.
- the semiconductor chip ( 40 ) cools.
- each heatsink assembly ( 50 ) is attached to the outside surface of the corresponding semiconductor chip ( 40 ), is mounted securely on the corresponding heat-conducting wall ( 22 ) and has a heatsink fin assembly ( 51 ) and a fan ( 52 ).
- the heatsink fin assembly ( 51 ) is attached to the outside surface of the semiconductor chip ( 40 ), is attached to the corresponding heat-conducting wall ( 22 ) and has a base ( 511 ) and multiple fins ( 512 ).
- the base ( 511 ) is attached to the outside surface of the semiconductor chip ( 40 ), is attached to the corresponding heat-conducting wall ( 22 ) and has an inside surface and an outside surface.
- the inside surface is attached to the outside surface of the semiconductor chip ( 40 ).
- the fins ( 512 ) are formed on the outside surface of the base ( 511 ) and have a distal end.
- the fan ( 52 ) is mounted securely on the distal end of the fins ( 512 ) and electrically connects to the switch ( 11 ). When the switch ( 11 ) is in the heating position, the fan ( 52 ) blows heat from the fins ( 512 ) out the vent ( 12 ).
- the heating and cooling appliance as described has numerous advantages.
- the outer box ( 10 ) conforms to the interior equipment and furnishings of the vehicle and does not occupy unnecessary spaces.
- the switch ( 11 ) can change the operation way of the semiconductor chip ( 40 ). Then the semiconductor chip ( 40 ) can give out heat or cold as the user wish.
- the heating and cooling appliance has multiple semiconductor chips, and the inner box has the fluid passage so the heating or cooling effects will be distributed evenly.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly. The outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch. The thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall. The inner box is mounted in the thermal box. The semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch. The heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
Description
- 1. Field of the Invention
- The present invention relates to a heating and cooling appliance, especially to a heating and cooling appliance for use in a vehicle.
- 2. Description of the Prior Arts
- When people drive or take trips in vehicles, people often bring hot drinks or cold drinks onto the vehicles. The hot drinks and the cold drinks quickly approach ambient temperature in the vehicles unless placed in a heating or cooling appliance. However, heating chests and portable refrigerators occupy a large volume in vehicles.
- To overcome the shortcomings, the present invention provides a heating and cooling appliance for use in a vehicle to mitigate or obviate the aforementioned problems.
- The main objective of the present invention is to provide a heating and cooling appliance for use in a vehicle. The heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly. The outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch. The thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall. The inner box is mounted in the thermal box. The semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch on the outer box. The heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
- Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
-
FIG. 1 is a perspective of a heating and cooling appliance for use in a vehicle in accordance with the present invention with four drink cans; -
FIG. 2 is a partially exploded perspective view of the heating and cooling appliance inFIG. 1 with four drink cans; -
FIG. 3 is an exploded perspective view of the heating and cooling appliance inFIG. 1 without the outer box and with four drink cans; -
FIG. 4 is a side view in partial section of the heating and cooling appliance inFIG. 1 ; -
FIG. 5 is an operational perspective view of a vehicle interior with two heating and cooling appliances inFIG. 1 mounted in the vehicle; and -
FIG. 6 is a top view of a vehicle interior with three heating and cooling appliances inFIG. 1 mounted in the vehicle. - With reference to
FIGS. 1, 2 and 3, a heating and cooling appliance for use in a vehicle in accordance with the present invention comprises an outer box (10), a thermal box (20), an inner box (30), at least one semiconductor chip (40) and at, least one heatsink assembly (50). - With further reference to
FIGS. 5 and 6 , the outer box (10) is mounted in a vehicle to conform to interior equipment and furnishings of the vehicle and has a top, four sides, an inner space, an opening, a switch (11) and at least one vent (12). The outer box can be an armrest, a bucket seat console or the like. The opening is formed in the top and communicates with the inner space. The switch (11) is mounted on the top and can be pressed to turn off the heating and cooling appliance or activate either a heating mode or a cooling mode. The at least one vent (42) is formed uniquely in a side. - The thermal box (20) is hollow, is mounted in the inner space through the opening in the outer box (10) and has four outer sidewalls, a top opening, a top edge, multiple insulated walls (21) and at least one heat-conducting wall (22). The insulated walls (21) are formed in the outer sidewalls. Each heat-conducting wall (22) is formed in an insulated wall (21) and corresponds uniquely to a vent (12).
- The inner box (30) is hollow, is mounted through the top opening in the thermal box (20) and has a top opening, a top edge, an outer sidewall, an optional flange (31) and an optional fluid passage (32). The flange (31) is formed on and extends out perpendicular from the top edge of the inner box (30) and attaches to the top edge of the thermal box (20). The fluid passage (32) is formed around the outer sidewall of the inner box (30) and is filled with a heat-conducting fluid.
- Each semiconductor chip (40) is attached uniquely to a heat-conducting wall (22), corresponds to the fluid passage (32), electrically connects to the switch (11) and has an inside surface, an outside surface and heatsink grease (41). The inside surface is attached to the heat-conducting wall (22). The heatsink grease (41) is spread on the outside surface. Changing the position of the switch (11) will change the operation mode of the semiconductor chip (40). When the switch (11) is in the closed position, the semiconductor chip (40) stops operating. When the switch (11) is the heating position, the semiconductor chip (40) generates heat. When the switch (11) is in the cooling position, the semiconductor chip (40) cools.
- With further reference to
FIG. 4 , each heatsink assembly (50) is attached to the outside surface of the corresponding semiconductor chip (40), is mounted securely on the corresponding heat-conducting wall (22) and has a heatsink fin assembly (51) and a fan (52). The heatsink fin assembly (51) is attached to the outside surface of the semiconductor chip (40), is attached to the corresponding heat-conducting wall (22) and has a base (511) and multiple fins (512). The base (511) is attached to the outside surface of the semiconductor chip (40), is attached to the corresponding heat-conducting wall (22) and has an inside surface and an outside surface. The inside surface is attached to the outside surface of the semiconductor chip (40). The fins (512) are formed on the outside surface of the base (511) and have a distal end. The fan (52) is mounted securely on the distal end of the fins (512) and electrically connects to the switch (11). When the switch (11) is in the heating position, the fan (52) blows heat from the fins (512) out the vent (12). - The heating and cooling appliance as described has numerous advantages. The outer box (10) conforms to the interior equipment and furnishings of the vehicle and does not occupy unnecessary spaces. The switch (11) can change the operation way of the semiconductor chip (40). Then the semiconductor chip (40) can give out heat or cold as the user wish. When the heating and cooling appliance has multiple semiconductor chips, and the inner box has the fluid passage so the heating or cooling effects will be distributed evenly.
- Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (4)
1. A heating and cooling appliance in a vehicle comprising
an outer box adapted to be mounted in a vehicle to conform to interior equipment and furnishings of the vehicle and having
a top;
four sides;
an inner space;
an opening formed in the top and communicating with the inner space;
a switch mounted on the top; and
at least one vent formed in a side;
a thermal box being hollow, mounted in the inner space through the opening in the outer box and having
four outer sidewalls;
a top opening;
a top edge;
multiple insulated walls formed in the outer sidewalls; and
at least one heat-conducting wall, and each heat-conducting wall formed in one of the heat insulated walls and corresponding to the at least one vent;
an inner box being hollow, mounted through the top opening in the thermal box and having
a top opening;
a top edge; and
an outer sidewall;
at least one semiconductor chip, and each semiconductor chip attached to the at least one heat-conducting wall, electrically connecting to the switch and having
an inside surface attached to the heat-conducting wall;
an outside surface; and
heatsink grease spread on the outside surface; and
at least one heatsink assembly, and each heatsink assembly attached to the outside surface of one of the at least one semiconductor chip, mounted securely on a one of the at least one heat-conducting wall and having
a heatsink fin assembly attached to the outside surface of the corresponding semiconductor chip, attached to the corresponding heat-conducting wall and having
a base attached to the outside surface of the corresponding semiconductor chip, mounted securely on the corresponding heat-conducting wall and having
an inside surface attached to the outside surface of the corresponding semiconductor chip; and
an outside surface; and
multiple fins formed on the outside surface of the base and having a distal end; and
a fan mounted securely on the distal end of the fins and electrically connecting to the switch.
2. The heating and cooling appliance in a vehicle as claimed in claim 1 , wherein the inner box further has a flange formed on and extending out perpendicular from the top edge of the inner box.
3. The heating and cooling appliance in a vehicle as claimed in claim 1 , wherein the inner box further has a fluid passage formed around the outer sidewall of the inner box and filled with a heat-conducting fluid.
4. The heating and cooling appliance in a vehicle as claimed in claim 2 , wherein the inner box further has a fluid passage formed around the outer sidewall of the inner box and filled with a heat-conducting fluid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/035,886 US20060156739A1 (en) | 2005-01-18 | 2005-01-18 | Heating and cooling appliance for use in a vehicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/035,886 US20060156739A1 (en) | 2005-01-18 | 2005-01-18 | Heating and cooling appliance for use in a vehicle |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060156739A1 true US20060156739A1 (en) | 2006-07-20 |
Family
ID=36682429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/035,886 Abandoned US20060156739A1 (en) | 2005-01-18 | 2005-01-18 | Heating and cooling appliance for use in a vehicle |
Country Status (1)
Country | Link |
---|---|
US (1) | US20060156739A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140175844A1 (en) * | 2012-12-21 | 2014-06-26 | Hyundai Motor Company | Armrest for vehicle |
US20170036586A1 (en) * | 2015-08-03 | 2017-02-09 | Lawrence Jones | Vehicular thermal device |
US20200047654A1 (en) * | 2017-02-15 | 2020-02-13 | Gentherm Incorporated | Improved control systems and methods for thermally conditioned receptacles |
CN115036527A (en) * | 2022-06-13 | 2022-09-09 | 上海卓微氢科技有限公司 | Heating and cooling system of fuel cell and control method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4364234A (en) * | 1981-03-25 | 1982-12-21 | Koolatron Industries, Ltd. | Control circuitry for thermoelectric environmental chamber |
US5927091A (en) * | 1998-07-10 | 1999-07-27 | Hong; Wen-Hu | Dual-purpose refrigerator for use on an automobile |
US20040068992A1 (en) * | 2000-11-02 | 2004-04-15 | Cauchy Charles J. | Temperature-controlled storage system |
US7007494B2 (en) * | 2004-07-23 | 2006-03-07 | Al Rashidi Falah M | Portable food storage container |
-
2005
- 2005-01-18 US US11/035,886 patent/US20060156739A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4364234A (en) * | 1981-03-25 | 1982-12-21 | Koolatron Industries, Ltd. | Control circuitry for thermoelectric environmental chamber |
US5927091A (en) * | 1998-07-10 | 1999-07-27 | Hong; Wen-Hu | Dual-purpose refrigerator for use on an automobile |
US20040068992A1 (en) * | 2000-11-02 | 2004-04-15 | Cauchy Charles J. | Temperature-controlled storage system |
US7007494B2 (en) * | 2004-07-23 | 2006-03-07 | Al Rashidi Falah M | Portable food storage container |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140175844A1 (en) * | 2012-12-21 | 2014-06-26 | Hyundai Motor Company | Armrest for vehicle |
US8944499B2 (en) * | 2012-12-21 | 2015-02-03 | Hyundai Motor Company | Armrest for vehicle |
US20170036586A1 (en) * | 2015-08-03 | 2017-02-09 | Lawrence Jones | Vehicular thermal device |
US20200047654A1 (en) * | 2017-02-15 | 2020-02-13 | Gentherm Incorporated | Improved control systems and methods for thermally conditioned receptacles |
CN115036527A (en) * | 2022-06-13 | 2022-09-09 | 上海卓微氢科技有限公司 | Heating and cooling system of fuel cell and control method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |