TWI849431B - Heat dissipating system - Google Patents

Abstract

A heat dissipating system for electronic devices includes a first heat dissipation device, a thermal conduction component, and a second heat dissipation device. A thermal conduction component is disposed around the first heat dissipation device and is configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dissipated in a plurality of directions away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction away from the second heat dissipation device.

Description

Cooling system

The present disclosure relates to a heat dissipation system, and more particularly to a heat dissipation system for electronic devices.

As the performance of electronic devices continues to improve, the requirements for heat dissipation efficiency are also getting higher and higher, especially in gaming laptops. While improving processor performance, in order to enhance heat dissipation and cooling, the heat dissipation system required by gaming laptops is often more complex and larger in size, making gaming laptops thicker and heavier than ordinary laptops, thus reducing the portability of gaming laptops.

Therefore, how to come up with a heat dissipation system that can solve the above problems is one of the issues that the industry is eager to invest research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a heat dissipation system that can solve the above problems.

The present disclosure relates to a heat dissipation system for an electronic device, comprising a first heat dissipation device, a heat conduction component, and a second heat dissipation device. The heat conduction component is disposed around the first heat dissipation device and is configured to contact a heat source. The second heat dissipation device is disposed adjacent to the heat conduction component. The first heat dissipation device is configured to generate a first action fluid toward the heat conduction component, so that the heat transferred from the heat source to the heat conduction component is dispersed in a plurality of directions away from the first heat dissipation device. The second heat dissipation device is configured to generate a second action fluid, so that the heat adjacent to the second heat dissipation device is dispersed in at least one direction away from the second heat dissipation device.

In some embodiments, at least one direction away from the second heat sink is at least one direction toward the heat conducting component.

In some embodiments, at least one direction away from the second heat sink is at least one direction away from the heat conducting component.

In some embodiments, the heat transfer component further includes a heat conductive element extending to the second heat sink and a heat exchanger adjacent to the second heat sink, and the second working fluid passes through the heat exchanger.

In some embodiments, the heat dissipation system further includes a first baffle disposed between the heat conducting component and the second heat dissipation device.

In some embodiments, the heat transfer component is a heat sink, a heat pipe, a graphite sheet, or a high-conductivity metal.

In some embodiments, the heat transfer component is disposed completely around the first heat sink.

In some embodiments, the heat transfer component is disposed partially around the first heat sink.

In some embodiments, the heat conduction component is located between the first heat sink and the second heat sink.

In some embodiments, the first heat dissipation device is an open centrifugal fan, which includes at least one axial air inlet and a plurality of radial air outlets, and the radial air outlets respectively correspond to the directions away from the first heat dissipation device.

In some embodiments, the second heat dissipation device is a closed centrifugal fan, and the closed centrifugal fan includes at least one axial air inlet and at least one lateral air outlet.

In some embodiments, the closed centrifugal fan further comprises a housing and a second baffle. The housing has at least one axial air inlet and at least one lateral air outlet. The second baffle surrounds the housing.

In some embodiments, the closed centrifugal fan further comprises a housing and a third baffle. The housing has at least one axial air inlet and at least one lateral air outlet. The third baffle is disposed on the housing and is located at the outer edge of the at least one axial air inlet.

In summary, in the heat dissipation system disclosed herein, the heat transfer component evenly disperses the heat from the heat source through the working fluid generated by the first heat dissipation device. The second heat dissipation device further generates the working fluid to guide the heat to a specific direction. The heat-conducting element extending from the heat transfer component can further disperse the heat of the heat transfer component and guide the heat to the path through which the working fluid generated by the second heat dissipation device passes. In addition, the first baffle disposed between the heat transfer component and the second heat dissipation device allows the first heat dissipation device and the second heat dissipation device to each have an independent (heat) flow field, thereby reducing unnecessary heat transfer and preventing the hot air in the system from reflux, which leads to a decrease in heat dissipation efficiency. Compared with the heat dissipation system currently commonly used for electronic devices, it can achieve a better heat dissipation and cooling effect.

These and other aspects of the present disclosure will become apparent from the following description of preferred embodiments in conjunction with the drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concepts of the present disclosure.

The following disclosure will now be more fully described here through drawings and references, and some exemplary embodiments are illustrated in the drawings. The disclosure can be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to help a more complete understanding of the content of the disclosure and fully convey the scope of the invention to those skilled in the art. The same reference numerals will refer to similar elements throughout the text.

Please refer to FIG. 1, which shows a top view of a heat dissipation system 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the heat dissipation system 100 includes a heat conduction component 101, a first heat dissipation device 102, and a second heat dissipation device 103. The heat conduction component 101 is disposed around the first heat dissipation device 102. As shown in FIG. 1, the heat conduction component 101 is partially disposed around the first heat dissipation device 102. In some embodiments, the heat conduction component 101 is disposed completely around the first heat dissipation device 102 (see FIG. 5). The second heat dissipation device 103 is disposed adjacent to the heat conduction component 101. In some embodiments, the heat conduction component 101 is located between the first heat dissipation device 102 and the second heat dissipation device 103.

The heat conducting component 101 is configured to thermally contact the heat source of the electronic device. The number of heat sources is not limited to one. If there are two heat sources, they are arranged on opposite sides of the first heat sink 102 to disperse the heat sources and reduce the superposition of heat energy generated by the two heat sources. Similarly, if there are three or more heat sources, they are arranged together around the first heat sink 102. In the embodiment of the present disclosure, the electronic device can be, but is not limited to, a portable electronic device such as a laptop computer or a palmtop computer.

The heat conducting component 101 may be a vapor chamber, a heat pipe, a graphite sheet, or a high-conductivity metal, etc., which can absorb the heat of the heat source and distribute it to the heat conducting component 101. It should be understood that the heat conducting component 101 can have different shapes and configurations in accordance with the first heat sink 102, the second heat sink 103, and the structure outside the system while remaining within the scope of the present disclosure.

Please refer to FIG. 2A and FIG. 2B, which respectively illustrate a perspective view and a side view of the first heat dissipation device 102 according to some embodiments of the present disclosure. In these embodiments, the first heat dissipation device 102 is an open centrifugal fan, including at least one axial air inlet 104 and a plurality of radial air outlets 105. These radial air outlets 105 correspond to the air outlet directions away from the first heat dissipation device 102. For example, as shown in FIG. 2B , the open centrifugal fan has two axial air inlets 104 and a plurality of radial air outlets 105. The open centrifugal fan introduces cold air from outside the system through the two axial air inlets 104, and then blows the cold air to the heat transfer component 101 along different air outlet directions through the radial air outlets 105 (as shown by the arrows of the first working fluid WF1 in FIG. 2B ). In the embodiment of the present disclosure, the first heat dissipation device 102 may be, but is not limited to, an open centrifugal fan.

Please refer to FIG. 3A and FIG. 3B, which respectively illustrate a perspective view and a side view of the second heat dissipation device 103 according to some embodiments of the present disclosure. In these embodiments, the second heat dissipation device 103 is a closed centrifugal fan, including at least one axial air inlet 106 and at least one lateral air outlet 107. For example, as shown in FIG. 3B, the closed centrifugal fan has two axial air inlets 106 and one lateral air outlet 107. The closed centrifugal fan introduces cold air from the outside of the system through the two axial air inlets 106, and then discharges the cold air along the opening direction through the lateral air outlet 107 (as shown by the arrow of the second working fluid WF2 in FIG. 3B). In the embodiment of the present disclosure, the second heat dissipation device 103 may be but is not limited to a closed centrifugal fan.

In some embodiments, the second heat sink 103 further includes a housing 108 and a second baffle 109. The housing 108 has at least one axial air inlet 106 and at least one lateral air outlet 107. For example, as shown in FIG. 3A and FIG. 3B , the housing 108 has two axial air inlets 106 and one lateral air outlet 107. The second baffle 109 surrounds the housing 108 and is configured to prevent the heat carried by the portion of the heat conducting component 101 adjacent to the second heat sink 103 from heating the second heat sink 103, causing the cold air introduced into the second heat sink 103 to be heated, thereby reducing the cooling efficiency.

In some embodiments, the second heat sink 103 further includes a housing 108 and a third block 110. As shown in FIG. 3A , the third block 110 is disposed on the housing 108 and is located at the outer edges of the two axial air inlets 106, respectively, for the purpose of ensuring that the air introduced by the two axial air inlets 106 is from outside the system, rather than from the higher temperature air circulating near the second heat sink 103. Although in FIG. 3A , the third block 110 is annular, it should be understood that the third block 110 may have different shapes and configurations according to different flow field characteristics while remaining within the scope of the present disclosure.

In the drawings of the present disclosure, the first heat dissipation device 102 is illustrated by an open centrifugal fan as an example, and the second heat dissipation device 103 is illustrated by a closed centrifugal fan as an example.

Returning to Figure 1, the first heat sink 102 takes in air from the outside of the system, and the introduced cold air is blown toward the heat transfer component 101 in a radial manner along different air outlet directions, accelerating the heat transfer component 101 to evenly distribute the heat from the heat source to all parts of the heat transfer component 101. Then, the cold air introduced by the second heat sink 103 exchanges heat with the heat transfer component 101, and while the cold air absorbs heat, it also causes the heat adjacent to the second heat sink 103 to be dispersed outward along its air outlet direction.

Although only one first heat sink 102 and one second heat sink 103 are shown in the embodiment illustrated in FIG. 1 , it should be understood that the heat dissipation system 100 may include any number of first heat sinks 102 and second heat sinks 103 while remaining within the scope of the present disclosure.

For example, FIG. 4 shows a top view of a heat dissipation system 100' according to some embodiments of the present disclosure. As shown in FIG. 4, the heat dissipation system 100' includes a heat conduction component 101, a first heat dissipation device 102, two second heat dissipation devices 103, and a heat exchanger 111. Specifically, the first heat dissipation device 102 blows cold air toward the heat conduction component 101 along different air outlet directions to accelerate the even distribution of heat in the heat conduction component 101. Then, the cold air introduced by the second heat dissipation device 103 exchanges heat with the heat conduction component 101. In addition, as shown in FIG. 4 , the air outlet direction of the second heat sink 103 is toward the heat exchanger 111 (eg, heat sink fins), which promotes heat dissipation from the heat exchanger 111 and accelerates air convection near the heat transfer component 101, thereby reducing heat accumulation in dead zones of the flow field.

In some embodiments, the air outlet direction of the second heat sink 103 is away from the heat transfer component 101. In these embodiments, the cold air of the second heat sink 103 does not directly exchange heat with the heat transfer component 101, but exchanges heat with the heat conduction element (such as the heat conduction element 112) and the heat exchanger (such as the heat exchanger 113) extending from the heat transfer component 101, so that the first heat sink 102 and the second heat sink 103 each have an independent (heat) flow field, preventing the hot air in the system from flowing back and causing the heat dissipation efficiency to decrease.

For example, FIG. 5 shows a top view of a heat dissipation system 200 according to other embodiments of the present disclosure. As shown in FIG. 5, the air outlet direction of the second heat dissipation device 103 is away from the heat conduction component 101 and is perpendicular to the short axis of the heat conduction component 101. The heat conduction component 101 further includes a heat conducting element 112. The heat conducting element 112 extends outside the lateral air outlet 107 of the second heat dissipation device 103, and the cold air introduced by the second heat dissipation device 103 exchanges heat with the heat conducting element 112. In addition, as described above, the second heat dissipation device 103 may further include a second baffle 109 to block the heat from the part of the heat conduction component 101 adjacent to the second heat dissipation device 103. In this way, the first heat dissipation device 102 and the second heat dissipation device 103 each have an independent (heat) flow field, and conduct the heat to different directions for dissipation.

Similarly, although only one first heat sink 102, one second heat sink 103, and one thermal conductive element 112 are shown in the embodiment illustrated in FIG. 5, it should be understood that the heat dissipation system 200 may include any number of first heat sinks 102, second heat sinks 103, and thermal conductive elements 112 while remaining within the scope of the present disclosure.

For example, FIG. 6 shows a top view of a heat dissipation system 200' according to other embodiments of the present disclosure. As shown in FIG. 6, the heat dissipation system 200' includes a heat conduction component 101, a first heat dissipation device 102, two second heat dissipation devices 103, a heat exchanger 111, two heat conducting elements 112, and two heat exchangers 113. Specifically, the first heat dissipation device 102 blows cold air to the heat conduction component 101 along different air outlet directions to accelerate the even distribution of heat in the heat conduction component 101, and the heat exchanger 111 increases the heat convection and heat radiation area to accelerate the heat dissipation efficiency of the heat conduction component 101. At the same time, the heat conducting element 112 guides part of the heat of the heat conducting component 101 to the side air outlet 107 of the second heat sink 103. The cold air introduced by the second heat sink 103 exchanges heat with the heat exchanger 113 (such as a heat sink fin). The heat exchanger 113 can increase the heat convection and heat radiation area to improve the heat dissipation efficiency.

Please refer to FIG. 7, which shows a top view of a heat dissipation system 200'' according to other embodiments of the present disclosure. In some embodiments, in order to block the heat transfer between the portion of the heat conduction component 101 adjacent to the second heat dissipation device 103 and the second heat dissipation device 103, and to strengthen the separation between the respective (heat) flow fields of the first heat dissipation device 102 and the second heat dissipation device 103, the heat dissipation system 200'' further includes a first baffle 114 to reduce unnecessary heat transfer and prevent the hot air in the system from flowing back and causing a decrease in heat dissipation efficiency. For example, the first baffle 114 is arranged around the edge of the heat conduction component 101, as shown in FIG. 7. As described above, the heat conducting component 101 may be a vapor chamber, a heat pipe, a graphite sheet or a high-conductivity metal, etc. Therefore, the first block 114 may have different configurations according to the different structures of the heat conducting component 101 while remaining within the scope of the present disclosure.

From the above detailed description of the specific implementation method of the present disclosure, it can be clearly seen that in the heat dissipation system of the present disclosure, the heat transfer component evenly disperses the heat from the heat source through the working fluid generated by the first heat dissipation device. The second heat dissipation device further generates a working fluid to guide the heat to a specific direction. The heat-conducting element extending from the heat transfer component can further disperse the heat of the heat transfer component and guide the heat to the path through which the working fluid generated by the second heat dissipation device passes. In addition, the first baffle disposed between the heat transfer component and the second heat dissipation device can enable the first heat dissipation device and the second heat dissipation device to each have an independent (heat) flow field, reduce unnecessary heat transfer, and prevent the hot air in the system from reflux and causing a decrease in heat dissipation efficiency. Compared with the heat dissipation system currently commonly used for electronic devices, it can achieve a better heat dissipation and cooling effect.

The foregoing description is only provided to illustrate and describe the exemplary embodiments of the present disclosure, and is not intended to limit the precise form of the invention disclosed by the present disclosure. The above teachings may be modified or varied.

The embodiments selected and described are used to explain the content of the present disclosure and their practical applications to inspire other technical personnel in the field to utilize the present disclosure and various embodiments, and to make various modifications to meet the expected specific use. Alternative embodiments will be obvious to technical personnel in the field to which the present disclosure belongs without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached patent application, rather than being limited by the above specification and the exemplary embodiments described therein.

100,100',200,200',200'': heat dissipation system 101: heat transfer component 102: first heat dissipation device 103: second heat dissipation device 104,106: axial air inlet 105: radial air outlet 107: lateral air outlet 108: housing 109: second baffle 110: third baffle 111,113: heat exchanger 112: heat conduction element 114: first baffle WF1: first working fluid WF2: second working fluid

The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same drawing labels are used to refer to similar or identical elements of the embodiments as much as possible, wherein: FIG. 1 is a top view of a heat dissipation system according to some embodiments of the present disclosure. FIG. 2A is a perspective view of a first heat dissipation device according to some embodiments of the present disclosure. FIG. 2B is a side view of a first heat dissipation device according to some embodiments of the present disclosure. FIG. 3A is a perspective view of a second heat dissipation device according to some embodiments of the present disclosure. FIG. 3B is a side view of a second heat dissipation device according to some embodiments of the present disclosure. FIG. 4 is a top view of a heat dissipation system according to some embodiments of the present disclosure. FIG. 5 is a top view of a heat dissipation system according to other embodiments of the present disclosure. FIG. 6 is a top view of a heat dissipation system according to other embodiments of the present disclosure. FIG. 7 is a top view of a heat dissipation system according to other embodiments of the present disclosure.

200': heat dissipation system 101: heat transfer component 102: first heat dissipation device 103: second heat dissipation device 107: side air outlet 111,113: heat exchanger 112: heat conduction element

Claims (8)

A heat dissipation system for electronic devices, comprising: a heat spreader having an opening and configured to thermally contact two heat sources; a first heat dissipation device located in the opening of the heat spreader; two second heat dissipation devices located at two corners of the heat spreader; and two heat conducting elements extending outward from the two corners of the heat spreader, respectively, wherein each of the second heat dissipation devices is located between a notch at a corresponding corner of the heat spreader and a corresponding heat conducting element. A heat dissipation system as described in claim 1, wherein the first heat dissipation device is an open centrifugal fan, and the open centrifugal fan includes at least one axial air inlet and a plurality of radial air outlets. A heat dissipation system as described in claim 1, wherein the second heat dissipation device is a closed centrifugal fan, and the closed centrifugal fan includes at least one axial air inlet and at least one lateral air outlet. A heat dissipation system as described in claim 3, wherein the side air outlets of the two second heat dissipation devices face in two opposite directions. A heat dissipation system as described in claim 1, wherein the heat sink is completely arranged around the first heat dissipation device. A heat dissipation system as described in claim 1, wherein the heat sink is partially disposed around the first heat dissipation device. A heat dissipation system as described in claim 1, wherein the first heat dissipation device and the two second heat dissipation devices are arranged in a triangular relationship. A heat dissipation system as described in claim 1, wherein each of the heat-conducting elements extends to the corresponding lateral air outlet of the second heat dissipation device.

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