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TWI368268B - Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same - Google Patents

Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same

Info

Publication number
TWI368268B
TWI368268B TW094100216A TW94100216A TWI368268B TW I368268 B TWI368268 B TW I368268B TW 094100216 A TW094100216 A TW 094100216A TW 94100216 A TW94100216 A TW 94100216A TW I368268 B TWI368268 B TW I368268B
Authority
TW
Taiwan
Prior art keywords
same
semiconductor wafer
removing unnecessary
unnecessary matter
matter
Prior art date
Application number
TW094100216A
Other languages
English (en)
Other versions
TW200527528A (en
Inventor
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200527528A publication Critical patent/TW200527528A/zh
Application granted granted Critical
Publication of TWI368268B publication Critical patent/TWI368268B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094100216A 2004-01-07 2005-01-05 Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same TWI368268B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004001745A JP4592289B2 (ja) 2004-01-07 2004-01-07 半導体ウエハの不要物除去方法

Publications (2)

Publication Number Publication Date
TW200527528A TW200527528A (en) 2005-08-16
TWI368268B true TWI368268B (en) 2012-07-11

Family

ID=34709017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094100216A TWI368268B (en) 2004-01-07 2005-01-05 Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same

Country Status (6)

Country Link
US (1) US7264998B2 (zh)
JP (1) JP4592289B2 (zh)
KR (1) KR101048920B1 (zh)
CN (1) CN100433266C (zh)
SG (1) SG113039A1 (zh)
TW (1) TWI368268B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4688728B2 (ja) 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
KR100741168B1 (ko) * 2006-07-05 2007-07-20 주식회사 다이나테크 필링바를 이용한 디테이핑 장치
KR101053268B1 (ko) * 2008-12-29 2011-08-01 윤점채 웨이퍼 디테이핑 메카니즘과 그 이용방법
JP5249826B2 (ja) * 2009-03-17 2013-07-31 リンテック株式会社 シート剥離装置及び剥離方法
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
JP5554430B2 (ja) * 2013-03-06 2014-07-23 リンテック株式会社 シート剥離装置及び剥離方法並びにシート剥離用プレート部材
CN104217864A (zh) * 2014-07-24 2014-12-17 天津三星电机有限公司 Mlcc载板的异物清理装置及清理方法
JP6628689B2 (ja) * 2016-05-30 2020-01-15 リンテック株式会社 シート貼付装置および貼付方法
CN115339093B (zh) * 2022-06-30 2024-10-11 江苏通用半导体有限公司 一种全自动晶圆覆膜机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447518B2 (ja) * 1996-08-09 2003-09-16 リンテック株式会社 接着シート貼付装置および方法
SG132495A1 (en) * 1998-03-13 2007-06-28 Towa Corp Nest for dicing, and method and apparatus for cutting tapeless substrate using the same
US5961766A (en) * 1998-04-17 1999-10-05 Avery Dennison Corporation Method for selecting a substrate intended for use in a cutting operation
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
CN1260779C (zh) * 2001-06-11 2006-06-21 日东电工株式会社 从半导体晶片上清除无用物质的方法和装置
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
JP4318471B2 (ja) * 2003-03-05 2009-08-26 日東電工株式会社 保護テープの貼付・剥離方法
SG110108A1 (en) * 2003-09-24 2005-04-28 Nitto Denko Corp Method and apparatus for joining adhesive tape

Also Published As

Publication number Publication date
SG113039A1 (en) 2005-07-28
CN1638054A (zh) 2005-07-13
TW200527528A (en) 2005-08-16
KR20050072665A (ko) 2005-07-12
CN100433266C (zh) 2008-11-12
JP4592289B2 (ja) 2010-12-01
JP2005197429A (ja) 2005-07-21
US20050148156A1 (en) 2005-07-07
KR101048920B1 (ko) 2011-07-12
US7264998B2 (en) 2007-09-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees
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