+

US20010014375A1 - Pellicle case having chemical traps - Google Patents

Pellicle case having chemical traps Download PDF

Info

Publication number
US20010014375A1
US20010014375A1 US09/842,144 US84214401A US2001014375A1 US 20010014375 A1 US20010014375 A1 US 20010014375A1 US 84214401 A US84214401 A US 84214401A US 2001014375 A1 US2001014375 A1 US 2001014375A1
Authority
US
United States
Prior art keywords
pellicle
reticle pattern
pattern surface
deposition control
capturing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/842,144
Other versions
US6443302B2 (en
Inventor
Yoshiyuki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/842,144 priority Critical patent/US6443302B2/en
Publication of US20010014375A1 publication Critical patent/US20010014375A1/en
Application granted granted Critical
Publication of US6443302B2 publication Critical patent/US6443302B2/en
Assigned to NEC ELECTRONICS CORPORATION reassignment NEC ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor

Definitions

  • the present invention relates to a pellicle for protecting the pattern surface of a reticle used for exposure patterning when manufacturing semiconductor devices such as LSIs (Large Scale Integrated circuits), and a case for accommodating the pellicle.
  • LSIs Large Scale Integrated circuits
  • a semiconductor substrate is irradiated with a laser beam by using a reticle formed with a pattern as a mask. Accordingly, the patterning precision often depends on the precision of a pattern formed on the reticle (to be referred to as a reticle pattern hereinafter).
  • a pattern image formed on the semiconductor substrate deforms from a predetermined one.
  • a pellicle for foreign substance attachment prevention is formed on the reticle pattern surface.
  • This pellicle is comprised of a pellicle frame having a desired height so as to surround the reticle pattern surface, and a membrane-like pellicle film bonded to the upper end face of the pellicle frame to be almost parallel to the pattern surface of the reticle.
  • the pellicle is regarded as an assembly including the reticle.
  • the pellicle When exposure patterning is performed by using the pellicle, the pellicle is irradiated with a laser beam. Hence, a plurality of deposition control materials which contribute to formation of deposits on the reticle pattern surface cause chemical reaction, or a deposition control material which promotes formation of deposits on the reticle pattern surface attaches to the pattern surface.
  • ammonia or ammonium ions existing in the atmosphere react with sulfuric acid or sulfate ions remaining on the reticle pattern surface to deposit ammonium sulfate on the reticle pattern surface.
  • Sulfuric acid or sulfate ions originating from a sulfuric acid-based cleaning agent used in the manufacturing process, particularly the cleaning step as the final step, of the reticle often remain on the reticle surface.
  • the remaining sulfuric acid or sulfate ions are assumed to promote deposition reaction upon laser beam irradiation.
  • Japanese Patent Laid-Open Nos. 3-166545 and 9-68793 propose to apply a pressure-sensitive adhesive agent to the inner surface of a pellicle frame so a foreign substance will not attach to the reticle pattern surface.
  • the foreign substance discussed in these references is not a deposition control material as described above but dust and the like. This deposition control material is difficult to capture with only the pressure-sensitive adhesive agent, and formation of deposits on the reticle pattern surface cannot be sufficiently prevented.
  • a pellicle comprising a reticle having a reticle pattern surface formed with a reticle pattern, a pellicle frame having one end face bonded to the reticle pattern surface to surround the reticle pattern, a pellicle film bonded to the other end face of the pellicle frame, and a capturing material formed on at least part of an inner surface of the pellicle frame to capture a deposition control material which is present in a gas in a space in the pellicle to control formation of a deposit on the reticle pattern surface, the space in the pellicle being defined by the reticle pattern surface, the pellicle frame, and the pellicle film.
  • FIG. 1 is a perspective view of a pellicle according to the first embodiment of the present invention
  • FIG. 2 is a sectional view taken along the line A - A′ of FIG. 1;
  • FIG. 3 is a graph showing a relationship among the concentration of ammonia present in a gas in the pellicle, the concentration of sulfuric acid, and formation of deposits of ammonium sulfate on the reticle pattern surface upon irradiation with a KrF laser beam;
  • FIG. 4 is a sectional view of a pellicle according to the second embodiment of the present invention.
  • FIG. 5 is a perspective view of a pellicle according to the third embodiment of the present invention.
  • FIG. 6 is a sectional view of a pellicle case according to the present invention.
  • FIGS. 1 and 2 show a pellicle according to the first embodiment of the present invention.
  • a desired reticle pattern 3 is formed from a chrome film or the like on a reticle pattern surface 2 a as the upper surface of a reticle 2 constituted by a flat plate.
  • the reticle pattern surface 2 a is bonded to the lower end face of a pellicle frame 4 so arranged as to surround the reticle pattern 3 .
  • the pellicle frame 4 and reticle pattern surface 2 a are bonded to each other through an adhesive layer 6 .
  • the upper end face of the pellicle frame 4 is bonded to a transparent dust-preventive pellicle film 8 .
  • the pellicle frame 4 and pellicle film 8 make up a pellicle 11 .
  • the reticle pattern surface 2 a, pellicle frame 4 , and pellicle film 8 form the inner space of the pellicle 11 .
  • a pressure-sensitive adhesive layer 10 is formed on the entire inner circumferential surface of the pellicle frame 4 .
  • a capturing material for capturing a deposition control material which forms deposits on the reticle pattern surface 2 a is added or applied to the pressure-sensitive adhesive layer 10 .
  • the pressure-sensitive adhesive layer 10 containing the capturing material may be formed not on the entire inner circumferential surface of the pellicle frame 4 but on part of the inner circumferential surface, e.g., a pair of opposing surfaces, of the pellicle frame 4 .
  • An example of the capturing material includes
  • ammonium sulfate is formed when ammonia (or ammonium ions) in the atmosphere reacts with sulfuric acid (or sulfate ions) remaining on the reticle pattern surface 2 a.
  • FIG. 3 shows a relationship among the concentration of ammonia (or ammonium ions) present in a gas in the pellicle 11 , the concentration of sulfuric acid (or sulfate ions), and formation of deposits of ammonium sulfate on the reticle pattern surface 2 a.
  • concentration of ammonia and sulfuric acid decreases, even if the concentration of the remaining one of ammonia and sulfuric acid is high, deposition of ammonium sulfate can be sufficiently suppressed.
  • phosphoric acid is used as the capturing material. Ammonia reacts with the capturing material and is captured as ammonium phosphoric acid, so that the ammonia concentration in the gas in the pellicle 11 decreases sufficiently.
  • potassium carbonate can be used as the capturing material.
  • the sulfuric acid-based material reacts with the capturing material and is captured as potassium sulfate, so that the concentration of sulfuric acid-based ions in the pellicle 11 decreases sufficiently.
  • Formation of deposits on the reticle pattern surface 2 a also depends on the condition of the reticle pattern surface 2 a. If a large amount of siloxane or other organic substances are attached to the reticle pattern surface 2 a, a larger amount of deposits is formed than a case wherein the amount of siloxane or other organic substances is small.
  • active carbon can be used as the organic substance capturing material. Then, deposition of ammonium sulfate on the reticle pattern surface 2 a is suppressed.
  • the pressure-sensitive adhesive layer 10 is formed on the inner surface of the pellicle frame 4 , a material such as dust present in the pellicle 11 , which does not relate to deposit formation at all can also be adsorbed.
  • a capturing material for a deposition control material is added to or applied to the surface of a material constituting the pressure-sensitive adhesive layer 10 having this function, a good deposition preventive effect can be obtained with a simple means.
  • FIG. 4 shows a pellicle according to the second embodiment of the present invention.
  • portions that are identical to those of FIGS. 1 and 2 are denoted by the same reference numerals as in FIGS. 1 and 2, and a detailed description thereof will be omitted.
  • a capturing material for a deposition control material is directly applied to the entire inner circumferential surface of a pellicle frame 4 , thereby forming a capturing material layer 12 .
  • the capturing material 12 may be applied to part of the inner circumferential surface of the pellicle frame 4 , i.e., equidistantly or only to its one portion.
  • the capturing material may be the same material as that of the first embodiment, and a desired binder is used because it can be applied easily.
  • the same function and effect as those of the first embodiment can be obtained.
  • FIG. 5 shows a pellicle according to the third embodiment of the present invention.
  • portions that are identical to those of FIGS. 1, 2, and 4 are denoted by the same reference numerals as in FIGS. 1, 2, and 4 .
  • a ventilation opening 14 is formed in one side surface of a pellicle frame 4 , and the inside and outside of a pellicle 11 communicate with each other through the ventilation opening 14 .
  • the ventilation opening 14 has a filter 16 carrying a capturing material for a deposition control material, so powdery dust and the like will not enter from the outside.
  • the capturing material one similar to that of the first embodiment can be used.
  • the ventilation opening 14 since the ventilation opening 14 is formed, pressures inside and outside the pellicle 11 can be maintained at the same level, and an atmospheric pressure difference does not occur between the two surface sides of a pellicle film 8 when a temperature change or the like occurs. Then, the stress acting on the pellicle film 8 does not fluctuate, and a long service life can be obtained.
  • a deposition control material entering from outside the pellicle 11 along with ventilation (for example, sulfurous acid gas which is generated, when forming a case for accommodating the pellicle 11 for storage, from a sulfuric acid-based material remaining in the case) can be captured by the capturing material carried by the filter 16 , so the deposition control material will not enter the pellicle 11 .
  • ventilation for example, sulfurous acid gas which is generated, when forming a case for accommodating the pellicle 11 for storage, from a sulfuric acid-based material remaining in the case
  • FIG. 6 shows a pellicle case that accommodates the pellicle 11 shown in FIG. 5.
  • the pellicle 11 when not in use, the pellicle 11 is accommodated in a case 20 and is stored.
  • the storage time of the pellicle 11 is longer than the time in use of it. Accordingly, in order to prevent deposit formation on a reticle pattern surface 2 a, it is important to prevent a deposition control material from entering the pellicle 11 during storage.
  • a layer 22 of a material which captures the deposition control material is formed on the inner surface of the case 20 .
  • the capturing material one similar to that of the first embodiment can be used.
  • a desired binder can be used because it can be applied easily.
  • a reticle 2 is supported in the case 20 as its peripheral portion is vertically sandwiched with holding members 23 .
  • the case 20 can be constituted by separable upper and lower cases to which the upper and lower holding members 23 are respectively fixed.
  • the peripheral portion of the reticle 2 is sandwiched by engaging the upper case with the lower case.
  • a capturing material for a deposition control material may be applied to an appropriate surface of the upper and lower holding members 23 .
  • a pressure-sensitive adhesive layer may be formed on the inner surface of the case 20 and the surfaces of the holding members 23 , in the same manner as it is done for the pellicle frame 4 in the first embodiment, and a capturing material for the deposition control material may be added to or applied to the surface of the pressure-sensitive adhesive layer.
  • the pellicle and the case therefor of the present invention alone can naturally achieve the object of the present invention, and provide a multiplicative effect if they are used in combination.
  • a multiplicative effect can be obtained.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

A pellicle includes a reticle, a pellicle frame, a pellicle film, and a capturing material. The pellicle frame has a reticle pattern surface formed with a reticle pattern. The pellicle frame has one end face bonded to the reticle pattern surface to surround the reticle pattern. The pellicle film is bonded to the other end face of the pellicle frame. The capturing material is formed on at least part of an inner surface of the pellicle frame to capture a deposition control material which is present in a gas in a space in the pellicle to control formation of a deposit on the reticle pattern surface. The space in the pellicle is defined by the reticle pattern surface, the pellicle frame, and the pellicle film. A pellicle case for accommodating the pellicle is also disclosed.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a pellicle for protecting the pattern surface of a reticle used for exposure patterning when manufacturing semiconductor devices such as LSIs (Large Scale Integrated circuits), and a case for accommodating the pellicle. [0001]
  • When performing exposure patterning in the manufacture of semiconductor devices such as LSIs, a semiconductor substrate is irradiated with a laser beam by using a reticle formed with a pattern as a mask. Accordingly, the patterning precision often depends on the precision of a pattern formed on the reticle (to be referred to as a reticle pattern hereinafter). [0002]
  • If a foreign substance such as dust attaches to the pattern-formed surface of the reticle (to be referred to as a reticle pattern surface hereinafter), a pattern image formed on the semiconductor substrate deforms from a predetermined one. In order to prevent this inconvenience, a pellicle for foreign substance attachment prevention is formed on the reticle pattern surface. This pellicle is comprised of a pellicle frame having a desired height so as to surround the reticle pattern surface, and a membrane-like pellicle film bonded to the upper end face of the pellicle frame to be almost parallel to the pattern surface of the reticle. In the following description, the pellicle is regarded as an assembly including the reticle. [0003]
  • When exposure patterning is performed by using the pellicle, the pellicle is irradiated with a laser beam. Hence, a plurality of deposition control materials which contribute to formation of deposits on the reticle pattern surface cause chemical reaction, or a deposition control material which promotes formation of deposits on the reticle pattern surface attaches to the pattern surface. [0004]
  • For example, sometimes ammonia or ammonium ions existing in the atmosphere react with sulfuric acid or sulfate ions remaining on the reticle pattern surface to deposit ammonium sulfate on the reticle pattern surface. Sulfuric acid or sulfate ions originating from a sulfuric acid-based cleaning agent used in the manufacturing process, particularly the cleaning step as the final step, of the reticle often remain on the reticle surface. The remaining sulfuric acid or sulfate ions are assumed to promote deposition reaction upon laser beam irradiation. [0005]
  • Conventionally, Japanese Patent Laid-Open Nos. 3-166545 and 9-68793 propose to apply a pressure-sensitive adhesive agent to the inner surface of a pellicle frame so a foreign substance will not attach to the reticle pattern surface. However, the foreign substance discussed in these references is not a deposition control material as described above but dust and the like. This deposition control material is difficult to capture with only the pressure-sensitive adhesive agent, and formation of deposits on the reticle pattern surface cannot be sufficiently prevented. [0006]
  • Therefore, in order to suppress deposition of a foreign substance on the reticle pattern surface, countermeasures such as use of a pellicle material that does not produce ammonia, reduction of residual sulfuric acid on the reticle pattern surface, and reduction of gases leaking from a pellicle case have been employed. With these countermeasures alone, however, it is difficult to sufficiently prevent formation of deposits on the reticle pattern surface, since ammonia and the like are always present in an ordinary environment and tend to be thick in the pellicle. [0007]
  • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide a pellicle capable of maintaining a patterning precision over a long period of time by suppressing deposition of a foreign substance on a reticle pattern surface, and a case therefor. [0008]
  • In order to achieve the above object, according to the present invention, there is provided a pellicle comprising a reticle having a reticle pattern surface formed with a reticle pattern, a pellicle frame having one end face bonded to the reticle pattern surface to surround the reticle pattern, a pellicle film bonded to the other end face of the pellicle frame, and a capturing material formed on at least part of an inner surface of the pellicle frame to capture a deposition control material which is present in a gas in a space in the pellicle to control formation of a deposit on the reticle pattern surface, the space in the pellicle being defined by the reticle pattern surface, the pellicle frame, and the pellicle film. [0009]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a pellicle according to the first embodiment of the present invention; [0010]
  • FIG. 2 is a sectional view taken along the line A - A′ of FIG. 1; [0011]
  • FIG. 3 is a graph showing a relationship among the concentration of ammonia present in a gas in the pellicle, the concentration of sulfuric acid, and formation of deposits of ammonium sulfate on the reticle pattern surface upon irradiation with a KrF laser beam; [0012]
  • FIG. 4 is a sectional view of a pellicle according to the second embodiment of the present invention; [0013]
  • FIG. 5 is a perspective view of a pellicle according to the third embodiment of the present invention; and [0014]
  • FIG. 6 is a sectional view of a pellicle case according to the present invention. [0015]
  • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will be described in detail with reference to the accompanying drawings. [0016]
  • FIGS. 1 and 2 show a pellicle according to the first embodiment of the present invention. Referring to FIGS. 1 and 2, a desired [0017] reticle pattern 3 is formed from a chrome film or the like on a reticle pattern surface 2 a as the upper surface of a reticle 2 constituted by a flat plate. The reticle pattern surface 2 a is bonded to the lower end face of a pellicle frame 4 so arranged as to surround the reticle pattern 3. The pellicle frame 4 and reticle pattern surface 2 a are bonded to each other through an adhesive layer 6. The upper end face of the pellicle frame 4 is bonded to a transparent dust-preventive pellicle film 8.
  • The [0018] pellicle frame 4 and pellicle film 8 make up a pellicle 11. The reticle pattern surface 2 a, pellicle frame 4, and pellicle film 8 form the inner space of the pellicle 11.
  • A pressure-sensitive [0019] adhesive layer 10 is formed on the entire inner circumferential surface of the pellicle frame 4. A capturing material for capturing a deposition control material which forms deposits on the reticle pattern surface 2 a is added or applied to the pressure-sensitive adhesive layer 10.
  • The pressure-sensitive [0020] adhesive layer 10 containing the capturing material may be formed not on the entire inner circumferential surface of the pellicle frame 4 but on part of the inner circumferential surface, e.g., a pair of opposing surfaces, of the pellicle frame 4.
  • An example of the capturing material includes [0021]
  • (1) a material which captures one of a plurality of materials that form deposits as the result of chemical reaction in the [0022] pellicle 11, and
  • (2) a material which captures a material that promotes deposition of a foreign substance on the [0023] reticle pattern surface 2 a as it is attracted to the reticle 2.
  • An explanation will be made by way of ammonium sulfate as a deposit. Ammonium sulfate is formed when ammonia (or ammonium ions) in the atmosphere reacts with sulfuric acid (or sulfate ions) remaining on the [0024] reticle pattern surface 2 a.
  • FIG. 3 shows a relationship among the concentration of ammonia (or ammonium ions) present in a gas in the [0025] pellicle 11, the concentration of sulfuric acid (or sulfate ions), and formation of deposits of ammonium sulfate on the reticle pattern surface 2 a. As is seen from FIG. 3, when the concentration of either one of ammonia and sulfuric acid decreases, even if the concentration of the remaining one of ammonia and sulfuric acid is high, deposition of ammonium sulfate can be sufficiently suppressed.
  • Hence, in this embodiment, in order to remove ammonia from the gas in the [0026] pellicle 11, phosphoric acid is used as the capturing material. Ammonia reacts with the capturing material and is captured as ammonium phosphoric acid, so that the ammonia concentration in the gas in the pellicle 11 decreases sufficiently.
  • Alternatively, in order to remove a sulfuric acid-based material such as sulfurous acid gas from the gas in the [0027] pellicle 11, potassium carbonate can be used as the capturing material. In this case, the sulfuric acid-based material reacts with the capturing material and is captured as potassium sulfate, so that the concentration of sulfuric acid-based ions in the pellicle 11 decreases sufficiently.
  • Formation of deposits on the [0028] reticle pattern surface 2 a also depends on the condition of the reticle pattern surface 2 a. If a large amount of siloxane or other organic substances are attached to the reticle pattern surface 2 a, a larger amount of deposits is formed than a case wherein the amount of siloxane or other organic substances is small. To prevent the organic substances from attaching to the reticle pattern surface 2 a, active carbon can be used as the organic substance capturing material. Then, deposition of ammonium sulfate on the reticle pattern surface 2 a is suppressed.
  • In this embodiment, since the pressure-sensitive [0029] adhesive layer 10 is formed on the inner surface of the pellicle frame 4, a material such as dust present in the pellicle 11, which does not relate to deposit formation at all can also be adsorbed. When a capturing material for a deposition control material is added to or applied to the surface of a material constituting the pressure-sensitive adhesive layer 10 having this function, a good deposition preventive effect can be obtained with a simple means.
  • FIG. 4 shows a pellicle according to the second embodiment of the present invention. Referring to FIG. 4, portions that are identical to those of FIGS. 1 and 2 are denoted by the same reference numerals as in FIGS. 1 and 2, and a detailed description thereof will be omitted. [0030]
  • In the second embodiment, in place of the pressure-sensitive [0031] adhesive layer 10 shown in FIG. 2, a capturing material for a deposition control material is directly applied to the entire inner circumferential surface of a pellicle frame 4, thereby forming a capturing material layer 12. The capturing material 12 may be applied to part of the inner circumferential surface of the pellicle frame 4, i.e., equidistantly or only to its one portion.
  • The capturing material may be the same material as that of the first embodiment, and a desired binder is used because it can be applied easily. In the second embodiment, the same function and effect as those of the first embodiment can be obtained. [0032]
  • FIG. 5 shows a pellicle according to the third embodiment of the present invention. Referring to FIG. 5, portions that are identical to those of FIGS. 1, 2, and [0033] 4 are denoted by the same reference numerals as in FIGS. 1, 2, and 4.
  • In the third embodiment, a [0034] ventilation opening 14 is formed in one side surface of a pellicle frame 4, and the inside and outside of a pellicle 11 communicate with each other through the ventilation opening 14. The ventilation opening 14 has a filter 16 carrying a capturing material for a deposition control material, so powdery dust and the like will not enter from the outside. As the capturing material, one similar to that of the first embodiment can be used.
  • According to the third embodiment, since the [0035] ventilation opening 14 is formed, pressures inside and outside the pellicle 11 can be maintained at the same level, and an atmospheric pressure difference does not occur between the two surface sides of a pellicle film 8 when a temperature change or the like occurs. Then, the stress acting on the pellicle film 8 does not fluctuate, and a long service life can be obtained.
  • A deposition control material entering from outside the [0036] pellicle 11 along with ventilation (for example, sulfurous acid gas which is generated, when forming a case for accommodating the pellicle 11 for storage, from a sulfuric acid-based material remaining in the case) can be captured by the capturing material carried by the filter 16, so the deposition control material will not enter the pellicle 11.
  • FIG. 6 shows a pellicle case that accommodates the [0037] pellicle 11 shown in FIG. 5.
  • Referring to FIG. 6, when not in use, the [0038] pellicle 11 is accommodated in a case 20 and is stored. The storage time of the pellicle 11 is longer than the time in use of it. Accordingly, in order to prevent deposit formation on a reticle pattern surface 2 a, it is important to prevent a deposition control material from entering the pellicle 11 during storage.
  • A [0039] layer 22 of a material which captures the deposition control material is formed on the inner surface of the case 20. As the capturing material, one similar to that of the first embodiment can be used. A desired binder can be used because it can be applied easily.
  • A [0040] reticle 2 is supported in the case 20 as its peripheral portion is vertically sandwiched with holding members 23. The case 20 can be constituted by separable upper and lower cases to which the upper and lower holding members 23 are respectively fixed. In this case, the peripheral portion of the reticle 2 is sandwiched by engaging the upper case with the lower case. A capturing material for a deposition control material may be applied to an appropriate surface of the upper and lower holding members 23.
  • In place of applying the capturing material for the deposition control material, a pressure-sensitive adhesive layer may be formed on the inner surface of the [0041] case 20 and the surfaces of the holding members 23, in the same manner as it is done for the pellicle frame 4 in the first embodiment, and a capturing material for the deposition control material may be added to or applied to the surface of the pressure-sensitive adhesive layer.
  • The pellicle and the case therefor of the present invention alone can naturally achieve the object of the present invention, and provide a multiplicative effect if they are used in combination. When the first and second embodiments are used in combination with the third embodiment, a multiplicative effect can be obtained. [0042]
  • As has been described above, according to the present invention, when a chemical material such as ammonia serving as the deposition control material is removed from the space in the pellicle or from the environment around the pellicle, deposition of a foreign substance on the reticle pattern surface is suppressed. As a result, an accurate pattern shape can be maintained over a long period of time, and a patterning precision can be maintained over a long period of time. [0043]

Claims (18)

What is claimed is:
1. A pellicle comprising:
a reticle having a reticle pattern surface formed with a reticle pattern;
a pellicle frame having one end face bonded to said reticle pattern surface to surround said reticle pattern;
a pellicle film bonded to the other end face of said pellicle frame; and
a capturing material formed on at least part of an inner surface of said pellicle frame to capture a deposition control material which is present in a gas in a space in said pellicle to control formation of a deposit on said reticle pattern surface, said space in said pellicle being defined by said reticle pattern surface, said pellicle frame, and said pellicle film.
2. A pellicle according to
claim 1
, further comprising a pressure-sensitive adhesive layer formed on an inner surface of said pellicle frame and added with said capturing material.
3. A pellicle according to
claim 1
, further comprising a pressure-sensitive adhesive layer formed on an inner surface of said pellicle frame and having a surface coated with said capturing material.
4. A pellicle according to
claim 1
, wherein said capturing material is directly applied to said inner surface of said pellicle frame.
5. A pellicle according to
claim 1
, further comprising
a ventilation opening formed in said pellicle frame to allow said space in said pellicle and an outside of said pellicle to communicate with each other, and
a filter with said capturing material formed in said ventilation opening,
said capturing material serving to capture the deposition control material entering said space in said pellicle from outside through said ventilation opening.
6. A pellicle according to
claim 1
, wherein the deposit on said pellicle pattern surface is formed by reaction of a plurality of different kinds of deposition control materials.
7. A pellicle according to
claim 6
, wherein
the deposition control materials include one of ammonia and ammonium ions, and
said capturing material is phosphoric acid.
8. A pellicle according to
claim 6
, wherein
the deposition control materials include one of sulfuric acid and sulfate ions,
and said capturing material is potassium carbonate.
9. A pellicle according to
claim 1
, wherein the deposition control material promotes formation of the deposit on said reticle pattern surface.
10. A pellicle according to
claim 9
, wherein
the deposition control material is an organic substance, and
said capturing material is active carbon.
11. A pellicle case comprising:
a holding member for holding a pellicle having a pellicle frame having one end face bonded to said reticle pattern surface to surround a reticle pattern formed on a reticle pattern surface, and a pellicle film bonded to the other end face of said pellicle frame; and
a capturing material formed in said pellicle case to capture a deposition control material that causes formation of a deposit on said pellicle pattern surface.
12. A case according to
claim 11
, wherein said pellicle frame has a ventilation opening to allow an inside and outside of said pellicle to communicate with each other.
13. A case according to
claim 12
, wherein said ventilation opening has a dust preventive filter.
14. A case according to
claim 11
, wherein the deposit on said pellicle pattern surface is formed by reaction of a plurality of different kinds of deposition control materials.
15. A case according to
claim 11
, wherein
the deposition control material is one of ammonia and ammonium ions, and
said capturing material is phosphoric acid.
16. A case according to
claim 11
, wherein
the deposition control material is one of sulfuric acid and sulfate ions, and
said capturing material is potassium carbonate.
17. A case according to
claim 11
, wherein the deposition control material promotes formation of the deposit on said reticle pattern surface.
18. A case according to
claim 17
, wherein
the deposition control material is an organic substance, and
said capturing material is an active carbon.
US09/842,144 1999-06-09 2001-04-26 Pellicle and storage case therefor having chemical traps Expired - Fee Related US6443302B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/842,144 US6443302B2 (en) 1999-06-09 2001-04-26 Pellicle and storage case therefor having chemical traps

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP163023/1999 1999-06-09
JP11-163023 1999-06-09
JP16302399A JP3434731B2 (en) 1999-06-09 1999-06-09 Pellicle and its case
US09/588,722 US6254942B1 (en) 1999-06-09 2000-06-07 Pellicle case having chemical traps
US09/842,144 US6443302B2 (en) 1999-06-09 2001-04-26 Pellicle and storage case therefor having chemical traps

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US09/588,722 Division US6254942B1 (en) 1999-06-09 2000-06-07 Pellicle case having chemical traps
US09588722 Division 2001-07-03

Publications (2)

Publication Number Publication Date
US20010014375A1 true US20010014375A1 (en) 2001-08-16
US6443302B2 US6443302B2 (en) 2002-09-03

Family

ID=15765726

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/588,722 Expired - Lifetime US6254942B1 (en) 1999-06-09 2000-06-07 Pellicle case having chemical traps
US09/842,144 Expired - Fee Related US6443302B2 (en) 1999-06-09 2001-04-26 Pellicle and storage case therefor having chemical traps

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US09/588,722 Expired - Lifetime US6254942B1 (en) 1999-06-09 2000-06-07 Pellicle case having chemical traps

Country Status (2)

Country Link
US (2) US6254942B1 (en)
JP (1) JP3434731B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050048376A1 (en) * 2003-08-26 2005-03-03 Intel Corporation Mounting a pellicle to a frame
US20050045262A1 (en) * 2003-08-26 2005-03-03 Intel Corporation Attaching a pellicle frame to a reticle
US20050140949A1 (en) * 2003-04-30 2005-06-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing methods, mask and method of characterizing a mask and/or pellicle
US20050202252A1 (en) * 2004-03-12 2005-09-15 Alexander Tregub Use of alternative polymer materials for "soft" polymer pellicles
US20050203254A1 (en) * 2004-03-12 2005-09-15 Alexander Tregub Process to optimize properties of polymer pellicles and resist for lithography applications
US6978437B1 (en) * 2000-10-10 2005-12-20 Toppan Photomasks, Inc. Photomask for eliminating antenna effects in an integrated circuit and integrated circuit manufacture with same
US20090176166A1 (en) * 2008-01-04 2009-07-09 Alcatei-Lucent Method for manufacturing photomasks and device for its implementation
FR2926145A1 (en) * 2008-01-04 2009-07-10 Alcatel Lucent Sas Photomask manufacturing method for electronic card, involves restoring atmospheric pressure in enclosure, and extracting photomask from enclosure to eliminate ammonia and sulfate residues after cleaning photomask

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3434731B2 (en) * 1999-06-09 2003-08-11 Necエレクトロニクス株式会社 Pellicle and its case
KR100505283B1 (en) * 2001-10-31 2005-08-03 미쓰이 가가쿠 가부시키가이샤 Pellicle and method of manufacturing mask with pellicle
JP2003315983A (en) * 2002-04-22 2003-11-06 Mitsubishi Electric Corp Photomask
DE10246788B4 (en) * 2002-10-08 2007-08-30 Infineon Technologies Ag Protective mask for reflection masks and method for using a protected reflection mask
US7094505B2 (en) * 2002-10-29 2006-08-22 Toppan Photomasks, Inc. Photomask assembly and method for protecting the same from contaminants generated during a lithography process
TW200422793A (en) * 2002-11-15 2004-11-01 Mitsui Chemicals Inc Pellicle with small gas production amount
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
US7463338B2 (en) * 2003-07-08 2008-12-09 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
US7516379B2 (en) * 2004-04-06 2009-04-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Circuit and method for comparing circuit performance between functional and AC scan testing in an integrated circuit (IC)
JP4388467B2 (en) * 2004-12-28 2009-12-24 信越化学工業株式会社 Pellicle and pellicle frame for photolithography
DE102005052046A1 (en) * 2005-10-31 2007-05-03 Infineon Technologies Ag Lithographic projection photo-mask, useful e.g. in structuring semiconductor wafers to form integrated circuits, includes absorber in purging gas volume above substrate to inhibit crystal formation
DE102005062430A1 (en) * 2005-12-23 2007-07-05 Carl Zeiss Smt Ag Optical arrangement used in microlithography comprises photomask and adsorbing substance arranged in intermediate chamber to bind contaminating gases containing hydrocarbons by physical adsorption and/or chemical adsorption
JP4936515B2 (en) 2006-05-18 2012-05-23 Hoya株式会社 Photomask manufacturing method and halftone phase shift mask manufacturing method
JP2007333910A (en) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd Pellicle
JP5051840B2 (en) * 2007-11-22 2012-10-17 信越化学工業株式会社 Method for storing a pellicle in a pellicle storage container
CN111221213A (en) * 2020-01-13 2020-06-02 合肥维信诺科技有限公司 Mask device
CN111929990B (en) * 2020-07-31 2023-02-07 中国科学院微电子研究所 Hydrogen ion trap, ammonium sulfate-resistant system, photolithography system, and ammonium sulfate-resistant method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470508A (en) * 1983-08-19 1984-09-11 Micro Lithography, Inc. Dustfree packaging container and method
US4996106A (en) * 1987-11-05 1991-02-26 Mitsui Petrochemical Industries, Ltd. Pellicle
US6254942B1 (en) * 1999-06-09 2001-07-03 Nec Corporation Pellicle case having chemical traps

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057841A (en) 1983-09-09 1985-04-03 Hitachi Ltd Method and device for foreign matter
JPS6214450A (en) 1985-07-11 1987-01-23 Nec Corp Lead frame
JPH03166545A (en) 1989-11-27 1991-07-18 Hitachi Electron Eng Co Ltd Pellicle frame for protecting ic reticule
JPH04269752A (en) 1991-02-26 1992-09-25 Fujitsu Ltd Pellicle
JP3445685B2 (en) * 1994-08-11 2003-09-08 三井化学株式会社 Mask protection device
JPH0968793A (en) 1995-08-30 1997-03-11 Shin Etsu Chem Co Ltd Pellicle
JP4112649B2 (en) 1997-02-13 2008-07-02 三井化学株式会社 UV pellicle and pellicle case
JPH1195413A (en) 1997-09-25 1999-04-09 Nippon Telegr & Teleph Corp <Ntt> Mask storage device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470508A (en) * 1983-08-19 1984-09-11 Micro Lithography, Inc. Dustfree packaging container and method
US4996106A (en) * 1987-11-05 1991-02-26 Mitsui Petrochemical Industries, Ltd. Pellicle
US6254942B1 (en) * 1999-06-09 2001-07-03 Nec Corporation Pellicle case having chemical traps

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6978437B1 (en) * 2000-10-10 2005-12-20 Toppan Photomasks, Inc. Photomask for eliminating antenna effects in an integrated circuit and integrated circuit manufacture with same
US20050140949A1 (en) * 2003-04-30 2005-06-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing methods, mask and method of characterizing a mask and/or pellicle
US7379154B2 (en) * 2003-04-30 2008-05-27 Asml Netherlands, B.V. Lithographic apparatus, device manufacturing methods, mask and method of characterizing a mask and/or pellicle
US20080094591A1 (en) * 2003-08-26 2008-04-24 Intel Corporation Mounting a Pellicle to a Frame
US20050045262A1 (en) * 2003-08-26 2005-03-03 Intel Corporation Attaching a pellicle frame to a reticle
US8551675B2 (en) 2003-08-26 2013-10-08 Intel Corporation Mounting a pellicle to a frame
US8012651B2 (en) 2003-08-26 2011-09-06 Intel Corporation Mounting a pellicle to a frame
US7264853B2 (en) * 2003-08-26 2007-09-04 Intel Corporation Attaching a pellicle frame to a reticle
US20050048376A1 (en) * 2003-08-26 2005-03-03 Intel Corporation Mounting a pellicle to a frame
US7316869B2 (en) 2003-08-26 2008-01-08 Intel Corporation Mounting a pellicle to a frame
US7314667B2 (en) 2004-03-12 2008-01-01 Intel Corporation Process to optimize properties of polymer pellicles and resist for lithography applications
US20070037074A1 (en) * 2004-03-12 2007-02-15 Alexander Tregub Use of alternative polymer materials for "soft" polymer pellicles
US20050203254A1 (en) * 2004-03-12 2005-09-15 Alexander Tregub Process to optimize properties of polymer pellicles and resist for lithography applications
US20050202252A1 (en) * 2004-03-12 2005-09-15 Alexander Tregub Use of alternative polymer materials for "soft" polymer pellicles
US20090176166A1 (en) * 2008-01-04 2009-07-09 Alcatei-Lucent Method for manufacturing photomasks and device for its implementation
FR2926145A1 (en) * 2008-01-04 2009-07-10 Alcatel Lucent Sas Photomask manufacturing method for electronic card, involves restoring atmospheric pressure in enclosure, and extracting photomask from enclosure to eliminate ammonia and sulfate residues after cleaning photomask
US8383296B2 (en) 2008-01-04 2013-02-26 Alcatel Lucent Method for manufacturing photomasks and device for its implementation

Also Published As

Publication number Publication date
US6443302B2 (en) 2002-09-03
JP2000352812A (en) 2000-12-19
JP3434731B2 (en) 2003-08-11
US6254942B1 (en) 2001-07-03

Similar Documents

Publication Publication Date Title
US6254942B1 (en) Pellicle case having chemical traps
KR101080531B1 (en) Container for housing a mask blank, method of housing a mask blank, and mask blank package
JP5268142B2 (en) Mask blank storage case, mask blank storage method, and mask blank storage body
CN112650021B (en) Photomask box with window
US20020089656A1 (en) Containers for lithography mask and method of use
JP2005508509A (en) Fabrication process and preservation method of packaged radiation-sensitive coated workpiece
US5397665A (en) Photomask with pellicle and method of treating and storing the same
JP5668346B2 (en) Mounting structure of pellicle to photomask
JP2001053136A (en) Case
JP4342863B2 (en) Mask blank storage container, mask blank storage method, mask blank storage body, and mask blank storage body transport method
JP2005175324A (en) Mask-contamination preventing method and apparatus, and aligner
US20090114563A1 (en) Reticle storage apparatus and semiconductor element storage apparatus
JP5347286B2 (en) Adhesive tape, casing and transport / storage method thereof, photomask case and transport / storage method thereof
JPH07226364A (en) How to save the photo plate
JP4342872B2 (en) Mask blank storage method, mask blank storage body, and mask blank manufacturing method
JP4972860B2 (en) Semiconductor laser module and printing apparatus using the same
JPH06208947A (en) Method and device for processing resist
JP2011129698A (en) Photomask manufacturing method and charged particle beam lithography system
JP2005031489A (en) Storage container of mask blank or the like, method for housing mask blank, and mask blank housed body
KR20080084371A (en) Photomask Manufacturing Method
JP2005070390A (en) Method for processing housing member of mask blank, method for manufacturing housing member of mask blank, and mask blank housed body
JPH04269752A (en) Pellicle
JP2007108367A (en) Photomask
JP2004241740A (en) Dust-proofing device, stencil mask with dust-proofing device, exposure method, inspection method and defect correcting method
CN113900352A (en) Mask structure, manufacturing method thereof and photoetching method

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: NEC ELECTRONICS CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NEC CORPORATION;REEL/FRAME:013774/0295

Effective date: 20021101

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20100903

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载