+

US20020024796A1 - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
US20020024796A1
US20020024796A1 US09/855,494 US85549401A US2002024796A1 US 20020024796 A1 US20020024796 A1 US 20020024796A1 US 85549401 A US85549401 A US 85549401A US 2002024796 A1 US2002024796 A1 US 2002024796A1
Authority
US
United States
Prior art keywords
heat sink
sink unit
fins
bottom heat
mounting groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/855,494
Other versions
US6396693B1 (en
Inventor
Ming Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20020024796A1 publication Critical patent/US20020024796A1/en
Application granted granted Critical
Publication of US6396693B1 publication Critical patent/US6396693B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink adapted to dissipate heat from a CPU.
  • FIG. 1 shows a heat sink according to the prior art.
  • This structure of heat sink is extruded from aluminum, comprising a flat bottom panel 11 and parallel radiation fins 2 perpendicularly extended from the top surface of the flat bottom panel 11 .
  • the radiation fins 2 are made as longer as possible.
  • due to aluminum extrusion technical problem there is a limitation to the length of the radiation fins 2 .
  • the present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat sink, which provides a big heat dissipation area to dissipate heat efficiently.
  • the heat sink comprises a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together.
  • the top heat sink unit has a circular top recess and two locating grooves at two sides of the circular top recess for the mounting of a fan.
  • FIG. 1 is an elevational view of a heat sink according to the prior art.
  • FIG. 2 is an elevational view of a heat sink according to a first embodiment of the present invention.
  • FIG. 3 is an exploded view of the heat sink shown in FIG. 2.
  • FIG. 4 is an elevational view of a heat sink according to a second embodiment of the present invention (before processing of the top heat sink unit).
  • FIG. 5 is an elevational view of the heat sink of the second embodiment of the present invention, showing the top heat sink unit processed.
  • a heat sink 100 is shown generally comprised of a top heat sink unit 2 , and a bottom heat sink unit 3 .
  • the top heat sink unit 2 comprises a plurality of transversely extended bottom fins 21 , a circular top recess 22 disposed at the center of the top sidewall thereof and adapted to receive a fan (not shown), two top locating grooves 23 transversely disposed at the top sidewall and cut through the border of the circular top recess 22 at two opposite sides and adapted to receive tie screws that fasten the fan to the circular top recess 22 , and two coupling flanges 24 transversely disposed at two opposite lateral sides.
  • the coupling flanges 24 each have a horizontal mounting groove 25 .
  • the bottom heat sink unit 3 comprises a transversely extended upright fins 31 , and two side rails 32 transversely disposed at two opposite lateral sides.
  • the side rails 32 each comprises two horizontal mounting grooves 33 ; 33 a disposed at different elevations.
  • the transversely extended bottom fins 21 of the top heat sink unit 2 are respectively vertically inserted into gaps in between the transversely extended upright fins 31 of the bottom heat sink unit 3 from the top side, permitting the bottom fins 21 of the top heat sink unit 2 to be respectively forced into engagement with the upright fins 31 of the bottom heat sink unit 3 at one side, and then two hook plates 4 are respectively hooked in the horizontal mounting groove 25 of each of the coupling flanges 24 and the upper horizontal mounting grooves 33 of each of the side rails 32 to secure the top heat sink unit 2 and the bottom heat sink unit firmly together.
  • first and last upright fins 31 of the bottom sink heat unit 3 are relatively taller than the other upright fins, each having a positioning groove in the topmost edge.
  • the coupling flanges 24 each have a positioning rib 26 respectively engaged into the positioning groove 34 in the topmost edge of each of the first and last upright fins 31 of the bottom heat sink unit 3 .
  • FIGS. 4 and 5 show a heat sink 200 according to a second embodiment of the present invention.
  • the heat sink 200 is comprised of a top heat sink unit 5 and a bottom heat sink unit 6 .
  • the top heat sink unit 5 comprises a plurality of transversely extended bottom fins 51 .
  • the bottom heat sink unit 6 comprises a plurality of transversely extended upright fins 61 respectively forced into engagement with the bottom fins 51 of the top heat sink unit 5 .
  • the top heat sink 5 is processed to provide top peripheral ribs 52 and a longitudinally extended middle mounting groove 53 for receiving fastener means adapted to secure the heat sink 200 to the CPU module.
  • FIGS. 2 - 5 A prototype of heat sink has been constructed with the features of FIGS. 2 - 5 .
  • the heat sink functions smoothly to provide all of the features discussed earlier.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink at one side, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a heat sink adapted to dissipate heat from a CPU. [0001]
  • In order to enhance the heat dissipation efficiency of a heat sink, the heat dissipation area must be relatively increased. FIG. 1 shows a heat sink according to the prior art. This structure of heat sink is extruded from aluminum, comprising a [0002] flat bottom panel 11 and parallel radiation fins 2 perpendicularly extended from the top surface of the flat bottom panel 11. In order to increase the heat dissipation area, the radiation fins 2 are made as longer as possible. However, due to aluminum extrusion technical problem, there is a limitation to the length of the radiation fins 2.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat sink, which provides a big heat dissipation area to dissipate heat efficiently. According to one aspect of the present invention, the heat sink comprises a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together. According to another aspect of the present invention, the top heat sink unit has a circular top recess and two locating grooves at two sides of the circular top recess for the mounting of a fan.[0003]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an elevational view of a heat sink according to the prior art. [0004]
  • FIG. 2 is an elevational view of a heat sink according to a first embodiment of the present invention. [0005]
  • FIG. 3 is an exploded view of the heat sink shown in FIG. 2. [0006]
  • FIG. 4 is an elevational view of a heat sink according to a second embodiment of the present invention (before processing of the top heat sink unit). [0007]
  • FIG. 5 is an elevational view of the heat sink of the second embodiment of the present invention, showing the top heat sink unit processed.[0008]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 2 and 3, a [0009] heat sink 100 is shown generally comprised of a top heat sink unit 2, and a bottom heat sink unit 3. The top heat sink unit 2 comprises a plurality of transversely extended bottom fins 21, a circular top recess 22 disposed at the center of the top sidewall thereof and adapted to receive a fan (not shown), two top locating grooves 23 transversely disposed at the top sidewall and cut through the border of the circular top recess 22 at two opposite sides and adapted to receive tie screws that fasten the fan to the circular top recess 22, and two coupling flanges 24 transversely disposed at two opposite lateral sides. The coupling flanges 24 each have a horizontal mounting groove 25. The bottom heat sink unit 3 comprises a transversely extended upright fins 31, and two side rails 32 transversely disposed at two opposite lateral sides. The side rails 32 each comprises two horizontal mounting grooves 33;33 a disposed at different elevations. During assembly process of the heat sink 100, the transversely extended bottom fins 21 of the top heat sink unit 2 are respectively vertically inserted into gaps in between the transversely extended upright fins 31 of the bottom heat sink unit 3 from the top side, permitting the bottom fins 21 of the top heat sink unit 2 to be respectively forced into engagement with the upright fins 31 of the bottom heat sink unit 3 at one side, and then two hook plates 4 are respectively hooked in the horizontal mounting groove 25 of each of the coupling flanges 24 and the upper horizontal mounting grooves 33 of each of the side rails 32 to secure the top heat sink unit 2 and the bottom heat sink unit firmly together. During installation of the heat sink 100, clamp means or the like is fastened to the lower horizontal mounting grooves 33 a of each of the side rails 32 to secure the heat sink 100 to the CPU module. Furthermore, the first and last upright fins 31 of the bottom sink heat unit 3 are relatively taller than the other upright fins, each having a positioning groove in the topmost edge. The coupling flanges 24 each have a positioning rib 26 respectively engaged into the positioning groove 34 in the topmost edge of each of the first and last upright fins 31 of the bottom heat sink unit 3.
  • FIGS. 4 and 5 show a [0010] heat sink 200 according to a second embodiment of the present invention. The heat sink 200 is comprised of a top heat sink unit 5 and a bottom heat sink unit 6. The top heat sink unit 5 comprises a plurality of transversely extended bottom fins 51. The bottom heat sink unit 6 comprises a plurality of transversely extended upright fins 61 respectively forced into engagement with the bottom fins 51 of the top heat sink unit 5. When assembled, the top heat sink 5 is processed to provide top peripheral ribs 52 and a longitudinally extended middle mounting groove 53 for receiving fastener means adapted to secure the heat sink 200 to the CPU module.
  • A prototype of heat sink has been constructed with the features of FIGS. [0011] 2-5. The heat sink functions smoothly to provide all of the features discussed earlier.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims. [0012]

Claims (3)

What the invention claimed is:
1. A heat sink comprising:
a bottom heat sink unit, said bottom heat sink unit comprising a plurality of transversely extended upright fins, and two side rails transversely disposed at two opposite lateral sides thereof, said side rails each comprising a first horizontal mounting groove, and a second horizontal mounting groove for receiving fastener means adapted to secure said bottom heat sink unit to a CPU module;
a top heat sink unit fastened to said bottom heat sink unit at a top side, said top heat sink unit comprising a plurality of transversely extended bottom fins respectively forced into engagement with the upright fins of said bottom heat sink unit at one side, a circular top recess disposed at the center of a top sidewall thereof and adapted to receive a fan, two top locating grooves transversely disposed at the top sidewall and cut through the border of said circular top recess at two opposite sides and adapted to receive tie screws that fasten a fan to said circular top recess, and two coupling flanges transversely disposed at two opposite lateral sides and respectively coupled to first and last upright fins of said bottom heat sink unit, said coupling flanges each having a horizontal mounting groove; and
two hook plates respectively hooked in the horizontal mounting groove of each of said coupling flanges and the first horizontal mounting grooves of each of said side rails to secure the top heat sink unit and said bottom heat sink unit together.
2. The heat sink of claim 1 wherein the first and last upright fins of said bottom heat sink unit each comprises a positioning groove in the respective topmost edge, and said coupling flanges of said top heat sink unit each have a positioning rib respectively engaged into the positioning groove in the topmost edge of each of the first and last upright fins of said bottom heat sink unit.
3. A heat sink comprising:
a bottom heat sink unit, said bottom heat sink unit comprising a plurality of transversely extended upright fins, and a longitudinal mounting groove cut through said upright fins on the middle; and
a top heat sink unit fastened to said bottom heat sink unit at a top side, said top heat sink unit comprising a plurality of transversely extended bottom fins respectively forced into engagement with the upright fins of said bottom heat sink unit at one side, a longitudinal mounting groove cut through said bottom fins on the middle and fitting the longitudinal mounting groove of said bottom heat sink unit for mounting, and a plurality of peripheral ribs disposed at a top side.
US09/855,494 2000-08-24 2001-05-16 Heat sink Expired - Fee Related US6396693B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW89214627 2000-08-24
TW89214627U 2000-08-24
TW089214627 2000-08-24

Publications (2)

Publication Number Publication Date
US20020024796A1 true US20020024796A1 (en) 2002-02-28
US6396693B1 US6396693B1 (en) 2002-05-28

Family

ID=21671917

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/855,494 Expired - Fee Related US6396693B1 (en) 2000-08-24 2001-05-16 Heat sink

Country Status (1)

Country Link
US (1) US6396693B1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150952A1 (en) * 2003-01-30 2004-08-05 Tsung-Hsi Yu Integrated heat-dissipating module
US7391614B2 (en) 2005-03-24 2008-06-24 Dell Products L.P. Method and apparatus for thermal dissipation in an information handling system
US20120293952A1 (en) * 2011-05-19 2012-11-22 International Business Machines Corporation Heat transfer apparatus
GB2493019A (en) * 2011-07-21 2013-01-23 Control Tech Ltd Heat sink adaptor or cooling hat
CN103687423A (en) * 2012-09-07 2014-03-26 宏碁股份有限公司 Electronic device and heat dissipation module thereof
WO2014123774A1 (en) * 2013-02-06 2014-08-14 Tyco Electronics Corporation Heat sink
CN109643695A (en) * 2016-09-29 2019-04-16 西门子股份公司 Thermal Insulator
US10383252B2 (en) * 2018-01-11 2019-08-13 Comptake Technology Inc. Solid state disk module and heat sink device thereof
US11262821B1 (en) * 2020-12-07 2022-03-01 Dell Products L.P. Information handling system with articulated cooling fins between interleaved and separated positions
US11320876B1 (en) 2020-12-07 2022-05-03 Dell Products L.P. Information handling system handle with integrated thermal rejection system
US11733742B2 (en) 2020-12-07 2023-08-22 Dell Products L.P. Information handling system integrated speaker with variable volume sound chamber

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6604575B1 (en) * 2002-08-30 2003-08-12 Southeastern Univer. Research Assn. Inc. Heat exchange apparatus
US6633485B1 (en) * 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
TWM249090U (en) * 2002-12-25 2004-11-01 Jiun-Fu Liou Improved device for heat sink module
US20040130870A1 (en) * 2003-01-07 2004-07-08 Vulcan Portals Inc. System and method for heat removal from a hand-held portable computer while docked
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
CN2701072Y (en) * 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 Heat sink
TWI259754B (en) * 2004-05-18 2006-08-01 Quanta Comp Inc Extended fin array
TW200604781A (en) * 2004-07-30 2006-02-01 Via Tech Inc Expandable heat sink
TWI260966B (en) * 2004-10-28 2006-08-21 Quanta Comp Inc Heat dissipation device
US7711211B2 (en) * 2005-06-08 2010-05-04 Xerox Corporation Method for assembling a collection of digital images
CN100518475C (en) * 2006-06-02 2009-07-22 富准精密工业(深圳)有限公司 Heat radiating device
US7903413B1 (en) * 2007-06-28 2011-03-08 Nvidia Corporation Coupling system and method for attaching thermal components in association with a board-mounted integrated circuit
US20090065174A1 (en) * 2007-09-10 2009-03-12 Yu-Jen Lai Heat sink for an electrical device and method of manufacturing the same
US9912107B2 (en) 2014-04-01 2018-03-06 Te Connectivity Corporation Plug and receptacle assembly having a thermally conductive interface
US9343851B2 (en) 2014-08-29 2016-05-17 Tyco Electronics Corporation Pluggable connector configured to transfer thermal energy away from internal electronics of the pluggable connector
US9841772B2 (en) * 2015-12-03 2017-12-12 Te Connectivity Corporation Temperature responsive thermal bridge
US9620890B1 (en) 2016-05-25 2017-04-11 Te Connectivity Corporation Thermal-transfer assembly and electrical connector having the same
JP6378299B2 (en) * 2016-12-14 2018-08-22 ファナック株式会社 heatsink
EP4244887A4 (en) * 2020-11-18 2024-10-09 Sharfi, Benjamin K. DIAMOND-BASED THERMAL COOLING DEVICES, METHODS AND MATERIALS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US5838065A (en) * 1996-07-01 1998-11-17 Digital Equipment Corporation Integrated thermal coupling for heat generating device
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
TW477437U (en) * 1998-06-23 2002-02-21 Foxconn Prec Components Co Ltd Assembled-type CPU heat sink

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150952A1 (en) * 2003-01-30 2004-08-05 Tsung-Hsi Yu Integrated heat-dissipating module
US6906922B2 (en) * 2003-01-30 2005-06-14 Micro-Star Int'l Co., Ltd. Integrated heat-dissipating module
US7391614B2 (en) 2005-03-24 2008-06-24 Dell Products L.P. Method and apparatus for thermal dissipation in an information handling system
US20120293952A1 (en) * 2011-05-19 2012-11-22 International Business Machines Corporation Heat transfer apparatus
GB2493019A (en) * 2011-07-21 2013-01-23 Control Tech Ltd Heat sink adaptor or cooling hat
CN103687423A (en) * 2012-09-07 2014-03-26 宏碁股份有限公司 Electronic device and heat dissipation module thereof
WO2014123774A1 (en) * 2013-02-06 2014-08-14 Tyco Electronics Corporation Heat sink
US9739543B2 (en) 2013-02-06 2017-08-22 Te Connectivity Corporation Heat sink
CN109643695A (en) * 2016-09-29 2019-04-16 西门子股份公司 Thermal Insulator
RU2712938C1 (en) * 2016-09-29 2020-02-03 Сименс Акциенгезелльшафт Heat conducting insulator
US11129301B2 (en) 2016-09-29 2021-09-21 Siemens Aktiengesellschaft Thermally conductive insulator
US10383252B2 (en) * 2018-01-11 2019-08-13 Comptake Technology Inc. Solid state disk module and heat sink device thereof
US11262821B1 (en) * 2020-12-07 2022-03-01 Dell Products L.P. Information handling system with articulated cooling fins between interleaved and separated positions
US11320876B1 (en) 2020-12-07 2022-05-03 Dell Products L.P. Information handling system handle with integrated thermal rejection system
US11733742B2 (en) 2020-12-07 2023-08-22 Dell Products L.P. Information handling system integrated speaker with variable volume sound chamber

Also Published As

Publication number Publication date
US6396693B1 (en) 2002-05-28

Similar Documents

Publication Publication Date Title
US6396693B1 (en) Heat sink
US6520250B2 (en) Fan holder
US6119765A (en) Structure of heat dissipating pieces of memories
US7489513B2 (en) Heat dissipation device
US6343016B1 (en) Heat sink
US7684197B2 (en) Memory module assembly having heat sinks with improved structure
US20010001898A1 (en) Heat sink and method for making the same
US6654246B2 (en) Heat sink assembly with fixing members
US20070258214A1 (en) Heat-Dissipating Device with Tapered Fins
US7363966B2 (en) Heat dissipating device
US7414839B2 (en) Heat dissipation device having a fan holder for attachment of a fan
US7423873B2 (en) Heat dissipation device having fan holder for attachment of a fan
US20050103474A1 (en) Heat dissipation device
US6995981B2 (en) Heat sink assembly with combined parallel fins
US7004236B2 (en) Fan holder
US7032650B1 (en) Cooling fin set
US20070181288A1 (en) Combination of a heat sink and a fan
US6373699B1 (en) Heat dissipation device
US6942026B2 (en) Fin assembly of heat sink
US20100122795A1 (en) Heat dissipation device
US7086456B2 (en) Combination of fan and heat sink
US6089315A (en) Composite heat sink
US6392886B1 (en) Heat sink assembly
US7694720B2 (en) Sectional modular heat sink
US20020043359A1 (en) Heat sink for electronic parts and manufacture thereof

Legal Events

Date Code Title Description
REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20060528

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载