US20060038485A1 - Laminated light-emitting diode display device and manufacturing method thereof - Google Patents
Laminated light-emitting diode display device and manufacturing method thereof Download PDFInfo
- Publication number
- US20060038485A1 US20060038485A1 US10/920,306 US92030604A US2006038485A1 US 20060038485 A1 US20060038485 A1 US 20060038485A1 US 92030604 A US92030604 A US 92030604A US 2006038485 A1 US2006038485 A1 US 2006038485A1
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- United States
- Prior art keywords
- display device
- insulator
- light
- circuits
- circuitry unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000012212 insulator Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 238000005234 chemical deposition Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910052754 neon Inorganic materials 0.000 description 10
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000004075 alteration Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a laminated light-emitting diode display device and a manufacturing method thereof, and more particularly, to a laminated light-emitting diode display device having the circuitry unit printed on the insulator for driving SMT-type light-emitting diodes to emit light in order to display characters or graphics.
- FIG. 1 of a schematic diagram illustrating a conventional light series 8 .
- the light series 8 includes a power core 81 , light bulbs 82 and bulb receptors 83 .
- the light series 8 could be placed on somewhere in accordance with users' preferences and arranged in users' preferred manners in order to display desired characters or graphics.
- FIG. 2 a schematic diagram showing a conventional neon lamp 9 .
- the neon lamp 9 consists of neon light lamps 91 and a decorative plate 92 having the neon light lamp placed thereon.
- Neon light lamps 91 can be arranged as preferred characters or graphics.
- the aforementioned light series 8 or neon lamp 9 has its own thickness and occupies a specific volume, and thus is not capable of being adhered in some locations under certain conditions, therefore limiting its application.
- light bulbs 92 of the conventional light series 8 or neon light lamps 91 of the conventional neon lamp 9 are connected to each other through wires, making the assembly process for both more complicated and rendering the manufacturing more time-consuming.
- the present invention display device comprises a laminated design so as to reduce effectively the thickness as a whole and facilitate the placement thereof. Meanwhile, the assembly process for the present invention display device is not that time-consuming, compared to that the prior art light series or neon lamp, and thus leads to less manufacturing effort.
- the laminated light-emitting diode display device includes an insulator, a circuitry device placed on the insulator and consisting of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
- the present invention further provides a corresponding manufacturing method for the laminated light-emitting diode display device.
- the manufacturing method includes steps of preparing an insulator, placing a circuitry unit having a plurality of circuits on the insulator, and electrically connecting a plurality of SMT-type light-emitting diodes to the circuits of the circuitry unit.
- FIG. 1 is a schematic diagram showing a conventional light series
- FIG. 2 is a schematic diagram showing a conventional neon lamp
- FIG. 3 is a schematic diagram showing a laminated light-emitting diode display device according to the present invention.
- FIG. 3A is a schematic diagram partially detailing part A in FIG. 3 ;
- FIG. 4 is a top view of the laminated light-emitting diode display device according to the present invention.
- FIG. 5 shows the operation status of the laminated light-emitting diode display device according to the present invention
- FIG. 6 is a top view of another preferred embodiment according to the present invention.
- FIG. 7 shows a flow chart of the manufacturing method for the laminated light-emitting diode display device according to the present invention.
- the present invention display device includes an insulator 1 , a circuitry unit 2 and a plurality of light-emitting diodes 3 .
- the insulator is made of a glass, a paper or a transparent plastic thin film.
- the shape of the insulator is not limited and thus can be in a variety of different forms in practical use.
- the preferred embodiment 1 is in the form of a rectangle.
- the circuitry unit 2 is placed upon the insulator 1 by printing, electroplating or chemical deposition.
- the circuitry unit 2 consists of a plurality of circuits 21 made of highly conductive materials.
- the arrangement of circuits 21 is not specifically limited and changes based on practical use along with the placement of light-emitting diodes 3 .
- the circuitry unit 2 further connects to appropriate power sources.
- Light-emitting diodes 3 are SMT-type light-emitting diodes, meaning light-emitting diodes 3 are capable of being adhered to circuits 21 of the circuitry unit 2 (shown in FIG. 3A ). Under this configuration, light-emitting diodes 3 are placed on the insulator 1 and electrically connect to the circuitry unit 2 , which serves as a power source for light-emitting diodes 3 . The number and arrangement of these light-emitting diodes 3 are not limited either. Light-emitting diodes 3 can be arranged as characters or graphics and in the present embodiment they are arranged as English characters.
- circuits 21 of the circuitry unit 2 further electrically connect to a plurality of resistors 4 providing the protection of the circuit.
- Circuits 21 further electrically connect to a controlling integrated circuit (IC) 5 controlling the on/off of these light-emitting diodes 3 and thus providing the on/off variance of these light-emitting diodes 3 .
- a protective thin film 6 further encapsulates the insulator, the circuitry unit 2 , light-emitting diodes 3 , resistors 4 and the controlling IC 5 for dust and waterproofing.
- FIG. 6 a schematic diagram showing a solar power-generating device 7 on the insulator 1 .
- the solar-power-generating device 7 includes a solar power plate 71 electrically connected to circuits 21 of the circuitry unit 2 , whereby solar energy powers the display device.
- the present invention primarily provides a laminated light-emitting diode display device having the circuitry unit 2 printed on the insulator 1 , SMT-type light-emitting diodes 3 and the power source in order to display desired characters or graphics (shown in FIG. 5 ).
- the laminated light-emitting diode display device according to the present invention is comparatively thin and thus is easily packed and stored, as well as being applicable in many occasions.
- FIG. 7 of a flow chart of the present invention manufacturing method for the laminated light-emitting diode display device.
- the manufacturing method includes steps of (a) preparing an insulator 1 (shown in FIGS. 3 and 4 ) made of a glass, paper or transparent plastic thin film, (b) placing a circuitry unit 2 having a plurality of circuits 21 on the insulator 1 by printing, electroplating or chemical deposition, (c) electrically connecting a plurality of SMT-type light-emitting diodes 3 to the circuits 21 of the circuitry unit 2 , in which these SMT-type light-emitting diodes 3 are adhered to circuits 2 through the SMT, (d) electrically connecting a plurality of resistors 4 and a controlling IC 5 to circuits 2 of the circuitry unit 2 , with resistors 4 and the controlling IC are placed on the insulator 1 , and (e) encapsulating the insulator 1 , circuitry unit 2 , light-emitting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
Description
- 1. Field of the Invention
- The present invention relates to a laminated light-emitting diode display device and a manufacturing method thereof, and more particularly, to a laminated light-emitting diode display device having the circuitry unit printed on the insulator for driving SMT-type light-emitting diodes to emit light in order to display characters or graphics.
- 2. Description of Prior Arts
- Reference is made to
FIG. 1 of a schematic diagram illustrating aconventional light series 8. Thelight series 8 includes apower core 81,light bulbs 82 andbulb receptors 83. Thelight series 8 could be placed on somewhere in accordance with users' preferences and arranged in users' preferred manners in order to display desired characters or graphics. - Reference is made to
FIG. 2 of a schematic diagram showing aconventional neon lamp 9. Theneon lamp 9 consists ofneon light lamps 91 and adecorative plate 92 having the neon light lamp placed thereon.Neon light lamps 91 can be arranged as preferred characters or graphics. - However, the
aforementioned light series 8 orneon lamp 9 has its own thickness and occupies a specific volume, and thus is not capable of being adhered in some locations under certain conditions, therefore limiting its application. - Moreover,
light bulbs 92 of theconventional light series 8 orneon light lamps 91 of theconventional neon lamp 9 are connected to each other through wires, making the assembly process for both more complicated and rendering the manufacturing more time-consuming. - It is therefore a primary objective of the present invention to provide a laminated light-emitting diode display device and a manufacturing method thereof. The present invention display device comprises a laminated design so as to reduce effectively the thickness as a whole and facilitate the placement thereof. Meanwhile, the assembly process for the present invention display device is not that time-consuming, compared to that the prior art light series or neon lamp, and thus leads to less manufacturing effort.
- In accordance with the claimed invention, the laminated light-emitting diode display device includes an insulator, a circuitry device placed on the insulator and consisting of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
- The present invention further provides a corresponding manufacturing method for the laminated light-emitting diode display device. The manufacturing method includes steps of preparing an insulator, placing a circuitry unit having a plurality of circuits on the insulator, and electrically connecting a plurality of SMT-type light-emitting diodes to the circuits of the circuitry unit.
- These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment illustrated in the various figures and drawings.
- The foregoing aspects and many of the attendant advantages of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
-
FIG. 1 is a schematic diagram showing a conventional light series; -
FIG. 2 is a schematic diagram showing a conventional neon lamp; -
FIG. 3 is a schematic diagram showing a laminated light-emitting diode display device according to the present invention; -
FIG. 3A is a schematic diagram partially detailing part A inFIG. 3 ; -
FIG. 4 is a top view of the laminated light-emitting diode display device according to the present invention; -
FIG. 5 shows the operation status of the laminated light-emitting diode display device according to the present invention; -
FIG. 6 is a top view of another preferred embodiment according to the present invention; and -
FIG. 7 shows a flow chart of the manufacturing method for the laminated light-emitting diode display device according to the present invention. - Reference is made to
FIGS. 3 and 4 of schematic diagrams of laminated light-emitting diode display devices according to the present invention. The present invention display device includes aninsulator 1, acircuitry unit 2 and a plurality of light-emitting diodes 3. The insulator is made of a glass, a paper or a transparent plastic thin film. The shape of the insulator is not limited and thus can be in a variety of different forms in practical use. Thepreferred embodiment 1 is in the form of a rectangle. - The
circuitry unit 2 is placed upon theinsulator 1 by printing, electroplating or chemical deposition. Thecircuitry unit 2 consists of a plurality ofcircuits 21 made of highly conductive materials. The arrangement ofcircuits 21 is not specifically limited and changes based on practical use along with the placement of light-emittingdiodes 3. Thecircuitry unit 2 further connects to appropriate power sources. - Light-
emitting diodes 3 are SMT-type light-emitting diodes, meaning light-emittingdiodes 3 are capable of being adhered tocircuits 21 of the circuitry unit 2 (shown inFIG. 3A ). Under this configuration, light-emitting diodes 3 are placed on theinsulator 1 and electrically connect to thecircuitry unit 2, which serves as a power source for light-emitting diodes 3. The number and arrangement of these light-emittingdiodes 3 are not limited either. Light-emittingdiodes 3 can be arranged as characters or graphics and in the present embodiment they are arranged as English characters. - Additionally, the
circuits 21 of thecircuitry unit 2 further electrically connect to a plurality ofresistors 4 providing the protection of the circuit.Circuits 21 further electrically connect to a controlling integrated circuit (IC) 5 controlling the on/off of these light-emitting diodes 3 and thus providing the on/off variance of these light-emittingdiodes 3. Moreover, a protectivethin film 6 further encapsulates the insulator, thecircuitry unit 2, light-emittingdiodes 3,resistors 4 and the controllingIC 5 for dust and waterproofing. - Reference is made to
FIG. 6 of a schematic diagram showing a solar power-generatingdevice 7 on theinsulator 1. The solar-power-generating device 7 includes asolar power plate 71 electrically connected tocircuits 21 of thecircuitry unit 2, whereby solar energy powers the display device. - The present invention primarily provides a laminated light-emitting diode display device having the
circuitry unit 2 printed on theinsulator 1, SMT-type light-emitting diodes 3 and the power source in order to display desired characters or graphics (shown inFIG. 5 ). - The laminated light-emitting diode display device according to the present invention is comparatively thin and thus is easily packed and stored, as well as being applicable in many occasions.
- The
circuitry unit 2 is printed on theinsulator 1 and light-emittingdiodes 3 are surface molded by surface molding technology (SMT) on the insulator for electrically connecting to thecircuitry unit 2, making the assembly process for the present invention display device easy and reduces effort in manufacturing. - Reference is made to
FIG. 7 of a flow chart of the present invention manufacturing method for the laminated light-emitting diode display device. The manufacturing method includes steps of (a) preparing an insulator 1 (shown inFIGS. 3 and 4 ) made of a glass, paper or transparent plastic thin film, (b) placing acircuitry unit 2 having a plurality ofcircuits 21 on theinsulator 1 by printing, electroplating or chemical deposition, (c) electrically connecting a plurality of SMT-type light-emitting diodes 3 to thecircuits 21 of thecircuitry unit 2, in which these SMT-type light-emittingdiodes 3 are adhered tocircuits 2 through the SMT, (d) electrically connecting a plurality ofresistors 4 and a controllingIC 5 tocircuits 2 of thecircuitry unit 2, withresistors 4 and the controlling IC are placed on theinsulator 1, and (e) encapsulating theinsulator 1,circuitry unit 2, light-emittingdiodes 3,resistors 4, and the controllingIC 5 in a protectivethin film 6. - Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Claims (14)
1. A laminated light-emitting diode (LED) display device, comprising:
an insulator;
a circuitry unit placed on the insulator and consisting of a plurality of circuits interconnected with each other; and
a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
2. The display device in claim 1 , wherein the insulator is made of a glass, a paper or a transparent plastic thin film.
3. The display device in claim 1 , wherein the circuitry unit is disposed on the insulator by printing, electroplating or chemical deposition.
4. The display device in claim 1 , wherein the light-emitting diodes are arranged as a character or a graphic.
5. The display device in claim 1 , wherein the circuits of the circuitry unit are connected to a plurality of resistors.
6. The display device in claim 1 , wherein the circuits of the circuitry unit are connected to a controlling integrated circuit (IC).
7. The display device in claim 1 , wherein the insulator, the circuitry unit and the light-emitting diodes are encapsulated by a protective thin film.
8. The display device in claim 1 , wherein the circuits of the circuitry unit are connected to a solar power device.
9. A manufacturing method for a laminated light-emitting diode display device, comprising:
preparing an insulator;
placing a circuitry unit having a plurality of circuits on the insulator; and
electrically connecting a plurality of SMT-type light-emitting diodes to the circuits of the circuitry unit.
10. The method in claim 9 , wherein the insulator is made of a glass, a paper or a transparent plastic thin film.
11. The method in claim 9 , wherein the circuitry is formed on the insulator by printing, electroplating or chemical deposition.
12. The method in claim 9 , further comprising a step of electrically connecting a plurality of resistors to the circuits of the circuitry unit.
13. The method in claim 9 , further comprising a step of electrically connecting a controlling integrated circuit (IC) to the circuits of the circuitry unit.
14. The method in claim 9 , further comprising a step of encapsulating the insulator, the circuitry unit and the light-emitting diodes with a protective thin film.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/920,306 US20060038485A1 (en) | 2004-08-18 | 2004-08-18 | Laminated light-emitting diode display device and manufacturing method thereof |
US11/605,425 US7563641B2 (en) | 2004-08-18 | 2006-11-29 | Laminated light-emitting diode display device and manufacturing method thereof |
Applications Claiming Priority (1)
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US10/920,306 US20060038485A1 (en) | 2004-08-18 | 2004-08-18 | Laminated light-emitting diode display device and manufacturing method thereof |
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US11/605,425 Division US7563641B2 (en) | 2004-08-18 | 2006-11-29 | Laminated light-emitting diode display device and manufacturing method thereof |
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US20060038485A1 true US20060038485A1 (en) | 2006-02-23 |
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US10/920,306 Abandoned US20060038485A1 (en) | 2004-08-18 | 2004-08-18 | Laminated light-emitting diode display device and manufacturing method thereof |
US11/605,425 Active 2025-06-02 US7563641B2 (en) | 2004-08-18 | 2006-11-29 | Laminated light-emitting diode display device and manufacturing method thereof |
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US11/605,425 Active 2025-06-02 US7563641B2 (en) | 2004-08-18 | 2006-11-29 | Laminated light-emitting diode display device and manufacturing method thereof |
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Cited By (1)
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Publication number | Priority date | Publication date | Assignee | Title |
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US20070072506A1 (en) * | 2004-08-18 | 2007-03-29 | Harvatek Corporation | Laminated light-emitting diode display device and manufacturing method thereof |
US7563641B2 (en) * | 2004-08-18 | 2009-07-21 | Harvatek Corporation | Laminated light-emitting diode display device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
US7563641B2 (en) | 2009-07-21 |
US20070072506A1 (en) | 2007-03-29 |
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