TWI393629B - Metal - resin laminate - Google Patents

Metal - resin laminate Download PDF

Info

Publication number: TWI393629B
Authority: TW; Taiwan
Prior art keywords: formula; repeating unit; thermoplastic polyimide; carbon atoms; laminate according
Prior art date: 2007-04-18

Application number

TW097113987A

Other languages

English (en)

Chinese (zh)

Other versions

TW200909202A (en

Inventor

Takaaki Ioka

Yoshinori Ozumi

Original Assignee

Asahi Chemical Ind

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-04-18

Filing date

2008-04-17

Publication date

2013-04-21

2008-04-17 Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind

2009-03-01 Publication of TW200909202A publication Critical patent/TW200909202A/zh

2013-04-21 Application granted granted Critical

2013-04-21 Publication of TWI393629B publication Critical patent/TWI393629B/zh

Links

239000011347 resin Substances 0.000 title claims description 75
229920005989 resin Polymers 0.000 title claims description 75
229910052751 metal Inorganic materials 0.000 title claims description 64
239000002184 metal Substances 0.000 title claims description 64
229920006259 thermoplastic polyimide Polymers 0.000 claims description 124
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 82
GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 63
239000011888 foil Substances 0.000 claims description 61
230000005606 hygroscopic expansion Effects 0.000 claims description 48
125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 48
229920001169 thermoplastic Polymers 0.000 claims description 47
239000004416 thermosoftening plastic Substances 0.000 claims description 45
239000011889 copper foil Substances 0.000 claims description 41
229920001721 polyimide Polymers 0.000 claims description 32
125000004432 carbon atom Chemical group C* 0.000 claims description 29
150000004985 diamines Chemical class 0.000 claims description 24
ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 24
125000003545 alkoxy group Chemical group 0.000 claims description 16
125000000217 alkyl group Chemical group 0.000 claims description 16
239000000126 substance Substances 0.000 claims description 13
ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 10
239000001257 hydrogen Substances 0.000 claims description 10
229910052739 hydrogen Inorganic materials 0.000 claims description 10
239000002253 acid Substances 0.000 claims description 9
DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 6
WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 6
239000004305 biphenyl Substances 0.000 claims description 5
235000010290 biphenyl Nutrition 0.000 claims description 5
125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 5
VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
239000000470 constituent Substances 0.000 claims description 3
NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 2
125000004427 diamine group Chemical group 0.000 claims 1
150000000000 tetracarboxylic acids Chemical class 0.000 claims 1
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229910052802 copper Inorganic materials 0.000 description 41
239000010949 copper Substances 0.000 description 41
239000002243 precursor Substances 0.000 description 41
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XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 16
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208000028659 discharge Diseases 0.000 description 13
239000011521 glass Substances 0.000 description 13
-1 alkoxy aluminum Chemical compound 0.000 description 12
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150000008064 anhydrides Chemical class 0.000 description 7
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239000004642 Polyimide Substances 0.000 description 6
239000004809 Teflon Substances 0.000 description 6
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239000012790 adhesive layer Substances 0.000 description 6
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USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
239000007789 gas Substances 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 6
CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 6
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238000003851 corona treatment Methods 0.000 description 5
238000005530 etching Methods 0.000 description 5
150000002431 hydrogen Chemical class 0.000 description 5
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
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238000012545 processing Methods 0.000 description 5
239000010935 stainless steel Substances 0.000 description 5
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238000012360 testing method Methods 0.000 description 5
ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
CXISKMDTEFIGTG-UHFFFAOYSA-N [4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxyphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(OC=2C=CC(OC(=O)C=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)=O)=C1 CXISKMDTEFIGTG-UHFFFAOYSA-N 0.000 description 4
230000032683 aging Effects 0.000 description 4
150000001412 amines Chemical class 0.000 description 4
DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
239000000758 substrate Substances 0.000 description 4
UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 description 3
WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 3
JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 3
KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 3
WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
229920001646 UPILEX Polymers 0.000 description 3
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238000011161 development Methods 0.000 description 3
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150000002466 imines Chemical class 0.000 description 3
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VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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230000000704 physical effect Effects 0.000 description 3
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125000001424 substituent group Chemical group 0.000 description 3
230000000930 thermomechanical effect Effects 0.000 description 3
RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 2
UFFBMTHBGFGIHF-UHFFFAOYSA-N 2,6-dimethylaniline Chemical compound CC1=CC=CC(C)=C1N UFFBMTHBGFGIHF-UHFFFAOYSA-N 0.000 description 2
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KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 1
UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
238000006864 oxidative decomposition reaction Methods 0.000 description 1
BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
BUZHLYBJNNZTPL-UHFFFAOYSA-N pentane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)CC(C(O)=O)CC(C(O)=O)CC(O)=O BUZHLYBJNNZTPL-UHFFFAOYSA-N 0.000 description 1
125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
ZDMBWRVNJKHIAV-UHFFFAOYSA-N phenyl-[2-(2-phenylethynyl)phenyl]methanone Chemical compound C=1C=CC=C(C#CC=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 ZDMBWRVNJKHIAV-UHFFFAOYSA-N 0.000 description 1
UHZYTMXLRWXGPK-UHFFFAOYSA-N phosphorus pentachloride Chemical compound ClP(Cl)(Cl)(Cl)Cl UHZYTMXLRWXGPK-UHFFFAOYSA-N 0.000 description 1
DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
239000004633 polyglycolic acid Substances 0.000 description 1
229920000137 polyphosphoric acid Polymers 0.000 description 1
108010026466 polyproline Proteins 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
230000008569 process Effects 0.000 description 1
230000002250 progressing effect Effects 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
239000010453 quartz Substances 0.000 description 1
150000004060 quinone imines Chemical class 0.000 description 1
125000005920 sec-butoxy group Chemical group 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
238000005476 soldering Methods 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
238000003756 stirring Methods 0.000 description 1
150000003462 sulfoxides Chemical class 0.000 description 1
238000001308 synthesis method Methods 0.000 description 1
150000003505 terpenes Chemical class 0.000 description 1
235000007586 terpenes Nutrition 0.000 description 1
TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
239000004474 valine Substances 0.000 description 1
238000005406 washing Methods 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Laminated Bodies (AREA)
Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Manufacturing Of Printed Wiring (AREA)

TW097113987A 2007-04-18 2008-04-17 Metal - resin laminate TWI393629B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2007109623		2007-04-18
JP2007306107		2007-11-27

Publications (2)

Publication Number	Publication Date
TW200909202A TW200909202A (en)	2009-03-01
TWI393629B true TWI393629B (zh)	2013-04-21

Family

ID=39925638

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097113987A TWI393629B (zh)	2007-04-18	2008-04-17	Metal - resin laminate

Country Status (4)

Country	Link
JP (1)	JP4896219B2 (ja)
CN (1)	CN101652244B (ja)
TW (1)	TWI393629B (ja)
WO (1)	WO2008133182A1 (ja)

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JP2010221586A (ja) *	2009-03-24	2010-10-07	Asahi Kasei E-Materials Corp	金属箔ポリイミド積層体
JP2011037157A (ja) *	2009-08-12	2011-02-24	Asahi Kasei E-Materials Corp	金属箔ポリイミド積層体
JP5732740B2 (ja) *	2009-09-30	2015-06-10	大日本印刷株式会社	フレキシブルデバイス用薄膜トランジスタ基板およびフレキシブルデバイス
CN102576735B (zh) *	2009-09-30	2016-01-20	大日本印刷株式会社	挠性装置用基板、挠性装置用薄膜晶体管基板、挠性装置、薄膜元件用基板、薄膜元件、薄膜晶体管、薄膜元件用基板的制造方法、薄膜元件的制造方法及薄膜晶体管的制造方法
WO2011040440A1 (ja) *	2009-09-30	2011-04-07	大日本印刷株式会社	フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板、フレキシブルデバイス、薄膜素子用基板、薄膜素子、薄膜トランジスタ、薄膜素子用基板の製造方法、薄膜素子の製造方法および薄膜トランジスタの製造方法
JP2011138683A (ja) *	2009-12-28	2011-07-14	Dainippon Printing Co Ltd	電子素子
KR101437612B1 (ko) *	2010-12-20	2014-09-15	에스케이이노베이션 주식회사	후막 폴리이미드 연성금속적층판의 제조방법
JP5886027B2 (ja) *	2011-12-21	2016-03-16	新日鉄住金化学株式会社	両面金属張積層板およびその製造方法
CN103172883B (zh) *	2011-12-26	2016-09-28	深圳光启高等理工研究院	超材料基板加工方法
CN102573315B (zh) *	2012-01-31	2015-05-13	云南云天化股份有限公司	环氧树脂电路板的电路形成工艺
CN102963062B (zh) *	2012-03-16	2013-10-30	深圳光启创新技术有限公司	复合板、超材料及其加工方法
JP6473028B2 (ja) *	2015-03-31	2019-02-20	日鉄ケミカル＆マテリアル株式会社	銅張積層板、プリント配線板及びその使用方法
CN105916292A (zh) *	2016-06-16	2016-08-31	常州市超顺电子技术有限公司	可折弯的铝基覆铜板及其用途和制备方法
CN106113803A (zh) *	2016-06-16	2016-11-16	常州市超顺电子技术有限公司	一种铝基覆铜板及其用途和制备方法
WO2021070232A1 (ja) *	2019-10-07	2021-04-15	Ｈｄマイクロシステムズ株式会社	ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP2021063212A (ja) *	2019-10-15	2021-04-22	住友化学株式会社	光学フィルム
JP7556806B2 (ja)	2021-03-02	2024-09-26	ノリタケ株式会社	導電性ペーストおよびその利用

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2008
- 2008-04-17 WO PCT/JP2008/057517 patent/WO2008133182A1/ja active Application Filing
- 2008-04-17 CN CN2008800115332A patent/CN101652244B/zh not_active Expired - Fee Related
- 2008-04-17 JP JP2009511846A patent/JP4896219B2/ja not_active Expired - Fee Related
- 2008-04-17 TW TW097113987A patent/TWI393629B/zh not_active IP Right Cessation

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TW200300726A (en) *	2001-12-10	2003-06-16	Mitsui Chemicals Inc	Method for manufacturing a polyimide and metal compound sheet

Also Published As

Publication number	Publication date
WO2008133182A1 (ja)	2008-11-06
CN101652244B (zh)	2013-06-26
JPWO2008133182A1 (ja)	2010-07-22
JP4896219B2 (ja)	2012-03-14
CN101652244A (zh)	2010-02-17
TW200909202A (en)	2009-03-01

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Date	Code	Title	Description
2022-01-21	MM4A	Annulment or lapse of patent due to non-payment of fees

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