US20020066946A1 - Tape carrier package - Google Patents
Tape carrier package Download PDFInfo
- Publication number
- US20020066946A1 US20020066946A1 US09/542,998 US54299800A US2002066946A1 US 20020066946 A1 US20020066946 A1 US 20020066946A1 US 54299800 A US54299800 A US 54299800A US 2002066946 A1 US2002066946 A1 US 2002066946A1
- Authority
- US
- United States
- Prior art keywords
- tape carrier
- carrier package
- holes
- base film
- rectangular shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims description 14
- 238000005452 bending Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
- G11B15/60—Guiding record carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Definitions
- the present invention relates to a tape carrier package, to which semiconductor pellets are bonded and which is used for such as a flexible printed circuit (FPC), in particular, in which a tape automated bonding (TAB) tape is used.
- FPC flexible printed circuit
- TAB tape automated bonding
- FIG. 1 is a plane view of the first example of the conventional tape carrier package.
- FIG. 2 is a sectional view at the C to C′ section of FIG. 1.
- a conventional tape carrier package 50 provides plural conductive leads 53 on a base film 52 having a device hole 51 whose shape is rectangular.
- inner leads 53 a of the conductive leads 53 are formed in a state that the inner leads 53 a stick out to the device hole 51 .
- sprocket holes 54 are provided at the both edge sides of the base film 52 in a state that the sprocket holes 54 have the same intervals.
- a semiconductor pellet (die) 55 provides plural metal bumps 56 , and each of the plural metal bumps 56 is bonded to a corresponding inner lead 53 a of the conductive leads 53 by a heat press of a pressing tool (not shown).
- FIG. 3 is a sectional view of the second example of the conventional tape carrier package.
- a conventional tape carrier package 60 provides a base film 61 not having a device hole, and plural conductive leads 62 are provided on this base film 61 .
- a semiconductor pellet 55 provides plural metal bumps 56 , and each of the plural metal bumps 56 is bonded to a corresponding inner lead 62 a of the conductive leads 62 by a heat press of a pressing tool (not shown).
- This second example is a tape carrier package used so called a face down bonding system.
- the inner leads 62 a are fixed to the base film 61 , therefore this package has a characteristic that the inner leads 62 a are not bent easily by external force.
- This example is disclosed in Japanese Patent Application Laid-Open No. HEI 5-251510.
- FIG. 4 is a plane view of the third example of the conventional tape carrier package.
- FIG. 5 is a sectional view at the D to D′ section of FIG. 4.
- equivalent elements to the first example shown in FIGS. 1 and 2 have the same reference numbers, and the same explanation is omitted.
- a conventional tape carrier package 70 provides plural conductive leads 72 on a base film 52 having a device hole 71 whose shape is rectangular.
- inner leads 72 a of the conductive leads 72 are formed in a state that the inner leads 72 a do not stick out to the device hole 71 .
- sprocket holes 54 are provided at the both edge sides of the base film 52 in a state that the sprocket holes 54 have the same intervals.
- a semiconductor pellet 55 provides plural metal bumps 56 , and each of the plural metal bumps 56 is bonded to a corresponding inner lead 72 a of the conductive leads 72 by a heat press of a pressing tool (not shown).
- At least one or more slits 73 are provided at the base film 52 between adjacent conductive leads 72 at the near parts of the tip of the inner leads 72 a of the conductive leads 72 .
- the tape carrier package 50 of the first example the inner leads 53 a float in the air, as a result, there is a problem that the inner leads 53 a are easily bent by external force.
- the tape carrier package 60 of the second example was developed.
- the alignment between the semiconductor pellet 55 and the inner leads 62 a is technically difficult, consequently, there is a problem that the yield is reduced.
- the tape carrier package 70 of the third example was also developed.
- the base film 52 is deformed by the temperature at the bonding, as a result, there is a problem that non-intentional positions between the semiconductor pellet 55 and the conductive leads 72 may become short-circuit accidentally.
- a tape carrier package for achieving the objects mentioned above, there is provided a tape carrier package.
- Said tape carrier package provides a base film in which rectangular shaped first holes are provided, plural conductive leads, whose one ends are positioned not sticking out to each of said rectangular shaped first holes, on said base film, a second holes provided at the corner parts of each of said rectangular shaped first holes on said base film at the outside of each of said rectangular shaped first hole, and a semiconductor pellet in which plural metal bumps are provided. And said plural metal bumps are bonded to corresponding ends of said plural conductive leads.
- said conductive leads are provided on said base film in a state that said one ends of said conductive leads do not stick out to each of said rectangular shaped first holes, and said second holes are provided at the corner parts of each of said rectangular shaped first holes at the outside of each of said rectangular shaped first holes.
- FIG. 1 is a plane view of a first example of a conventional tape carrier package
- FIG. 2 is a sectional view at the C to C′ section of FIG. 1;
- FIG. 3 is a sectional view of a second example of the conventional tape carrier package
- FIG. 4 is a plane view of a third example of the conventional tape carrier package
- FIG. 5 is a sectional view at the D to D′ section of FIG. 4;
- FIG. 6 is a plane view of a first embodiment of a tape carrier package of the present invention.
- FIG. 7 is a sectional view at the A to A′ section of FIG. 6;
- FIG. 8 is a plane view of a second embodiment of the tape carrier package of the present invention.
- FIG. 9 is a plane view of a third embodiment of the tape carrier package of the present invention.
- FIG. 10 is a plane view of a fourth embodiment of the tape carrier package of the present invention.
- the present invention relates to a tape carrier package using a tape automated bonding (TAB) tape, which has a structure in which wiring patterns are formed on a base film such as a polyimide resin material.
- TAB tape automated bonding
- a structure of the tape carrier package having only one semiconductor pellet is explained, however actually many semiconductor pellets are sequentially bonded on the tape carrier package.
- FIG. 6 is a plane view of the first embodiment of the tape carrier package of the present invention.
- FIG. 7 is a sectional view at the A to A′ section of FIG. 6. In this, at the first embodiment, equivalent elements to the conventional examples shown in FIGS.
- a tape carrier package 1 provides plural conductive leads 3 on a base film 52 having a device hole 2 whose shape is rectangular. And inner leads 3 a of the conductive leads 3 are formed in a state that the inner leads 3 a do not stick out to the device hole 2 and are contained on the base film 52 . Furthermore, sprocket holes 54 are provided at the both edge sides of the base film 52 in a state that the sprocket holes 54 have the same intervals.
- a semiconductor pellet 55 provides plural metal bumps 56 , and each of the plural metal bumps 56 is bonded to a corresponding inner lead 3 a of the conductive leads 3 by a heat press of a pressing tool (not shown). And the rectangular shaped device hole 2 is smaller than the size of the semiconductor pellet 55 and works as recognizing the semiconductor pellet 55 .
- holes 4 are formed at the four corners of the device hole 2 on the base film 52 at the outside of the device hole 2 . These holes 4 are formed in a state that the holes 4 are connected to the device hole 2 .
- the base film 52 including the inner leads 3 a can be easily formed to a desiring forming shape. That is, by forming suitable slant (desiring forming shape) to the parts of the inner leads 3 a, a defect such as an edge touching that an edge of the semiconductor pellet 55 touches a pattern of a flexible printed circuit (FPC) at mounting can be prevented.
- FPC flexible printed circuit
- the base film 52 can be easily formed two dimensionally. As a result, the edge touching is prevented by that the forming can be applied to the parts of the inner leads 3 a.
- the silts 73 are provided as shown in FIG. 4, however the first embodiment of the present invention does not provides slits, therefore the adjacent inner leads 3 a do not touch with each other.
- FIG. 8 is a plane view of the second embodiment of the tape carrier package of the present invention.
- equivalent elements to the first embodiment shown in FIGS. 6 and 7 have the same reference numbers, and the same explanation is omitted.
- the different point between a tape carrier package 6 of the second embodiment and the tape carrier package 1 of the first embodiment is that the tape carrier package 6 of the second embodiment provides slits 5 instead of the holes 4 at the first embodiment. That is, the slits 5 are provided at the four corners of the device hole 2 on the base film 52 at the outside of the device hole 2 . These slits 5 are formed in a state that the slits 5 connect to the device hole 2 . By providing the slits 5 at these positions, the equivalent effect to the first embodiment can be obtained.
- FIG. 9 is a plane view of the third embodiment of the tape carrier package of the present invention.
- equivalent elements to the first embodiment shown in FIGS. 6 and 7 have the same reference numbers, and the same explanation is omitted.
- the different point between a tape carrier package 7 of the third embodiment and the tape carrier package 1 of the first embodiment is that the tape carrier package 7 of the third embodiment provides holes 8 instead of the holes 4 at the first embodiment, and the holes 8 are provided at the different positions from the holes 4 of the first embodiment. That is, the holes 8 are provided at the four corners of the device hole 2 on the base film 52 , but are not connected to the device hole 2 .
- a bridge 8 a which is a part of the base film 52 , is formed between the holes 8 and the device hole 2 .
- the bridge 8 a is stretched and the forming is easily performed. As a result, an equivalent effect to the first embodiment can be obtained at the third embodiment.
- FIG. 10 is a plane view of the fourth embodiment of the tape carrier package of the present invention.
- equivalent elements to the second embodiment shown in FIG. 8 have the same reference numbers, and the same explanation is omitted.
- the different point between a tape carrier package 9 of the fourth embodiment and the tape carrier package 6 of the second embodiment is that the tape carrier package 9 of the fourth embodiment provides slits 10 instead of the slits 5 at the second embodiment, and the slits 10 are provided at the different positions from the slits 5 of the second embodiment. That is, the slits 10 are provided at the four corners of the device hole 2 on the base film 52 , but are not connected to the device hole 2 .
- a bridge 10 a being a part of the base film 52 is formed between the slits 10 and the device hole 2 .
- the bridge 10 a is stretched and the forming is easily performed. As a result, an equivalent effect to the first embodiment can be obtained at the forth embodiment.
- the tape carrier package provides a base film in which a rectangular shaped first hole is provided, plural conductive leads, whose one ends are positioned not sticking out to the rectangular shaped first hole, on the base film, second holes provided at the corner parts of the rectangular shaped first hole on the base film at the outside of the rectangular shaped first hole, and a semiconductor pellet in which plural metal bumps are provided, and the plural metal bumps are bonded to corresponding ends of the conductive leads.
- inner leads of the conductive leads are prevented from bending by external force, and the yield is made to improve, and short-circuits at non-intentional positions between the wiring on the base film and the semiconductor pellet caused by heat at bonding can be prevented.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
- The present invention relates to a tape carrier package, to which semiconductor pellets are bonded and which is used for such as a flexible printed circuit (FPC), in particular, in which a tape automated bonding (TAB) tape is used.
- First, a first example of a conventional tape carrier package is explained. FIG. 1 is a plane view of the first example of the conventional tape carrier package. FIG. 2 is a sectional view at the C to C′ section of FIG. 1. As shown in FIGS. 1 and 2, a conventional
tape carrier package 50 providesplural conductive leads 53 on abase film 52 having adevice hole 51 whose shape is rectangular. And inner leads 53 a of theconductive leads 53 are formed in a state that the inner leads 53 a stick out to thedevice hole 51. Furthermore,sprocket holes 54 are provided at the both edge sides of thebase film 52 in a state that thesprocket holes 54 have the same intervals. - A semiconductor pellet (die)55 provides
plural metal bumps 56, and each of theplural metal bumps 56 is bonded to a correspondinginner lead 53 a of theconductive leads 53 by a heat press of a pressing tool (not shown). - Next, a second example of the conventional tape carrier package is explained. FIG. 3 is a sectional view of the second example of the conventional tape carrier package. In this, at the second example, equivalent elements to the first example shown in FIGS. 1 and 2 have the same reference numbers, and the same explanation is omitted. As shown in FIG. 3, a conventional
tape carrier package 60 provides abase film 61 not having a device hole, and pluralconductive leads 62 are provided on thisbase film 61. And asemiconductor pellet 55 providesplural metal bumps 56, and each of theplural metal bumps 56 is bonded to a correspondinginner lead 62 a of theconductive leads 62 by a heat press of a pressing tool (not shown). - This second example is a tape carrier package used so called a face down bonding system. At this tape carrier package, the
inner leads 62 a are fixed to thebase film 61, therefore this package has a characteristic that theinner leads 62 a are not bent easily by external force. This example is disclosed in Japanese Patent Application Laid-Open No. HEI 5-251510. - Next, a third example of the conventional tape carrier package is explained. This third type example is disclosed in Japanese Patent Application Laid-Open No. HEI 3-85740 and Japanese Patent Application Laid-Open No. HEI 3-101140. FIG. 4 is a plane view of the third example of the conventional tape carrier package. FIG. 5 is a sectional view at the D to D′ section of FIG. 4. In this, at the third example, equivalent elements to the first example shown in FIGS. 1 and 2 have the same reference numbers, and the same explanation is omitted. As shown in FIGS. 4 and 5, a conventional
tape carrier package 70 providesplural conductive leads 72 on abase film 52 having adevice hole 71 whose shape is rectangular. And inner leads 72 a of theconductive leads 72 are formed in a state that the inner leads 72 a do not stick out to thedevice hole 71. Furthermore,sprocket holes 54 are provided at the both edge sides of thebase film 52 in a state that thesprocket holes 54 have the same intervals. - And a
semiconductor pellet 55 providesplural metal bumps 56, and each of theplural metal bumps 56 is bonded to a correspondinginner lead 72 a of the conductive leads 72 by a heat press of a pressing tool (not shown). - And at least one or
more slits 73 are provided at thebase film 52 between adjacent conductive leads 72 at the near parts of the tip of theinner leads 72 a of theconductive leads 72. By providing this kind ofslits 73, a stress generated by the differences of thermal expansion coefficients and humidity expansion coefficients among a sealing resin material (not shown) using at bonding, the conductive leads 72, thebase film 52, and thesemiconductor pellet 55 can be absorbed. With these slits, defects caused by cracking of the resin material and braking of leads can be prevented. - However, at the
tape carrier package 50 of the first example, the inner leads 53 a float in the air, as a result, there is a problem that theinner leads 53 a are easily bent by external force. In order to solve this problem, thetape carrier package 60 of the second example was developed. However, at thistape carrier package 60, the alignment between thesemiconductor pellet 55 and theinner leads 62 a is technically difficult, consequently, there is a problem that the yield is reduced. As the same as the second example, in order to solve the problem of thetape carrier package 50 of the first example, thetape carrier package 70 of the third example was also developed. However, at thistape carrier package 70, thebase film 52 is deformed by the temperature at the bonding, as a result, there is a problem that non-intentional positions between thesemiconductor pellet 55 and theconductive leads 72 may become short-circuit accidentally. - It is therefore an object of the present invention to provide a tape carrier package, in which inner leads are prevented from bending by external force, and the yield is made to improve, and non-intentional short-circuits between wiring on a base film and a semiconductor pellet caused by heat at bonding can be prevented.
- According to the present invention, for achieving the objects mentioned above, there is provided a tape carrier package. Said tape carrier package provides a base film in which rectangular shaped first holes are provided, plural conductive leads, whose one ends are positioned not sticking out to each of said rectangular shaped first holes, on said base film, a second holes provided at the corner parts of each of said rectangular shaped first holes on said base film at the outside of each of said rectangular shaped first hole, and a semiconductor pellet in which plural metal bumps are provided. And said plural metal bumps are bonded to corresponding ends of said plural conductive leads.
- According to the present invention, said conductive leads are provided on said base film in a state that said one ends of said conductive leads do not stick out to each of said rectangular shaped first holes, and said second holes are provided at the corner parts of each of said rectangular shaped first holes at the outside of each of said rectangular shaped first holes. With this structure, inner leads of said conductive leads are prevented from bending by external force, the yield is made to improve, and short-circuits at non-intentional positions between wiring on said base film and said semiconductor pellet caused by heat at bonding can be prevented.
- The objects and features of the present invention will become more apparent from the consideration of the following detailed description taken in conjunction with the accompanying drawings in which:
- FIG. 1 is a plane view of a first example of a conventional tape carrier package;
- FIG. 2 is a sectional view at the C to C′ section of FIG. 1;
- FIG. 3 is a sectional view of a second example of the conventional tape carrier package;
- FIG. 4 is a plane view of a third example of the conventional tape carrier package;
- FIG. 5 is a sectional view at the D to D′ section of FIG. 4;
- FIG. 6 is a plane view of a first embodiment of a tape carrier package of the present invention;
- FIG. 7 is a sectional view at the A to A′ section of FIG. 6;
- FIG. 8 is a plane view of a second embodiment of the tape carrier package of the present invention;
- FIG. 9 is a plane view of a third embodiment of the tape carrier package of the present invention; and
- FIG. 10 is a plane view of a fourth embodiment of the tape carrier package of the present invention.
- Referring now to the drawings, embodiments of the present invention are explained in detail. The present invention relates to a tape carrier package using a tape automated bonding (TAB) tape, which has a structure in which wiring patterns are formed on a base film such as a polyimide resin material. In the embodiments, a structure of the tape carrier package having only one semiconductor pellet is explained, however actually many semiconductor pellets are sequentially bonded on the tape carrier package. First, a first embodiment of the present invention is explained. FIG. 6 is a plane view of the first embodiment of the tape carrier package of the present invention. FIG. 7 is a sectional view at the A to A′ section of FIG. 6. In this, at the first embodiment, equivalent elements to the conventional examples shown in FIGS.1 to 5 have the same reference numbers, and the same explanation is omitted. As shown in FIGS. 6 and 7, a tape carrier package 1 provides plural conductive leads 3 on a
base film 52 having adevice hole 2 whose shape is rectangular. Andinner leads 3 a of the conductive leads 3 are formed in a state that the inner leads 3 a do not stick out to thedevice hole 2 and are contained on thebase film 52. Furthermore, sprocket holes 54 are provided at the both edge sides of thebase film 52 in a state that the sprocket holes 54 have the same intervals. - A
semiconductor pellet 55 provides plural metal bumps 56, and each of the plural metal bumps 56 is bonded to a correspondinginner lead 3 a of the conductive leads 3 by a heat press of a pressing tool (not shown). And the rectangular shapeddevice hole 2 is smaller than the size of thesemiconductor pellet 55 and works as recognizing thesemiconductor pellet 55. - And holes4 are formed at the four corners of the
device hole 2 on thebase film 52 at the outside of thedevice hole 2. Theseholes 4 are formed in a state that theholes 4 are connected to thedevice hole 2. By providing theholes 4 at these positions, thebase film 52 including the inner leads 3 a can be easily formed to a desiring forming shape. That is, by forming suitable slant (desiring forming shape) to the parts of the inner leads 3 a, a defect such as an edge touching that an edge of thesemiconductor pellet 55 touches a pattern of a flexible printed circuit (FPC) at mounting can be prevented. In other words, by providing theholes 4 at the four corners of thedevice hole 2 at the outside of thedevice hole 2, thebase film 52 can be easily formed two dimensionally. As a result, the edge touching is prevented by that the forming can be applied to the parts of the inner leads 3 a. At the third example of the conventional tape carrier package, thesilts 73 are provided as shown in FIG. 4, however the first embodiment of the present invention does not provides slits, therefore the adjacent inner leads 3 a do not touch with each other. - Next, a second embodiment of the present invention is explained. FIG. 8 is a plane view of the second embodiment of the tape carrier package of the present invention. In this, at the second embodiment, equivalent elements to the first embodiment shown in FIGS.6 and 7 have the same reference numbers, and the same explanation is omitted. The different point between a
tape carrier package 6 of the second embodiment and the tape carrier package 1 of the first embodiment is that thetape carrier package 6 of the second embodiment providesslits 5 instead of theholes 4 at the first embodiment. That is, theslits 5 are provided at the four corners of thedevice hole 2 on thebase film 52 at the outside of thedevice hole 2. Theseslits 5 are formed in a state that theslits 5 connect to thedevice hole 2. By providing theslits 5 at these positions, the equivalent effect to the first embodiment can be obtained. - Next, a third embodiment of the present invention is explained. FIG. 9 is a plane view of the third embodiment of the tape carrier package of the present invention. In this, at the third embodiment, equivalent elements to the first embodiment shown in FIGS. 6 and 7 have the same reference numbers, and the same explanation is omitted. The different point between a tape carrier package7 of the third embodiment and the tape carrier package 1 of the first embodiment is that the tape carrier package 7 of the third embodiment provides
holes 8 instead of theholes 4 at the first embodiment, and theholes 8 are provided at the different positions from theholes 4 of the first embodiment. That is, theholes 8 are provided at the four corners of thedevice hole 2 on thebase film 52, but are not connected to thedevice hole 2. By providing theholes 8 at these positions, abridge 8 a, which is a part of thebase film 52, is formed between theholes 8 and thedevice hole 2. When a forming is applied to the part of the inner leads 3 a, thebridge 8 a is stretched and the forming is easily performed. As a result, an equivalent effect to the first embodiment can be obtained at the third embodiment. - Last, a fourth embodiment of the present invention is explained. FIG. 10 is a plane view of the fourth embodiment of the tape carrier package of the present invention. In this, at the fourth embodiment, equivalent elements to the second embodiment shown in FIG. 8 have the same reference numbers, and the same explanation is omitted. The different point between a
tape carrier package 9 of the fourth embodiment and thetape carrier package 6 of the second embodiment is that thetape carrier package 9 of the fourth embodiment providesslits 10 instead of theslits 5 at the second embodiment, and theslits 10 are provided at the different positions from theslits 5 of the second embodiment. That is, theslits 10 are provided at the four corners of thedevice hole 2 on thebase film 52, but are not connected to thedevice hole 2. By providing theslits 10 at these positions, abridge 10 a being a part of thebase film 52 is formed between theslits 10 and thedevice hole 2. When a forming is applied to the part of the inner leads 3 a, thebridge 10 a is stretched and the forming is easily performed. As a result, an equivalent effect to the first embodiment can be obtained at the forth embodiment. - According to a tape carrier package of the present invention, the tape carrier package provides a base film in which a rectangular shaped first hole is provided, plural conductive leads, whose one ends are positioned not sticking out to the rectangular shaped first hole, on the base film, second holes provided at the corner parts of the rectangular shaped first hole on the base film at the outside of the rectangular shaped first hole, and a semiconductor pellet in which plural metal bumps are provided, and the plural metal bumps are bonded to corresponding ends of the conductive leads. With this structure, inner leads of the conductive leads are prevented from bending by external force, and the yield is made to improve, and short-circuits at non-intentional positions between the wiring on the base film and the semiconductor pellet caused by heat at bonding can be prevented.
- While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by those embodiments but only by the appended claims. It is to be appreciated that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP09952799A JP3555927B2 (en) | 1999-04-07 | 1999-04-07 | Tape carrier package |
JP11-099527 | 1999-04-07 |
Publications (2)
Publication Number | Publication Date |
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US20020066946A1 true US20020066946A1 (en) | 2002-06-06 |
US6407447B1 US6407447B1 (en) | 2002-06-18 |
Family
ID=14249713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/542,998 Expired - Fee Related US6407447B1 (en) | 1999-04-07 | 2000-04-04 | Tape carrier package |
Country Status (3)
Country | Link |
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US (1) | US6407447B1 (en) |
JP (1) | JP3555927B2 (en) |
KR (1) | KR100380831B1 (en) |
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US20090020858A1 (en) * | 2007-07-17 | 2009-01-22 | Matsushita Electric Industrial Co., Ltd. | Tape carrier substrate and semiconductor device |
US20100232115A1 (en) * | 2009-03-13 | 2010-09-16 | Aisin Aw Co., Ltd. | Electronic circuit device |
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KR100304261B1 (en) | 1999-04-16 | 2001-09-26 | 윤종용 | Tape Carrier Package, Liquid Crystal Display panel assembly contain the Tape Carrier Package, Liquid Crystal Display device contain the Liquid Crystal panel assembly and method for assembling the same |
US7339568B2 (en) * | 1999-04-16 | 2008-03-04 | Samsung Electronics Co., Ltd. | Signal transmission film and a liquid crystal display panel having the same |
CN1308742C (en) * | 2003-11-07 | 2007-04-04 | 友达光电股份有限公司 | Tape and Reel Carrier Package |
TWI239088B (en) * | 2004-12-30 | 2005-09-01 | Chipmos Technologies Inc | Tape for tape carrier package |
JP7661868B2 (en) | 2021-11-17 | 2025-04-15 | 株式会社デンソー | Semiconductor Module |
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JPH0385740A (en) | 1989-08-30 | 1991-04-10 | Sumitomo Bakelite Co Ltd | Semiconductor device |
JPH03101140A (en) | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | Semiconductor device |
JPH04123448A (en) * | 1990-09-14 | 1992-04-23 | Toshiba Corp | Semi-conductor mounting apparatus |
JPH04162734A (en) | 1990-10-26 | 1992-06-08 | Hitachi Ltd | Semiconductor device and method for forming the same |
JPH05275498A (en) | 1991-03-20 | 1993-10-22 | Fujitsu Ltd | Tape carrier and method of assembling semiconductor device using the same |
JPH05251510A (en) | 1992-03-05 | 1993-09-28 | Hitachi Chem Co Ltd | Tab tape carrier and its production |
JP3329073B2 (en) * | 1993-06-04 | 2002-09-30 | セイコーエプソン株式会社 | Semiconductor device and manufacturing method thereof |
JP2586344B2 (en) * | 1994-09-30 | 1997-02-26 | 日本電気株式会社 | Carrier film |
JP3484554B2 (en) * | 1995-02-28 | 2004-01-06 | 日本テキサス・インスツルメンツ株式会社 | Semiconductor device |
JP3170182B2 (en) * | 1995-08-15 | 2001-05-28 | 株式会社東芝 | Resin-sealed semiconductor device and method of manufacturing the same |
JP2861956B2 (en) * | 1996-07-24 | 1999-02-24 | 日本電気株式会社 | High frequency device package and manufacturing method thereof |
JPH11213737A (en) | 1998-01-22 | 1999-08-06 | Toshiba Tec Corp | Discharge lamp fixture |
-
1999
- 1999-04-07 JP JP09952799A patent/JP3555927B2/en not_active Expired - Fee Related
-
2000
- 2000-04-04 US US09/542,998 patent/US6407447B1/en not_active Expired - Fee Related
- 2000-04-07 KR KR10-2000-0018116A patent/KR100380831B1/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090020858A1 (en) * | 2007-07-17 | 2009-01-22 | Matsushita Electric Industrial Co., Ltd. | Tape carrier substrate and semiconductor device |
US20100232115A1 (en) * | 2009-03-13 | 2010-09-16 | Aisin Aw Co., Ltd. | Electronic circuit device |
US8279612B2 (en) | 2009-03-13 | 2012-10-02 | Aisin Aw Co., Ltd. | Electronic circuit device |
Also Published As
Publication number | Publication date |
---|---|
JP3555927B2 (en) | 2004-08-18 |
US6407447B1 (en) | 2002-06-18 |
KR100380831B1 (en) | 2003-04-18 |
JP2000294604A (en) | 2000-10-20 |
KR20000071587A (en) | 2000-11-25 |
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