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US20020058137A1 - Dielectric spacing layer - Google Patents

Dielectric spacing layer Download PDF

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Publication number
US20020058137A1
US20020058137A1 US09/986,788 US98678801A US2002058137A1 US 20020058137 A1 US20020058137 A1 US 20020058137A1 US 98678801 A US98678801 A US 98678801A US 2002058137 A1 US2002058137 A1 US 2002058137A1
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United States
Prior art keywords
particles
dielectric material
layer
dielectric
layers
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US09/986,788
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English (en)
Inventor
Leif Bergstedt
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Telefonaktiebolaget LM Ericsson AB
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Individual
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Assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) reassignment TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BERGSTEDT, LEIF ROLAND
Publication of US20020058137A1 publication Critical patent/US20020058137A1/en
Abandoned legal-status Critical Current

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Definitions

  • the present invention relates to a dielectric spacing layer applied between a layer of conductive material so as to maintain a given spacing between the layers.
  • So-called printed circuit boards or component carriers that can be used beneficially for implementing different circuitries are at present used in practically all modern electronic equipment. These printed circuit boards afford many advantages. Among other things, they are simple to manufacture, they can be disposed in a distinct and space-saving fashion in the equipment, and can be readily replaced or exchanged.
  • a printed circuit board of this nature is comprised of a carrying basic part on which a dielectric material is applied. The components with which the function of the board is achieved are interconnected by thin conductors that extend in or on the dielectric layer.
  • the field strength E max (d) at which such a short circuit occurs depends partly on the distance d between the conductors and also on the nature of the material between the conductors, more specifically on the possible energy density of the material, this density giving a measurement relating to the amount of energy that the material is able to store.
  • This energy density w is essentially proportional to the field strength E and the materialspecific dielectric index ⁇ r:
  • One known technique of obtaining effective insulation against short circuits between conducting layers involves the use of a layer of a dielectric glue that includes a woven fibreglass reinforcement.
  • this layer needs to have a given minimum thickness, in the order of some 10 ⁇ m, in order to achieve effective insulation.
  • the problem addressed by the invention relates to the known fact that the risk of short circuiting between two electrically conductive layers increases when the thickness of the dielectric material located between said layers is beneath a given minimum value.
  • a first object of the present invention is to provide a material that can be used to produce very thin dielectric layers.
  • Another object of the invention is to provide a dielectric material that can be used to minimise the thickness of a dielectric layer between two electric conductors to a given permitted minimum distance, in a controlled manner.
  • the invention is based on the concept of providing a material, e.g. a glue film, to be used as a dielectric between two conductive layers with a low concentration of non-conductive particles. These particles prevent short circuiting between the conductive layers, by keeping the layers at a minimum distance apart, this distance corresponding to the diameter of the particles between the layers.
  • a material e.g. a glue film
  • One advantage afforded by the inventive dielectric material is that a thin dielectric layer can be provided between two conductors with the conductors spaced at a given minimum distance apart that will not enhance the risk of short circuiting between said conductors.
  • Another advantage is that component carriers, for instance a printed circuit board, can be given a thinner design.
  • Still another advantage afforded by the invention is that component carriers can be given thin, sequentially constructive layers.
  • inventive dielectric material facilitates the construction of a buried capacitor, for instance.
  • a commercially acceptable production of thin dielectric layers is one advantage afforded by the inventive method.
  • FIG. 1 illustrates a first embodiment of the invention comprising two conductive layers and an intermediate dielectric.
  • FIGS. 2 a - 2 d illustrate the method steps for spacing two conductive layers at a given minimum distance apart with the aid of the inventive dielectric spacing material.
  • FIGS. 3 a - 3 b illustrate respectively the use of the inventive dielectric material for producing a buried capacitor.
  • FIG. 1 illustrates part of a structure 10 that includes two layers 11 a , 11 b and an intermediate layer 13 , this latter layer being comprised of the inventive dielectric material.
  • the invention is based on the concept of including in said dielectric material a low concentration of non-conductive particles 14 , primarily with the object of being able to control the thickness of the dielectric layer comprised of said material so that the layer height h can be reduced to a given absolute minimum distance that cannot be surpassed. Because the particles 14 are comprised of a non-conductive material, short circuits between two conductors 12 a , 12 b will be effectively prevented.
  • the dielectric material has a distance holding effect, for example when mounting on a carrier two conductive layers and an intermediate dielectric.
  • the properties of the inventive dielectric material can be modified in accordance with the contemplated area of use, through the choice of the dielectric material on the one hand and by varying the properties of the particles with which the material is doped on the other hand.
  • the minimum possible thickness value of the dielectric layer is determined essentially by the size of the particles. Depending on particle size, it is possible to obtain between the conductors 12 a , 12 b controlled distances in the order of magnitude of only some micrometers. Particle sizes in the order of magnitude of 5-20 ⁇ m are normally used. A lower limit with respect to particle size is governed by the smallest distance allowed by the dielectric material without the occurrence of a short circuit.
  • the inventive dielectric material is normally used as a dielectric between two conductive layers, which will allow the layers to be pressed together to a given minimum distance apart.
  • a conceivable modification is one in which the particle shape in different alternative embodiments of the inventive dielectric material is modified to achieve beneficial distribution of pressure on the particles.
  • the particles may have a thread-like form, for instance consist of fibreglass particles, or flakes.
  • a further parameter is the particle concentration in the dielectric material.
  • the particle concentration shall be low, for instance ranging from 5%-15% inclusive, meaning that said particles comprised 5%-15% of the dielectric material.
  • a bottom limit of a concentration range is apparent from the fact that there must be present in the dielectric material a sufficient number of particles to ensure the probability that the number of particles present between the conductors will suffice to exceed a given minimum value.
  • the particle concentration may not exceed a maximum value, in order to avoid stacking of the particles. Particle stacking would prevent a minimum distance corresponding to particle diameter or particle thickness from being achieved.
  • An appropriate dielectric material has a high viscosity, for example the consistency of a soft paste or of a glue film having an adhesive effect.
  • a particularly beneficial material is one which can be applied in a soft state at a given laminating temperature and which then hardens or cures at normal room temperature. The use of such a material has the benefit of enabling two sequential layers that shall be held apart be mounted in a firm connection.
  • an important criterion is that the properties of the material, e.g. with respect to adhesiveness or viscosity, will not change essentially at temperatures that occur on, e.g., a printed circuit board in operation.
  • Appropriate materials that have an adhesive effect are, e.g., thermosetting resins, such as epoxy resins. Other dielectric materials can alternatively be used, such as thermoplastics.
  • a thin dielectric layer is obtained by heating the dielectric material to a given temperature. This enables an object to be pressed into or to sink into the dielectric layer to a depth at which further penetration of the object is prevented by the particles, wherewith the dielectric layer obtains a given minimum thickness that corresponds to the diameter of the particles.
  • the particle material has a higher temperature resistance than the dielectric material, so that the particles will not be deformed at the laminating temperature while applying typical pressure conditions when compressing the layers.
  • the laminating temperature must be considerably higher than those temperatures that occur, e.g., on a printed circuit board in operation.
  • a suitable particle material is, for instance, ceramic powder or an appropriate plastic-based material. Typical values of the dielectric index ⁇ r of the particles may lie in a range of 3-9.
  • FIG. 2 illustrates the method steps of spacing two conductive layers 21 , 24 apart through a given minimum distance with the aid of the inventive distance-maintaining dielectric material.
  • the conductive layers 21 , 24 may, for example, be an earth plane and an electronic component or conductor on a printed circuit board, or two capacitor surfaces.
  • a layer of the inventive dielectric material 22 is applied to a first layer 21 , shown in FIG. 2 a .
  • the material is doped with non-conductive particles 23 to a given concentration, as described above, in order to obtain a dielectric that has the properties desired.
  • a second layer 24 is applied to the dielectric material 22 .
  • This second layer 24 is either pressed against the first layer 21 or allowed to sink into the dielectric material 22 under its own weight.
  • the particles 23 are therewith also pressed together in the dielectric material, into a continually decreasing space. These particles prevent the distance between the two layers 21 , 24 from surpassing a given minimum value corresponding to the diameters of the particles, as shown in FIG. 2 d.
  • the dielectric material for example in the form of a dielectric glue film which is doped with non-conductive particles to a low concentration, may be used beneficially to create a space-saving dielectric layer in a simple fashion.
  • the inventive material advantageously facilitates mounting of electronic components, e.g., onto a printed circuit board, in those instances when, for reasons of manufacture, it may be difficult to place a conductive layer on a dielectric without therewith surpassing a given minimum value with respect to the thickness of the dielectric layer.
  • FIG. 3 There is shown in FIG. 3 an advantageous use of the inventive dielectric material when mounting an electronic chip 32 on a printed circuit board 31 .
  • the chip 32 is mounted on a base element 34 in a suitable cavity on the board 31 .
  • the chip 32 is intended to carry out certain functions that are controlled by microwave signals applied from without, through the medium of contact conductors 33 . In this case, it may be important to effectively de-couple undesired signals leaving or entering the chip 32 . In the illustrated case, this is achieved with the aid of a decoupling filter disposed between the chip 32 and the remainder of the board 31 .
  • Such a filter is used to de-couple incoming interference signals and biasing signals to the chip 32 , on the one hand, and to prevent signals on the chip 32 from leaking out on the control signals 33 , on the other hand.
  • This filter function can be implemented in a space-saving fashion through the medium of a so-called buried capacitor formed between the earth plane 35 of said board and a thin layer of conductive material having a dielectric disposed therebetween. Typical values of the capacitance of said capacitor are in the order of magnitude of some 10 pF. Assuming the use of a flat capacitor, dimensioning of the capacitor surfaces is determined essentially by the frequency of the signals; more specifically the edge length of the capacitor must be smaller than one-eighth of the wavelength of the signals.
  • the distance between the capacitor plates will be only a few micrometers.
  • the diameter of the particles prevent the thickness from falling beneath the minimum distance corresponding to the diameter of the particles.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)
US09/986,788 2000-11-10 2001-11-09 Dielectric spacing layer Abandoned US20020058137A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0004125A SE0004125L (sv) 2000-11-10 2000-11-10 Distanshållande dielektriskt skikt
SE0004125-1 2000-11-10

Publications (1)

Publication Number Publication Date
US20020058137A1 true US20020058137A1 (en) 2002-05-16

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US (1) US20020058137A1 (fr)
AU (1) AU2002211171A1 (fr)
SE (1) SE0004125L (fr)
WO (1) WO2002039797A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2400825A1 (fr) * 2010-06-23 2011-12-28 Bayer MaterialScience AG Composition d'isolation pour des dispositifs électroniques imprimés dans un point de croisement de conducteurs
US11640687B2 (en) 2020-03-31 2023-05-02 Sony Group Corporation Volumetric capture and mesh-tracking based machine learning 4D face/body deformation training
JP7667400B2 (ja) 2021-03-19 2025-04-23 Ｎｅｃプラットフォームズ株式会社 電源装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2951296A1 (de) * 1979-12-20 1981-06-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Isolierkoerper
JPH07221125A (ja) * 1994-01-27 1995-08-18 Toyota Autom Loom Works Ltd 半導体部品の実装構造及び絶縁性接着剤
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2400825A1 (fr) * 2010-06-23 2011-12-28 Bayer MaterialScience AG Composition d'isolation pour des dispositifs électroniques imprimés dans un point de croisement de conducteurs
WO2011161050A1 (fr) 2010-06-23 2011-12-29 Bayer Materialscience Ag Composition isolante pour électronique imprimée dans un point de jonction de conducteur
CN103098566A (zh) * 2010-06-23 2013-05-08 拜耳知识产权有限责任公司 用于导线交叉点的印刷电子的绝缘组合物
US11640687B2 (en) 2020-03-31 2023-05-02 Sony Group Corporation Volumetric capture and mesh-tracking based machine learning 4D face/body deformation training
JP7667400B2 (ja) 2021-03-19 2025-04-23 Ｎｅｃプラットフォームズ株式会社 電源装置

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SE0004125D0 (sv) 2000-11-10
AU2002211171A1 (en) 2002-05-21
SE0004125L (sv) 2002-05-11
WO2002039797A1 (fr) 2002-05-16

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