TWI371845B - Chip stacked assembly - Google Patents

Chip stacked assembly

Info

Publication number: TWI371845B
Authority: TW; Taiwan
Prior art keywords: stacked assembly; chip stacked; chip; assembly; stacked
Prior art date: 2008-02-26

Application number

TW097106704A

Other languages

Chinese (zh)

Other versions

TW200937606A (en

Inventor

ming yao Chen

Original Assignee

Powertech Technology Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-02-26

Filing date

2008-02-26

Publication date

2012-09-01

2008-02-26 Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc

2008-02-26 Priority to TW097106704A priority Critical patent/TWI371845B/en

2009-09-01 Publication of TW200937606A publication Critical patent/TW200937606A/en

2012-09-01 Application granted granted Critical

2012-09-01 Publication of TWI371845B publication Critical patent/TWI371845B/en

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

TW097106704A 2008-02-26 2008-02-26 Chip stacked assembly TWI371845B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW097106704A TWI371845B (en)	2008-02-26	2008-02-26	Chip stacked assembly

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW097106704A TWI371845B (en)	2008-02-26	2008-02-26	Chip stacked assembly

Publications (2)

Publication Number	Publication Date
TW200937606A TW200937606A (en)	2009-09-01
TWI371845B true TWI371845B (en)	2012-09-01

Family

ID=44867096

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097106704A TWI371845B (en)	2008-02-26	2008-02-26	Chip stacked assembly

Country Status (1)

Country	Link
TW (1)	TWI371845B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9570421B2 (en)	2013-11-14	2017-02-14	Taiwan Semiconductor Manufacturing Co., Ltd.	Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113811079A (en) *	2020-06-15	2021-12-17	群翊工业股份有限公司	Automated production equipment and method for batch baking of substrates

2008
- 2008-02-26 TW TW097106704A patent/TWI371845B/en not_active IP Right Cessation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9570421B2 (en)	2013-11-14	2017-02-14	Taiwan Semiconductor Manufacturing Co., Ltd.	Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
US9929109B2 (en)	2013-11-14	2018-03-27	Taiwan Semiconductor Manufacturing Co., Ltd.	Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
US10510684B2 (en)	2013-11-14	2019-12-17	Taiwan Semiconductor Manufacturing Co., Ltd.	Three dimensional integrated circuit (3DIC) with support structures
US11424194B2 (en)	2013-11-14	2022-08-23	Taiwan Semiconductor Manufacturing Company, Ltd.	Three dimensional integrated circuit (3DIC) with support structures

Also Published As

Publication number	Publication date
TW200937606A (en)	2009-09-01

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Legal Events

Date	Code	Title	Description
2018-06-01	MM4A	Annulment or lapse of patent due to non-payment of fees