US20020051700A1 - Robot for handling workpieces in an automated processing system - Google Patents
Robot for handling workpieces in an automated processing system Download PDFInfo
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- US20020051700A1 US20020051700A1 US09/907,523 US90752301A US2002051700A1 US 20020051700 A1 US20020051700 A1 US 20020051700A1 US 90752301 A US90752301 A US 90752301A US 2002051700 A1 US2002051700 A1 US 2002051700A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Definitions
- the field of the invention is automated workpiece processing systems, used for processing workpieces, such as semiconductor wafers, hard disk media, substrates, optical materials, as well as other workpieces formed from a substrate upon which microelectronic circuits or components, data storage elements or layers, and/or micro-mechanical elements are or can be formed. These and similar materials generally requiring very low levels of contamination, are collectively referred to here as “wafers” or “workpieces”.
- Robots which handle workpieces by their edges have been used, with varying degrees of success.
- these robots require precise pre-positioning, before making contact with the workpiece. While the added time required for pre-positioning a robot for a single workpiece pick up operation may be relatively little, the added time for this positioning and movement, over hundreds or thousands of workpiece pick up cycles, becomes substantial.
- an automated processing system has a robot at a transfer station.
- the robot withdraws workpieces from a container at a docking station and moves the workpieces to a carrier.
- the robot has an end effector or hand having first and second arms or tines. Each arm has a workpiece contact.
- the robot is moved so that the workpiece is between the arms.
- the arms are then brought together, with the workpiece contacts engaging the edges of the workpiece.
- the arms preferably remain parallel at all times.
- the contacts on the arms preferably move linearly to contact and pick up the workpiece. Extensive robot pre-positioning movements, to align the robot with the workpiece, are avoided. In addition, the workpiece contacts preferably contact the workpiece edges nearly simultaneously. This reduces or avoids sliding movement of the workpiece, which can cause damage or contamination to the workpiece.
- first and second arms are driven by a linkage which moves the arms simultaneously in equal and opposite directions. This provides for automatic precise four-point contact between the robot and the workpiece, resulting in simplified and expedited handling.
- an actuator drives the linkage moving the first and second arms.
- the limited amount of force exerted by the actuator on the linkage correspondingly limits the force which the workpiece contacts on the arms may exert on the workpiece. As a result, gentle handling of the workpiece is automatically provided.
- sensors are provided on the robot, to detect whether the robot has successfully picked up a workpiece. This feature reduces potential for damage to workpieces, by signaling the robot controller to stop or reverse robot movement, when appropriate.
- FIG. 1 is a perspective view of an automated processing system, with enclosure walls removed for purpose of illustration;
- FIG. 2 is a plan view of the system of FIG. 1, with enclosure walls removed for purposes of illustration;
- FIG. 3 is a front and right side perspective view of the interface section shown in FIGS. 1 and 2, with enclosure walls removed for purposes of illustration;
- FIG. 4 is a rear and left side perspective view thereof
- FIG. 5 is an exploded perspective view of the end effector of the robot shown in FIGS. 1 and 2;
- FIG. 6 is a top view of the end effector shown in FIG. 5, with the cover removed;
- FIG. 7 is a section view taken along line 7 - 7 of FIG. 6;
- FIG. 8 is a section view taken along line 8 - 8 of FIG. 6;
- FIG. 9 is a plan view showing the end effector of FIGS. 5 - 8 positioned to engage or pick up a workpiece
- FIG. 10 is a plan view of the end effector in FIG. 9 holding a workpiece
- FIG. 11 is a section view taken along line 11 - 11 of FIG. 10;
- FIG. 12 is a perspective view showing the end effector of FIGS. 5 - 8 picking up a workpiece from an array of workpieces within a container.
- an automated processing system 20 has an interface section 42 along side of a process section 44 within an enclosure 22 .
- Workpieces 35 within a container such as an FOUP box or container, are placed onto an input/output station 24 , and then moved into an indexer 26 within the enclosure 22 .
- the indexer 26 temporarily stores the workpieces, either waiting for processing, or waiting for removal from the processing system 20 . This allows the processing system 20 to run continuously.
- Elevators 28 at the back end of the indexer 26 move boxes 25 vertically between the indexer 26 and a docking station 30 . At the docking station 30 , the boxes 25 are placed or sealed against a wall 32 .
- a cover 36 over an opening 34 in the wall 32 is removed by a cover actuator 38 .
- a transfer robot 50 at a transfer station 40 removes workpieces 35 from the boxes 25 and places them into a carrier 48 .
- a process robot 46 carries the loaded carrier 48 to a processor 52 .
- Processed workpieces move in the reverse sequence, with the process robot 46 carrying them in a carrier 48 back to the transfer station 40 , where the transfer robot 50 removes workpieces 35 , one at a time from the carrier 48 and places them back into a box 25 .
- the design and operation of the processing system is generally described in U.S. patent application Ser. Nos. 09/612,009; 09/611,709; and 09/735,154, all incorporated herein by reference.
- the transfer robot 50 has an end effector or hand 55 attached to an articulated arm 51 of a cylinder robot 78 , such as, for example, a Gencobot telescopic robot available from Genmark Automation, Sunnyvale, Calif., U.S.A.
- the cylinder robot 78 can telescope vertically and drive the articulated arm 51 , to move the end effector 55 in multiple degrees of freedom, as is well known.
- the end effector 55 has a first arm or tine 62 and a second arm or tine 64 extending out of a housing 60 .
- Each of the arms 62 and 64 has two inserts or workpiece contacts 66 .
- the arms 62 and 64 are moveable from an open position, shown in FIG. 9, to a closed position, shown in FIG. 10. With the arms 62 and 64 in the closed position, the inserts 66 are geometrically positioned at the corners of a square 65 . With the arms in the open position, the inserts 66 are geometrically located at the corners of a rectangle 67 , having a top and bottom A and B slightly longer than the sides C.
- each of the inserts 66 has a base 68 secured into an arm 62 or 64 .
- An angled annular insert lip 70 extends radially outwardly from the base 68 .
- a cap 72 attached to the lip 70 forms a groove or slot 75 , with the lip 70 , adapted to engage the edge of a workpiece.
- the inserts are preferably an electrically conducting material. Wires connect each of the inserts 66 to an amplifier 118 in the housing 60 .
- the amplifier 66 is connected to a system controller/computer through the cylinder robot 78 .
- the first arm 62 is attached to a first slide block 102 by clamp plates 112 and fasteners 114 .
- the second arm 64 is attached to a second slide block 104 with clamp plates 112 and fasteners 114 .
- Both slide blocks 102 and 104 are slidable on guide rails 106 laterally, in the direction L shown in FIG. 5.
- the slide blocks 102 and 104 , and the arms 62 and 64 attached to them can move only together and away from each other, in direction L.
- a first link 100 is pivotably attached to the first slide block 102 and to a first end of a cross arm 96 .
- a second link 98 is similarly pivotably attached to the second slide block 104 and to a second end of the cross arm 96 , opposite from the first link 100 .
- the cross arm 96 is pivotably supported on the housing 60 .
- An actuator 92 has a piston attached at one side of the cross arm 96 through a clevis 95 .
- the actuator 92 is preferably a pneumatic actuator connected to pneumatic valves 116 within the housing 60 .
- Compressed air or gas lines from a compressed gas source in the processing system 20 extend in or on the cylinder robot 78 and connect to the valves 116 in the housing 60 through a supply line 90 .
- Several of the lines connecting the valves 116 to the actuator 92 or supply line 90 are omitted for clarity of illustration.
- the actuator 92 alternatively may be electrically powered.
- An optical workpiece mapping sensor 120 is optionally also provided in the housing 60 .
- the cross arm 96 , first arm 100 and second arm 98 form a parallel acting linkage 94 .
- the cross arm 96 is turned clockwise. This moves the first slide block 102 and the second slide block 104 and the arms 62 and 64 attached to the slide blocks 102 and 104 , away from each other, with equal and opposite movement.
- the cylinder robot 78 moves the end effector 55 so that the arms 62 and 64 are underneath the workpiece 35 to be picked up.
- the inserts 72 are all equally distant from the edge 37 of the workpiece 35 .
- the actuator 92 is energized to move the cross arm 96 counterclockwise (in FIGS. 5 and 6). This movement brings the arms and the inserts 66 towards each other in a straight line.
- the inserts 66 accordingly move into contact with the edges 37 of the workpiece 35 and contact the edge 37 simultaneously, or near simultaneously. Consequently, sliding of the workpiece 35 during engagement by the end effector 55 is reduced or eliminated.
- the actuator 92 exerts nominal force, so that the workpiece 35 is handled gently.
- the inserts 66 may form a capacitive sensor. As the inserts 66 contact the workpiece 35 , a change in capacitance is detected, amplified by the amplifier 118 , and a corresponding signal is provided to the system controller. This change in capacitance verifies the presence of the wafer edge in contact with the inserts 66 . If the end effector 55 is moved to pick up a workpiece 35 , and the arms 62 and 64 move in to the position shown in FIG.
- the system controller or computer may determine that the workpiece 35 is not properly engaged by the end effector 55 , that a workpiece 35 is missing from an intended position, or that another condition exists which must be resolved before further workpiece movements are initiated.
- a first micro-switch 110 is closed when the linkage 94 and arms 62 and 64 are fully open. This indicates to the controller that the arms are positioned as shown in FIG. 9, so that they are ready to pick up a workpiece.
- a second micro-switch 108 detects an inward arm movement limit condition, when the cross arm 96 contacts the switch 108 . The switch 108 detects an over position movement, indicating that the arms 62 and 64 are too close together to be picking up or holding a workpiece 35 .
- the actuator 92 may be replaced by a spring mounted stepper motor actuator.
- the arms move together or close until the spring is compressed by a predetermined distance. This provides a secure centered grip on the workpiece.
- the arms 62 and 64 and inserts 66 have a low profile, allowing the end effector 55 to pick up a workpiece in the middle of an array of workpieces within a container 25 .
- the arms 62 and 64 are preferably ceramic, so that they have minimal bending deflection.
- the mapping sensor 120 has an optical emitter and sensor directed out of the back end of the housing 60 (opposite from the arms 62 and 64 ).
- the cylinder robot 78 moves the end effector 55 , with the arms 62 and 64 facing away from the workpieces, and with the back end of the housing 60 facing the workpieces, to allow the mapping sensor 120 to scan workpieces in the carriers 48 , or in the containers 25 .
- the mapping sensor 120 is electrically connected via the line 90 to the system controller/computer, for optically detecting incorrectly placed workpieces.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
- This application is Continuation-in-Part of U.S. patent application Ser. No. 09/274,511, filed Mar. 23, 1999 and now pending, which is a Continuation-in-Part of U.S. patent application Ser. No. 09/112,259, filed Jul. 8, 1998, and now pending, which is a Continuation-in-Part of U.S. patent application Ser. No. 08/994,737, filed Dec. 19, 1997, and now pending, which is a Continuation-in-Part of U.S. patent application Ser. No. 08/851,480, filed May 5, 1997 and now abandoned. This Application is also a Continuation-in-Part of U.S. patent application Ser. No. 09/612,009, filed Jul. 7, 2000 and now pending. Priority to these applications is claimed under 35 USC § 120, and these applications are incorporated herein by reference.
- The field of the invention is automated workpiece processing systems, used for processing workpieces, such as semiconductor wafers, hard disk media, substrates, optical materials, as well as other workpieces formed from a substrate upon which microelectronic circuits or components, data storage elements or layers, and/or micro-mechanical elements are or can be formed. These and similar materials generally requiring very low levels of contamination, are collectively referred to here as “wafers” or “workpieces”.
- Computers, televisions, telephones and other electronic product contain large numbers of essential electronic semiconductor devices. To produce electronic products, hundreds or thousands of semiconductor devices are manufactured in a very small space, using lithography techniques on semiconductor substrates, such as on silicon wafers or other substrates. Due to the extremely small dimensions involved in manufacturing semiconductor devices, contaminants on the semiconductor substrate material, such as particles of dust, dirt, paint, metal, etc. lead to defects in the end products.
- Existing automated semiconductor processing system use robots, carriers, rotors, and other devices, to move and process wafers. Many automated semiconductor processing systems use centrifugal wafer processors, which spin the wafers in a rotor at high speed, while spraying or otherwise applying process fluids and/or gases onto the wafers. The rotors typically hold a batch of wafers in a parallel array. Other types of processors have a fixed or rotating workpiece supports holding workpieces within a chamber. Process fluids, such as liquids, gases or vapors are introduced into the chamber to process the workpieces. Typically, automated semiconductor processing system have robots which move workpieces between different stations or locations, as described, for example, in U.S. Pat. Nos. 5,544,421 and 5,664,337, incorporated herein by reference. In some systems the robots handle the workpieces directly, generally by picking them up or holding the workpiece at the edges of the workpiece. Other systems have robots which handle workpieces using suction cups or similar devices on the top or bottom surface of the workpiece.
- These types of robots and handling techniques have certain disadvantages. Micro-electronic devices or other components necessary in the ultimate product manufactured from the workpiece (e.g., micro-electronic circuits) are created on the front and/or back surfaces of the workpiece. Consequently, handling the workpiece on these surfaces can lead to defects and reduced yield in the manufacturing process. As a result, handling workpieces by their edges is preferred, because no components are formed at the edges. However, handling workpieces at the edges requires precise positioning of the robot for pick up and placement of a workpiece. In addition, as the workpieces are typically fragile, they must be handled gently by the robot. Rubbing or scraping of a workpiece, or rough handling, may also result in damage or the creation of particles which may settle on a workpiece, resulting in defects.
- Robots which handle workpieces by their edges have been used, with varying degrees of success. However, these robots require precise pre-positioning, before making contact with the workpiece. While the added time required for pre-positioning a robot for a single workpiece pick up operation may be relatively little, the added time for this positioning and movement, over hundreds or thousands of workpiece pick up cycles, becomes substantial.
- Accordingly, an improved robot and workpiece handling methods are needed for use in an automated workpiece processing system.
- A workpiece handling robot has now been invented for picking up and handling workpieces by their edges in a quick and direct way, and without the need for extensive time-consuming precise alignment or pre-positioning of the robot relative to the workpiece. In a first aspect, an automated processing system has a robot at a transfer station. The robot withdraws workpieces from a container at a docking station and moves the workpieces to a carrier. The robot has an end effector or hand having first and second arms or tines. Each arm has a workpiece contact. The robot is moved so that the workpiece is between the arms. The arms are then brought together, with the workpiece contacts engaging the edges of the workpiece. The arms preferably remain parallel at all times. The contacts on the arms preferably move linearly to contact and pick up the workpiece. Extensive robot pre-positioning movements, to align the robot with the workpiece, are avoided. In addition, the workpiece contacts preferably contact the workpiece edges nearly simultaneously. This reduces or avoids sliding movement of the workpiece, which can cause damage or contamination to the workpiece.
- In a second aspect, the first and second arms are driven by a linkage which moves the arms simultaneously in equal and opposite directions. This provides for automatic precise four-point contact between the robot and the workpiece, resulting in simplified and expedited handling.
- In a third aspect, an actuator drives the linkage moving the first and second arms. The limited amount of force exerted by the actuator on the linkage correspondingly limits the force which the workpiece contacts on the arms may exert on the workpiece. As a result, gentle handling of the workpiece is automatically provided.
- In a fourth aspect, sensors are provided on the robot, to detect whether the robot has successfully picked up a workpiece. This feature reduces potential for damage to workpieces, by signaling the robot controller to stop or reverse robot movement, when appropriate.
- Other advantageous features will also be shown and described. The invention resides as well in subcombinations of the components and methods described. It is an object of the invention to provide an improved robot for handling workpieces in an automated workpiece processing system.
- In the drawings, wherein the same reference number indicates the same element, in all of the views:
- FIG. 1 is a perspective view of an automated processing system, with enclosure walls removed for purpose of illustration;
- FIG. 2 is a plan view of the system of FIG. 1, with enclosure walls removed for purposes of illustration;
- FIG. 3 is a front and right side perspective view of the interface section shown in FIGS. 1 and 2, with enclosure walls removed for purposes of illustration;
- FIG. 4 is a rear and left side perspective view thereof;
- FIG. 5 is an exploded perspective view of the end effector of the robot shown in FIGS. 1 and 2;
- FIG. 6 is a top view of the end effector shown in FIG. 5, with the cover removed;
- FIG. 7 is a section view taken along line7-7 of FIG. 6;
- FIG. 8 is a section view taken along line8-8 of FIG. 6;
- FIG. 9 is a plan view showing the end effector of FIGS.5-8 positioned to engage or pick up a workpiece;
- FIG. 10 is a plan view of the end effector in FIG. 9 holding a workpiece;
- FIG. 11 is a section view taken along line11-11 of FIG. 10;
- FIG. 12 is a perspective view showing the end effector of FIGS.5-8 picking up a workpiece from an array of workpieces within a container.
- Turning now in detail to the drawings, as shown in FIGS. 1 and 2, an
automated processing system 20 has aninterface section 42 along side of aprocess section 44 within anenclosure 22.Workpieces 35 within a container, such as an FOUP box or container, are placed onto an input/output station 24, and then moved into anindexer 26 within theenclosure 22. Theindexer 26 temporarily stores the workpieces, either waiting for processing, or waiting for removal from theprocessing system 20. This allows theprocessing system 20 to run continuously.Elevators 28 at the back end of theindexer 26move boxes 25 vertically between theindexer 26 and adocking station 30. At thedocking station 30, theboxes 25 are placed or sealed against awall 32. Acover 36 over an opening 34 in thewall 32 is removed by acover actuator 38. Atransfer robot 50 at atransfer station 40 removesworkpieces 35 from theboxes 25 and places them into acarrier 48. Aprocess robot 46 carries the loadedcarrier 48 to aprocessor 52. - Processed workpieces move in the reverse sequence, with the
process robot 46 carrying them in acarrier 48 back to thetransfer station 40, where thetransfer robot 50 removesworkpieces 35, one at a time from thecarrier 48 and places them back into abox 25. The design and operation of the processing system is generally described in U.S. patent application Ser. Nos. 09/612,009; 09/611,709; and 09/735,154, all incorporated herein by reference. - Referring to FIG. 2, the
transfer robot 50 has an end effector orhand 55 attached to an articulatedarm 51 of a cylinder robot 78, such as, for example, a Gencobot telescopic robot available from Genmark Automation, Sunnyvale, Calif., U.S.A. The cylinder robot 78 can telescope vertically and drive the articulatedarm 51, to move theend effector 55 in multiple degrees of freedom, as is well known. - Turning to FIG. 5, the
end effector 55 has a first arm ortine 62 and a second arm ortine 64 extending out of ahousing 60. Each of thearms workpiece contacts 66. Thearms arms inserts 66 are geometrically positioned at the corners of a square 65. With the arms in the open position, theinserts 66 are geometrically located at the corners of arectangle 67, having a top and bottom A and B slightly longer than the sides C. - Referring to Figure11, each of the
inserts 66 has a base 68 secured into anarm base 68. Acap 72 attached to the lip 70 forms a groove or slot 75, with the lip 70, adapted to engage the edge of a workpiece. The inserts are preferably an electrically conducting material. Wires connect each of theinserts 66 to anamplifier 118 in thehousing 60. Theamplifier 66 is connected to a system controller/computer through the cylinder robot 78. - Referring to FIGS.5-8, the
first arm 62 is attached to afirst slide block 102 byclamp plates 112 andfasteners 114. Similarly, thesecond arm 64 is attached to asecond slide block 104 withclamp plates 112 andfasteners 114. Both slide blocks 102 and 104 are slidable onguide rails 106 laterally, in the direction L shown in FIG. 5. The slide blocks 102 and 104, and thearms first link 100 is pivotably attached to thefirst slide block 102 and to a first end of across arm 96. Asecond link 98 is similarly pivotably attached to thesecond slide block 104 and to a second end of thecross arm 96, opposite from thefirst link 100. Thecross arm 96 is pivotably supported on thehousing 60. Anactuator 92 has a piston attached at one side of thecross arm 96 through aclevis 95. Theactuator 92 is preferably a pneumatic actuator connected topneumatic valves 116 within thehousing 60. Compressed air or gas lines from a compressed gas source in theprocessing system 20 extend in or on the cylinder robot 78 and connect to thevalves 116 in thehousing 60 through a supply line 90. Several of the lines connecting thevalves 116 to theactuator 92 or supply line 90 are omitted for clarity of illustration. - The
actuator 92 alternatively may be electrically powered. An opticalworkpiece mapping sensor 120 is optionally also provided in thehousing 60. - The
cross arm 96,first arm 100 andsecond arm 98 form aparallel acting linkage 94. Referring to FIGS. 4 and 5, when theactuator 92 extends, thecross arm 96 is turned clockwise. This moves thefirst slide block 102 and thesecond slide block 104 and thearms - Referring to FIG. 9, in use, the cylinder robot78 moves the
end effector 55 so that thearms workpiece 35 to be picked up. Theinserts 72 are all equally distant from the edge 37 of theworkpiece 35. Theactuator 92 is energized to move thecross arm 96 counterclockwise (in FIGS. 5 and 6). This movement brings the arms and theinserts 66 towards each other in a straight line. Theinserts 66 accordingly move into contact with the edges 37 of theworkpiece 35 and contact the edge 37 simultaneously, or near simultaneously. Consequently, sliding of theworkpiece 35 during engagement by theend effector 55 is reduced or eliminated. Theactuator 92 exerts nominal force, so that theworkpiece 35 is handled gently. - The
inserts 66 may form a capacitive sensor. As theinserts 66 contact theworkpiece 35, a change in capacitance is detected, amplified by theamplifier 118, and a corresponding signal is provided to the system controller. This change in capacitance verifies the presence of the wafer edge in contact with theinserts 66. If theend effector 55 is moved to pick up aworkpiece 35, and thearms inserts 66, the system controller or computer may determine that theworkpiece 35 is not properly engaged by theend effector 55, that aworkpiece 35 is missing from an intended position, or that another condition exists which must be resolved before further workpiece movements are initiated. - Referring to FIGS. 5 and 6, a
first micro-switch 110 is closed when thelinkage 94 andarms second micro-switch 108 detects an inward arm movement limit condition, when thecross arm 96 contacts theswitch 108. Theswitch 108 detects an over position movement, indicating that thearms workpiece 35. - The
actuator 92 may be replaced by a spring mounted stepper motor actuator. In this alternative design, the arms move together or close until the spring is compressed by a predetermined distance. This provides a secure centered grip on the workpiece. - As shown in FIG. 12, the
arms end effector 55 to pick up a workpiece in the middle of an array of workpieces within acontainer 25. Thearms mapping sensor 120 has an optical emitter and sensor directed out of the back end of the housing 60 (opposite from thearms 62 and 64). The cylinder robot 78 moves theend effector 55, with thearms housing 60 facing the workpieces, to allow themapping sensor 120 to scan workpieces in thecarriers 48, or in thecontainers 25. Themapping sensor 120 is electrically connected via the line 90 to the system controller/computer, for optically detecting incorrectly placed workpieces. - Thus, a novel robot for an automated process system has been shown and described. Of course, many changes, modifications and substitutions may be made, without departing from the spirit and scope of the invention. The invention, therefore, should not be limited, except by the following claims and their equivalents.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/907,523 US6572320B2 (en) | 1997-05-05 | 2001-07-16 | Robot for handling workpieces in an automated processing system |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85148097A | 1997-05-05 | 1997-05-05 | |
US08/994,737 US6447232B1 (en) | 1994-04-28 | 1997-12-19 | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
US09/112,259 US6273110B1 (en) | 1997-12-19 | 1998-07-08 | Automated semiconductor processing system |
US09/274,511 US6279724B1 (en) | 1997-12-19 | 1999-03-23 | Automated semiconductor processing system |
US09/612,009 US6942738B1 (en) | 1996-07-15 | 2000-07-07 | Automated semiconductor processing system |
US09/907,523 US6572320B2 (en) | 1997-05-05 | 2001-07-16 | Robot for handling workpieces in an automated processing system |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US09/274,511 Continuation-In-Part US6279724B1 (en) | 1996-03-26 | 1999-03-23 | Automated semiconductor processing system |
US09/612,009 Continuation-In-Part US6942738B1 (en) | 1996-03-26 | 2000-07-07 | Automated semiconductor processing system |
Publications (2)
Publication Number | Publication Date |
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US20020051700A1 true US20020051700A1 (en) | 2002-05-02 |
US6572320B2 US6572320B2 (en) | 2003-06-03 |
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US09/907,523 Expired - Lifetime US6572320B2 (en) | 1997-05-05 | 2001-07-16 | Robot for handling workpieces in an automated processing system |
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US (1) | US6572320B2 (en) |
Cited By (2)
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US20040120797A1 (en) * | 2002-12-19 | 2004-06-24 | Texas Instruments Incorpprated | Method and system for eliminating wafer protrusion |
CN109923657A (en) * | 2016-09-08 | 2019-06-21 | 布鲁克斯自动化公司 | Substrate-treating apparatus |
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JP2004535681A (en) * | 2001-07-14 | 2004-11-25 | ブルックス オートメーション インコーポレイテッド | Centered bilateral edge grip end effector with integrated mapping sensor |
CN1608308A (en) * | 2001-11-13 | 2005-04-20 | Fsi国际公司 | Reduced footprint tool for automated processing of microelectronic substrates |
US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
CN1618716B (en) * | 2003-11-12 | 2011-03-16 | 周星工程股份有限公司 | Loading lock and loading lock chamber therewith |
US7422253B2 (en) * | 2004-06-30 | 2008-09-09 | Lg Display Co., Ltd. | Glass handling tool and method of carrying glass |
US7712808B2 (en) * | 2005-09-29 | 2010-05-11 | Brooks Automation, Inc. | End effector with centering grip |
US7520286B2 (en) | 2005-12-05 | 2009-04-21 | Semitool, Inc. | Apparatus and method for cleaning and drying a container for semiconductor workpieces |
JP2012243335A (en) * | 2011-05-17 | 2012-12-10 | Sony Corp | Disk conveyance device and disk storage system |
CN103400789B (en) * | 2013-08-01 | 2018-01-26 | 上海集成电路研发中心有限公司 | Equipment platform system and its wafer transfer method |
US9536764B2 (en) * | 2015-01-27 | 2017-01-03 | Lam Research Corporation | End effector for wafer transfer system and method of transferring wafers |
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US4639028A (en) * | 1984-11-13 | 1987-01-27 | Economic Development Corporation | High temperature and acid resistant wafer pick up device |
US4735452A (en) * | 1986-12-19 | 1988-04-05 | Texas Instruments Incorporated | Article gripper assembly |
US5022695A (en) | 1989-01-30 | 1991-06-11 | Texas Instruments Incorporated | Semiconductor slice holder |
CH680275A5 (en) | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
JP2867194B2 (en) * | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | Processing device and processing method |
US5404894A (en) | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
US6447232B1 (en) * | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
US5590996A (en) | 1994-10-13 | 1997-01-07 | Semitherm | Wafer transfer apparatus |
US5700046A (en) * | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
US6279724B1 (en) * | 1997-12-19 | 2001-08-28 | Semitoll Inc. | Automated semiconductor processing system |
US6322119B1 (en) * | 1999-07-09 | 2001-11-27 | Semitool, Inc. | Robots for microelectronic workpiece handling |
US5988971A (en) * | 1997-07-09 | 1999-11-23 | Ade Optical Systems Corporation | Wafer transfer robot |
-
2001
- 2001-07-16 US US09/907,523 patent/US6572320B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040120797A1 (en) * | 2002-12-19 | 2004-06-24 | Texas Instruments Incorpprated | Method and system for eliminating wafer protrusion |
CN109923657A (en) * | 2016-09-08 | 2019-06-21 | 布鲁克斯自动化公司 | Substrate-treating apparatus |
EP3510633B1 (en) * | 2016-09-08 | 2023-05-31 | Brooks Automation US, LLC | Substrate processing apparatus |
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