US20020196616A1 - Emi protective spring plate for motherboard - Google Patents
Emi protective spring plate for motherboard Download PDFInfo
- Publication number
- US20020196616A1 US20020196616A1 US09/888,487 US88848701A US2002196616A1 US 20020196616 A1 US20020196616 A1 US 20020196616A1 US 88848701 A US88848701 A US 88848701A US 2002196616 A1 US2002196616 A1 US 2002196616A1
- Authority
- US
- United States
- Prior art keywords
- flat
- spring plate
- sliding portion
- top contact
- protective spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 34
- 238000005476 soldering Methods 0.000 claims abstract description 43
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
Definitions
- the present invention relates to an EMI protective spring plate for motherboard and, more particularly, to such an EMI protective spring plate, which has a lower dead point design that prevents permanent deformation.
- FIGS. From 1 through 3 show a spring plate constructed according to the prior art for this purpose.
- This structure of spring plate 10 a comprises a flat top contact portion 11 a, which supports a shielding cover plate 40 a, a flat bottom soldering portion 15 a, which is soldered to the motherboard 30 a with tin soldering paste 20 a, two side plate portions 14 vertically downwardly extended from two ends of the flat top contact portion 11 a, an intermediate supporting portion 12 a obliquely connected between the flat top contact portion 11 a and the flat bottom soldering portion 15 a, an upper turn R 1 a connected between the flat top contact portion 11 a and the intermediate supporting portion 12 a, a second turn R 2 a connected between the intermediate supporting portion 12 a and the flat bottom soldering portion 15 a, and two slots 13 a respectively formed in the first turn R 1 a
- spring plate 10 a This structure of spring plate 10 a is still not satisfactory in function. Because the spring plate 10 a has a substantially S-shaped profile, it may hook other objects during its installation in the motherboard 30 a, thereby causing a deformation. Because a stress is produced during the formation of the first turn R 1 a and the second turn R 2 a, the flat top contact portion 11 a and the first turn R 1 a are forced downwards at different extents upon loading of the shielding cover plate 40 a, thereby causing the shielding cover plate 40 a unable to be stably supported on the flat top contact portion 11 a. Unstable contact between the plate shield 40 a and the flat top contact portion 11 a affects the EMI protective effect of the shielding cover plate 40 a. Further, the spring plate 10 a may be deformed permanently when received a high pressure.
- the present invention has been accomplished to provide an EMI protective spring plate, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide an EMI protective spring plate, which does not hook other objects during its installation. It is another object of the present invention to provide an EMI protective spring plate, which keeps the loaded EMI protective shielding cover plate stably in balance. It is still another object of the present invention to provide an EMI protective spring plate, which has a lower dead point design that prohibits the spring plate from being deformed excessively.
- the EMI protective spring plate comprises a flat top contact portion, a flat bottom soldering portion, an oblique supporting portion diagonally connected between the flat top contact portion and the flat bottom soldering portion, a front sliding portion obliquely downwardly extended from one end of the flat top contact portion toward the flat bottom soldering portion and inserted through a lower slot in the oblique supporting portion, and a rear sliding portion obliquely upwardly extended from one end of the flat bottom soldering portion toward the flat top contact portion and inserted through an upper slot in the oblique supporting portion.
- FIG. 1 is a perspective view of an EMI protective spring plate constructed according to the prior art.
- FIG. 2 is a side view of the prior art EMI protective spring plate shown in FIG. 1.
- FIG. 3 is a sectional view showing the prior art EMI protective spring plate installed.
- FIG. 4 is a perspective view of an EMI protective spring plate constructed according to the present invention.
- FIG. 5 is a sectional view of the EMI protective spring plate according to the present invention.
- FIG. 6 is a front view of the EMI protective spring plate according to the present invention.
- FIG. 7 is a sectional view showing the EMI protective spring plate installed according to the present invention.
- FIG. 8 is similar 6 to FIG. 7 but showing a downward pressure given to the EMI protective spring plate according to the present invention.
- an EMI protective spring plate 1 comprising a flat top contact portion 11 , which supports a shielding cover plate 4 (see FIG. 7), a flat bottom soldering portion 18 , which is soldered to a motherboard 3 , an oblique supporting portion 12 diagonally connected between one end, namely, the rear end of the flat top contact portion 11 and one end, namely, the front end of the flat bottom soldering portion 18 , a first turn R 1 connected between the rear end of the flat top contact portion 11 and one end, namely, the top end of the oblique supporting portion 12 , an upper slot 131 and a lower slot 132 respectively formed in the oblique supporting portion 12 at different elevations, a front sliding portion 14 obliquely downwardly extended from one end, namely, the front end of the flat top contact portion 11 toward the flat bottom soldering portion 18 and inserted through the lower slot 132 , a second turn R 2 connected between the front end of the flat top
- the first slope 16 and the second slope 17 distribute accumulated stress of the tin soldering paste 2 , the third turn R 3 , and the fourth turn R 4 in different directions upon a downward applied to the flat top contact portion 11 .
- the free end (bottom end) of the front sliding portion 14 and the free end (top end) of the rear sliding portion 15 are respectively rolled up.
- the front sliding portion 14 has a width gradually reducing from its top end toward its bottom end (i.e., gradually reducing in direction from the flat top contact portion 11 toward the flat bottom soldering portion 18 ).
- the rear sliding portion 15 has a width gradually reducing from its bottom end toward its top end (i.e., gradually reducing in direction from the flat bottom soldering portion 18 toward the flat top contact portion 11 ).
- the free end (top end) of the rear sliding portion 15 is disposed in contact with the bottom surface of the flat top contact portion 11 .
- the free end (bottom end) of the front sliding portion 14 is spaced above the flat bottom soldering portion 18 .
- the spring plate 1 further comprises two upright baffles 19 formed integral with two opposite lateral sides of the flat bottom soldering portion 18 , which stops tin soldering paste 2 from falling to the top surface of the flat bottom soldering portion 18 when soldering the flat bottom soldering portion 18 to the motherboard 3 .
- the rear sliding portion 15 is forced to turn inwards and to move its free end forwards along the bottom surface of the flat top contact portion 11
- the front sliding portion 14 is forced to move downwards and then to turn inwards, causing the free end of the front sliding portion 14 to be moved backwards along the top surface of the flat bottom soldering portion 18 .
- the slot 131 or 132 has a width wider than the free end of the sliding portion 14 or 15 but narrower than the fixed end of the sliding portion 14 or 15 .
- the slots 131 ; 132 limit the sliding distance of the sliding portions 14 ; 15 , preventing the spring plate 1 from being excessively deformed.
- This is the so-called lower dead point design. Because the spring plate 1 has an enclosed structure (the free end of the front sliding portion and the free end of the rear sliding portion are kept from touching external objects), the spring plate 1 does not hook external objects during its installation. Because two turns are provided at the two ends of the flat top contact portion 11 , the flat top contact portion 11 is maintained in balance and prohibited from sloping in one direction upon loading of the shielding plate 4 . Therefore, the shielding plate 4 can be stably supported on the flat top contact portion 11 . Further, the lower dead point design prevents protects the spring plate 1 from being deformed excessively.
- FIGS. A prototype of EMI protective spring plate has been constructed with the features of FIGS. from 4 through 8 .
- the EMI protective spring plate functions smoothly to provide all of the features discussed earlier.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
An EMI protective spring plate having an oblique supporting portion diagonally connected between a flat top contact portion and a flat bottom soldering portion, a front sliding portion obliquely downwardly extended from one end of the flat top contact portion toward the flat bottom soldering portion and inserted through a lower slot in the oblique supporting portion, and a rear sliding portion obliquely upwardly extended from one end of the flat bottom soldering portion toward the flat top contact portion and inserted through an upper slot in the oblique supporting portion.
Description
- The present invention relates to an EMI protective spring plate for motherboard and, more particularly, to such an EMI protective spring plate, which has a lower dead point design that prevents permanent deformation.
- In order to protect a motherboard against EMI (electromagnetic interference), spring plates may be installed in the border of the motherboard to support a plate shield. FIGS. From1 through 3 show a spring plate constructed according to the prior art for this purpose. This structure of
spring plate 10 a comprises a flattop contact portion 11 a, which supports ashielding cover plate 40 a, a flatbottom soldering portion 15 a, which is soldered to themotherboard 30 a withtin soldering paste 20 a, twoside plate portions 14 vertically downwardly extended from two ends of the flattop contact portion 11 a, an intermediate supportingportion 12 a obliquely connected between the flattop contact portion 11 a and the flatbottom soldering portion 15 a, an upper turn R1 a connected between the flattop contact portion 11 a and the intermediate supportingportion 12 a, a second turn R2 a connected between the intermediate supportingportion 12 a and the flatbottom soldering portion 15 a, and twoslots 13 a respectively formed in the first turn R1 a and the second turn R2 a. This structure ofspring plate 10 a is still not satisfactory in function. Because thespring plate 10 a has a substantially S-shaped profile, it may hook other objects during its installation in themotherboard 30 a, thereby causing a deformation. Because a stress is produced during the formation of the first turn R1 a and the second turn R2 a, the flattop contact portion 11 a and the first turn R1 a are forced downwards at different extents upon loading of theshielding cover plate 40 a, thereby causing theshielding cover plate 40 a unable to be stably supported on the flattop contact portion 11 a. Unstable contact between theplate shield 40 a and the flattop contact portion 11 a affects the EMI protective effect of theshielding cover plate 40 a. Further, thespring plate 10 a may be deformed permanently when received a high pressure. - The present invention has been accomplished to provide an EMI protective spring plate, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide an EMI protective spring plate, which does not hook other objects during its installation. It is another object of the present invention to provide an EMI protective spring plate, which keeps the loaded EMI protective shielding cover plate stably in balance. It is still another object of the present invention to provide an EMI protective spring plate, which has a lower dead point design that prohibits the spring plate from being deformed excessively. To achieve these and other objects of the present invention, the EMI protective spring plate comprises a flat top contact portion, a flat bottom soldering portion, an oblique supporting portion diagonally connected between the flat top contact portion and the flat bottom soldering portion, a front sliding portion obliquely downwardly extended from one end of the flat top contact portion toward the flat bottom soldering portion and inserted through a lower slot in the oblique supporting portion, and a rear sliding portion obliquely upwardly extended from one end of the flat bottom soldering portion toward the flat top contact portion and inserted through an upper slot in the oblique supporting portion.
- FIG. 1 is a perspective view of an EMI protective spring plate constructed according to the prior art.
- FIG. 2 is a side view of the prior art EMI protective spring plate shown in FIG. 1.
- FIG. 3 is a sectional view showing the prior art EMI protective spring plate installed.
- FIG. 4 is a perspective view of an EMI protective spring plate constructed according to the present invention.
- FIG. 5 is a sectional view of the EMI protective spring plate according to the present invention.
- FIG. 6 is a front view of the EMI protective spring plate according to the present invention.
- FIG. 7 is a sectional view showing the EMI protective spring plate installed according to the present invention.
- FIG. 8 is similar6 to FIG. 7 but showing a downward pressure given to the EMI protective spring plate according to the present invention.
- Referring to FIGS. From4 through 7, an EMI
protective spring plate 1 is shown comprising a flattop contact portion 11, which supports a shielding cover plate 4 (see FIG. 7), a flat bottom solderingportion 18, which is soldered to amotherboard 3, an oblique supportingportion 12 diagonally connected between one end, namely, the rear end of the flattop contact portion 11 and one end, namely, the front end of the flat bottom solderingportion 18, a first turn R1 connected between the rear end of the flattop contact portion 11 and one end, namely, the top end of the oblique supportingportion 12, anupper slot 131 and alower slot 132 respectively formed in the oblique supportingportion 12 at different elevations, a front slidingportion 14 obliquely downwardly extended from one end, namely, the front end of the flattop contact portion 11 toward the flat bottom solderingportion 18 and inserted through thelower slot 132, a second turn R2 connected between the front end of the flattop contact portion 11 and one end of thefront sliding portion 14, a rear slidingportion 15 obliquely upwardly extended from one end, namely, the rear end of the flat bottom solderingportion 16 toward the flattop contact portion 11 and inserted through theupper slot 131, a third turn R3 connected between the rear end of the flat bottom solderingportion 18 and one end of the rear slidingportion 15, a fourth turn R4 connected between one end, namely, the bottom end of the oblique supportingportion 12 and one end, namely, the front end of the flat bottom solderingportion 18, afirst slope 16 formed in the connection area between the fourth turn R4 and the front end of the flat bottom solderingportion 18, and asecond slope 17 formed in the connection area between the third turn R3 and the rear end of the flat bottom solderingportion 18. Thefirst slope 16 and thesecond slope 17 distribute accumulated stress of thetin soldering paste 2, the third turn R3, and the fourth turn R4 in different directions upon a downward applied to the flattop contact portion 11. Preferably, the free end (bottom end) of the front slidingportion 14 and the free end (top end) of the rear slidingportion 15 are respectively rolled up. The front slidingportion 14 has a width gradually reducing from its top end toward its bottom end (i.e., gradually reducing in direction from the flattop contact portion 11 toward the flat bottom soldering portion 18). The rear slidingportion 15 has a width gradually reducing from its bottom end toward its top end (i.e., gradually reducing in direction from the flatbottom soldering portion 18 toward the flat top contact portion 11). The free end (top end) of the rear slidingportion 15 is disposed in contact with the bottom surface of the flattop contact portion 11. The free end (bottom end) of thefront sliding portion 14 is spaced above the flatbottom soldering portion 18. Thespring plate 1 further comprises twoupright baffles 19 formed integral with two opposite lateral sides of the flatbottom soldering portion 18, which stops tin solderingpaste 2 from falling to the top surface of the flatbottom soldering portion 18 when soldering the flatbottom soldering portion 18 to themotherboard 3. - Referring to FIG. 8 when loading the
shielding cover plate 4 on the flattop contact portion 11 of thespring plate 1 after the flatbottom soldering portion 18 of thespring plate 1 has been soldered to themotherboard 3, the rear slidingportion 15 is forced to turn inwards and to move its free end forwards along the bottom surface of the flattop contact portion 11, and the front slidingportion 14 is forced to move downwards and then to turn inwards, causing the free end of thefront sliding portion 14 to be moved backwards along the top surface of the flatbottom soldering portion 18. Theslot portion portion slots 131;132 limit the sliding distance of thesliding portions 14;15, preventing thespring plate 1 from being excessively deformed. This is the so-called lower dead point design. Because thespring plate 1 has an enclosed structure (the free end of the front sliding portion and the free end of the rear sliding portion are kept from touching external objects), thespring plate 1 does not hook external objects during its installation. Because two turns are provided at the two ends of the flattop contact portion 11, the flattop contact portion 11 is maintained in balance and prohibited from sloping in one direction upon loading of theshielding plate 4. Therefore, theshielding plate 4 can be stably supported on the flattop contact portion 11. Further, the lower dead point design prevents protects thespring plate 1 from being deformed excessively. - A prototype of EMI protective spring plate has been constructed with the features of FIGS. from4 through 8. The EMI protective spring plate functions smoothly to provide all of the features discussed earlier.
- Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.
Claims (11)
1. An EMI (electromagnetic interference) protective spring plate comprising:
a flat top contact portion adapted to support an EMI (electromagnetic interference) protective shielding cover plate, said flat top contact portion having a front end and a rear end;
a flat bottom soldering portion adapted to be soldered to a motherboard, said flat bottom soldering portion having a front end and a rear end;
an oblique supporting portion diagonally connected between the rear end of said flat top contact portion and the front end of said flat bottom soldering portion, said oblique supporting portion having a top end and a bottom end;
a first turn connected between the rear end of said flat top contact portion and the top end of said oblique supporting portion;
an upper slot and a lower slot respectively formed in said oblique supporting portion at different elevations;
a front sliding portion obliquely downwardly extended from the front end of said flat top contact portion toward said flat bottom soldering portion and inserted through said lower slot, said front sliding portion having wider fixed top end connected to said flat top contact portion and a narrower free bottom end;
a second turn connected between the front end of said flat top contact portion and the top end of said front sliding portion;
a rear sliding portion obliquely upwardly extended from the rear end of said flat bottom soldering portion toward said flat top contact portion and inserted through said upper slot, said rear sliding portion having a wider fixed bottom end connected to the rear end of said flat bottom soldering portion and a narrower free top end;
a third turn connected between the rear end of said flat bottom soldering portion and the fixed bottom end of said rear sliding portion; and
a fourth turn connected between the bottom end of said oblique supporting portion and the front end of said flat bottom soldering portion.
2. The EMI protective spring plate of claim 1 wherein the bottom end of said front sliding portion is disposed in contact with a top surface of said flat bottom soldering portion.
3. The EMI protective spring plate of claim 1 wherein the bottom end of said front sliding portion is spaced above said flat bottom soldering portion.
4. The EMI protective spring plate of claim 1 wherein the top end of said rear sliding portion is disposed in contact with a bottom surface of said flat top contact portion.
5. The EMI protective spring plate of claim 1 wherein the top end of said rear sliding portion is spaced below said flat top contact portion.
6. The EMI protective spring plate of claim 1 wherein said lower slot has a width narrower than the wider top end of said front sliding portion but wider than the narrower bottom end of said front sliding portion.
7. The EMI protective spring plate of claim 1 wherein said upper slot has a width narrower than wider bottom end of said rear sliding portion but wider than the narrower top end of said rear sliding portion.
8. The EMI protective spring plate of claim 1 wherein the bottom end of said front sliding portion is rolled up.
9. The EMI protective spring plate of claim 1 wherein the top end of said rear sliding portion is rolled up.
10. The EMI protective spring plate of claim 1 further comprising two upright baffles disposed at two opposite lateral sides of said flat bottom soldering portion.
11. The EMI protective spring plate of claim 1 further comprising a first slope formed in the connection area between said fourth turn and said flat bottom soldering portion, and a second slope formed in the connection area between said third turn and said flat bottom soldering portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US09/888,487 US6493241B1 (en) | 2001-06-26 | 2001-06-26 | EMI protective spring plate for motherboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US09/888,487 US6493241B1 (en) | 2001-06-26 | 2001-06-26 | EMI protective spring plate for motherboard |
Publications (2)
Publication Number | Publication Date |
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US6493241B1 US6493241B1 (en) | 2002-12-10 |
US20020196616A1 true US20020196616A1 (en) | 2002-12-26 |
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US09/888,487 Expired - Lifetime US6493241B1 (en) | 2001-06-26 | 2001-06-26 | EMI protective spring plate for motherboard |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015510684A (en) * | 2012-01-17 | 2015-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | Interposer with compressible conductor |
EP3229327A1 (en) * | 2016-04-07 | 2017-10-11 | Sony Interactive Entertainment Inc. | Electronic device |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US6898087B1 (en) * | 2003-12-29 | 2005-05-24 | Wei-Chen Chen | Resilient element |
JP2005258669A (en) * | 2004-03-10 | 2005-09-22 | Riso Kagaku Corp | Direct printing apparatus, direct printing method, and direct printing program |
US7170013B2 (en) * | 2004-04-08 | 2007-01-30 | Hewlett-Packard Development Company, L.P. | Spring fingers with end extensions |
US7182634B2 (en) * | 2004-06-29 | 2007-02-27 | Intel Corporation | Connector cell having a supported conductive extension |
KR100662339B1 (en) * | 2004-07-02 | 2007-01-02 | 엘지전자 주식회사 | Connection terminal of portable electric appliance |
TWM268878U (en) * | 2004-12-24 | 2005-06-21 | Wintek Corp | Fixing structure of circuit board for optical display module |
CN101895019B (en) * | 2009-05-18 | 2012-10-17 | 深圳富泰宏精密工业有限公司 | Elastic piece structure |
JP5246806B2 (en) * | 2009-11-16 | 2013-07-24 | 北川工業株式会社 | contact |
KR101352407B1 (en) * | 2012-12-10 | 2014-01-20 | 대일티앤씨 주식회사 | Conductive finger strip for shielding emi |
US9240645B1 (en) * | 2014-09-22 | 2016-01-19 | Foxconn Interconnect Technology Limited | Electrical contact |
US9768537B2 (en) * | 2015-03-31 | 2017-09-19 | Samsung Electronics Co., Ltd. | Connecting terminal device and electronic device including the same |
JP6732172B2 (en) * | 2016-06-02 | 2020-07-29 | 北川工業株式会社 | contact |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4386819A (en) * | 1981-08-31 | 1983-06-07 | Amp Incorporated | RF Shielded assembly having capacitive coupling feature |
US5530783A (en) * | 1994-08-31 | 1996-06-25 | Berg Technology, Inc. | Backplane optical fiber connector for engaging boards of different thicknesses and method of use |
-
2001
- 2001-06-26 US US09/888,487 patent/US6493241B1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015510684A (en) * | 2012-01-17 | 2015-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | Interposer with compressible conductor |
EP3229327A1 (en) * | 2016-04-07 | 2017-10-11 | Sony Interactive Entertainment Inc. | Electronic device |
US10008813B2 (en) | 2016-04-07 | 2018-06-26 | Sony Interactive Entertainment Inc. | Electronic device |
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US6493241B1 (en) | 2002-12-10 |
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