TWM667038U - Touchpad module - Google Patents
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- TWM667038U TWM667038U TW113212952U TW113212952U TWM667038U TW M667038 U TWM667038 U TW M667038U TW 113212952 U TW113212952 U TW 113212952U TW 113212952 U TW113212952 U TW 113212952U TW M667038 U TWM667038 U TW M667038U
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Abstract
Description
本創作係有關於一種觸控板模組,尤其係有關於一種電阻式壓力感測的觸控板模組。This invention relates to a touch panel module, and more particularly to a resistive pressure sensing touch panel module.
目前市面上的某些電子裝置配有觸控板模組。使用者可透過手指在觸控板模組上滑動以移動電子裝置的螢幕上的游標,亦可透過按壓觸控板模組以使電子裝置執行特定功能。如此一來,使用者不需額外攜帶及裝設滑鼠。Some electronic devices currently on the market are equipped with a touch panel module. Users can slide their fingers on the touch panel module to move the cursor on the screen of the electronic device, or press the touch panel module to make the electronic device perform a specific function. In this way, users do not need to carry and install an additional mouse.
一般而言,觸控板模組通常採用壓電式、電阻式或電容式感測器,以使觸控板模組具有壓力感測功能。然而由於壓電式感測器採用壓電材料,因此成本較高;電阻式感測器採用電阻應變件(strain gauge),因此成本較高;環境溫溼度容易對電容式感測器產生影響,並且其線性度較差。因此目前的觸控板模組仍有待改善。Generally speaking, touch panel modules usually use piezoelectric, resistive or capacitive sensors to enable the touch panel module to have pressure sensing function. However, since piezoelectric sensors use piezoelectric materials, their cost is relatively high; resistive sensors use resistive strain gauges, their cost is relatively high; environmental temperature and humidity can easily affect capacitive sensors, and their linearity is relatively poor. Therefore, the current touch panel modules still need to be improved.
本創作提供一種觸控板模組,其包括支撐件、組裝電路板、間隔件及中間層。組裝電路板位於支撐件上方,並且包括至少一組導電圖案設置在組裝電路板的下表面上,其中該至少一組導電圖案包括彼此分離的第一導電圖案及第二導電圖案。間隔件設置在支撐件與組裝電路板之間,其中間隔件為對應該至少一組導電圖案的導電間隔件,或者間隔件的上表面設有對應該至少一組導電圖案的導電層。中間層設置在該至少一組導電圖案與間隔件之間,並且定義鏤空區域,以使該至少一組導電圖案透過鏤空區域面對導電間隔件或導電層,其中當觸控板模組未被按壓時,第一導電圖案及第二導電圖案未接觸導電間隔件或導電層,當觸控板模組被按壓時,第一導電圖案及第二導電圖案接觸導電間隔件或導電層,以使第一導電圖案與第二導電圖案透過導電間隔件或導電層彼此導通。The invention provides a touch panel module, which includes a support, an assembly circuit board, a spacer and an intermediate layer. The assembly circuit board is located above the support, and includes at least one set of conductive patterns arranged on the lower surface of the assembly circuit board, wherein the at least one set of conductive patterns includes a first conductive pattern and a second conductive pattern separated from each other. The spacer is arranged between the support and the assembly circuit board, wherein the spacer is a conductive spacer corresponding to the at least one set of conductive patterns, or the upper surface of the spacer is provided with a conductive layer corresponding to the at least one set of conductive patterns. The middle layer is arranged between the at least one set of conductive patterns and the spacer, and defines a hollow area so that the at least one set of conductive patterns faces the conductive spacer or the conductive layer through the hollow area, wherein when the touch panel module is not pressed, the first conductive pattern and the second conductive pattern do not contact the conductive spacer or the conductive layer, and when the touch panel module is pressed, the first conductive pattern and the second conductive pattern contact the conductive spacer or the conductive layer, so that the first conductive pattern and the second conductive pattern are conductively connected to each other through the conductive spacer or the conductive layer.
在本創作的一些實施例中,觸控板模組不包括電阻應變件(strain gauge)。In some embodiments of the present invention, the touch panel module does not include a resistive strain gauge.
在本創作的一些實施例中,該至少一組導電圖案係以銀漿印刷製成。In some embodiments of the present invention, the at least one set of conductive patterns is made by silver paste printing.
在本創作的一些實施例中,中間層為接著層。In some embodiments of the present invention, the middle layer is a connecting layer.
在本創作的一些實施例中,間隔件透過接著層固定在該至少一組導電圖案上。In some embodiments of the present invention, the spacer is fixed on the at least one set of conductive patterns through a bonding layer.
在本創作的一些實施例中,中間層的上視圖案為環形或折線形。In some embodiments of the present invention, the top-view pattern of the middle layer is a ring or a broken line.
在本創作的一些實施例中,間隔件具有彈性。In some embodiments of the present invention, the spacer is elastic.
在本創作的一些實施例中,間隔件的邵氏硬度小於或等於40度。In some embodiments of the present invention, the Shore hardness of the spacer is less than or equal to 40 degrees.
在本創作的一些實施例中,中間層的厚度小於間隔件的厚度。In some embodiments of the present invention, the thickness of the middle layer is less than the thickness of the spacer.
本創作的優點及特徵以及達到其方法將參照例示性實施例及附圖進行更詳細的描述而更容易理解。然而,本創作可以不同形式來實現,而不應被理解僅限於此處所陳述的實施例。相反地,對所屬技術領域具有通常知識者而言,所提供的此些實施例將使本創作更加透徹與全面且完整地傳達本創作的範疇。The advantages and features of the present invention and the methods for achieving the same will be described in more detail with reference to the exemplary embodiments and drawings so as to be more easily understood. However, the present invention can be implemented in different forms and should not be understood to be limited to the embodiments described herein. On the contrary, for those with ordinary knowledge in the art, the embodiments provided will make the present invention more thorough and comprehensive and fully convey the scope of the present invention.
本文中的空間相對用語,例如「下」、「上」,這是為了便於敘述圖式中一元件或特徵與另一元件或特徵之間的相對關係。這些空間相對用語的真實意義包含其他方位。例如,當圖式上下翻轉180度時,一元件與另一元件之間的關係,可能從「下」變成「上」。本文中所使用的空間相對敘述也應作同樣的解釋。The spatially relative terms used herein, such as "lower" and "upper", are used to facilitate the description of the relative relationship between one element or feature and another element or feature in the drawings. The true meaning of these spatially relative terms includes other orientations. For example, when the drawings are flipped 180 degrees up and down, the relationship between one element and another element may change from "lower" to "upper". The spatially relative descriptions used in this article should also be interpreted in the same way.
如先前技術所述,一般而言,觸控板模組通常採用壓電式、電阻式或電容式感測器,以使觸控板模組具有壓力感測功能。然而由於壓電式感測器採用壓電材料,因此成本較高;電阻式感測器採用電阻應變件(strain gauge),因此成本較高;環境溫溼度容易對電容式感測器產生影響,並且其線性度較差。因此目前的觸控板模組仍有待改善。據此,本創作提供一種觸控板模組,其包括支撐件、具有至少一組導電圖案的組裝電路板、間隔件及中間層。該至少一組導電圖案包括彼此分離的第一導電圖案及第二導電圖案。間隔件為對應該至少一組導電圖案的導電間隔件,或者間隔件的上表面設有對應該至少一組導電圖案的導電層。中間層設置在該至少一組導電圖案與間隔件之間,並且定義鏤空區域,以使該至少一組導電圖案透過鏤空區域面對導電間隔件或導電層。當觸控板模組被按壓時,該至少一組導電圖案(其包括彼此分離的第一導電圖案及第二導電圖案)往下突出,經鏤空區域而接觸導電間隔件或導電層,使相應的感測元件能夠測得第一導電圖案及第二導電圖案導通前(即開路狀態)及導通後的電流變化,而計算出電阻變化。藉此電阻變化作為壓力感測的訊號來源。因此本創作的觸控板模組不需要在支撐件下方設置電阻應變件(strain gauge),也不需要設置連接於電阻應變件與組裝電路板之間的軟性電路板,因此相較於傳統之包括電阻應變件及軟性電路板的電阻式觸控板模組,本創作的觸控板模組的材料成本及製程成本較低。另一方面,相較於壓電式觸控板模組,本創作的觸控板模組的材料成本較低;相較於電容式觸控模組,本創作的觸控板模組不受環境溫溼度影響,並且線性度佳。以下將詳述本創作的觸控板模組的各種實施例。As described in the prior art, in general, a touch panel module usually uses a piezoelectric, resistive or capacitive sensor to enable the touch panel module to have a pressure sensing function. However, since piezoelectric sensors use piezoelectric materials, their cost is relatively high; resistive sensors use resistive strain gauges, their cost is relatively high; ambient temperature and humidity can easily affect capacitive sensors, and their linearity is relatively poor. Therefore, the current touch panel module still needs to be improved. Accordingly, the present invention provides a touch panel module, which includes a support member, an assembly circuit board having at least one set of conductive patterns, a spacer and an intermediate layer. The at least one set of conductive patterns includes a first conductive pattern and a second conductive pattern separated from each other. The spacer is a conductive spacer corresponding to the at least one set of conductive patterns, or the upper surface of the spacer is provided with a conductive layer corresponding to the at least one set of conductive patterns. The intermediate layer is arranged between the at least one set of conductive patterns and the spacer, and a hollow area is defined so that the at least one set of conductive patterns faces the conductive spacer or the conductive layer through the hollow area. When the touch panel module is pressed, the at least one set of conductive patterns (which includes a first conductive pattern and a second conductive pattern separated from each other) protrudes downward, contacts the conductive spacer or the conductive layer through the hollow area, so that the corresponding sensing element can detect the current change before the first conductive pattern and the second conductive pattern are turned on (i.e., in an open circuit state) and after they are turned on, and calculate the resistance change. The resistance change is used as the signal source for pressure sensing. Therefore, the touch panel module of this invention does not need to set a resistance strain gauge under the support, nor does it need to set a flexible circuit board connected between the resistance strain gauge and the assembly circuit board. Therefore, compared with the traditional resistive touch panel module including a resistance strain gauge and a flexible circuit board, the material cost and process cost of the touch panel module of this invention are lower. On the other hand, compared with the piezoelectric touch panel module, the material cost of the touch panel module of this invention is lower; compared with the capacitive touch panel module, the touch panel module of this invention is not affected by the ambient temperature and humidity, and has good linearity. Various embodiments of the touch panel module of the present invention are described in detail below.
圖1為根據本創作一實施例之觸控板模組的外觀示意圖。圖2為圖1之觸控板模組的分解示意圖。圖3為圖2之包括多組導電圖案的組裝電路板的下視示意圖。圖4為圖2之包括多組導電圖案的組裝電路板及中間層的下視示意圖。圖5為圖1之觸控板模組的局部剖面示意圖。如圖1至5所示,觸控板模組包括支撐件110、組裝電路板(printed circuit board assembly, PCBA)120、間隔件130及中間層140。FIG. 1 is a schematic diagram of the appearance of a touch panel module according to an embodiment of the present invention. FIG. 2 is a schematic diagram of an exploded view of the touch panel module of FIG. 1 . FIG. 3 is a schematic diagram of a bottom view of an assembly circuit board including multiple sets of conductive patterns of FIG. 2 . FIG. 4 is a schematic diagram of a bottom view of an assembly circuit board including multiple sets of conductive patterns and an intermediate layer of FIG. 2 . FIG. 5 is a schematic diagram of a partial cross-section of the touch panel module of FIG. 1 . As shown in FIGS. 1 to 5 , the touch panel module includes a
在一些實施例中,支撐件110為金屬件,例如為鐵件。在一些實施例中,如圖1及2所示,支撐件110具有開口(未標示)。In some embodiments, the
組裝電路板120位於支撐件110上方,並且包括至少一組導電圖案1201設置在組裝電路板120的下表面上。在一些實施例中,如圖2至4所示,組裝電路板120包括多組導電圖案1201,其分別設置在組裝電路板120的下表面的周邊區域上。The
如圖3及4所示,該至少一組導電圖案1201包括彼此分離的第一導電圖案1201a及第二導電圖案1201b。在一些實施例中,設置感測元件(圖未示)在組裝電路板120的下表面上,並且感測元件電性連接第一導電圖案1201a及第二導電圖案1201b。感測元件可測得第一導電圖案1201a與第二導電圖案1201b導通前(即開路狀態)及導通後的電流變化,而計算出電阻變化。藉此電阻變化作為壓力感測的訊號來源。As shown in FIGS. 3 and 4 , the at least one set of
在一些實施例中,第一導電圖案1201a及第二導電圖案1201b為導線圖案,例如為折線形。然而本創作不限於前述實施例。在其他實施例中,第一導電圖案及第二導電圖案為實心圖案,例如為方形、三角形等,只要兩者彼此分離即可。在一些實施例中,該至少一組導電圖案1201係以銀漿印刷製成。然而本創作不限於前述實施例,該至少一組導電圖案1201亦可透過其他合適的製程形成。In some embodiments, the first
如圖2及5所示,間隔件130設置在支撐件110與組裝電路板120之間。間隔件130可為對應該至少一組導電圖案1201的導電間隔件(參考圖2及5),或者間隔件130的上表面可設有對應該至少一組導電圖案1201的導電層(圖未示)。在一些實施例中,間隔件130具有彈性,例如由橡膠或其他合適的材質製成,以使觸控板模組被按壓時,該至少一組導電圖案1201能夠往下突出而接觸導電間隔件或導電層。在一些實施例中,間隔件130的邵氏硬度小於或等於40度。As shown in FIGS. 2 and 5 , the
如圖2、4及5所示,中間層140設置在該至少一組導電圖案1201與間隔件130之間,並且定義鏤空區域140a,以使該至少一組導電圖案1201透過鏤空區域140a面對導電間隔件(當間隔件130為導電間隔件)或導電層(當間隔件130的上表面設有的導電層,圖未示)。在一些實施例中,中間層140的上視圖案為環形(例如圓形、正方框形、長方框形(如圖4所示)、三角形等)或折線形(例如Z字形)。然而本創作不限於前述實施例,只要中間層能夠定義出合適的鏤空區域,使該至少一組導電圖案1201透過鏤空區域面對導電間隔件或導電層,並且當觸控板模組被按壓時,該至少一組導電圖案1201經鏤空區域能夠接觸導電間隔件或導電層,使第一導電圖案1201a與第二導電圖案1201b之間彼此導通即可。As shown in FIGS. 2, 4 and 5, the
在一些實施例中,中間層140為接著層。在一些實施例中,間隔件130透過接著層固定在該至少一組導電圖案1201上。在一些實施例中,中間層140的厚度小於間隔件130的厚度。In some embodiments, the
參考圖5,當觸控板模組未被按壓時,該至少一組導電圖案1201未接觸導電間隔件或導電層。當觸控板模組被按壓時,該至少一組導電圖案1201接觸導電間隔件或導電層。參考圖3至5,詳細而言,當觸控板模組被按壓時,第一導電圖案1201a及第二導電圖案1201b往下突出,經鏤空區域140a而接觸導電間隔件或導電層,而使第一導電圖案1201a與第二導電圖案1201b透過導電間隔件或導電層彼此導通。感測元件可測得第一導電圖案1201a與第二導電圖案1201b導通前(即開路狀態)及導通後的電流變化,而計算出電阻變化。藉由此電阻變化作為壓力感測的訊號來源。因此本創作之觸控板模組可不包括電阻應變件。Referring to FIG. 5 , when the touch panel module is not pressed, the at least one
在一些實施例中,如圖1、2及5所示,觸控板模組更包括蓋板150,其覆蓋組裝電路板120。在一些實施例中,蓋板150由玻璃或由其他合適的材料製成。In some embodiments, as shown in FIGS. 1, 2 and 5, the touch panel module further includes a
在一些實施例中,如圖2及3所示,觸控板模組更包括致動器160,其設置在組裝電路板120的下表面上,並自支撐件110的開口中露出。In some embodiments, as shown in FIGS. 2 and 3 , the touch panel module further includes an
惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍,即大凡依新型申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬新型專利涵蓋之範圍內。另外,本創作的任一實施例或申請專利範圍不須達成本創作所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本創作之權利範圍。However, the above is only the best embodiment of this creation, and it cannot be used to limit the scope of implementation of this creation. That is, simple equivalent changes and modifications made according to the scope of the new patent application and the new description content are still within the scope of the new patent. In addition, any embodiment or patent application scope of this creation does not need to achieve all the purposes, advantages or features disclosed by this creation. In addition, the abstract part and the title are only used to assist in searching patent documents, and are not used to limit the scope of rights of this creation.
110:支撐件
120:組裝電路板
1201:組導電圖案
1201a:第一導電圖案
1201b:第二導電圖案
130:間隔件
140:中間層
140a:鏤空區域
150:蓋板
160:致動器
110: Supporting member
120: Assembling circuit board
1201: Assembling
以下將結合附圖閱讀,根據以下實施方式可以最好地理解本創作的各方面。然而應當理解的是,根據行業中的慣例,各種特徵不一定按照比例繪製。實際上,為了清楚起見,各種特徵的形狀可作適當的調整,並且各種特徵的尺寸可以任意地增加或減小。The following will be read in conjunction with the accompanying drawings, and various aspects of the present invention can be best understood according to the following embodiments. However, it should be understood that, according to the conventions in the industry, the various features are not necessarily drawn to scale. In fact, for the sake of clarity, the shapes of the various features may be appropriately adjusted, and the sizes of the various features may be arbitrarily increased or reduced.
圖1為根據本創作一實施例之觸控板模組的外觀示意圖。FIG1 is a schematic diagram of the appearance of a touch panel module according to an embodiment of the present invention.
圖2為圖1之觸控板模組的分解示意圖。FIG. 2 is an exploded schematic diagram of the touch panel module of FIG. 1 .
圖3為圖2之包括多組導電圖案的組裝電路板的下視示意圖。FIG. 3 is a bottom view of the assembled circuit board including multiple sets of conductive patterns shown in FIG. 2 .
圖4為圖2之包括多組導電圖案的組裝電路板及中間層的下視示意圖。FIG. 4 is a bottom view of the assembled circuit board including multiple sets of conductive patterns and the middle layer of FIG. 2 .
圖5為圖1之觸控板模組的局部剖面示意圖。FIG. 5 is a partial cross-sectional diagram of the touch panel module of FIG. 1 .
110:支撐件 110: Support parts
120:組裝電路板 120: Assembling circuit boards
1201:組導電圖案 1201: Group conductive pattern
130:間隔件 130: Spacer
140:中間層 140: Middle layer
140a:鏤空區域 140a: hollowed-out area
150:蓋板 150: Cover plate
Claims (9)
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TW113212952U TWM667038U (en) | 2024-11-27 | 2024-11-27 | Touchpad module |
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TW113212952U TWM667038U (en) | 2024-11-27 | 2024-11-27 | Touchpad module |
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