US20020006997A1 - Compositions with enhanced ductility - Google Patents
Compositions with enhanced ductility Download PDFInfo
- Publication number
- US20020006997A1 US20020006997A1 US09/291,462 US29146299A US2002006997A1 US 20020006997 A1 US20020006997 A1 US 20020006997A1 US 29146299 A US29146299 A US 29146299A US 2002006997 A1 US2002006997 A1 US 2002006997A1
- Authority
- US
- United States
- Prior art keywords
- composition
- polyphenylene ether
- organoclay
- resin
- ether resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 91
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- -1 heteroaromatic cation Chemical class 0.000 claims description 36
- 229920006122 polyamide resin Polymers 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000003063 flame retardant Substances 0.000 claims description 10
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 10
- 239000011707 mineral Substances 0.000 claims description 10
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 229920005669 high impact polystyrene Polymers 0.000 claims description 6
- 239000004797 high-impact polystyrene Substances 0.000 claims description 6
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical group O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical group [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 229910001594 brammallite Inorganic materials 0.000 claims description 2
- 238000005341 cation exchange Methods 0.000 claims description 2
- 229910001596 celadonite Inorganic materials 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229910000271 hectorite Inorganic materials 0.000 claims description 2
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims description 2
- 229910000275 saponite Inorganic materials 0.000 claims description 2
- 125000005842 heteroatom Chemical class 0.000 claims 5
- 150000001768 cations Chemical class 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 claims 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 claims 2
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 claims 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 claims 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 claims 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 claims 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 claims 2
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 claims 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 1
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 claims 1
- GAMYYCRTACQSBR-UHFFFAOYSA-N 4-azabenzimidazole Chemical compound C1=CC=C2NC=NC2=N1 GAMYYCRTACQSBR-UHFFFAOYSA-N 0.000 claims 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 claims 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 claims 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 claims 1
- 150000003863 ammonium salts Chemical group 0.000 claims 1
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 claims 1
- 229910001649 dickite Inorganic materials 0.000 claims 1
- 229910052621 halloysite Inorganic materials 0.000 claims 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 claims 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 claims 1
- 229910052622 kaolinite Inorganic materials 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910000273 nontronite Inorganic materials 0.000 claims 1
- 229920005672 polyolefin resin Polymers 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000004927 clay Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 11
- 230000000704 physical effect Effects 0.000 abstract description 6
- 125000000962 organic group Chemical group 0.000 abstract description 5
- 229920001169 thermoplastic Polymers 0.000 abstract description 5
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 4
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 16
- 229910019142 PO4 Inorganic materials 0.000 description 14
- 235000021317 phosphate Nutrition 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 11
- 239000004609 Impact Modifier Substances 0.000 description 10
- 229920001400 block copolymer Polymers 0.000 description 9
- 229910052736 halogen Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000010452 phosphate Substances 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 150000002367 halogens Chemical group 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- 229920000098 polyolefin Polymers 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 0 *C.*C(=C)c1ccccc1.II Chemical compound *C.*C(=C)c1ccccc1.II 0.000 description 5
- 229920000359 diblock copolymer Polymers 0.000 description 5
- 150000001993 dienes Chemical class 0.000 description 5
- 150000002430 hydrocarbons Chemical class 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 150000008039 phosphoramides Chemical class 0.000 description 5
- 229920000428 triblock copolymer Polymers 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 229920002633 Kraton (polymer) Polymers 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910052984 zinc sulfide Inorganic materials 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920013623 Solprene Polymers 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000001118 alkylidene group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- OBTARUYASFQRHM-UHFFFAOYSA-N benzene-1,3-diol;diphenoxyphosphoryl diphenyl phosphate Chemical compound OC1=CC=CC(O)=C1.C=1C=CC=CC=1OP(OP(=O)(OC=1C=CC=CC=1)OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 OBTARUYASFQRHM-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000012764 mineral filler Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229960003742 phenol Drugs 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- FJUJZGNQVISAPS-UHFFFAOYSA-N (4-methylphenyl) bis(2,5,5-trimethylhexyl) phosphate Chemical compound CC(C)(C)CCC(C)COP(=O)(OCC(C)CCC(C)(C)C)OC1=CC=C(C)C=C1 FJUJZGNQVISAPS-UHFFFAOYSA-N 0.000 description 1
- JNUCNIFVQZYOCP-UHFFFAOYSA-N (4-methylphenyl) dihydrogen phosphate Chemical compound CC1=CC=C(OP(O)(O)=O)C=C1 JNUCNIFVQZYOCP-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- FYEICUJLVWWATQ-UHFFFAOYSA-N 1,3-dibromo-2-[(2,6-dibromophenyl)methyl]benzene Chemical compound BrC1=CC=CC(Br)=C1CC1=C(Br)C=CC=C1Br FYEICUJLVWWATQ-UHFFFAOYSA-N 0.000 description 1
- SKLOHZRZUDVZDA-UHFFFAOYSA-N 1,3-dichloro-2-[2-(2,6-dichlorophenyl)ethyl]benzene Chemical compound ClC1=CC=CC(Cl)=C1CCC1=C(Cl)C=CC=C1Cl SKLOHZRZUDVZDA-UHFFFAOYSA-N 0.000 description 1
- MZGIQLRQZHLDMY-UHFFFAOYSA-N 1,3-dichloro-2-[2-(2,6-dichlorophenyl)pentan-2-yl]benzene Chemical compound ClC=1C=CC=C(Cl)C=1C(C)(CCC)C1=C(Cl)C=CC=C1Cl MZGIQLRQZHLDMY-UHFFFAOYSA-N 0.000 description 1
- AEYSBXOAQUTNNK-UHFFFAOYSA-N 1,3-dichloro-5-[1-(3,5-dichlorophenyl)ethyl]benzene Chemical compound C=1C(Cl)=CC(Cl)=CC=1C(C)C1=CC(Cl)=CC(Cl)=C1 AEYSBXOAQUTNNK-UHFFFAOYSA-N 0.000 description 1
- UFSATALLDGOPCE-UHFFFAOYSA-N 1,3-dichloro-5-[2-(3,5-dichlorophenyl)propan-2-yl]benzene Chemical compound C=1C(Cl)=CC(Cl)=CC=1C(C)(C)C1=CC(Cl)=CC(Cl)=C1 UFSATALLDGOPCE-UHFFFAOYSA-N 0.000 description 1
- YYZGAPJCNYTXQY-UHFFFAOYSA-N 1,3-dichloro-5-[cyclohexyl-(3,5-dichlorophenyl)methyl]benzene Chemical compound ClC1=CC(Cl)=CC(C(C2CCCCC2)C=2C=C(Cl)C=C(Cl)C=2)=C1 YYZGAPJCNYTXQY-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Definitions
- the invention relates to compositions comprising an organically modified layered silicate clay generally referred to as organo clay and polyphenylene ether resin and blends containing polyphenylene ether resin
- the compositions exhibit physical properties that are enhanced over compositions containing clay of the prior art.
- the invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art.
- the invention also relates to articles made from the compositions.
- Organo clay materials have been used in crystalline resins, e.g., polyesters and polyamide resins, to enhance the flame and/or temperature resistance characteristics.
- crystalline resins e.g., polyesters and polyamide resins
- the utility of organo clay material to enhance the ductility of thermoplastic resins is believed to be novel and non-obvious.
- compositions comprising:
- the invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art.
- the invention also relates to articles made from the compositions and methods.
- organoclay is a layered silicate clay, derived from layered minerals, in which organic structures have been chemically incorporated.
- organic structures are trimethyldodecylammonium ion and N,N′-didodecylimidazolium ion. Since the surfaces of clay layers, which have a lattice-like arrangement, are electrically charged, they are capable of binding organic ions.
- the preferred organo clays are layered minerals that have undergone cation exchange with organo cations and/or onium compounds.
- layered minerals are the kaolinite group and the montmorillonite group. It is also within the scope of this invention to employ minerals of the illite group which can include hydromicas, phengite, brammallite, glaucomite, celadonite and the like. Often, however, the preferred layered minerals include those often referred to as 2:1 layered silicate minerals like muscovite, vermiculite, saponite, hectorite and montmorillonite, wherein montmorillonite is often preferred.
- the layered minerals described above may be synthetically produced. However, most often they are naturally occurring and commercially available. A detailed description of the layered minerals can be found in U.S. Pat. No. 5,530,052 which is incorporated herein by reference.
- the amount of organoclay present in the compositions of the invention can vary depending on the final properties desired. Generally, the level is adjusted to allow for the desired level of increased stiffness, heat resistance, and/or dimensional stability balanced against the level of achievable ductility. Typical levels include from about 1% to about 25% by weight, preferably between about 1% to about 15% by weight, based upon the entire weight of the composition.
- PPE Polyphenylene ether resin
- each Q 1 is independently halogen, primary or secondary lower alkyl (e.g., alkyl containing up to 7 carbon atoms), phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each Q 2 is independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy as defined for Q 1 .
- each Q 1 is alkyl or phenyl, especially C 1-4 alkyl, and each Q 2 is hydrogen.
- Both homopolymer and copolymer PPE are included.
- the preferred homopolymers are those containing 2,6-dimethyl-1,4-phenylene ether units.
- Suitable copolymers include random copolymers containing, for example, such units in combination with 2,3,6-trimethyl-1,4-phenylene ether units.
- PPE containing moieties prepared by grafting vinyl monomers or polymers such as polystyrenes, as well as coupled PPE in which coupling agents such as low molecular weight polycarbonates, quinones, heterocycles and formals undergo reaction in known manner with the hydroxy groups of two PPE chains to produce a higher molecular weight polymer.
- the PPE generally have an intrinsic viscosity often between about 0.05-0.60 dl./g., preferably in the range of about 0.10-0.48 dl./g., all as measured in chloroform at 25° C. It is also possible to utilize a high intrinsic viscosity PPE and a low intrinsic viscosity PPE in combination.
- high viscosity is meant a PPE having an I.V. of at least about 0.30 dl/g, and conversely, by low is meant a PPE with an I.V. of less than about 0.30 dl/g, preferably less than about 0.20 dl/g. Determining an exact ratio, when two intrinsic viscosities are used, will depend somewhat on the exact intrinsic viscosities of the PPE used and the ultimate physical properties that are desired.
- the PPE resin compositions of the present invention preferably contain at least one nonelastomeric polymer of an alkenylaromatic compound.
- Suitable polymers of this type may be prepared by methods known in the art including bulk, suspension and emulsion polymerization. They generally contain at least about 25% by weight of structural units derived from an alkenylaromatic monomer of the formula (II):
- G is hydrogen, lower alkyl or halogen
- Z is vinyl, halogen or lower alkyl
- p is from 0 to 5.
- resins include homopolymers of styrene, chlorostyrene and vinyltoluene, random copolymers of styrene with one or more monomers illustrated by acrylonitrile, butadiene, ⁇ -methylstyrene, ethylvinylbenzene, divinylbenzene and maleic anhydride, and rubber-modified polystyrenes comprising blends and grafts, wherein the rubber is a polybutadiene or a rubbery copolymer of about 98-68% styrene and about 2-32% diene monomer.
- HIPS high impact polystyrene
- Non-elastomeric block copolymer compositions of styrene and butadiene can also be used that have linear block, radial block or tapered block copolymer architectures. They are commercially available from such companies as Fina Oil as under the trademark FINACLEAR and Phillips under the trademark K-RESINS.
- the amount of the polymer of a nonelastomeric alkenylaromatic compound when one is used, is an amount effective to improve the flow and processability of the composition. Improved flow can be indicated by reduced viscosity or reduced injection pressures needed to fill a part during an injection molding process.
- the nonelastomeric alkenylaromatic compound is utilized in the range of about 20% to about 60% by weight based on the total weight of the composition. The preferred range is about 30% to about 60% by weight; based on the total weight of the composition.
- compositions of the present invention may also contain at least one impact modifier.
- the impact modifier may be used alone or in combination with a nonelastomeric alkenylaromatic compound.
- the impact modifiers include block (typically diblock, triblock or radial teleblock) copolymers of alkenyl aromatic compounds and dienes. Most often at least one block is derived from styrene and at least one block from at least one of butadiene and isoprene. Especially preferred are the triblock and diblock copolymers comprising polystyrene blocks and diene derived blocks wherein the aliphatic unsaturation has been preferentially removed with hydrogenation. Mixtures of various copolymers are also sometimes useful.
- the weight average molecular weights of the impact modifiers are typically in the range of about 50,000 to 300,000.
- Block copolymers of this type are available commercially from a number of sources, including Phillips Petroleum under the trademark SOLPRENE, Shell Chemical Co. under the trademark KRATON, and Kuraray under the trademark SEPTON.
- the amount of the impact modifier generally present, when one is used, is an amount effective to improve the physical properties, for example, the ductility of the composition when compared to the same composition without an impact modifier. Improved ductility can be indicated by increased impact strength, increased tensile elongation to break, or both increased impact strength and increased tensile elongation to break.
- the impact modifier is utilized in the range of about 1% to about 20% by weight based on the total weight of the composition. A preferred range is about 1% to about 8% by weight; based on the total weight of the composition. The exact amount and types or combinations of impact modifiers utilized will depend in part on the requirements needed in the final blend composition.
- compositions comprising polyphenylene ether resin
- preferred compositions have the major components which make up the composition in an amount within the following preferred ranges:
- Polyphenylene ether resin (a) about 30 to about 70 parts;
- Non-elastomeric polymer of an alkenylaromatic compound (b) about 20 to about 60 parts;
- Compatibilized blends of polyphenylene ether resin and polyamide resin are another useful resin composition for the present invention.
- Compatibilized blends of a polyphenylene ether resin and a polyamide resin are generally known in the art. These blends are typically made through reactive compounding techniques involving addition of a compatibilizing agent to compositions containing polyphenylene ether resin and polyamide resin.
- the compatibilizing agent is thought to result in reaction products between the polyphenylene ether resin and a polyamide resin and that these reaction products improve the compatibility between the polyphenylene ether resin and polyamide resin.
- the improved compatibility results in enhanced physical properties such as, for example, increased ductility.
- Illustrative compatibilizing agents for blends of polyphenylene ether resin and polyamide resin include citric acid, maleic anhydride, fumaric acid, malic acid as well as various derivatives of the foregoing.
- the ratio of polyphenylene ether resin to polyamide resin can vary widely but is preferably adjusted so that the polyamide resin remains the continuous phase.
- the polyamide is at least about 40% by weight of the total resin composition. Increasing the level of the polyamide results in enhanced ductility and flow and is often preferred.
- the resin compositions may contain more than one type of polyamide resin such as a blend of nylon 6 and nylon 6,6.
- the amine to acid endgroup ratio of the polyamide resin may also be varied as well as the relative viscosity of the polyamide contained within the resin composition.
- the polyphenylene ether resins useful in the present invention include all known polyphenylene ether resins.
- Preferable resins include poly(2,6-dimethylphenylene ether) as well as the copolymer resins of 2,6-dimethylphenol and 2,3,6-trimethylphenol. These and other variations of the polyamide and the polyphenylene ether resins do not detract from the present invention.
- the compatibilized blend of polyphenylene ether resin and polyamide resin may additionally contain various property modifiers such as elastomers for ductility enhancement.
- elastomers for this purpose are known in the art and include, for example, styrenic block copolymers and various acid functionalized ethylene-propylene copolymers (e.g., EP-graft-maleic anhydride).
- elastomeric block copolymers for example, A-B-A triblock copolymers and A-B diblock copolymers.
- the A-B and A-B-A type block copolymer rubber additives which may be used are thermoplastic rubbers comprised of one or two alkenyl aromatic blocks which are typically styrene blocks and a rubber block, e.g., a butadiene block which may be partially or totally hydrogenated. Mixtures of these triblock copolymers and diblock copolymers are especially preferred in the present compositions.
- Suitable A-B and A-B-A type block copolymers are disclosed in, for example, U.S. Pat. Nos. 3,078,254, 3,402,159, 3,297,793, 3,265,765, and 3,594,452 and U.K. Patent 1,264,741.
- A-B and A-B-A block copolymers include polystyrene-polybutadiene (SBR), polystyrene-poly(ethylene-propylene), polystyrene-polyisoprene, poly(a-methylstyrene)-polybutadiene, polystyrene-polybutadiene-polystyrene (SBR), polystyrene-poly(ethylene-butylene)-polystyrene, polystyrene-polyisoprene-polystyrene and poly( ⁇ -methylstyrene)-polybutadiene-poly(a-methylstyrene), as well as the selectively hydrogenated versions thereof.
- SBR polystyrene-polybutadiene
- SBR polystyrene-poly(ethylene-propylene)
- polystyrene-polyisoprene poly(a-
- A-B and A-B-A block copolymers are available commercially from a number of sources, including Phillips Petroleum under the trademark SOLPRENE, Shell Chemical Co., under the trademark KRATON, Dexco under the tradename VECTOR, and Kuraray under the trademark SEPTON.
- Other property modifiers include nucleating agents, stabilizers, pigments, dyes, and mineral fillers and reinforcing agents.
- Also useful elastomers include functionalized elastomeric polyolefins such as elastomeric polyolefins containing at least one moiety of the group consisting of anhydride, epoxy, oxazoline, and orthoester.
- the essential structural units of the elastomeric polyolefin are derived from ethylene and at least one C 3-8 1-olefin, such as, propylene, 1-butene, 1-hexene, and 1-octene.
- the proportions of ethylene and at least one C 3-8 1-olefin are not critical provided that they together constitute the major portion of the polymer.
- the functionalized elastomeric polyolefin is a functionalized ethylene-propylene rubber or a functionalized ethylene-propylene-diene elastomer.
- the diene portion is at least one non-conjugated diene, such as ethylidene norbornene, 1,4-hexadiene, or dicyclopentadiene.
- These elastomeric polyolefins are known in the art as EPR and EPDM elastomers.
- a useful amount of the optional elastomeric block copolymers is between about 1% and about 15% by weight, preferably between about 1% and about 10% by weight, wherein the weight percentages are based on the entire weight of the composition. Mixtures of the previous described impact modifiers are also useful.
- the resins of the present invention may also comprise at least one flame retardant, generally a halogenated material, an organic phosphate, or a combination of the two.
- a flame retardant generally a halogenated material
- an organic phosphate or a combination of the two.
- the organic phosphate class of materials are generally preferred.
- the organic phosphate is preferably an aromatic phosphate compound of the formula (III):
- R is the same or different and is alkyl, cycloalkyl, aryl, alkyl substituted aryl, halogen substituted aryl, aryl substituted alkyl, halogen, or a combination of any of the foregoing, provided at least one R is aryl.
- Examples include phenyl bisdodecyl phosphate, phenylbisneopentyl phosphate, phenyl-bis (3,5,5′-tri-methyl-hexyl phosphate), ethyldiphenyl phosphate, 2-ethyl-hexyldi(p-tolyl) phosphate, bis-(2-ethylhexyl) p-tolylphosphate, tritolyl phosphate, bis-(2-ethylhexyl) phenyl phosphate, tri-(nonylphenyl) phosphate, di (dodecyl) p-tolyl phosphate, tricresyl phosphate, triphenyl phosphate, dibutylphenyl phosphate, 2-chloroethyldiphenyl phosphate, p-tolyl bis(2,5,5′-trimethylhexyl) phosphate, 2-ethyl
- the organic phosphate can be a di- or polyfunctional compound or polymer having the formula (IV), (V), or (VI) below:
- R 1 , R 3 and R 5 are, independently, hydrocarbon
- R 2 , R 4 , R 6 and R 7 are, independently, hydrocarbon or hydrocarbonoxy
- X 1 , X 2 and X 3 are halogen
- m and r are 0 or integers from 1 to 4
- n and p are from 1 to 30.
- Examples include the bis diphenyl phosphates of resorcinol, hydroquinone and bisphenol-A, respectively, or their polymeric counterparts.
- Another group of useful flame retardants include certain cyclic phosphates, for example, diphenyl pentaerythritol diphosphate, as a flame retardant agent for polyphenylene ether resins, as is described by Axelrod in U.S. Pat. No. 4,254,775.
- each A moiety is a 2,6-dimethylphenyl moiety or a 2,4,6-trimethylphenyl moiety.
- These phosphoramides are piperazine-type phosphoramides. These additives are known in the art and have been described in Talley, J. Chem. Eng. Data, 33, 221-222 (1988). When polyamide resins are used as part of the composition, these piperazine-type phosphoramides are especially useful as they are believed to have less interactions with the polyamides then the organo-ester type phosphates.
- Preferred phosphate flame retardants include those based upon resorcinol such as, for example, resorcinol tetraphenyl diphosphate, as well as those based upon bis-phenols such as, for example, bis-phenol A tetraphenyl diphosphate. Also preferred are the aforementioned piperazine-type phosphoramides. Phosphates containing substituted phenyl groups are also preferred.
- the organophosphate is selected from the group consisting of butylated triphenyl phosphate ester, resorcinol tetraphenyl diphosphate, bis-phenol A tetraphenyl diphosphate, and mixtures containing at least one of the foregoing.
- the flame retardant is present in at least the minimum amount necessary to impart a degree of flame retardancy to the composition to pass the desired UL-94 protocol.
- the particular amount will vary, depending on the molecular weight of the organic phosphate, the amount of the flanunable resin present and possibly other normally flammable ingredients which might also be included in the composition.
- Halogenated materials are also a useful class of flame retardants. These materials are preferably aromatic halogen compounds and resins of the formula (VIII):
- R is an alkylene, alkylidene or cycloaliphatic linkage, e.g., methylene, ethylene, propylene, isopropylene, isopropylidene, butylene, isobutylene, amylene, cyclohexylene, cyclopentylidene, etc.; a linkage selected from the group consisting of either oxygen ether; carbonyl; amine; a sulfur containing linkage, e.g., sulfide, sulfoxide, sulfone; a phosphorus containing linkage; etc.
- a linkage selected from the group consisting of either oxygen ether; carbonyl; amine; a sulfur containing linkage, e.g., sulfide, sulfoxide, sulfone; a phosphorus containing linkage; etc.
- R can also consist of two or more alkylene or alkylidene linkages connected by such groups as aromatic, amino, ether, carbonyl, sulfide, sulfoxide, sulfone, a phosphorus containing linkage, etc.
- Other groups which are represented by R will occur to those skilled in the art, including those found in U.S. Pat. Nos. 4,692,490 and 4,191,685.
- Ar and Ar′ are mono- or polycarbocyclic aromatic groups such as phenylene, biphenylene, terphenylene, naphthylene, etc. Ar and Ar′may be the same or different.
- Y is a substituent selected from the group consisting of organic, inorganic or organometallic radicals.
- the substituents represented by Y include (1) halogen, e.g., chlorine, bromine, iodine, fluorine or (2) ether groups of the general formula OE, wherein E is a monovalent hydrocarbon radical similar to X or (3) monovalent hydrocarbon groups of the type represented by R or (4) other substituents, e.g., nitro, cyano, etc., said substituents being essentially inert provided there be at least one and preferably two halogen atoms per aryl nucleus.
- X is a monovalent hydrocarbon group exemplified by the following: alkyl, such as methyl, ethyl, propyl, isopropyl, butyl, decyl, etc; aryl groups, such as phenyl, naphthyl, biphenyl, xylyl, tolyl, etc; aralkyl groups such as benzyl, ethylphenyl, etc.; cycloaliphatic groups, such as cyclopentyl, cyclohexyl, etc.; as well as monovalent hydrocarbon groups containing inert substituents therein. It will be understood that where more than one X is used they may be alike or different.
- the letter d represents a whole number ranging from 1 to a maximum equivalent to the number of replaceable hydrogens substituted on the aromatic rings comprising Ar or Ar′.
- the letter e represents a whole number ranging from 0 to a maximum controlled by the number of replaceable hydrogens on R.
- the letters a, b, and c represent whole numbers including 0. When b is not 0, neither a nor c may be 0. Otherwise either a or c, but not both, may be 0. Where b is 0, the aromatic groups are joined by a direct carbon-carbon bond.
- hydroxyl and Y substituents on the aromatic groups, Ar and Ar′ can be varied in the ortho, meta or para positions on the aromatic rings and the groups can be in any possible geometric relationship with respect to one another.
- oligomeric and polymeric halogenated aromatic compounds such as, for example, a copolycarbonate of bisphenol A and tetrabromobisphenol A and a carbonate precursor, e.g., phosgene.
- Metal synergists e.g., antimony oxide, may also be used with the flame retardant.
- composition can be further modified, if desired, by including one or more additives often used with thermoplastic polymers, some of which may serve to beneficially affect the chemical and physical properties.
- additives often used with thermoplastic polymers, some of which may serve to beneficially affect the chemical and physical properties.
- examples are mineral fillers, including clay, reinforcing agents, for example, glass fibers, flakes or spheres, plasticizers, flame retardants, stabilizers, antioxidants, colorants, processing aids, and so forth.
- the resin compositions used in the present invention can be prepared by a variety of methods involving intimate admixing of the materials with any additional additives desired in the formulation. Suitable procedures include solution blending and melt blending. Because of the availability of melt blending equipment in commercial polymer processing facilities, melt processing procedures are generally preferred. Examples of equipment used in such melt compounding methods include: co-rotating and counter-rotating extruders, single screw extruders, disc-pack processors and various other types of extrusion equipment. In some instances, the compounded material exits the extruder through small exit holes in a die and the resulting strands of molten resin are cooled by passing the strands through a water bath. The cooled strands can be chopped into small pellets for packaging and further handling.
- All of the ingredients may be added initially to the processing system, or else certain additives may be pre-compounded with each other.
- the concentrate is then added in an amount necessary to achieve the desired final amount.
- Concentrates are especially useful and desirable when a crystalline resin, e.g. polyamide, polyester, or polyolefin, is used as at least part of the resin composition.
- vent port in each section between the feed ports to allow venting (either atmospheric or vacuum) of the melt.
- thermoplastic compositions described herein are another embodiment of the present invention.
- SBS polystyrene-polybutadiene-polystyrene block copolymer commercially available from Shell Chemical Co. as KRATON® D-1102
- HG-90 a silicate clay, commercially available from Huber Co. as grade HG-90
- I-1010 a commercially available hindered phenol antioxidant, commercially available from Ciba-Geigy as Irganox 1010
- compositions of the table were extruded on a Werner-Pfleiderer twin-screw extruder at a temperature of about 280-300° C. with a vacuum of 2 inches Hg applied to the melt during compounding.
- the resultant compositions were molded using a Toshiba injection molding machine using a temperature set of about 280-300° C. and a mold temperature of about 100° C. Test specimens were subjected to testing under ASTM conditions.
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Abstract
Description
- Not applicable.
- Not applicable.
- 1. Field of the Invention
- The invention relates to compositions comprising an organically modified layered silicate clay generally referred to as organo clay and polyphenylene ether resin and blends containing polyphenylene ether resin
- In a preferred embodiment, the compositions exhibit physical properties that are enhanced over compositions containing clay of the prior art. The invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art. The invention also relates to articles made from the compositions.
- 2. Brief Description of the Related Art
- Many commercial articles, such as connectors and automotive under hood components, require levels of stiffness and heat resistance that are greater than most thermoplastic resins. Inorganic fillers have been used to increase the stiffness and heat resistance of thermoplastic resins, however, concomitant with an unacceptable loss in ductility for many applications.
- Organo clay materials have been used in crystalline resins, e.g., polyesters and polyamide resins, to enhance the flame and/or temperature resistance characteristics. The utility of organo clay material to enhance the ductility of thermoplastic resins is believed to be novel and non-obvious.
- The present invention relates to compositions comprising:
- (i) polyphenylene ether resin and blends containing polyphenylene ether resin, and
- (ii) an organoclay.
- The invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art. The invention also relates to articles made from the compositions and methods.
- The description which follows provides further details regarding this invention.
- Not applicable.
- As used herein, organoclay is a layered silicate clay, derived from layered minerals, in which organic structures have been chemically incorporated. Illustrative examples of organic structures are trimethyldodecylammonium ion and N,N′-didodecylimidazolium ion. Since the surfaces of clay layers, which have a lattice-like arrangement, are electrically charged, they are capable of binding organic ions. There is no limitation with respect to the layered minerals employed in this invention other than that they are capable of undergoing an ion exchange with the organic ions. The preferred organo clays are layered minerals that have undergone cation exchange with organo cations and/or onium compounds. Illustrative of such layered minerals are the kaolinite group and the montmorillonite group. It is also within the scope of this invention to employ minerals of the illite group which can include hydromicas, phengite, brammallite, glaucomite, celadonite and the like. Often, however, the preferred layered minerals include those often referred to as 2:1 layered silicate minerals like muscovite, vermiculite, saponite, hectorite and montmorillonite, wherein montmorillonite is often preferred. The layered minerals described above may be synthetically produced. However, most often they are naturally occurring and commercially available. A detailed description of the layered minerals can be found in U.S. Pat. No. 5,530,052 which is incorporated herein by reference.
- The amount of organoclay present in the compositions of the invention can vary depending on the final properties desired. Generally, the level is adjusted to allow for the desired level of increased stiffness, heat resistance, and/or dimensional stability balanced against the level of achievable ductility. Typical levels include from about 1% to about 25% by weight, preferably between about 1% to about 15% by weight, based upon the entire weight of the composition.
- Descriptions of useful resins for the practice of the present invention are provided as follows.
- Polyphenylene Ether Resin and Blends Containing Polyphenylene Ether Resin.
-
- wherein for each structural unit, each Q1 is independently halogen, primary or secondary lower alkyl (e.g., alkyl containing up to 7 carbon atoms), phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each Q2 is independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy as defined for Q1. Preferably, each Q1 is alkyl or phenyl, especially C1-4 alkyl, and each Q2 is hydrogen.
- Both homopolymer and copolymer PPE are included. The preferred homopolymers are those containing 2,6-dimethyl-1,4-phenylene ether units. Suitable copolymers include random copolymers containing, for example, such units in combination with 2,3,6-trimethyl-1,4-phenylene ether units. Also included are PPE containing moieties prepared by grafting vinyl monomers or polymers such as polystyrenes, as well as coupled PPE in which coupling agents such as low molecular weight polycarbonates, quinones, heterocycles and formals undergo reaction in known manner with the hydroxy groups of two PPE chains to produce a higher molecular weight polymer.
- It will be apparent to those skilled in the art from the foregoing that the PPE contemplated for use in the present invention include all those presently known, irrespective of variations in structural units or ancillary chemical features.
- The PPE generally have an intrinsic viscosity often between about 0.05-0.60 dl./g., preferably in the range of about 0.10-0.48 dl./g., all as measured in chloroform at 25° C. It is also possible to utilize a high intrinsic viscosity PPE and a low intrinsic viscosity PPE in combination. By high viscosity is meant a PPE having an I.V. of at least about 0.30 dl/g, and conversely, by low is meant a PPE with an I.V. of less than about 0.30 dl/g, preferably less than about 0.20 dl/g. Determining an exact ratio, when two intrinsic viscosities are used, will depend somewhat on the exact intrinsic viscosities of the PPE used and the ultimate physical properties that are desired.
- The PPE resin compositions of the present invention preferably contain at least one nonelastomeric polymer of an alkenylaromatic compound. Suitable polymers of this type may be prepared by methods known in the art including bulk, suspension and emulsion polymerization. They generally contain at least about 25% by weight of structural units derived from an alkenylaromatic monomer of the formula (II):
- wherein G is hydrogen, lower alkyl or halogen; Z is vinyl, halogen or lower alkyl; and p is from 0 to 5. These resins include homopolymers of styrene, chlorostyrene and vinyltoluene, random copolymers of styrene with one or more monomers illustrated by acrylonitrile, butadiene, α-methylstyrene, ethylvinylbenzene, divinylbenzene and maleic anhydride, and rubber-modified polystyrenes comprising blends and grafts, wherein the rubber is a polybutadiene or a rubbery copolymer of about 98-68% styrene and about 2-32% diene monomer. These rubber modified polystyrenes include high impact polystyrene (commonly referred to as HIPS). Non-elastomeric block copolymer compositions of styrene and butadiene can also be used that have linear block, radial block or tapered block copolymer architectures. They are commercially available from such companies as Fina Oil as under the trademark FINACLEAR and Phillips under the trademark K-RESINS.
- The amount of the polymer of a nonelastomeric alkenylaromatic compound, when one is used, is an amount effective to improve the flow and processability of the composition. Improved flow can be indicated by reduced viscosity or reduced injection pressures needed to fill a part during an injection molding process. Generally, the nonelastomeric alkenylaromatic compound is utilized in the range of about 20% to about 60% by weight based on the total weight of the composition. The preferred range is about 30% to about 60% by weight; based on the total weight of the composition.
- The compositions of the present invention may also contain at least one impact modifier. The impact modifier may be used alone or in combination with a nonelastomeric alkenylaromatic compound. The impact modifiers include block (typically diblock, triblock or radial teleblock) copolymers of alkenyl aromatic compounds and dienes. Most often at least one block is derived from styrene and at least one block from at least one of butadiene and isoprene. Especially preferred are the triblock and diblock copolymers comprising polystyrene blocks and diene derived blocks wherein the aliphatic unsaturation has been preferentially removed with hydrogenation. Mixtures of various copolymers are also sometimes useful. The weight average molecular weights of the impact modifiers are typically in the range of about 50,000 to 300,000. Block copolymers of this type are available commercially from a number of sources, including Phillips Petroleum under the trademark SOLPRENE, Shell Chemical Co. under the trademark KRATON, and Kuraray under the trademark SEPTON.
- Various mixtures of the aforementioned impact modifiers are also sometimes useful. The amount of the impact modifier generally present, when one is used, is an amount effective to improve the physical properties, for example, the ductility of the composition when compared to the same composition without an impact modifier. Improved ductility can be indicated by increased impact strength, increased tensile elongation to break, or both increased impact strength and increased tensile elongation to break. Generally, the impact modifier is utilized in the range of about 1% to about 20% by weight based on the total weight of the composition. A preferred range is about 1% to about 8% by weight; based on the total weight of the composition. The exact amount and types or combinations of impact modifiers utilized will depend in part on the requirements needed in the final blend composition.
- For compositions comprising polyphenylene ether resin, preferred compositions have the major components which make up the composition in an amount within the following preferred ranges:
- Polyphenylene ether resin, (a) about 30 to about 70 parts;
- Non-elastomeric polymer of an alkenylaromatic compound, (b) about 20 to about 60 parts; and
- Organoclay, (c) about 1 to about 10 parts;
- based on 100 parts by weight of (a), (b), and (c) together.
- Compatibilized blends of polyphenylene ether resin and polyamide resin are another useful resin composition for the present invention. Compatibilized blends of a polyphenylene ether resin and a polyamide resin are generally known in the art. These blends are typically made through reactive compounding techniques involving addition of a compatibilizing agent to compositions containing polyphenylene ether resin and polyamide resin. The compatibilizing agent is thought to result in reaction products between the polyphenylene ether resin and a polyamide resin and that these reaction products improve the compatibility between the polyphenylene ether resin and polyamide resin. The improved compatibility results in enhanced physical properties such as, for example, increased ductility. Illustrative compatibilizing agents for blends of polyphenylene ether resin and polyamide resin include citric acid, maleic anhydride, fumaric acid, malic acid as well as various derivatives of the foregoing.
- The ratio of polyphenylene ether resin to polyamide resin can vary widely but is preferably adjusted so that the polyamide resin remains the continuous phase. Preferably the polyamide is at least about 40% by weight of the total resin composition. Increasing the level of the polyamide results in enhanced ductility and flow and is often preferred. The resin compositions may contain more than one type of polyamide resin such as a blend of nylon 6 and nylon 6,6. Moreover, the amine to acid endgroup ratio of the polyamide resin may also be varied as well as the relative viscosity of the polyamide contained within the resin composition.
- The polyphenylene ether resins useful in the present invention include all known polyphenylene ether resins. Preferable resins include poly(2,6-dimethylphenylene ether) as well as the copolymer resins of 2,6-dimethylphenol and 2,3,6-trimethylphenol. These and other variations of the polyamide and the polyphenylene ether resins do not detract from the present invention.
- The compatibilized blend of polyphenylene ether resin and polyamide resin may additionally contain various property modifiers such as elastomers for ductility enhancement. Useful elastomers for this purpose are known in the art and include, for example, styrenic block copolymers and various acid functionalized ethylene-propylene copolymers (e.g., EP-graft-maleic anhydride). Especially preferred are the so called elastomeric block copolymers, for example, A-B-A triblock copolymers and A-B diblock copolymers. The A-B and A-B-A type block copolymer rubber additives which may be used are thermoplastic rubbers comprised of one or two alkenyl aromatic blocks which are typically styrene blocks and a rubber block, e.g., a butadiene block which may be partially or totally hydrogenated. Mixtures of these triblock copolymers and diblock copolymers are especially preferred in the present compositions.
- Suitable A-B and A-B-A type block copolymers are disclosed in, for example, U.S. Pat. Nos. 3,078,254, 3,402,159, 3,297,793, 3,265,765, and 3,594,452 and U.K. Patent 1,264,741. Examples of typical species of A-B and A-B-A block copolymers include polystyrene-polybutadiene (SBR), polystyrene-poly(ethylene-propylene), polystyrene-polyisoprene, poly(a-methylstyrene)-polybutadiene, polystyrene-polybutadiene-polystyrene (SBR), polystyrene-poly(ethylene-butylene)-polystyrene, polystyrene-polyisoprene-polystyrene and poly(α-methylstyrene)-polybutadiene-poly(a-methylstyrene), as well as the selectively hydrogenated versions thereof. Mixtures of the aforementioned block copolymers are also useful. Such A-B and A-B-A block copolymers are available commercially from a number of sources, including Phillips Petroleum under the trademark SOLPRENE, Shell Chemical Co., under the trademark KRATON, Dexco under the tradename VECTOR, and Kuraray under the trademark SEPTON. Other property modifiers include nucleating agents, stabilizers, pigments, dyes, and mineral fillers and reinforcing agents.
- Also useful elastomers include functionalized elastomeric polyolefins such as elastomeric polyolefins containing at least one moiety of the group consisting of anhydride, epoxy, oxazoline, and orthoester. The essential structural units of the elastomeric polyolefin are derived from ethylene and at least one C3-8 1-olefin, such as, propylene, 1-butene, 1-hexene, and 1-octene. The proportions of ethylene and at least one C3-8 1-olefin are not critical provided that they together constitute the major portion of the polymer.
- In a preferred embodiment, the functionalized elastomeric polyolefin is a functionalized ethylene-propylene rubber or a functionalized ethylene-propylene-diene elastomer. The diene portion is at least one non-conjugated diene, such as ethylidene norbornene, 1,4-hexadiene, or dicyclopentadiene. These elastomeric polyolefins are known in the art as EPR and EPDM elastomers.
- A useful amount of the optional elastomeric block copolymers is between about 1% and about 15% by weight, preferably between about 1% and about 10% by weight, wherein the weight percentages are based on the entire weight of the composition. Mixtures of the previous described impact modifiers are also useful.
- Flame Retardant
- The resins of the present invention may also comprise at least one flame retardant, generally a halogenated material, an organic phosphate, or a combination of the two. For resin compositions containing polyphenylene ether or polycarbonate resin, the organic phosphate class of materials are generally preferred. The organic phosphate is preferably an aromatic phosphate compound of the formula (III):
- where R is the same or different and is alkyl, cycloalkyl, aryl, alkyl substituted aryl, halogen substituted aryl, aryl substituted alkyl, halogen, or a combination of any of the foregoing, provided at least one R is aryl.
- Examples include phenyl bisdodecyl phosphate, phenylbisneopentyl phosphate, phenyl-bis (3,5,5′-tri-methyl-hexyl phosphate), ethyldiphenyl phosphate, 2-ethyl-hexyldi(p-tolyl) phosphate, bis-(2-ethylhexyl) p-tolylphosphate, tritolyl phosphate, bis-(2-ethylhexyl) phenyl phosphate, tri-(nonylphenyl) phosphate, di (dodecyl) p-tolyl phosphate, tricresyl phosphate, triphenyl phosphate, dibutylphenyl phosphate, 2-chloroethyldiphenyl phosphate, p-tolyl bis(2,5,5′-trimethylhexyl) phosphate, 2-ethylhexyldiphenyl phosphate, and the like. The preferred phosphates are those in which each R is aryl. Especially preferred is triphenyl phosphate, which may be either unsubstituted or substituted, for example, isopropylated triphenyl phosphate.
-
- including mixtures thereof, in which R1, R3 and R5 are, independently, hydrocarbon; R2, R4, R6 and R7 are, independently, hydrocarbon or hydrocarbonoxy; X1, X2 and X3 are halogen; m and r are 0 or integers from 1 to 4, and n and p are from 1 to 30.
- Examples include the bis diphenyl phosphates of resorcinol, hydroquinone and bisphenol-A, respectively, or their polymeric counterparts.
- Methods for the preparation of the aforementioned di- and polyfunctional aromatic phosphates are described in British Patent No. 2,043,083.
- Another group of useful flame retardants include certain cyclic phosphates, for example, diphenyl pentaerythritol diphosphate, as a flame retardant agent for polyphenylene ether resins, as is described by Axelrod in U.S. Pat. No. 4,254,775.
-
- wherein each A moiety is a 2,6-dimethylphenyl moiety or a 2,4,6-trimethylphenyl moiety. These phosphoramides are piperazine-type phosphoramides. These additives are known in the art and have been described in Talley,J. Chem. Eng. Data, 33, 221-222 (1988). When polyamide resins are used as part of the composition, these piperazine-type phosphoramides are especially useful as they are believed to have less interactions with the polyamides then the organo-ester type phosphates.
- Preferred phosphate flame retardants include those based upon resorcinol such as, for example, resorcinol tetraphenyl diphosphate, as well as those based upon bis-phenols such as, for example, bis-phenol A tetraphenyl diphosphate. Also preferred are the aforementioned piperazine-type phosphoramides. Phosphates containing substituted phenyl groups are also preferred. In an especially preferred embodiment, the organophosphate is selected from the group consisting of butylated triphenyl phosphate ester, resorcinol tetraphenyl diphosphate, bis-phenol A tetraphenyl diphosphate, and mixtures containing at least one of the foregoing.
- The flame retardant is present in at least the minimum amount necessary to impart a degree of flame retardancy to the composition to pass the desired UL-94 protocol. The particular amount will vary, depending on the molecular weight of the organic phosphate, the amount of the flanunable resin present and possibly other normally flammable ingredients which might also be included in the composition.
-
- wherein R is an alkylene, alkylidene or cycloaliphatic linkage, e.g., methylene, ethylene, propylene, isopropylene, isopropylidene, butylene, isobutylene, amylene, cyclohexylene, cyclopentylidene, etc.; a linkage selected from the group consisting of either oxygen ether; carbonyl; amine; a sulfur containing linkage, e.g., sulfide, sulfoxide, sulfone; a phosphorus containing linkage; etc. R can also consist of two or more alkylene or alkylidene linkages connected by such groups as aromatic, amino, ether, carbonyl, sulfide, sulfoxide, sulfone, a phosphorus containing linkage, etc. Other groups which are represented by R will occur to those skilled in the art, including those found in U.S. Pat. Nos. 4,692,490 and 4,191,685.
- Ar and Ar′ are mono- or polycarbocyclic aromatic groups such as phenylene, biphenylene, terphenylene, naphthylene, etc. Ar and Ar′may be the same or different.
- Y is a substituent selected from the group consisting of organic, inorganic or organometallic radicals. The substituents represented by Y include (1) halogen, e.g., chlorine, bromine, iodine, fluorine or (2) ether groups of the general formula OE, wherein E is a monovalent hydrocarbon radical similar to X or (3) monovalent hydrocarbon groups of the type represented by R or (4) other substituents, e.g., nitro, cyano, etc., said substituents being essentially inert provided there be at least one and preferably two halogen atoms per aryl nucleus.
- X is a monovalent hydrocarbon group exemplified by the following: alkyl, such as methyl, ethyl, propyl, isopropyl, butyl, decyl, etc; aryl groups, such as phenyl, naphthyl, biphenyl, xylyl, tolyl, etc; aralkyl groups such as benzyl, ethylphenyl, etc.; cycloaliphatic groups, such as cyclopentyl, cyclohexyl, etc.; as well as monovalent hydrocarbon groups containing inert substituents therein. It will be understood that where more than one X is used they may be alike or different.
- The letter d represents a whole number ranging from 1 to a maximum equivalent to the number of replaceable hydrogens substituted on the aromatic rings comprising Ar or Ar′. The letter e represents a whole number ranging from 0 to a maximum controlled by the number of replaceable hydrogens on R. The letters a, b, and c represent whole numbers including 0. When b is not 0, neither a nor c may be 0. Otherwise either a or c, but not both, may be 0. Where b is 0, the aromatic groups are joined by a direct carbon-carbon bond.
- The hydroxyl and Y substituents on the aromatic groups, Ar and Ar′ can be varied in the ortho, meta or para positions on the aromatic rings and the groups can be in any possible geometric relationship with respect to one another.
- Included within the scope of the above formula are biphenols of which the following are representative: 2,2-bis-(3,5-dichlorophenyl)-propane; bis-(2-chlorophenyl)-methane; bis(2,6-dibromophenyl)-methane; 1,1-bis-(4-iodophenyl)-ethane; 1,2-bis-(2,6-dichlorophenyl)-ethane; 1,1-bis-(2-chloro-4-iodophenyl)ethane; 1,1-bis-(2-chloro-4-methylphenyl)-ethane; 1,1-bis-(3,5-dichlorophenyl)-ethane; 2,2-bis-(3-phenyl-4-bromophenyl)-ethane; 2,6-bis-(4,6-dichloronaphthyl)-propane; 2,2-bis-(2,6-dichlorophenyl)-pentane; 2,2-bis-(3,5-dichromophenyl)-hexane; bis-(4-chlorophenyl)-phenyl-methane; bis-(3,5-dichlorophenyl)-cyclohexylmethane; bis-(3-nitro-4-bromophenyl)-methane; bis-(4-hydroxy-2,6-dichloro-3-methoxyphenyl)-methane; 2,2-bis-(3,5-dichloro-4-hydroxyphenyl)-propane 2,2 bis-(3-bromo-4-hydroxyphenyl)-propane.
- The preparation of these and other applicable bisphenols is known in the art. They are most commonly prepared by condensation of two moles of a phenol with a single mole of a ketone or aldehyde. In place of the divalent aliphatic group in the above examples may be substituted oxygen, sulfur, sulfoxy, etc.
- Included within the above structural formula are: 1,3-dichlorobenzene, 1,4-dibrombenzene, 1,3-dichloro-4-hydroxybenzene and biphenyls such as 2,2′-dichlorobiphenyl, polybrominated 1,4-diphenoxybenzene, 2,4′-dibromobiphenyl, and 2,4′-dichlorobiphenyl as well as decabromo diphenyl oxide, and the like.
- Also useful are oligomeric and polymeric halogenated aromatic compounds, such as, for example, a copolycarbonate of bisphenol A and tetrabromobisphenol A and a carbonate precursor, e.g., phosgene. Metal synergists, e.g., antimony oxide, may also be used with the flame retardant.
- The composition can be further modified, if desired, by including one or more additives often used with thermoplastic polymers, some of which may serve to beneficially affect the chemical and physical properties. Examples are mineral fillers, including clay, reinforcing agents, for example, glass fibers, flakes or spheres, plasticizers, flame retardants, stabilizers, antioxidants, colorants, processing aids, and so forth.
- The resin compositions used in the present invention can be prepared by a variety of methods involving intimate admixing of the materials with any additional additives desired in the formulation. Suitable procedures include solution blending and melt blending. Because of the availability of melt blending equipment in commercial polymer processing facilities, melt processing procedures are generally preferred. Examples of equipment used in such melt compounding methods include: co-rotating and counter-rotating extruders, single screw extruders, disc-pack processors and various other types of extrusion equipment. In some instances, the compounded material exits the extruder through small exit holes in a die and the resulting strands of molten resin are cooled by passing the strands through a water bath. The cooled strands can be chopped into small pellets for packaging and further handling.
- All of the ingredients may be added initially to the processing system, or else certain additives may be pre-compounded with each other. For example, it is often preferred to predisperse the organo-clay into a resin at a higher loading than in the desired final product to make a concentrate. The concentrate is then added in an amount necessary to achieve the desired final amount. Concentrates are especially useful and desirable when a crystalline resin, e.g. polyamide, polyester, or polyolefin, is used as at least part of the resin composition. In one embodiment, it is also desirable to disperse the organoclay in a low I.V. PPE, preferably having an I.V. of less than about 0.20 dl/g as measured in chloroform at 23° C. It is also sometimes advantageous to employ at least one vent port in each section between the feed ports to allow venting (either atmospheric or vacuum) of the melt. Those of ordinary skill in the art will be able to adjust blending times and temperatures, as well as component addition location and sequence, without undue additional experimentation.
- It should be clear that articles formed out of the thermoplastic compositions described herein are another embodiment of the present invention.
- All patents cited are incorporated herein by reference.
- The invention will be further illustrated by the following examples.
- Experimental
- In the examples the following materials have been used:
- PPE 0.46 I.V. poly(2,6-dimethylphenylene ether) resin
- HIPS high impact polystyrene
- SBS polystyrene-polybutadiene-polystyrene block copolymer, commercially available from Shell Chemical Co. as KRATON® D-1102
- FR mixture of tris(alkylphenyl) phosphate including triphenyl phosphate
- Organoclay Claytone HY (dimethyl hydrogenated ditallow ammonium chloride exchanged sodium montmorillonite) commercilly available from Southern Clay Products
- HG-90 a silicate clay, commercially available from Huber Co. as grade HG-90
- TSAN polytetrafluoro ethylene (PTFE) dispersion in styrene-acrylonitrile copolymer having over 50% PTFE content
- PE linear low density polyethylene
- I-1010 a commercially available hindered phenol antioxidant, commercially available from Ciba-Geigy as Irganox 1010
- ZnO zinc oxide
- ZnS zinc sulfide
- The compositions of the table were extruded on a Werner-Pfleiderer twin-screw extruder at a temperature of about 280-300° C. with a vacuum of 2 inches Hg applied to the melt during compounding. The resultant compositions were molded using a Toshiba injection molding machine using a temperature set of about 280-300° C. and a mold temperature of about 100° C. Test specimens were subjected to testing under ASTM conditions.
TABLE 1 Sample 1 2 3 4 5 6 7 8 PPE 42 48 55 42 48 55 44 44 HIPS 58 52 45 58 52 45 56 56 SBS 2 2 2 2 2 2 2 4 FR 2 4 6 2 4 6 6 2 Oranoclay 1 1 1 0 0 0 4 4 HG-90 0 0 0 1 1 1 0 0 TSAN 0.1 0.1 0.1 0.1 0.1 0.1 0 0 PE 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 I-1010 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ZnO 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 ZnS 0.2 0.2 0.2 0.2 0.2 0.2 0.16 0.16 Properties n. Izod (ft-lb/ 6.5 7 7.1 5.7 5.6 5.4 3.1 5.49 in) Flex. Mod. 336.8 349.4 361.1 333.5 345 352.5 374.9 369.3 (kpsi) Dyn. 23° C. 23 28 36 21 22 14 23 37 (ft-lb) Dyn. −30° C. 38 41 42 37 39 39 8 14 (ft-lb) HDT @ 66 psi 238 235 236 237 238 238 223 235.6 (° F.) - As can be seen by the above data, increased notched Izod impact strength can be achieved with the use of the organoclay over unmodified clay reinforcement. Stiffness as indicated by flexural modulus and heat resistance as indicated by heat distortion temperature (HDT) are not diminished with the use of the organoclay. Based upon the teachings of the prior art, it was unexpected that this combination of properties could be achieved.
- The preceding examples are set forth to illustrate specific embodiments of the invention and are not intended to limit its scope. It should be clear that the present invention includes articles from the compositions as described herein. Additional embodiments and advantages within the scope of the claimed invention will be apparent to one of ordinary skill in the art.
Claims (23)
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-
2000
- 2000-03-17 JP JP2000611614A patent/JP2002542329A/en not_active Withdrawn
- 2000-03-17 WO PCT/US2000/007171 patent/WO2000061683A1/en active IP Right Grant
- 2000-03-17 KR KR1020017013092A patent/KR100697932B1/en not_active IP Right Cessation
- 2000-03-17 CN CNB008061998A patent/CN1239614C/en not_active Expired - Fee Related
- 2000-03-17 DE DE60016742T patent/DE60016742T2/en not_active Expired - Lifetime
- 2000-03-17 EP EP00919457A patent/EP1185586B1/en not_active Expired - Lifetime
- 2000-03-17 AU AU40144/00A patent/AU4014400A/en not_active Abandoned
- 2000-03-17 AT AT00919457T patent/ATE284925T1/en not_active IP Right Cessation
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US20070185248A1 (en) * | 2004-06-25 | 2007-08-09 | Polyone Corporation | Intumescent polylefin nanocomposites and their use |
US20090326125A1 (en) * | 2005-06-20 | 2009-12-31 | David Abecassis | Flame retardant non halogenated silicone composition for high temperature and automotive and building construction applications |
US8022123B2 (en) | 2005-12-22 | 2011-09-20 | Glen Burnie Technologies, Llc | Method for manufacturing and dispersing nanoparticles in thermoplastics |
US20100152348A1 (en) * | 2006-04-06 | 2010-06-17 | David Abecassis | Nanocompatibilized novel polymer blends |
US20080023679A1 (en) * | 2006-05-11 | 2008-01-31 | David Abecassis | Novel flame retardant nanoclay |
US20080227899A1 (en) * | 2006-05-11 | 2008-09-18 | David Abecassis | Novel method for polymer RDP-clay nanocomposites and mechanisms for polymer/polymer blending |
US20080234408A1 (en) * | 2006-05-11 | 2008-09-25 | David Abecassis | Novel method for producing an organoclay additive for use in polypropylene |
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US20080317987A1 (en) * | 2006-07-21 | 2008-12-25 | David Abecassis | Nanocomposite materials for ethanol, methanol and hydrocarbon transportation use and storage |
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WO2008115414A3 (en) * | 2007-03-15 | 2008-11-13 | Glen Burnie Technologies L L C | A novel method for producing an organoclay additive for use in polypropylene |
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US20090012211A1 (en) * | 2007-07-02 | 2009-01-08 | David Abecassis | Novel biodegradable nanocomposites |
Also Published As
Publication number | Publication date |
---|---|
EP1185586B1 (en) | 2004-12-15 |
EP1185586A1 (en) | 2002-03-13 |
ATE284925T1 (en) | 2005-01-15 |
US6350804B2 (en) | 2002-02-26 |
KR20020000165A (en) | 2002-01-04 |
JP2002542329A (en) | 2002-12-10 |
KR100697932B1 (en) | 2007-03-20 |
CN1239614C (en) | 2006-02-01 |
DE60016742D1 (en) | 2005-01-20 |
WO2000061683A1 (en) | 2000-10-19 |
AU4014400A (en) | 2000-11-14 |
CN1368993A (en) | 2002-09-11 |
DE60016742T2 (en) | 2005-12-01 |
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