TWI385695B - Protection element and manufacturing method thereof - Google Patents
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- TWI385695B TWI385695B TW98129874A TW98129874A TWI385695B TW I385695 B TWI385695 B TW I385695B TW 98129874 A TW98129874 A TW 98129874A TW 98129874 A TW98129874 A TW 98129874A TW I385695 B TWI385695 B TW I385695B
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Description
本發明是有關於一種應用於電子裝置中的保護元件，且特別是有關於一種可防止過電流及過電壓的保護元件與其製作方法。The present invention relates to a protective element for use in an electronic device, and more particularly to a protective element capable of preventing overcurrent and overvoltage and a method of fabricating the same.
近年來，資訊科技突飛猛進，舉凡手機、電腦及個人行動助理等資訊產品隨處可見，藉由它們的幫助，提供了人們在生活上食、衣、住、行、育、樂各方面的需求，也使人們對資訊產品之依賴性與日俱增。然而，近來時常有關於手機等可攜式電子產品的電池在充放電的過程中爆炸的新聞。因此，業界開始加強電池在充放電的過程中的保護措施，以防止電池在充放電的過程中因過電壓或過電流而爆炸。In recent years, information technology has advanced by leaps and bounds. Information products such as mobile phones, computers and personal mobile assistants can be seen everywhere. With their help, they provide people with the needs of food, clothing, housing, transportation, education and music. Make people's dependence on information products grow with each passing day. However, there has been a recent news about the explosion of batteries in portable electronic products such as mobile phones during charging and discharging. Therefore, the industry began to strengthen the protection measures of the battery during charging and discharging to prevent the battery from exploding due to overvoltage or overcurrent during charging and discharging.
習知技術提出的保護元件的保護方式是使保護元件中的低熔點金屬片與電池的電路串聯，且使保護元件中的低熔點金屬片與加熱元件電性連接至場效電晶體(FET)與積體電路(IC)等所組成之控制單元。如此一來，當積體電路(IC)量測到的電壓超過預設電壓值時會驅動場效電晶體(FET)，使電流通過保護元件中的加熱元件而發熱以熔斷低熔點金屬片，進而使電池的電路呈斷路的狀態而達到過電壓保護。此外，當通過低熔點金屬片的電流大於預設電流範圍時，大量的電流流經低熔點金屬片，會使低熔點金屬片發熱而熔斷，進而使電池的電路呈斷路的狀態而達到過電流保護。The protection element proposed by the prior art is protected by connecting the low melting point metal piece in the protection element in series with the circuit of the battery, and electrically connecting the low melting point metal piece and the heating element in the protection element to the field effect transistor (FET). A control unit composed of an integrated circuit (IC) or the like. In this way, when the voltage measured by the integrated circuit (IC) exceeds the preset voltage value, a field effect transistor (FET) is driven to cause the current to pass through the heating element in the protection element to generate heat to melt the low melting metal piece. Further, the circuit of the battery is disconnected to achieve overvoltage protection. In addition, when the current passing through the low melting point metal piece is greater than the preset current range, a large amount of current flows through the low melting point metal piece, which causes the low melting point metal piece to heat up and be blown, thereby causing the circuit of the battery to be in an open state to reach an overcurrent. protection.
圖1A繪示習知的一種防護元件的剖面示意圖，圖1B繪示習知的另一種防護元件的剖面示意圖。請參照圖1A，美國專利第5,712,610號揭露之習知的保護元件100a具有一基板110、一加熱元件120、一絕緣層130、一低熔點金屬片140以及一內封止層150，加熱元件120配置於基板110上，絕緣層130覆蓋加熱元件120。低熔點金屬片140配置於絕緣層130上，且內封止層150覆蓋低熔點金屬片140。如此一來，加熱元件120發熱可直接熔融低熔點金屬片140，以使低熔點金屬片140熔融而向加熱元件120兩側的電極層160流動。然而由於絕緣層130的表面近乎平坦，電極層160之相對於基板110的最大高度H1與絕緣層130之相對於基板110的最大高度H2差異不大，且熔融的低熔點金屬片140依然具有一定的黏度，因此，熔融的低熔點金屬片140不易流動且無有效容納空間，以致於加熱元件120無法有效熔斷低熔點金屬片140。FIG. 1A is a schematic cross-sectional view of a conventional protective element, and FIG. 1B is a cross-sectional view showing another conventional protective element. Referring to FIG. 1A, a conventional protective element 100a disclosed in US Pat. No. 5,712,610 has a substrate 110, a heating element 120, an insulating layer 130, a low melting point metal sheet 140, and an inner sealing layer 150. The heating element 120 Disposed on the substrate 110, the insulating layer 130 covers the heating element 120. The low melting point metal piece 140 is disposed on the insulating layer 130, and the inner sealing layer 150 covers the low melting point metal piece 140. As a result, the heating element 120 generates heat to directly melt the low-melting-point metal sheet 140 to melt the low-melting-point metal sheet 140 to flow to the electrode layer 160 on both sides of the heating element 120. However, since the surface of the insulating layer 130 is nearly flat, the maximum height H1 of the electrode layer 160 with respect to the substrate 110 and the maximum height H2 of the insulating layer 130 with respect to the substrate 110 are not significantly different, and the molten low-melting metal sheet 140 still has a certain value. The viscosity, therefore, the molten low-melting metal sheet 140 does not easily flow and has no effective accommodation space, so that the heating element 120 cannot effectively melt the low-melting-point metal sheet 140.
為改善絕緣層和電極層的相對高度差不大，導致熔融金屬片不易流動且無有效容納空間的問題美國專利第7,286,037號揭露具有懸空區域S的保護元件100b(請參照圖1B)，低熔點金屬片141與絕緣層131之間藉由中間電極162的位置設置，使低熔點金屬片141和絕緣層131有一懸空高度H，且懸空高度H和低熔點金屬片141的截面積的比值需大於5×10-5 。然而，當保護元件尺寸要求縮小而耐電流要求不變時，隨著低熔點金屬片141的截面積增加，需相對應增加懸空高度H的設計。換句話說，即需提高中間電極162或電極層161、163的高度，造成保護元件高度無法同時縮小及製造成本增加。In order to improve the relative height difference between the insulating layer and the electrode layer, the molten metal sheet is less likely to flow and there is no effective accommodation space. U.S. Patent No. 7,286,037 discloses a protective element 100b having a suspended region S (please refer to Fig. 1B), a low melting point. The position of the intermediate electrode 162 between the metal piece 141 and the insulating layer 131 is such that the low-melting-point metal piece 141 and the insulating layer 131 have a flying height H, and the ratio of the flying height H to the cross-sectional area of the low-melting-point metal piece 141 is larger than 5×10 -5 . However, when the protection element size is required to be reduced and the current resistance requirement is constant, as the cross-sectional area of the low-melting-point metal piece 141 is increased, the design of the flying height H is required to be correspondingly increased. In other words, it is necessary to increase the height of the intermediate electrode 162 or the electrode layers 161, 163, resulting in a reduction in the height of the protective member at the same time and an increase in manufacturing cost.
此外，低熔點金屬片上的內封止層在生產過程中，是先以點狀助焊膠形成於低熔點金屬片上方中央處，待保護元件經由回焊(reflow)製程焊接於電路板的同時，因內封止層的熔點較低而熔融流動覆蓋低熔點金屬片，防止低熔點金屬片表面氧化，因此若點狀助焊膠於金屬層上方塗佈位置偏離中心點或回焊時之流動覆蓋不完全，將影響低熔點金屬片之有效熔斷穩定性。In addition, the inner sealing layer on the low-melting-point metal sheet is formed in the center of the low-melting-point metal sheet by a spot-shaped soldering paste in the production process, and the component to be protected is soldered to the circuit board through a reflow process. Because the melting point of the inner sealing layer is low, the molten flow covers the low-melting metal sheet to prevent oxidation of the surface of the low-melting metal sheet. Therefore, if the spot-shaped flux is applied to the metal layer, the coating position is off-center or reflowed. Incomplete coverage will affect the effective fusing stability of low melting point metal sheets.
本發明提供一種保護元件，可有效防止過電流與過電壓。The invention provides a protection element which can effectively prevent overcurrent and overvoltage.
本發明提供一種線路基板的製作方法，可將助焊劑內埋於金屬片與基板之間，確保金屬片的有效熔斷穩定性。The invention provides a method for manufacturing a circuit substrate, which can embed a flux between a metal sheet and a substrate to ensure effective fusing stability of the metal sheet.
本發明提出一種保護元件，包含一基板、一第一電極、一第二電極、一第一助焊劑以及一金屬片。第一電極配置於基板上。第二電極配置於基板上。第一助焊劑配置於基板上並位於第一電極與第二電極之間。金屬片連接第一電極與第二電極，其中第一助焊劑與位於基板與金屬片之間。The invention provides a protective component comprising a substrate, a first electrode, a second electrode, a first flux and a metal sheet. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The first flux is disposed on the substrate and located between the first electrode and the second electrode. The metal piece connects the first electrode and the second electrode, wherein the first flux is located between the substrate and the metal piece.
在本發明之一實施例中，基板具有一中心部以及環繞中心部的一第一周邊部、一第二周邊部、一第三周邊部以及一第四周邊部，第一周邊部相對於第二周邊部，第三周邊部相對第四周邊部，第一電極與第二電極分別位於第一周邊部與第二周邊部上，且第一助焊劑位於中心部上。In an embodiment of the invention, the substrate has a central portion and a first peripheral portion surrounding the central portion, a second peripheral portion, a third peripheral portion, and a fourth peripheral portion, the first peripheral portion being opposite to the first portion The second peripheral portion, the third peripheral portion is opposite to the fourth peripheral portion, the first electrode and the second electrode are respectively located on the first peripheral portion and the second peripheral portion, and the first flux is located on the central portion.
在本發明之一實施例中，保護元件更包含一第三電極、一第四電極以及一發熱層。第三電極配置於基板的第三周邊部上。第四電極配置於基板的第四周邊部上。發熱層配置於基板上且連接於第三電極與第四電極之間。In an embodiment of the invention, the protection element further includes a third electrode, a fourth electrode, and a heat generating layer. The third electrode is disposed on the third peripheral portion of the substrate. The fourth electrode is disposed on the fourth peripheral portion of the substrate. The heat generating layer is disposed on the substrate and connected between the third electrode and the fourth electrode.
在本發明之一實施例中，第三電極的一第一延伸部延伸至發熱層上方並位於第一電極與第二電極之間，且第一助焊劑位於第一延伸部的周邊。In an embodiment of the invention, a first extension of the third electrode extends above the heat generating layer and between the first electrode and the second electrode, and the first flux is located at a periphery of the first extension.
在本發明之一實施例中，第三電極更具有一第二延伸部，第四電極具有一第三延伸部，第二延伸部與第三延伸部延伸至中心部上並位於第一電極與第二電極之間，且發熱層配置於中心部上並連接於第二延伸部與第三延伸部之間。In an embodiment of the invention, the third electrode further has a second extension portion, the fourth electrode has a third extension portion, and the second extension portion and the third extension portion extend to the central portion and are located at the first electrode Between the second electrodes, and the heat generating layer is disposed on the central portion and connected between the second extending portion and the third extending portion.
在本發明之一實施例中，發熱層位於基板與金屬片之間。In an embodiment of the invention, the heat generating layer is located between the substrate and the metal sheet.
在本發明之一實施例中，保護元件更包含一絕緣層，其覆蓋發熱層，並位於發熱層與第一延伸部之間，以及位於發熱層與第一助焊劑之間。In an embodiment of the invention, the protection element further comprises an insulating layer covering the heat generating layer and located between the heat generating layer and the first extending portion and between the heat generating layer and the first flux.
在本發明之一實施例中，基板位於發熱層與金屬片之間。In an embodiment of the invention, the substrate is located between the heat generating layer and the metal sheet.
在本發明之一實施例中，基板具有相對的一第一表面與一第二表面，且金屬片與發熱層分別位於第一表面與第二表面上，第三電極自第一表面延伸至第二表面，至少部分第四電極位於第二表面上。In an embodiment of the invention, the substrate has a first surface and a second surface, and the metal sheet and the heat generating layer are respectively located on the first surface and the second surface, and the third electrode extends from the first surface to the first surface. The two surfaces, at least a portion of the fourth electrode are located on the second surface.
在本發明之一實施例中，金屬片的截面積和第一助焊劑與第一電極、第一延伸部及第二電極的總接觸面積的比值小於1.3。In one embodiment of the invention, the cross-sectional area of the metal sheet and the ratio of the first flux to the total contact area of the first electrode, the first extension, and the second electrode are less than 1.3.
在本發明之一實施例中，保護元件更包含一焊料層，其配置於金屬片與第一電極之間、配置於金屬片與第二電極之間以及配置於金屬片與第一延伸部之間。In an embodiment of the invention, the protection element further includes a solder layer disposed between the metal piece and the first electrode, disposed between the metal piece and the second electrode, and disposed between the metal piece and the first extension between.
在本發明之一實施例中，金屬片內埋有一第二助焊劑。In an embodiment of the invention, a second flux is embedded in the metal sheet.
本發明提出一種保護元件的製作方法如下所述。首先，提供一基板。接著，形成一第一電極、一第二電極、一第三電極和一第四電極於基板上。然後，形成一發熱層於基板上，且電連接第三電極與第四電極。之後，形成一第一助焊劑於第一電極和第二電極之間。接著，提供一金屬片，金屬片連接第一電極與第二電極，及覆蓋部份第一助焊劑。The present invention proposes a method of fabricating a protective element as follows. First, a substrate is provided. Next, a first electrode, a second electrode, a third electrode and a fourth electrode are formed on the substrate. Then, a heat generating layer is formed on the substrate, and the third electrode and the fourth electrode are electrically connected. Thereafter, a first flux is formed between the first electrode and the second electrode. Next, a metal piece is provided, the metal piece is connected to the first electrode and the second electrode, and covers part of the first flux.
在本發明之一實施例中，形成第三電極的方法包含形成一第一延伸部於第一電極與第二電極之間。In one embodiment of the invention, a method of forming a third electrode includes forming a first extension between a first electrode and a second electrode.
在本發明之一實施例中，保護元件的製作方法更包含形成一焊料層於第一電極與金屬片之間，以及於第二電極與金屬片之間。In an embodiment of the invention, the method of fabricating the protective element further comprises forming a solder layer between the first electrode and the metal piece, and between the second electrode and the metal piece.
在本發明之一實施例中，形成第一助焊劑的方法更包含在將第一助焊劑形成在第一電極與第二電極之間時，將第一助焊劑形成在焊料層上。In an embodiment of the invention, the method of forming the first flux further includes forming the first flux on the solder layer when the first flux is formed between the first electrode and the second electrode.
在本發明之一實施例中，當焊料層的材質包含一焊料合金與一助焊材料時，形成第一助焊劑的方法包含加熱焊料層，以使助焊材料軟化而流到第一電極與第二電極之間。In an embodiment of the invention, when the material of the solder layer comprises a solder alloy and a fluxing material, the method of forming the first flux comprises heating the solder layer to soften the flux material and flowing to the first electrode and the first electrode. Between the two electrodes.
基於上述，由於本發明的保護元件內埋有助焊劑，且助焊劑是位於金屬層與發熱層之間，因此，當發熱層發熱時，熔融的助焊劑可有效地幫助金屬層熔融。Based on the above, since the flux is embedded in the protective element of the present invention, and the flux is located between the metal layer and the heat generating layer, the molten flux can effectively help the metal layer to melt when the heat generating layer generates heat.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖2A繪示本發明一實施例之保護元件的俯視圖，圖2B繪示圖2A之保護元件的仰視圖，圖2C繪示圖2A之保護元件沿I-I’線段的剖面圖，圖2D繪示圖2A之保護元件沿II-II’線段的剖面圖。圖3繪示圖2A中的金屬片的一種變化結構的剖面圖。2A is a top view of the protection element of the embodiment of the present invention, FIG. 2B is a bottom view of the protection element of FIG. 2A, and FIG. 2C is a cross-sectional view of the protection element of FIG. 2A along the line I-I', FIG. 2D 2A is a cross-sectional view of the protection element along line II-II'. 3 is a cross-sectional view showing a variation of the metal piece of FIG. 2A.
請同時參照圖2A、圖2B、圖2C與圖2D，本實施例之保護元件200包括一基板210、一第一電極220、一第二電極230、一第三電極240、一第四電極250、一發熱層260、一助焊劑270以及一金屬片280。第一電極220、第二電極230、第三電極240與第四電極250皆分別配置於基板210上。Referring to FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D, the protection component 200 of the present embodiment includes a substrate 210, a first electrode 220, a second electrode 230, a third electrode 240, and a fourth electrode 250. A heat generating layer 260, a flux 270, and a metal piece 280. The first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 are respectively disposed on the substrate 210.
詳細而言，在本實施例中，基板210具有一中心部C以及環繞中心部C的一第一周邊部212、一第二周邊部214、一第三周邊部216以及一第四周邊部218，其中第一周邊部212相對於第二周邊部214，第三周邊部216相對第四周邊部218。第一電極220、第二電極230、第三電極240與第四電極250可分別位於第一周邊部212、第二周邊部214、第三周邊部216以及第四周邊部218上。基板210可具有相對的一第一表面S1與一第二表面S2，且第一電極220、第二電極230、第三電極240與第四電極250皆可由第一表面S1延伸至第二表面S2。然並不以此為限，各電極也可依實際設計需求而決定有無或位於第一表面S1或第二表面S2上，於另一實施例中，第四電極250也可僅位於第二表面S2上。In detail, in the embodiment, the substrate 210 has a central portion C and a first peripheral portion 212 surrounding the central portion C, a second peripheral portion 214, a third peripheral portion 216, and a fourth peripheral portion 218. Wherein the first peripheral portion 212 is opposite the second peripheral portion 214 and the third peripheral portion 216 is opposite the fourth peripheral portion 218. The first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 may be located on the first peripheral portion 212, the second peripheral portion 214, the third peripheral portion 216, and the fourth peripheral portion 218, respectively. The substrate 210 may have a first surface S1 and a second surface S2, and the first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 may extend from the first surface S1 to the second surface S2. . However, the second electrode 250 may also be located only on the second surface. In another embodiment, the fourth electrode 250 may also be located only on the second surface. On S2.
此外，在本實施例中，第三電極240的一第一延伸部242與一第二延伸部244分別配置於第一表面S1與第二表面S2上，並分別延伸至中心部C上。在本實施例中，第一延伸部242與第二延伸部244分別位於二實質上相互平行但不重疊的平面上。第四電極250的一第三延伸部252配置於第二表面S2上，並延伸至中心部C上。第一、第二與第三延伸部242、244、252可分別位於第一電極220與第二電極230之間。In addition, in the embodiment, a first extending portion 242 and a second extending portion 244 of the third electrode 240 are disposed on the first surface S1 and the second surface S2, respectively, and extend to the central portion C, respectively. In this embodiment, the first extension portion 242 and the second extension portion 244 are respectively located on planes that are substantially parallel to each other but do not overlap. A third extension 252 of the fourth electrode 250 is disposed on the second surface S2 and extends to the central portion C. The first, second, and third extensions 242, 244, 252 may be located between the first electrode 220 and the second electrode 230, respectively.
基板210的材質包括陶瓷(例如氧化鋁)、玻璃環氧樹脂、二氧化鋯(ZrO2 )、氮化矽(Si3 N4 )、氮化鋁(AlN)、氮化硼(BN)或是其他無機材料。第一電極220、第二電極230、第三電極240與第四電極250的材質例如為銀、銅、金、鎳、銀鉑合金與鎳合金等導電性質良好的材料。The material of the substrate 210 includes ceramic (for example, alumina), glass epoxy resin, zirconium dioxide (ZrO 2 ), tantalum nitride (Si 3 N 4 ), aluminum nitride (AlN), boron nitride (BN) or Other inorganic materials. The material of the first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 is, for example, a material having good electrical conductivity such as silver, copper, gold, nickel, a silver-platinum alloy, or a nickel alloy.
發熱層260配置於第二表面S2上並連接於第二延伸部244與第三延伸部252之間，其中第三電極240的第一延伸部242是位於發熱層260上方(如圖2C所示)。發熱層260的材質包括二氧化釕(RuO2 )、碳黑(可摻雜於水玻璃等無機系黏著劑中或是熱硬化樹脂等有機系黏著劑中)、銅、鈦、鎳鉻合金與鎳銅合金。此外，為保護發熱層260不受後製程及外界濕氣、酸鹼環境影響，可在發熱層260上覆蓋一絕緣層290，其材質包括玻璃膠或環氧樹脂(epoxy resin)。The heat generating layer 260 is disposed on the second surface S2 and connected between the second extending portion 244 and the third extending portion 252, wherein the first extending portion 242 of the third electrode 240 is located above the heat generating layer 260 (as shown in FIG. 2C). ). The material of the heat generating layer 260 includes ruthenium dioxide (RuO 2 ), carbon black (which may be doped in an inorganic adhesive such as water glass or an organic adhesive such as a thermosetting resin), copper, titanium, nickel chrome and Nickel copper alloy. In addition, in order to protect the heat generating layer 260 from the post-process and external moisture, acid and alkali environment, the heat generating layer 260 may be covered with an insulating layer 290, the material of which includes glass glue or epoxy resin.
助焊劑270配置於基板210的第一表面S1上並位於第一延伸部242的周邊。詳細而言，在本實施例中，助焊劑270是位於第一電極220、第二電極230與第一延伸部242之間。具體而言，助焊劑270是填充於由第一電極220、第一延伸部242以及基板210所構成的一第一凹槽R1中，以及填充於由第二電極230、第一延伸部242以及基板210所構成的一第二凹槽R2中。助焊劑270的材質包括樹脂或松脂等。The flux 270 is disposed on the first surface S1 of the substrate 210 and located at the periphery of the first extension portion 242. In detail, in the present embodiment, the flux 270 is located between the first electrode 220, the second electrode 230, and the first extension portion 242. Specifically, the flux 270 is filled in a first recess R1 composed of the first electrode 220, the first extending portion 242, and the substrate 210, and is filled in the second electrode 230, the first extending portion 242, and The substrate 210 is formed in a second recess R2. The material of the flux 270 includes resin or rosin.
金屬片280配置於第一電極220、第一延伸部242與第二電極230上，且覆蓋部份的助焊劑270，其中助焊劑270與第一延伸部242皆位於發熱層260與金屬片280之間，且助焊劑270的熔點低於金屬片280的熔點。如此一來，當控制單元(未顯示)偵測到過電壓狀態，驅動發熱層260發熱熔斷金屬片280時，由於助焊劑270被金屬片280覆蓋且被第一電極220、第二電極230與第一延伸部242圍繞，故助焊劑270可有效地幫助其上方的金屬片280熔斷，使保護元件達到過電壓保護目地。換言之，由於本實施例的助焊劑270是內埋在保護元件200之中，可避免金屬片280受熱熔融開始流動之表面產生氧化薄膜，進而有助於金屬片280熔斷。此外助焊劑270也可提供熔融金屬片280和各電極間有較佳的潤溼性，且可增加熔融的金屬片280本身的內聚力，使熔融金屬片280可流動且聚集於各電極上，進而達到有效熔斷。The metal piece 280 is disposed on the first electrode 220, the first extending portion 242 and the second electrode 230, and covers a portion of the flux 270, wherein the flux 270 and the first extending portion 242 are located on the heat generating layer 260 and the metal piece 280. Between, and the melting point of the flux 270 is lower than the melting point of the metal piece 280. In this way, when the control unit (not shown) detects the overvoltage state and drives the heat generating layer 260 to heat-fuse the metal piece 280, the flux 270 is covered by the metal piece 280 and is covered by the first electrode 220 and the second electrode 230. The first extension 242 is surrounded, so the flux 270 can effectively help the metal piece 280 above it to blow, so that the protection element reaches the overvoltage protection purpose. In other words, since the flux 270 of the present embodiment is embedded in the protective member 200, it is possible to prevent the metal sheet 280 from being oxidized by the surface on which the hot melt starts to flow, thereby contributing to the melting of the metal piece 280. In addition, the flux 270 can also provide the molten metal sheet 280 and the better wettability between the electrodes, and can increase the cohesive force of the molten metal sheet 280 itself, so that the molten metal sheet 280 can flow and gather on the electrodes, and further Achieve effective blow.
金屬片280的材質包括錫鉛合金、錫銀鉛合金、錫銦鉍鉛合金、錫銻合金、錫銀銅合金等低熔點合金。此外，在其他實施例中，金屬片280a可內埋有一助焊劑F(如圖3所示)，以利於金屬片280a受熱而熔斷。需注意的是，雖然本發明於此係以具有發熱層而可同時提供過電壓及過電流保護之保護元件結構進行說明，然而本發明所屬技術領域中具有通常知識者當知，本發明具有助焊劑270於金屬片280下方幫助熔斷穩定性的特徵，亦可應用在沒有發熱層之結構中，幫助金屬片280在過電流通過而發熱熔融時的熔斷穩定性。The material of the metal piece 280 includes a low melting point alloy such as a tin-lead alloy, a tin-silver-lead alloy, a tin-indium-bismuth-lead alloy, a tin-bismuth alloy, or a tin-silver-copper alloy. In addition, in other embodiments, the metal piece 280a may be embedded with a flux F (as shown in FIG. 3) to facilitate the heat dissipation of the metal piece 280a. It should be noted that although the present invention is described herein as a protective element structure having a heat generating layer capable of providing both overvoltage and overcurrent protection, it is known to those skilled in the art to which the present invention pertains. The flux 270 is characterized by a fracture stability under the metal piece 280, and can also be applied to a structure without a heat generating layer to help the metal sheet 280 to have a fusing stability when an overcurrent passes through heat generation and melting.
在本實施例中，由於助焊劑270可幫助金屬片280熔融，因此需適當地調整金屬片280的截面積和助焊劑270與各電極的總接觸面積的比值，以達到較佳的熔斷穩定性。舉例來說，金屬片280的截面積和助焊劑270與各電極的總接觸面積的比值可小於1.3。詳細而言，當保護元件尺寸縮小而耐電流要求不變時，可依照金屬片280和助焊劑270與各電極的總接觸面積比值進行調整，以達到較佳的設計。進一步舉例說明，在本實施例中，金屬片280的截面積為與流經金屬片280之電流方向垂直的面之面積(例如圖2D所示之截面)；助焊劑270與各電極的總接觸面積是指助焊劑270於第一凹槽R1和第二凹槽R2中分別與第一電極220、第一延伸部242和第二電極230接觸之表面的總表面積(如圖2A及圖2C所示)。In the present embodiment, since the flux 270 can help the metal piece 280 to melt, it is necessary to appropriately adjust the cross-sectional area of the metal piece 280 and the ratio of the flux 270 to the total contact area of each electrode to achieve better fusing stability. . For example, the cross-sectional area of the metal piece 280 and the ratio of the flux 270 to the total contact area of each electrode can be less than 1.3. In detail, when the size of the protection element is reduced and the current resistance requirement is constant, the ratio of the total contact area of the metal piece 280 and the flux 270 to each electrode can be adjusted to achieve a better design. Further exemplifying, in the present embodiment, the cross-sectional area of the metal piece 280 is the area of the surface perpendicular to the direction of current flowing through the metal piece 280 (for example, the cross section shown in FIG. 2D); the total contact of the flux 270 with each electrode The area refers to the total surface area of the surface of the flux 270 in contact with the first electrode 220, the first extension portion 242 and the second electrode 230 in the first groove R1 and the second groove R2, respectively (as shown in FIGS. 2A and 2C). Show).
此外，為了更進一步說明金屬片280可有效熔斷，因此本實施例提供數個實施範例說明具有不同寬度或厚度之金屬片280的截面積和助焊劑270與各電極的總接觸面積之間的關係。各實施範例中所使用發熱層260的發熱功率為3.5W，並以是否熔斷結果及熔斷時間120秒為熔斷與否(OK或NG)判定依據。實施範例10為未添加助焊劑270之測試範例。In addition, in order to further illustrate that the metal piece 280 can be effectively blown, the present embodiment provides several embodiments to illustrate the relationship between the cross-sectional area of the metal piece 280 having different widths or thicknesses and the total contact area of the flux 270 and each electrode. . The heat generating power of the heat generating layer 260 used in each of the examples was 3.5 W, and the basis of the melting or not (OK or NG) was determined based on whether or not the melting result and the melting time were 120 seconds. Example 10 is a test example in which no flux 270 was added.
由表一可得知：當金屬片280的截面積和助焊劑270與各電極的總接觸面積之比值小於1.3時，發熱功率3.5瓦特的發熱層260可確實熔斷金屬片280，而沒有助焊劑270的設計，無法有效熔斷金屬片280。另外，由於助焊劑270可提高熔融金屬片280和電極間的潤溼性，並增加熔融金屬片280的內聚力，因此當金屬片280熔斷時，會聚集於第一電極220、第一延伸部242與第二電極230上，可以確保熔融的金屬不會讓第一延伸部222a與第一電極220或第二電極230產生短路現象。如此一來，可進一步確保金屬片280可有效地被熔斷，而達成有效防止過電壓或過電流。簡言之，當金屬片280的截面積和助焊劑270與各電極的總接觸面積之比值小於1.3，可提高金屬塊270有效熔斷的可靠度。As can be seen from Table 1, when the ratio of the cross-sectional area of the metal piece 280 and the total contact area of the flux 270 and each electrode is less than 1.3, the heat generating layer 260 having a heating power of 3.5 watts can surely melt the metal piece 280 without the flux. The design of the 270 does not effectively blow the metal piece 280. In addition, since the flux 270 can improve the wettability between the molten metal piece 280 and the electrode and increase the cohesive force of the molten metal piece 280, when the metal piece 280 is blown, it will collect on the first electrode 220 and the first extending portion 242. On the second electrode 230, it is ensured that the molten metal does not cause the first extension portion 222a to short-circuit with the first electrode 220 or the second electrode 230. As a result, it is further ensured that the metal piece 280 can be effectively blown, thereby achieving effective prevention of overvoltage or overcurrent. In short, when the cross-sectional area of the metal piece 280 and the ratio of the flux 270 to the total contact area of each electrode are less than 1.3, the reliability of the effective melting of the metal block 270 can be improved.
此外，在本實施例中，可選擇性地在金屬片280與第一電極220之間、在金屬片280與第二電極230之間以及在金屬片280與第一延伸部242之間配置一焊料層D，以以將金屬片280固定在第一電極220、第二電極230以及第一延伸部242上。焊料層D的材質包括錫鉛合金、錫銀合金、金、銀、錫、鉛、鉍、銦、鎵、鈀、鎳、銅及其合金等金屬材料，且焊料層D可更包含10～15%的助焊劑，以減少熔融焊料層D和金屬片280表面之張力，而助長金屬片280之擴張，以確保熔斷效果。然而於其他實施例中，金屬片280與第一電極220、第二電極230及第一延伸部242之間也可以超音波焊接等方式固定而沒有焊料層D。In addition, in this embodiment, a metal sheet 280 and the first electrode 220 are selectively disposed between the metal piece 280 and the second electrode 230 and between the metal piece 280 and the first extending portion 242. The solder layer D is used to fix the metal piece 280 on the first electrode 220, the second electrode 230, and the first extension portion 242. The material of the solder layer D includes tin-lead alloy, tin-silver alloy, metal materials such as gold, silver, tin, lead, antimony, indium, gallium, palladium, nickel, copper and alloys thereof, and the solder layer D may further comprise 10-15. % flux to reduce the tension between the molten solder layer D and the surface of the metal piece 280, and to promote the expansion of the metal piece 280 to ensure the fusing effect. However, in other embodiments, the metal piece 280 and the first electrode 220, the second electrode 230, and the first extending portion 242 may be fixed by ultrasonic welding or the like without the solder layer D.
以下將詳細介紹保護元件200的製作方法。The method of fabricating the protective element 200 will be described in detail below.
圖4A～圖4C繪示本發明一實施例之保護元件的製程俯視圖，圖5A～圖5C繪示圖4A～圖4C的製程的仰視圖。值得注意的是，在圖4A～圖4C與圖5A～圖5C中的元件名稱及標號與圖2A～圖2D中的元件名稱及標號相同者，其材質相同，故於此不再贅述。4A to 4C are plan views showing the process of the protection element according to an embodiment of the present invention, and FIGS. 5A to 5C are bottom views of the process of FIGS. 4A to 4C. It is to be noted that the component names and reference numerals in FIGS. 4A to 4C and FIGS. 5A to 5C are the same as those in FIGS. 2A to 2D, and the materials are the same, and thus will not be described again.
首先，請同時參照圖4A與圖5A，提供一基板210，並在基板210上形成一第一電極220、一第二電極230、一第三電極240、一第四電極250。基板210可具有相對的一第一表面S1與一第二表面S2，且第一電極220、第二電極230、第三電極240與第四電極250可由第一表面S1延伸至第二表面S2。First, referring to FIG. 4A and FIG. 5A, a substrate 210 is provided, and a first electrode 220, a second electrode 230, a third electrode 240, and a fourth electrode 250 are formed on the substrate 210. The substrate 210 may have a first surface S1 and a second surface S2 opposite to each other, and the first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 may extend from the first surface S1 to the second surface S2.
在本實施例中，第三電極240的一第一延伸部242與一第二延伸部244分別配置於第一表面S1與第二表面S2上。第四電極250的一第三延伸部252配置於第二表面S2上。第一、第二與第三延伸部242、244、252可分別位於第一電極220與第二電極230之間。In this embodiment, a first extension portion 242 and a second extension portion 244 of the third electrode 240 are disposed on the first surface S1 and the second surface S2, respectively. A third extension 252 of the fourth electrode 250 is disposed on the second surface S2. The first, second, and third extensions 242, 244, 252 may be located between the first electrode 220 and the second electrode 230, respectively.
接著，請參照圖5B，例如以印刷、濺鍍或壓合的方式在第二延伸部244與第三延伸部252之間形成一發熱層260，發熱層260電連接第二延伸部244與第三延伸部252。Next, referring to FIG. 5B, a heat generating layer 260 is formed between the second extending portion 244 and the third extending portion 252 by printing, sputtering or pressing, and the heat generating layer 260 is electrically connected to the second extending portion 244 and the first portion. Three extensions 252.
然後，請參照圖5C，在發熱層260上覆蓋一層絕緣層290，且絕緣層290還可覆蓋第二延伸部244與第三延伸部252，以保護發熱層260不受後製程及外界濕氣、酸鹼環境影響。接著，可對第一電極220、第二電極230、第三電極240與第四電極250進行一表面處理製程，以於第一電極220、第二電極230、第三電極240與第四電極250上形成一抗氧化層(未繪示)，其中表面處理製程例如化鎳金或電鍍製程等。Then, referring to FIG. 5C, the heat generating layer 260 is covered with an insulating layer 290, and the insulating layer 290 can also cover the second extending portion 244 and the third extending portion 252 to protect the heat generating layer 260 from the post process and external moisture. , acid and alkali environmental impact. Then, the first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250 may be subjected to a surface treatment process for the first electrode 220, the second electrode 230, the third electrode 240, and the fourth electrode 250. An anti-oxidation layer (not shown) is formed thereon, wherein the surface treatment process is, for example, nickel gold or an electroplating process.
之後，請參照圖4B，例如以塗佈的方式在第一電極220、第二電極230以及第一延伸部242上形成一焊料層D。然後，例如以塗佈的方式在第一電極220、第二電極230以及第一延伸部242之間的基板210上形成一助焊劑270。在其他實施例中，當焊料層D的材質包括一焊料合金與一助焊材料時，例如含10-15%，形成助焊劑270的方法包括加熱焊料層D(例如120℃以上)，以使助焊材料軟化而流到第一電極220、第二電極230以及第一延伸部242之間的基板210上，若助焊材料的量不足時，則可選擇性地添加一第二助焊劑(未顯示)。Thereafter, referring to FIG. 4B, a solder layer D is formed on the first electrode 220, the second electrode 230, and the first extension portion 242, for example, by coating. Then, a flux 270 is formed on the substrate 210 between the first electrode 220, the second electrode 230, and the first extension portion 242, for example, by coating. In other embodiments, when the material of the solder layer D includes a solder alloy and a fluxing material, for example, 10-15%, the method of forming the flux 270 includes heating the solder layer D (for example, above 120 ° C) to assist The solder material softens and flows onto the substrate 210 between the first electrode 220, the second electrode 230, and the first extension portion 242. If the amount of the soldering material is insufficient, a second flux may be selectively added (not display).
然後，請同時參照圖4C與圖2C，將一金屬片280配置於第一電極220、第二電極230以及第一延伸部242上，並焊接金屬片280與焊料層D，以將助焊劑270夾在金屬片280與基板210之間。如此一來，當基板210下方的發熱層260發熱時，基板210上方的助焊劑270可有助於使其上的金屬片280熔融。Then, referring to FIG. 4C and FIG. 2C, a metal piece 280 is disposed on the first electrode 220, the second electrode 230, and the first extending portion 242, and the metal piece 280 and the solder layer D are soldered to apply the flux 270. It is sandwiched between the metal piece 280 and the substrate 210. As such, when the heat generating layer 260 under the substrate 210 generates heat, the flux 270 above the substrate 210 can contribute to melting the metal piece 280 thereon.
圖6A繪示本發明另一實施例之保護元件600的俯視圖，圖6B繪示圖6A之保護元件的仰視圖，圖6C繪示圖6A之保護元件沿I-I’線段的剖面圖，圖6D繪示圖6A之保護元件沿II-II’線段的剖面圖。請同時參照圖6A～圖6D，本實施例之保護元件600相似於圖2A～圖2D的保護元件200，兩者的差異之處在於保護元件600的發熱層260、第二延伸部244、第三延伸部252與絕緣層290皆配置於基板210的第一表面S1上。6A is a top view of a protection element 600 according to another embodiment of the present invention, FIG. 6B is a bottom view of the protection element of FIG. 6A, and FIG. 6C is a cross-sectional view of the protection element of FIG. 6A along line I-I'. 6D is a cross-sectional view of the protection element of FIG. 6A taken along line II-II'. Referring to FIG. 6A to FIG. 6D simultaneously, the protection component 600 of the present embodiment is similar to the protection component 200 of FIGS. 2A to 2D , and the difference between the two is the heat generating layer 260 , the second extension portion 244 , and the The three extension portions 252 and the insulating layer 290 are disposed on the first surface S1 of the substrate 210.
詳細而言，第二延伸部244與第三延伸部252配置於第一表面S1上並位於第一電極220與第二電極230之間，發熱層260配置於第二延伸部244與第三延伸部252之間，且絕緣層290覆蓋發熱層260、第二延伸部244與第三延伸部252。第三電極240的第一延伸部242延伸至絕緣層290上，而助焊劑270配置於絕緣層290上且位於第一延伸部242的周邊，金屬片280覆蓋第一電極220、助焊劑270、第一延伸部242與第二電極230，以使助焊劑270位於金屬片280與絕緣層290之間。如此一來，當發熱層260發熱時，熱可透過絕緣層290傳導到助焊劑270與金屬片280，以熔融金屬片280，此時，直接接觸金屬片280的助焊劑270可有助於金屬片280熔融。在本實施例中，第一延伸部242與第二延伸部244分別位於二實質上相互平行但不重疊的平面上(如圖6D所示)。In detail, the second extending portion 244 and the third extending portion 252 are disposed on the first surface S1 and located between the first electrode 220 and the second electrode 230, and the heat generating layer 260 is disposed on the second extending portion 244 and the third extending portion Between the portions 252, the insulating layer 290 covers the heat generating layer 260, the second extending portion 244, and the third extending portion 252. The first extension 242 of the third electrode 240 extends onto the insulating layer 290, and the flux 270 is disposed on the insulating layer 290 and located at the periphery of the first extending portion 242. The metal piece 280 covers the first electrode 220, the flux 270, The first extension portion 242 and the second electrode 230 are such that the flux 270 is located between the metal piece 280 and the insulating layer 290. As a result, when the heat generating layer 260 generates heat, the heat permeable insulating layer 290 is conducted to the flux 270 and the metal piece 280 to melt the metal piece 280. At this time, the flux 270 directly contacting the metal piece 280 can contribute to the metal. Sheet 280 melts. In this embodiment, the first extension portion 242 and the second extension portion 244 are respectively located on planes that are substantially parallel to each other but do not overlap (as shown in FIG. 6D).
另外，保護元件600的製作方法相似於圖2A～圖2D的保護元件200的製作方法(圖4A～圖4C與圖5A～圖5C)，兩者的差異之處僅在於保護元件600的製作方法是先依序將第二延伸部244、第三延伸部252、發熱層260與絕緣層290形成在基板210的第一表面S1上，然後才形成延伸至絕緣層290上的第一延伸部242，接著，於第一延伸部242的周邊形成助焊劑270，之後，形成覆蓋第一電極220、助焊劑270、第一延伸部242與第二電極230的金屬片280。In addition, the manufacturing method of the protection element 600 is similar to the manufacturing method of the protection element 200 of FIGS. 2A to 2D ( FIGS. 4A to 4C and FIGS. 5A to 5C ), and the only difference between the two is that the protection element 600 is fabricated. The second extension portion 244, the third extension portion 252, the heat generating layer 260 and the insulating layer 290 are sequentially formed on the first surface S1 of the substrate 210, and then the first extension portion 242 extending to the insulating layer 290 is formed. Next, the flux 270 is formed on the periphery of the first extension portion 242, and thereafter, the metal piece 280 covering the first electrode 220, the flux 270, the first extension portion 242, and the second electrode 230 is formed.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100a、100b‧‧‧保護元件100a, 100b‧‧‧protective components
110、210‧‧‧基板110, 210‧‧‧ substrate
120‧‧‧加熱元件120‧‧‧heating elements
130、131、290‧‧‧絕緣層130, 131, 290‧‧‧ insulation
140、141‧‧‧低熔點金屬片140, 141‧‧‧low melting point metal sheet
150‧‧‧內封止層150‧‧‧Inner sealing layer
160、161、163‧‧‧電極層160,161,163‧‧‧electrode layer
162‧‧‧中間電極162‧‧‧Intermediate electrode
200、600‧‧‧保護元件200, 600‧‧‧protective components
212‧‧‧第一周邊部212‧‧‧First perimeter
214‧‧‧第二周邊部214‧‧‧Second peripheral
216‧‧‧第三周邊部216‧‧ Third third quarter
218‧‧‧第四周邊部218‧‧The fourth peripheral
220‧‧‧第一電極220‧‧‧First electrode
230‧‧‧第二電極230‧‧‧second electrode
240‧‧‧第三電極240‧‧‧ third electrode
242‧‧‧第一延伸部242‧‧‧First Extension
244‧‧‧第二延伸部244‧‧‧Second extension
250‧‧‧第四電極250‧‧‧fourth electrode
252‧‧‧第三延伸部252‧‧‧ Third Extension
260‧‧‧發熱層260‧‧‧heat layer
280、280a‧‧‧金屬片280, 280a‧‧‧ metal pieces
270、F‧‧‧助焊劑270, F‧‧‧ flux
C‧‧‧中心部C‧‧‧ Central Department
D‧‧‧焊料層D‧‧‧ solder layer
H‧‧‧懸空高度H‧‧‧ suspended height
H1、H2‧‧‧最大高度H1, H2‧‧‧ maximum height
R1‧‧‧第一凹槽R1‧‧‧ first groove
R2‧‧‧第二凹槽R2‧‧‧second groove
S‧‧‧懸空區域S‧‧‧ vacant area
S1‧‧‧第一表面S1‧‧‧ first surface
S2‧‧‧第二表面S2‧‧‧ second surface
圖1A繪示習知的一種防護元件的剖面示意圖，圖1B繪示習知的另一種防護元件的剖面示意圖。FIG. 1A is a schematic cross-sectional view of a conventional protective element, and FIG. 1B is a cross-sectional view showing another conventional protective element.
圖2A繪示本發明一實施例之保護元件的俯視圖，圖2B繪示圖2A之保護元件的仰視圖，圖2C繪示圖2A之保護元件沿I-I’線段的剖面圖，圖2D繪示圖2A之保護元件沿II-II’線段的剖面圖。2A is a top view of the protection element of the embodiment of the present invention, FIG. 2B is a bottom view of the protection element of FIG. 2A, and FIG. 2C is a cross-sectional view of the protection element of FIG. 2A along the line I-I', FIG. 2D 2A is a cross-sectional view of the protection element along line II-II'.
圖3繪示圖2A中的金屬片的一種變化結構。FIG. 3 illustrates a variation of the metal piece of FIG. 2A.
圖4A~圖4C繪示本發明一實施例之保護元件的製程俯視圖，圖5A~圖5C繪示圖4A~圖4C的製程的仰視圖。4A-4C are plan views of a process of the protection device according to an embodiment of the present invention, and FIGS. 5A to 5C are bottom views of the process of FIGS. 4A-4C.
圖6A繪示本發明一實施例之保護元件的俯視圖，圖6B繪示圖6A之保護元件的仰視圖，圖6C繪示圖6A之保護元件沿I-I’線段的剖面圖，圖6D繪示圖6A之保護元件沿II-II’線段的剖面圖。6A is a top view of the protection element of the embodiment of the present invention, FIG. 6B is a bottom view of the protection element of FIG. 6A, and FIG. 6C is a cross-sectional view of the protection element of FIG. 6A along the line I-I', FIG. 6D A cross-sectional view of the protection element of Figure 6A taken along line II-II'.
200‧‧‧保護元件200‧‧‧protective components
210‧‧‧基板210‧‧‧Substrate
220‧‧‧第一電極220‧‧‧First electrode
230‧‧‧第二電極230‧‧‧second electrode
242‧‧‧第一延伸部242‧‧‧First Extension
244‧‧‧第二延伸部244‧‧‧Second extension
252‧‧‧第三延伸部252‧‧‧ Third Extension
260‧‧‧發熱層260‧‧‧heat layer
270‧‧‧助焊劑270‧‧‧ flux
280‧‧‧金屬片280‧‧‧metal pieces
290‧‧‧絕緣層290‧‧‧Insulation
D‧‧‧焊料層D‧‧‧ solder layer
R1‧‧‧第一凹槽R1‧‧‧ first groove
R2‧‧‧第二凹槽R2‧‧‧second groove
S1‧‧‧第一表面S1‧‧‧ first surface
S2‧‧‧第二表面S2‧‧‧ second surface
Claims (27)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98129874A TWI385695B (en) | 2009-09-04 | 2009-09-04 | Protection element and manufacturing method thereof |
| JP2010198312A JP5351860B2 (en) | 2009-09-04 | 2010-09-03 | Protective device |
| US12/875,752 US8472158B2 (en) | 2009-09-04 | 2010-09-03 | Protective device |
| US12/875,771 US9129769B2 (en) | 2009-09-04 | 2010-09-03 | Protective device |
| JP2010198242A JP5192524B2 (en) | 2009-09-04 | 2010-09-03 | Protective device |
| US13/894,160 US8675333B2 (en) | 2009-09-04 | 2013-05-14 | Protective device |
| JP2013134048A JP5624183B2 (en) | 2009-09-04 | 2013-06-26 | Protective device |
| US13/962,837 US9336978B2 (en) | 2009-09-04 | 2013-08-08 | Protective device |
| US14/162,185 US9025295B2 (en) | 2009-09-04 | 2014-01-23 | Protective device and protective module |
| JP2014210266A JP5923153B2 (en) | 2009-09-04 | 2014-09-25 | Protective device |
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| TW98129874A TWI385695B (en) | 2009-09-04 | 2009-09-04 | Protection element and manufacturing method thereof |
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| TW201110178A TW201110178A (en) | 2011-03-16 |
| TWI385695B true TWI385695B (en) | 2013-02-11 |
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| TWI588857B (en) * | 2014-02-10 | 2017-06-21 | 陳莎莉 | Composite protective component and protection circuit |
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| JP6227276B2 (en) * | 2013-05-02 | 2017-11-08 | デクセリアルズ株式会社 | Protective element |
| CN114203678B (en) * | 2022-02-18 | 2022-05-06 | 威海嘉瑞光电科技股份有限公司 | Integrated packaging structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004185960A (en) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | Circuit protection element and its manufacturing method |
| TW200416763A (en) * | 2003-02-05 | 2004-09-01 | Sony Chemicals Corp | Protection device |
| TW200703400A (en) * | 2005-07-15 | 2007-01-16 | Inpaq Technology Co Ltd | New structure of overcurrent protection device and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004185960A (en) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | Circuit protection element and its manufacturing method |
| TW200416763A (en) * | 2003-02-05 | 2004-09-01 | Sony Chemicals Corp | Protection device |
| TW200703400A (en) * | 2005-07-15 | 2007-01-16 | Inpaq Technology Co Ltd | New structure of overcurrent protection device and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI588857B (en) * | 2014-02-10 | 2017-06-21 | 陳莎莉 | Composite protective component and protection circuit |
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