TWI317353B - - Google Patents
Download PDFInfo
- Publication number
- TWI317353B TWI317353B TW095102289A TW95102289A TWI317353B TW I317353 B TWI317353 B TW I317353B TW 095102289 A TW095102289 A TW 095102289A TW 95102289 A TW95102289 A TW 95102289A TW I317353 B TWI317353 B TW I317353B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- plate
- holding
- gap
- hole
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 132
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000013013 elastic material Substances 0.000 claims description 13
- 230000005489 elastic deformation Effects 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 description 17
- 239000005060 rubber Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000011521 glass Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
!317353 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板保持構造，其係例如在液晶顯示 器（LCD)或電漿顯不器（PDP)等的平板顯示器的製造過程 中，用於包括黏著保持CF玻璃或TFT玻璃等的玻璃製基板 或合成樹脂製基板而貼合的基板貼合機的基板組裝裝置或 搬送基板的基板搬送裝置等。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding structure which is, for example, in the manufacture of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP). A substrate assembly device for a substrate bonding machine or a substrate transfer device for transferring a substrate, which includes a glass substrate or a synthetic resin substrate adhered to a CF glass or a TFT glass.
詳細係關於-種將基板對保持面在分散的複數個部位承 載面’而-面確保平坦度一面保持之基板保持構造。 【先前技術】 以往，作爲這種基板保持構造，有在加壓板和桌子保持 面上分別各設置複數個開口，在這些開口内分別具備旋轉 用促動器和上下驅動用促動器，並在從每個旋轉用促動器 延伸的旋轉軸的前端上安裝點著構件，在開口内藉由上下 驅動用促動H的作動移動各㈣構件而使其露出，並接觸 基板而黏著保持’維持該保持狀態下-面定位一面進行站 使黏著構件後退到各開口㈣，—面對基板面藉由旋 器使其後退，從基㈣下❹上下驅動用促動 υ。 黏者構件者（例如參照專利文獻 ::文特開2齡2735°8號公報(第3-5頁、圖Μ 接觸2 Γ以往的基板保持構造，將複數個黏著構件 接觸基板-面以平坦狀承載面 板的貼合，作是自保持，藉此進行2個基 疋在e亥承载面的保持面側所要求的平面度爲 】06983.doc 1317353 mm的大型基板也在土數十pm的範 例如即使一邊超過1 〇〇〇 圍内。 對此，作爲承載面的黏著構件的材料，爲了實行確切的 黏著’主要使㈣膠之類的彈性材料，但是該橡膠尺寸精 度不明確，為±數百μηι。Specifically, a substrate holding structure in which a substrate is placed on a plurality of portions on which the holding surface is dispersed, and the surface is held flat is ensured. [Prior Art] Conventionally, as such a substrate holding structure, a plurality of openings are provided on each of the pressure plate and the table holding surface, and a rotation actuator and an up-and-down driving actuator are provided in each of the openings. A point member is attached to the front end of the rotating shaft extending from each of the rotation actuators, and each of the (four) members is moved by the operation of the vertical driving actuation H in the opening to be exposed, and is adhered to the substrate to be adhered and held. While maintaining the holding state, the surface is positioned to retract the adhesive member to each of the openings (4), and the substrate surface is retracted by the spinner to drive the upper and lower driving actuators from the base (four). For example, refer to the patent document: wen wen 2nd 2735°8 (page 3-5, Μ contact 2 Γ conventional substrate holding structure, a plurality of adhesive members are in contact with the substrate-surface to be flat The bonding of the load-bearing panel is self-retaining, whereby the large-scale substrate required for the two bases on the holding surface side of the e-hai bearing surface is 06083.doc 1317353 mm, and the large substrate is also tens of pm. For example, even if one side exceeds 1 〇〇〇 circumference, the material of the adhesive member as the bearing surface is an elastic material such as (4) glue for the purpose of performing the exact adhesion, but the dimensional accuracy of the rubber is not clear. Hundreds of μηι.
因此’作爲承載面的黏著構件的材料使用橡膠時，面承 載基板的保持面側中，只有各橡膠的配置部分成爲數百 _凹凸，不能達成所要求的平面度（士數十㈣），其結果， 存在不能進行高精度基板貼合的問題。 而士 ’有時候厚度薄的㈣構件不與基板接觸，因此存 在黏著力不夠而基板位置偏移或落下的憂慮。 【發明内容】 本發明中請求们的發明，其目的在於：作爲彈性材料 即使使用橡膠也達成所要求的保持面側的平面度。 請，項2的發明除了請求項1的發明的目的外，其目的在 於.提高面承載板的縱向彈性變形的模仿性。 請求項3的發明除了請求項_的發明的目的外，其目 的在於：確切地防止黏著力不夠而基板位置偏移或落下。 爲了達成上述目的，本發明中請求項丨的發明，其特徵 在於：在保持面上分散凹設複數個空隙部，將這些空隙部 的開口分則可彈性變形的固定板龍，在各ϋ定板的i ，中央，以朝向基板突出之方式安裝比上述空隙部的開口 U的由彈性材料構成的面承載板，將該固定板及面承載 板體化，使這些分散的面承載板分別抵接在基板而一面 106983.doc 1317353 以平坦狀承載面—面保持’同時利用上述空隙部作爲被一 體化的固定板及面承載板的彈性變形的放出空間。 請求項2的發明，其特徵在於：在請求項！的發明的構成 加上以下構成：在上述固定板中穿設貫通孔，從該貫通孔 的内部沿著上述固定板的至少基板側表面一體形成面承載 板’使該面承載板的基板側層積部的壓縮變形通過上述貫 通孔游動到相反側。 請求項3的發明除了請求項！或2的發明的目的外，其目 的在於.確切地防止黏著力不夠而基板位置偏移或落下。 本發明中請求項1的發明’係在保持面上分散凹設複數 個空隙部，將這些空隙部的開口分別用固定板覆蓋，在各 固定板的大致中央’以朝向基板突出之方式安裝比上述空 隙部的一還小的由彈性材料構成的面承載板，使這些兩 者-體化’藉由使如此分散配置的面承載板分別抵接在基 板而面以平坦狀承載面一面保持’在由彈性材料構成的 面承載板的厚度尺寸上有偏差時，隨著厚度尺寸大的面承 载板與基板抵接而其固定板或該㈣載板朝向空隙部彈性 變形’將該彈性變形放出到空隙部，ϋ此厚度尺寸大的面 承載板沈入空隙部側，而與其他的面承载板被平坦化。 因此，作爲彈性材料即使使用橡膠也能達成所要求的保 持面側的平面度。 其結果，面承載基板的保持 口Ρ刀/又有成爲數百μη的凹凸 合。 面側中， 而可以 只有各橡膠的配置 進行高精度基板貼 106983.doc 1317353 請求項2的發明，除了請求項丨的發明的效果外，係在固 定板中穿設貫通孔，從該貫通孔的内部沿著上述固定板的 至少與基板相對面的表面上形成面承載板，藉此在面承載 板的基板側層積部的厚度尺寸上有偏差時，隨著厚度尺寸 大的面承載板的基板側層積部與基板抵接，該面承載板的 基板側層積部本身壓縮變形，通過貫通孔游動到相反側， 藉此厚度尺寸大的面承載板的基板側層積部沈入空隙部 側，而與其他的面承載板的基板側層積部被平坦化。 因此，可以提高面承載板的縱向彈性變形的模仿性。 其結果，可以更加確切地達成所要求的保持面側的平面 度’而且可以進行高精度基板貼合。 而且，由於從貫通孔的内部沿著固定板的至少基板側表 面一體形成面承載板，所以可以防止對固定板的面承載板 的位置偏移或剝落等，同時這些固定板及面承載板處理上 也容易。 β求項3的發明，除了請求項丨或2的發明的效果外，係 猎由在面承載板的表面上設置黏著部，對基板確切地接觸 並黏著保持這些黏著部。 因此，可以確切地防止黏著力不夠而基板位置偏移或落 下。 ’ 【實施方式】 表不本發明的基板保持構造Α配備於黏著保持液晶顯示 器(LCD)面板等的玻璃基板而貼合的基板貼合裝置的情 況。 I06983.doc 1317353 該基板貼合機如圖1〜圖6所示，係在與上下配置的保 板B、C平行相對面的保持面卜i上分別保持2個破蹲製基 板D、D，在該等周圍區劃形成的密閉空間s内達到特定的 真空度後，將上下保持板B、c相對地向χγθ方向（水平方 向)調整移動’進行基板D…彼此的對位。之後，從上保 ，板B㈣持面1強制剝離上基板D而向下基板上的環狀黏 者劑（密封材）瞬間壓接，藉此密封兩者間並重合後，利用 在兩基板D、D内外產生的氣壓差將兩基板D、D之間加壓 至特定的間隙。Therefore, when rubber is used as the material of the adhesive member as the load-bearing surface, only the arrangement portion of each rubber in the holding surface side of the surface-bearing substrate becomes hundreds of irregularities, and the required flatness (ten number (four)) cannot be achieved. As a result, there is a problem that high-precision substrate bonding cannot be performed. However, sometimes the thin (4) member does not come into contact with the substrate, so there is a concern that the adhesion is insufficient and the substrate position is shifted or dropped. SUMMARY OF THE INVENTION The invention of the present invention has an object to achieve a desired flatness of a holding surface side even when rubber is used as an elastic material. The invention of item 2, in addition to the object of the invention of claim 1, is intended to improve the imitation of the longitudinal elastic deformation of the surface bearing plate. The invention of claim 3 has the object of specifically preventing the adhesion from being insufficient and the substrate position being shifted or falling, in addition to the object of the invention of the claim. In order to achieve the above object, the invention of claim 1 is characterized in that a plurality of void portions are dispersed and recessed on the holding surface, and the openings of the gap portions are elastically deformable. A surface bearing plate made of an elastic material than the opening U of the gap portion is attached to the center of the plate so as to protrude toward the substrate, and the fixed plate and the surface bearing plate are formed, and the dispersed surface bearing plates are respectively abutted. The surface of the substrate is connected to the substrate 106983.doc 1317353 in a flat shape, and the gap portion is used as the release space for the elastic deformation of the integrated fixing plate and the surface carrier plate. The invention of claim 2 is characterized by: in the request item! According to a configuration of the invention, a through hole is bored in the fixing plate, and a surface carrier plate is integrally formed from at least a substrate side surface of the fixing plate from the inside of the through hole to form a substrate side layer of the surface bearing plate The compression deformation of the product portion swims to the opposite side through the through hole. The invention of claim 3 is in addition to the request item! In addition to the object of the invention of 2 or 2, the object is to prevent the adhesive force from being insufficient and the substrate position to be displaced or dropped. According to the invention of claim 1, the plurality of void portions are dispersed and recessed on the holding surface, and the openings of the gap portions are covered by the fixing plates, and the mounting is performed so as to protrude toward the substrate at substantially the center of each of the fixing plates. A small surface-bearing plate made of an elastic material in the gap portion is formed such that the surface-bearing plates thus dispersed are respectively abutted on the substrate and held on the flat bearing surface side. When there is a deviation in the thickness dimension of the surface-bearing plate made of an elastic material, the surface-bearing plate having a large thickness is abutted against the substrate, and the fixing plate or the (four) carrier plate is elastically deformed toward the gap portion to release the elastic deformation. To the gap portion, the surface carrying sheet having a large thickness is sunk to the side of the gap portion, and is flattened with the other surface bearing sheets. Therefore, even if rubber is used as the elastic material, the flatness of the desired holding surface side can be achieved. As a result, the holding boring tool of the surface-bearing substrate has an unevenness of several hundred μη. In the surface side, the high-precision substrate paste 106983.doc 1317353 can be applied only to the arrangement of the respective rubbers. In addition to the effect of the invention of claim 丨, a through hole is bored in the fixing plate from the through hole. The inner surface of the fixing plate is formed with a surface bearing plate along at least the surface opposite to the substrate, whereby when the thickness of the substrate side laminated portion of the surface bearing plate is deviated, the surface bearing plate having a large thickness The substrate-side laminated portion is in contact with the substrate, and the substrate-side laminated portion of the surface-bearing plate is compressed and deformed by itself, and is moved to the opposite side through the through-hole, whereby the substrate-side layered portion of the surface-bearing plate having a large thickness is sunk. The side of the gap portion is formed, and the substrate side laminated portion of the other surface carrying sheet is flattened. Therefore, the imitation of the longitudinal elastic deformation of the surface bearing plate can be improved. As a result, the desired flatness on the holding surface side can be more accurately achieved, and high-precision substrate bonding can be performed. Further, since the surface bearing plate is integrally formed from the inside of the through hole along at least the substrate side surface of the fixing plate, positional displacement or peeling of the surface bearing plate of the fixing plate can be prevented, and at the same time, these fixing plates and the surface bearing plate are processed. It is also easy. According to the invention of the invention of claim 3, in addition to the effect of the invention of claim 2 or 2, the adhesion is provided by the surface of the surface-bearing plate, and the adhesive portion is surely contacted and adhered to the substrate. Therefore, it is possible to surely prevent the adhesion from being insufficient and the substrate position to be shifted or dropped. [Embodiment] The substrate holding structure of the present invention is not limited to the case of a substrate bonding apparatus in which a glass substrate such as a liquid crystal display (LCD) panel is adhered and adhered. As shown in FIG. 1 to FIG. 6 , the substrate bonding machine holds two broken substrates D and D on the holding surfaces of the parallel faces of the protective plates B and C disposed above and below. After a certain degree of vacuum is reached in the sealed space s formed by the surrounding sections, the upper and lower holding plates B and c are relatively moved in the χγθ direction (horizontal direction) to align the substrates D.... After that, from the upper protection, the plate B (four) holding surface 1 forcibly peels off the upper substrate D and the annular adhesive (sealing material) on the lower substrate is momentarily crimped, thereby sealing the two and overlapping them, and then using the two substrates D The air pressure difference generated inside and outside D presses the two substrates D and D to a specific gap.
、”田σ兒明，則上下保持板B、c被升降機構（未圓示）向Z 方向（上下方向）相對地可移動地支撐，將這些上下保持板 B C向上下方向隔開的狀態下，在各個保持面丨、丨上設 土板D D後’藉由s亥升降機構的動作使上下保持板B、 C接近而區劃形成密閉空間$。 而且，從該密閉空間s藉由吸氣機構（未圖示）的動作， 抽出空氣達到特定的真空度時，藉由水平移動機構（未圖 不）的動作’使上下保持板B、c的任—方對另—方向謂 方向調整移動’藉此作爲被該等保持的基板D、D彼此的 對位（對準），順次進行粗對位和微對位。 這些對位結束並重合上下基板D、D後，藉由在密閉空 間S内供給空氣或氮，使該密閉空間8内的氣氛恢復大氣 屋’而被兩基板D、D内外產.生的氣壓差均等加壓，在液 晶被封入的狀態下壓壞至特定間隙而完成產品。 而且，在上下保持板B、C的基板側的保^面卜！上分 106983.doc 317353 二=彈性材料構成的複數個面承載部，使這些面承载 二：在上下基板D、D而—面以平坦狀承載面一面裝： 自如地保持，則可Y剩_ "保持面1防止基板D的背面D1向 位置偏移(橫移）’同時將這些面承載部的表面用 __成，則可以黏著保持基板De卩的表面用 但疋’作爲上述面承載部的彈性材料使用橡膠材 由於該橡膠的尺寸精度爲 f 〇 m J頂度爲±數百Pm，所以保持面丨整體中In the case where the upper and lower holding plates B and c are relatively movably supported in the Z direction (up and down direction) by the elevating mechanism (not shown), the upper and lower holding plates BC are spaced upward and downward. After the earth plate DD is placed on each of the holding surfaces and the sills, the upper and lower holding plates B and C are brought close to each other to form a sealed space by the operation of the shovel lifting mechanism. Further, the suction space s is sucked by the suction mechanism. (Unillustrated) When the extracted air reaches a certain degree of vacuum, the movement of the horizontal movement mechanism (not shown) causes the upper and lower holding plates B and c to move in the direction of the other direction. Thereby, the alignment (alignment) of the substrates D and D held by the substrates is sequentially performed, and the coarse alignment and the micro alignment are sequentially performed. After the alignment ends and the upper and lower substrates D and D are overlapped, the sealed space S is used. Air or nitrogen is supplied to the atmosphere, and the atmosphere in the sealed space 8 is restored to the atmosphere. The pressure difference between the inside and the outside of the two substrates D and D is uniformly pressurized, and the liquid crystal is sealed and collapsed to a specific gap. Product. Moreover, keep the plates B and C up and down. The surface of the substrate is protected by the surface of the substrate. The upper surface is 106983.doc 317353. The multiple surface bearing portions of the elastic material are placed on the upper and lower substrates D and D. If it is freely held, the remaining surface _ " holding surface 1 prevents the back surface D1 of the substrate D from being displaced (transversely shifted)' while the surface of these surface bearing portions is formed by __, and the substrate De 卩 can be adhered The rubber material used as the elastic material of the surface bearing portion is used for the surface. Since the dimensional accuracy of the rubber is f 〇m J, the apex is ± hundreds of Pm, so the entire surface is maintained.
裝置的保持板Β、==μ…作爲基板貼合 c的保持面1不能達成所要求的平面度（+ 數十μηι)。 因此，爲了解決這種問題， 基板側的保持面1、1的任何一 保持構造Α。 至少在上下保持板B、C的 方或雙方具備本發明的基板 =务明的基板保持構造A如圖i及圖2所示，在與基板〇 :背面D1相對面的保持面!上分散凹設複數個空隙部2，將The holding plate 1 of the apparatus, ==μ... as the holding surface 1 of the substrate bonding c cannot achieve the required flatness (+ tens of μηι). Therefore, in order to solve such a problem, any one of the holding faces 1 and 1 on the substrate side is held. At least one or both of the upper and lower holding plates B and C are provided with the substrate of the present invention. The substrate holding structure A of the present invention is dispersed on the holding surface of the substrate 〇: the back surface D1 as shown in FIGS. Set a plurality of gaps 2, which will
這些空隙部2的開口分別用例如由不銹鋼或其以外的金屬 等的可彈性變形的材料或難以彈性變形的材料構成的固定 板3覆蓋，在各個固定板3的大致中央，以朝向基板d的背 面⑴突出之方式安裝比上述空隙部2的開口面積還小且由 橡膠或類似於此的彈性材料形成的面承載板4，藉此使這 些固定板3及面承載板4一體化。 這一工隙。卩2、固定板3及面承載板4被單元化，對上述 保持面1每相等間隔分散配置多數個單元U，將各單元⑽ 面承載板4分別面接觸基板D的背面D1而-面以平坦狀承 106983.doc 1317353 载面一面保持，同時利用上述空隙部2作爲被一體化的固 尺板3及面承載板4彈性變形時的放出空間。 舉其具體例，對χγ方向尺寸例如爲150〇xl8〇〇 mm的保 持面1，將上述單元U以約100 mm程度的間距配置約2〇〇組 程度。 以下，根據附圖說明本發明的各實施例。 實施例1 本實施例1如圖1(a)及（b)所示，係將空隙部2對上述保持 面^凹設爲圓板狀’用可彈性變形的比其大徑的圓板狀的 固定板3以覆蓋空隙部2的整體之方式配置，同時，將其周 緣部對保持面1用螺絲等安裝，在該固定板3的大致中央， 用黏者劑等—體固定比上述空隙部2的開口面積還小的形 狀的橡膠製的面承載板4,使這些面承載板4分別 抵接在基板D而一面以平坦狀承載面一面保持。 而且，在對保持面！分散配置由這種空隙部2、固定… 的的狀態下，其中幾個面承載板4 ，左;他的面承載板4的厚度尺寸還厚時，如圖 丁 ^著該厚度尺寸大的面承載板4,與基板D的背 D1抵接，藉由φ 7、丞板υ的责面 該彈性變形放板3朝向空隙部2彈性變形，將 十… 到空隙部2，藉此厚度尺寸大的面承載板4, 沈入空隙部2伽工t 叫5戰板4 化。 而與其他的單元U的面承載板4被平坦 數百爲面承載板4的材料，即使使用其尺寸精产爲+ 數百μιη的橡膠，、 』谓度4士 Τ以達成所要求的保持面1的平面度、 106983.doc 1317353 數十μηι ’其結果可以進 咬仃阿精度基板貼合 實施例2 本實施例2如圖2(a)〜(Ή μ - 狀凹設U部2,藉此用大述保持面1以矩形板 芸”"2之方^署的矩形板狀的固定板3以部分覆 二：方式配置’同時對保持面工用螺絲等安裝其兩 4 在該固定板3的大致中 中央，用黏者劑等一體固定比 述工隙部2的開口面積還小 ^ 還小的形成為矩形板狀的橡膠製 的面承載板4之構成不同於μ、+. _ Π於上述圖1所示的實施例1，其以 外的構成與實施例1同樣。 因此’圖2所不的實施例2也可以獲得與上述實施例^同 樣的作用效果。 實施例3 本實施例3如圖3(a)〜⑷所示，將凹設於上述保持面^ 的空隙部2用由難以彈性變形的材料構成的固定板3覆蓋， 在-亥固疋板3上向其厚度方向每適當間隔穿設複數個貫通 孔3a彳之&些貝通孔3a的内部沿著上述固定板3的至少基 板側表面一體形成彈性材料（橡膠）製的面承載板4,同時^ 該面承載板4的基板側層積部（表面側層積部）“的壓縮變 形通過上述貝通孔3 a向相反側4b游動（流動）而放出到空隙 部2之構成不同於上述圖丨所示的實施例丨或圖2所示的實施 例2 ’其以外的構成與實施例1或實施例2同樣。 在圖示例中，表示將上述空隙部2、固定板3及面承载板 4形成爲與上述圖〗所示的實施例1同樣的圓板狀，同時作 爲貝通孔3a穿設圓孔，通過這些貫通孔3a沿著該固定板3 I06983.doc 1317353 的正反兩面一體成形，藉此同時形成基板側層積部4a和背 面層積部仆的情況。 作爲其以外的例雖然未圖示，但是形成與上述圖2所示 的實施例2同樣的矩形板狀，或作爲貫通孔3&，穿設例如 角孔等圓孔以外的形狀的孔也可以。 而且在將由這種空隙部2、固定板3及面承載板4構成 的單7G U分散配置在保持面丨的狀態下，可以考慮其中幾個 面承載板4的基板侧層積部4a的厚度尺寸比其他面承載板4 的基板側層積部4a的厚度尺寸厚的情況。 此時，如圖3(c)所示，若該厚度尺寸大的面承載板4，的 基板側層積部4a'與基板D的背面D1抵接，則該面承載板4, 2基板側層積部4a，本身壓縮變形，其彈性材料（橡膠）通過 貫通孔3a游動（流動）到相反側仆，而將該壓縮變形放出到 工隙部2，藉此厚度尺寸大的面承載板4，的基板側層積部 牝’沈入空隙部2側，而與其他單元1;的面承載板4的基板側 層積部4a被平坦化。 因此，圖3所示的實施例3也可以獲得與上述實施例}或 實施例2同樣的作用效果，加之比使如實施例】的固定板3 彈性變形而與其他面承載板4平坦化者，彈性材料（橡膠）製 的面承載板4的基板側層積部心|即使與基板d的抵接力小 也合易彈性變形’因此提高面承載板4的縱向(Z方向)彈性 變形的模仿性’而爲了平坦化的動作順利並且確切，可以 更加確切地達成所要求的保持面1的平面《，其、结果有可 以進行更加高精度基板貼合的優點。 106983.doc -13- 1317353 而且，由於從貫通孔3a的内部沿著固定板3的至少基板 側表面一體形成面承載板4，因此與將面承載板4固定在固 疋板3而一體化的實施例丨相比，可以防止對固定板3的面 承載板4的位置偏移或剝落等，同時這些固定板3及面承載 板4的處理也容易，尤其是如圖示例，通過貫通孔h沿著 固定板3的正反兩面一體形成面承載板4時，也有更加提高 的優點。 而且，與將面承載板4固定在固定板3而一體化的實施例 1相比，可以將形成於固定板3的基板側表面的面承載板4 的基板側層積部4a的厚度形成得薄，同時該基板側層積部 4a的壓縮變形時不向水平方向（χγθ)方向膨脹而游動（流 動）到相反側4b，因此也有相互接近而配備面承載板4時不 帶來壞影響的優點。 實施例4 本實施例4如圖4(a)(b)所示，爲了使上述基板〇可黏著保 持，因此在以圓板狀或矩形板狀形成的橡膠製面承載板4 的表面設置黏著部4c，同時作爲該黏著部4c和基板d的剝 離機構配設提升銷5，藉由該提升銷5的延伸移動，將基板 D的背面D1從該黏著部4c強製壓剝之構成不同於上述圖i 所示的實施例1或圖2所示的實施例2或圖3所示的實施例 3 ’其以外的構成與實施例1或實施例2或實施例3同樣。 上述黏著部4c與後述的提升銷5接近配置爲宜，在圖示 例中係以沿著後述的通孔5a的周圍成爲環狀之方式部分地 配設。 106983.doc -14- 1317353 作爲該配設方法，表面處理由橡膠材料構成的面承載板 4或進行與其類似的加工’藉此將黏著部4c只在其表面的 所希望的部位一體形成爲與該面承載板4的表面齊平面 狀，或一體形成。 上述提升鎖5使用於從基板搬送用機器人（未圖示）向上 下保持板B、C交接基板D的時候，穿設從上述保持面】的 二隙42遍及固定板3及面承載板4以直線狀貫通的通孔 5a，在該通孔5a的内部朝向基板D自由往復動地配設。 而且，在圖不例中，表示將上述空隙部2、固定板3及面 豕載板4形成爲與上述圖丨所示的實施例丨同樣的圓板狀的 情況。 作爲其以外例雖然未圖示，但是也可以形成與上述圖2 所不的實施例2同樣的矩形板狀，或與上述圖3所示的實施 幻3同樣，在固定板3穿設貫通孔3a ,通過該貫通孔3a沿著 肩固疋板3的正反兩面一體形成面承載板4也可以。 圖5U)(b)表示藉由具有這種構造的基板保持構造a的基 板貼合裝置貼合保持的基板D、D彼此的工序。 土 ，圖5⑷所示的例中，在下方的保持板c的台座ι&上裝 :多，上述構造的單元U’黏著保持下基板D的背面D1， 同時藉由裝入上方的保持板B的靜電吸盤6不可移動地保持 上基板D的背面d 1。 ^爲其以外的變形例，取代上方的保持板B的靜電吸盤 6’裝入多數上述構造的單元u，黏著保持上基板d的背面 106983.doc 1317353 然後，每些上下保持板B、c接近移動並在兩者之間區 劃形成密閉ms後’上下保持板B、c向χγθ方向調整移 動而進行基板D、D彼此的對位，然後如圖5〇?)所示，藉由 從上保持板B的保持面!強制剝離上基板〇並瞬間壓接到下 基板D上的環狀黏著劑(密封材)E，密封兩者間並重合，然 後用兩基板D、D内外產生的氣壓差將兩基板…D之間加 壓至特定的間隙。 因此，圖4及圖5所示的實施例4也能獲得與上述實施例】 或實施例2或實施例3同樣的作用效果，加上配借在保持面 1上的多數個黏著部4e對基板D的背面m確切地接觸下保 持板C而可以黏著保持，藉此有可以確切地防止黏著力不 夠而基板D位置偏移的優點。 實施例5 4 5如圖6(a)(b)所示’將升降單元U"作爲上述黏 二和基板D的剝離機構，該升降單元u”由對保持面岍 ^自如的台座lb和凹設於其的空隙部2、固^板3及面承載 板4構成，使該升降單元u 接近或隔離之方式向上下方:=保持面1以與基板D 設置於這些面承載板4的 如地配將包括 體藉由促動D的㈣而減板降單元『整 成不η… 而從基板〇的背面m強制壓剝之構 lilt (a^ 外的構成與貫施例4同樣。 =例中’取代裝入於圖5(a)(b)所示的實施例4的上 持板B的靜電吸盤6,將上述構造的升降單別”多數 i 06983.doc 1317353 自由往復動地裳人，其以外的構成與實施例3同樣。 作爲其他的變形例’也可以將上述構造的升降單元U"分 別在上下保持板B、c的保持面卜】的雙方多數 ^ 動地裝入。 因此，圖6所示的實施例5與上述實__^雜The openings of the gap portions 2 are respectively covered with a fixing plate 3 made of an elastically deformable material such as stainless steel or a metal other than metal or a material which is difficult to be elastically deformed, and are oriented substantially at the center of each of the fixing plates 3 toward the substrate d. The back surface (1) is protruded in such a manner that a surface carrier plate 4 which is smaller than the opening area of the above-described void portion 2 and which is formed of rubber or an elastic material similar thereto is attached, whereby the fixing plate 3 and the surface bearing plate 4 are integrated. This work gap.卩2, the fixing plate 3 and the surface carrying plate 4 are unitized, and a plurality of units U are disposed at equal intervals for the holding surface 1, and each unit (10) surface carrying plate 4 is in surface contact with the back surface D1 of the substrate D, respectively. The flat bearing 106983.doc 1317353 is held while the carrier is held, and the gap portion 2 is used as the discharge space when the integrated solid plate 3 and the surface carrier plate 4 are elastically deformed. As a specific example, for the holding surface 1 having a χ γ direction dimension of, for example, 150 〇 x 18 μm, the unit U is disposed at a pitch of about 100 mm to about 2 〇〇. Hereinafter, each embodiment of the present invention will be described with reference to the drawings. [Embodiment 1] As shown in Figs. 1 (a) and (b), the first embodiment is a disk-shaped shape in which the gap portion 2 is formed in a disk shape with respect to the holding surface. The fixing plate 3 is disposed so as to cover the entire gap portion 2, and the peripheral portion thereof is attached to the holding surface 1 by screws or the like, and the gap is fixed at the substantially center of the fixing plate 3 by an adhesive or the like. The rubber surface carrier 4 having a small opening area of the portion 2 is placed on the substrate D while being held on the flat substrate. And, in the face! In the state in which the dispersion portion is fixed by the gap portion 2, a plurality of the surface bearing plates 4 and the left side; when the thickness of the surface bearing plate 4 is thick, the surface having a large thickness is as shown in the figure. The carrier plate 4 abuts against the back D1 of the substrate D, and the elastic deformation plate 3 is elastically deformed toward the gap portion 2 by the surface of the φ 7 and the 丞 plate ,, and the thickness is large. The surface carrying plate 4, sinking into the gap portion 2, is called the 5 battle plate. On the other hand, the surface carrying plate 4 of the other unit U is flattened by a plurality of materials for the surface carrying plate 4, even if the rubber is manufactured with a size of +100 μm, and the degree is 4 angstroms to achieve the required retention. The flatness of the surface 1 , 106983.doc 1317353 tens of μηι 'the result can be bitten into the A precision substrate bonding example 2 This embodiment 2 is as shown in Fig. 2 (a) ~ (Ή μ - concave U part 2, By using the rectangular plate-shaped fixing plate 3 of the rectangular plate 芸""2, the rectangular plate-shaped fixing plate 3 is arranged in a partial cover two manner, and the two are mounted on the holding surface screws or the like. The central portion of the fixing plate 3 is integrally fixed with an adhesive or the like, and the opening area of the gap portion 2 is smaller than that of the gap portion 2, and the rubber surface carrier plate 4 formed in a rectangular plate shape is different from μ and +. The configuration of the first embodiment shown in Fig. 1 is the same as that of the first embodiment. Therefore, the same effects as those of the above-described embodiment can be obtained in the second embodiment of Fig. 2 . In the third embodiment, as shown in Figs. 3(a) to (4), the gap portion 2 recessed in the holding surface ^ is difficult to be elastically deformed. The fixing plate 3 made of a material is covered, and a plurality of through holes 3a are formed in the thickness direction of the - - - - - - - - - - - - - - - - - - - The side surface integrally forms the surface bearing plate 4 made of an elastic material (rubber), and at the same time, the compression deformation of the substrate side laminated portion (surface side laminated portion) of the surface bearing plate 4 passes through the above-mentioned beacon hole 3 a to the opposite side The configuration in which 4b swims (flows) and is released to the gap portion 2 is different from that of the embodiment shown in FIG. 2 or the embodiment 2 shown in FIG. 2, and the configuration is the same as that of the first embodiment or the second embodiment. In the example of the drawing, the gap portion 2, the fixing plate 3, and the surface carrying plate 4 are formed in the same circular plate shape as that of the first embodiment shown in the above-mentioned drawings, and a round hole is bored as the through hole 3a. These through-holes 3a are integrally formed along the front and back surfaces of the fixing plate 3 I06983.doc 1317353, thereby simultaneously forming the substrate-side laminated portion 4a and the back-side layered portion. However, other examples are not shown. However, the same rectangular plate as in the second embodiment shown in Fig. 2 is formed. Or, as the through hole 3&, a hole having a shape other than a circular hole such as a corner hole may be bored. Further, the single 7G U composed of such a cavity portion 2, the fixed plate 3, and the surface carrier plate 4 is dispersed and held. In the state of the facet, it is conceivable that the thickness of the substrate-side layered portion 4a of the plurality of surface-bearing plates 4 is thicker than the thickness of the substrate-side layered portion 4a of the other surface-bearing plate 4. As shown in FIG. 3(c), when the substrate-side laminated portion 4a' of the surface carrying plate 4 having a large thickness is in contact with the back surface D1 of the substrate D, the surface-bearing plate 4, the substrate-side laminated portion 4a, The compression material itself is compressed and deformed, and the elastic material (rubber) is swung (flowed) through the through hole 3a to the opposite side, and the compression deformation is released to the working portion 2, whereby the substrate side of the surface carrying plate 4 having a large thickness is formed. The laminated portion 牝' sinks into the gap portion 2 side, and the substrate-side laminated portion 4a of the surface carrying sheet 4 of the other unit 1 is flattened. Therefore, the third embodiment shown in FIG. 3 can also obtain the same operational effects as those of the above-described embodiment or the second embodiment, and the flattening of the other surface carrier plate 4 can be achieved by elastically deforming the fixing plate 3 as in the embodiment. The substrate-side laminated core of the surface-bearing plate 4 made of an elastic material (rubber) is easily elastically deformed even if the abutting force with the substrate d is small. Therefore, the imitation of the longitudinal (Z-direction) elastic deformation of the surface bearing plate 4 is improved. In order to smoothly and accurately perform the flattening operation, the desired plane of the holding surface 1 can be more accurately achieved, and as a result, there is an advantage that a higher precision substrate bonding can be performed. Further, since the surface carrier plate 4 is integrally formed from the inside of the through hole 3a along at least the substrate side surface of the fixed plate 3, the surface carrier plate 4 is fixed to the fixed plate 3 and integrated. Compared with the embodiment, the positional displacement or peeling of the surface bearing plate 4 of the fixing plate 3 can be prevented, and the processing of the fixing plate 3 and the surface bearing plate 4 is also easy, especially as shown in the figure. When the surface carrier plate 4 is integrally formed along the front and back sides of the fixed plate 3, there is an advantage that it is further improved. Further, the thickness of the substrate-side laminated portion 4a of the surface-bearing plate 4 formed on the substrate-side surface of the fixed plate 3 can be formed as compared with the first embodiment in which the surface-bearing plate 4 is fixed to the fixed plate 3 and integrated. When the substrate side laminate portion 4a is compressed and deformed, it does not expand in the horizontal direction (χγθ) direction and swims (flows) to the opposite side 4b. Therefore, it is also close to each other and the surface carrier plate 4 is provided without adverse effects. The advantages. [Embodiment 4] In the fourth embodiment, as shown in Fig. 4 (a) and (b), in order to allow the substrate 〇 to be adhered and held, adhesion is provided on the surface of the rubber-made surface-bearing plate 4 formed in a disk shape or a rectangular plate shape. The portion 4c is provided with a lift pin 5 as a peeling mechanism of the adhesive portion 4c and the substrate d. The extension of the lift pin 5 causes the back surface D1 of the substrate D to be forcibly peeled off from the adhesive portion 4c. The configuration other than the embodiment 1 shown in Fig. 1 or the embodiment 2 shown in Fig. 2 or the embodiment 3 shown in Fig. 3 is the same as that of the first embodiment or the second embodiment or the third embodiment. The adhesive portion 4c is preferably disposed adjacent to the lift pin 5 to be described later, and is partially disposed in the illustrated example so as to be annular along the periphery of the through hole 5a to be described later. 106983.doc -14- 1317353 As the disposing method, the surface-handling plate 4 made of a rubber material is surface-treated or processed similarly', whereby the adhesive portion 4c is integrally formed only at a desired portion of the surface thereof. The surface of the surface carrying plate 4 is flush or integrally formed. When the lift lock 5 is used to transfer the substrates B and C up and down from the substrate transfer robot (not shown), the two gaps 42 from the holding surface are passed over the fixed plate 3 and the surface carrying plate 4 The through hole 5a that penetrates linearly is disposed to reciprocate toward the substrate D inside the through hole 5a. Further, in the example of the drawing, the gap portion 2, the fixing plate 3, and the gusset carrier 4 are formed into a disk shape similar to that of the embodiment 上述 shown in Fig. 。. Although not shown in the drawings, a rectangular plate shape similar to that of the second embodiment shown in FIG. 2 may be formed, or a through hole may be formed in the fixing plate 3 in the same manner as the embodiment shown in FIG. 3 described above. 3a, the surface carrying plate 4 may be integrally formed along the front and back surfaces of the shoulder fixing plate 3 through the through hole 3a. Figs. 5U) and (b) show the steps of bonding the substrates D and D held by the substrate bonding apparatus of the substrate holding structure a having such a structure. In the example shown in Fig. 5 (4), the base ι & of the lower holding plate c is mounted on the lower surface, and the unit U' of the above structure is adhered to hold the rear surface D1 of the lower substrate D while being loaded by the upper holding plate B. The electrostatic chuck 6 is immovably held on the back surface d 1 of the upper substrate D. For the other modification, the electrostatic chuck 6' of the upper holding plate B is placed in the unit u of the above-mentioned structure, and the back surface of the upper substrate d is adhered to the back surface 106983.doc 1317353. Then, the upper and lower holding plates B and c are close to each other. After moving and dividing the gap between the two to form a closed ms, the upper and lower holding plates B and c are moved in the direction of χγθ to perform alignment of the substrates D and D, and then, as shown in FIG. 5A, The holding surface of the plate B is forcibly peeled off the upper substrate 〇 and is instantaneously pressed against the annular adhesive (sealing material) E on the lower substrate D, sealing the two and overlapping each other, and then using the pressure difference between the inside and the outside of the two substrates D, D Pressurize the two substrates...D to a specific gap. Therefore, in the fourth embodiment shown in Figs. 4 and 5, the same effects as those of the above-described embodiment or the second embodiment or the third embodiment can be obtained, and a plurality of adhesive portions 4e paired on the holding surface 1 are added. The back surface m of the substrate D is in contact with the lower holding plate C and can be adhered and held, whereby the advantage that the adhesion of the substrate D is not sufficiently prevented and the position of the substrate D is shifted can be surely prevented. Embodiment 5 4 5 As shown in Fig. 6 (a) and (b), 'the lifting unit U" is used as the peeling mechanism of the above-mentioned two sheets and the substrate D, and the lifting unit u" is free from the pedestal lb and the concave surface of the holding surface. The gap portion 2, the fixing plate 3 and the surface bearing plate 4 provided therein are configured such that the lifting unit u approaches or is isolated upward and downward: the holding surface 1 is disposed on the surface of the surface bearing plate 4 with the substrate D. The configuration is the same as that of the fourth embodiment by the method of forcibly peeling off the back surface m of the substrate 藉 by the (4) of the actuator D. The 'supplementary cup 6 loaded in the upper holding plate B of the embodiment 4 shown in Fig. 5 (a) and (b) is replaced by a plurality of i 06983.doc 1317353 The other configuration is the same as that of the third embodiment. As another modification, the lifting unit U" of the above-described structure may be mounted in a plurality of positions on the holding surfaces of the upper and lower holding plates B and c, respectively. , the embodiment 5 shown in FIG. 6 and the above-mentioned real __^
面1、1的雙方分別配備的多數黏著部仏對上下基板D、D 的背面D1、D1確切地接觸上下保持板B、c並可以黏著保The plurality of adhesive portions provided on both sides of the faces 1 and 1 respectively contact the upper and lower holding plates B and C of the upper and lower substrates D and D, and can adhere to the upper and lower holding plates B and c.
持，藉此獲得可以綠切地防止黏著力不夠而基板D的位置 偏移或落下的作用效果。 而且另加上在上下保持面B、C的保持面丨、丨雙方，作 爲各個面承載板4的材料，即使使用其尺寸精度爲土數百 μηι的橡膠，也可以達成所要求的保持面1的平面度、數十 μηι，其結果有可以獲得能高精度基板貼合的作用效果的 優點。 尚且本發明表示了基板保持板構造Α配備於黏著保持 液晶顯示器（LCD)面板等的玻璃基板而貼合的基板貼合裂 置的情況，但並不限定於此’配備在該基板貼合裝置以外 的基板組裝裝置或搬送基板的基.板搬送裝置，或黏著保持 LCD面板用玻璃基板以外的基板也可以。 而且’說明了在真空中貼合上下基板D、D的基板貼合 裳置’但並不限定於此，也可以是在大氣中貼合基板D、 D的基板貼合裝置，此時也能獲得與上述真空貼合裝置同 樣的作用效果。 【圖式簡單說明】 K)6983.doc -17- 1317353 圖（a)爲表示本發明的基板 面圖，⑼爲縱斷正面圖，⑷=構造的實施例1的部分平 面圖。 v )爲表示彈性變形時的縱斷正 圖2(a)爲表示本發明的甚 板保持構造的實施例2的部分平 113圖（b)爲縱斷正面圖，s生_ 面圖。 1 )爲表不彈性變形時的縱斷正 圖3(a)爲表示本發明的基板伴捭^奢A μ 面圖，极保持構以的實施例3的部分平 面圖。 為表不弹性變形時的縱斷正 圖4(a)爲表示本發明的基板保持構造的實施例4 面圖，（b)爲縱斷正面圖。 ,爲將實施例4的基板保持構造裝入基板貼合裝置的縮 小縱斷正面圖 、” M 肘具動作工序表示於（a)(b)。 =6爲表不將本發明的基板保持構造裝入基板貼合裝置 的實施例5的縮小縱斷正面圖，將其動作表示於工序 (a)(b) 〇 【主要元件符號說明】 1 保持板 la，lb 2 3 3a 4 4' 台座 空隙部 固定板 貫通孔 面承載板 厚面承載板 106983.doc -18* 1317353By this, it is possible to obtain an effect of preventing the adhesive force from being insufficiently cut and the position of the substrate D being shifted or dropped. Further, in addition to the holding surfaces 丨 and 丨 of the upper and lower holding faces B and C, as the material of each of the surface bearing plates 4, the required holding surface 1 can be achieved even if a rubber having a dimensional accuracy of several hundred μηη is used. The flatness and the tens of μηι result in the advantage that the effect of the high-precision substrate bonding can be obtained. Further, the present invention shows a substrate holding plate structure, which is provided in a case where a substrate to which a liquid crystal display (LCD) panel or the like is adhered and adhered is bonded and laminated, but the present invention is not limited thereto. Other than the substrate assembly device or the substrate transfer device for transporting the substrate, or a substrate other than the glass substrate for the LCD panel. Further, 'the substrate bonding of the upper and lower substrates D and D in a vacuum is described, but the substrate bonding device is not limited thereto, and the substrate bonding device for bonding the substrates D and D in the air may be used. The same effects as the above vacuum bonding apparatus were obtained. BRIEF DESCRIPTION OF THE DRAWINGS K) 6983.doc -17- 1317353 (a) is a plan view showing a substrate of the present invention, (9) is a longitudinal front view, and (4) is a partial plan view of the first embodiment. v) is a longitudinal sectional view showing elastic deformation. Fig. 2(a) is a partial plan view showing the second embodiment of the present invention. Fig. 2(b) is a longitudinal front view, and is a plan view. 1) Longitudinal fracture when the sheet is not elastically deformed. Fig. 3(a) is a partial plan view showing a third embodiment of the substrate of the present invention. Fig. 4(a) is a plan view showing a fourth embodiment of the substrate holding structure of the present invention, and Fig. 4(b) is a vertical front view. The front view of the reduced longitudinal direction in which the substrate holding structure of the fourth embodiment is incorporated in the substrate bonding apparatus, and the "M-clamp operation step are shown in (a) and (b). = 6 indicates that the substrate holding structure of the present invention is not shown. The front view of the reduced longitudinal direction of the fifth embodiment of the substrate bonding apparatus is shown, and the operation is shown in the step (a) (b). [Main element symbol description] 1 holding plate la, lb 2 3 3a 4 4' pedestal gap Fixed plate through hole surface bearing plate thick surface bearing plate 106983.doc -18* 1317353
4a 4b 4c 5 5 a 6 7 A B C Cl D D1 E S u U" 基板側層積部（表面側層積部） 相反側（背面側層積部） 黏著部 提升銷 通孔 靜電吸盤 促動器 基板保持構造 上方的保持板 下方的保持板 台座 基板 背面 環狀黏著劑（密封材） 密閉空間4a 4b 4c 5 5 a 6 7 ABC Cl D D1 ES u U" Substrate side laminate (surface side laminate) Opposite side (back side laminate) Adhesive lift pin through hole Electrostatic chuck actuator substrate retention The annular adhesive (sealing material) on the back side of the holding plate pedestal under the retaining plate above the structure
XiV —· 早兀 升降單元 106983.doc •19-XiV —· 早兀 Lifting unit 106983.doc •19-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/017832 WO2007036996A1 (en) | 2005-09-28 | 2005-09-28 | Substrate holding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200712020A TW200712020A (en) | 2007-04-01 |
| TWI317353B true TWI317353B (en) | 2009-11-21 |
Family
ID=37899435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095102289A TW200712020A (en) | 2005-09-28 | 2006-01-20 | Substrate holding structure |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3943590B2 (en) |
| KR (1) | KR101038026B1 (en) |
| CN (1) | CN100533513C (en) |
| TW (1) | TW200712020A (en) |
| WO (1) | WO2007036996A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9023611B2 (en) | 2009-02-06 | 2015-05-05 | Beth Israel Deaconess Medical Center | Charged-balanced imaging agents |
| US10493169B2 (en) | 2009-02-06 | 2019-12-03 | Beth Israel Deaconess Medical Center | Use of charge-balanced imaging agents for determining renal function |
| EP2490073B1 (en) | 2011-02-18 | 2015-09-23 | ASML Netherlands BV | Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder |
| JP5422767B1 (en) * | 2013-05-09 | 2014-02-19 | 信越エンジニアリング株式会社 | Bonding separation method and separation apparatus |
| TWI671721B (en) * | 2014-09-15 | 2019-09-11 | 比利時商巴而可公司 | Display tile, frame for display tile and method of fabricating the same |
| EP3482415A4 (en) * | 2016-07-09 | 2020-02-26 | Applied Materials, Inc. | Substrate carrier |
| TWI642999B (en) * | 2017-07-07 | 2018-12-01 | 友達光電股份有限公司 | Display module |
| CN109036147B (en) * | 2018-09-19 | 2020-05-22 | 京东方科技集团股份有限公司 | A substrate and a display panel |
| JP7057334B2 (en) * | 2019-10-29 | 2022-04-19 | キヤノントッキ株式会社 | Manufacturing method of board holding unit, board holding member, board holding device, board processing device and electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305592A (en) * | 1992-04-28 | 1993-11-19 | Sony Corp | Vacuum chuck |
| JPH09181156A (en) * | 1995-12-25 | 1997-07-11 | Sony Corp | Vacuum chuck |
| TWI266104B (en) * | 2002-03-14 | 2006-11-11 | Sharp Kk | Manufacturing method of liquid crystal display apparatus and substrate assembling apparatus |
| JP3773866B2 (en) | 2002-03-14 | 2006-05-10 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
-
2005
- 2005-09-28 JP JP2007505310A patent/JP3943590B2/en not_active Expired - Fee Related
- 2005-09-28 WO PCT/JP2005/017832 patent/WO2007036996A1/en active Application Filing
- 2005-09-28 KR KR1020077002543A patent/KR101038026B1/en not_active Expired - Fee Related
- 2005-09-28 CN CNB2005800233477A patent/CN100533513C/en not_active Expired - Fee Related
-
2006
- 2006-01-20 TW TW095102289A patent/TW200712020A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN100533513C (en) | 2009-08-26 |
| KR101038026B1 (en) | 2011-05-31 |
| CN101061528A (en) | 2007-10-24 |
| JP3943590B2 (en) | 2007-07-11 |
| JPWO2007036996A1 (en) | 2009-04-02 |
| TW200712020A (en) | 2007-04-01 |
| WO2007036996A1 (en) | 2007-04-05 |
| KR20080053245A (en) | 2008-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI317353B (en) | ||
| CN101379606B (en) | Adhesive Chuck Device | |
| CN104143499B (en) | Fitting separation method and separation device | |
| JP2008277688A (en) | Transfer apparatus and transfer method | |
| TWI625240B (en) | Laminated body manufacturing method and manufacturing device | |
| KR20150113397A (en) | Apparatus and Method of Bonding Flexible Display and Curved Cover Element | |
| TWI738888B (en) | Vacuum bonding device for bonding devices | |
| TWI659849B (en) | Peeling device and method of laminated body, and manufacturing method of electronic device | |
| CN105609447A (en) | Orderly arrangement device and orderly arrangement method | |
| TW201501935A (en) | Sticking apparatus and sticking method | |
| JP2018069702A (en) | Vacuum lamination device and jig for vacuum lamination device | |
| WO2019044530A1 (en) | Thinned plate member production method and production device | |
| JP5442171B1 (en) | Workpiece adhesive chuck device and workpiece bonding machine | |
| KR102124310B1 (en) | Sheet adhering device and adhering method | |
| KR20180111520A (en) | Dividing apparatus and dividing method of resin sheet | |
| KR102133780B1 (en) | Method for processing laminated sheet and processed laminated sheet | |
| KR101678352B1 (en) | Attaching apparatus | |
| CN104919189B (en) | Actuator and adhesive chuck device | |
| KR101340614B1 (en) | Substrate bonding apparatus | |
| JP6017131B2 (en) | Board assembly equipment | |
| JP6134228B2 (en) | Sheet sticking device and sheet sticking method | |
| WO2016024446A1 (en) | Flexographic printing plate manufacturing method and liquid crystal display element manufacturing method | |
| JP5795272B2 (en) | Method for manufacturing ceramic element | |
| KR20130003105U (en) | An improved structure of panel pressing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |