US20020025372A1 - Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon - Google Patents
Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon Download PDFInfo
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- US20020025372A1 US20020025372A1 US09/785,858 US78585801A US2002025372A1 US 20020025372 A1 US20020025372 A1 US 20020025372A1 US 78585801 A US78585801 A US 78585801A US 2002025372 A1 US2002025372 A1 US 2002025372A1
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000000151 deposition Methods 0.000 claims abstract description 66
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000010936 titanium Substances 0.000 claims abstract description 32
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 17
- 229910001069 Ti alloy Inorganic materials 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims description 41
- 230000008021 deposition Effects 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 79
- 235000012431 wafers Nutrition 0.000 description 29
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000012634 fragment Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- WYEMLYFITZORAB-UHFFFAOYSA-N boscalid Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1NC(=O)C1=CC=CN=C1Cl WYEMLYFITZORAB-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7685—Barrier, adhesion or liner layers the layer covering a conductive structure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76867—Barrier, adhesion or liner layers characterized by methods of formation other than PVD, CVD or deposition from a liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1068—Formation and after-treatment of conductors
- H01L2221/1073—Barrier, adhesion or liner layers
- H01L2221/1078—Multiple stacked thin films not being formed in openings in dielectrics
Definitions
- This invention relates to methods of forming aluminum comprising lines having a titanium nitride comprising layer thereon.
- Conductive metal lines and contacts are one of the many components typically fabricated in semiconductor processing of integrated circuitry.
- a semiconductor wafer fragment 10 comprised of a bulk monocrystalline silicon substrate 12 .
- semiconductor substrate or “semiconductive substrate” is defined to mean any construction comprising semiconductive material, including, but not limited to, bulk semiconductive materials such as a semiconductive wafer (either alone or in assemblies comprising other materials thereon), and semiconductive material layers (either alone or in assemblies comprising other materials).
- substrate refers to any supporting structure, including, but not limited to, the semiconductive substrates described above.
- An exemplary insulating layer 14 is formed over substrate 12 .
- a titanium layer 16 is formed over layer 14 .
- An example thickness for layer 16 is 400 Angstroms.
- An aluminum or aluminum alloy layer 18 is formed over layer 16 .
- An example thickness is 6000 Angstroms.
- Metal layers 16 and 18 in one aspect of the prior art can be conventionally deposited using physical vapor deposition semiconductor processing tools, such as the Applied Materials Endura 5500TM physical vapor deposition tool.
- a tool comprises multiple processing chambers within which various processing, such as pre-clean, deposition and cooling, are conducted.
- titanium layer 16 could be deposited in a processing chamber of the tool having a titanium sputtering target received therein.
- Layer 18 would typically likewise be deposited in another chamber having an aluminum or an aluminum alloy sputtering target received therein.
- Layer 18 might also be deposited in one or multiple depositions in the same or different aluminum deposition chambers.
- a lattermost of such depositions, where multiple depositions are conducted includes a high temperature sputter deposition at a temperature of, for example, 450° C.
- the wafer is typically moved to another chamber for deposition of a titanium nitride comprising layer 20 .
- An example thickness for layer 20 is from about 150 Angstroms to about 250 Angstroms.
- Layer 20 is typically provided to function as an antireflective coating layer which facilitates subsequent photolithographic processing.
- defects in the form of bright, circular areas or formations 22 have been forming atop layer 20 when viewed by a scanning electron microscope. These defect areas 22 have been determined to be one or combination of aluminum or aluminum oxide apparently resulting from migration of aluminum from layer 18 through cracks formed in layer 20 which exist at least during its deposition. Formation of these defect regions 22 is undesirable. It has been surmised the aluminum migrates through cracks in layer 20 .
- a prior art solution to the existing problem has been to position the wafer into a dedicated cooling chamber within the processing tool prior to conducting the titanium nitride deposition in a different chamber.
- the cooling takes a considerable amount of time, and effectively lengthens the amount of time it ultimately takes to process a batch of wafers utilizing the processing tool.
- the invention includes methods of forming aluminum containing lines having titanium nitride containing layers thereon, and preferably by physical vapor deposition.
- a first layer including at least one of elemental aluminum or an aluminum alloy is formed over a substrate.
- a second layer including an alloy of titanium and the aluminum from the first layer is formed.
- the alloy has a higher melting point than that of the first layer.
- a third layer including titanium nitride is formed over the second layer.
- the first, second and third layers are formed into a conductive line.
- a method of forming an aluminum containing line having a titanium nitride containing layer thereon includes physical vapor depositing a first layer having at least one of elemental aluminum or an aluminum alloy over a substrate.
- At least one of elemental titanium or a titanium alloy is physical vapor deposited on the first layer, and formed therefrom is a second layer comprising an alloy of titanium and the aluminum from the first layer.
- the alloy has a higher melting point than that of the first layer.
- a third layer comprising titanium nitride is physical vapor deposited over the second layer. The first, second and third layers are photopatterned into a conductive line.
- FIG. 1 is a diagrammatic sectional view of a semiconductor wafer fragment processed in accordance with the prior art, and is discussed in the “Background” section above.
- FIG. 2 is a diagrammatic sectional view of a semiconductor wafer fragment at one processing step in accordance with an aspect of the invention.
- FIG. 3 is a view of the FIG. 2 wafer at a processing step subsequent to that shown by FIG. 2.
- FIG. 4 is a view of the FIG. 2 wafer at a processing step subsequent to that shown by FIG. 3.
- FIG. 5 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 4.
- FIG. 6 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 5.
- FIG. 7 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 6.
- FIG. 8 is a diagrammatic plan view of a semiconductor wafer processor utilizable in fabrication of the exemplary semiconductor wafer depicted in the FIGS. 2 - 7 embodiment.
- a semiconductor wafer fragment in process is indicated generally with reference numeral 30 .
- Such comprises a bulk monocrystalline silicon substrate 32 having a diffusion region 34 formed therein.
- An insulating layer 36 has been formed thereover, with a contact opening 38 having been formed therethrough to diffusion region 34 .
- processing would then be conducted for deposition of subsequent metal layers in a physical vapor deposition semiconductor processing tool, such as tool 70 depicted in FIG. 8.
- a physical vapor deposition semiconductor processing tool such as tool 70 depicted in FIG. 8.
- Such comprises an example processing tool, such as the Applied Materials Endura 5500TM system. Alternate processing tools are, of course, usable.
- the depicted system 70 comprises a buffering high vacuum chamber 72 and an ultra-high transfer chamber 74 .
- Buffer chamber 72 is connected with a pair of load-lock chambers 78 within which a plurality of wafers for processing can be received.
- a pair of degassing chambers 80 are also associated with buffer chamber 72 . Wafers, prior to depositions using the tool, can be processed here to remove water or other materials therefrom.
- Another pair of pre-clean or deposition chambers 82 are also associated with buffer chamber 72 . Pre-cleaning of the wafers prior to transfer through one of passthroughs 76 to transfer chamber 74 can occur here, such as sputter cleaning using an inert gas.
- Transfer chamber 74 is shown as having five discrete processing chambers 84 , 86 , 88 , 90 , and 92 associated therewith. Their exemplary functions and operations in accordance with best mode principles of the invention are described relative to the processing of the exemplary embodiment wafer from FIGS. 2 through 6.
- the FIG. 2 wafer is positioned within chamber 84 (FIG. 8) for deposition of a titanium layer 40 .
- Deposition of layer 40 is preferred to provide silicide formation (not shown) in contact opening 70 at the interface with silicon material 32 / 34 .
- titanium layer provides a wetting layer to subsequently deposited metal layers.
- the deposition in the depicted tool would be by physical vapor deposition (i.e., sputtering) using a titanium target.
- An example would be to provide 2500 watts of power on the target, argon flow of 35 sccm at ambient temperature, and a pressure of 1.5 mTorr.
- An exemplary deposition time is for 15 seconds to produce a layer 40 having a thickness of approximately 400 Angstroms.
- FIG. 3 wafer would then be removed from chamber 84 and positioned within chamber 86 .
- Chamber 86 preferably includes an elemental aluminum or an aluminum alloy target therein.
- a layer comprising at least one of elemental aluminum or an aluminum alloy is then physical vapor deposited over the substrate.
- the wafer is then preferably removed from chamber 86 and positioned within another aluminum deposition chamber 88 .
- Physical vapor deposition of aluminum within chamber 88 is then conducted at a higher temperature, with the desired goal being the ultimate production of a layer 42 (FIG. 4) having an exemplary thickness of 6000 Angstroms.
- layer 42 is referred to as a first layer, and most preferably consists essentially of elemental aluminum, an aluminum alloy or a mixture thereof.
- Exemplary processing for both the chamber 86 and chamber 88 depositions include argon flow of from 15 to 50 sccm and pressure at from 0.5 to 5 mTorr. Temperature during the first chamber 86 deposition is preferably at 100° C. or less, while temperature during deposition in chamber 88 is at 400° C., and more preferably at 450° C. or greater. Power during the first chamber 86 deposition is preferably at from 10,000 Watts to 15,000 Watts, while power during the second chamber 88 deposition if preferably at from 1000 watts to 2000 watts. Thus, an outermost portion of layer 42 is preferably deposited at a temperature of at least about 400° C., and more preferably at a temperature of at least about 450° C.
- FIG. 4 wafer is removed from chamber 88 and positioned within another deposition chamber 90 .
- at least one of elemental titanium or a titanium alloy is physical vapor deposited on first layer 42
- a second layer 44 (FIG. 5) is formed therefrom to comprise an alloy of the depositing titanium and aluminum from first layer 42 .
- alloy second layer 44 forms during and upon contact by the titanium deposition.
- essentially all of the titanium deposited alloys with aluminum of first layer 42 is from about 50 Angstroms to about 150 Angstroms, and even more preferably from about 100 Angstroms to about 200 Angstroms.
- Example deposition conditions for layer 44 include a titanium target powered at 1000 watts, argon gas flow rate at 35 sccm, ambient steady state temperature, and a pressure of 1.5 mTorr to provide a preferred deposition thickness of from about 100 Angstroms to about 200 Angstroms.
- first layer 42 in such circumstances will have a temperature of at least about 360° C. during the physical vapor depositing of titanium to form titanium-aluminum alloy layer 44 .
- titanium and aluminum will form an alloy having a significantly higher melting point than that of first layer 42 , and thus preferably effectively form a shield to migration of aluminum through layer 44 during or after it's formation, particularly where subsequent processing occurs at temperatures below the melting point of titanium-aluminum alloy layer 44 .
- a third layer 46 comprising titanium nitride is physical vapor deposited over and preferably on (i.e., in contact with) second layer 44 .
- Such processing preferably is conducted in the same processing chamber 90 within which layer 44 was formed. Such will also thereby typically be conducted while at least an outer portion of layer 42 is at a temperature of at least 360° C.
- An example and preferred thickness for layer 46 is from about 150 Angstroms to about 250 Angstroms.
- Example deposition conditions for forming layer 46 include 6000 watts of power on a titanium target within chamber 90 , an N 2 or other nitrogen containing gas flow rate of 35 sccm, argon flow rate of 15 sccm, ambient steady state temperature, and a pressure of 2.0 mTorr. Accordingly in the preferred embodiment, physical vapor deposition of titanium to form layer 44 and the physical vapor deposition to form third layer 46 occur in the same deposition chamber, and without moving the substrate therefrom intermediate the elemental titanium and third layer depositions. Alternately but less preferred, such depositions could be conducted in different chambers.
- FIG. 6 wafer would be removed from deposition chamber 90 and inserted in a cooling chamber 92 .
- Example cooling would be to flow argon gas therethrough at room temperature for from 45 seconds to 60 seconds.
- the substrate would be removed from processing chamber 92 , through one of passageways 76 , and ultimately out of buffer chamber 72 through one of load-lock chambers 78 . Accordingly, the substrate is ultimately removed from processing tool 70 .
- layers 46 , 44 , 42 and 40 are preferably photopatterned (i.e., using photolithography) to form a conductive line 50 having a contacting plug therebelow making electrical connection with diffusion region 34 .
- a conductive line 50 having a contacting plug therebelow making electrical connection with diffusion region 34 .
- an aluminum comprising line having a titanium nitride comprising layer thereon is fabricated.
- the above-described and preferred processing is all associated with physical vapor deposition, and preferably in a single processing tool for fabrication of the metal layers over the substrate, and further using subsequent photopatterning.
- the invention also contemplates other methods of forming the depicted and described first, second and third layers, such as by way of example only, chemical vapor deposition or other techniques developed or yet to be developed. Further, existing or to-be-developed processing other than photopatterning could be used to form an ultimate desired line shape.
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Abstract
The invention includes methods of forming aluminum containing lines having titanium nitride containing layers thereon, and preferably by physical vapor deposition. In one aspect, a first layer including at least one of elemental aluminum or an aluminum alloy is formed over a substrate. A second layer including an alloy of titanium and the aluminum from the first layer is formed. The alloy has a higher melting point than that of the first layer. A third layer including titanium nitride is formed over the second layer. The first, second and third layers are formed into a conductive line. In one aspect, a method of forming an aluminum containing line having a titanium nitride containing layer thereon includes physical vapor depositing a first layer having at least one of elemental aluminum or an aluminum alloy over a substrate. At least one of elemental titanium or a titanium alloy is physical vapor deposited on the first layer, and formed therefrom is a second layer comprising an alloy of titanium and the aluminum from the first layer. The alloy has a higher melting point than that of the first layer. A third layer comprising titanium nitride is physical vapor deposited over the second layer. The first, second and third layers are photopatterned into a conductive line.
Description
- This invention relates to methods of forming aluminum comprising lines having a titanium nitride comprising layer thereon.
- Conductive metal lines and contacts are one of the many components typically fabricated in semiconductor processing of integrated circuitry. One example process of doing so, and problems associated therewith, is described with reference to FIG. 1. There illustrated is a
semiconductor wafer fragment 10 comprised of a bulkmonocrystalline silicon substrate 12. In the context of this document, the term “semiconductor substrate” or “semiconductive substrate” is defined to mean any construction comprising semiconductive material, including, but not limited to, bulk semiconductive materials such as a semiconductive wafer (either alone or in assemblies comprising other materials thereon), and semiconductive material layers (either alone or in assemblies comprising other materials). The term “substrate” refers to any supporting structure, including, but not limited to, the semiconductive substrates described above. An exemplaryinsulating layer 14 is formed oversubstrate 12. Atitanium layer 16 is formed overlayer 14. An example thickness forlayer 16 is 400 Angstroms. An aluminum oraluminum alloy layer 18 is formed overlayer 16. An example thickness is 6000 Angstroms. -
Metal layers titanium layer 16 could be deposited in a processing chamber of the tool having a titanium sputtering target received therein.Layer 18 would typically likewise be deposited in another chamber having an aluminum or an aluminum alloy sputtering target received therein.Layer 18 might also be deposited in one or multiple depositions in the same or different aluminum deposition chambers. Typically, a lattermost of such depositions, where multiple depositions are conducted, includes a high temperature sputter deposition at a temperature of, for example, 450° C. - After the aluminum deposition, the wafer is typically moved to another chamber for deposition of a titanium
nitride comprising layer 20. An example thickness forlayer 20 is from about 150 Angstroms to about 250 Angstroms.Layer 20 is typically provided to function as an antireflective coating layer which facilitates subsequent photolithographic processing. However, it has been discovered that defects in the form of bright, circular areas orformations 22 have been forming atoplayer 20 when viewed by a scanning electron microscope. Thesedefect areas 22 have been determined to be one or combination of aluminum or aluminum oxide apparently resulting from migration of aluminum fromlayer 18 through cracks formed inlayer 20 which exist at least during its deposition. Formation of thesedefect regions 22 is undesirable. It has been surmised the aluminum migrates through cracks inlayer 20. - A prior art solution to the existing problem has been to position the wafer into a dedicated cooling chamber within the processing tool prior to conducting the titanium nitride deposition in a different chamber. However, the cooling takes a considerable amount of time, and effectively lengthens the amount of time it ultimately takes to process a batch of wafers utilizing the processing tool.
- Accordingly, it would desirable to develop alternate methods of eliminating or at least reducing formation of
defect regions 22, preferably without appreciably significantly increasing the overall processing time for a batch of wafers. - The invention includes methods of forming aluminum containing lines having titanium nitride containing layers thereon, and preferably by physical vapor deposition. In one aspect, a first layer including at least one of elemental aluminum or an aluminum alloy is formed over a substrate. A second layer including an alloy of titanium and the aluminum from the first layer is formed. The alloy has a higher melting point than that of the first layer. A third layer including titanium nitride is formed over the second layer. The first, second and third layers are formed into a conductive line. In one aspect, a method of forming an aluminum containing line having a titanium nitride containing layer thereon includes physical vapor depositing a first layer having at least one of elemental aluminum or an aluminum alloy over a substrate. At least one of elemental titanium or a titanium alloy is physical vapor deposited on the first layer, and formed therefrom is a second layer comprising an alloy of titanium and the aluminum from the first layer. The alloy has a higher melting point than that of the first layer. A third layer comprising titanium nitride is physical vapor deposited over the second layer. The first, second and third layers are photopatterned into a conductive line.
- Preferred embodiments of the invention are described below with reference to the following accompanying drawings.
- FIG. 1 is a diagrammatic sectional view of a semiconductor wafer fragment processed in accordance with the prior art, and is discussed in the “Background” section above.
- FIG. 2 is a diagrammatic sectional view of a semiconductor wafer fragment at one processing step in accordance with an aspect of the invention.
- FIG. 3 is a view of the FIG. 2 wafer at a processing step subsequent to that shown by FIG. 2.
- FIG. 4 is a view of the FIG. 2 wafer at a processing step subsequent to that shown by FIG. 3.
- FIG. 5 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 4.
- FIG. 6 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 5.
- FIG. 7 is a view of the FIG. 2 wafer fragment at a processing step subsequent to that shown by FIG. 6.
- FIG. 8 is a diagrammatic plan view of a semiconductor wafer processor utilizable in fabrication of the exemplary semiconductor wafer depicted in the FIGS.2-7 embodiment.
- This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).
- Referring initially to FIG. 2, a semiconductor wafer fragment in process is indicated generally with
reference numeral 30. Such comprises a bulkmonocrystalline silicon substrate 32 having adiffusion region 34 formed therein. Aninsulating layer 36 has been formed thereover, with a contact opening 38 having been formed therethrough todiffusion region 34. In accordance with a most preferred aspect of the invention, processing would then be conducted for deposition of subsequent metal layers in a physical vapor deposition semiconductor processing tool, such astool 70 depicted in FIG. 8. Such comprises an example processing tool, such as the Applied Materials Endura 5500™ system. Alternate processing tools are, of course, usable. The depictedsystem 70 comprises a bufferinghigh vacuum chamber 72 and anultra-high transfer chamber 74. Such are interconnected by selectively openable and closable pass-throughsections 76.Buffer chamber 72 is connected with a pair of load-lock chambers 78 within which a plurality of wafers for processing can be received. A pair ofdegassing chambers 80 are also associated withbuffer chamber 72. Wafers, prior to depositions using the tool, can be processed here to remove water or other materials therefrom. Another pair of pre-clean ordeposition chambers 82 are also associated withbuffer chamber 72. Pre-cleaning of the wafers prior to transfer through one ofpassthroughs 76 to transferchamber 74 can occur here, such as sputter cleaning using an inert gas. -
Transfer chamber 74 is shown as having fivediscrete processing chambers - Referring to FIG. 3, the FIG. 2 wafer is positioned within chamber84 (FIG. 8) for deposition of a
titanium layer 40. Deposition oflayer 40 is preferred to provide silicide formation (not shown) incontact opening 70 at the interface withsilicon material 32/34. Further, such titanium layer provides a wetting layer to subsequently deposited metal layers. The deposition in the depicted tool would be by physical vapor deposition (i.e., sputtering) using a titanium target. An example would be to provide 2500 watts of power on the target, argon flow of 35 sccm at ambient temperature, and a pressure of 1.5 mTorr. An exemplary deposition time is for 15 seconds to produce alayer 40 having a thickness of approximately 400 Angstroms. - The FIG. 3 wafer would then be removed from
chamber 84 and positioned withinchamber 86.Chamber 86 preferably includes an elemental aluminum or an aluminum alloy target therein. A layer comprising at least one of elemental aluminum or an aluminum alloy is then physical vapor deposited over the substrate. The wafer is then preferably removed fromchamber 86 and positioned within anotheraluminum deposition chamber 88. Physical vapor deposition of aluminum withinchamber 88 is then conducted at a higher temperature, with the desired goal being the ultimate production of a layer 42 (FIG. 4) having an exemplary thickness of 6000 Angstroms. In the context of this document,layer 42 is referred to as a first layer, and most preferably consists essentially of elemental aluminum, an aluminum alloy or a mixture thereof. Exemplary processing for both thechamber 86 andchamber 88 depositions include argon flow of from 15 to 50 sccm and pressure at from 0.5 to 5 mTorr. Temperature during thefirst chamber 86 deposition is preferably at 100° C. or less, while temperature during deposition inchamber 88 is at 400° C., and more preferably at 450° C. or greater. Power during thefirst chamber 86 deposition is preferably at from 10,000 Watts to 15,000 Watts, while power during thesecond chamber 88 deposition if preferably at from 1000 watts to 2000 watts. Thus, an outermost portion oflayer 42 is preferably deposited at a temperature of at least about 400° C., and more preferably at a temperature of at least about 450° C. - The FIG. 4 wafer is removed from
chamber 88 and positioned within anotherdeposition chamber 90. Here, at least one of elemental titanium or a titanium alloy is physical vapor deposited onfirst layer 42, and a second layer 44 (FIG. 5) is formed therefrom to comprise an alloy of the depositing titanium and aluminum fromfirst layer 42. Preferably, alloysecond layer 44 forms during and upon contact by the titanium deposition. Further preferably, essentially all of the titanium deposited alloys with aluminum offirst layer 42. An example and preferred thickness forlayer 44 is from about 50 Angstroms to about 150 Angstroms, and even more preferably from about 100 Angstroms to about 200 Angstroms. Greater deposition thicknesses are of course possible, with a less desired result being ultimate formation of a thicker line layer and possibly an elemental titanium layer being received over the titaniumaluminum alloy layer 44. Example deposition conditions forlayer 44 include a titanium target powered at 1000 watts, argon gas flow rate at 35 sccm, ambient steady state temperature, and a pressure of 1.5 mTorr to provide a preferred deposition thickness of from about 100 Angstroms to about 200 Angstroms. - Where deposition is conducted as typical within
chamber 90 as soon as removing the wafer fromchamber 88, the wafer will typically not have cooled down by much more than 25° C., and perhaps less. Accordingly, at least an outer portion offirst layer 42 in such circumstances will have a temperature of at least about 360° C. during the physical vapor depositing of titanium to form titanium-aluminum alloy layer 44. However, titanium and aluminum will form an alloy having a significantly higher melting point than that offirst layer 42, and thus preferably effectively form a shield to migration of aluminum throughlayer 44 during or after it's formation, particularly where subsequent processing occurs at temperatures below the melting point of titanium-aluminum alloy layer 44. - Referring to FIG. 6, a
third layer 46 comprising titanium nitride is physical vapor deposited over and preferably on (i.e., in contact with)second layer 44. Such processing, preferably is conducted in thesame processing chamber 90 within whichlayer 44 was formed. Such will also thereby typically be conducted while at least an outer portion oflayer 42 is at a temperature of at least 360° C. An example and preferred thickness forlayer 46 is from about 150 Angstroms to about 250 Angstroms. Example deposition conditions for forminglayer 46 include 6000 watts of power on a titanium target withinchamber 90, an N2 or other nitrogen containing gas flow rate of 35 sccm, argon flow rate of 15 sccm, ambient steady state temperature, and a pressure of 2.0 mTorr. Accordingly in the preferred embodiment, physical vapor deposition of titanium to formlayer 44 and the physical vapor deposition to formthird layer 46 occur in the same deposition chamber, and without moving the substrate therefrom intermediate the elemental titanium and third layer depositions. Alternately but less preferred, such depositions could be conducted in different chambers. - Subsequently, the FIG. 6 wafer would be removed from
deposition chamber 90 and inserted in acooling chamber 92. Example cooling would be to flow argon gas therethrough at room temperature for from 45 seconds to 60 seconds. Thereafter, the substrate would be removed from processingchamber 92, through one ofpassageways 76, and ultimately out ofbuffer chamber 72 through one of load-lock chambers 78. Accordingly, the substrate is ultimately removed from processingtool 70. - Referring to FIG. 7, layers46, 44, 42 and 40 are preferably photopatterned (i.e., using photolithography) to form a
conductive line 50 having a contacting plug therebelow making electrical connection withdiffusion region 34. Thus by way of example only, an aluminum comprising line having a titanium nitride comprising layer thereon is fabricated. - Consider, by way of example only, one alternate processing using
processing tool 70. The wafer after completion of processing inchamber 88 could be moved back intochamber 84, with the next new wafer to be processed waiting in one of the pass-throughchambers 76.Third layer 46 could be deposited onto the substrate withinchamber 84. Further, one or both of pass-throughchambers 76 could be used as cooling chambers. - The above-described and preferred processing is all associated with physical vapor deposition, and preferably in a single processing tool for fabrication of the metal layers over the substrate, and further using subsequent photopatterning. However, the invention also contemplates other methods of forming the depicted and described first, second and third layers, such as by way of example only, chemical vapor deposition or other techniques developed or yet to be developed. Further, existing or to-be-developed processing other than photopatterning could be used to form an ultimate desired line shape.
- In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
Claims (34)
1. A method of forming an aluminum comprising line having a titanium nitride comprising layer thereon, the method comprising:
forming a first layer comprising at least one of elemental aluminum or an aluminum alloy over a substrate;
forming a second layer comprising an alloy of titanium and the aluminum from the first layer, the alloy having a higher melting point than that of the first layer;
forming a third layer comprising titanium nitride over the second layer; and
forming the first, second and third layers into a conductive line.
2. The method of claim 1 wherein the titanium nitride of the third layer is formed in contact with the second layer.
3. The method of claim 1 wherein an outermost portion of the first layer is deposited at a temperature of at least about 400° C.
4. The method of claim 1 wherein an outermost portion of the first layer is deposited at a temperature of at least about 450° C.
5. The method of claim 1 comprising forming the second layer to have a thickness of from about 50 Angstroms to about 150 Angstroms.
6. The method of claim 1 comprising forming the second layer to have a thickness of from about 100 Angstroms to about 200 Angstroms.
7. The method of claim 1 wherein temperature of at least an outer portion of the first layer is at least about 360° C. during forming of the second layer.
8. The method of claim 1 wherein temperature of at least an outer portion of the first layer is at least about 360° C. during forming of the third layer.
9. The method of claim 1 wherein the first layer consists essentially of elemental aluminum.
10. A method of forming an aluminum comprising line having a titanium nitride comprising layer thereon, the method comprising:
physical vapor depositing a first layer comprising at least one of elemental aluminum or an aluminum alloy over a substrate;
physical vapor depositing at least one of elemental titanium or a titanium alloy on the first layer and forming therefrom a second layer comprising an alloy of titanium and the aluminum from the first layer, the alloy having a higher melting point than that of the first layer;
physical vapor depositing a third layer comprising titanium nitride over the second layer; and
photopatterning the first, second and third layers into a conductive line.
11. The method of claim 10 wherein the titanium nitride of the third layer is deposited in contact with the second layer.
12. The method of claim 10 wherein the second layer forms during the elemental titanium deposition.
13. The method of claim 10 wherein essentially all the physical vapor deposited titanium alloys with the aluminum of the first layer.
14. The method of claim 10 comprising physical vapor depositing each of the first layer, titanium, and third layer in different deposition chambers of the same processing tool.
15. The method of claim 10 comprising physical vapor depositing the titanium and third layer in the same deposition chamber.
16. The method of claim 10 comprising physical vapor depositing the first layer in two different chambers of the same processing tool, and physical vapor depositing the titanium and third layer in a common chamber of the same processing tool.
17. The method of claim 10 comprising physical vapor depositing the titanium and the third layer in the same deposition chamber without moving the substrate therefrom intermediate the titanium and third layer depositions.
18. The method of claim 10 wherein an outermost portion of the first layer is deposited at a temperature of at least about 400° C.
19. The method of claim 10 wherein an outermost portion of the first layer is deposited at a temperature of at least about 450° C.
20. The method of claim 10 comprising depositing the second layer to have a thickness of from about 50 Angstroms to about 150 Angstroms.
21. The method of claim 10 comprising depositing the second layer to have a thickness of from about 100 Angstroms to about 200 Angstroms.
22. The method of claim 10 wherein the first layer consists essentially of elemental aluminum, an aluminum alloy, or a mixture thereof.
23. The method of claim 10 wherein the first layer consists essentially of elemental aluminum.
24. The method of claim 10 wherein the physical vapor depositing at least one of elemental titanium or a titanium alloy comprises physical vapor depositing elemental titanium.
25. The method of claim 10 wherein temperature of at least an outer portion of the first layer is at least about 360° C. during the physical vapor depositing of the elemental titanium.
26. The method of claim 10 wherein temperature of at least an outer portion of the first layer is at least about 360° C. during the physical vapor depositing of the third layer.
27. A method of forming an aluminum comprising line having a titanium nitride comprising layer thereon, the method comprising:
in a processing tool, physical vapor depositing a first layer comprising at least one of elemental aluminum or an aluminum alloy over a substrate in a first chamber;
physical vapor depositing at least one of elemental titanium or a titanium alloy on the first layer in a second chamber of the processing tool while at least an outer portion of the first layer is at a temperature of at least about 360° C., and forming therefrom a second layer comprising an alloy of titanium and the aluminum from the first layer in the second chamber during said depositing, the alloy having a higher melting point than that of the first layer;
physical vapor depositing a third layer comprising titanium nitride on the second layer in the second chamber of the processing tool;
removing the substrate from the processing tool after depositing the third layer; and
photopatterning the first, second and third layers into a conductive line.
28. The method of claim 27 wherein essentially all the physical vapor deposited titanium alloys with the aluminum of the first layer.
29. The method of claim 27 comprising depositing the second layer to have a thickness of from about 50 Angstroms to about 150 Angstroms.
30. The method of claim 27 comprising depositing the second layer to have a thickness of from about 100 Angstroms to about 200 Angstroms.
31. The method of claim 27 wherein the first layer consists essentially of elemental aluminum, an aluminum alloy, or a mixture thereof.
32. The method of claim 27 wherein the first layer consists essentially of elemental aluminum.
33. The method of claim 27 wherein the physical vapor depositing as at least one of elemental titanium or a titanium alloy comprises physical vapor depositing elemental titanium.
34. The method of claim 27 wherein temperature of at least an outer portion of the first layer is at least about 360° C. during the physical vapor depositing of the third layer.
Priority Applications (1)
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US09/785,858 US20020025372A1 (en) | 1999-08-19 | 2001-02-16 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/378,551 US6224942B1 (en) | 1999-08-19 | 1999-08-19 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
US09/785,858 US20020025372A1 (en) | 1999-08-19 | 2001-02-16 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
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US09/378,551 Continuation US6224942B1 (en) | 1999-08-19 | 1999-08-19 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
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US20020025372A1 true US20020025372A1 (en) | 2002-02-28 |
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US09/378,551 Expired - Lifetime US6224942B1 (en) | 1999-08-19 | 1999-08-19 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
US09/785,858 Abandoned US20020025372A1 (en) | 1999-08-19 | 2001-02-16 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
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US09/378,551 Expired - Lifetime US6224942B1 (en) | 1999-08-19 | 1999-08-19 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070020799A1 (en) * | 2005-07-25 | 2007-01-25 | Samsung Electronics Co., Ltd. | Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100669688B1 (en) * | 2003-03-12 | 2007-01-18 | 삼성에스디아이 주식회사 | Thin film transistor and flat panel display device having same |
JP4038485B2 (en) * | 2003-03-12 | 2008-01-23 | 三星エスディアイ株式会社 | Flat panel display device with thin film transistor |
US20090120785A1 (en) * | 2005-12-26 | 2009-05-14 | United Microelectronics Corp. | Method for forming metal film or stacked layer including metal film with reduced surface roughness |
US20070144892A1 (en) * | 2005-12-26 | 2007-06-28 | Hui-Shen Shih | Method for forming metal film or stacked layer including metal film with reduced surface roughness |
US20180033642A1 (en) * | 2015-12-18 | 2018-02-01 | Boe Technology Group Co., Ltd | Thin film transistor, array substrate, and display apparatus, and their fabrication methods |
Family Cites Families (8)
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JPH0434939A (en) * | 1990-05-30 | 1992-02-05 | Nec Corp | Semiconductor device and manufacture thereof |
JPH06120218A (en) * | 1992-10-02 | 1994-04-28 | Miyazaki Oki Electric Co Ltd | Metal wiring of semiconductor element |
US5565707A (en) * | 1994-10-31 | 1996-10-15 | International Business Machines Corporation | Interconnect structure using a Al2 Cu for an integrated circuit chip |
US5582881A (en) * | 1996-02-16 | 1996-12-10 | Advanced Micro Devices, Inc. | Process for deposition of a Ti/TiN cap layer on aluminum metallization and apparatus |
JP3537269B2 (en) * | 1996-05-21 | 2004-06-14 | アネルバ株式会社 | Multi-chamber sputtering equipment |
US5909635A (en) * | 1996-06-28 | 1999-06-01 | Intel Corporation | Cladding of an interconnect for improved electromigration performance |
US6028003A (en) * | 1997-07-03 | 2000-02-22 | Motorola, Inc. | Method of forming an interconnect structure with a graded composition using a nitrided target |
US6010965A (en) * | 1997-12-18 | 2000-01-04 | Advanced Micro Devices, Inc. | Method of forming high integrity vias |
-
1999
- 1999-08-19 US US09/378,551 patent/US6224942B1/en not_active Expired - Lifetime
-
2001
- 2001-02-16 US US09/785,858 patent/US20020025372A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070020799A1 (en) * | 2005-07-25 | 2007-01-25 | Samsung Electronics Co., Ltd. | Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same |
US7666789B2 (en) * | 2005-07-25 | 2010-02-23 | Samsung Electronics Co., Ltd. | Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same |
US20100112752A1 (en) * | 2005-07-25 | 2010-05-06 | Suk-Hun Choi | Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same |
US7803657B2 (en) | 2005-07-25 | 2010-09-28 | Samsung Electronics Co., Ltd. | Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same |
US8148710B2 (en) | 2005-07-25 | 2012-04-03 | Samsung Electronics Co., Ltd. | Phase-change memory device using a variable resistance structure |
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