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US20020017378A1 - Heat ventilation device - Google Patents

Heat ventilation device Download PDF

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Publication number
US20020017378A1
US20020017378A1 US09/819,484 US81948401A US2002017378A1 US 20020017378 A1 US20020017378 A1 US 20020017378A1 US 81948401 A US81948401 A US 81948401A US 2002017378 A1 US2002017378 A1 US 2002017378A1
Authority
US
United States
Prior art keywords
cooler
plate member
ring plate
fan
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/819,484
Inventor
Chin Hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tranyoung Tech Corp
Original Assignee
Tranyoung Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tranyoung Tech Corp filed Critical Tranyoung Tech Corp
Assigned to TRANYOUNG TECHNOLOGY CORP. reassignment TRANYOUNG TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HU, CHIN YI
Publication of US20020017378A1 publication Critical patent/US20020017378A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to fans and more particularly to a fan used in conjunction with cooler of central processing unit (CPU).
  • CPU central processing unit
  • FIGS. 1 to 3 A number of techniques and devices have been proposed and commercially available for improving the heat ventilation of CPU by manufacturers.
  • a heat ventilation device called “Power Cooler” 12 is mounted on the K 7 processor manufactured by AMD a U.S. based corporation as shown in FIGS. 1 to 3 .
  • Such cooler 12 is a hollow cylinder having a plurality of fins parallel longitudinally disposed on the outer surface. Further, a passage is formed between two adjacent fins for providing a heat ventilation path from the fan to the outside.
  • the fan mounted on cooler 12 in FIG. 1 is different from the fan mounted on cooler 12 in FIG. 2. But both fans serve to radiate superfluous heat from CPU through the cooler 12 .
  • fan 10 is secured to the inside of cooler 12 by a plurality of screws 11 .
  • seat 13 is very close to the bottom 16 of cooler 12 (FIG. 3).
  • the temperature at the bottom 16 is undesirably increased because the bottom 16 is adjacent the hot CPU plus the heat generated by the driving elements (e.g., coils, magnets, and etc.) accumulated therein.
  • the provision of fan 10 has adversely affected the heat ventilation capability of cooler 12 .
  • FIG. 1 As shown in FIG.
  • seat 23 is fixed to frame 22 under the ring plate member 21 .
  • the heat ventilation path of blades 24 is blocked by frame 22 , thus lowers the heat ventilation efficiency of the heat ventilation arrangement.
  • seat 23 is very close to the bottom of cooler 20 .
  • the temperature at the bottom of cooler 20 is still undesirably increased because the bottom of cooler 20 is adjacent the hot CPU.
  • This drawback is the same as the heat ventilation arrangement in FIG. 1.
  • the ring plate member 21 is glued to the top opening of cooler 20 . This is a poor fastening design. In a worse condition, cooler 20 may become disengaged from fan due to the melting of the adhesive.
  • Fan mounted on the top opening of a cylindrical cooler.
  • Fan comprises a ring plate member, a seat, a plurality of blades, and a plurality of ribs interconnected between the ring plate member and the seat. Blades are rotationally mounted on seat. The bottom of fan is abutted on the inner bottom surface of cooler. Wind generated by the activation of blades is directed toward cooler. As such, the heat transferred from a heat source may be radiated to the outside.
  • FIG. 1 is an exploded perspective view of a conventional heat ventilation arrangement
  • FIG. 2 is an exploded perspective view of another conventional heat ventilation arrangement
  • FIG. 3 is top plan view of the FIG. 1 arrangement
  • FIG. 4 is an exploded perspective view of a heat ventilation device according to the invention.
  • FIG. 5 is a cross-sectional view of the assembled fan and cooler shown in FIG. 4;
  • FIG. 6 is a top plan view of the assembled fan and cooler shown in FIG. 4.
  • FIG. 7 is a partial enlarged fragmentary view showing the fastening of ring plate member and cooler of FIG. 4.
  • FIGS. 4 to 7 there is shown a heat ventilation device constructed in accordance with the invention comprising a cooler 30 and a fan 40 secured to the top opening 30 a of cooler 30 .
  • Cooler 30 is a hollow cylindrical member having a plurality of fins 31 parallel longitudinally disposed on the outer surface. Further, a passage 31 a is formed between two adjacent fins 31 for providing a heat ventilation path from the fan 40 to the outside.
  • a short cylindrical bar 33 is projected on the underside 32 of cooler 30 . Bar 33 is in contact with a heat source (e.g., CPU not shown). Thus heat generated by CPU may be transferred to cooler 30 through bar 33 .
  • a heat source e.g., CPU not shown
  • Fan 40 comprises a ring plate member 41 , a seat 43 , a plurality of blades 44 , and a plurality of ribs 42 interconnected between ring plate member 41 and seat 43 .
  • Blades 44 are rotationally mounted on seat 43 .
  • the bottom 44 a of fan 40 is abutted on the inner bottom surface of cooler 30 . Wind generated by the activation of blades 44 is blowing toward cooler 30 and fins 31 . As such, the heat transferred from CPU may be radiated to the outside through passages 31 a and fins 31 .
  • a plurality of pairs of parallel inserts 461 and 462 are provided at the underside of ring plate member 41 .
  • a connecting member 463 is coupled between inserts 461 and 462 .
  • a threaded hole 47 is formed at ring plate member 41 between the pair of inserts 461 and 362 .
  • inserts 461 , 462 are inserted into two passages 31 a respectively, while connecting member 463 is urged against the inner rear sides of fins 31 .
  • ring plate member 41 is engaged with cooler 30 .
  • a screw 50 is driven through threaded hole 47 to secure to a passage 31 b. As such, fan 40 is secured to cooler 30 .
  • a plurality of elongate arcuate ventilation openings 411 are equally spaced apart on ring plate member 41 for enhancing the heat ventilation of the invention. Furthermore as shown in FIG. 4, a hole 412 is formed on ring plate member 41 for allowing power cord 45 to pass through. The power cord 45 is far from the bottom of cooler 30 (i.e., adjacent CPU) for lowering the possibility of being damaged by the high temperature CPU.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

A fan device mounted on the top opening of a cylindrical cooler. Fan comprises a ring plate member, a seat, a plurality of blades, and a plurality of ribs interconnected between the ring plate member and the seat. Blades are rotationally mounted on seat. The bottom of fan is abutted on the inner bottom surface of cooler. Wind generated by the activation of blades is directed toward cooler. As such, the heat transferred from a heat source may be effectively radiated to the outside.

Description

    FIELD OF THE INVENTION
  • The present invention relates to fans and more particularly to a fan used in conjunction with cooler of central processing unit (CPU). [0001]
    • BACKGROUND OF THE INVENTION
  • It is known that the temperature of CPU is high during operation. As such, heat ventilation is very important as to the normal operation of CPU. A number of techniques and devices have been proposed and commercially available for improving the heat ventilation of CPU by manufacturers. For example, a heat ventilation device called “Power Cooler” [0002] 12 is mounted on the K7 processor manufactured by AMD a U.S. based corporation as shown in FIGS. 1 to 3. Such cooler 12 is a hollow cylinder having a plurality of fins parallel longitudinally disposed on the outer surface. Further, a passage is formed between two adjacent fins for providing a heat ventilation path from the fan to the outside. The fan mounted on cooler 12 in FIG. 1 is different from the fan mounted on cooler 12 in FIG. 2. But both fans serve to radiate superfluous heat from CPU through the cooler 12.
  • But these two types of fans are unsatisfactory for the purpose for which the invention is concerned for the following reasons: [0003]
  • 1. As to the heat ventilation arrangement shown in FIG. 1, [0004] fan 10 is secured to the inside of cooler 12 by a plurality of screws 11. However, the previous design suffered from several disadvantages. For example, seat 13 is very close to the bottom 16 of cooler 12 (FIG. 3). As such, the temperature at the bottom 16 is undesirably increased because the bottom 16 is adjacent the hot CPU plus the heat generated by the driving elements (e.g., coils, magnets, and etc.) accumulated therein. In brief, the provision of fan 10 has adversely affected the heat ventilation capability of cooler 12. Moreover, as shown in FIG. 3, it is difficult for a person to use a tool to perform a fastening/unfastening of seat 13 inside the fan 10 due to the blocking of blades 14. One may increase the spacing between two adjacent blades 14. But it inevitably sacrifices the heat ventilation efficiency due to the reduction of the total area of blades 14. In fact, it is not applicable. Also, as shown in FIG. 3, a power cord 15 under blades 14 is adjacent the hot bottom 16. As such, the shield of power cord 15 may be damaged by the high temperature. This may adversely affect the normal operation of fan 10.
  • 2. As to the other heat ventilation arrangement shown in FIG. 2, [0005] seat 23 is fixed to frame 22 under the ring plate member 21. This solves the problem (i.e., difficult for fastening/unfastening of fan 10 in cooler 12) experienced in the FIG. 1 prior art. However, it still suffered from several disadvantages. For example, the heat ventilation path of blades 24 is blocked by frame 22, thus lowers the heat ventilation efficiency of the heat ventilation arrangement. Further, seat 23 is very close to the bottom of cooler 20. As such, the temperature at the bottom of cooler 20 is still undesirably increased because the bottom of cooler 20 is adjacent the hot CPU. This drawback is the same as the heat ventilation arrangement in FIG. 1. Furthermore, the ring plate member 21 is glued to the top opening of cooler 20. This is a poor fastening design. In a worse condition, cooler 20 may become disengaged from fan due to the melting of the adhesive.
    • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide a fan device mounted on the top opening of a cylindrical cooler. Fan comprises a ring plate member, a seat, a plurality of blades, and a plurality of ribs interconnected between the ring plate member and the seat. Blades are rotationally mounted on seat. The bottom of fan is abutted on the inner bottom surface of cooler. Wind generated by the activation of blades is directed toward cooler. As such, the heat transferred from a heat source may be radiated to the outside. [0006]
  • It is another object of the present invention to provide a fan device wherein the heat ventilation path of blades is not blocked, thereby improving the heat ventilation efficiency of the fan device. [0007]
  • It is still another object of the present invention to provide a fan device wherein the power cord is far from the heat source, thus lowering the possibility of being damaged by the heat source. [0008]
  • It is a further object of the present invention to provide an fan device wherein a plurality of fasteners are driven through the ring plate member to secure the fan to the cooler. [0009]
  • The above and other objects, features and advantages of the present invention will become apparent from the following detailed description taken with the accompanying drawings.[0010]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded perspective view of a conventional heat ventilation arrangement; [0011]
  • FIG. 2 is an exploded perspective view of another conventional heat ventilation arrangement; [0012]
  • FIG. 3 is top plan view of the FIG. 1 arrangement; [0013]
  • FIG. 4 is an exploded perspective view of a heat ventilation device according to the invention; [0014]
  • FIG. 5 is a cross-sectional view of the assembled fan and cooler shown in FIG. 4; [0015]
  • FIG. 6 is a top plan view of the assembled fan and cooler shown in FIG. 4; and [0016]
  • FIG. 7 is a partial enlarged fragmentary view showing the fastening of ring plate member and cooler of FIG. 4.[0017]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. [0018] 4 to 7, there is shown a heat ventilation device constructed in accordance with the invention comprising a cooler 30 and a fan 40 secured to the top opening 30 a of cooler 30. Cooler 30 is a hollow cylindrical member having a plurality of fins 31 parallel longitudinally disposed on the outer surface. Further, a passage 31 a is formed between two adjacent fins 31 for providing a heat ventilation path from the fan 40 to the outside. A short cylindrical bar 33 is projected on the underside 32 of cooler 30. Bar 33 is in contact with a heat source (e.g., CPU not shown). Thus heat generated by CPU may be transferred to cooler 30 through bar 33. Fan 40 comprises a ring plate member 41, a seat 43, a plurality of blades 44, and a plurality of ribs 42 interconnected between ring plate member 41 and seat 43. Blades 44 are rotationally mounted on seat 43. The bottom 44 a of fan 40 is abutted on the inner bottom surface of cooler 30. Wind generated by the activation of blades 44 is blowing toward cooler 30 and fins 31. As such, the heat transferred from CPU may be radiated to the outside through passages 31 a and fins 31.
  • A plurality of pairs of [0019] parallel inserts 461 and 462 are provided at the underside of ring plate member 41. A connecting member 463 is coupled between inserts 461 and 462. A threaded hole 47 is formed at ring plate member 41 between the pair of inserts 461 and 362. As shown in FIG. 7 specifically, inserts 461, 462 are inserted into two passages 31 a respectively, while connecting member 463 is urged against the inner rear sides of fins 31. Thus ring plate member 41 is engaged with cooler 30. A screw 50 is driven through threaded hole 47 to secure to a passage 31 b. As such, fan 40 is secured to cooler 30. Further, a plurality of elongate arcuate ventilation openings 411 are equally spaced apart on ring plate member 41 for enhancing the heat ventilation of the invention. Furthermore as shown in FIG. 4, a hole 412 is formed on ring plate member 41 for allowing power cord 45 to pass through. The power cord 45 is far from the bottom of cooler 30 (i.e., adjacent CPU) for lowering the possibility of being damaged by the high temperature CPU.
  • While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims. [0020]

Claims (5)

What is claimed is:
1. A heat ventilation device comprising:
a hollow cylindrical cooler including a plurality of fins parallel longitudinally disposed on the outer surface, a plurality of passages each formed between two of the adjacent fins for providing a heat ventilation path from the inside to the outside, and a bar projected on the underside being in contact with a heat source for absorbing heat therefrom; and
a fan mounted in the cooler with the bottom abutted on the bottom surface of the cooler, the fan including a ring plate member, a seat, a plurality of blades rotationally mounted on the seat, and a plurality of ribs interconnected between the ring plate member and the seat,
whereby wind generated by the blades is directed toward the cooler and the fins, thereby radiating heat transferred from the heat source to the outside through the passages and the fins.
2. The device of claim 1, further comprising a plurality of pairs of parallel inserts at the underside of the ring plate member wherein the pair of the inserts are inserted into two of the passages for engaging the ring plate member with the cooler and a threaded hole at the ring plate member between the pair of the inserts for permitting a fastener to drive through the threaded hole to secure to the passage for securing the fan to the cooler.
3. The device of claim 2, further comprising a connecting member coupled between the pair of the inserts and urged against the inner rear sides of two of the fins.
4. The device of claim 1, further comprising a plurality of elongate arcuate ventilation openings equally spaced apart on the ring plate member.
5. The device of claim 1, further comprising a hole on the ring plate member for allowing a power cord to pass through.
US09/819,484 2000-08-09 2001-03-27 Heat ventilation device Abandoned US20020017378A1 (en)

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TW089213775U TW510642U (en) 2000-08-09 2000-08-09 Heat dissipating
TW89213775 2000-08-09

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Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023853A2 (en) * 2001-09-10 2003-03-20 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US20030189813A1 (en) * 2000-11-20 2003-10-09 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US20050161196A1 (en) * 2004-01-22 2005-07-28 Hsieh Hsin-Mao Heat radiator for a CPU
US20060042777A1 (en) * 2004-08-31 2006-03-02 Delano Andrew D Heat sink fin with stator blade
WO2006072105A1 (en) * 2004-12-31 2006-07-06 Intel Corporation Systems for improved heat exchanger
US20070181288A1 (en) * 2006-02-08 2007-08-09 Bing Chen Combination of a heat sink and a fan
USD564460S1 (en) 2007-01-25 2008-03-18 Nidec Corporation Heat sink fan
US20080080137A1 (en) * 2006-10-02 2008-04-03 Nidec Corporation Heat sink and cooling apparatus
US20080094798A1 (en) * 2005-04-11 2008-04-24 Lee Sang C Apparatus for cooling computer parts and method of manufacturing the same
USD568829S1 (en) 2006-10-12 2008-05-13 Nidec Corporation Heat sink
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
USD576567S1 (en) 2007-02-13 2008-09-09 Nidec Corporation Heat sink fan
CN100456206C (en) * 2005-12-30 2009-01-28 富准精密工业(深圳)有限公司 Heat abstractor assembling
USD600218S1 (en) * 2007-06-20 2009-09-15 Nidec Corporation Heat sink
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20100193173A1 (en) * 2002-01-17 2010-08-05 Intel Corporation Heat sinks and method of formation
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US20130044433A1 (en) * 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array
CN106960831A (en) * 2017-03-23 2017-07-18 四川西金联合电气股份有限公司 A kind of electronic heat sink
CN110437888A (en) * 2019-08-21 2019-11-12 中冶焦耐(大连)工程技术有限公司 exhaust gas cooler
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
USD962879S1 (en) * 2020-04-09 2022-09-06 Acer Incorporated Heat-dissipation unit

Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030189813A1 (en) * 2000-11-20 2003-10-09 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6845010B2 (en) 2000-11-20 2005-01-18 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US7120020B2 (en) 2001-09-10 2006-10-10 Intel Corporation Electronic assemblies with high capacity bent fin heat sinks
WO2003023853A3 (en) * 2001-09-10 2003-11-13 Intel Corp Electronic assemblies with high capacity heat sinks and methods of manufacture
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US7911790B2 (en) 2001-09-10 2011-03-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
WO2003023853A2 (en) * 2001-09-10 2003-03-20 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
US7200934B2 (en) 2001-09-10 2007-04-10 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US8205666B2 (en) * 2002-01-17 2012-06-26 Intel Corporation Heat sinks and method of formation
US20100193173A1 (en) * 2002-01-17 2010-08-05 Intel Corporation Heat sinks and method of formation
US6981542B2 (en) * 2003-10-29 2006-01-03 Rotys Inc. Multi-heatsink integrated cooler
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US20050161196A1 (en) * 2004-01-22 2005-07-28 Hsieh Hsin-Mao Heat radiator for a CPU
US20060042777A1 (en) * 2004-08-31 2006-03-02 Delano Andrew D Heat sink fin with stator blade
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
WO2006072105A1 (en) * 2004-12-31 2006-07-06 Intel Corporation Systems for improved heat exchanger
US20060144569A1 (en) * 2004-12-31 2006-07-06 Crocker Michael T Systems for improved heat exchanger
US7143820B2 (en) 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
CN100530617C (en) * 2004-12-31 2009-08-19 英特尔公司 Systems for improved heat exchanger
US20080094798A1 (en) * 2005-04-11 2008-04-24 Lee Sang C Apparatus for cooling computer parts and method of manufacturing the same
US7515417B2 (en) * 2005-04-11 2009-04-07 Zalman Tech Co., Ltd. Apparatus for cooling computer parts and method of manufacturing the same
CN100456206C (en) * 2005-12-30 2009-01-28 富准精密工业(深圳)有限公司 Heat abstractor assembling
US20070181288A1 (en) * 2006-02-08 2007-08-09 Bing Chen Combination of a heat sink and a fan
US7623348B2 (en) 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
US20080080137A1 (en) * 2006-10-02 2008-04-03 Nidec Corporation Heat sink and cooling apparatus
USD568829S1 (en) 2006-10-12 2008-05-13 Nidec Corporation Heat sink
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US8210241B2 (en) 2006-12-28 2012-07-03 Nidec Corporation Heat sink fan
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
USD564460S1 (en) 2007-01-25 2008-03-18 Nidec Corporation Heat sink fan
USD576567S1 (en) 2007-02-13 2008-09-09 Nidec Corporation Heat sink fan
USD600218S1 (en) * 2007-06-20 2009-09-15 Nidec Corporation Heat sink
US8385071B2 (en) * 2008-04-16 2013-02-26 Asia Vital Components Co., Ltd. Heat radiator
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US12219678B2 (en) 2008-11-26 2025-02-04 In 2 Developments Llc High intensity replaceable light emitting diode module and array
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array
US11924943B2 (en) 2008-11-26 2024-03-05 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US11178744B2 (en) 2008-11-26 2021-11-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US10925139B2 (en) 2008-11-26 2021-02-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US8879261B2 (en) * 2010-05-24 2014-11-04 Icepipe Corporation Heat-dissipating device for electronic apparatus
US20130044433A1 (en) * 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
CN106960831A (en) * 2017-03-23 2017-07-18 四川西金联合电气股份有限公司 A kind of electronic heat sink
CN110437888A (en) * 2019-08-21 2019-11-12 中冶焦耐(大连)工程技术有限公司 exhaust gas cooler
USD962879S1 (en) * 2020-04-09 2022-09-06 Acer Incorporated Heat-dissipation unit

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