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US20020088607A1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
US20020088607A1
US20020088607A1 US09/758,789 US75878901A US2002088607A1 US 20020088607 A1 US20020088607 A1 US 20020088607A1 US 75878901 A US75878901 A US 75878901A US 2002088607 A1 US2002088607 A1 US 2002088607A1
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US
United States
Prior art keywords
heat sink
fan
fins
engaging
catch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/758,789
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US6415852B1 (en
Inventor
Wei Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US09/758,789 priority Critical patent/US6415852B1/en
Assigned to FOXCONN PRECISION COMPONENTS reassignment FOXCONN PRECISION COMPONENTS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LO, WEI TA
Application granted granted Critical
Publication of US6415852B1 publication Critical patent/US6415852B1/en
Publication of US20020088607A1 publication Critical patent/US20020088607A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink assembly, and particularly to a heat sink assembly which readily and firmly attaches a fan to a heat sink.
  • a conventional means for attaching a fan to a heat sink is by using screws.
  • screws During installation of the screws, however, there is a risk of accidental damage to fins of the heat sink in the vicinity of the screws. Furthermore, since the fins are generally flexible, the screws can become loose over time.
  • an object of the present invention is to provide a heat sink assembly which readily and firmly attaches a fan to a heat sink.
  • Another object of the present invention is to provide a heat sink assembly which has a simple configuration.
  • a heat sink assembly comprises a heat sink and a fan attached to the heat sink.
  • the fan is box-shaped, and defines two recesses in each of two opposite side walls thereof.
  • the heat sink comprises a base and a plurality of parallel fins extending upwardly therefrom.
  • the fins comprise two engaging fins at each of two opposite lateral sides of the heat sink.
  • a wedge-shaped inside catch is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan.
  • the fan is pressed downwardly so that the engaging fins elastically deform. The catches then enter the recesses of the fan.
  • the fan is readily and securely attached to the heat sink.
  • a through hole is defined at each corner of the fan. In assembly, catches of the heat sink engage in the through holes of the fan.
  • FIG. 1 is an exploded view of a heat sink assembly in accordance with a preferred embodiment of the present invention
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is an assembled view of a heat sink assembly in accordance with an alternative embodiment of the present invention.
  • a heat sink assembly 1 of the present invention includes a heat sink 10 and a fan 20 .
  • the fan 20 is box-shaped.
  • Each of two opposite side walls 22 of the fan 20 defines two recesses 24 therein.
  • a slanted inner surface 25 is formed on each side wall 22 at each recess 24 .
  • the heat sink 10 includes a base 12 and a plurality of parallel fins 14 extending upwardly from the base 12 .
  • a slot 13 is defined through the fins 14 above a center of the base 12 , for receiving a conventional clip (not shown) which attaches the heat sink assembly 1 to an electronic device (not shown).
  • a row of alternate side fins 15 and engaging fins 16 is formed at each of two opposite lateral sides of the heat sink 10 .
  • the side fins 15 and engaging fins 16 extend higher than the fins 14 , thereby defining a receiving space (not labeled) therebetween for receiving the fan 20 .
  • Each said row of alternate side fins 15 and engaging fins 16 comprises one pair of engaging fins 16 , corresponding to the recesses 24 of the side wall 22 of the fan 20 .
  • a wedge-shaped inside catch 18 is formed at a distal end of each engaging fin 16 .
  • Each catch 18 has a sloped surface 19 for abutting against the corresponding slanted inner surface 25 of the fan 20 .
  • a distance between a pair of directly opposite engaging fins 16 at opposite sides of the heat sink 10 respectively is slightly less than a distance between the two opposite side walls 22 of the fan 20 .
  • the clip (not shown) is accommodated in the slot 13 of the heat sink 10 .
  • the fan 20 is placed on the heat sink 10 , with the side walls 24 of the fan 20 abutting against the sloped surfaces 19 of the catches 18 of the heat sink 10 .
  • the fan 20 is pressed downwardly.
  • the engaging fins 16 elastically deform, and the catches 18 enter the corresponding recesses 24 of the fan 20 .
  • the sloped surface 19 of each catch 18 interferentially abuts against the corresponding slanted inner surface 25 of the fan 20 .
  • the side walls 22 of the fan 20 interferentially abut against the side fins 15 and the engaging fins 16 of the heat sink 10 .
  • the fan 20 is readily and securely retained in the receiving space (not labeled) of the heat sink 10 .
  • the engagement of the catches 18 of the heat sink 10 in the recesses 24 of the fan 20 prevents the fan 20 from moving in a direction parallel to the lateral sides of the heat sink 10 .
  • the interferential abutment of the sloped surfaces 19 of the catches 18 against the slanted inner surfaces 25 of the fan 20 further prevents the fan 20 from moving relative to the heat sink 10 .
  • FIG. 3 shows a heat sink assembly 1 ′ in accordance with an alternative embodiment of the present invention.
  • the heat sink assembly 1 ′ comprises a heat sink 10 ′ and a fan 20 .
  • the heat sink 10 ′ comprises a base 12 and a plurality of fins 14 extending upwardly from the base 12 .
  • a row of side fins 15 ′ is formed at each of two opposite lateral sides of the heat sink 10 ′.
  • the side fins 15 ′ extend higher than the fins 14 , thereby defining a receiving space (not labeled) therebetween for receiving the fan 20 .
  • catches 18 ′ are respectively formed on four engaging fins 16 ′ located at four comers of the array of fins 14 , corresponding to four through holes 26 respectively defined in four comers of the fan 20 .
  • the catches 18 ′ are higher than the side fins 15 ′.
  • the fan 20 is placed on sloped surfaces 19 ′ of the catches 18 ′ of the engaging fins 16 ′.
  • the fan 20 is pressed downwardly, and the engaging fins 16 ′ elastically deform.
  • the engaging fins 16 ′ elastically snap back inwardly.
  • the catches 18 ′ engage in the corresponding through holes 26 of the fan 20 .
  • the side fins 15 ′ interferentially abut against opposite side walls (not labeled) of the fan 20 .
  • the fan 20 is thus securely retained in the receiving space of the heat sink 10 ′.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink assembly (1) includes a heat sink (10), and a fan (20) attached to the heat sink. The fan is box-shaped, and defines two recesses (24) in each of two opposite side walls (22) thereof. The heat sink includes a base (12) and a plurality of parallel fins (14) extending upwardly therefrom. The fins include two engaging fins (16) at each of two opposite lateral sides of the heat sink. A wedge-shaped inside catch (18) is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan. In assembly, the fan is pressed downwardly so that the engaging fins elastically deform, and the catches enter the recesses of the fan. Thus the fan is readily and securely attached to the heat sink. In an alternative embodiment, catches (18′) of the heat sink (10′) engage in through holes (26) of the fan.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heat sink assembly, and particularly to a heat sink assembly which readily and firmly attaches a fan to a heat sink. [0002]
  • 2. Related Art [0003]
  • During operation of an electronic device of a computer system, a large amount of heat is often produced. The heat must be quickly removed from the electronic device, to prevent the computer system from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the electronic device to facilitate removal of heat therefrom. A fan is often attached to the heat sink to provide forced convection therefrom. [0004]
  • A conventional means for attaching a fan to a heat sink is by using screws. During installation of the screws, however, there is a risk of accidental damage to fins of the heat sink in the vicinity of the screws. Furthermore, since the fins are generally flexible, the screws can become loose over time. [0005]
  • Thus an additional fixing device for attaching the fan to the heat sink is often used. However, the fixing device must first be attached to the heat sink, whereupon the fan is attached to the fixing device. This makes the assembly process unduly complicated, and decreases the efficiency of mass production. Moreover, the need for an additional fixing device increases costs. [0006]
  • Thus a heat sink assembly which overcomes the above problems of the related art is desired. [0007]
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a heat sink assembly which readily and firmly attaches a fan to a heat sink. [0008]
  • Another object of the present invention is to provide a heat sink assembly which has a simple configuration. [0009]
  • To achieve the above-mentioned objects, a heat sink assembly comprises a heat sink and a fan attached to the heat sink. The fan is box-shaped, and defines two recesses in each of two opposite side walls thereof. The heat sink comprises a base and a plurality of parallel fins extending upwardly therefrom. The fins comprise two engaging fins at each of two opposite lateral sides of the heat sink. A wedge-shaped inside catch is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan. In assembly, the fan is pressed downwardly so that the engaging fins elastically deform. The catches then enter the recesses of the fan. Thus the fan is readily and securely attached to the heat sink. [0010]
  • In an alternative embodiment, a through hole is defined at each corner of the fan. In assembly, catches of the heat sink engage in the through holes of the fan. [0011]
  • Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of preferred embodiments of the present invention with the attached drawings, in which:[0012]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat sink assembly in accordance with a preferred embodiment of the present invention; [0013]
  • FIG. 2 is an assembled view of FIG. 1; and [0014]
  • FIG. 3 is an assembled view of a heat sink assembly in accordance with an alternative embodiment of the present invention.[0015]
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIG. 1, a [0016] heat sink assembly 1 of the present invention includes a heat sink 10 and a fan 20. The fan 20 is box-shaped. Each of two opposite side walls 22 of the fan 20 defines two recesses 24 therein. A slanted inner surface 25 is formed on each side wall 22 at each recess 24.
  • The [0017] heat sink 10 includes a base 12 and a plurality of parallel fins 14 extending upwardly from the base 12. A slot 13 is defined through the fins 14 above a center of the base 12, for receiving a conventional clip (not shown) which attaches the heat sink assembly 1 to an electronic device (not shown). A row of alternate side fins 15 and engaging fins 16 is formed at each of two opposite lateral sides of the heat sink 10. The side fins 15 and engaging fins 16 extend higher than the fins 14, thereby defining a receiving space (not labeled) therebetween for receiving the fan 20. Each said row of alternate side fins 15 and engaging fins 16 comprises one pair of engaging fins 16, corresponding to the recesses 24 of the side wall 22 of the fan 20. A wedge-shaped inside catch 18 is formed at a distal end of each engaging fin 16. Each catch 18 has a sloped surface 19 for abutting against the corresponding slanted inner surface 25 of the fan 20. A distance between a pair of directly opposite engaging fins 16 at opposite sides of the heat sink 10 respectively is slightly less than a distance between the two opposite side walls 22 of the fan 20.
  • Referring also to FIG. 2, in assembly, the clip (not shown) is accommodated in the [0018] slot 13 of the heat sink 10. The fan 20 is placed on the heat sink 10, with the side walls 24 of the fan 20 abutting against the sloped surfaces 19 of the catches 18 of the heat sink 10. The fan 20 is pressed downwardly. The engaging fins 16 elastically deform, and the catches 18 enter the corresponding recesses 24 of the fan 20. The sloped surface 19 of each catch 18 interferentially abuts against the corresponding slanted inner surface 25 of the fan 20. The side walls 22 of the fan 20 interferentially abut against the side fins 15 and the engaging fins 16 of the heat sink 10. Thus the fan 20 is readily and securely retained in the receiving space (not labeled) of the heat sink 10.
  • The engagement of the [0019] catches 18 of the heat sink 10 in the recesses 24 of the fan 20 prevents the fan 20 from moving in a direction parallel to the lateral sides of the heat sink 10. The interferential abutment of the sloped surfaces 19 of the catches 18 against the slanted inner surfaces 25 of the fan 20 further prevents the fan 20 from moving relative to the heat sink 10.
  • The simple configuration of the [0020] heat sink assembly 1 accordingly simplifies the assembly process.
  • FIG. 3 shows a [0021] heat sink assembly 1′ in accordance with an alternative embodiment of the present invention. The heat sink assembly 1′ comprises a heat sink 10′ and a fan 20. The heat sink 10′ comprises a base 12 and a plurality of fins 14 extending upwardly from the base 12. A row of side fins 15′ is formed at each of two opposite lateral sides of the heat sink 10′. The side fins 15′ extend higher than the fins 14, thereby defining a receiving space (not labeled) therebetween for receiving the fan 20. Four catches 18′ are respectively formed on four engaging fins 16′ located at four comers of the array of fins 14, corresponding to four through holes 26 respectively defined in four comers of the fan 20. The catches 18′ are higher than the side fins 15′.
  • In assembly, the [0022] fan 20 is placed on sloped surfaces 19′ of the catches 18′ of the engaging fins 16′. The fan 20 is pressed downwardly, and the engaging fins 16′ elastically deform. Once the fan 20 has passed beyond the catches 18′, the engaging fins 16′ elastically snap back inwardly. The catches 18′ engage in the corresponding through holes 26 of the fan 20. The side fins 15′ interferentially abut against opposite side walls (not labeled) of the fan 20. The fan 20 is thus securely retained in the receiving space of the heat sink 10′.
  • It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein. [0023]

Claims (16)

1. A heat sink assembly comprising:
a heat sink comprising a base and a plurality of fins extending upwardly from the base, each of two opposite sides of the heat sink having at least one engaging fin, each engaging fin forming a catch thereon; and
a fan attached to the heat sink, the fan defining at least one receiving portion, each receiving portion receiving one corresponding catch of the heat sink.
2. The heat sink assembly as described in claim 1, wherein a slot is defined in the heat sink, for receiving a clip therein and for thereby attaching the heat sink to a heat-generating electronic device.
3. The heat sink assembly as described in claim 1, wherein a distance between a pair of directly opposite engaging fins at opposite sides of the heat sink respectively is slightly less than a distance between the two opposite side walls of the fan.
4. The heat sink assembly as described in claim 1, wherein a row of fins including the at least one engaging fin at each of two opposite sides of the heat sink extends higher than other fins, thereby defining a space for receiving the fan therein.
5. The heat sink assembly as described in claim 4, wherein each said row of fins includes alternate engaging fins and side fins.
6. The heat sink assembly as described in claim 5, wherein the engaging fins and the side fins interferentially abut against the side walls of the fan.
7. The heat sink assembly as described in claim 1, wherein at least one receiving portion of the fan comprises a recess defining at one side wall of the fan.
8. The heat sink assembly as described in claim 1, wherein each catch is wedge-shaped, and is formed at a distal end of the corresponding engaging fin, a sloped surface of each catch interferentially abutting against a slanted inner surface of the fan at the corresponding recess of the fan.
9. The heat sink assembly as described in claim 1, wherein each receiving portion of the fan comprises a through hole.
10. The heat sink assembly as described in claim 9, wherein every catch of the heat sink is higher than the side fins of the heat sink, and each catch engages with a corresponding through hole of the fan for retaining the fan in the heat sink.
11. A heat sink comprising:
a base;
a plurality of fins extending upwardly from the base; and
at least two engaging fins extending from the base at two opposite sides of the fins, each engaging fin forming a catch at a distal end thereof, a sloped surface being formed at each catch.
12. The heat sink as described in claim 11, wherein the engaging fins and the opposite sides of the fins are higher than the other fins therefore defining a space for receiving a fan therein.
13. A heat sink assembly comprising:
a heat sink comprising a base and a plurality of fins, each of two opposite sides of the heat sink having at least one engaging fin;
a fan attached to the fins and secured between the engaging fins; and means for fixing the fan to the heat sink.
14. The heat sink assembly as described in claim 13, wherein the means comprises a catch at a distal end of each engaging fin, each catch having a sloped surface.
15. The heat sink assembly as described in claim 13, wherein the means further comprises a recess at each of two opposite sides of the fan for engagement of the catch, the sloped surface of the catch abutting against a slanted inner surface of the recess.
16. The heat sink assembly as described in claim 13, wherein the means further comprises a through hole at each corner of the fan for engagement of the catch.
US09/758,789 2001-01-11 2001-01-11 Heat sink assembly Expired - Fee Related US6415852B1 (en)

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
US6665934B2 (en) * 2001-01-24 2003-12-23 Foxconn Precision Components Co., Ltd. Method for making heat dissipation device
US20040194927A1 (en) * 2003-01-29 2004-10-07 Lee Hsieh Kun Fan holder
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US20060007654A1 (en) * 2004-07-08 2006-01-12 Hon Hai Precision Industry Co., Ltd. Fan holder
US20070119567A1 (en) * 2005-11-25 2007-05-31 Foxconn Technology Co., Ltd. Heat dissipation device
USRE39784E1 (en) * 2003-01-08 2007-08-21 Ma Laboratories, Inc. Structure for removable cooler
DE102007013913A1 (en) * 2007-03-13 2009-01-02 Jet Computer Products Gmbh Fan
US20100101758A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with fan
FR3096224A1 (en) * 2019-05-16 2020-11-20 Skydrone Innovations "Watertight box to receive an electronic source of heat"

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US6722720B2 (en) * 2002-02-04 2004-04-20 Ford Global Technologies, Llc Engine compartment sound baffle
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EP1463113A1 (en) * 2003-03-22 2004-09-29 ABC Taiwan Electronics Corp. Ceramic heat sink with micro-pores structure
JP2005197303A (en) * 2003-12-26 2005-07-21 Nippon Densan Corp Heatsink fan
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
CN2694488Y (en) * 2004-03-18 2005-04-20 鸿富锦精密工业（深圳）有限公司 Heat radiator
US7405932B2 (en) * 2004-07-19 2008-07-29 Hewlett-Packard Development Company, L.P. System and method for cooling electronic devices
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly
CN101296601A (en) * 2007-04-25 2008-10-29 鸿富锦精密工业（深圳）有限公司 Heat radiating device
CN101667057B (en) * 2008-09-01 2012-09-19 鸿富锦精密工业（深圳）有限公司 Fan fixing device
CN101674718A (en) * 2008-09-11 2010-03-17 鸿富锦精密工业（深圳）有限公司 Radiation device
USD1009399S1 (en) 2021-07-20 2023-12-26 Transportation Ip Holdings, Llc Fluid control device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6665934B2 (en) * 2001-01-24 2003-12-23 Foxconn Precision Components Co., Ltd. Method for making heat dissipation device
USRE39784E1 (en) * 2003-01-08 2007-08-21 Ma Laboratories, Inc. Structure for removable cooler
US20040194927A1 (en) * 2003-01-29 2004-10-07 Lee Hsieh Kun Fan holder
US7004236B2 (en) * 2003-01-29 2006-02-28 Hon Hai Precision Ind. Co., Ltd. Fan holder
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US6981542B2 (en) * 2003-10-29 2006-01-03 Rotys Inc. Multi-heatsink integrated cooler
US20060007654A1 (en) * 2004-07-08 2006-01-12 Hon Hai Precision Industry Co., Ltd. Fan holder
US7131485B2 (en) * 2004-07-08 2006-11-07 Hon Hai Precision Industry Co., Ltd. Fan holder
US20070119567A1 (en) * 2005-11-25 2007-05-31 Foxconn Technology Co., Ltd. Heat dissipation device
DE102007013913A1 (en) * 2007-03-13 2009-01-02 Jet Computer Products Gmbh Fan
US20100101758A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with fan
FR3096224A1 (en) * 2019-05-16 2020-11-20 Skydrone Innovations "Watertight box to receive an electronic source of heat"

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